KR101075139B1 - Electronic component handling apparatus, method for operating the electronic component handling apparatus, test tray and pusher - Google Patents

Abstract

The test tray 500 containing the plurality of IC devices 2 can be transported to the positions of the plurality of sockets 40 of the test unit unit (Hi-Fix) 50 provided in the test head 5. As the handler 1, a plurality of tests are made by making the external shape of the plurality of test unit units 50 having different sizes, arrangements (including pitch and planar directions) and the number of the sockets 40 different from each other by the same size. The handler 1 which can be suitably used with any of the subunits 50 is provided. Such a handler 1 can cope with a plurality of test unit units 50 having different sizes, arrangements or numbers of sockets.

Electronics, parts, handling, tray, pusher

Description

ELECTRONIC COMPONENT HANDLING APPARATUS, METHOD FOR OPERATING THE ELECTRONIC COMPONENT HANDLING APPARATUS, TEST TRAY AND PUSHER}

The present invention relates to an electronic component handling apparatus capable of installing a test tray containing a plurality of electronic components in order to test electronic components such as an IC device, an operation method thereof, and a test tray and a pusher used in the electronic component handling apparatus. will be.

In the manufacturing process of electronic components, such as an IC device, the test apparatus which tests the finally manufactured electronic component is needed. In such a test apparatus, a plurality of IC devices are stored in a test tray and conveyed by an electronic component handling apparatus called a handler, and the external terminals of each IC device are electrically contacted with connection terminals of sockets provided on the test heads, The test is carried out on a test mains (tester). In this way, the IC device is tested and classified into at least a category of good or defective.

On the test head, a test unit unit (sometimes called Hi-Fix) is generally provided. The test unit includes a performance board and a socket board electrically connected to the performance board and provided with a plurality of sockets. This test unit is provided so as to be replaceable with respect to the test head body.

Here, the socket in which the IC device is mounted at the time of testing needs to be changed according to the type of the IC device. For example, if the size of the IC device changes, it is necessary to change the size of the socket accordingly, and if the size of the socket changes, the arrangement of the socket may need to be changed.

For this reason, as the test unit, a plurality of test unit units having different sizes and arrangements of sockets are prepared, and a desired test unit is selected and installed for the common test head main body.

However, test unit units having different sizes or arrangements of sockets as described above also differ in the size of the appearance of the test unit unit itself, and thus cannot be supported by the same handler. That is, when the external appearance of the test unit is different, it is necessary to change the device for conveying the test tray, the device for driving the pusher, and the like, and it is very difficult to cope with the same handler in reality. Therefore, conventionally, it was necessary to prepare a plurality of corresponding handlers for each test unit unit having a different size or arrangement of sockets.

In addition, in the case of changing the number of simultaneous measurements of the IC devices, the number of sockets on the test unit must naturally be changed, accompanied by the arrangement of the sockets and the size of the external shape of the test unit. Therefore, the test handler unit having a different number of sockets has not been able to cope with the same handler in the past, and it is necessary to prepare a plurality of handlers corresponding to the test unit units having different socket numbers.

The present invention has been made in view of such a situation, and an electronic component handling apparatus and a method of operating the electronic component handling apparatus, which are compatible with the same electronic component handling apparatus even for a plurality of test unit units having different sizes, arrangements or numbers of sockets, and An object of the present invention is to provide a test tray and a pusher that can be used in the electronic component handling apparatus.

In order to achieve the above object, firstly, the present invention provides an electronic component capable of conveying a test tray containing a plurality of electronic components to a position of a plurality of sockets of a test unit unit (Hi-Fix) provided in a test head. A handling apparatus comprising any of the plurality of test unit units by making the external shape of a plurality of test unit units at least one of the size, arrangement (including pitch and planar direction) and the number of sockets different in size to approximately the same size. Provided is an electronic component handling apparatus which can be suitably used (Invention 1).

In the above invention (Invention 1), by making the external shapes of the plurality of test unit units approximately the same size, it is not necessary to change the device for conveying the test tray, the device for driving the pusher, or the like, and thus the plurality of test unit units It is possible to cope with the same electronic component handling apparatus.

In the invention (Invention 1), it is preferable that the electronic component accommodating member of the test tray can be replaced so that the electronic component can be mounted in the socket of the test unit according to the type of the test unit used. (Invention 2)

In the above invention (Invention 2), it is preferable to automatically perform replacement of the electronic component accommodating member of the test tray according to the type of the test unit used (Invention 3).

In the above invention (Invention 3), it is preferable to read the information of the test unit used, and to automatically replace the electronic component storage member of the test tray based on the read information (Invention 4). .

