KR20160094231A - Electric device unloading equipment - Google Patents

Abstract

The present invention relates to electronic device unloading equipment. The electronic device unloading equipment comprises: an electronic component turning device for turning over electronic components in a vertical state into a horizontal state; a first picking device for unloading electronic components, loaded in a horizontal state on a test tray, from the test tray, and providing the electronic components in a vertical state for the electronic component turning device; and a second picking device for moving the electronic components, turned in a horizontal state by the electronic component turning device, to an underfill zig on a loading position. Therefore, according to the disclosed specification, by unloading a vertical state electronic component, after a first test process after the production, from a test tray, and loading the same in a horizontal state on the underfill zig, the electronic components can be promptly introduced to the next process, thereby increasing the productivity.

Description

{ELECTRIC DEVICE UNLOADING EQUIPMENT}

The present invention relates to a technique for unloading an electronic part loaded in a test tray with an underfill jig.

Electronic parts such as solid state drives (SSD) are produced and loaded on the process tray. The electronic components loaded in the process tray are then transported to the test tray for testing. The electronic component is electrically connected to the tester while being loaded in the test tray, so that a first test process for the electronic component is performed.

The electronic component determined to be good in the first test process is completed with the shipped product through the casing process and the labeling process, and then the second test process proceeds. After the second test process, the electronic parts are classified as good and defective according to the test result, and only good parts are shipped.

Conventionally, the above-described series of processes except for the test process were performed by hand, resulting in low productivity. Accordingly, the applicant of the present invention has proposed a labeling apparatus (Korean Patent Application No. 10-2014-0041140, hereinafter referred to as "Prior Art 1") capable of performing a casing process and a labeling process on an electronic component prior to the present invention, A test apparatus (Korean Application No. 10-2014-0091798, hereinafter referred to as " Prior Art 2 ") for performing a second test process for the completed electronic component, and an electronic component for which the second test has been completed (Korean Patent Application No. 10-2014-0154576, hereinafter referred to as "Prior Art 2").

Prior Art 1 is a technology relating to equipment for carrying out casing work and labeling work for electronic parts determined to be good after the first testing process.

The second aspect of the invention relates to a device for performing a second test process on an electronic component for which casing work and labeling work have been completed.

Prior Art 3 is a technology relating to equipment for sorting electronic components according to a test result after a second test process.

Further, the applicant of the present invention has developed a system for forming a system with the devices according to the above-described first to third inventions, and for loading the electronic parts loaded on the process tray into the test tray for performing the first test process (Korean Patent Application No. 10-2014-01909640, hereinafter referred to as "Prior Art 4").

The present invention relates to a process for unloading from a test tray to an underfill jig after a first test is performed by a tester after the electronic component is loaded on the test tray by the electronic component loading equipment according to the above-mentioned fourth invention.

For reference, the electronic parts loaded on the underfill jig while being unloaded from the test tray by the apparatus according to the present invention are provided with the equipment according to the above-mentioned first invention, and the casing and the labeling operation are performed. In this specification, the underpark is referred to as a tray of the symbol 'T' in the prior art 1.

It is an object of the present invention to provide a novel apparatus for unloading an electronic part loaded in a test tray from a test tray after a first test process is performed.

The electronic part unloading device according to the present invention as described above includes: an electronic part rotating device for rotating a vertical electronic part in a horizontal state; A first picking device for unloading the vertically stacked electronic component from the test tray in the test tray at the unloading position and then supplying the vertical electronic component to the electronic component rotating device; And a second picking device for moving the electronic component horizontally rotated by the electronic component rotating device to an underfill jig in a loading position; .

Wherein the electronic component unloading equipment comprises a tray transfer device for transferring the test tray from the standby position to the unloading position or from the unloading position to the standby position; As shown in FIG.

Wherein the electronic part unloading device comprises: a tray moving device for moving the test tray in the receiving position to the standby position; As shown in FIG.

Wherein the electronic part unloading device comprises: a tray conveying device for conveying the test tray at the standby position to a tray unloading position; As shown in FIG.

The electronic part unloading equipment comprises a first type of tray transfer device for transferring a first type of test tray from a standby position to the unloading position or from the unloading position to the standby position; And a second type of test tray for transferring a second type of test tray having a structure different from that of the first type of test tray from the standby position to the unloading position or from the unloading position to the standby position, Conveying device; As shown in FIG.

Wherein the electronic part unloading equipment comprises a test tray in an unloading position, As shown in FIG.

The tray supporting apparatus comprises: a support for supporting a first test tray of a first type; And a pair of support rails for supporting a second type of test tray having a different structure from the first test tray; . ≪ / RTI >

Said electronic component unloading equipment comprising: said tray carrying device for conveying a test tray in a first stand-by position to a second stand-by position; And a tray transfer device for transferring the test tray in the second standby position to the unloading position; As shown in FIG.

The electronic part unloading device includes an upper plate removing device for detaching the upper plate of the underfill jig from the lower plate; As shown in FIG.

An opening groove is formed in the lower plate, and the upper plate removing device grips the upper plate through the opening groove.

Wherein the electronic part unloading device includes a first jig moving device for moving the lower plate, from which the upper plate is detached, to a first movement end position by the upper plate removing device; A lower plate transfer device for transferring the lower plate at the first movement end position to the loading position; And a second jig moving device for positioning the underfill jig to which the upper plate is coupled by the upper plate removing device at a second movement end position after the loading of the electronic component at the loading position is completed; As shown in FIG.

Wherein the electronic part unloading equipment comprises a jig conveying device for conveying an empty underfill jig at a supply position to a movement start position; Wherein the first jig moving device moves the underfill jig at the movement start position to a top plate removing position where the top plate is detached by the top plate removing device, 1 movement end position.

Wherein the electronic part unloading equipment comprises a jig reversing device for rotating the underfill jig in the reversal position by 180 degrees around a horizontal line as a rotation axis; And a jig conveying device for conveying the underfill jig at the second movement ending position to the reversing position; As shown in FIG.

The first picking apparatus has a release pin provided on the test tray for releasing the holding state of the holding device for holding the loaded electronic component.

The first picking device may further have an escape prevention member for preventing the escape of the electronic component whose holding state is released by the action of the release pin.

The present invention has the following effects.

First, after the first test process is performed, unloading of the vertical electronic components loaded on the test tray through an automated flow is used to supply electronic components to the casing and labeling equipment proposed in the first prior art The productivity can be improved by being mounted horizontally on the underfill jig.

Second, because unloading operations can be performed by accommodating different types of test trays, it is not necessary to provide unloading equipment for each kind of test trays, thereby reducing investment costs.

Third, by reversing the electronic parts loaded on the underfill jig as needed, it is possible to reduce the hassle and improve the productivity by maintaining the automatic flow in the whole system.

1 is a schematic perspective view of a first test tray applied to an electronic component unloading apparatus according to an embodiment of the present invention.
2 is a schematic perspective view of a second test tray applied to an electronic component unloading apparatus according to an embodiment of the present invention.
FIG. 3 is a schematic perspective view of a stacking frame used to supply the second test tray of FIG. 2 to the electronic component unloading equipment according to an embodiment of the present invention.
4 is a schematic perspective view of an underfill jig applied to an electronic part unloading apparatus according to an embodiment of the present invention.
5 is a conceptual top view of an electronic component unloading device according to an embodiment of the present invention.
Figs. 6 and 7 are reference views for explaining a movement flow of the electronic component in the electronic component unloading equipment of Fig.
8 is a reference view for explaining a moving flow of the test tray having the first form in the electronic part unloading equipment of FIG.
9 is a reference view for explaining the movement flow of the test tray having the second form in the electronic part unloading equipment of FIG.
10 is a reference view for explaining a flow of movement of the underfill jig in the electronic part unloading equipment of Fig.
11 is a schematic perspective view of a first tray moving apparatus applied to the electronic part unloading apparatus of FIG.
Figs. 12 to 14 are schematic perspective views of a second tray mover constituting the first tray mover of Fig. 11. Fig.
Figure 15 is a schematic perspective view of a first tray transfer device applied to the electronic part unloading equipment of Figure 5;
Figure 16 is a schematic perspective view of a third tray transfer device applied to the electronic part unloading equipment of Figure 5;
17 and 18 are schematic perspective views of a second tray supporting apparatus applied to the electronic component unloading apparatus of FIG.
Fig. 19 is a schematic perspective view of the first supporting device constructed in the second tray supporting device of Fig. 17; Fig.
20 is a schematic perspective view of a first electronic component rotating apparatus applied to the electronic component unloading apparatus of FIG.
Figs. 21 and 22 are operation state diagrams for explaining the operation of the first electronic component rotating apparatus of Fig. 20; Fig.
23 is a schematic perspective view of the first picking apparatus applied to the electronic part unloading equipment of FIG.
24 is a schematic perspective view of the first tray carry-out apparatus applied to the electronic part unloading apparatus of FIG.
Fig. 25 is a schematic perspective view of a second picking apparatus applied to the electronic part unloading apparatus of Fig. 5; Fig.
26 is a schematic perspective view of a top plate desorption apparatus applied to the electronic part unloading apparatus of FIG.
Fig. 27 is a schematic perspective view of a jig reversing device applied to the electronic part unloading equipment of Fig. 5; Fig.
28 is a partially exploded view of the jig inverting apparatus of Fig.
29 to 32 are operational state diagrams showing a front view of the jig inverting apparatus to explain the operation of the jig inverting apparatus of Fig.
Fig. 33 is a schematic perspective view of a jig transfer device applied to the electronic part unloading equipment of Fig. 5; Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

Before describing the electronic part unloading equipment (EDUE) according to the present invention, the test trays and the underfill jig used in the electronic part unloading equipment (EDUE) will be described.

