KR100824128B1 - Insert for electronic component handling apparatus, and electronic component handling apparatus - Google Patents

Abstract

Two electronic component accommodating portions 19 are formed on the insert 16 mounted on the test tray TST of the electronic component handling apparatus 1, and the two electronic component accommodating portions 19 are positioned to position the insert 16. It arrange | positions in the position which interposes the reference hole 20a used for the reference of a position at the time. By using the insert 16 having a plurality of electronic component storage portions 19, the number of storage of the IC device 2 per unit area in the test tray TST is increased, thereby improving throughput. In addition, when the two electronic component storage portions 19 are arranged at positions with the reference hole 20a interposed therebetween, both the electronic component storage portions 19 can be positioned near the reference hole 20a. Position shift of the IC device 2 caused by thermal expansion and thermal contraction of 16) is suppressed, and the occurrence of contact miss due to position shift is suppressed.

Handling Units, Test Trays, Reference Holes, IC Drivers

Description

INSERT FOR ELECTRONIC COMPONENT HANDLING APPARATUS, AND ELECTRONIC COMPONENT HANDLING APPARATUS}

The present invention relates to inserts and pushers used in electronic component handling devices, socket guides and electronic component handling devices used in test heads.

In the manufacturing process of electronic components, such as an IC device, the test apparatus for testing the finally manufactured electronic component is needed. The test apparatus is provided with a test tray in which the IC device is stored, and a mounting hole of the IC device called an insert is attached to the test tray. As shown in Fig. 12A, the conventional insert has an electronic component housing portion A for storing the IC device in the center thereof, and a reference hole for positioning formed at one end thereof. B and the guide hole C for positioning formed in the other edge part is provided. The test tray is provided with 32 such inserts, for example, and the IC device can be accommodated in each insert.

In the test apparatus, the IC device is stored in an insert attached to the test tray, and the test tray is conveyed above the test head by an electronic component handling apparatus called a handler. The insert, then mounted on the test tray, is positioned in the socket guide on the test head, in which state each IC device housed in the insert is pushed into the socket on the test head. Then, the connection terminal of an IC device and the connection terminal of a socket are brought into electrical contact, and a test is performed by the test main apparatus (tester). When the test is finished, each IC device is taken out from the test head by the electronic component handling apparatus, loaded on the tray according to the test result, and classified into each category, such as good or bad.

<Start of invention>

Problems to be Solved by the Invention

Recently, however, by increasing the number of inserts in one test tray to 32, 64, or 128, it is possible to test more IC devices simultaneously, thus improving throughput. Is done. By the way, when the number of inserts attached to one test tray is increased, the test tray and the electronic component handling apparatus become larger. When the apparatus becomes large, the handling of the apparatus becomes difficult, or securing the installation space becomes difficult, which may limit the installation site.

In addition, it is conceivable to increase the number of IC devices per unit area in the test tray by using an insert having a plurality of IC device accommodating portions, thereby increasing throughput by increasing the number of IC devices under test that can be tested simultaneously. Can be. Specifically, as shown in FIG. 12B, the number of electronic component accommodating portions A of the insert center portion is two. In this case, however, the size of each insert becomes large. In the test of the IC device, there is a test in which the IC device is subjected to heat stress (heating or cooling). In this test, the larger the insert, the larger the dimensional change due to thermal expansion or thermal contraction. When a large dimensional change occurs, positional deviation with respect to the socket of the IC device stored in the insert is likely to occur, and contact misses due to positional deviation are likely to occur.

This invention is made | formed in view of such a situation, and the improvement of a throughput or the size reduction of an apparatus is aimed at by the increase of the number of simultaneous measurement of the electronic component under test per unit area, and also the contact miss resulting from the position shift of the electronic component under test It is an object of the present invention to provide an insert for an electronic component handling apparatus capable of suppressing the occurrence of the present invention, and to provide an electronic component handling apparatus in which the insert is used.

Means for solving the problem

In order to achieve the above object, firstly, the present invention is an insert for storing an electronic component under test and mounted on a contact portion of a test head in the state, and the reference hole for positioning the insert, which is formed in the center of the insert. And at least one guide hole for preventing a positional shift in the rotational direction with respect to the reference hole of the insert, formed at both ends of the insert, and an electronic component under test disposed at a position where the reference hole is interposed therebetween. Provided is an insert comprising at least two electronic component housings (Invention 1).

According to the invention (Invention 1), a plurality of electronic component accommodating portions can be formed to approach each other, and the number of simultaneous measurement of the electronic component under test per unit area can be increased, thereby improving throughput or miniaturizing the apparatus. Can be. Further, according to the invention (Invention 1), since the electronic component accommodating portion is disposed at a position sandwiching the reference hole, each electronic component accommodating portion can be positioned near the reference hole. As described above, when two electronic component accommodating portions are formed side by side in the center of the insert (see FIG. 12B), the electronic component accommodating portion near the reference hole and the electronic component accommodating portion away from the reference hole exist. However, according to the invention (Invention 1), this does not happen. If all the electronic component housing parts are located near the reference hole, the positional shift of the electronic component storage part due to thermal expansion or thermal contraction of the insert is minimized. Moreover, the position shift of the rotation direction with respect to the reference hole of an insert is also inhibited by the guide hole of the said insert. Therefore, according to the said invention (invention 1), generation | occurrence | production of the contact miss resulting from the position shift of the electronic component under test is suppressed.