In the said invention (invention 2), the said test tray is provided with the movable member which can hold and release an electronic component accommodating member, The said electronic component handling apparatus is equipped with the apparatus which drives the said movable member. Preferred (invention 5).

In the said invention (invention 5), it is preferable that the said movable member is a hook-shaped member, and the said electronic component accommodating member is provided with the engaging part to which the said hook-shaped movable member couples (invention 6).

In the above invention (Invention 2), it is preferable that a plurality of protrusions erected in the Z-axis direction are formed in the electronic component accommodating member, and the electronic component is accommodated in the cutout portion in which the protrusions are cut out. ).

In the invention (invention 7), it is preferable that the protrusions include a plurality of protrusions extending in the X-axis direction and a plurality of protrusions extending in the Y-axis direction (invention 8).

In the invention (invention 7), the protrusions have a substantially L shape in plan view, and are formed in a plurality of rows at predetermined intervals so as to be sequentially enlarged from one angle of the electronic component accommodating member toward the diagonal. A notch may be formed in the position of the said one angle and diagonal (invention 9).

In the said invention (invention 8), the said notch part is formed in the substantially center part of the said electronic component accommodating member, The protrusion part extended in the said X-axis direction and the protrusion part extended in the said Y-axis direction are the said notch parts It may be located around (Invention 10).

In the above invention (Invention 7), a plurality of convex portions that can be inserted between the plurality of protrusions in the electronic component accommodating member are provided in the electronic component pressing portion of the pusher of the electronic component handling apparatus. Preferably, the plurality of convex portions are concave portions into which the protrusions of the electronic component accommodating member can be inserted (invention 11).

In the invention (invention 11), it is preferable that the convex portion of the pusher is formed so as not to interfere with the protruding portion in the electronic component storage member having the smallest cutout portion among a plurality of types of electronic component storage members ( Invention 12).

In the invention (invention 11), the convex portion of the pusher is gradually increased toward the diagonal from the substantially rectangular convex portion and the one angle of the electronic component pressing portion in plan view provided at one corner of the electronic component pressing portion. In the planar view, the L-shaped convex portion may exist in the plane formed by a plurality of predetermined intervals (Invention 13), and the convex portion of the pusher is centered on the substantially center portion of the pressing portion of the electronic component, It may be serialized as (Invention 14).

In the above invention (Invention 1), the electronic component handling apparatus is capable of transferring electronic components from the supply tray to the test tray, and depending on the type of test unit unit used, the electronic component is transferred from the supply tray to the test tray. In the process of transferring, it is desirable to be able to change the arrangement of the electronic components (invention 15).

In the above invention (invention 15), the electronic component handling apparatus is provided with a transfer apparatus capable of holding an electronic component housed in a supply tray and transferring the test component to a test tray, wherein the transfer apparatus holds an electron. It may be provided with the function which changes the arrangement | positioning of components (Invention 16).

In the said invention (invention 16), it is preferable that the said conveying apparatus is provided with the function which changes the plane direction of the hold | maintained electronic component (invention 17).

In the above invention (invention 15), the electronic component handling apparatus includes a mounting portion on which the electronic component can be temporarily placed between the electronic components from the supply tray to the test tray, and the mounting portion is placed thereon. You may be provided with the function to change the arrangement | positioning of the electronic component which exists (invention 18).

In the said invention (invention 18), it is preferable that the said mounting part is provided with the function which changes the pitch and / or planar direction of the mounted electronic component (invention 19).

In the invention (invention 18), it is preferable to automatically change the arrangement of the electronic component according to the type of test unit used (invention 20).

In the invention (invention 20), it is preferable to read the information of the test unit used, and to automatically change the arrangement of the electronic component based on the read information (invention 21).

Secondly, the present invention is a test tray which accommodates a plurality of electronic components and is installed to be conveyed from the electronic component handling apparatus to the test section, wherein the test tray detachably supports the electronic component storage member and the electronic component storage member. A support tray is provided, and the support tray is provided with a movable member capable of holding and releasing the electronic component housing member (invention 22).

According to the invention (invention 22), an electronic component accommodating member according to the type (size, arrangement or number of sockets) of a test unit unit to be used is prepared, and an appropriately selected electronic component accommodating member is supported on a support by a movable member. It is possible to cope with a plurality of test unit units.

In the said invention (invention 22), it is preferable that the said movable member is a hook-shaped member, and the said electronic component accommodating member is provided with the engaging part to which the said hook-shaped movable member couples (Invention 23).

In the invention (invention 22), it is preferable that a plurality of protrusions formed in the Z-axis direction are formed in the electronic component accommodating member, and the electronic component is accommodated in the cutout portion in which the protrusions are cut out (invention 24). ).