≪ Description of First Test Tray >

As shown in FIG. 1, the first test tray TT ₁ is loaded with the electronic component ED having undergone the first test. The first test tray TT ₁ is provided with the contact module CM since the first test is performed with the electronic component ED (for example, 'SSD') being loaded in the first test tray TT ₁ do. The contact module CM has an insertion groove IS into which a vertical electronic component ED can be inserted and a connection terminal (not shown because it is configured at the bottom). Here, the electronic component ED inserted in the insertion groove IS is electrically contacted to the connection terminals, and the connection terminals can be electrically contacted to the tester. Therefore, the first test is performed by electrically connecting the electronic component (ED) and the tester via the connection terminal. The contact module CM is provided therein with a holding device for holding an electronic component ED inserted in the insertion groove IS.

For reference, the first test tray TT ₁ has an identification means IDC1 for identifying itself.

≪ Description of the second test tray >

As shown in FIG. 2, the second test tray TT ₂ is loaded with an electronic component ED having undergone the first test. This second test tray TT ₂ has stacking modules LM for stacking the vertical electronic components ED and a circuit board CB on which the stacking modules LM are mounted. The electronic component ED vertically stacked on the stacking module LM of the second test tray TT ₂ is electrically connected to the connecting portion CP of the circuit board CB through a circuit provided on the circuit board CB Lt; / RTI > And the connection portion (CP) is electrically connected to the tester. Thus, the electronic component (ED) loaded on the stacking module (LM) is electrically connected to the tester to perform the first test.

Similarly, the loading module LM is provided with a holding device for holding the loaded electronic component ED therein.

The second test tray TT ₂ also has an identification means IDC2 for identifying itself.

On the other hand, in order to supply the second test tray TT ₂ to the electronic part unloading equipment EDUE according to the present embodiment, a tray loading frame (TLF) as shown in Fig. 3 is used. In the tray loading frame (TLF), a plurality of second test trays (TT ₂ ) in a horizontal state are stacked in a vertical direction. The tray loading frame TLF is provided with a rail R for guiding and supporting the back and forth movement of the reinforcing bar S and the second test tray TT ₂ for maintaining firmness.

The reason why the structures of the first test tray (TT ₁ ) and the second test tray (TT ₂ ) are different is that the electrical connection structure differs depending on the type of the tester. The electronic part unloading equipment EDUE according to the present embodiment is configured such that the first test tray TT ₁ and the second test tray TT ₂ can be arbitrarily applied. Hereinafter referred to as a first test tray (TT ₁₎ to test trays (TT ₁₎ La abbreviated, and the test to separate the two test tray, the test first for (TT ₂₎ tray board (TT ₂₎ to avoid confusion It is called.

<Description of underfill jig>

The unloaded electronic components from the test tray TT ₁ or the test board TT ₂ can be horizontally stacked on the underfill jig UJ as shown in FIG. The underfill jig UJ is composed of a top plate JT and a bottom plate TB. The electronic components ED are mounted on the lower plate TB in a horizontal state and the upper plate JT is detachably coupled to the lower plate JB. Therefore, in order to mount the electronic component ED on the underfill jig UJ, the upper plate JT must be separated from the lower plate JB. For this purpose, four opening grooves OS are formed in the lower plate JB. Through these four opening grooves OS, the holding member 2711 of the upper plate removing apparatus 2700 to be described later can grasp and support only the upper plate JT (see Fig. 26). An identification means IDC3 such as a barcode is provided in the lower plate JB for history management and an exposure groove ES for exposing the identification means IDC3 is provided on the upper plate JP at a position corresponding to the IDC3. Is formed. An alignment hole UAH is formed in the upper plate JP and an alignment pin UAP is provided in the lower plate JB to induce proper coupling between the upper plate JP and the lower plate JB, . Of course, the number and position of the opening grooves (OS) or the positions and the numbers of the alignment pins (UAP) and the alignment holes (UAH) can be appropriately selected.

It is further preferable that the lower plate JB is provided with a magnet M and the upper plate JT is provided with a magnetic substance so that the coupling force between the lower plate JB and the upper plate JT can be maintained.

For reference, it is preferable that the underfill jig (UJ) is also supplied to the electronic part unloading equipment in a state where a plurality of underfill jigs (UJ) are mounted on the jig mounting frame.

<An overview of the configuration of electronic unloading equipment>

5 is a conceptual top view of an electronic component unloading equipment (EDUE) according to an embodiment of the present invention.

The electronic component unloading equipment EDUE includes a first tray transfer device 1100, a second tray transfer device 1200, a first tray transfer device 1300, a second tray transfer device 1400, The first tray supporting device 1500, the first tray supporting device 1600, the second tray supporting device 1700, the first electronic component rotating device 1800, the second electronic component rotating device 1900, the first picking device 2100, A first jig moving device 2500, a second jig moving device 2600, an upper plate removing device 2700, a lower plate moving device 2500, A jig transfer device 3100, a jig transfer device 3200, a jig transfer device 3300, a jig transfer device 3400, and a control device 3500. The jig transfer device 3100, the jig transfer device 3100,

The first tray moving apparatus 1100 moves the test board TT ₂ in the state of being loaded on the test tray TT ₁ or the loading frame TLF supplied to the first receiving position SDP ₁ to the first waiting position WP ₁ ). In addition, the first tray moving apparatus 1100 moves the empty test board TT ₂ in the first waiting position WP ₁ to the first receiving position SDP ₁ .

The second tray moving apparatus 1200 moves the test tray TT ₁ supplied in the second receiving position SDP ₂ or the test board TT ₂ loaded in the loading frame TLF to the second standby position WP ₂ ). Similarly, the second tray moving device 1200 moves the blank test board (TT ₂₎ in a second stand-by position (WP ₂₎ loading frame (TLF) the loading conditions in a second supply position (SDP _2).

A first tray conveying apparatus 1300 to convey the test board (TT ₂₎ in a first waiting position (WP ₁₎ to a first unloading position (UP ₁₎ or in a first unloading position (UP ₁₎ And transfers the empty test board TT ₂ to the first standby position WP ₁ .

The second tray transfer device 1400 transfers the test board TT ₂ in the second standby position WP ₂ to the second unloading position UP ₂ . The second tray transfer device 1400 also transfers the test board TT ₂ in the second unloading position UP ₂ to the second waiting position WP ₂ .

The third tray transfer device 1500 transfers the test tray TT ₁ in the second standby position WP ₂ to the second unloading position UP ₂ . Of course, the third tray transfer device 1400 also transfers the test tray TT _{1 in} the second unloading position UP ₂ to the second waiting position WP ₂ .

The first tray supporting apparatus 1600 supports the test board TT ₂ in the first unloading position UP ₁ .

The second tray supporting apparatus 1700 supports the test tray TT ₁ or the test board TT ₂ in the second unloading position UP ₂ .

The first electronic component rotating apparatus 1800 and the second electronic component rotating apparatus 1900 are unloaded from the test tray TT ₁ or the test board TT ₂ by the first picking apparatus 2100, Rotate the loaded electronic component (ED) horizontally.

The first picking apparatus 2100 unloads the electronic component ED from the test tray TT ₁ or the test board TT ₂ and then rotates the vertically oriented electronic component ED to the first electronic component rotating apparatus 1800 ) Or the second electronic component rotating apparatus 1900, as shown in Fig. The first picking apparatus 2100 can remove the electronic component ED determined to be defective in the first test process among the electronic components ED unloaded from the test tray TT ₁ or the test board TT ₂ , (RT) at the RP.

The tray transport apparatus 2200 transports the test tray TT ₁ loaded with the electronic components ED in the first standby position WP ₁ to the second standby position WP _{2 and} moves the second standby position WP ₂₎ an empty test tray (TT ₁₎ in the tray is carried to the out position (TCP).

