JP4912080B2 - Electronic component handling apparatus and operation method thereof, test tray and pusher - Google Patents

Description

  INDUSTRIAL APPLICABILITY The present invention is used in an electronic component handling apparatus capable of operating a test tray containing a plurality of electronic components and a method for operating the same for testing electronic components such as IC devices, and the electronic component handling apparatus. It relates to test trays and pushers.

  In the manufacturing process of electronic components such as IC devices, a test apparatus for testing the finally manufactured electronic components is required. In such a test apparatus, a large number of IC devices are accommodated in a test tray by an electronic component handling apparatus called a handler, and external terminals of each IC device are connected to connection terminals of sockets provided on the test head. The test main device (tester) conducts the test in electrical contact. In this way, IC devices are tested and classified into categories such as at least good products and defective products.

  A test unit (sometimes referred to as Hi-Fix) is generally provided on the test head. The test unit includes a performance board and a socket board electrically connected to the performance board and provided with a plurality of sockets. The test unit is provided to be replaceable with respect to the test head body.

  Here, the socket in which the IC device is mounted during the test needs to be appropriately changed depending on the type of the IC device. For example, if the size of the IC device changes, the size of the socket needs to be changed accordingly, and if the size of the socket changes, the arrangement of the socket may need to be changed.

  Therefore, a plurality of test unit units having different socket sizes and arrangements are prepared as test unit units, and a desired test unit unit is selected and attached to a common test head body.

  However, test unit units having different socket sizes and arrangements as described above cannot be handled by the same handler because the test unit units themselves have different external sizes. That is, if the test unit units have different external shapes, it is necessary to change the device that transports the test tray, the device that drives the pusher, and the like, and it is extremely difficult to cope with the same handler in practice. Therefore, conventionally, it has been necessary to prepare a plurality of corresponding handlers for each test unit having different socket sizes and arrangements.

  Also, when changing the number of IC devices to be measured simultaneously, it is natural that the number of sockets on the test unit must be changed, and accordingly, the socket arrangement and the size of the test unit unit itself are different. Come. Accordingly, conventionally, the same handler cannot handle test unit units having different numbers of sockets, and it is necessary to prepare a plurality of handlers corresponding to the test unit units having different numbers of sockets.

  The present invention has been made in view of such a situation, and can handle a plurality of test unit units having different socket sizes, arrangements, or numbers with the same electronic component handling apparatus. It is an object of the present invention to provide an apparatus, an operation method of the electronic component handling apparatus, and a test tray and a pusher usable in the electronic component handling apparatus.

  In order to achieve the above object, first, the present invention conveys a test tray containing a plurality of electronic components to a plurality of socket positions of a test unit (Hi-Fix) provided in a test head. A plurality of test unit units that differ in at least one of the size, arrangement (including pitch and orientation in the plane direction), and the number of sockets, have substantially the same size. Thus, an electronic component handling apparatus that can be used in conformity with any of the plurality of test unit units is provided (invention 1).

  In the above invention (Invention 1), it is not necessary to change the device for conveying the test tray, the device for driving the pusher, etc. by making the outer shapes of the plurality of types of test unit units substantially the same size. It is possible to cope with various types of test unit units with the same electronic component handling device.

  In the said invention (invention 1), according to the kind of test part unit to be used, it replaces | exchanges the electronic component storage member which a test tray has so that an electronic component can be mounted in the socket which the said test part unit has. (Invention 2)

  In the said invention (invention 2), it is preferable to automatically exchange the electronic component storage member of the said test tray according to the kind of test part unit to be used (invention 3).

  In the said invention (invention 3), it is preferable to read the information of the test part unit to be used, and to replace | exchange automatically the electronic component storage member of the said test tray based on the read information (invention 4). .

  In the above invention (Invention 2), the test tray includes a movable member capable of holding and releasing the electronic component storage member, and the electronic component handling device includes a device for driving the movable member. (Invention 5)

  In the said invention (invention 5), it is preferable that the said movable member is a hook-shaped member, and the said electronic component storage member is formed with the engaging part which the said hook-shaped movable member engages ( Invention 6).

  In the above invention (invention 2), the electronic component housing member is formed with a plurality of protrusions standing in the Z-axis direction, and the electronic component is formed in the notch where the protrusions are notched. Is preferably stored (Invention 7).