In the said invention (invention 1), it is preferable that the said guide hole is a long hole whose longitudinal direction of the said insert becomes a long axis (invention 2). When the guide hole has such a shape, even if a dimensional change occurs in the insert due to thermal expansion or thermal contraction (in particular, the length direction of the insert is larger than the width direction), the guide bush of the socket guide is inserted into the guide hole. The guide pin of the pusher can be inserted, and the insert, the pusher and the socket can be fitted. In addition, in the width direction of the guide hole, the insert is locked by two guide holes, and the positional shift in the rotational direction around the reference hole of the insert is suppressed.

In the above inventions (Inventions 1 and 2), the electronic component accommodating portion is provided at a position corresponding to a socket having a connection terminal in electrical contact with a terminal of the electronic component under test, which is disposed in the contact portion of the test head. And the reference hole is formed at a position to fit the reference bush of the socket guide fixed to the contact portion to position the socket and the insert, and the guide hole is formed at a position to fit the guide bush of the socket guide. It is preferable to become (invention 3).

In the above invention (Invention 3), both end portions of the insert are concave or convex, which fits into the convex or concave guide portion formed in the socket guide and can suppress the positional shift in the rotational direction with respect to the socket guide. The guide portion of the shape may be formed (Invention 4). According to this invention (invention 4), even if the two guide holes of the insert are formed with a diameter slightly larger than the diameter of the guide bush of the socket guide, the positional shift in the rotational direction of the insert can be prevented. Does not require high dimensional accuracy.

In the above invention (Invention 3, 4), the electronic component under test stored in the electronic component accommodating portion is pressed by the pusher of the pusher to the connection terminal of the socket so that the reference hole of the insert fits. Preferably, the reference pin of the pusher is inserted into the hollow portion of the reference bush, and the guide pin of the pusher is inserted into the hollow portion of the guide bush of the socket guide to which the guide hole of the insert is fitted (invention 5).

Secondly, the present invention provides an insert for accommodating an electronic component under test and mounted in a contact portion of a test head in a state thereof, the core portion having an electronic component accommodating portion for accommodating the electronic component under test, and the plurality of core portions. An insert is provided which comprises a holding portion for holding each of the flows independently (invention 6).

According to the above invention (Invention 6), a plurality of electronic component accommodating portions can be formed close to each other, and the number of simultaneous measurement of the electronic component under test can be increased per unit area, thereby improving throughput or miniaturizing the apparatus. Can be. In addition, according to the invention (Invention 1), since each core part is held to be able to flow in the holding part, even if the insert is thermally expanded or thermally contracted, by appropriately defining the position while moving each core part minutely, The position shift of the component storage part can be minimized.

In the above invention (Invention 6), it is preferable that each of the core portions is provided with an individual positioning hole at a position to engage with the individual positioning pin provided on the contact portion side of the test head (invention 7). According to this invention (invention 7), since each core part can be reliably positioned to the contact part of a test head, generation of a contact miss resulting from the position shift of the electronic component under test can be suppressed.

In the above invention (Invention 6, 7), it is preferable that the holding portion is formed with a guide hole at a position that fits into the guide bush of the socket guide fixed to the contact portion of the test head (Invention 8). According to this invention (invention 8), since the holding portion, and further, each core portion can be reliably positioned in the contact portion of the test head, it is possible to suppress the occurrence of contact miss due to the positional shift of the electronic component under test. ．

In the said invention (invention 1-8), the said insert is provided with the at least 2 attachment hole for attaching the said insert to a test tray, The said insert is an attachment piece provided in the said test tray in the said attachment hole. It is preferred to be fluidly attached relative to (Invention 9). According to this invention (invention 9), even if the insert attached to the test tray is slightly displaced in the initial stage, the insert can be forcibly fitted to the socket guide to maintain the positioning.

Thirdly, the present invention provides a socket guide for positioning the insert in mounting an insert having at least two electronic component accommodating portions, a reference hole and a guide hole in a socket of a test head, the connecting terminal being provided in the socket. At least two window holes exposing to the side of the electronic component under test carried over the socket, a reference bush inserted into the reference hole of the insert when positioning the insert, and a guide of the insert when positioning the insert. And a guide bush inserted into the hole, wherein the window hole is disposed at a position sandwiching the reference bush (invention 10).

According to the invention (Invention 10), it is possible to provide a socket guide that can be fitted to the insert according to the invention (Invention 1-5) described above, so that the socket guide on the test head where the insert and the socket guide correspond one-to-one. It can be installed, and it becomes easier to secure the positioning accuracy when positioning the insert in the socket guide. As a result, it is possible to reduce the occurrence of contact miss caused by the positional shift of the electronic component under test while improving the throughput or miniaturizing the device.

Fourthly, the present invention provides a structure of a contact portion of a test head in which an insert having a plurality of core portions having an electronic component accommodating portion and a holding portion for holding each of the plurality of core portions independently movable is mounted. And an individual positioning pin that can fit with an individual positioning hole formed in each of the core portions of the insert, and a guide bush that can fit with a guide hole formed in the holding portion of the insert. The structure of the contact portion is provided (invention 11).

According to the invention (Invention 11), it is possible to provide a contact portion that can be fitted to the insert according to the invention (Invention 6-8) described above, so that it is easier to secure positioning accuracy when positioning the insert in the contact portion. Become. As a result, it is possible to reduce the occurrence of contact miss caused by the positional shift of the electronic component under test while improving the throughput or miniaturizing the device.