The tray transport apparatus 2300 transports the test tray TT _{1 in the} tray transport position TCP to the external equipment or the loading apparatus. Of course, according to the practice of the present invention, the tray delivering apparatus 2300 may place the test tray TT ₁ supplied from the outside with the electronic component ED loaded in the tray take-out position TCP, It is also possible to move the test tray TT ₁ in the tray unloading position TCP to the first waiting position WP ₁ or the second waiting position WP ₂ .

The second picking device 2400 holds the electronic component ED horizontally rotated by the first electronic component rotating device 1800 or the second electronic component rotating device 1900 and then rotates the picked- (JB) of the underfill jig (UJ).

The first jig moving device 2500 moves the underfill jig UJ supplied to the movement start position MSP by the jig transportation device 3100 to the upper plate removal position TTP, (JB) from which the jaws JT have been removed to the first movement end position (MEP ₁ ).

The second jig moving device 2600 moves the lower plate JB in the loading position LP to the upper plate engaging position TJP and moves the under jig UJ to which the upper plate JT is engaged in the upper plate engaging position TJP, To the second movement end position (MEP ₂ ).

The upper plate removing apparatus 2700 removes the upper plate JT from the underfill jig UJ at the upper plate removing position TTP and then joins the upper plate JT to the lower plate JB at the upper plate engaging position TJP .

The lower plate conveying apparatus 2800 moves the lower plate JB in the first movement end position MEP ₁ to the rear loading position LP.

The jig raising device 2900 sequentially raises the underfill jig UJ supplied to the jig supply position JSP so that the underfill jig UJ located at the uppermost position is moved by the jig transport device 3100 to the transport start position MSP ). &Lt; / RTI &gt;

The jig carrier device 3100 carries the empty underfill jig UJ in the jig supply position JSP to the transport start position MSP. The jig carrier device 3100 also moves the underfill jig UJ filled with the electronic component ED in the second movement end position MEP ₂ to the reverse position JDP.

The jig inverting apparatus 3200 rotates the underfill jig UJ in the reversal position JDP 180 degrees about the horizontal line on the left and right.

The jig transfer device 3300 transfers the underfill jig UJ in the reversal position JDP to the jig removal position JCP.

The jig take-out apparatus 3400 takes out the underfill jig UJ in the jig take-out position JCP.

For the reference, the jig take-out device 3400 may also be configured to position the empty underfill jig UJ supplied by a separate device from the right side to the jig take-off position JCP. In this case, the jig transfer device 3300 transfers the empty underfill jig UJ to the reverse position JDP, and then the underfill jig UJ located at the reverse position JDP is conveyed by the jig conveying device 3100 It may be considered to be implemented in a starting position (MSP).

The control device 3500 controls each of the above configurations. Particularly, after the identification information of the test tray TT ₁ or the test board TT ₂ is acquired through the identification device (not _shown ), the electronic component ED as a good product is received by the first electronic component rotating device 1800 or the second electronic component And controls the first picking device 2100 to send the defective electronic component ED to the removal position RP.

A description will now be given of a flow of movement of the electronic component ED, the test tray TT ₁ , the test board TT ₂ and the underfill jig UJ in the electronic component unloading equipment EDLE having the above configuration.

<Description of Logistics Performed in Electronic Unloading Equipment>

1. Movement Flow of Electronic Components (ED)

A. Test Tray (TT _One ) Is applied (see arrows in Fig. 6)

The electronic component ED is supplied to the first supply position SDP ₁ and the second supply position SDP ₂ while being loaded on the test tray TT ₁ . The electronic component ED is moved to the first supply position SDP ₁ and the second supply position AL by the first tray moving device 1100 and the second tray moving device 1200 while being loaded on the test tray TT ₁ , (1 - 1, 1 - 2) to the first standby position (WP ₁ ) and the second standby position (WP ₂ ) in the first waiting position SDP ₁ .

The test tray TT _{1 in} the second standby position WP ₂ is transferred to the second unloading position UP ₂ by the third tray transfer device 1700, (? -3,1,? -3-2) to the first electronic component rotating apparatus 1800 or the second electronic component rotating apparatus 1900 individually. For reference, the electronic component ED determined to be defective is sent to the removal position RP by the first picking device 2100 (3 - 3).

The electronic component ED which has been switched from the vertical state to the horizontal state by the first electronic component rotating apparatus 1800 or the second electronic component rotating apparatus 1900 is moved to the loading position LP by the second picking apparatus 2400 (4-l, 4-2) to the lower plate JB of the underfill jig UP having the underfill jig UP and the second jig moving device 2500 moves in the loading position LP as the underfill jig UJ moves by the second jig moving device 2500 (⑤) to the second movement end position (MEP ₂ ) via the upper plate coupling position (TJP).

Subsequently, the electronic component ED is moved (⑥) from the second movement end position MEP ₂ to the inversion position JDP in a state of being loaded on the underfill jig UJ, and is rotated 180 degrees by the jig inverting device 3200 Is inverted 180 degrees together with the inverted underfill jig UJ and then moved to the jig removal position JCP by the jig transfer device 3300 (7). (8) to the equipment connected to the right side or the prepared loading element by the jig take-out device 3400.

On the other hand, the first waiting position (WP ₁₎ electronic components (ED) is to carry the second waiting position (WP ₂₎ by the tray carrier 2200 with the test tray (TT ₁₎ (①-3) in the And then moved from the second standby position WP ₂ to the jig removal position JCP through the above-mentioned angular positions and carried out.

B. Test board (TT ₂ ) Is applied (see arrows in Fig. 7)

The electronic component ED is moved to the first standby position WP ₁ and the second standby position WP in the first supply position SDP ₁ and the second supply position SDP ₂ while being loaded on the test board TT ₂ , ₂ ) (①-1, ①-2). From the first waiting position WP ₁ and the second waiting position WP ₂ to the first unloading position UP ₁ and the second unloading position UP ₂ by the first tray transfer device 1300 and the second tray transfer device 1400, (-2-1 and -2-2) to the unloading position UP ₂ and the first picking apparatus 2100 individually feeds the first and second electronic part rotating apparatuses 1800 and 1900. [ (--1 to--4). (④-1, 2 to ⑧) after being passed through the loading position LP, top plate coupling position TJP, second movement end position MEP ₂ , inversion position JDP, and jig removal position JCP, . Of course, the electronic component ED determined to be defective is sent to the removal position RP at the first unloading position UP ₁ or the second unloading position UP ₂ .

2. Movement flow of test tray (see arrow in Fig. 8)

The test tray TT ₁ loaded with the electronic component ED is supplied to the first supply position SDP ₁ and the second supply position SDP ₂ and then the first tray moving device 1100 and the second tray moving (1 - 1, 1 - 2) to the first waiting position WP ₁ and the second waiting position WP ₂ by the device 1200.

The test tray TT _{1 in} the second standby position WP ₂ is transferred to the second unloading position UP ₂ by the third tray transfer device 1500 and the first picking device 2100 is moved The unloaded empty test tray TT ₁ is returned to the second waiting position WP ₂ by the third tray transfer device 1500. (④) from the second standby position (WP ₂ ) to the tray unloading position (TCP) by the tray transport device (2200), and then it is carried out (⑤).

On the other hand, the move to the first waiting position (WP ₁₎ test tray (TT ₁₎ to the second waiting position (WP ₂₎ by the tray transport device 2200 in the (①-3), a second unloading position after the (UP _2), the second is taken out through the stand-by position (WP ₂₎ and tray out position (TCP).

3. Movement flow of test board (see arrow in Fig. 9)

The test board TT ₂ loaded with the electronic component ED is supplied to the first supply position SDP ₁ and the second supply position SDP ₂ and then the first tray moving device 1100 and the second tray moving (1 - 1, 1 - 2) to the first waiting position WP ₁ and the second waiting position WP ₂ by the device 1200.

And the first unloading position UP ₁ and the second unloading position T ₂ are moved by the first tray transfer device 1300 and the second tray transfer device 1400 in the first standby position WP ₁ and the second standby position WP ₂ , ( _2-1 , 2-2) to the unloading position (UP ₂ ).

The empty test board TT _{2 in which} the unloading of the electronic component ED is completed in the first unloading position UP ₁ and the second unloading position UP ₂ is performed by the first tray transfer device 1300 (③-1, ③-2) to the first waiting position WP ₁ and the second waiting position WP ₂ by the first tray moving device 1100 and the second tray moving device 1400, (④-1, ④-2) to the first supply position (SDP ₁ ) and the second supply position (SDP ₂ ) by the two-tray moving device 1200 and then carried out.

4. Movement of the underfill jig (see arrows in Fig. 10)

The empty underfill jig UJ is supplied to the jig feed position JSP and is conveyed to the feed start position MSP by the jig conveying device 3100, Move to the removal position (TTP) (②).