  In the above invention (Invention 7), it is preferable that the ridge portion includes a plurality of ridge portions extending in the X-axis direction and a plurality of ridge portions extending in the Y-axis direction (Invention). 8).

  Moreover, in the said invention (invention 7), the said protrusion part has a substantially L shape in planar view, and several is provided at predetermined intervals so that it may become large sequentially toward the diagonal from the corner of the said electronic component storage member. It is formed side by side, and the cutout portion may be formed at a position diagonal to the one corner (Invention 9).

  In the above invention (Invention 8), the notch is formed at a substantially central portion of the electronic component housing member, and a protrusion extending in the X-axis direction and a protrusion extending in the Y-axis direction. The strip may be positioned around the notch (invention 10).

  In the said invention (invention 7), the electronic component press part of the pusher which the said electronic component handling apparatus has is provided with the several convex part which can be inserted between these protrusions in the said electronic component storage member. In addition, it is preferable that a gap between the plurality of convex portions is a concave portion into which the protruding portion of the electronic component housing member can be inserted (Invention 11).

  In the above invention (invention 11), the protrusion of the pusher is formed so as not to interfere with the protruding portion of the electronic component storage member having the smallest notch among the plurality of types of electronic component storage members. It is preferable (Invention 12).

  In the above invention (Invention 11), the convex portion of the pusher has a substantially rectangular convex portion in plan view provided at one corner of the electronic component pressing portion, and from one corner of the electronic component pressing portion toward the diagonal. There may be a plurality of convex portions having a substantially L shape in plan view formed side by side at predetermined intervals so as to increase sequentially (invention 13), and the convex portion of the pusher is substantially at the center of the electronic component pressing portion. It may extend in the X-axis direction and the Y-axis direction around the part (Invention 14).

  In the said invention (invention 1), the said electronic component handling apparatus can transfer an electronic component from a supply tray to a test tray, and supplies an electronic component according to the kind of test part unit to be used. It is preferable that the arrangement of the electronic components can be changed in the process of transferring from the test tray to the test tray (Invention 15).

  In the above invention (Invention 15), the electronic component handling device includes a transfer device that holds an electronic component housed in a supply tray and can transfer the electronic component to a test tray. You may have the function to change arrangement | positioning of the electronic component currently hold | maintained (invention 16).

  In the said invention (invention 16), it is preferable that the said transfer apparatus is provided with the function to change the direction of the planar direction of the electronic component currently hold | maintained (invention 17).

  In the said invention (invention 15), the said electronic component handling apparatus is equipped with the mounting part which can mount an electronic component temporarily, while transferring an electronic component from a supply tray to a test tray. The placement unit may have a function of changing the placement of the placed electronic component (Invention 18).

  In the said invention (invention 18), it is preferable that the said mounting part is provided with the function to change the pitch of the electronic component to mount, and / or the direction of a plane direction (invention 19).

  In the above invention (Invention 18), it is preferable to automatically change the arrangement of the electronic components according to the type of the test unit used (Invention 20).

  In the said invention (invention 20), it is preferable to read the information of the test part unit to be used, and to automatically change the arrangement of the electronic components based on the read information (invention 21).

  Secondly, the present invention is a test tray that accommodates a plurality of electronic components and is routed so as to be conveyed to a test unit in an electronic component handling apparatus, the test tray including an electronic component storage member, And a support for removably supporting the electronic component storage member, and the support is provided with a movable member capable of holding and releasing the electronic component storage member. A tray is provided (Invention 22).

  According to the above invention (Invention 22), an electronic component storage member corresponding to the type (size, arrangement or number of sockets) of the test unit used is prepared, and the appropriately selected electronic component storage member is moved by the movable member. It is possible to support a plurality of types of test unit units by supporting the support body.

  In the above invention (Invention 22), it is preferable that the movable member is a hook-shaped member, and the electronic component housing member is formed with an engaging portion with which the hook-shaped movable member is engaged ( Invention 23).

  In the above invention (Invention 22), the electronic component housing member is formed with a plurality of ridge portions standing in the Z-axis direction, and the electronic component is formed in the cutout portion where the ridge portions are cut out. Is preferably stored (Invention 23).

  In the above invention (Invention 24), it is preferable that the ridge portion includes a plurality of ridge portions extending in the X-axis direction and a plurality of ridge portions extending in the Y-axis direction (invention). 25).