Fifthly, the present invention is a pusher of an electronic component handling device for pressing an electronic component under test stored in an insert having a reference hole and a guide hole to a contact portion of a test head, and for pressing the electronic component under test to the contact portion. And at least two pressurizers, a reference pin inserted into the reference hole of the insert to press the positioning pin, and a guide pin inserted into the guide hole of the insert to press the positioning pin, and the pressurizer includes the reference pin. A pusher is provided which is arranged at a position sandwiching a pin (invention 12).

According to the above invention (Invention 12), since the pushers having the same number of pressurizers as the electronic component accommodating portion of the insert according to the invention (Invention 1-5) described above can be provided, the electronic parts such that the insert and the pusher correspond one-to-one Pushers can be installed on the handling device.

Sixthly, the present invention provides an electronic component handling apparatus which stores a plurality of electronic components under test in an insert, conveys them to the contact portion of the test head, and electrically connects them to perform the test. An electronic component handling apparatus is provided (invention 13).

In the invention (Invention 13), a test chamber for maintaining a state in which a plurality of the inserts containing the electronic component under test are heated or cooled to a predetermined temperature, and the electronic component under test stored in the insert are It is preferable to provide a plurality of pushers pressed on the contact portion, and a driving device to hold and drive the plurality of pushers so that the plurality of pushers collectively pressurize the electronic component under test contained in the plurality of inserts. (Invention 14)

Effect of the Invention

According to the insert, pusher, socket guide for a test head, and the electronic component handling device using the insert according to the present invention, the throughput can be improved by increasing the number of simultaneous measurement of the electronic component under test per unit area. Miniaturization can be attained, and the occurrence of contact miss caused by misalignment of the electronic component under test can be suppressed.

<Best Mode for Carrying Out the Invention>

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described in detail based on drawing.

[First Embodiment]

1 is an overall side view of an IC device testing apparatus including an electronic component handling apparatus (hereinafter referred to as a "handler") according to a first embodiment of the present invention, FIG. 2 is a perspective view of a handler according to the first embodiment, 3 is a cross-sectional view of an essential part in a test chamber of a handler according to the first embodiment, FIG. 4 is an exploded perspective view showing a test tray used in the handler, and FIG. 5 is a view of the vicinity of a socket in the handler according to the first embodiment. 6 is an exploded perspective view showing the structure, and FIG. 6 is a partial cross-sectional view of the pusher in the handler according to the first embodiment.

First, the whole structure of the IC device test apparatus provided with the handler which concerns on the Example of this invention is demonstrated.

As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main device 6. The handler 1 sequentially transfers the IC device (an example of electronic component) to be tested to a socket provided in the test head 5, classifies the IC device after the test is completed according to the test result, and transfers the IC device to a predetermined tray. The operation to store is performed.

The socket provided in the test head 5 is electrically connected to the test main device 6 via the cable 7, and the test main device is connected to the test device via the cable 7 with the IC device detachably attached to the socket. It connects to (6), and tests an IC device by the electrical signal for a test from the test main device 6.

Although the control apparatus which mainly controls the handler 1 is built in the lower part of the handler 1, the hollow part 8 is formed in one part. In this empty part 8, the test head 5 is arrange | positioned so that replacement is possible, and it becomes possible to mount an IC device to the socket on the test head 5 via the through hole formed in the handler 1. .

This handler 1 is an apparatus for testing an IC device which is an electronic component to be tested in a temperature state (high temperature) or a low temperature state (low temperature) higher than normal temperature. And the handler 1 has the chamber 100 comprised from the thermostat 101, the test chamber 102, and the heat removal tank 103 as shown in FIG. The upper part of the test head 5 shown in FIG. 1 is inserted in the test chamber 102 as shown in FIG. 3, and the test of the IC device 2 is performed there.

As shown in Fig. 2, the handler 1 of the present embodiment includes an IC storing unit 200 which stores an IC device to be tested from now on, and classifies and stores the tested IC devices. Loader IC 300 for sending the IC device under test sent from 200 to the chamber portion 100, the chamber portion 100 including the test head, and the test IC for which the test was performed in the chamber portion 100. It consists of an unloader unit 400 to take out and classify.

Many IC devices before being set in the handler 1 are housed in a customer tray (not shown), and are supplied to the IC storage unit 200 of the handler 1 shown in FIG. 2 in that state. The IC device is carried from the customer tray to the test tray TST (see FIG. 4) described later used for conveyance in the handler 1. Inside the handler 1, as shown in FIG. 3, the IC device moves in a state loaded on the test tray TST, and is subjected to a high temperature or low temperature stress to test whether or not it operates properly (inspection). And classified according to the test results.

Hereinafter, the inside of the handler 1 is explained in full detail individually.

First, a part related to the IC storing unit 200 will be described.

As illustrated in FIG. 2, the IC storing unit 200 includes a pre-test IC stocker 201 storing an IC device before a test, and a tested IC stocker 202 storing IC devices classified according to the test results. Is installed.

The IC stocker 201 and the tested IC stocker 202 before these tests are frame-shaped tray support frame 203 and the elevator 204 which can enter from the lower part of this tray support frame 203, and can be elevated up and down. ). A plurality of customer trays are stacked and supported on the tray support frame 203, and only the stacked customer trays are moved up and down by the elevator 204.

In the pre-test IC stocker 201 shown in FIG. 2, a customer tray in which the IC device to be tested is stored is stacked and held. In the tested IC stocker 202, customer trays in which IC devices sorted after testing are stored are stacked and held.

Second, the part related to the loader part 300 is demonstrated.