The upper plate JT detached from the lower plate JB by the upper plate despooler 2700 at the upper plate removing position TTP is moved to the upper plate engaging position TJP (? -1) and the lower plate JB is moved And moved to the first movement end position MEP ₁ (? -3) by the jig moving device 2500.

The lower plate JB in the first movement end position MEP ₁ is moved to the loading position LP by the lower plate transfer device 2800 and the loading of the electronic part ED at the loading position LP The finished lower plate JB is moved (⑤) to the upper plate engaging position TJP by the second jig moving device 2600.

The underfill jig UJ to which the upper plate JT is coupled to the lower plate JB by the upper plate despooler 2700 at the upper plate engaging position TJP is moved to the second movement end position MEP ₂ ) (⑥). Subsequently, the underfill jig UJ is transported (⑦) from the second movement end position MEP ₂ to the reverse position JDP by the jig transport device 3100. The underfill jig UJ inverted 180 degrees by the jig inverting device 3200 in the reverse position JDP is moved to the jig transfer position JCP by the jig transfer device 3300 3400).

<Description of detailed configuration of electronic unloading device>

Each of the above-mentioned constituent elements configured for the movement flow of the above-described electronic component (ED) will be described in detail.

1. A first tray moving device and a second tray moving device

The first tray moving apparatus 1100 moves the test tray TT ₁ or the test board TT ₂ in the first supply position SDP ₁ to the first standby position WP ₁ as shown in FIG. And two tray moving devices 1110 and 1120.

The first tray mover 1110 supports a load frame (TLF) loaded with the test tray TT ₁ or the test board TT ₂ in the first supply position SDP ₁ .

The second tray mover 1120 supports the stacking frame (TLF) loaded with the test tray TT ₁ or the test board TT ₂ in the first standby position WP ₁ .

Furthermore, the first tray, the mobile device 1110 and the second tray, the mobile device 1120 over a first supply position (SDP ₁₎ the test tray at the (TT ₁₎ and a test board (TT ₂₎ is loaded loading frame (TLF ) To the first standby position (WP ₁ ).

Next, the detailed configuration required for ascending and descending the test tray (TT ₁ ) or the stacking frame (TLF) will be described.

12 is a schematic perspective view of a second tray mover 1120. 12, the second tray mover 1120 includes a lifting frame 1121, a lifting base 1122, a first moving belt portion 1123, a second moving belt portion 1124, a moving motor 1125, (STP) and an elevator (U / D).

The lifting frame 1121 is provided so as to be movable up and down. The test tray TT ₁ and the stacking frame TLF on which the first moving belt portion 1123 and the second moving belt portion 1124 are placed are raised and lowered in accordance with the ascending and descending of the lifting frame 1121.

The elevating unit 1122 elevates the elevating frame 1121.

First moving belt portion 1123 is lifting frame 1121 installed be the elevating frame 1121 and elevated together with the moving belt of the pair (MB _1, MB _2), the drive pulley (DP) and the driven pulley ( PP).

Since the second moving belt portion 1124 is the same as the first moving belt portion 1123, a description thereof will be omitted.

For reference, in the case of the test tray TT ₁ , as shown in FIG. 13, the test board TT ₁ is supported by the first moving belt portion 1123 and the second moving belt portion 1124, (TLF), the first moving belt portion 1123 and the second moving belt portion 1124 are supported together as shown in FIG.

Moving motor 1125 allows to rotate the drive pulley (DP) moving belt by the rotation (MB _1, MB ₂₎ to the drive pulley (DP) and the driven pulley (PP) in a rotational turning point.

The stopper STP is provided to prevent the test tray TT ₁ from being pushed. Therefore, if the stopper STP is raised by a drive source (not shown), the test tray TT ₁ or the stacking frame TLF is prevented from being pushed and the test tray TT ₁ or the stacking frame TLF Can be moved in the forward and backward directions.

The elevator U / D elevates the test tray TT ₁ or the loading frame TLF placed on the first moving belt portion 1123 or the second moving belt portion 1124 at a predetermined interval. This elevator U / D acts when the test board TT ₂ or, as the case may be, the test tray TT ₁ is discharged forward. For example, when the test tray TT ₁ is being discharged, when the front end of the test tray TT _{1 comes} into contact with the stopper STP and the stopper STP is pushed forward, the stopper STP is moved by a sensor (not shown) In order to detect the jungle of. When the advance of the stopper (STP) detection, lift (U / D) is operating to when the first moving belt portion of the test tray (TT ₁₎ by raising the test tray (TT ₁₎ (1123) and the second moving belt Portion 1124. The portion 1124 of FIG. At the same time, the operation of the first moving belt portion 1123 or the second moving belt portion 1124 is stopped. When the operation of the first moving belt portion 1123 or the second moving belt portion 1124 is stopped, the elevator U / D is operated in reverse to move the test tray TT ₁ to the first moving belt portion 1123 And is placed on the second moving belt portion 1124. This lift (U / D) in the test tray (TT ₁₎ to the lifting because the stopper (STP) test tray in the lower layer of the move is stopped by the (TT ₁₎ and a test tray in the lower layer (TT ₁ which by Is prevented from being damaged by the first moving belt portion 1123 or the second moving belt portion 1124 which are operated.

In FIG. 11, reference character r denotes a roller for guiding the forward and backward movement of the test tray TT ₁ .

On the other hand, the first tray mover 1110 has the same configuration as the second tray mover 1120. However, since the first tray moving device 1110 does not need to lift the test tray TT ₁ or the loading frame (TLF), the elevating frame and the elevating frame may be omitted.

When the first tray mover 1110 and the second tray mover 1120 of the second tray mover 1120 operate as described above, the test tray TT ₁ supplied to the first supply position SDP ₁ , The stacking frame TLF loaded with the stacking tray TT ₂ is moved from the first supply position SDP ₁ to the first standby position WP ₁ rearward together with the circulation rotation of the moving belts MB ₁ and MB ₂ . Of course, when the moving motors 125 of the first tray mover 1110 and the second tray mover 1120 are operated in reverse, the stacking frame (TLF) in the first standby position WP ₁ is moved to the first standby position WP ₁ ) to the first supply position (SDP ₁ ).

The loading frame TLF in which the test tray TT ₁ or the test board TT _{2 in} the first standby position WP ₁ is loaded is moved by the operation of the lift source 1122 of the second tray mover 1120 It can be raised or lowered. The reason why the test tray TT ₁ or the loading frame TLF can be raised or lowered in the first standby position WP ₁ is that the first tray transport apparatus 1300 and the tray transport apparatus 2200 It is necessary to adjust the height of the test tray (TT ₁ ) or the stacking frame (TLF) for proper operation required to transport the uppermost test board (TT ₂ ) or the test tray (TT ₁ ). For example, the test tray TT ₁ at the uppermost position in the first standby position WP ₁ is sent to the second unloading position UP ₂ via the second standby position WP ₂ . The test tray TT _{1 in which} the unloading of the electronic component ED is completed is carried out via the second waiting position WP ₂ and the tray unloading position TCP. Then follow the same path as the test tray (TT _1), the test tray (TT ₁₎ the previously discharged in the upper side of the following ranking of the test tray (TT ₁₎ taken out by a predetermined height raised the stacked test tray (TT ₁₎ . Likewise, when the test board TT ₂ loaded on the stacking frame TLF is loaded again on the stacking frame (TLF) after the electronic part ED is unloaded from the uppermost one, the stacking frame (TLF) And the electronic parts ED loaded on the test board TT ₂ at the height of the next rank are unloaded.

It is also contemplated that the first moving belt portion 1123 and the second moving belt portion 1124 of the second tray mover 1120 may be independently raised and lowered when the test tray TT ₁ is applied .

The second tray moving apparatus 1200 moves the stacking frame (TLF) loaded with the test tray TT ₁ or the test board TT ₂ in the second supply position SDP ₂ to the second standby position WP ₂ And has the same configuration as that of the first tray moving device 1100, and a description thereof will be omitted.

2. The first tray transfer device and the second tray transfer device

A first tray conveying apparatus 1300 to convey the test board (TT ₂₎ in a first waiting position (WP ₁₎ to a first unloading position (UP ₁₎ or in a first unloading position (UP ₁₎ the test board (TT ₂₎ including a first standby position holding members 1310, elevator 1320, and before and after the mobile station 1330 as shown in Figure 15 in order to transport to the (WP _1).

The gripping member 1310 is provided so as to be movable up and down, and has a grip pin 1311 protruding upward. This gripping member 1310 holds the test board TT ₂ with the gripping pin 1311 by lifting and releases the gripping of the test board TT ₂ by the gripping pin 1311 by the descent. Of course, it is preferable that a grip hole through which the grip pin 1311 can be inserted is formed on the bottom surface of the test board TT ₂ .

