CN114355149A - Temperature stress screening test system of converter module circuit board - Google Patents
Temperature stress screening test system of converter module circuit board Download PDFInfo
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- CN114355149A CN114355149A CN202011095988.6A CN202011095988A CN114355149A CN 114355149 A CN114355149 A CN 114355149A CN 202011095988 A CN202011095988 A CN 202011095988A CN 114355149 A CN114355149 A CN 114355149A
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- 238000012360 testing method Methods 0.000 title claims abstract description 142
- 238000012216 screening Methods 0.000 title claims abstract description 18
- 238000012544 monitoring process Methods 0.000 claims abstract description 38
- 238000004891 communication Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims 1
- 230000035882 stress Effects 0.000 description 12
- 230000032683 aging Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a temperature stress screening test system of a converter module circuit board, which comprises a hardware framework and a software framework, wherein the hardware framework is a hardware module; the software architecture comprises a bottom layer, a middle layer and an application layer, wherein the bottom layer is used for configuring basic contents of test operation, the middle layer is used for receiving and transmitting data, and the application layer is used for recording and displaying the states of various tested products and test equipment; the hardware framework comprises a power supply unit, a monitoring unit, a clamping unit and a high-low temperature test unit, wherein the clamping unit is used for clamping and fixing a tested article, and the high-low temperature test unit is used for placing the clamped and fixed tested article and providing temperature stress to excite faults; the monitoring unit is connected with each tested product and used for reading and exporting the communication condition and the test log of each tested product in the test process; the power supply unit is respectively connected with the monitoring unit, the high-low temperature test unit and each circuit board and used for supplying power. The invention has the advantages of simple operation, high test efficiency, high automation degree and the like.
Description
Technical Field
The invention mainly relates to the technical field of converters, in particular to a temperature stress screening test system for a module circuit board of a converter.
Background
The traction converter is a core component of a train of the motor train unit, the converter module is a basic power unit of the traction converter, and as the requirement on the reliability of the operation of loading a circuit board is continuously improved, a temperature stress screening (ESS for short) test is carried out in the production process of the circuit board, which is an effective means for controlling the reliability of a product, so that an ESS test is carried out on a circuit board plug-in unit of the converter module, the existing ESS test device has a complex structure, needs manual operation, recording and the like, is low in test efficiency and is easy to deviate, and the requirements on related test technologies cannot be met.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the problems in the prior art, the invention provides the temperature stress screening test system for the converter module circuit board, which is simple and convenient to operate, high in test efficiency and high in test precision.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a temperature stress screening test system of a converter module circuit board comprises a hardware framework and a software framework; the software architecture comprises a bottom layer, a middle layer and an application layer, wherein the bottom layer is used for configuring basic contents of test operation, the middle layer is used for receiving and transmitting data, and the application layer is used for recording and displaying the states of various tested products and test equipment; the hardware framework comprises a power supply unit, a monitoring unit, a clamping unit and a high-low temperature test unit, wherein the clamping unit is used for clamping and fixing a tested article, and the high-low temperature test unit is used for placing the clamped and fixed tested article and providing temperature stress to excite faults; the monitoring unit is connected with each tested product and used for reading and exporting the communication condition and the test log of each tested product in the test process; and the power supply unit is respectively connected with the monitoring unit, the high-low temperature test unit and each circuit board and is used for supplying power.
As a further improvement of the above technical solution:
the bottom layer comprises a monitoring unit bottom layer program, a power supply unit IP address configuration module, a test parameter configuration module and a clock module; the monitoring unit bottom layer program is used for carrying out logic processing on the digital quantity transmitted by the upper computer through a protocol and providing a logic control basis for the middle layer and the application layer; the power supply unit IP address configuration module is used for configuring the IP address of the power supply unit, identifying each power supply unit according to the difference of the IP address and supplying power to the tested object and the equipment in a time-sharing manner before the test; the test parameter configuration module is used for configuring key parameters of a test temperature curve, and the clock module is used for providing timing basis and synchronizing each unit time.
The key parameters comprise one or more of highest temperature, lowest temperature, temperature change rate, humidity and cycle number.