In the invention (invention 24), it is preferable that the protrusions include a plurality of protrusions extending in the X-axis direction and a plurality of protrusions extending in the Y-axis direction (invention 25).

In the invention (invention 24), the protrusions have a substantially L shape in plan view, and are formed in a plurality of rows at predetermined intervals so as to increase in sequence from one angle of the electronic component accommodating member toward the diagonal. The notches may be formed at positions of the one angle and the diagonal (Invention 26).

In the invention (invention 25), the cutout portion is formed at a substantially central portion of the electronic component storage member, and the protrusion portion extending in the X-axis direction and the protrusion portion extending in the Y-axis direction are the cutout portion. It may be located around (Invention 27).

Thirdly, the present invention corresponds to a test tray provided with an electronic component accommodating portion in which a plurality of protruding portions formed in the Z-axis direction are formed and the electronic components are accommodated in the cutout portions in which the protruding portions are cut out. A pusher for use in an apparatus, wherein an electronic component pressing portion of the pusher is provided with a plurality of convex portions that can be inserted between the plurality of protrusions in the electronic component accommodating member, and the plurality of convex portions mutually support the electrons. Provided is a pusher, characterized in that it is a recess into which the protrusion of the component housing member can be inserted (invention 28).

In the invention (Invention 28), it is preferable that the convex portion of the pusher is formed so as not to interfere with the protrusion in the electronic component storage member having the smallest cutout portion among a plurality of types of electronic component storage members. 29).

In the above invention (Invention 28), the convex portion of the pusher is gradually larger toward the diagonal from the substantially rectangular convex portion and the one angle of the electronic component pressing portion in a plan view provided at one corner of the electronic component pressing portion. In the plane formed by a plurality of predetermined intervals, the L-shaped convex portions may be present (invention 30), and the convex portions of the pushers are formed in the X-axis direction and the Y-axis direction about the center of the electronic component pressing portion. It may be serialized as (Invention 31).

Fourthly, the present invention provides an operation method of an electronic component handling apparatus capable of conveying a test tray containing a plurality of electronic components to a position of a plurality of sockets of a test unit unit provided in a test head. And a test tray so that the electronic component can be mounted in a socket of the test unit according to a predetermined test unit used among a plurality of test unit units having at least one kind of numbers different in appearance and having substantially the same size. An operating method of an electronic component handling device characterized by replacing an electronic component accommodation member (invention 32).

In the invention (Invention 32), it is preferable to automatically perform replacement of the electronic component accommodating member of the test tray according to the predetermined test unit used (invention 33).

Fifthly, the present invention transfers an electronic component from a supply tray to a test tray, and can transport a test tray containing a plurality of electronic components to a position of a plurality of sockets of a test unit unit provided in a test head. A method for operating an electronic component handling device, comprising: a tray for supplying an electronic component in accordance with a predetermined test unit unit used among a plurality of test unit units having at least one of a size, an arrangement, and a number of sockets having a substantially identical size In the process of transferring from the test tray to the test tray, there is provided a method of operating the electronic component handling device, characterized in that the arrangement of the electronic component is changed (invention 34).

In the above invention (invention 34), it is preferable to automatically change the arrangement of the electronic component in accordance with the predetermined test unit used (invention 35).

According to the electronic component handling apparatus, the test tray, or the pusher of the present invention, the same electronic component handling apparatus can be applied to a plurality of test unit units having different sizes, arrangements or numbers of sockets.

1 is an overall side view of an IC device test apparatus including a handler according to an embodiment of the present invention.

2 is a perspective view of a handler according to an embodiment of the present invention.

3 is a cross-sectional view of main parts of a test chamber of a handler according to one embodiment of the present invention;

4 is a plan view of a plurality of test unit units having different sizes, arrangements and number of sockets;

Fig. 5 is a bottom view showing an example of the movable head of the X-Y transport apparatus in the handler according to the embodiment of the present invention.

6 is a plan view illustrating an example of a presizer in a handler according to an embodiment of the present invention.

7 is a perspective view of a test tray used in a handler according to one embodiment of the present invention.

FIG. 8 is a cross-sectional view (A-A cross section in FIG. 7) of a carrier of a test tray used in a handler according to one embodiment of the present invention.

9 is a perspective view of a carrier core of a test tray used in a handler according to one embodiment of the present invention.

10 is a perspective view of the pusher block in the handler according to the embodiment of the present invention.

Figure 11 is a cross-sectional view of the carrier core of the pusher block and the test tray in the handler according to one embodiment of the present invention.

12 is a plan view of a carrier core and a pusher block of a test tray in a handler according to one embodiment of the present invention.

Fig. 13 is a perspective view showing another example of the carrier core.

14 is a plan view of a carrier core and a pusher block according to another example.