The elevator 1320 lifts the gripping member 1310 so that the gripping pin 1311 can be inserted into or removed from the gripping hole of the test board TT ₂ . Thus, the gripping member 1310 can grip or release the grip of the test board TT ₂ .

The forward / backward mobile device 1330 moves the gripping member 1310 and the elevator 1320 in the forward and backward directions. The test board TT ₂ is transferred from the loading frame TLF at the first standby position WP ₁ to the first unloading position UP ₁ at the rear in accordance with the forward and backward movement of the gripping member 1310 Or can be loaded on the stack frame (TLF) while being transferred from the first unloading position UP ₁ to the first standby position WP ₁ forward. At this time, the test board TT ₂ mounted on the loading frame TLF is gripped by the gripping member 1310 for rearward movement, or the test board TT ₂ placed in the first unloading position UP ₁ It is necessary to raise and lower the stacking frame (TLF) by the second tray mover 1120 in order to adjust the height of the test board TT ₂ as mentioned above so as to be properly loaded in the stacking frame TLF. For reference, in this embodiment, as shown in FIG. 15, a rodless cylinder is applied as the front and rear mobile unit 1330 for space utilization, but a general cylinder may be applied for cost reduction or the like.

2 in the tray transport apparatus 1400 of the second stand-by position (WP ₂₎ test board (TT ₂₎ to the second unloading position (UP ₂₎ to reduce or second unloading position transfer (UP ₂₎ in the And has the same configuration of the first tray transfer device 1300 to transfer the empty test board TT ₂ with the first test tray TT ₂ to the second waiting position WP ₂ . Therefore, detailed description of the configuration is omitted.

3. Third tray transfer device

A third tray delivery apparatus 1500 is a second stand-by position (WP ₂₎ a test tray (TT ₁₎ on and transferred to the second unloading position (UP _2), a second unloading position in (UP ₂₎ And conveys the test tray TT ₁ to the second standby position WP ₂ . To this end, the third tray transfer device 1500 has a first tray transfer device 1510 and a second tray transfer device 1520 as shown in FIG.

The first tray conveyor 1510 includes a gripper 1511, a horizontal mover 1512 and a vertical mover 1513.

The gripper 1511 is provided with a pair of grip members 1511a and 1511b capable of adjusting the interval between the pair of drive cylinders DS1 and DS2 to grip both ends of the test tray TT ₁ , can do. Such a gripper 1511 may have a rotation source RDF capable of rotating the grip members 1511a and 1511b. The rotation source RDF folds or unfolds the grip members 1511a and 1511b inward or outward by rotating the grip members 1511a and 1511b in the direction of the arrow. The interference between the test board TT ₂ and the grip members 1511a and 1511b can be eliminated when the test tray TT ₂ is moved by the second tray transfer apparatus 1400. [

The level shifter 1512 moves the test tray TT ₁ gripped by the gripper 1511 from the second standby position WP ₂ to the second unloading position UP ₂ by moving the gripper 1511 in the forward and backward directions. to thereby transferred to or transferred to a second unloading position at the second stand-by position _{(UP 2) (WP 2)} .

The vertical mover 1513 moves the gripper 1511 up and down. Therefore, the gripper 1511 is a test tray (TT ₁₎ to be lowered or raised to the height, or if it is to be gripped, can be raised and lowered in a state of releasing the grip of the test tray (TT _1).

The second tray conveyor 1520 is provided symmetrically with the first tray conveyor 1510 and has the same configuration as the first tray conveyor 1510, so that the description thereof will be omitted.

Of course, the first tray transmitter 1510 and the second tray transmitter 1520 can operate independently or interlock with each other.

Since the test tray TT ₁ must be positioned at a height at which the _first tray transmitter 1510 and the second tray transmitter 1520 can grip the test tray TT ₁ , It is necessary to lift the test tray TT ₁ by the tray 1120.

4. The first tray support unit and the second tray support unit

The first tray supporting apparatus 1600 supports the test board TT ₂ in the first unloading position UP ₁ and the second tray supporting apparatus 1700 supports the test board TT ₂ in the second unloading position UP ₂ , Support the tray (TT ₁ ) or the test board (TT ₂ ).

17, the second tray supporting device 1700 includes a pair of supporting rails 1711 and 1712, a pair of supporting devices 1721 and 1722, (1730).

A pair of support rails (1711, 1712) is supporting the both ends of the test board (TT _2), the second guides the longitudinal movement of the test board (TT ₂₎ to move back and forth by the tray transport apparatus 1500.

A pair of supporters 1721 and 1722 support the test tray TT ₁ as shown in FIG. First of the pair of supporters 1721 and 1722, the first supporter 1721 will be described.

The first support device 1721 includes a support plate 1721a and an elevator 1721b as shown in Fig.

The support plate 1721a is provided so as to be movable up and down, and supports the test tray TT ₁ .

The elevator 1721b lifts the support plate 1721a. Therefore, when the test board TT ₂ is applied, the support plate 1721a is lowered so that the support plate 1721a is not interfered with the movement of the test board TT ₂ . Further, when the test tray TT ₁ is applied, the support tray 1721 a is lifted so that the test tray TT ₁ can be positioned at an appropriate height for unloading the electronic component ED.

The second holder 1722 has the same configuration as the first holder 1721. [

Meanwhile, the first tray receiving apparatus 1600 may be configured in the same manner as the second tray receiving apparatus 1700. However, considering the logistics of the test tray TT ₁ in the electronic component unloading equipment EDUE according to the present embodiment, the first tray receiving apparatus 1600 need not support the test tray TT ₁ . Therefore, it is preferable to omit the pair of supporting members for supporting the test tray TT _{1 in} the first tray supporting apparatus 1600.

5. The first electronic component rotating device and the second electronic component rotating device

The first electronic component rotating apparatus 1800 and the second rotating apparatus 1900 rotate the vertical electronic component ED received from the first picking apparatus 2100 in a horizontal direction.

First, the first electronic component rotating apparatus 1800 will be described with reference to FIG.

The first electronic component rotating apparatus 1800 includes a moving plate 1810, a back and forth moving source 1820, a component rotating machine 1830 and a component aligner 1840.

The moving plate 1810 is movable in the front-rear direction. The moving plate 1810 is provided with a component rotator 1830 and a component aligner 1840. For reference, a plurality of foam rotators and component aligners may be provided on the moving plate 1810 to improve the processing capacity.

The back and forth moving source 1820 moves the moving plate 1810 in the forward and backward directions. The component rotator 1830 and the component aligner 1840 installed on the moving plate 1810 receive the electronic component ED from the first picking device 2100 and the position where the component picker 1840 receives the electronic component ED from the first picking device 2100, ED) to be moved. That is, when receiving the electronic component ED from the first picking device 2100, when the moving plate 1810 is in the forward movement state and the electronic component ED is fed to the second picking device 2400 The moving plate 1810 is moved backward. Accordingly, the operation areas of the first picking device 2100 and the second picking device 2400 are separated from each other, so that the operation interference between the first picking device 2100 and the second picking device 2400 is prevented.

The component rotator 1830 includes a mounting frame 1831, a rotating member 1832, a pair of holding members 1833a and 1833b, a first gap adjuster 1834 and a rotation driving source 1835. [

The lower end of the mounting frame 1831 is fixed to the moving plate 1810. A rotary member 1832 and the like are provided on the upper side of the installation frame 1831.

The rotary member 1832 is rotatably provided.

The pair of gripping members 1833a and 1833b are installed on the rotary member 1832 so as to be able to move back and forth in a direction opposite to each other to grasp the electronic component ED but release gripping. The pair of gripping members 1833a and 1833b are formed with gripping grooves GSa and GSb into which both ends of the electronic component ED can be inserted in directions opposite to each other.

The first gap adjuster 1834 moves the pair of gripping members 1833a and 1833b so as to approach or move away from each other so that the pair of gripping members 1833a and 1833b grip the electronic component ED, Or to release the grip of the electronic component (ED). The gap between the pair of gripping members 1833a and 1833b at the time of insertion of the electronic component ED is such that the gap between the pair of gripping members 1833a and 1833b is such that the electronic component ED drops while being slidably inserted into the gripping grooves GSa and GSb . At this time, since the lower ends of the gripping grooves GSa and GSb are in the closed jaw structure, the fall of the electronic component ED does not occur. When the electronic component ED is completely inserted into the gripper grooves GSa and GSb, the pair of gripper members 1833a and 1833b approach each other in a direction opposite to each other to stably grip the electronic component ED. This prevents the electronic component (ED) from deviating from the shake.