  In the above invention (Invention 24), the protrusions have a substantially L shape in plan view, and a plurality of the protrusions are arranged at predetermined intervals so as to gradually increase from one corner of the electronic component housing member toward the diagonal. It is formed and the said notch part may be formed in the said diagonal and diagonal position (invention 26).

  In the above invention (Invention 25), the notch is formed at a substantially central portion of the electronic component housing member, and a protrusion extending in the X-axis direction and a protrusion extending in the Y-axis direction. The strip may be positioned around the notch (invention 27).

  Thirdly, according to the present invention, there is provided an electronic component storage portion in which a plurality of protruding portions standing in the Z-axis direction are formed, and an electronic component is stored in the notched portion where the protruding portion is notched. A pusher used in an electronic component handling apparatus corresponding to the test tray provided, and inserted between the plurality of protrusions of the electronic component storage member into the electronic component pressing portion of the pusher. Provided is a pusher characterized in that a plurality of projecting convex portions are provided, and between the plurality of convex portions are concave portions into which the protruding portions of the electronic component housing member can be inserted (invention). 28).

  In the above invention (Invention 28), the protrusion of the pusher is formed so as not to interfere with the protruding portion of the electronic component storage member having the smallest notch among the plurality of types of electronic component storage members. (Invention 29)

  In the above invention (Invention 28), the convex portion of the pusher has a substantially rectangular convex portion in plan view provided at one corner of the electronic component pressing portion, and from one corner of the electronic component pressing portion toward the diagonal. There may be a plurality of substantially L-shaped projections in plan view formed in a row at predetermined intervals so as to increase sequentially (invention 30), and the projection of the pusher is substantially at the center of the electronic component pressing portion. It may extend in the X-axis direction and the Y-axis direction around the part (Invention 31).

  Fourthly, the present invention is an operating method of an electronic component handling apparatus capable of transporting a test tray containing a plurality of electronic components to a plurality of socket positions of a test unit provided in a test head. Depending on a predetermined test unit used from among a plurality of test unit units having different sizes, arrangements and numbers of sockets and having substantially the same outer shape, the sockets of the test unit An electronic component handling apparatus operating method is provided in which the electronic component storage member of the test tray is replaced so that the electronic component can be mounted on the electronic component (Invention 32).

  In the above invention (Invention 32), it is preferable to automatically replace the electronic component storage member of the test tray according to a predetermined test unit used (Invention 33).

  5thly, this invention transfers an electronic component from the supply tray to the test tray, and the test tray which accommodated the several electronic component is moved to the position of the some socket which the test part unit provided in the test head has. A method of operating an electronic component handling device that can be transported, wherein at least one type of socket is different in size, arrangement, and number, and a predetermined use for use from a plurality of test unit units having substantially the same outer shape In accordance with the test unit, an electronic component handling apparatus operating method is provided that changes the arrangement of the electronic components in the process of transferring the electronic components from the supply tray to the test tray (Invention 34).

  In the above invention (invention 34), it is preferable to automatically change the arrangement of the electronic components in accordance with a predetermined test unit used (invention 35).

  According to the electronic component handling device, the test tray, or the pusher of the present invention, the same electronic component handling device can handle a plurality of test unit units having different socket sizes, arrangements, or numbers.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1 is an overall side view of an IC device testing apparatus including an electronic component handling apparatus (hereinafter referred to as “handler”) according to an embodiment of the present invention, FIG. 2 is a perspective view of the handler according to the embodiment, and FIG. It is principal part sectional drawing in the test chamber of the handler concerning the embodiment.

  First, an overall configuration of an IC device test apparatus including a handler according to an embodiment of the present invention will be described.

  As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main apparatus 6. The handler 1 performs an operation of sequentially transporting IC devices (an example of electronic components) to be tested to a socket provided in the test head 5, classifying the IC devices that have been tested according to the test results, and storing them in a predetermined tray. Execute.

  The socket provided in the test head 5 is electrically connected to the test main device 6 through the cable 7, and the IC device detachably attached to the socket is connected to the test main device 6 through the cable 7. The IC device is tested by the electrical test signal from the main apparatus 6 for testing.

  A control device that mainly controls the handler 1 is built in the lower portion of the handler 1, but a space portion 8 is provided in part. The test head 5 is replaceably disposed in the space portion 8, and an IC device can be attached to a socket on the test head 5 through a through hole formed in the handler 1.