Explanation of the sign

One… Handler (Electronic Component Handling Device)

10... IC device (electronic component) test equipment

30 ... Pusher

30a... Pusher block

310... Recess

311... Convex

303... Movable head

304... X-Y Carrier (Transfer Unit)

305... Presizer

5... Test head

50, 50a, 50b, 50c, 50d... Test unit

51... Socket board

40, 40a, 40b, 40c, 40d... socket

500... Test Tray (Test Tray)

518,518A... Carrier core (electronic component storing member)

520... Recess

521,521X, 521Y... Stone grandfather

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail based on drawing.

1 is an overall side view of an IC device test apparatus including an electronic component handling apparatus (hereinafter referred to as a "handler") according to an embodiment of the present invention; FIG. 2 is a perspective view of a handler according to an embodiment of the present invention; 3 is a cross-sectional view of main parts of a test chamber of a handler according to an embodiment of the present invention.

First, the whole structure of the IC device test apparatus provided with the handler which concerns on embodiment of this invention is demonstrated.

As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main apparatus 6. The handler 1 sequentially returns IC devices (an example of electronic components) to be tested to sockets provided in the test head 5, and classifies the IC devices that have been tested according to the test results and stores them in predetermined trays. Execute the action.

The socket provided in the test head 5 is electrically connected to the test main device 6 via a cable 7, and the test main device 6 is connected to the test device via a cable 7 with an IC device detachably mounted to the socket. The IC device is tested by the test electrical signal from the test main device 6.

The control part which mainly controls the handler 1 is built in the lower part of the handler 1, but the space part 8 is provided in part. In this space part 8, the test head 5 is arrange | positioned freely and it becomes possible to mount an IC device to the socket on the test head 5 via the through-hole formed in the handler 1.

The handler 1 is an apparatus for testing an IC device, which is an electronic component to be tested, in a temperature state (high temperature) or a low temperature state (low temperature) higher than normal temperature. And the handler 1 has the chamber 100 comprised from the thermostat 101, the test chamber 102, and the heat removal tank 103, as shown in FIG. The upper part of the test head 5 (test section unit 50) is inserted into the test chamber 102 as shown in Fig. 3, whereby the test of the IC device 2 is performed.

As shown in Fig. 2, the handler 1 of the present embodiment includes an IC storage unit 200 which stores IC devices for future tests, and classifies and stores IC devices that have been tested. End of the test in which the test is performed on the loader unit 300, the chamber unit 100 including the test head, and the chamber unit 100 to transfer the IC device under test sent from the 200 to the chamber unit 100. It consists of the unloader part 400 which takes out and classifies the IC.

Many IC devices before being set in the handler 1 are housed in a customer tray (not shown), and are supplied to the IC storage unit 200 of the handler 1 shown in FIG. The IC device is transferred from the customer tray to the test tray 500 (see Fig. 7) described later, which is used for conveyance in the handler 1. Inside the handler 1, the IC device moves in a state loaded on the test tray 500, and a high or low temperature stress is applied, and it is tested (inspected) whether it operates properly, and the test result Are classified according to.

On the test head 5, test part units 50a-50d as shown in FIG. 4 are provided. These test part units 50a-50d are electrically connected to the performance board 52 and the performance board 52, and are provided with the socket board 51 in which the some socket 40a-40d was provided. The test unit units 50a to 50d are provided so as to be replaceable with respect to the test head body.

In the present embodiment, a plurality of socket boards 51 (12 in FIG. 4) are provided in the test unit units 50a to 50d, and a plurality (four or six in FIG. 4) to each socket board 51. FIG. Sockets 40a to 40d are provided.

Each test unit unit 50a to 50d has a different size, arrangement (pitch or planar direction) or number of sockets 40a to 40d, and the size and arrangement of the sockets 40a to 40d according to the type of IC device under test. And the number are appropriately set. For example, in the arrangement (especially the pitch) of the sockets 40a to 40d, the electrical characteristics of the test unit 50a to 50d are best in consideration of the characteristics of the electrical signals branched in the test unit 50a to 50d. It is set appropriately so that the state of, i.e., the performance of the test main device 6 can be withdrawn as much as possible.

In the present embodiment, the arrangement change of the sockets 40a to 40d as described above is performed for each of the socket boards 51 provided in the test unit units 50a to 50d in plural, whereby the test unit units 50a to 50d are formed. It is possible to further improve the characteristics of the electric signal branched in the quadrature.

