JP2012047754A - Insert for electronic component handling apparatus and electronic component handling apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insert for an electronic component handling apparatus which can improve throughput or can downsize the apparatus by increasing the number of simultaneous measurement of electronic components to be tested per unit area, and further can suppress occurrence of a contact error caused by position deviation of the electronic components to be tested.SOLUTION: An insert 516 includes a plurality of core parts 518 each having an electronic component accommodation portion 519 for accommodating an electronic component to be tested, and a holding part 517 for independently holding respective ones of the plurality of core parts 518 in a freely movable manner.

Description

  The present invention relates to an insert and a pusher used in an electronic component handling apparatus, a socket guide used in a test head, and an electronic component handling apparatus.

  In the manufacturing process of electronic parts such as IC devices, a test apparatus for testing electronic parts finally manufactured is necessary. In the test apparatus, a test tray for storing an IC device is prepared, and an IC device mounting tool called an insert is attached to the test tray. As shown in FIG. 13A, the conventional insert includes an electronic component storage portion A for storing an IC device at the center thereof, and a positioning reference formed at one end portion. It has a hole B and a guide hole C for positioning formed at the other end. In the test tray, for example, 32 inserts are mounted, and an IC device can be stored in each insert.

  In the test apparatus, an IC device is accommodated in an insert attached to the test tray, and the test tray is conveyed above the test head by an electronic component handling apparatus called a handler. Thereafter, the insert mounted on the test tray is positioned on the socket guide on the test head, and in this state, each IC device housed in the insert is pressed against the socket on the test head with a pusher. Then, the connection terminal of the IC device and the connection terminal of the socket are brought into a state of electrical contact, and the test is performed by the test main device (tester). When the test is completed, each IC device is unloaded from the test head by the electronic component handling apparatus, is transferred to a tray according to the test result, and is classified into each category such as a non-defective product and a defective product.

  By the way, in recent years, by increasing the number of inserts mounted on one test tray to 32, 64, or even 128, it becomes possible to test more IC devices under test simultaneously, thereby improving the throughput. Things have been done. However, when the number of inserts attached to one test tray is increased, the size of the test tray and the electronic component handling apparatus is increased. When the apparatus becomes large, it may be difficult to handle the apparatus or it may be difficult to secure an installation space, which may limit the installation location.

  In addition, by using an insert having a plurality of IC device storage portions, the number of IC devices carried in per unit area in the test tray is increased, thereby increasing the number of IC devices to be tested that can be simultaneously tested, thereby improving the throughput. Can be considered. Specifically, as shown in FIG. 13B, the number of electronic component storage portions A at the center of the insert is two. However, in this case, the size of each insert inevitably becomes large. In the test of IC devices, there is a test that is performed in a state where thermal stress (heating or cooling) is applied to the IC device. In this test, the larger the insert, the larger the size due to thermal expansion and contraction. Change occurs. When a large dimensional change occurs, the IC device housed in the insert is likely to be displaced with respect to the socket, and a contact error due to the displacement is likely to occur.

  The present invention has been made in view of such a situation, and the increase in the number of simultaneous measurement of electronic devices under test per unit area can improve the throughput or downsize the apparatus. It is an object of the present invention to provide an insert for an electronic component handling apparatus that can suppress the occurrence of a contact error due to the positional deviation of the electronic component, and to provide an electronic component handling apparatus using the insert.

In order to achieve the above object, firstly, the present invention is an insert for a handler which accommodates an electronic device under test and is attached to a contact portion of the test head in that state, and an electronic device which houses the electronic device under test. Provided is an insert comprising a plurality of core portions each having a component storage portion and a holding portion that holds each of the plurality of core portions so as to be independently movable (invention 1 ).

According to the above invention (Invention 1 ), a plurality of electronic component storage portions can be formed close to each other, and the number of simultaneously measured electronic components per unit area can be increased, thereby improving throughput. Alternatively, the size of the device can be reduced. Moreover, according to the said invention (invention 1 ), since each core part is hold | maintained freely at a holding | maintenance part, even if an insert thermally expands and shrinks, the position is being moved, moving each core part minutely. By appropriately defining the above, it is possible to minimize the displacement of the electronic component storage unit.

In the said invention (invention 1 ), it is preferable that the said core part is provided with the individual positioning fitting part in the position fitted with the individual positioning fitting part provided in the contact part side of the test head. (Invention 2 ). According to this invention (invention 2 ), since each core part can be reliably positioned in the contact part of a test head, generation | occurrence | production of the contact mistake resulting from the position shift of an electronic component to be tested can be suppressed.

In the above inventions (Inventions 1 and 2 ), it is preferable that the guide fitting portion is formed at a position where the socket guide fixed to the contact portion of the test head or the guide fitting portion of the socket is fitted (Invention 3). ). According to this invention (Invention 3 ), since the holding portion and, in turn, each core portion can be reliably positioned on the contact portion of the test head, the occurrence of a contact error due to the displacement of the electronic device under test is suppressed. be able to.