The middle layer comprises a tested article state monitoring module, a test equipment state monitoring module and each unit communication module; the test article state monitoring module is used for receiving test article state information and sending out a control signal; the test equipment state monitoring module is used for receiving state information of the power supply unit and the high and low temperature test unit and sending out control signals; and each unit communication module is used for supporting the communication between each tested article and the upper computer and the communication between each test device and the upper computer.
The application layer comprises a tested article state display module, a test equipment state display module, a test system checking module and a test log recording module; the test article state display module is used for visually displaying the test state of each test article in real time on the upper computer, and when the test article state is normal, a green light is displayed, and when the test article state is abnormal, a red light is displayed; the test equipment state display module is used for visually displaying the states of the high-low temperature test unit and the power supply unit in real time; the test system calibration module is used for testing the periodic calibration of related equipment and devices; and the test log recording module is used for collecting and summarizing data information in the test process, and recording and storing the data information in the specified file address directory.
The clamping unit comprises an installation plate, a plurality of first clamping stations and a plurality of second clamping stations are arranged on the installation plate, and a first clamping tool is arranged on each first clamping station and used for clamping and fixing the drive plate; a second clamping tool is arranged on the second clamping station and used for clamping and fixing the pulse plate; the first clamping tool comprises a mounting frame, a plurality of layers of tracks which are arranged up and down are arranged on the mounting frame, one end of each track is closed, the other end of each track is open, a limiting part is movably arranged at the position of the opening, and a tested device is inserted into the corresponding track and is limited by the limiting part.
The second clamping tool comprises a clamping groove positioned on one side of a second clamping station, movable socket rows are arranged on the other side, opposite to the clamping groove, of each second clamping station, and each movable socket row is connected with a linkage handle; one side of the pulse plate is positioned in the clamping groove, and the other side of the pulse plate oppositely inserts the movable power strip through the linkage handle.
The bottom of mounting panel is equipped with the bottom plate, form the wiring space that is used for arranging the signal line between bottom plate and the mounting panel.
The bottom plate and the mounting plate are both of hollow structures.
The high and low temperature test unit comprises a high and low temperature aging box.
Compared with the prior art, the invention has the advantages that:
according to the invention, the test system applies temperature stress to the converter module driving system single plate to excite potential defects and weak links of the converter module driving system single plate product, so that early-stage failure products are eliminated, the product quality is improved, and the product failure rate is reduced; the whole ESS test system is programmed by an upper computer, does not need the intervention of operators in the test process, can automatically record test process data, and has the advantages of simple and convenient operation, high test efficiency and high test precision; the clamping units suitable for all the tested products are developed, so that the tested products can be quickly and reliably connected by one clamping unit, and the operation is convenient; the clamping unit has high compatibility, and can be compatible with similar circuit boards with the same structure to carry out ESS tests.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention.
FIG. 2 is a block diagram of a software architecture according to an embodiment of the present invention.
Fig. 3 is a perspective view of the clamping unit according to the embodiment of the present invention.
Fig. 4 is a top view structural view of the clamping unit according to the embodiment of the present invention.
Fig. 5 is a front view structural view of the clamping unit of the present invention in an embodiment.
Fig. 6 is a side view structural view of the clamping unit of the present invention in an embodiment.
The reference numbers in the figures denote: 1. an upper computer; 2. a monitoring unit; 3. a power supply unit; 4. a high and low temperature test unit; 5. a clamping unit; 501. mounting a plate; 502. a base plate; 503. a first clamping station; 504. a first clamping tool; 5041. a track; 5042. a limiting member; 505. a second clamping station; 506. a second clamping tool; 5061. a card slot; 5062. a movable power strip; 5063. a linkage handle; 507. to the external connector.
Detailed Description
The invention is further described below with reference to the figures and the specific embodiments of the description.
As shown in fig. 1 and fig. 2, the temperature stress screening test system for the converter module circuit board of the present embodiment includes a hardware architecture and a software architecture; the software architecture comprises a bottom layer, a middle layer and an application layer, wherein the bottom layer is used for configuring basic contents of test operation, the middle layer is used for receiving and transmitting data, and the application layer is used for recording and displaying the states of various tested products and test equipment; the hardware architecture comprises a power supply unit 3, a monitoring unit 2, a clamping unit 5 and a high-low temperature test unit 4 (such as a high-low temperature aging box), wherein the clamping unit 5 is used for clamping and fixing a tested article, and the high-low temperature test unit 4 is used for placing the clamped and fixed tested article and providing temperature stress to excite faults; the monitoring unit 2 is connected with each tested article and used for reading and exporting the communication condition and the test log of each tested article in the test process; the power supply unit 3 is respectively connected with the monitoring unit 2, the high and low temperature test unit 4 and each circuit board and is used for supplying power.