Referring to Fig. 4, the socket 40b of the test unit 50b is smaller than the socket 40a of the test unit 50a, the pitch is also small, and the socket board 51 It is gathered and installed in the center part of). Moreover, the socket 40c of the test part unit 50c is installed in the state which rotated 90 degrees with respect to the socket 40a of the test part unit 50a. In addition, four sockets 40a of the test unit 50a are provided on each socket board 51, whereas six sockets 40d of the test unit 50d are provided on each socket board 51. It is provided and the number increases compared with the socket 40a of the test part unit 50a.

Although each test part unit 50a-50d differs in size, arrangement | positioning, or number of sockets 40a-40d as mentioned above, the external shape is the same size. Thus, by making the external shape of each test part unit 50a-50d the same size, each test part unit 50a-, without changing the apparatus which conveys the test tray 500, the apparatus which drives the pusher 30, etc. is not changed. With respect to 50d), it is possible to cope with the same handler 1.

The handler 1 will be described below.

As shown in Fig. 2, the IC storage unit 200 of the handler 1 has a pre-test IC stocker 201 for storing the IC device before the test, and a test termination for storing IC devices classified according to the test results. An IC stocker 202 is provided.

In the pre-test IC stocker 201 shown in Fig. 2, a customer tray containing IC devices for which a test is performed in the future is stacked and held. In addition, the test tray IC stocker 202 stacks and holds a customer tray in which IC devices classified after being tested are stored.

As shown in FIG. 2, the customer tray stored in the IC stocker 201 before the test is connected to the device substrate by the tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. It is conveyed to the window part 306 of the loader part 300 under the 105. In the loader section 300, the IC device under test loaded on the customer tray is once transferred to the presizer 305 by the XY transfer apparatus 304 (corresponding to the transfer apparatus of the present invention). After correcting the positions of the IC devices under test, the IC devices transferred to the presizer 305 are further stopped by the loader unit 300 using the XY transfer device 304. Transfer it to the test tray 500 which is present.

As shown in FIG. 2, the XY conveying apparatus 304 which transfers an IC device under test from the customer tray to the test tray 500, and loads is equipped with two rails 301 hypothesized on the upper part of the apparatus substrate 105, and The movable rail 302 which can reciprocate (this direction is called a Y-axis direction) between the test tray 500 and the customer tray by these two rails 301, and this movable arm 302 It is supported and has the movable head 303 which can move along the movable arm 302 to an X-axis direction.

A plurality of (four in Fig. 5) suction heads 313 are mounted to the movable head 303 of the XY transfer device 304 in the downward direction, and the suction head 313 is used to remove the IC under test from the customer tray. The device 2 is attracted and the IC device 2 under test is stored in the test tray 500.

In the handler 1 according to the present embodiment, the test part units 50 (for example, the test part units 50a, 50b, 50d) and the test part unit 50c have different plane directions of the sockets 40. ), And the movable head 303 of the XY conveying apparatus 304 is rotatable, as shown to FIG. 5 (a)-(b). That is, each suction head 313 sucks the IC device 2 under test, as shown in Fig. 5 (a), and rotates by 90 ° as shown in Fig. 5 (b), The rotated IC device 2 under test is stored in the test tray 500. In this way, since the XY conveying apparatus 304 can change the plane direction of the IC device 2 by 90 degrees, the handler 1 includes the test unit units 50a, 50b, 50d and the test. It may correspond to any of the subunits 50c.

The rotation of the movable head 303 is preferably performed by the handler 1 reading the information of the test unit 50 used, and automatically performed based on the read information.

In addition, although the movable head 303 of the XY conveyance apparatus 304 was comprised in the said embodiment, you may comprise so that each adsorption head 313 provided in the movable head 303 may rotate instead. .

In the handler 1 according to the present embodiment, instead of rotating the movable head 303 of the XY transport apparatus 304, as shown in FIG. 6, the presizer 305 (witness of the present invention) May be rotated or the pitch can be changed. The presizer 305 of this example includes a substrate 305 and movable parts 315 provided in the substrate 305 in a plurality (four in FIG. 6), and the movable part 315 has a concave device housing portion ( 325 is formed. The device housing portion 325 has a shape corresponding to the shape of the IC device 2 under test.

In the presizer 305 of this example, as shown in Figs. 6 (a) to 6 (b), each of the movable parts 315 in which the IC device 2 is accommodated in the device accommodating part 325 is rotated 90 degrees or more. By moving in the X-axis direction / Y-axis direction, the plane direction of the IC device 2 can be changed by 90 degrees or the pitch can be changed.

The test tray 500 in which the IC device 2 under test is loaded from the loader 300 is transferred to the thermostat 101 of the chamber 100 and then to the test chamber 102, and thus the test chamber 102. Each IC device 2 under test is tested.