  The handler 1 is an apparatus for testing an IC device, which is an electronic component to be tested, in a temperature state higher than normal temperature (high temperature) or a lower temperature state (low temperature). And the handler 1 has the chamber 100 comprised by the thermostat 101, the test chamber 102, and the heat removal tank 103, as shown in FIG. The upper part of the test head 5 (test unit 50) is inserted into the test chamber 102 as shown in FIG. 3, where the IC device 2 is tested.

  As shown in FIG. 2, the handler 1 of this embodiment stores an IC device to be tested from now on, an IC storage unit 200 that classifies and stores tested IC devices, and is sent from the IC storage unit 200. A loader unit 300 for feeding an IC device under test into the chamber unit 100, a chamber unit 100 including a test head, and an unloader unit 400 for taking out and classifying tested ICs that have been tested in the chamber unit 100. Yes.

  A number of IC devices before being set in the handler 1 are stored in a customer tray (not shown), and are supplied to the IC storage unit 200 of the handler 1 shown in FIG. Here, the IC device is transferred from a customer tray to a later-described test tray 500 (see FIG. 7) used for conveyance in the handler 1. Inside the handler 1, the IC device moves while being placed on the test tray 500, is subjected to a high-temperature or low-temperature stress, is tested (inspected) for proper operation, and depends on the test result. Classified.

  On the test head 5, test unit units 50a to 50d as shown in FIG. 4 are provided. The test unit 50a to 50d includes a performance board 52 and a socket board 51 electrically connected to the performance board 52 and provided with a plurality of sockets 40a to 40d. The test unit units 50a to 50d are provided to be replaceable with respect to the test head main body.

  In the present embodiment, the test unit units 50a to 50d are provided with a plurality (12 pieces in FIG. 4) of socket boards 51, and each socket board 51 has a plurality of sockets (4 or 6 pieces in FIG. 4). 40a to 40d are provided.

  Each of the test unit units 50a to 50d is different in the size, arrangement (pitch or plane direction) or number of the sockets 40a to 40d, and the size of the sockets 40a to 40d according to the type of IC device to be tested. The arrangement and the number are appropriately set. For example, the arrangement (especially pitch) of the sockets 40a to 40d is such that the electrical characteristics of the test unit units 50a to 50d are the best in consideration of the characteristics of the electrical signals branched in the test unit units 50a to 50d. That is, it is set as appropriate so that the performance of the test main device 6 can be maximized.

  In the present embodiment, the change in the arrangement of the sockets 40a to 40d as described above is performed for each socket board 51 provided in a plurality of test unit units 50a to 50d, and thereby, in the test unit units 50a to 50d. Thus, it is possible to further improve the characteristics of the branched electric signal.

  Referring to FIG. 4, the socket 40b of the test unit 50b is smaller than the socket 40a of the test unit 50a and has a smaller pitch. It is provided near the department. Further, the socket 40c of the test unit 50c is provided in a state of being rotated by 90 ° with respect to the socket 40a of the test unit 50a. Further, four sockets 40a of the test unit 50a are provided on each socket board 51, whereas six sockets 40d of the test unit 50d are provided on each socket board 51. The number is larger than that of the socket 40a of 50a.

  As described above, the test unit units 50a to 50d are different in size, arrangement, or number of the sockets 40a to 40d, but have the same outer shape. Thus, by making the outer dimensions of the test unit units 50a to 50d have the same size, the test unit units 50a to 50d can be changed to the test unit units 50a to 50d without changing the device for transporting the test tray 500, the device for driving the pusher 30, and the like. On the other hand, it is possible to cope with the same handler 1.

Hereinafter, the handler 1 will be described.
As shown in FIG. 2, the IC storage unit 200 of the handler 1 includes a pre-test IC stocker 201 that stores pre-test IC devices and a tested IC stocker that stores IC devices classified according to the test results. 202 is provided.

  In the pre-test IC stocker 201 shown in FIG. 2, customer trays containing IC devices to be tested are stacked and held. The tested IC stocker 202 has a stack of customer trays in which IC devices classified after finishing the test are stored.