The customer tray stored in the IC stocker 201 before the test is the device substrate by the tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105 as shown in FIG. 2. It is conveyed to the window part 306 of the loader part 300 from the lower side of 105. In this loader section 300, the IC device under test mounted on the customer tray is transferred to the preciser 305 by the XY transfer device 304, and here, the IC device under test After correcting the position of each other, the IC device under test transferred to the preserizer 305 is further moved to the test tray TST stopped by the loader 300 using the XY transfer apparatus 304. Load.

The XY conveying apparatus 304 which carries an IC device under test from a customer tray to a test tray TST is equipped with two rails 301 hypothesized on the upper part of the apparatus board | substrate 105 as shown in FIG. The movable arm 302 is supported by the movable arm 302 which can reciprocate between the test tray TST and the customer tray by this rail 301 (this direction is called Y direction), and the movable arm 302 The movable head 303 which can move along the X direction is provided.

An adsorption head is attached downward to the movable head 303 of this XY conveyance apparatus 304, and this adsorption head adsorb | sucks an IC device under test from a customer tray, and carries out the IC device under test in a test tray TST. Transfer to

Third, the part related to the chamber 100 is demonstrated.

The IC device under test is loaded on the loader section 300 in the test tray TST described above. Thereafter, the test tray TST is sent to the chamber 100, where each IC device under test in the state mounted on the test tray TST is tested.

As shown in FIG. 2, the chamber 100 includes a thermostat 101 that applies a high-temperature or low-temperature thermal stress to an IC device under test on a test tray TST, and thermal stress is generated in the thermostat 101. The IC device under test is configured with a test chamber 102 in which a socket on the test head is mounted, and a heat removing tank 103 for removing the applied thermal stress from the IC device under test in the test chamber 102. have.

In the heat removal tank 103, when high temperature is applied in the thermostat 101, the IC device under test is cooled by blowing air to return to room temperature, and when the low temperature is applied in the thermostat 101, the IC under test is tested. The device is heated in a warm air or a heater to return to a temperature where condensation does not occur. Then, the removed IC device under test is carried out to the unloader unit 400.

As shown in FIG. 3, a test head 5 is disposed below the test chamber 102. The test tray TST in which the IC device 2 is housed is carried on this test head 5. In the test head 5, all the IC devices 2 stored in the test tray TST are sequentially electrically contacted with the test head 5, and a test is performed on all the IC devices 2 in the test tray TST. When the test is completed, the test tray TST is de-heated in the heat removal tank 103 to return the temperature of the IC device 2 to room temperature, and then discharged to the unloader unit 400 shown in FIG. 2.

In addition, as shown in FIG. 2, the upper part of the thermostat 101 and the heat removal tank 103 has an opening for inlet for sending the test tray TST from the device substrate 105, and the test tray to the device substrate 105. The opening part for outlet for sending out TST is formed, respectively. In the device substrate 105, a test tray conveying device 108 for dispensing the test tray TST from these openings is mounted. These conveying apparatus 108 is comprised by the rotating roller etc., for example. The test tray TST discharged from the heat removal tank 103 is conveyed to the unloader part 400 by the test tray conveyance apparatus 108 provided on this apparatus substrate 105.

As shown in FIG. 4, the test tray TST has a rectangular frame 12, and a plurality of flesh 13 are provided in the frame 12 in parallel and at equal intervals. A plurality of attachment pieces 14 are formed to protrude at equal intervals in the longitudinal direction on both sides of these flesh 13 and inside the side 12a of the frame 12 parallel to these flesh 13. . Each insert housing portion 15 is constituted by two attachment pieces 14 facing each other among the plurality of attachment pieces 14 provided between the ribs 13 and between the ribs 13 and the sides 12a. It is.

One insert 16 is accommodated in each insert storage portion 15, and the insert 16 is floated on the two attachment pieces 14 using the fixture 17 in the attachment hole 21. Is attached. In this embodiment, 4 inserts are to be attached to one test tray TST. By storing the IC device 2 under test in the insert 16, the IC device 2 under test can be loaded on the test tray TST.

As shown in FIG. 5, the insert 16 is equipped with the circular reference hole 20a by which the reference bush 411a of the socket guide 41 mentioned later is inserted in the center part. On both sides of the reference hole 20a, a substantially rectangular IC accommodating portion 19 is formed in plan view. In other words, the two IC accommodating portions 19 are arranged at positions sandwiching the reference holes 20a. And the position of the reference hole 20a is more precisely the intermediate position of both IC accommodating parts 19.

In addition, the guide hole 20b which consists of an elliptical long hole is formed in the center part of the both ends of the insert 16 in consideration of thermal expansion and thermal contraction so that the guide bush 411b of the socket guide 41 may be inserted even under temperature stress. It is. Each guide hole 20b is formed in elliptical shape so that the longitudinal direction of the insert 16 may become long axis, as shown in FIG. When the guide hole 20b is made into such a shape, even if the dimensional change has occurred in the insert 16 due to thermal expansion or heat shrinkage, the guide bush 411b of the socket guide 41 and the guide hole 20b, The guide pin 35b of the pusher 30 shown in FIG. 6 can be inserted, and the insert 16 and the guide hole 20b are used with the reference hole 20a as a reference. The pusher 30 and the socket 40 can be fitted.

And the attachment hole 21 used when attaching the insert 16 to the test tray TST is formed in the position adjacent to each guide hole 20b.