The rotation driving source 1835 rotates the rotating member 1832. The electronic component ED gripped by the gripping members 1833a and 1833b in the vertical state can be switched to the horizontal state in accordance with the rotation of the rotating member 1832. [

The component aligner 1840 includes a left-right aligner 1841, a pair of alignment members 1842a and 1842b, and a second spacing adjuster 1843. [

The left-right aligner 1841 supports the right end of the electronic component ED which has been switched to the horizontal state, and aligns the left-right position of the electronic component ED. To this end, the left-right aligner 1841 includes a cylinder 1841a and a support member 1841b. The support member 1841b advances in the left direction by the cylinder 1841a to align the left and right positions of the electronic part ED. Needless to say, the supporting member 1841b is provided with a supporting step for supporting the right end of the electronic part ED.

The pair of alignment members 1833a and 1833b align the horizontal electronic component ED placed on the support plate 1841. [ To this end, the pair of alignment members 1842a and 1842b are provided so as to be movable toward or away from each other. The pair of alignment members 1833a and 1833b are also provided with support tabs for supporting the front and rear ends of the electronic component ED, respectively.

The second gap adjuster 1843 moves the pair of alignment members 1842a and 1842b in a mutually approaching direction or in a separating direction.

Next, the operation of the above-described first electronic component rotating apparatus 1800 will be described.

20 shows a state in which the distance between a pair of gripping members 1833a and 1833b is slightly widened in a state in which the moving plate 1810 is advanced forward.

When the vertical electronic component ED is inserted into the gripping grooves GS1 and GS2 of the gripping members 1833a and 1833b by the first picking apparatus 2100 in the state as shown in Fig. 20, the first gap adjuster 1834 The gap between the pair of gripping members 1833a and 1833b is narrowed and the electronic part ED is gripped by the gripping members 1833a and 1833b. Then, as shown in Fig. 21, the moving plate 1810 is moved backward by the front and rear moving source 1820. As shown in Fig. Of course, unlike FIG. 21, it is also possible to prevent the interference with other structures in the electronic part unloading equipment EDUE or to move the moving plate 1810 after rotating the electronic part ED first according to the designer's intention.

Then, in the state of FIG. 21, the rotation driving source 1835 operates to rotate the rotating member 1832 as shown in FIG. As a result, the pair of gripping members 1833a and 1833b rotate together with the rotary member 1832 so that the electronic part ED is also switched from the vertical state to the horizontal state.

22, in order to prevent drop interference caused by the pair of alignment members 1842a and 1842b at the time of falling of the electronic component ED that is to be converted into a horizontal posture, a pair of alignment members 1842a, 1842b are slightly widened.

22, when the first interval adjuster 1834 is operated in reverse to release gripping of the electronic component ED by the pair of gripper members 1833a and 1833b, the electronic component ED is kept in a horizontal state It falls down parallel to the bottom. The front and rear ends of the electronic component ED are connected to the pair of alignment members 1842a and 1842b so that the surfaces of the pair of alignment members 1842a and 1842b face each other to guide falling of the electronic component ED. Are stably falling while coming into contact with each other. Then, the rotation driving source 1835 is operated in reverse to rotate the rotating member 1832 in the reverse direction.

On the other hand, when the drop of the electronic component ED is completed, the electronic component ED is supported by the support jaws of the support member 1841b and the pair of alignment members 1833a and 1833b. The support member 1841b is advanced to the left to align the left and right positions of the electronic component ED and the second gap adjuster 1843 is operated to narrow the gap between the pair of alignment members 1842a and 1842b, And aligns the component ED in the forward and backward directions in the correct position. And the second gap adjuster 1843 is operated in reverse to slightly increase the gap between the pair of alignment members 1842a and 1842b. Therefore, the gripping of the electronic component ED by the second picking device 2400 can be performed at a proper position, and the electronic component ED in the horizontal state is grasped by the second picking device 2400, . &Lt; / RTI &gt; Of course, when the electronic component ED is moved to the loading position LP by the second picking device 2400, the moving plate 1810 is moved forward again to move the electronic component (the first picking device 2100) ED).

Since the second electronic component rotating apparatus 1900 is additionally provided with the first electronic component rotating apparatus 1800 to increase the processing capacity, the second electronic component rotating apparatus 1900 is provided with the first electronic component rotating apparatus 1800, . Therefore, the description of the second electronic component rotating apparatus 1900 is omitted.

6. First picking device

The first picking apparatus 2100 unlocks the electronic part ED from the test tray TT ₁ or the test board TT ₂ in the first unloading position UP ₁ or the second unloading position UP ₂ The electronic component ED is supplied to the first electronic component rotating device 1800 or the first electronic component rotating device 1900 in which the moving plate 1810 is advanced forward. To this end, the first picking apparatus 2100 includes a picking module 2110, a first horizontal shifter 2120, a second horizontal shifter 2130 and a vertical shifter 2140 as shown in FIG.

The picking module 2110 includes a pair of pickers 2111a and 2111b and a pair of elevators 2112a and 2112b.

A pair of picker (2111a, 2111b) is the viewing direction face each other the holding members (CE _1, CE ₂₎ and the gripping member (CE _1, CE ₂₎ to each other in a pair in order to grip the opposite ends of the respective electronic components (ED) to have a retractable circle (AR _1, AR ₂₎ for advance and retreat.

The pair of elevators 2112a and 2112b are provided for vertically moving the first and second pickers 2111a and 2111b independently of each other. Accordingly, two electronic components (ED) can be gripped and moved at one time, and the electronic components can be sequentially supplied to the first electronic component rotating device 1800 and the second electronic component rotating device 1900, respectively .

The first horizontal mover 2120 moves the picking module 2110 in the forward and backward directions.

The second horizontal movement unit 2130 moves the picking module 2110 in the left and right directions.

The vertical mover 2140 moves the picking module 2110 up and down.

In the first picking apparatus 2100 in the present embodiment, since the pair of pickers 2111a and 2111b can hold the electronic components ED, it is possible to move the two electronic components ED at a time . However, depending on the implementation, only one picker may be provided, or three or more pairs of pickers may be provided.

In addition, the pair of pickers 2111a and 2111b have release pins RP and release preventing members PP. The releasing pin RP is moved to the position where the electronic component ED is held by the holding unit provided in the contact module CM of the test tray TT ₁ or the loading module LM of the test board TT ₂ prior to gripping the electronic component ED ED) is released. The release pin RP has a stopper SP having an expanded outer diameter in the middle, and can be lifted and lowered by the cylinder CD. A spring S is provided between the release pin RP and the cylinder CD. Therefore, when the release pin RP descends, the portion of the stopper SP is caught in the hole, so that the release pin RP descends only a distance enough to operate the holding module of the contact module CM or the loading module LM do. When the cylinder CD is lowered by the lowering of the releasing pin RP and the excessive descent of the releasing pin RP is caused, the spring S is compressed so that the contact module CM or the loading module RP LM) is prevented.

The release preventing member PP can prevent the electronic part ED from being moved upward from the contact module CM or the loading module LM by the impact of the releasing operation when the electronic part ED is released by the releasing pin RP. So that it is prevented from being released. For reference, in the equipment in which the first picking apparatus 2100 is configured to load the electronic component ED onto the contact module CM or the load module LM, the electronic component ED is mounted on the contact module CM, The release preventing member PP functions as a pressing member for pressing the electronic part ED downward when the electronic component ED is mounted on the main body LM.

7. Tray conveyor

The tray transport apparatus 2200 transports the test tray TT ₁ from the first standby position WP ₁ to the second standby position WP ₂ or moves the tray transporting position TCP from the second standby position WP _{2 to} the second standby position WP ₂ , Lt; / RTI &gt; Since the tray conveying apparatus 2200 has substantially the same configuration as the first tray conveying apparatus 1510 of the third tray conveying apparatus 1500 described above, only the carrying direction of the test tray TT ₁ is different, .

8. Tray ejector

The tray unloading apparatus 2300 is provided to take out the test tray TT ₁ in the tray unloading position TCP to the left. This tray take-out apparatus 2300 includes a pair of take-out belts 2311 and 2312, a take-out motor 2320, a drive pulley 2330 and a driven pulley 2340 as shown in FIG.

The take-out belts 2311 and 2312 rotate with the drive pulley 2330 and the driven pulley 2340 as rotation turning points by the operation of the take-out motor 2320. Therefore, when the take-out motor 2320 is operated, the test tray TT ₁ placed in the tray carry-out position TCP by the tray transport apparatus 2200 is carried out in the left direction. At this time, a loading device for receiving the test tray TT ₁ may be provided in the left direction, or another device connected to the left side of the electronic part unloading device according to the present embodiment.