  As shown in FIG. 2, the customer tray stored in the pre-test IC stocker 201 is loaded from the lower side of the device substrate 105 by a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. It is carried to the window part 306 of the part 300. Then, in this loader unit 300, the IC device under test loaded on the customer tray is once transferred to the precursor 305 by the XY transport device 304 (corresponding to the transfer device of the present invention). After correcting the mutual positions, the IC devices to be tested transferred to the precursor 305 are reloaded onto the test tray 500 stopped at the loader unit 300 using the XY transport device 304 again.

  As shown in FIG. 2, an XY transfer device 304 that reloads IC devices to be tested from the customer tray to the test tray 500 includes two rails 301 installed on the upper portion of the device substrate 105 and the two rails. 301, a movable arm 302 that can reciprocate between the test tray 500 and the customer tray (this direction is defined as a Y-axis direction), and is supported by the movable arm 302 in the X-axis direction along the movable arm 302. And a movable head 303 that can move.

  A plurality of (four in FIG. 5) suction heads 313 are mounted downward on the movable head 303 of the XY transport device 304. The suction heads 313 allow the IC device 2 to be tested to be tested from the customer tray. The IC device 2 to be tested is accommodated in the test tray 500.

  In the handler 1 according to the present embodiment, in order to correspond to the test unit 50 (for example, the test unit 50a, 50b, 50d and the test unit 50c) in which the orientation of the socket 40 in the planar direction is different, FIG. As shown in (b), the movable head 303 of the XY transport device 304 is rotatable. That is, each suction head 313 sucks the IC device 2 to be tested as shown in FIG. 5A, and in that state, rotates 90 ° and rotates the IC device to be tested as shown in FIG. 5B. 2 is stored in the test tray 500. Thus, since the XY conveyance device 304 can change the orientation of the IC device 2 in the planar direction by 90 °, the handler 1 is one of the test unit 50a, 50b, 50d and the test unit 50c. Can also respond.

  The rotation of the movable head 303 is preferably performed automatically by the handler 1 reading information on the test unit 50 to be used and based on the read information.

  In the above-described embodiment, the movable head 303 of the XY conveyance device 304 is configured to rotate. Alternatively, each suction head 313 provided on the movable head 303 may be configured to rotate. Good.

  In the handler 1 according to the present embodiment, instead of rotating the movable head 303 of the XY transport device 304, as shown in FIG. 6, the precursor 305 (corresponding to the mounting portion of the present invention) can be rotated. Furthermore, the pitch may be changeable. The precursor 305 of this example includes a substrate 305 and a plurality of movable portions 315 provided on the substrate 305 (four in FIG. 6). The movable portion 315 has a concave device storage portion 325 formed thereon. Yes. The device storage portion 325 has a shape corresponding to the shape of the IC device 2 under test.

  In the precisionr 305 of this example, each movable part 315 in which the IC device 2 is accommodated in the device accommodating part 325 is rotated by 90 ° or moved in the X axis direction / Y axis direction as shown in FIGS. By doing so, the direction of the planar direction of the IC device 2 can be changed by 90 °, or the pitch can be changed.

  The test tray 500 on which the IC device 2 to be tested is loaded by the loader unit 300 is sent to the thermostat 101 of the chamber 100 and then to the test chamber 102, and each IC device 2 to be tested is tested in the test chamber 102.

  As shown in FIG. 3, a test unit 50 of the test head 5 is disposed below the test chamber 102. The test tray 500 in which the IC device 2 is stored is carried on the test unit 50. The IC device 2 accommodated in the test tray 500 is pressed against the socket 40 provided in the test unit 50 by pressing the pusher 30. As a result, the external terminal of the IC device 2 is in electrical contact with the connection terminal of the socket 40, and in this state, a test signal is applied to the IC device 2 to perform a test. When the test is completed, the test tray 500 is removed of heat in the heat removal tank 103, and after the temperature of the IC device 2 is returned to room temperature, it is discharged to the unloader unit 400 shown in FIG.

  As shown in FIG. 2, the unloader unit 400 is also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300, and this XY transport device 404, In 404, the tested IC devices 2 are transferred from the test tray 500 carried out to the unloader unit 400 to the customer tray.

  As shown in FIG. 7, the test tray 500 according to this embodiment includes a plurality of carriers 516 and a frame 510 that detachably supports the carriers 516.