In the embodiment, the bottom layer comprises a monitoring unit bottom layer program, a power supply unit IP address configuration module, a test parameter configuration module and a clock module; the monitoring unit bottom layer program is used for carrying out logic processing on the digital quantity transmitted by the upper computer 1 through a protocol and providing a logic control basis for the middle layer and the application layer; the power supply unit IP address configuration module is used for configuring the IP address of the power supply unit 3, identifying each power supply through the difference of the IP addresses and supplying power to the tested object and the equipment in a time-sharing manner before the test; the test parameter configuration module is used for configuring key parameters of a test temperature curve, wherein the key parameters comprise the highest temperature, the lowest temperature, the temperature change rate, the humidity and the cycle number; the clock module is used for providing timing basis and synchronizing each unit time.
In this embodiment, the middle layer includes a tested article state monitoring module, a testing equipment state monitoring module and each unit communication module; the device comprises a tested article state monitoring module, a control module and a display module, wherein the tested article state monitoring module is used for receiving tested article state information and sending a control signal; the test equipment state monitoring module is used for receiving the state information of the power supply unit 3 and the high and low temperature test unit 4 and sending out a control signal; and each unit communication module is used for supporting the communication between each tested article and the upper computer 1 and the communication between each test device and the upper computer 1.
In this embodiment, the application layer includes a tested article state display module, a test device state display module, a test system checking module and a test log recording module; the tested article state display module is used for visually displaying the test state of each tested article in real time on the upper computer 1, displaying a green light when the tested article state is normal, and displaying a red light when the tested article state is abnormal; the test equipment state display module is used for visually displaying the states of the high-low temperature test unit 4 and the power supply unit 3 in real time; the test system calibration module is used for testing the periodic calibration of the related equipment and devices; and the test log recording module is used for collecting and summarizing data information in the test process, and recording and storing the data information in the specified file address directory.
As shown in fig. 3 to 6, in the present embodiment, the clamping unit 5 is used for fixing the tested object and providing an electrical connection interface. Specifically, the clamping unit 5 includes a mounting plate 501, a plurality of first clamping stations 503 and a plurality of second clamping stations 505 are disposed on the mounting plate 501, and a first clamping tool 504 is disposed on the first clamping station 503 and used for clamping and fixing the drive plate; a second clamping tool 506 is arranged on the second clamping station 505 and used for clamping and fixing the pulse plate; the first clamping tool 504 comprises a mounting frame, a plurality of layers of rails 5041 arranged up and down are arranged on the mounting frame, one end of each rail 5041 is closed, the other end of each rail 5041 is open, a limiting piece 5042 is movably arranged at the opening, and a tested device is inserted into each rail 5041 and limited by the limiting piece 5042. The second clamping tool 506 comprises a clamping groove 5061 positioned on one side of the second clamping station 505, a movable socket 5062 is arranged on the other side, opposite to the clamping groove 5061, of each second clamping station 505, and each movable socket 5062 is connected with a linkage handle 5063; one side of the pulse plate is located in the slot 5061, and the other side of the pulse plate is oppositely inserted with the movable plug row 5062 through the linkage handle 5063.
In this embodiment, a bottom plate 502 is provided at the bottom of the mounting board 501, and a wiring space for arranging signal lines is formed between the bottom plate 502 and the mounting board 501. The bottom plate 502 and the mounting plate 501 are both hollow structures, and the large-area hollow design is favorable for heat exchange between a tested article and the high-low temperature aging box. The bottom of the mounting plate 501 is provided with an external connector 507, and all detection signals are sent to the monitoring unit 2 through the external connector 507.