As described above, when two IC storage portions 19 are formed in one insert 16, a plurality of IC storage portions 19 can share a space for providing positioning means such as the reference hole 20a. Therefore, the number of storing of the IC device 2 per unit area in the test tray TST increases. For example, the test tray shown in (a) of FIG. 7 is a test tray in which the insert 16 of this embodiment which has two IC accommodating parts 19 is mounted, and the test shown in (b) of FIG. The tray is a test tray on which a conventional insert 16 having only one IC housing portion is mounted. The number of inserts that can be mounted on any test tray is the same as 64 (= 4 rows x 16 columns), but the number of IC devices that can be transported is equipped with inserts having two IC storage units 19. The former test tray is doubled to 128. On the other hand, when the occupied area of each insert is compared, the length dimension is 114 mm larger on the former test tray side (just 1.39 times the conventional ratio), but the width dimension is almost the same. Therefore, according to the test tray TST of this embodiment, the IC device 2 can be mounted at a high density. Thus, as a result of the increase in the number of storing of the IC device 2 per unit area in the test tray TST, the throughput is improved and the test efficiency is improved.

As shown in FIG. 5, a socket board 50 is disposed on the test head 5, and a plurality of sockets 40 are fixed adjacent to each other on the test head 5. Each socket 40 has a probe pin 44 as a connection terminal. The probe pin 44 is elastically supported upwards by the spring which is not shown in figure. The number and pitch of the probe pins 44 correspond to the number and pitch of connection terminals of the IC device 2 to be tested.

In addition, the socket guide 41 is fixed on the socket board 50. The socket guide 41 has a reference bush 411a inserted into the reference hole 20a of the insert 16 in the center thereof. And the window hole 410 which exposes the probe pin 44 of the socket 40 to the upper side is formed in the both sides of the reference bush 411a one by one. That is, the socket guide 41 has a number of window holes 410 corresponding to the number of IC accommodating portions 19 in one insert 16, and the two window holes 410 are reference bushes 411a. It is arrange | positioned in the position which interposes. Also, the position of the reference bush 411a is more precisely the intermediate position of the two window holes 410.

Guide bushes 411b inserted into the guide holes 20b of the insert 16 are respectively provided at the centers of both ends of the socket guide 41, and the pushers described later are located at positions adjacent to the guide bushes 411b. Four stopper portions 412 defining the downward movement limit of 30 are formed in total, two each.

Here, the reference hole 20a of the insert 16 is formed so that there is no rattling between the fitting holes and the reference bush 411a of the socket guide 41. On the other hand, the two elliptical guide holes 20b of the insert 16 are fitted with the guide bush 411b of the socket guide 41 in the longitudinal direction of the insert 16 with the guide bush 411b. The gap between the guide bushes 411b is formed so that the gap between the guide bushes 411b does not occur in the width direction of the insert 16.

Above the test head 5, the pusher 30 which presses the IC device 2 which is a test object with the socket 40 is provided. As shown in FIG. 6, the pusher 30 is provided with the plate-shaped pusher base 31 and the upper block 32 provided on the pusher base 31, In the center part of the lower surface of the pusher base 31, A reference pin 35a extending downward is provided. This reference pin 35a is inserted into the reference hole 20a of the insert 16. And one presser 33 is provided in the both sides of the reference pin 35a one by one. Thus, the pusher 30 has a number of pressers 33 corresponding to the number of IC accommodating portions 19 in one insert 16, and the two pressers 33 have reference pins 35a. It is arrange | positioned at the position which interposes. The position of the reference pin 35a is more precisely the intermediate position of the two pushers 33.

In addition, guide pins 35b extending downward are respectively provided at the centers of both ends of the lower surface of the pusher base 31. This guide pin 35b is inserted into the guide hole 20b of the insert 16, and the stopper pin which defines the limit position of the downward movement of the pusher 30 is located in the position adjacent to each guide pin 35b. 36) are formed in total of two each.

This pusher 30 is held in the match plate 60 by engaging the upper periphery of the upper block 32 with the opening periphery of the match plate 60, as shown in FIG. This match plate 60 is supported by the drive plate 72 so that the test tray TST can be inserted between the pusher 30 and the socket 40 so that it may be located in the upper part of the test head 5. The pusher 30 held in such a match plate 60 is movable in the test head 5 direction and the drive plate 72 direction, that is, in the Z-axis direction.

And the press part 74 is being fixed to the lower surface of the drive plate 72 so that the upper surface of the upper block 32 of the pusher 30 may be pressed. The drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78, so that the drive shaft 78 can be moved up and down along the Z-axis direction. have.

In addition, in the chamber 100, the test tray TST is conveyed between the pusher 30 and the socket 40 from the paper perpendicular direction (X axis) in FIG. As a conveying means of the test tray TST in the chamber 100, a conveying roller etc. are used. At the time of conveyance movement of the test tray TST, the drive plate of the Z-axis drive device 70 rises along the Z-axis direction, and a sufficient gap is formed between the pusher 30 and the socket 40 to insert the test tray TST. have.

In addition, in the present embodiment, in the chamber 100 configured as described above, as illustrated in FIG. 3, a blower 90 for controlling temperature is provided inside the sealed casing 80 constituting the test chamber 102. It is installed. The temperature control blower 90 has a fan 92 and a heat exchanger 94. The fan 92 sucks air inside the casing and passes the heat exchanger 94 through the heat exchanger 94. The inside of the casing 80 is made into predetermined temperature conditions (high temperature or low temperature) by throwing out and circulating inside.

Fourth, a part related to the unloader unit 400 will be described.