  As shown in FIGS. 7 and 8, the carrier 516 includes a plurality of (four in FIG. 7) carrier cores 518 (corresponding to the electronic component housing member of the present invention) and a carrier that detachably supports the carrier core 518. A body 517 (the frame 510 corresponds to the support of the present invention). The plurality of carrier cores 518 are arranged on the carrier body 517 so as to correspond to the position of the socket 40 of the test unit 50. For example, in the example shown in FIG. 7, the carrier cores 518 are arranged in 2 rows × 2 columns.

  The carrier body 517 has a frame-like shape opened at a position corresponding to the carrier core 518, and includes a pivotable hook 517a extending downward.

  As shown in FIG. 8, the carrier core 518 has an engaging portion 518a (not shown in FIG. 7). The carrier core 518 is supported by the carrier body 517 by the hook 517a of the carrier body 517 engaging with the engaging portion 518a of the carrier core 518. Then, when the hook 517a rotates and the engagement between the hook 517a and the engaging portion 518a is released, the carrier core 518 is detached from the carrier body 517 and can be exchanged with another carrier core 518.

  Each carrier core 518 is formed with a device storage portion 519 corresponding to the shape of the IC device 2 to be tested, and the IC device 2 to be tested is stored so as to fit into the device storage portion 519. The structure related to the relationship between the carrier core 518 and the pusher 30 will be described later.

  As shown in FIG. 7, a plurality of types of carrier cores 518 are prepared according to the type of test unit 50 (the size, arrangement, and number of sockets 40), and appropriate according to the size, arrangement, and number of sockets 40. Selected and attached to carrier body 517. The device storage portion 519 of each carrier core 518 is formed at a position corresponding to the position of the socket 40 in the carrier core 518. For example, in the example shown in FIG. 7, each device storage portion 519 in each carrier core 518 is formed closer to the center portion of the carrier core 518.

  The hook 517a of the carrier body 517 is automatically rotatable by a driving device (not shown) provided in the handler 1. Further, the handler 1 accommodates a plurality of types of carrier cores 518, and automatically selects the carrier core 518 corresponding to the type of the IC device 2 to be tested so that it can be conveyed under the carrier body 517. As a result, a desired carrier core 518 can be automatically attached to the carrier body 517 and thus to the test tray 500, and a single handler 1 can handle a plurality of types of test unit units 50.

  The replacement of the carrier core 518 is preferably performed automatically by the handler 1 reading information on the test unit 50 to be used and based on the read information.

  The above example is a case where the number of sockets 40 in the socket board 51 is four. However, when the number of sockets 40 in the socket board 51 is six, the carrier 516 that supports six carrier cores 518. And the carrier 516 may be supported on the frame 510 of the test tray 500. Replacement of the carrier 516 in the test tray 500 can also be automatically performed by the handler 1.

  According to the test tray 500, the carrier core 518 corresponding to the type of the test unit 50 to be used (the size, arrangement, or number of the sockets 40) is prepared, and the carrier core 518 selected appropriately can be detachably attached to the carrier body. By supporting it on 517 (test tray 500), it is possible to support a plurality of types of test unit units 50.

  On the other hand, the pusher 30 is provided above the test unit 50 and is held by the match plate 60 as shown in FIGS. The match plate 60 is supported by the Z-axis drive device 70 so as to be positioned above the test unit 50 and so that the test tray 500 can be inserted between the pusher 30 and the socket 40. The pusher 30 held on the match plate 60 is movable in the Z-axis direction by driving the Z-axis driving device 70, thereby pressing the IC device 2 mounted on the test tray 500 against the socket 40. Is possible.

  As shown in FIG. 9, the carrier core 518 described above has a plurality of ridges 521 standing in the Z-axis direction, and a groove 520 is formed between the plurality of ridges 521. ing.

  Each ridge 521 in the present embodiment has a substantially L shape in a plan view including a ridge extending in the X-axis direction and a ridge extending in the Y-axis direction. A plurality of L-shaped protrusions 521 are formed side by side at a predetermined interval so as to increase sequentially from one corner of the carrier core 518 toward the diagonal (this is referred to as a “diagonal portion”). The protrusion 521 is cut out at the corner. This notch is the aforementioned device storage portion 519, in which the IC device 2 to be tested is stored. The IC device 2 dropped into the device storage portion 519 is positioned by contacting the end of the notched protrusion 521. As shown in FIG. 11, the upper part of the end portion of the notched ridge portion 521 is cut obliquely so that the IC device 2 can be easily dropped into the device storage portion 519.