As shown in fig. 3, after the stopper 5042 (e.g., stopper) is adjusted to the vertically upward position, the driving board is inserted along the guide rail, and the stopper is adjusted to the vertically downward position, and the power supply plug is connected. Wherein the installation drive plate need install lower floor's drive plate earlier, and the back installs upper drive plate, must both hands operate when the installation drive plate stirs the stopper to notice when installation or pulling out the drive plate and do not collide face device, hold the atress part during the connection power plug, forbid to pull the wire. The linkage handle 5063 is adjusted to be separated before the two pulse plates are installed, the linkage handle 5063 is adjusted to be closed after the pulse plates are installed correctly, and wiring is carried out according to the marks. Wherein the operating linkage handle 5063 is pushed and pulled in the middle part, so that the stress is uniform. Note that this link handle 5063 is prohibited from receiving external force when the pulse plate is not attached, and is strictly prohibited from being a handle receiving force. After the 16 driving plates and the 2 pulse plates on one clamp are all connected according to the mode, cross inspection is carried out, and after no problem exists, the two persons are lifted into the high-low temperature aging box together.
The above test system is further described below with reference to a specific embodiment:
the tested product comprises two sets of circuit boards, wherein one set of circuit board comprises a pulse board and eight driving boards, and the tested product is subjected to centralized control through the upper computer 1. Wherein, the upper computer 11 monitors the whole test, and converts and transmits the control signal to the tested object; the monitoring unit 2 converts and transmits signals to be detected to the pulse plate and the driving plate; the power supply unit 3 supplies power to the entire system.
According to test configuration, after the pulse plate and the drive plate are clamped and fixed through the clamping unit 5, the pulse plate and the drive plate are placed in a high-low temperature aging box, and the high-low temperature aging box provides temperature stress to excite product failure; outside the high-low temperature aging box, monitoring the test state of each tested article in the box by using a monitoring unit 2 and an upper computer 1; the communication condition and the test log of each tested product in the test process are read and exported from the monitoring unit 2 by the configuration of the upper computer 1, meanwhile, control signals are input to the tested products through the upper computer 1 and the monitoring unit 2, feedback signals of the tested products are received, and then the signals are subjected to processing such as transformation and transmission, so that the performance state of the tested products is detected.
According to the invention, the test system applies temperature stress to the converter module driving system single plate to excite potential defects and weak links of the converter module driving system single plate product, so that early-stage failure products are eliminated, the product quality is improved, and the product failure rate is reduced; the whole ESS test system is programmed by the upper computer 1, does not need the intervention of an operator in the test process, can automatically record test process data, and has the advantages of simple and convenient operation, high test efficiency and high test precision; the clamping units suitable for all the tested products are developed, so that the tested products can be quickly and reliably connected by one clamping unit, and the operation is convenient; the clamping unit has high compatibility, and can be compatible with similar circuit boards with the same structure to carry out ESS tests.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention.
Claims (10)
1. A temperature stress screening test system of a converter module circuit board is characterized by comprising a hardware framework and a software framework; the software architecture comprises a bottom layer, a middle layer and an application layer, wherein the bottom layer is used for configuring basic contents of test operation, the middle layer is used for receiving and transmitting data, and the application layer is used for recording and displaying the states of various tested products and test equipment; the hardware architecture comprises a power supply unit (3), a monitoring unit (2), a clamping unit (5) and a high-low temperature test unit (4), wherein the clamping unit (5) is used for clamping and fixing a tested article, and the high-low temperature test unit (4) is used for placing the clamped and fixed tested article and providing temperature stress to excite faults; the monitoring unit (2) is connected with each tested article and is used for reading and exporting the communication condition and the test log of each tested article in the test process; and the power supply unit (3) is respectively connected with the monitoring unit (2), the high-low temperature test unit (4) and each circuit board and is used for providing power supply.
2. The temperature stress screening test system of the converter module circuit board as claimed in claim 1, wherein the bottom layer comprises a monitoring unit bottom layer program, a power supply unit IP address configuration module, a test parameter configuration module and a clock module; the monitoring unit bottom layer program is used for carrying out logic processing on digital quantity transmitted by the upper computer (1) through a protocol and providing a logic control basis for the middle layer and the application layer; the power supply unit IP address configuration module is used for configuring the IP address of the power supply unit (3), identifying each power supply unit according to the difference of the IP addresses and supplying power to the tested article and the equipment in a time-sharing manner before the test; the test parameter configuration module is used for configuring key parameters of a test temperature curve, and the clock module is used for providing timing basis and synchronizing each unit time.