9. Second picking device

The second picking apparatus 2400 picks up the electronic component ED from the first electronic component rotating apparatus 1800 or the second electronic component rotating apparatus 1900 in which the moving plate 1810 is moved backward To the lower plate (JB) of the underfill jig (UJ) in the post-loading position (LP). To this end, the second picking device 2400 includes a picking module 2410, a first horizontal mover 2420, a second horizontal mover 2430 and a vertical mover 2440 as in FIG.

The picking module 2410 has two pickers P1 and P2 capable of picking up and holding a horizontal electronic component ED by a vacuum pressure. In this embodiment, the two pickers P1 and P2 are configured to hold one electronic component ED. However, in some implementations, one picker may be implemented to move two electronic components at a time by holding one electronic component. Furthermore, by configuring the cylinder with a configuration in which the different distance difference or the size of the grasping portion of the picker is different from each other, it is possible to realize extension and contraction as necessary. Thus, it is possible to design electronic components of different sizes to be gripped or released by one picker or several pickers.

The first horizontal shifter 2420 moves the picking module 2410 in the forward and backward directions. It is possible for the picking module 2410 to move forward and backward with the empty empty portion on the lower plate JB of the underfill jig UJ as the target position.

The second horizontal mover 2430 moves the picking module 2410 in the lateral direction so that the picking module 2410 is positioned on the first electronic component rotating device 1800 or the second electronic component rotating device 1900 side, (LP).

The vertical mover 2440 allows the picking module 2410 to grasp the electronic component ED by lifting the picking module 2410 or to load the electronic component ED onto the lower plate JB of the underfill jig UJ And allows horizontal movement of the picker module 2410 without interfering with other configurations.

10. The first jig moving device and the second jig moving device

The first jig moving device 2500 moves the underfill jig UJ supplied to the movement start position MSP by the jig transportation device 3100 to the upper plate removal position TTP, (JB) from which the jaws JT have been removed to the first movement end position (MEP ₁ ).

The second jig moving device 2600 moves the lower plate JB in the loading position LP to the upper plate engaging position TJP and moves the lower plate JB in the upper plate engaging position TJP to the underfill jig UJ) to the second movement end position (MEP ₂ ).

Since the first jig moving device 2500 and the second jig moving device 2600 are substantially the same in configuration as the tray moving device 2300 shown in FIG. 24, description thereof will be omitted.

11. Top plate removing device

The upper plate removing apparatus 2700 removes the upper plate JT from the underfill jig UJ at the upper plate removing position TTP and then joins the upper plate JT to the lower plate JB at the upper plate engaging position TJP . To this end, the upper plate removing apparatus 2700 includes a holding module 2710, a vertical moving unit 2720 and a horizontal moving unit 2730 as shown in FIG.

The gripping module 2710 can grip or release the upper plate JT. Here, the holding members 2711 of the holding module 2710 can grasp and support only the upper plate JT through the opening groove OS of the lower plate JB. At this time, since the upper and lower plates JT and JB are coupled by the magnet M, the lower plate JB can be lifted together when the upper plate JT is lifted. Therefore, it is preferable that the electronic part unloading equipment EDUE is provided with a pressurizer PA capable of downwardly pushing the lower plate JB through the exposed grooves ES of the upper plate JT. Of course, the presser PA may be provided with an elastic sheet for preventing damage at a portion contacting the lower plate JB.

The vertical mover 2720 moves the gripping module 2710 up and down to allow the gripping module 2710 to remove the upper plate JT from the underfill jig UJ or to engage the upper plate JT with the lower plate JB.

The horizontal shift device 2730 moves the grip module 2710 from the upper plate removal position TTP to the upper plate engagement position TJP or from the upper plate engagement position TJP to the upper plate removal position TTP.

12. Lower plate feeder

The lower plate feeding device 2800 feeds the lower plate JB in the first movement end position MEP ₁ to the rear loading position LP. The lower plate conveying apparatus 2800 is substantially the same as the upper plate removing apparatus 2700 except that the lower plate JB is gripped and conveyed, and thus the description thereof will be omitted.

13. Jig lifting device

The jig raising device 2900 sequentially raises the underfill jigs UJ supplied to the jig feed position JSP in a stacked state in the vertical direction so that the underfill jig UJ located at the uppermost position is moved upward by the jig conveying device 3100, To the transport start position MSP.

For reference, the underfill jig UJ can be supplied to the jig feed position JSP while being loaded in a separate stacking frame for loading the underfill jig UJ.

In this case, the jig raising device 2900 may be implemented to sequentially raise the underfill jig by stepping up the load frame by a certain height, or may be implemented to sequentially raise the underfill jig only.

The jig raising device 2900 may be substantially the same as the lift frame 1121 and the lift raising source 1122 of the second tray mover 1120 described above and may be modified as necessary .

14. Jig carrier

The jig carrier device 3100 carries the empty underfill jig UJ in the jig supply position JSP to the transport start position MSP. The jig carrier device 3100 also moves the underfill jig UJ filled with the electronic component ED at the second delivery end position MEP ₂ to the reverse position JDP. The structure of the jig carrier device 3100 is substantially the same as that of the above-mentioned upper plate removing / dismounting device 2700, only the transfer distance is different.

15. Jig reversing device

The jig inverting apparatus 3200 is connected to the underfill jig UJ conveyed to the inverted position JDP at the second movement end position MEP ₂ by the jig carrier 3100 with the horizontal line in the left- . To this end, the jig inverting device 3200 includes a jig holder 3210, a jig transducer 3220 and an installation frame 3230, as shown in Fig. 27 and in some exploded views, Fig.

The jig holder 3210 includes a support plate 3211 and a lift source 3212.

The support plate 3211 is provided to support the underfill jig UJ.

The lift source mobilization source 3212 elevates and lowers the support plate 3211. Accordingly, when the pedestal plate 3211 is lifted by the lifting wall motion source 3212, the under plate jig UJ can be supported by the pedestal plate 3211, and when the pedestal plate 3211 is lowered So that the receiving condition of the underfill jig UJ by the receiving plate 3211 is released.

The jig inverter 3220 includes a holding module 3221 and a reversing motor 3222. [

The gripping module 3221 can grip or release the gripping jig UJ. To this end, the gripping module 3221 includes a mounting block 3221a, a lift block 3221b, a lift source 3221c, a cam block 3221d, and an interlocking shaft 3221e. Here, the installation block 3221a, the elevation block 3221b, the elevation movement source 3221c, and the cam block 3221d are symmetrically provided in pairs.

The mounting block 3221a is rotatably mounted on the mounting frame 3230 and has a supporting portion SP capable of supporting the underfill jig UJ.

The elevating block 3221b is provided so as to be slightly elevated from the lower side of the setting block 3221a and has cam protrusions CP at the front end and the rear end thereof and a pair of holding protrusions GP projecting toward the underfill jig UJ, .

The lift source mobilization source 3221c is provided for raising and lowering the lift block 3221b.

The cam block 3221d is provided at both the front and rear ends of the installation block 3221a and a cam groove CS into which the cam protrusion CP of the lift block 3221b is inserted is formed. Here, the cam groove CS has a first vertical section PS1, a second vertical section PS2, and a slope section TS.

The first vertical section PS1 guides the lifting cam protrusion CP in the vertical direction. The first vertical section PS1 may be omitted.

The second vertical section PS2 is positioned on the upper side of the first vertical section PS1 and guides the cam protrusions CP ascending and descending in the vertical direction.

The ramp section TS connects the upper end of the first vertical section PS1 and the lower end of the second vertical section PS2 and the cam protrusions CP ascending or descending have a moving displacement in the direction of the underfill jig UJ The descending cam projection CP has an angle of about 45 degrees with the horizontal line so as to have a displacement in the opposite direction of the underfill jig UJ. Therefore, the cam protrusion CP moves in the inclined section TS while having both the vertical displacement and the horizontal displacement. Accordingly, the elevating block 3221b having the cam protrusion CP also moves with the vertical displacement and the horizontal displacement together.

The interlocking shafts 3221e are provided in pairs in the front and rear direction, and connect the left and right installation blocks 3221a so that the left and right installation blocks 3221a can rotate together.

The inverting motor 3222 rotates the mounting block 3221a by 180 degrees with the horizontal line in the left and right direction as a rotation axis so that the grip module 3221 is rotated 180 degrees, and accordingly the underfill gripped by the grip module 3221 Turn the jig (UJ) 180 degrees.

The installation frame 3230 is provided for installing the jig inverter 3220 and supports the jig inverter 3220. Here, the jig inverter 3220 is installed above the jig holder 3210.

Subsequently, the operation of the jig inverting apparatus 3200 will be described.