  In the carrier core 518, as shown in FIGS. 12 (a) to 12 (c), by changing the notch amount of the protruding portion 521, it corresponds to the socket 40 having a different size, pitch, or plane direction. be able to. That is, the carrier core 518 is first prepared without a cutout of the protrusion 521, and the protrusion 521 is cut out by a predetermined amount according to the size, pitch, or plane direction of the socket 40. Those corresponding to various sockets 40 can be easily manufactured.

  The pusher 30 in the present embodiment includes pusher blocks 30 a as shown in FIG. 10 corresponding to the number of sockets 40. In the pusher block 30 a, the bottom surface portion is a device pressing portion that presses the IC device 2 to be tested stored in the device storage portion 519 of the carrier core 518.

  The device pressing portion of the pusher block 30a is provided with a plurality of convex portions 311 that can be inserted into the plurality of concave grooves 520 of the carrier core 518, and the plurality of convex portions 311 are arranged between the plurality of convex portions 311. It becomes the recessed part 310 in which the protrusion part 521 can be inserted. In the present embodiment, the convex portion 311 and the concave portion 310 of the pusher block 30a are substantially L-shaped in plan view corresponding to the shapes of the concave groove 520 and the protruding portion 521 of the carrier core 518.

  The protrusion 311 of the pusher block 30a is formed so as not to interfere with the protrusion 521 in the carrier core 518 in which the notch (device storage part 519) of the protrusion 521 is the smallest among the plurality of types of carrier cores 518. Has been. The protrusion 311 of the pusher block 30a formed in this way does not interfere with the protrusion 521 of the carrier core 518 where the notch of the protrusion 521 is large, so that the pusher block 30a forms a plurality of types of carrier cores 518. It is possible to respond.

  When the pusher block 30a is brought close to the IC device 2 housed in the device housing portion 519 of the carrier core 518, the convex portion 311 of the pusher block 30a becomes a concave groove of the carrier core 518 as shown in FIGS. The protrusion 521 of the carrier core 518 is inserted into the recess 310 of the pusher block 30a. At the same time, the convex portion 311 of the pusher block 30a is inserted into the cutout portion (device storage portion 519) of the carrier core 518, and the IC device 2 is pressed by the insertion portion of the convex portion 311 of the pusher block 30a, so that the socket 40 Pressed against.

  As shown in FIGS. 11 (a), 11 (b) and 12 (a) to 12 (c), even if the type of carrier core 518, that is, the size, pitch or orientation of the socket 40 of the socket 40 changes, the pusher block It is possible to press the IC device 2 as described above without changing the 30a (the pusher 30).

  When the number of sockets 40 on the socket board 51 changes (for example, 4 to 6), the pusher 30 includes the match plate 60 including the number of pusher blocks 30a corresponding to the number of the sockets 40 (for example, 6). What is necessary is just to exchange for what hold | maintained 30.

  As described above, according to the handler 1 and the test tray 500 according to the present embodiment, the same handler 1 can handle a plurality of types of test unit units 50 having different sizes, arrangements, or numbers of sockets 40. .

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  13 and 14 show another example of the carrier core 518 and the pusher block 30a. As shown in FIG. 13, the carrier core 518A is formed with a ridge 521X standing in the Z-axis direction and extending in the X-axis direction and a ridge 521Y extending in the Y-axis direction. . The ridge portion 521X and the ridge portion 521Y are notched at a substantially central portion of the carrier core 518A, and the notch portion serves as a device storage portion 519. That is, the protrusion 521X and the protrusion 521Y are located around the notch (device storage 519).

  In the carrier core 518A, as shown in FIGS. 13 (a) and 13 (b) and FIGS. 14 (a) and 14 (b), the size and pitch are changed by changing the notch amounts of the protrusions 521X and 521Y. Or it can respond to the socket 40 from which the direction of a plane direction differs.

  On the other hand, as shown in FIG. 14, the bottom surface portion (device pressing portion) of the pusher block 30 </ b> A has a convex portion 311 </ b> A extending in the X-axis direction and the Y-axis direction around the substantially central portion of the device pressing portion. Is formed. The protrusion 311A does not interfere with the protrusions 521X and 521Y of the carrier core 518A having the smallest notch (device storage part 519) of the protrusions 521X and 521Y among the plurality of types of carrier cores 518A. Is formed. The protrusion 311A of the pusher block 30A formed in this way does not interfere with the protrusions 521X and 521Y of the carrier core 518A where the notches of the protrusions 521X and 521Y are large. It is possible to correspond to the carrier core 518A.