In the said invention (invention 1-3 ), each said core part may be a structure which does not interfere with the said electronic component guide part of the socket guide which has the electronic component guide part which positions an electronic component, or a socket (invention 4). ). By providing an electronic component guide portion on the socket guide or socket, even if thermal expansion or thermal contraction occurs in the insert, the electronic component can be guided by the electronic component guide portion and reliably contact the socket terminal. According to the above invention (Invention 4 ), such a configuration can be made possible.

In the said invention (invention 1-4 ), it is preferable that the said insert is attached to a test tray movably (invention 5 ). According to this invention (Invention 5 ), the insert attached to the test tray can be forcedly fitted to the socket guide and held in position even if the position is slightly shifted in the initial stage.

A second aspect of the present invention is an electronic component handling apparatus for storing a plurality of electronic components to be tested in an insert, transporting them to a contact portion of a test head, and electrically connecting them to perform testing . 5 ) is provided (Invention 6 ).

In the above invention (invention 6 ), a test chamber for maintaining a state in which the plurality of inserts containing the electronic devices under test are heated or cooled to a predetermined temperature, and the electronic devices under test contained in the inserts are connected to the test head. A plurality of pushers that press against the contact portions, and a drive device that holds and drives the plurality of pushers so that the plurality of pushers can collectively press the electronic devices under test housed in the plurality of inserts. (Invention 7 ).

  According to the electronic component handling apparatus insert, the pusher, the socket guide for the test head, and the electronic component handling apparatus using the insert according to the present invention, the number of simultaneously measured electronic components per unit area is increased and the throughput is increased. Or miniaturization of the apparatus can be achieved, and the occurrence of contact mistakes due to the displacement of the electronic device under test can be suppressed.

1 is an overall side view of an IC device test apparatus including a handler according to an embodiment of the present invention. It is a perspective view of the handler concerning the embodiment. It is principal part sectional drawing in the test chamber of the handler concerning the embodiment. It is a disassembled perspective view which shows the test tray used with the handler which concerns on the same embodiment. It is a disassembled perspective view which shows the structure of the socket vicinity in the handler which concerns on the embodiment. It is a fragmentary sectional view of the pusher in the handler concerning the embodiment. It is a top view of the test tray which concerns on the embodiment, and the conventional test tray. It is a top view which shows typically the structure of the insert which concerns on other embodiment. It is a figure which shows the insert and socket guide which concern on another embodiment, (a) is a side view of an insert and a socket guide, (b) is a bottom view of an insert, and a top view of a socket guide. It is a perspective view of the insert, pusher, socket, and socket guide which concern on the 2nd Embodiment of this invention. It is a perspective view of the insert concerning the embodiment. It is a perspective view which shows the insert and socket which concern on another embodiment. It is a schematic diagram which shows the cross-sectional structure of the conventional pusher.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
1 is an overall side view of an IC device testing apparatus including an electronic component handling apparatus (hereinafter referred to as “handler”) according to an embodiment of the present invention, FIG. 2 is a perspective view of the handler according to the embodiment, and FIG. FIG. 4 is an exploded perspective view showing a test tray used in the handler, and FIG. 5 is an exploded perspective view showing a structure in the vicinity of the socket in the handler according to the embodiment. 6 and 6 are partial sectional views of the pusher in the handler according to the embodiment.

  First, an overall configuration of an IC device test apparatus including a handler according to an embodiment of the present invention will be described.

  As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main apparatus 6. The handler 1 performs an operation of sequentially transporting IC devices (an example of electronic components) to be tested to a socket provided in the test head 5, classifying the IC devices that have been tested according to the test results, and storing them in a predetermined tray. Execute.

  The socket provided in the test head 5 is electrically connected to the test main device 6 through the cable 7, and the IC device detachably attached to the socket is connected to the test main device 6 through the cable 7. The IC device is tested by the electrical test signal from the main apparatus 6 for testing.

  A control device that mainly controls the handler 1 is built in the lower portion of the handler 1, but a space portion 8 is provided in part. The test head 5 is replaceably disposed in the space portion 8, and an IC device can be attached to a socket on the test head 5 through a through hole formed in the handler 1.

  The handler 1 is an apparatus for testing an IC device, which is an electronic component to be tested, in a temperature state higher than normal temperature (high temperature) or a lower temperature state (low temperature). And the handler 1 has the chamber 100 comprised by the thermostat 101, the test chamber 102, and the heat removal tank 103, as shown in FIG. The upper portion of the test head 5 shown in FIG. 1 is inserted into the test chamber 102 as shown in FIG. 3, where the IC device 2 is tested.