In the unloader part 400 shown in FIG. 2, the XY conveyance apparatus 404,404 of the same structure as the XY conveyance apparatus 304 provided in the loader part 300 is provided, and this XY conveyance apparatus 404,404 By this, the IC device of the test can be transferred to the customer tray from the test tray TST transferred to the unloader unit 400.

In the device substrate 105 of the unloader portion 400, a pair of window portions 406, 406 arranged so that the customer tray carried in the unloader portion 400 face the upper surface of the device substrate 105 are two. Stand open.

An elevator 204 is provided below each window 406 to lift and lower the customer tray. Here, the IC device of the test object is moved and loaded, and the customer tray is loaded and lowered. The cold tray is transferred to the tray transfer arm 205.

Next, in the IC device test apparatus 10 described above, a method of testing the IC device 2 will be described.

The IC device 2 is heated to a predetermined set temperature in the thermostat 101 in a state mounted on the test tray TST, that is, stored in the IC storage unit 19 of the insert 16 shown in FIG. 5. After that, it is conveyed into the test chamber 102 shown in FIG.

When the test tray TST carried in the test chamber 102 stops on the test head 5, the Z-axis driving device 70 is driven, and the pressing unit 74 fixed to the driving plate 72 is pusher 30. Move down. Then, the reference pin 35a of the pusher 30 is inserted into the reference hole 20a of the insert 16 and the reference bush 411a of the socket guide 41, and the two guide pins 35b of the pusher 30 are inserted. ) Is inserted into the guide hole 20b of the corresponding insert 16 and the guide bush 411b of the socket guide 41. At the same time, the reference bush 411a of the socket guide 41 is inserted into the reference hole 20a of the insert 16 and the guide bush 411b of the socket guide 41 is inserted into the guide hole 20b of the insert 16. ) Is inserted. Since the socket guide 41 is positioned relative to the socket 40, the pusher 30, the insert 16 and the socket 40 are mutually positioned as a result of the operation described herein.

And the presser 33 of the pusher 30 presses the package main body of the IC device 2 toward the socket 40 side, and as a result, the external terminal of the IC device 2 becomes the probe pin of the socket 40. It is connected to 44.

Here, since the IC device 2 accommodated in the insert 16 is heated (cooled) in the chamber part 100, the insert 16 changes size by thermal expansion (heat shrinkage). However, like the insert 16 of this embodiment, since all of the two IC accommodating portions 19 are formed at positions adjacent to the reference hole 20a, even if a dimensional change occurs, the IC accommodating portion 19 Position shift is suppressed to a minimum. As a result, since the positional relationship which can connect the connection terminal of the IC device 2 and the probe pin 44 of the socket 40 is ensured, even if the number of IC accommodating parts 19 is increased, it originates in a position shift. Contact misses do not easily occur. On the other hand, as shown in Fig. 12B, the situation is different in the insert in which two electronic component storage portions A are formed side by side in the center of the insert. In this insert, the electronic component accommodating part A of the position (distance x) near the reference hole B and the electronic component accommodating part A of the position (distance y) far from the reference hole B exist. In this case, in the electronic component accommodating part A which is separated from the reference hole B, larger position shift occurs due to thermal expansion or thermal contraction, so that contact miss due to position shift tends to occur.

In addition, since the long-axis direction of the two elliptical guide holes 20b of the insert 16 is formed so that a space may exist between the guide bush 411b of the socket guide 41, the thermal expansion of both ends is performed. Even if a difference occurs, the guide hole 20b and the guide bush 411b can fit. On the other hand, since the short axis direction of the elliptical guide hole 20b is formed in the hole width so that rattling does not generate | occur | produce between the guide bush 411b, the insert 16 has two guide holes 20b. It latches by and can eliminate the position shift of the rotation direction centering on the reference hole 20a of the insert 16. As shown in FIG. As a result, contact miss accompanying the position shift of the external terminal of the IC device 2 and the rotation direction of the corresponding probe pin 44 is reduced.

In addition, since the insert 16 is mounted in a floating state with respect to the test tray TST, the insert 16 is made to be able to flow minutely. As a result, the plurality of inserts 16 present on the test tray TST are forcibly fitted to the reference bushes 411a of the corresponding socket guides 41, respectively, to maintain positioning. Therefore, the two IC accommodating portions 19 disposed adjacent to the reference bush 411a are also in a state of being properly positioned in the corresponding sockets 40, respectively. According to this, even if the whole dimension of the group of socket boards 50 which generate | occur | produces with the change of the setting temperature (for example, -30 degreeC-+120 degreeC) of the test chamber 102 changes, the insert 16 and a socket guide are changed. 41 is mutually fitted, and each IC device 2 accommodated in two IC accommodating parts 19 can contact the probe pin 44 of the corresponding socket 40 correctly.

In this state, a test electrical signal is supplied from the test main device 6 to the IC device 2 under test via the probe pin 44 of the test head 5. The response signal output from the IC device 2 is sent to the test main apparatus 6 via the test head 5, whereby the acceptance determination of the IC device 2 is performed.

When the test of the IC device 2 is finished, the Z-axis driving device 70 is driven to raise the match plate 60 (pusher 30). And the X-Y conveyance apparatus 404 conveys the test IC device 2 mounted in the test tray TST, and stores it in a customer tray according to a test result.

Second Embodiment

Next, an insert according to a second embodiment of the present invention will be described.

10 is a perspective view of the insert, the pusher, the socket and the socket guide according to the second embodiment of the present invention, and FIG. 11 is a perspective view of the insert according to the second embodiment.