As shown in FIG. 3, a test unit unit 50 of the test head 5 is disposed below the test chamber 102. The test tray 500 in which the IC device 2 is housed is transported on this test unit unit 50. The IC device 2 accommodated in the test tray 500 is in close contact with the socket 40 installed in the test unit 50 by pressing the pusher 30. As a result, the external terminal of the IC device 2 is electrically contacted with the connection terminal of the socket 40, and a test signal is applied to the IC device 2 in this state so that the test is performed. When the test is completed, the test tray 500 is de-heated in the heat removal tank 103 to return the temperature of the IC device 2 to room temperature, and then discharged to the unloader 400 shown in FIG. 2. do.

As shown in Fig. 2, in the unloader 400, XY transport apparatuses 404 and 404 having the same structure as the XY transport apparatus 304 provided in the loader 300 are provided. From the test tray 500 carried by the apparatus 404 and 404 to the unloader part 400, the IC device 2 tested and transferred to the customer tray is loaded.

As illustrated in FIG. 7, the test tray 500 according to the present embodiment includes a plurality of carriers 516 and a frame 510 for detachably supporting the carriers 516.

As shown in Figs. 7 and 8, the carrier 516 detaches a plurality (four in Fig. 7) carrier cores 518 (corresponding to the electronic component housing member of the present invention) and the carrier core 518. In this freely supporting carrier body 517 (frame 510) Corresponding to the support of the present invention). The plurality of carrier cores 518 are disposed in the carrier body 517 so as to correspond to the positions of the sockets 40 of the test unit 50. For example, in the example shown in FIG. 7, the carrier cores 518 are arranged in two rows by two columns.

The carrier body 517 has a frame shape in which a position corresponding to the carrier core 518 is opened, and includes a rotatable hook 517a extending downward.

As shown in FIG. 8, the coupling part 518a is formed in the carrier core 518 (it abbreviate | omits in FIG. 7). The hook 517a of the carrier body 517 is coupled to the engaging portion 518a of the carrier core 518 so that the carrier core 518 is supported by the carrier body 517. Then, as the hook 517a rotates to disengage the hook 517a and the engaging portion 518a, the carrier core 518 is separated from the carrier body 517 so as to be replaced with another carrier core 518. do.

Each carrier core 518 is provided with a device housing portion 519 corresponding to the shape of the IC device 2 under test, and the IC device under test 2 is coupled to the device housing portion 519. It is stored. In addition, the structure regarding the relationship with the pusher 30 of the carrier core 518 is mentioned later.

As shown in Fig. 7, the carrier core 518 is prepared in plural kinds according to the type of test unit unit 50 (size, arrangement and number of sockets 40), and the size, arrangement and It is appropriately selected according to the number, and is installed in the carrier body 517. The device housing part 519 of each carrier core 518 is formed in the position corresponding to the position of the socket 40 in the carrier core 518. For example, in the example shown in FIG. 7, each device accommodating portion 519 of each carrier core 518 is formed at the center of the carrier core 518.

The hook 517a of the carrier body 517 is automatically rotatable by the drive device (not shown) provided in the handler 1. In addition, the handler 1 accommodates a plurality of types of carrier cores 518, automatically selects a carrier core 518 corresponding to the type of the IC device 2 under test, to the bottom of the carrier body 517. It is possible to carry. Thereby, the desired carrier core 518 can be automatically installed in the carrier body 517, and furthermore, the test tray 500, and the single handler 1 can cope with the plurality of test unit units 50. It is supposed to be done.

The exchange of the carrier core 518 is preferably performed by the handler 1 reading the information of the test unit 50 used and automatically performed based on the read information.

In the above example, the number of sockets 40 in the socket board 51 is four. However, in the case of six sockets 40 in the socket board 51, six carrier cores 518 are provided. The carrier 516 to support is prepared, and the carrier 516 may be supported by the frame 510 of the test tray 500. The exchange of the carrier 516 in the test tray 500 may also be performed automatically by the handler 1.

According to the test tray 500, the carrier core 518 according to the type (size, arrangement or number of sockets 40) of the test unit 50 to be used is prepared, and the appropriately selected carrier core 518 is prepared. By attaching and detaching freely to the carrier body 517 (test tray 500), it is possible to respond to the plurality of test unit units 50.

On the other hand, the pusher 30 is provided above the test unit 50, and is held in the match plate 60 as shown in Figs. The match plate 60 is placed on the Z-axis driving device 70 so as to be positioned above the test unit 50 and to allow the test tray 500 to be inserted between the pusher 30 and the socket 40. Supported. The pusher 30 held in the match plate 60 is free to move in the Z-axis direction by the driving of the Z-axis driving device 70, thereby the IC device 2 mounted on the test tray 500. Can be brought into close contact with the socket 40.

In the carrier core 518 described above, as shown in Fig. 9, a plurality of protrusions 521 are formed in the Z-axis direction, and a plurality of protrusions 521 are formed in the recess grooves 520. It is.