  As shown in FIG. 2, the handler 1 of this embodiment stores an IC device to be tested from now on, an IC storage unit 200 that classifies and stores tested IC devices, and is sent from the IC storage unit 200. A loader unit 300 for feeding an IC device under test into the chamber unit 100, a chamber unit 100 including a test head, and an unloader unit 400 for taking out and classifying tested ICs that have been tested in the chamber unit 100. Yes.

  A number of IC devices before being set in the handler 1 are stored in a customer tray (not shown), and are supplied to the IC storage unit 200 of the handler 1 shown in FIG. Here, the IC device is transferred from the customer tray to a later-described test tray TST (see FIG. 4) used for conveyance in the handler 1. Inside the handler 1, as shown in FIG. 3, the IC device moves in a state of being placed on the test tray TST, and is subjected to a test (inspection) as to whether or not the device operates properly by being applied with a high or low temperature stress. And classified according to the test results.

Hereinafter, the inside of the handler 1 will be described in detail individually.
First, parts related to the IC storage unit 200 will be described.
As shown in FIG. 2, the IC storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices and a tested IC stocker 202 that stores IC devices classified according to the test results. It is provided.

  The pre-test IC stocker 201 and the tested IC stocker 202 include a frame-shaped tray support frame 203 and an elevator 204 that enters from the bottom of the tray support frame 203 and can be moved up and down. Yes. A plurality of customer trays are stacked and supported on the tray support frame 203, and only the stacked customer trays are moved up and down by the elevator 204.

  In the pre-test IC stocker 201 shown in FIG. 2, customer trays containing IC devices to be tested are stacked and held. The tested IC stocker 202 has a stack of customer trays in which IC devices classified after finishing the test are stored.

Secondly, parts related to the loader unit 300 will be described.
As shown in FIG. 2, the customer tray stored in the pre-test IC stocker 201 is loaded from the lower side of the device substrate 105 by a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. It is carried to the window part 306 of the part 300. In this loader unit 300, the IC devices to be tested loaded on the customer tray are once transferred to the precursor 305 by the XY transport device 304, where the mutual positions of the IC devices to be tested are corrected. Thereafter, the IC device under test further transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transport device 304 again.

  As shown in FIG. 2, the XY transport device 304 that reloads IC devices under test from the customer tray to the test tray TST includes two rails 301 installed on the upper portion of the device substrate 105 and the two rails. The movable arm 302 that can reciprocate between the test tray TST and the customer tray (this direction is defined as the Y direction) by the rail 301, and is supported by the movable arm 302 in the X direction along the movable arm 302. And a movable head 303 that can move.

  A suction head is mounted on the movable head 303 of the XY transport device 304 so that the IC device under test is sucked from the customer tray by the suction head, and the IC device under test is attached to the test tray TST. Transship to

Thirdly, parts related to the chamber 100 will be described.
An IC device under test is loaded on the test tray TST described above by the loader unit 300. Thereafter, the test tray TST is fed into the chamber 100, where each IC device under test mounted on the test tray TST is tested.

  As shown in FIG. 2, the chamber 100 is provided with a thermostatic chamber 101 that applies a desired high or low temperature thermal stress to the IC device under test loaded on the test tray TST, and the thermostatic chamber 101 is subjected to the thermal stress. A test chamber 102 in which an IC device under test is mounted in a socket on a test head, and a heat removal tank 103 that removes applied thermal stress from the IC device under test in the test chamber 102 Has been.

  In the heat removal tank 103, when a high temperature is applied in the thermostatic chamber 101, the IC device under test is cooled by blowing to return to room temperature, and when a low temperature is applied in the thermostatic chamber 101, the IC device under test is heated with warm air. Or, it is heated with a heater or the like and returned to a temperature at which no condensation occurs. Then, the IC device to be tested after the heat removal is carried out to the unloader unit 400.

  As shown in FIG. 3, a test head 5 is disposed below the test chamber 102. The test tray TST in which the IC device 2 is stored is carried on the test head 5. In the test head 5, all the IC devices 2 accommodated in the test tray TST are sequentially brought into electrical contact with the test head 5, and the test is performed on all the IC devices 2 in the test tray TST. When the test is completed, the test tray TST is removed from heat by the heat removal tank 103, and after the temperature of the IC device 2 is returned to room temperature, it is discharged to the unloader unit 400 shown in FIG.

  Further, as shown in FIG. 2, an inlet opening for feeding the test tray TST from the apparatus substrate 105 to the upper part of the constant temperature bath 101 and the heat removal tank 103, and for sending the test tray TST to the apparatus substrate 105. Each of the outlet openings is formed. On the apparatus substrate 105, a test tray transfer device 108 for taking in and out the test tray TST from these openings is mounted. These conveying devices 108 are constituted by rotating rollers, for example. The test tray TST discharged from the heat removal tank 103 is transferred to the unloader unit 400 by the test tray transfer device 108 provided on the apparatus substrate 105.