As shown in FIGS. 10 and 11, the insert 516 according to the present embodiment is capable of flowing four insert cores 518 (corresponding to the core portion of the present invention) and the four insert cores 518. And a tray insert 517 (corresponding to the holding portion of the present invention) to hold it.

As shown in FIG. 10, each insert core 518 has one IC housing 519 and holds the IC device stored in the IC housing 519 by a latch member 531 that can swing. Or a latch mechanism for releasing. In the bottom plate part of each IC accommodating part 519, two individual positioning holes 551 which are fitted to two individual positioning pins 550 provided in the socket 540 described later are formed. The insert core 518 of the present embodiment has a shape corresponding to an SOP type IC device, but is not limited thereto.

In addition, two shafts 532 penetrate to each insert core 518 so as to be slidable, and those shafts 532 are attached to the tray insert 517 with a free space. By such a structure, each insert core 518 is latched by the tray insert 517 so that a small flow is possible. However, the flow mechanism of the insert core 518 is not limited to the said structure.

Circular guide holes 520 are formed in the central portions of both ends of the tray insert 517. This tray insert 517 is movably attached to the test tray TST shown in FIG. 4 in the same manner as the insert 16 in the above embodiment.

On the socket board of the test head, a plurality of sockets 540 are fixed to be adjacent to each other. As shown in FIG. 10, each socket 540 has a connection terminal 441 corresponding to an external terminal of the IC device, and is inserted into an individual positioning hole 551 formed in the insert core 518. Two individual positioning pins 550 are provided.

The socket guide 541 is fixed around the socket 540. The socket guide 541 in this embodiment is provided with two window holes opened, and two sockets 540 are exposed from each window hole. And the guide bush 542 inserted in the guide hole 520 of the said tray insert 517 is provided in the center part of the both ends of the socket guide 541 in the longitudinal direction.

The pusher base 600 of the pusher for pressing the IC device under test to the socket 540 includes four pushers 633 at positions corresponding to the four sockets 540. The pressurizer 633 may be attached to the pusher base 600 in a floating state, respectively, so as to be able to flow individually as needed. Thereby, even if thermal expansion and thermal contraction generate | occur | produce, it becomes possible to reliably pressurize an IC device under test. In addition, guide pins 635 inserted into the guide holes 520 of the tray insert 517 are provided at the centers of both ends of the lower surface of the pusher base 600.

In the test, the guide bush 511 of the socket guide 541 is inserted into the guide hole 520 of the tray insert 517, and the guide pin 635 provided in the pusher base 600 is connected to the socket guide 541. It is inserted in the guide bush 511, and each member will be in the fitted state. At this time, the pusher is roughly positioned by inserting the guide pin 635 into the guide bush 511 of the socket guide 541.

Here, the guide hole 520 of the tray insert 517 is such that there is a slight gap between the guide bush 511 of the socket guide 541 in consideration of thermal expansion accompanying the temperature change of each member. Formed. Therefore, at the time of the fitting, the tray insert 517 and the socket guide 541 are in a roughly positioned state.

On the other hand, the four insert cores 518 and the four sockets 540 facing them are formed of the individual positioning holes 551 of the insert cores 518 and the individual positioning pins 550 of the sockets 540. As a result of the insertion, the insert core 518 is slightly moved and positioned with respect to the socket 540, so that the external terminal of each IC device and the connection terminal 441 of the socket 540 can be reliably contacted. Therefore, even if thermal expansion occurs in each member in accordance with the temperature change, good contact can be realized.

The embodiments described above are described for ease of understanding of the present invention and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the insert 16 according to the first embodiment, the number of the IC accommodating portions 19 on one side between the reference holes 20a is not necessarily one, and it is not necessarily one of Figs. As shown to Fig.8 (b), two may be sufficient. In this case, the IC device can be mounted on the test tray with higher density. In the case of an IC device having a large allowable amount of misalignment, the number of IC accommodating portions 19 on one side between the reference holes 20a may be three, as shown in Fig. 8C. . In addition, as shown in FIG. 8D, another IC storage unit 190 may be formed at a position adjacent to the reference hole 20a of the insert 16. In this case, the IC device can be mounted on the test tray with higher density.

The idea of such a modification regarding the formation pattern of the IC housing of the insert can be applied to the case of forming a window hole in the socket guide or to installing a presser in the pusher. In other words, the number of window holes on one side between the socket guides in the socket guide may be two or three, and another window hole may be formed at a position adjacent to the reference bush of the socket guide. The number of pressurizers on one side of the pusher between the reference pins may be two or three, or another presser may be provided at a position adjacent to the reference pin of the pusher.

In addition, in positioning of the insert 16 and the socket guide 41, the guide hole 20b of the insert 16 and the guide bush 411 of the socket guide 41 may be one, respectively. Also, the positioning of the insert 16 and the socket guide 41 is practically possible. In this case, one guide hole 20b of the insert 16 and one guide bush 411b of the socket guide 41 can be omitted, resulting in further miniaturization, resulting in higher density. The IC device 2 can be mounted in a test tray, and this can be realized at a lower cost.

In addition, although the shape of the reference hole 20a of the insert 16 was circular in the 1st Example (refer FIG. 5), about the width direction of the insert 16, the socket guide 41 is carried out by the guide hole 20b. Since it is latched by the guide bush 411b of (), it is sufficient for the reference hole 20a of the insert 16 to position the longitudinal direction of the insert 16 at least. Therefore, the reference hole 20a of the insert 16 becomes the hole width which the ratchet does not generate | occur | produce between the reference bush 411a about the longitudinal direction of the insert 16 as needed, and the insert 16 The width direction may be an elliptical long hole so that a gap exists between the reference bush 411a. In this case, the insert 16 can be fitted more easily.