Each of the protrusions 521 in the present embodiment is substantially L-shaped when viewed in a plane consisting of a protrusion extending in the X-axis direction and a protrusion extending in the Y-axis direction. The L-shaped protrusions 521 are formed in a plurality of rows at predetermined intervals so as to sequentially increase from one angle of the carrier core 518 toward their diagonals (this is referred to as "diagonal portions"). 521 is cut off and cut off. This cutout portion is the device housing portion 519 described above, and the IC device 2 under test is stored therein. The IC device 2 dropped into the device housing portion 519 is positioned in contact with an end portion of the cutout 521 cut and cut. On the other hand, as shown in FIG. 11, the upper part of the edge part of the notched protrusion part 521 is cut obliquely so that the IC device 2 may fall to the device accommodating part 519, and it is easy to fall.

In the carrier core 518, as shown in Figs. 12A to 12C, by changing the cutout amount of the protrusion 521, it is possible to correspond to sockets 40 having different sizes, pitches, or planar directions. have. That is, the carrier core 518 is produced by first not having the cutout of the protrusion 521, and by cutting the predetermined amount of the protrusion 521 according to the size, pitch or plane direction of the socket 40, The thing corresponding to the socket 40 can be manufactured easily.

The pusher 30 in this embodiment is provided with the pusher block 30a as shown in FIG. 10 corresponding to the number of the sockets 40. In this pusher block 30a, the bottom part is a device pressing part which presses the IC device 2 under test stored in the device accommodating part 519 of the carrier core 518.

 In the device pressing portion of the pusher block 30a, a plurality of convex portions 311 which can be inserted into the plurality of concave grooves 520 of the carrier core 518 are provided, and the plurality of convex portions 311 are mutually provided. The concave portion 310 into which the plurality of protrusions 521 of the carrier core 518 can be inserted is formed. The convex part 311 and the concave part 310 of the pusher block 30a in this embodiment correspond to the shape of the concave groove 520 and the protruding part 521 of the carrier core 518, when viewed in plan view. It becomes approximately L phase.

 The convex part 311 of the pusher block 30a is a protrusion part in the carrier core 518 where the cutout part (device storage part 519) of the protrusion part 521 is the smallest among the several types of carrier core 518. It is formed so as not to interfere with 521. Since the convex part 311 of the pusher block 30a formed in this way does not interfere with the protrusion part 521 of the carrier core 518 which the cutout part of the protrusion part 521 has a large, it is a some kind of pusher block 30a. It is possible to correspond to the longitudinal carrier core 518.

When the pusher block 30a is brought close to the IC device 2 stored in the device accommodating portion 519 of the carrier core 518, as shown in Figs. 11 and 12, the convex portion of the pusher block 30a is shown. 311 is inserted into the recess 520 of the carrier core 518, and the protrusion 521 of the carrier core 518 is inserted into the recess 310 of the pusher block 30a. At the same time, the convex portion 311 of the pusher block 30a is inserted into the cutout portion (device storage portion 519) of the carrier core 518, and the insertion of the convex portion 311 of the pusher block 30a. By the part, the IC device 2 is pressed down to be in close contact with the socket 40.

As shown in Figs. 11 (a), (b) and 12 (a)-(c), even if the type of carrier core 518, that is, the size, pitch, or plane direction of the socket 40 is changed, the pusher block It is possible to press the IC device 2 in the above manner without changing 30a (pusher 30).

On the other hand, when the number of sockets 40 in the socket board 51 is changed (for example, from four to six), the match plate 60 is the number corresponding to the number of sockets 40 (eg, For example, the pushers 30 including the six pusher blocks 30a may be replaced with the held ones.

As described above, according to the handler 1 and the test tray 500 according to the present embodiment, the same handler 1 is applied to a plurality of test unit units 50 having different sizes, arrangements or numbers of sockets 40. It is possible.

The embodiments described above are described to facilitate understanding of the present invention and are not described to limit the present invention. Therefore, each element disclosed by the said embodiment is the meaning including all the design changes and equivalents which belong to the technical scope of this invention.

13 and 14 show another example of the carrier core 518 and the pusher block 30a. As shown in Fig. 13, the carrier core 518A is provided with a protrusion 521X extending in the Z-axis direction and extending in the X-axis direction and a protrusion 521Y extending in the Y-axis direction. The protruding portion 521X and the protruding portion 521Y are cut out at approximately the center of the carrier core 518A, and the cutout portion becomes the device housing portion 519. That is, the protruding portion 521X and the protruding portion 521Y are located around the cutout portion (device storage portion 519).