  As shown in FIG. 4, the test tray TST has a rectangular frame 12, and a plurality of bars 13 are provided in the frame 12 in parallel and at equal intervals. A plurality of attachment pieces 14 are formed on both sides of the crosspieces 13 and inside the side 12a of the frame 12 parallel to the crosspieces 13 so as to protrude at equal intervals in the longitudinal direction. Each insert storage portion 15 is constituted by two mounting pieces 14 facing each other among the plurality of mounting pieces 14 provided between the bars 13 and between the bars 13 and the side 12a.

  Each insert storage portion 15 is configured to store one insert 16. The insert 16 is attached to the two attachment pieces 14 in a floating state using fasteners 17 in the attachment holes 21. ing. In the present embodiment, 4 × 16 inserts 16 are attached to one test tray TST. By storing the IC device 2 under test in the insert 16, the IC device 2 under test can be loaded on the test tray TST.

  As shown in FIG. 5, the insert 16 is provided with a circular reference hole 20a in the center of which a reference bush 411a of a socket guide 41 described later is inserted. One IC storage portion 19 having a substantially rectangular shape in plan view is formed on each side of the reference hole 20a. That is, the two IC storage portions 19 are arranged at positions sandwiching the reference hole 20a. The position of the reference hole 20 a is more precisely the intermediate position between the two IC storage portions 19.

  In addition, a guide hole 20b composed of an oblong oblong hole is formed at the center of both ends of the insert 16 in consideration of thermal expansion and contraction so that the guide bush 411b of the socket guide 41 is inserted even under temperature stress. Has been. As shown in FIG. 5, each guide hole 20b is formed in an oval shape so that the longitudinal direction of the insert 16 has a long diameter. If the guide hole 20b has such a shape, even if a dimensional change occurs in the insert 16 due to thermal expansion or contraction, the guide bush 411b of the socket guide 41 or the pusher 30 shown in FIG. The guide pin 35b can be inserted, and the insert 16, the pusher 30 and the socket 40 can be fitted by the reference hole 20a and the guide hole 20b while using the reference hole 20a as a reference.

  And the attachment hole 21 used when attaching the insert 16 to the test tray TST is formed in the position adjacent to each guide hole 20b.

  As described above, when two IC storage portions 19 are formed in one insert 16, a space for providing positioning means such as the reference hole 20a can be shared by the plurality of IC storage portions 19, so that the unit area per unit area in the test tray TST can be shared. The number of stored IC devices 2 increases. For example, the test tray shown in FIG. 7A is a test tray to which the insert 16 of the present embodiment having two IC storage portions 19 is mounted, and the test tray shown in FIG. This is a test tray to which a conventional insert 16 having only one is mounted. In any test tray, the number of inserts that can be mounted is the same as 64 (= 4 rows × 16 columns), but the number of IC devices that can be transported is that of the former in which an insert having two IC storage portions 19 is mounted. The test tray is doubled to 128. On the other hand, when the occupied area of each insert is compared, the vertical dimension is 114 mm larger in the former test tray (1.39 times as compared with the conventional one), but the width dimension is almost equal. Therefore, according to the test tray TST of this embodiment, the IC devices 2 can be mounted with high density. Thus, as a result of the increase in the number of IC devices 2 stored per unit area in the test tray TST, throughput is improved and test efficiency is improved.

  As shown in FIG. 5, a socket board 50 is arranged on the test head 5, and a plurality of sockets 40 are fixed on the socket board 50 so as to be adjacent to each other. Each socket 40 has a probe pin 44 which is a connection terminal. The probe pin 44 is biased upward by a spring (not shown). The number and pitch of the probe pins 44 correspond to the number and pitch of the connection terminals of the IC device 2 to be tested.

  A socket guide 41 is fixed on the socket board 50. The socket guide 41 has a reference bush 411a inserted into the reference hole 20a of the insert 16 at the center thereof. One window hole 410 for exposing the probe pin 44 of the socket 40 to the upper side is formed on each side of the reference bush 411a. That is, the socket guide 41 has a number of window holes 410 corresponding to the number of the IC accommodating portions 19 in one insert 16, and the two window holes 410 are arranged at positions sandwiching the reference bush 411 a. Further, the position of the reference bush 411a is more precisely the intermediate position between the two window holes 410.

  Guide bushes 411b to be inserted into the guide holes 20b of the inserts 16 are respectively provided at the center portions of both ends of the socket guide 41, and the lower movement limit of the pusher 30 to be described later is located at a position adjacent to each guide bush 411b. There are four convenient four stopper portions 412.