  The present invention is useful for efficient use of an electronic component handling apparatus for a plurality of types of test unit units.

1 is an overall side view of an IC device test apparatus including a handler according to an embodiment of the present invention. It is a perspective view of the handler concerning the embodiment. It is principal part sectional drawing in the test chamber of the handler concerning the embodiment. It is a top view of the several test part unit from which the magnitude | size, arrangement | positioning, and number of sockets differ. It is a bottom view which shows an example of the movable head of the XY conveyance apparatus in the handler which concerns on the same embodiment. It is a top view which shows an example of the precursor in the handler which concerns on the same embodiment. It is a perspective view of the test tray used with the handler concerning the embodiment. It is sectional drawing (AA sectional drawing in FIG. 7) of the carrier of the test tray used with the handler which concerns on the same embodiment. It is a perspective view of the carrier core of the test tray used with the handler which concerns on the same embodiment. It is a perspective view of the pusher block in the handler concerning the embodiment. It is sectional drawing of the carrier core of the pusher block and test tray in the handler which concerns on the same embodiment. It is a top view of the carrier core and pusher block of the test tray in the handler according to the same embodiment. It is a perspective view which shows the other example of a carrier core. It is a top view of the carrier core and pusher block concerning other examples.

Explanation of symbols

1 ... Handler (electronic parts handling device)
DESCRIPTION OF SYMBOLS 10 ... IC device (electronic component) test apparatus 30 ... Pusher 30a ... Pusher block 310 ... Concave part 311 ... Convex part 303 ... Movable head 304 ... XY conveyance apparatus (transfer apparatus)
305 ... Preciser (mounting part)
5. Test heads 50, 50a, 50b, 50c, 50d ... Test unit 51 ... Socket boards 40, 40a, 40b, 40c, 40d ... Socket 500 ... Test tray (test tray)
518, 518A ... Carrier core (electronic component housing member)
520 ... concave groove 521, 521 X, 521 Y ... ridge

Claims (8)

An electronic component handling apparatus capable of transporting a test tray containing a plurality of electronic components to a plurality of socket positions of a test unit provided in a test head,
The size of the socket, by at least one arrangement and the number is substantially the same size profile of different test section unit, it may be used to conform to any of the plurality of test section unit, used Depending on the type of the test unit, the electronic component storage member of the test tray can be replaced so that the electronic component can be mounted in the socket of the test unit.
The test tray includes a movable member capable of holding and releasing an electronic component storage member,
The electronic component handling apparatus includes an apparatus for driving the movable member . Depending on the type of test section unit to be used, the electronic device handling apparatus according to claim 1 for automatically exchanging electronic component housing member of the tray for the test. The electronic component handling apparatus according to claim 2 , wherein information on a test unit to be used is read, and the electronic component storage member of the test tray is automatically replaced based on the read information.   The electronic component storage member is formed with a plurality of ridges standing in the Z-axis direction, and the electronic component is stored in the cutout portion where the ridges are cut out. The electronic component handling apparatus according to claim 2. 5. The electronic component according to claim 4 , wherein the protrusion includes a plurality of protrusions extending in the X-axis direction and a plurality of protrusions extending in the Y-axis direction. Handling device. The protrusions have a substantially L shape in plan view, and are formed in a plurality at a predetermined interval so as to increase sequentially from one corner of the electronic component storage member toward the diagonal,
The electronic component handling apparatus according to claim 4 , wherein the cutout portion is formed at a position diagonal to the one corner. The notch is formed in a substantially central portion of the electronic component storage member,
6. The electronic component handling apparatus according to claim 5 , wherein the ridge portion extending in the X-axis direction and the ridge portion extending in the Y-axis direction are located around the notch portion. A test tray that houses a plurality of electronic components and is routed so as to be conveyed to a test unit in an electronic component handling device,
The test tray includes an electronic component storage member and a support that removably supports the electronic component storage member.
A test tray, wherein the support is provided with a movable member capable of holding and releasing the electronic component storage member.

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