29, when the underfill jig UJ carried by the jig carrier device 3100 in the inversion position JDP is placed on the receiving plate 3211, the lifting device 3221c is moved Thereby raising the lift block 3221b. The elevating block 3221b moves horizontally toward the underfill jig UJ with the elevation while being guided by the cam groove CS of the cam block 3221d through the cam protrusion CP. At this time, the grip projection GP of the lift block 3221b moves toward the underfill jig UJ while the cam protrusion CP moves in the inclined section TS, whereby the grip protrusion GP is moved to the underfill jig UJ, As shown in Fig. When the lifting block 3221b further rises, the cam protrusion CP passes the second vertical section PS2 and the gripping projection GP grips the underfill jig UJ to the support portion SP And is brought into close contact. Therefore, the underfill jig UJ is grasped by the grasping module 3221 in a state of being caught by the grasping projection GP and the support portion SP. In the state of FIG. 30, the support plate 3211 is lowered and the inverting motor 3222 is operated as shown in FIG. 31 to rotate the gripping module 3221 by 180 degrees as shown in FIG. Therefore, the underfill jig UJ gripped by the gripping module 3221 is also rotated 180 degrees. When the gripping module 3221 is rotated, the support plate 3211 rises to support the underfill jig UJ and the lift block 3221b rises (since the gripping module is rotated 180 degrees, The block is expressed as rising), so that the gripping module 3221 releases gripping of the underfill jig UJ.

16. Jig conveying device

The jig transfer device 3300 transfers the underfill jig UJ in the reverse position JDP to the jig take-off position JCP on the right side. To this end, the jig transfer device 3300 includes a pair of guide rails 3311 and 3312, a plunger 3320 and a transfer drive source 3330 as shown in Fig.

The pair of guide rails 3311 and 3312 support the underfill jig UJ when the support plate 3211 of the jig holder 3210 descends and guides the rightward movement of the underfill jig UJ.

The plunger 3320 is provided for pushing and conveying the underfill jig UJ supported by the pair of guide rails 3311 and 3312 to the right jig removal position JCP.

The feed drive source 3330 moves the plunger 3320 in the left-right direction.

Therefore, when the under plate jig UJ is supported by the guide rails 3311 and 3312 by lowering the support plate 3211, the feed drive source 3330 operates to move the plunger 3320 in the right direction. As a result, the underfill jig UJ is pushed and moved by the plunger 3320 so that the underfill jig UJ is transferred from the reverse position JDP to the jig removal position JCP. Of course, when the feeding of the underfill jig UJ is completed, the feed driving source 3330 operates in the reverse direction to move the plunger 3320 to the left side.

17. Jig Exports

The jig take-out apparatus 3400 takes out the underfill jig UJ in the jig take-out position JCP. At this time, the underfill jig UJ to be carried out may be moved to a separate apparatus coupled to the rear end, or may be loaded on a separate loading apparatus. Since the jig take-out device 3400 is substantially the same as the above-mentioned tray take-out device 2300, detailed description thereof will be omitted.

<Description of Optional Configurations>

In the above embodiment, various configurations are added for enlarging the processing capacity, but many configurations can be omitted without considering the processing capacity.

1. Even if only the second tray transfer device 1200, the second tray transfer device 1400, the third tray transfer device 1500 and the second tray support device 1700 are used, The first tray transfer device 1100, the first tray transfer device 1300, and the first tray support device 1600 can be omitted because the device can be supplied to the device 2100. [

Furthermore, if the operator is designed to directly supply the load frame (TLF) loaded with the test tray TT ₁ or the test board TT ₂ to the first standby position WP ₁ or the second standby position WP ₂ , The first tray moving device 1110 in the first tray moving device 1100 or the second tray moving device 1200 can be omitted and the first moving belt portion 1123 and the second moving belt portion 1124 Can be omitted.

2. Either the first electronic component rotating device 1800 or the second electronic component rotating device 1900 can be omitted, provided that the processing capacity is not taken into account.

3. If the test tray TT ₁ is also controlled to be carried out to the first supply position SDP ₁ or the second supply position SDP ₂ like the test board TT ₂ , the tray transport apparatus 2300 is omitted .

4. If the first jig moving device 2500 can be moved in the left and right direction of the underfill jig UJ without considering the processing speed, the second jig moving device 2600 and the lower plate moving device 2800 It is also possible to omit it.

5. If the 180 degree inversion of the underfill jig UJ is not required, the jig inverting apparatus 3200 may be omitted.

6. It is also possible to omit the jig transfer device 3300 and the jig transfer device 3400 if the underfill jig UJ is implemented to be carried out through the jig supply position JSP.

7. If the underfill jig UJ is provided without a top plate, the top plate removing apparatus 2700 can be omitted.

8. In the embodiment according to the test tray (TT ₁₎ to be implemented by being applied only to omit a configuration for a test board (TT _2), or the test board by being implemented such that only the application (TT ₂₎ for a test tray (TT ₁₎ The configuration can be omitted.

9. In this embodiment, a test tray TT ₁ or a stacking frame (TLF) for proper transport operation of the first tray transfer device 1300, the second tray transfer device 1400 and the third tray transfer device 1500, And has a structure for ascending and descending. However, it is also contemplated that the first tray transfer device 1300, the second tray transfer device 1400, and the third tray transfer device 1500 may be elevated or lowered depending on the implementation.

Therefore, while the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the scope of the present invention is to be understood as the scope of the following claims and their equivalents.

EDUE: Electronic Part Unloading Equipment
1100: first tray moving device
1200: second tray moving device
1300: first tray feeding device
1400: second tray feeding device
1500: Third tray transfer device
1600: first tray support device
1700: second tray support device
1800: first electronic component rotating device
1900: Second electronic component rotating device
2100: first picking device
2200: Tray conveying device
2400: second picking device
2500: first jig moving device
2600: second jig moving device
2700: Top plate removing device
2800: Lower plate feeder
3100: Jig carrier device
3200: jig reversing device

Claims (15)

An electronic component rotating device for rotating the vertical electronic component in a horizontal state;
A first picking device for unloading the vertically stacked electronic component from the test tray in the test tray at the unloading position and then supplying the vertical electronic component to the electronic component rotating device; And
A second picking device for moving the electronic component horizontally rotated by the electronic component rotating device to an underfill jig in the loading position; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. The method according to claim 1,
A tray transfer device for transferring the test tray from the standby position to the unloading position or from the unloading position to the standby position; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. 3. The method of claim 2,
A tray moving device for moving the test tray in the receiving position to the standby position; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. 3. The method of claim 2,
A tray carrying device for carrying the test tray at the standby position to a tray take-out position; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. The method according to claim 1,
A first type of tray transfer device for transferring a first type of test tray from a standby position to the unloading position or from the unloading position to the standby position; And
A second type of test tray for transferring a second type of test tray having a structure different from that of the first type of test tray from the standby position to the unloading position or from the unloading position to the standby position, Device; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. The method according to claim 1,
The test tray in the unloading position is referred to as a tray supporting device; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. The method according to claim 6,
The tray support apparatus includes:
A support for supporting the first test tray of the first type; And
A pair of support rails supporting a second type of test tray having a different structure from the first test tray; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. The method according to claim 1,
The tray transport device for transporting the test tray in the first standby position to the second standby position; And
A tray transfer device for transferring the test tray in the second standby position to the unloading position; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. The method according to claim 1,
An upper plate detachment device for detaching the upper plate of the underfill jig from the lower plate; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. 10. The method of claim 9,
An opening groove is formed in the lower plate,
Wherein the upper plate desorption apparatus grasps the upper plate through the opening groove
Electronic parts unloading equipment. 10. The method of claim 9,
A first jig moving device for moving the lower plate, from which the upper plate has been removed by the upper plate removing device, to a first movement end position;
A lower plate transfer device for transferring the lower plate at the first movement end position to the loading position; And
A second jig moving device for positioning the underfill jig to which the upper plate is coupled by the upper plate removing device at a second movement end position after the loading of the electronic component at the loading position is completed; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. 12. The method of claim 11,
A jig conveying device for conveying the empty underfill jig in the supply position to the movement start position; Further comprising:
The first jig moving device moves the underfill jig at the movement start position to the upper plate removing position where the upper plate is detached by the upper plate removing device and then moves the lower plate from which the upper plate is detached to the first movement end position Characterized in that
Electronic parts unloading equipment. 12. The method of claim 11,
A jig inverting device for rotating the underfill jig at the inverted position by 180 degrees around a horizontal line as a rotation axis; And
A jig conveying device for conveying the underfill jig at the second movement end position to the inverted position; &Lt; RTI ID = 0.0 &gt;
Electronic parts unloading equipment. The method according to claim 1,
Wherein the first picking device has a release pin for releasing the holding state of the holding device provided in the test tray and holding the loaded electronic component
Electronic parts unloading equipment. The method according to claim 14,
Characterized in that the first picking apparatus further comprises a release preventing member for preventing the release of the electronic component whose holding state is released by the action of the release pin
Electronic parts unloading equipment.

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