  Here, the reference hole 20a of the insert 16 is formed so that there is no backlash between the two when fitting with the reference bush 411a of the socket guide 41. On the other hand, the two oval guide holes 20b of the insert 16 are inserted so that a gap exists between the guide bush 411b and the guide bush 411b in the longitudinal direction of the insert 16 when the socket bush 41 is fitted to the guide bush 411b. About 16 short directions, it forms with the hole width of the grade which is not rattled between guide bushes 411b.

  A pusher 30 that presses the IC device 2 to be tested against the socket 40 is provided above the test head 5. As shown in FIG. 6, the pusher 30 includes a plate-like pusher base 31 and an upper block 32 provided on the pusher base 31. The pusher base 31 extends downward at the center of the lower surface of the pusher base 31. A reference pin 35a is provided. The reference pin 35 a is inserted into the reference hole 20 a of the insert 16. One presser 33 is formed on each side of the reference pin 35a. As described above, the pusher 30 has the number of pressing elements 33 corresponding to the number of the IC accommodating portions 19 in one insert 16, and the two pressing elements 33 are arranged at positions sandwiching the reference pin 35 a. . More precisely, the position of the reference pin 35a is an intermediate position between the two pressing elements 33.

  In addition, guide pins 35b extending downward are provided at the center of both ends of the lower surface of the pusher base 31, respectively. This guide pin 35b is inserted into the guide hole 20b of the insert 16, and two stopper pins 36 that define the limit position of the downward movement of the pusher 30 are provided at two positions adjacent to each guide pin 35b. Four are formed for convenience.

  As shown in FIG. 3, the pusher 30 is held by the match plate 60 by engaging the upper peripheral edge of the upper block 32 with the open peripheral edge of the match plate 60. The match plate 60 is supported by the drive plate 72 so as to be positioned above the test head 5 and so that the test tray TST can be inserted between the pusher 30 and the socket 40. The pusher 30 held by the match plate 60 is movable in the test head 5 direction and the drive plate 72 direction, that is, the Z-axis direction.

  A pressing portion 74 is fixed to the lower surface of the drive plate 72 so that the upper surface of the upper block 32 of the pusher 30 can be pressed. A drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78, and the drive shaft 78 can be moved up and down along the Z-axis direction. It can be done.

  In the chamber 100, the test tray TST is transported between the pusher 30 and the socket 40 from the direction orthogonal to the plane of the paper (X axis) in FIG. As a means for transporting the test tray TST inside the chamber 100, a transport roller or the like is used. When transporting the test tray TST, the drive plate of the Z-axis drive device 70 is raised along the Z-axis direction, and the test tray TST is sufficiently inserted between the pusher 30 and the socket 40. A gap is formed.

  In the present embodiment, in the chamber 100 configured as described above, as shown in FIG. 3, a temperature adjusting blower 90 is mounted inside a sealed casing 80 that configures the test chamber 102. is there. The temperature adjusting blower 90 includes a fan 92 and a heat exchanging portion 94, sucks air inside the casing by the fan 92, discharges it into the casing 80 through the heat exchanging portion 94, and circulates the casing 80. The inside of is set to a predetermined temperature condition (high temperature or low temperature).

Fourthly, parts related to the unloader unit 400 will be described.
The unloader unit 400 shown in FIG. 2 is also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300. By the XY transport devices 404 and 404, The tested IC devices are transferred from the test tray TST carried out to the unloader unit 400 to the customer tray.

  The device substrate 105 of the unloader unit 400 has two pairs of windows 406 and 406 arranged so that the customer tray conveyed to the unloader unit 400 faces the upper surface of the device substrate 105.

  An elevator 204 for raising and lowering the customer tray is provided below each window 406. Here, the customer trays that have been filled with the tested IC devices to be tested are loaded and lowered. The full tray is transferred to the tray transfer arm 205.

  Next, a method for testing the IC device 2 in the IC device test apparatus 10 described above will be described.

  The IC device 2 is heated to a predetermined set temperature in the thermostatic chamber 101 in a state where it is mounted on the test tray TST, that is, in a state where it is dropped into the IC storage portion 19 of the insert 16 shown in FIG. It is transferred into the test chamber 102 shown in FIG.

  When the test tray TST carried into the test chamber 102 stops on the test head 5, the Z-axis driving device 70 is driven, and the pressing portion 74 fixed to the driving plate 72 moves the pusher 30 downward. Then, the reference pin 35a of the pusher 30 is inserted into the reference hole 20a of the insert 16 and the reference bush 411a of the socket guide 41, and the two guide pins 35b of the pusher 30 correspond to the guide hole 20b and socket guide 41 of the insert 16. The guide bush 411b is inserted. At the same time, the reference bush 411a of the socket guide 41 is inserted into the reference hole 20a of the insert 16, and the guide bush 411b of the socket guide 41 is inserted into the guide hole 20b of the insert 16. Since the socket guide 41 is positioned with respect to the socket 40, the pusher 30, the insert 16 and the socket 40 are positioned relative to each other as a result of the operation described here.