In the carrier core 518A, as shown in Figs. 13A, 13B, and 14A, 14B, by changing the cut amounts of the protrusions 521X and 521Y, the size, The pitch or planar direction may correspond to different sockets 40.

On the other hand, as shown in Fig. 14, the bottom portion (device pressing portion) of the pusher block 30A has a convex portion extending in the X-axis direction and the Y-axis direction centering on the substantially center portion of the device pressing portion ( 311A is formed. The convex portion 311A includes a carrier core having the smallest cutouts (device storage portion 519) of the protruding portions 521X and 521Y among the plurality of carrier cores 518A. It is formed so as not to interfere with the protrusions 521X and 521Y in 518A. Since the convex portion 311A of the pusher block 30A thus formed does not interfere with the protrusions 521X and 521Y of the carrier core 518A having large cutouts of the protrusions 521X and 521Y, It is possible to correspond to the plurality of types of carrier cores 518A with a kind of pusher block 30A.

The present invention is useful for the efficient use of electronic component handling devices for a plurality of test unit units.

Claims (35)

As an electronic component handling apparatus which can convey the test tray which accommodated the some electronic component to the position of the some socket which the test part unit provided in the test head has, According to the type of the test unit used, the electronic component accommodating member of the test tray can be exchanged so that the electronic component can be mounted in the socket of the test unit. The test tray includes a hook-shaped movable member capable of holding and releasing the electronic component accommodating member, The electronic component accommodating member has a coupling portion to which the hook-shaped movable member is coupled, The electronic component handling apparatus is provided with a driving device for driving the hook-shaped movable member. delete delete delete delete delete The method according to claim 1, And a plurality of protrusions provided in the Z-axis direction in the electronic component accommodating member, wherein the electronic component is accommodated in a cutout portion in which the protrusions are cut out. The method of claim 7, And a plurality of protrusions extending in the X axis direction and a plurality of protrusions extending in the Y axis direction. The method of claim 7, The protrusions have an L-shape when viewed in a plan view, and are formed in a plurality of rows at intervals so as to sequentially increase from one angle of the electronic component accommodating member toward the diagonal. And the cutout is formed at positions of the one angle and the diagonal angle. The method according to claim 8, The cutout portion is formed at the center of the electronic component accommodating member, and the protrusion portion extending in the X-axis direction and the protrusion portion extending in the Y-axis direction are positioned around the cutout portion. Electronic component handling device. The method of claim 7, In the electronic component pressing portion of the pusher of the electronic component handling device, a plurality of convex portions that can be inserted between the plurality of protrusions in the electronic component accommodating member are provided, and the plurality of the convex portions mutually intersect the electronic component. An electronic component handling apparatus, characterized in that a concave portion into which a protrusion of a storage member can be inserted. The method of claim 11, The convex portion of the pusher is formed so as not to interfere with the protruding portion in the electronic component storage member having the smallest cutout portion among a plurality of types of electronic component storage members. The method of claim 11, In the convex portion of the pusher is a planar formed in a plurality of lines at intervals so as to be sequentially enlarged toward the diagonal from the one side of the rectangular convex portion and the one side of the electronic component pressing portion as viewed in a plane installed on the corner of the electronic component pressing portion Electronic component handling device, characterized in that the L-shaped convex portion present. The method of claim 11, The convex portion of the pusher extends in the X-axis direction and the Y-axis direction with respect to the center of the electronic component pressing portion, characterized in that the electronic component handling device. delete delete delete delete delete delete delete A test tray which accommodates a plurality of electronic components and is installed to be conveyed from the electronic component handling apparatus to the test section, The test tray includes an electronic component accommodating member, and a support for detachably supporting the electronic component accommodating member. The support body is provided with a hook-like movable member that can hold and release the electronic component accommodating member, And said coupling part to which said hook-shaped movable member engages is formed in said electronic component accommodation member. delete 23. The method of claim 22, The electronic component accommodating member is provided with a plurality of protrusions provided in the Z-axis direction, and the electronic component is accommodated in the cutout portion in which the protrusions are cut out. 27. The method of claim 24, And a plurality of protrusions extending in the X-axis direction and a plurality of protrusions extending and extending in the Y-axis direction. 27. The method of claim 24, The protrusions have an L-shape when viewed in a plan view, and are formed in a plurality of rows at intervals so as to sequentially increase from one angle of the electronic component accommodating member toward the diagonal. The cutout is a test tray, characterized in that formed in the position of the one angle and the diagonal. The method according to claim 25, The cutout portion is formed at the center of the electronic component accommodating member, and the protrusion portion extending in the X-axis direction and the protrusion portion extending in the Y-axis direction are positioned around the cutout portion. Test tray. delete delete delete delete delete delete delete delete

Images