3. The temperature stress screening test system of converter module circuit board of claim 2, wherein said key parameters include one or more of highest temperature, lowest temperature, temperature change rate, humidity, cycle number.
4. The temperature stress screening test system of the converter module circuit board as claimed in claim 2, wherein the intermediate layer includes a tested object state monitoring module, a test equipment state monitoring module and each unit communication module; the test article state monitoring module is used for receiving test article state information and sending out a control signal; the test equipment state monitoring module is used for receiving state information of the power supply unit (3) and the high and low temperature test unit (4) and sending out control signals; and each unit communication module is used for supporting the communication between each tested article and the upper computer (1) and the communication between each test device and the upper computer (1).
5. The temperature stress screening test system of the converter module circuit board as claimed in claim 4, wherein the application layer comprises a tested object state display module, a test equipment state display module, a test system checking module and a test log recording module; the test article state display module is used for visually displaying the test state of each test article in real time on the upper computer (1), displaying a green light when the test article state is normal, and displaying a red light when the test article state is abnormal; the test equipment state display module is used for visually displaying the states of the high-low temperature test unit (4) and the power supply unit (3) in real time; the test system calibration module is used for testing the periodic calibration of related equipment and devices; and the test log recording module is used for collecting and summarizing data information in the test process, and recording and storing the data information in the specified file address directory.
6. The temperature stress screening test system for the converter module circuit board according to any one of claims 1 to 5, wherein the clamping unit (5) comprises a mounting plate (501), a plurality of first clamping stations (503) and a plurality of second clamping stations (505) are arranged on the mounting plate (501), and a first clamping tool (504) is arranged on the first clamping station (503) and used for clamping and fixing the driving plate; a second clamping tool (506) is arranged on the second clamping station (505) and used for clamping and fixing the pulse plate; first centre gripping frock (504) includes the mounting bracket, be equipped with track (5041) that the multilayer was arranged from top to bottom on the mounting bracket, the one end of track (5041) is sealed, and the other end opening, the opening part activity is equipped with locating part (5042), and the testee inserts and locates in track (5041) and carry out spacingly to it through locating part (5042).
7. The temperature stress screening test system for the converter module circuit board as claimed in claim 6, wherein the second clamping tool (506) comprises a clamping groove (5061) located on one side of the second clamping station (505), a movable socket (5062) is arranged on the other side of each second clamping station (505) relative to the clamping groove (5061), and each movable socket (5062) is connected with a linkage handle (5063); one side of the pulse plate is located in the clamping groove (5061), and the other side of the pulse plate is oppositely inserted into the movable power strip (5062) through the linkage handle (5063).
8. The temperature stress screening test system of the converter module circuit board as claimed in claim 7, wherein a bottom plate (502) is provided at the bottom of the mounting plate (501), and a wiring space for arranging signal lines is formed between the bottom plate (502) and the mounting plate (501).
9. The temperature stress screening test system of converter module circuit board as claimed in claim 8, wherein the bottom plate (502) and the mounting plate (501) are both hollow structures.
10. The temperature stress screening test system of the converter module circuit board as claimed in any one of claims 1 to 5, wherein the high and low temperature test unit (4) comprises a high and low temperature burn-in box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011095988.6A CN114355149A (en) | 2020-10-14 | 2020-10-14 | Temperature stress screening test system of converter module circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011095988.6A CN114355149A (en) | 2020-10-14 | 2020-10-14 | Temperature stress screening test system of converter module circuit board |
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| CN114355149A true CN114355149A (en) | 2022-04-15 |
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| CN202011095988.6A Pending CN114355149A (en) | 2020-10-14 | 2020-10-14 | Temperature stress screening test system of converter module circuit board |
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2020
- 2020-10-14 CN CN202011095988.6A patent/CN114355149A/en active Pending
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| JP2000162268A (en) * | 1998-11-27 | 2000-06-16 | Advantest Corp | Method of applying temperature of electronic component and electronic component tester |
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