  The pusher 33 of the pusher 30 presses the package body of the IC device 2 toward the socket 40, and as a result, the external terminal of the IC device 2 is connected to the probe pin 44 of the socket 40.

  Here, since the IC device 2 accommodated in the insert 16 is heated (cooled) in the chamber unit 100, the insert 16 changes its dimensions due to thermal expansion (thermal contraction). However, in the case where both of the two IC storage portions 19 are formed adjacent to the reference hole 20a as in the insert 16 of this embodiment, even if a dimensional change occurs, the IC storage portion 19 The displacement of the position is suppressed to a minimum. As a result, a positional relationship that can connect the connection terminal of the IC device 2 and the probe pin 44 of the socket 40 is ensured, so that a contact error due to misalignment can be achieved despite the increase in the number of IC storage portions 19. It is not easy to occur. On the other hand, as shown in FIG. 13B, the situation is different in an insert in which two electronic component storage portions A are formed side by side at the center of the insert. In this insert, there is an electronic component storage portion A at a position (distance x) close to the reference hole B and an electronic component storage portion A at a position (distance y) away from the reference hole B. In this case, in the electronic component storage part A that is away from the reference hole B, a larger positional shift occurs due to thermal expansion or thermal contraction, and therefore a contact error due to the positional shift is likely to occur.

  Further, the longitudinal direction of the two oval guide holes 20b of the insert 16 is formed so that there is a gap between the guide bush 411b of the socket guide 41, and therefore there is a difference in thermal expansion between the two. However, the guide hole 20b and the guide bush 411b can be fitted. On the other hand, the shorter direction of the oval guide hole 20b is formed with a hole width that does not cause rattling with the guide bush 411b, so the insert 16 is locked by the two guide holes 20b. The positional deviation in the rotational direction around the reference hole 20a of the insert 16 can be eliminated. As a result, the contact mistake accompanying the positional deviation in the rotation direction between the external terminal of the IC device 2 and the corresponding probe pin 44 is reduced.

  Further, since the insert 16 is attached to the test tray TST in a floating state, the insert 16 can be slightly moved. As a result, the large number of inserts 16 existing on the test tray TST are forcibly fitted to the reference bushing 411a of the corresponding socket guide 41 and positioned and held. Therefore, the two IC storage portions 19 arranged adjacent to the reference bush 411a are also properly positioned in the corresponding sockets 40, respectively. According to this, the insert 16 and the socket guide 41 are fitted to each other even if the overall size of the socket board 50 group that occurs due to a change in the set temperature (for example, −30 ° C. to + 120 ° C.) of the test chamber 102 changes. The respective IC devices 2 housed in the two IC housing portions 19 can contact the probe pins 44 of the corresponding sockets 40 accurately.

  In the above state, a test electrical signal is supplied from the test main device 6 to the IC device 2 under test via the probe pin 44 of the test head 5. The response signal output from the IC device 2 is sent to the test main device 6 through the test head 5, whereby the quality of the IC device 2 is determined.

  When the test of the IC device 2 is completed, the Z-axis drive device 70 is driven to raise the match plate 60 (the pusher 30). Then, the XY transport device 404 transports the tested IC device 2 mounted on the test tray TST, and stores it in the customer tray according to the test result.

[Second Embodiment]
Next, an insert according to the second embodiment of the present invention will be described.
FIG. 10 is a perspective view of an insert, a pusher, a socket, and a socket guide according to the second embodiment of the present invention, and FIG. 11 is a perspective view of the insert according to the embodiment.

  As shown in FIGS. 10 and 11, the insert 516 according to this embodiment includes four insert cores 518 (corresponding to the core portion of the present invention) and a tray that holds the four insert cores 518 in a freely movable manner. And an insert 517 (corresponding to the holding portion of the present invention).

  As shown in FIG. 10, each insert core 518 includes one IC storage portion 519 and a latch mechanism that holds or releases an IC device stored in the IC storage portion 519 by a swingable latch member 531. In the bottom plate portion of each IC storage portion 519, two individual positioning holes 551 that can be fitted to two individual positioning pins 550 provided in a socket 540 described later are formed. The insert core 518 of the present embodiment has a shape corresponding to an SOP type IC device, but is not limited thereto.

  In addition, two shafts 532 are slidably penetrating each insert core 518, and these shafts 532 are attached to the tray insert 517 in a state of play. With this structure, each insert core 518 is locked to the tray insert 517 so as to be slightly movable. However, the floating mechanism of the insert core 518 is not limited to the above structure.

  Circular guide holes 520 are formed at the center of both ends of the tray insert 517. The tray insert 517 is movably attached to the test tray TST shown in FIG. 4 in the same manner as the insert 16 in the above embodiment.