In addition, the insert 16 and the socket guide 41 may be fitted in the structure as shown in FIG. In the example shown in FIG. 9, the socket guide 41 has concave guide concave grooves having an inverted triangular shape which is an inverted triangle shape at both end portions on the center line passing through the centers of the two guide bushes 411b in plan view. 418a, 418b). The insert 16 is provided with convex guide convex portions 28a and 28b having an inverted triangle shape at positions corresponding to the guide concave grooves 418a and 418b of the socket guide 41.

According to the above structure, the insert 16 and the socket guide 41 are guide convex portions 28a and 28b of the insert 16 and the guide concave grooves 418a and 418b of the socket guide 41 at the time of their fitting. These combine and are guided by both. As a result, even if there is a difference in thermal expansion coefficient between the insert 16 and the socket guide 41, the positioning of both is hardly affected, and the positional shift in the rotational direction around the reference hole 20a of the insert is eliminated. can do. As a result, contact misses due to positional deviation in the rotational direction of the probe pin 44 corresponding to the external terminal of the IC device 2 can be reduced.

In this case, the guide hole 20b of the insert 16 is not elliptical and can be made into a circular shape with a diameter slightly larger than the diameter of the guide bush 411b of the socket guide 41.

Incidentally, the insert 516 according to the second embodiment includes four insert cores 518, but is not limited thereto. For example, at least two inserts 516 are provided. What is necessary is just to provide the insert core 518, and the objective of this invention can be achieved by it.

In the insert core 518 of the insert 516 according to the second embodiment, although the individual positioning holes 551 are formed in the bottom plate of the IC housing 519, the present invention is not limited thereto. For example, a concave hole may be formed in the bottom face of the corner of each insert core 518. In this case, it can also support IC devices, such as a BGA type. In this case, the individual positioning pins 550 are provided in the socket guide 541.

The insert for an electronic component handling apparatus, the pusher, the socket guide for the test head, and the electronic component handling apparatus using the insert are useful for improving throughput or miniaturizing the apparatus, while suppressing contact miss occurrence. Do.

1 is an overall side view of an IC device testing apparatus including a handler according to a first embodiment of the present invention.

2 is a perspective view of a handler according to the first embodiment;

3 is an essential part cross sectional view of the handler of the handler according to the first embodiment;

4 is an exploded perspective view showing a test tray used in the handler according to the first embodiment;

5 is an exploded perspective view showing the structure near the socket in the handler according to the first embodiment;

6 is a partial sectional view of the pusher in the handler according to the first embodiment;

7 is a plan view of a test tray and a conventional test tray according to the first embodiment;

8 is a plan view schematically illustrating a configuration of an insert according to another embodiment.

9 is a view showing the insert and the socket guide according to another embodiment, Figure 9 (a) is a side view of the insert and socket guide, Figure 9 (b) is a bottom view of the insert and a plan view of the socket guide.

10 is a perspective view of an insert, a pusher, a socket and a socket guide according to the second embodiment of the present invention.

11 is a perspective view of an insert according to a second embodiment;

12 is a schematic diagram showing a cross-sectional structure of a conventional pusher.

<Description of the code>

1: handler (electronic component handling device)

10: IC device (electronic component) test apparatus

16: insert

19: IC (electronic component) housing

20a: reference hole

20b: guide hole

30: pusher

33: pressurizer

35a: reference pin

35b: guide pin

40: socket

41: socket guide

410: window hole

411a: reference bush

411b: Guide Bush

Claims (14)

delete delete delete delete delete An insert that stores an electronic component under test and is attached to a contact portion of a test head in the state, A plurality of core parts which have an electronic component accommodating part which accommodates an electronic component under test, Holding portion for holding each of the plurality of cores independently movable Inserts comprising a. The method of claim 6, Each said core part is provided with the individual positioning hole in the position which fits with the individual positioning pin provided in the contact part side of a test head. The method of claim 6, The holding portion is formed with a guide hole formed at a position to fit the guide bush of the socket guide fixed to the contact portion of the test head. The method of claim 6, The insert is formed with at least two attachment holes for attaching the insert to the test tray, the insert is characterized in that the fluidly attached to the attachment piece installed in the test tray in the attachment hole. delete A structure of a contact portion of a test head to which an insert is mounted having a plurality of core portions having an electronic component housing portion and a holding portion for holding each of the plurality of core portions independently in a flowable manner, The said contact part is provided with the individual positioning pin which can be fitted with the individual positioning hole formed in each said core part of the insert, and the guide bush which can be fitted with the guide hole formed in the said holding part of the insert. The structure of a contact part characterized by the above-mentioned. delete An electronic component handling device which stores a plurality of electronic components under test in an insert, conveys them to a contact portion of a test head, and electrically connects them to perform a test. An electronic component handling device comprising the insert of claim 6. The method of claim 13, A test chamber for maintaining a state in which the plurality of inserts containing the electronic component under test are heated or cooled to a predetermined temperature; A plurality of pushers for pressing the electronic component under test stored in the insert to a contact portion of a test head; A driving device for holding and driving the plurality of pushers so that the plurality of pushers can collectively pressurize the electronic component under test contained in the plurality of inserts. Electronic component handling device comprising a.

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