  A plurality of sockets 540 are fixed so as to be adjacent to each other on the socket board of the test head. As shown in FIG. 10, each socket 540 has a connection terminal 441 corresponding to an external terminal of the IC device, and two individual positioning pins 550 inserted into the individual positioning holes 551 formed in the insert core 518. It is prepared one by one.

  A socket guide 541 is fixed around the socket 540. The socket guide 541 in the present embodiment includes two open window holes, and two sockets 540 are exposed from each window hole. Guide bushes 542 inserted into the guide holes 520 of the tray insert 517 are provided at the center of both ends of the socket guide 541 in the longitudinal direction.

  A pusher base 600 of a pusher for pressing the IC device under test against the socket 540 includes four pressing elements 633 at positions corresponding to the four sockets 540. If desired, the pressing elements 633 may be attached to the pusher base 600 in a floating state so as to be individually movable. Thereby, even if thermal expansion or thermal contraction occurs, it is possible to reliably press the IC device under test. Further, guide pins 635 to be inserted into the guide holes 520 of the tray insert 517 are provided at the center of both ends of the lower surface of the pusher base 600.

  During the test, the guide bush 542 of the socket guide 541 is inserted into the guide hole 520 of the tray insert 517, and the guide pin 635 provided on the pusher base 600 is inserted into the guide bush 542 of the socket guide 541, and the respective members are fitted. It will be in the state. At this time, the pusher is roughly positioned by inserting the guide pin 635 into the guide bush 542 of the socket guide 541.

  Here, the guide hole 520 of the tray insert 517 is formed in such a size that there is a slight gap between the guide bush 542 of the socket guide 541 in consideration of thermal expansion accompanying the temperature change of each member. Yes. Therefore, at the time of the fitting, the tray insert 517 and the socket guide 541 are in a state of being roughly positioned.

  On the other hand, the four insert cores 518 and the four sockets 540 opposed to the insert cores 518 are slightly moved by fitting the individual positioning holes 551 of the insert core 518 and the individual positioning pins 550 of the socket 540. As a result of positioning with respect to the socket 540, the external terminal of each IC device and the connection terminal 441 of the socket 540 can be reliably contacted. Therefore, even if thermal expansion occurs in each member as the temperature changes, good contact can be realized.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the insert 16 according to the first embodiment, the number of the IC storage portions 19 on one side sandwiching the reference hole 20a is not necessarily one, as shown in FIGS. 8 (a) and 8 (b). Two may be sufficient. In this case, the IC device can be mounted on the test tray with higher density. Further, in the case of an IC device having a large positional deviation tolerance, the number of the IC storage portions 19 on one side sandwiching the reference hole 20a may be three as shown in FIG. Furthermore, as shown in FIG. 8D, another IC storage portion 190 may be formed at a position adjacent to the reference hole 20 a of the insert 16. In this case, the IC device can be mounted on the test tray at a higher density.

  The concept of such a variation regarding the formation pattern of the IC housing portion of the insert can be applied also when a window hole is formed in the socket guide or when a pusher is provided on the pusher. That is, the number of window holes on one side sandwiching the reference bush in the socket guide may be two or three, and another window hole may be formed at a position adjacent to the reference bush of the socket guide. Good. The number of pressing members on one side of the pusher sandwiching the reference pin may be two or three, and another pressing member may be provided at a position adjacent to the reference pin of the pusher.

  Further, in positioning the insert 16 and the socket guide 41, the guide hole 20b of the insert 16 and the guide bush 411 of the socket guide 41 may each be one, and the insert 16 and the socket guide 41 can be positioned by such a structure. Practically possible. In this case, one guide hole 20b of the insert 16 and one guide bush 411b of the socket guide 41 can be omitted, and as a result of further miniaturization, the IC device 2 can be mounted on the test tray at a higher density. It can be realized at a lower cost.

  In the first embodiment, the shape of the reference hole 20a of the insert 16 is circular (see FIG. 5). However, the short direction of the insert 16 is determined by the guide bush 411b of the socket guide 41 in the guide hole 20b. In order to be locked, it is sufficient for the reference hole 20a of the insert 16 to position at least the position of the insert 16 in the longitudinal direction. Therefore, the reference hole 20a of the insert 16 has a hole width that does not rattle with the reference bush 411a in the longitudinal direction of the insert 16, if desired. It is good also as an oblong long hole in which a clearance gap exists between 411a. In this case, the insert 16 can be fitted and removed more easily.

  Further, the insert 16 and the socket guide 41 may be fitted with a structure as shown in FIG. In the example shown in FIG. 9, the socket guide 41 is formed with concave guide grooves 418a and 418b having inverted triangular shapes in side view at both end portions on the center line passing through the centers of the two guide bushes 411b in plan view. . The insert 16 is formed with inverted triangular convex projections 28a, 28b at positions corresponding to the guide concave grooves 418a, 418b of the socket guide 41.

  According to the above structure, when the insert 16 and the socket guide 41 are fitted to each other, the guide convex portions 28a and 28b of the insert 16 and the guide concave grooves 418a and 418b of the socket guide 41 are engaged with each other. While being fitted. As a result, even if there is a difference in thermal expansion coefficient between the insert 16 and the socket guide 41, the positioning of the two is hardly affected, and the displacement in the rotational direction around the reference hole 20a of the insert can be eliminated. . As a result, it is possible to reduce contact mistakes due to positional deviation in the rotational direction of the probe pins 44 corresponding to the external terminals of the IC device 2.

  In the above case, the guide hole 20b of the insert 16 is not oval, but can be a circle having a diameter slightly larger than the diameter of the guide bush 411b of the socket guide 41.

  Furthermore, the insert 516 according to the second embodiment is provided with four insert cores 518, but is not limited to this, for example, two, six, eight, etc. Any object including at least two insert cores 518 may be used, thereby achieving the object of the present invention.

  In the insert core 518 of the insert 516 according to the second embodiment, the individual positioning hole 551 is formed in the bottom plate portion of the IC storage portion 519. However, the present invention is not limited to this. A concave hole may be formed on the bottom side of the corner. In this case, an IC device such as a BGA type can be handled. In this case, the individual positioning pins 550 are provided on the socket guide 541.

  Further, as shown in FIG. 12, the socket 40 includes a device guide portion that engages with the corner portion of the IC device and positions the IC device at a position corresponding to the corner portion of the IC device mounted on the socket 40. 401 may be provided. In this embodiment, the device guide portion 401 has a protruding shape having a recess corresponding to the shape of the corner of the IC device. By providing such a device guide portion 401 in the socket 40, even if thermal expansion or thermal contraction occurs in the insert 16, the IC device is guided by the device guide portion 401 and reliably contacted to the probe pin 44 of the socket 40. Can be made.

  When the device guide portion 401 as described above is provided in the socket 40, the IC housing portion 19 of the insert 16 needs to be provided with a relief portion 191 as shown in FIG. 12 so as not to interfere with the device guide portion 401. is there. In the present embodiment, the escape portion 191 includes a hole formed in the bottom portion of the insert 16 and a tapered notch continuing from the hole.

  In FIG. 12, the device guide portion 401 is provided in the socket 40, but the present invention is not limited to this, and can be provided in the socket guide. In the case of the insert 516 having the insert core 518, the escape portion is formed in the IC storage portion 519 of the insert core 518.

Electronic device handling apparatus electronic device handling apparatus for insert preparative Contact and the insert of the embodiment of the present invention, as well as reducing the size of the increase or device throughput is useful for suppressing the contact miss occurrence.

1 ... Handler (electronic parts handling device)
10 ... IC device (electronic component) test equipment
16 ... Insert
  19 ... IC (electronic parts) storage
  20a ... reference hole
  20b ... Guide hole
30 ... Pusher
  33 ... Presser
  35a ... Reference pin
  35b ... guide pins
40 ... Socket
41 ... Socket guide
  Window hole ... 410
  411a ... reference bush
  411b ... Guide bush

Claims (7)

It is an insert of a handler that houses the electronic device under test and is attached to the contact part of the test head in that state.
A plurality of core portions each having an electronic component storage portion for storing an electronic device under test;
An insert comprising: a holding portion that holds each of the plurality of core portions so as to be independently movable. Wherein the each of the core portions, in a position for mating with individual positioning fitting portion provided on the contact portion side of the test head, according to claim 1, characterized in that is provided with individual positioning fitting portion insert. 3. A guide fitting portion is formed at a position where the holding portion is fitted to a socket guide fixed to a contact portion of a test head or a guide fitting portion of a socket. Insert as described in. Each said core part is a structure which does not interfere with the said electronic component guide part of the socket guide which has the electronic component guide part which positions an electronic component, or the socket, The said any one of Claims 1-3 characterized by the above-mentioned. Inserts. The inserts, insert according to claim 1, characterized in that mounted for floating on the test tray. An electronic component handling device that performs testing by storing a plurality of electronic components to be tested in an insert, transporting them to a contact portion of a test head, and connecting them electrically.
Electronic device handling apparatus characterized by comprising an insert according to any one of claims 1 to 5. A test chamber for maintaining a state in which the plurality of inserts containing electronic devices under test are heated or cooled to a predetermined temperature;
A plurality of pushers for pressing the electronic components to be tested housed in the insert against the contact portion of the test head;
Claim 6, wherein the plurality of pushers, wherein the plurality of collectively under test electronic components stored in the insert so as to press, that a driving device for driving and holding the plurality of pushers An electronic component handling device according to claim 1.

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