JP2000206194A - Tray for electronic component board test and test device of electronic component board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the throughput of test, enable tests to be carried out at an accurate temperature, and realize a miniaturization, simplification and cost reduction of a test device. SOLUTION: This tray 20 for test has an insert 30 in which a holding trench is formed into which both side end portions of a memory module are movable inserted in such a manner that a board terminals 12 of the memory module 10 are exposed, and a tray main body 20a which holds the insert 30 in such a manner that the board terminals 12 of the memory module 10 are exposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component substrate test tray for testing an electronic component substrate in a state in which the electronic component substrate such as a memory module is accommodated, and an electronic component substrate using the test tray. Test equipment.

[0002]

2. Description of the Related Art In a process of manufacturing an electronic component substrate such as a memory module, a test device for testing a finally manufactured memory module is required. As one type of such a test apparatus, an apparatus for testing a memory module under a temperature condition higher or lower than room temperature is known. This is because, as a characteristic of the memory module, it is guaranteed that the memory module operates well even at high or low temperature.

When a high-temperature test is performed in a conventional memory module test apparatus, the memory module before the test is heated by a preheating unit in the apparatus, and the heated memory module is measured by a pick-and-place operation. To a high-temperature test by preheating applied to the memory module.

When a low-temperature test is to be performed in a conventional memory module testing apparatus, the memory module before the test is cooled by a cooling unit in the apparatus, and the cooled memory module is picked and placed. It is conceivable that a low-temperature test is performed by transporting the memory module to the measurement unit by operation and using the cold applied to the memory module.

[0005]

However, in such a conventional test apparatus, since the memory module is transported from the preheating section or the cooling section to the measuring section by pick-and-place operation, the test throughput is very poor. .
In addition, the temperature of the memory module changes before the memory module is transported to the measuring unit, and the temperature accuracy at the measuring unit is poor, and it is difficult to perform a test at an accurate temperature.

In particular, in a low-temperature test, dew condensation may occur on the surface of a memory module cooled to a low temperature. As a practical matter, it has been difficult to perform a low-temperature test with a conventional test apparatus. If condensation forms on the memory module,
This is because the condensed water adheres to the terminals or the socket terminals of the memory module and adversely affects the test.

In order to solve such inconvenience, it is conceivable to cover all the preheating section (or cooling section) and the measuring section with a chamber and maintain the inside of the chamber at a predetermined temperature. However, causing the pick and place operation of the memory module inside the chamber is
The mechanism becomes complicated and the chamber must be designed large, which leads to an increase in size, complexity and cost of the test apparatus, which is not preferable.

[0008] The present invention has been made in view of such circumstances, improves the test throughput, enables a test at an accurate temperature, and can reduce the size, simplification, and cost of a test apparatus. It is an object of the present invention to provide an electronic component substrate test tray and an electronic component substrate test apparatus using the test tray.

[0009]

In order to achieve the above object, an electronic component board test tray according to the present invention has two side edges of the electronic component board so that the board terminals of the electronic component board are exposed. The electronic device includes an insert having a holding groove that is movably inserted therein, and a tray body that holds the insert so that board terminals of the electronic component board are exposed.

[0010] It is preferable that the insert is provided with first positioning means for positioning a board terminal of the electronic component board with respect to a board pusher for pushing the board terminal into a test socket.

The insert has a second terminal for positioning a board terminal of the electronic component board and a test socket.
Preferably, a positioning means is provided.

Preferably, a plurality of inserts are positioned and held on the tray body.

An electronic component substrate testing apparatus according to the present invention comprises:
The electronic component board test tray, a test socket into which the board terminal of the electronic component board is removably inserted, and an electronic component board in a state where the electronic component board is mounted in the electronic component board test tray. And a board pusher for pushing the substrate terminal into the test socket.

[0014] It is preferable that the board pusher is provided with guide grooves into which both end portions of the electronic component substrate are inserted to calibrate the inclination of the electronic component substrate.

An electronic component substrate testing apparatus according to the present invention comprises:
It is preferable to further include a match plate that holds the board pusher movably.

An electronic component substrate testing apparatus according to the present invention comprises:
It is preferable that the apparatus further includes driving means for moving the match plate toward and away from the electronic component substrate test tray.

In order to move the electronic component substrate in the electronic component substrate test tray with the board pusher and to push the substrate terminal of the electronic component substrate into the socket, the driving means includes: Preferably, an auxiliary driving means for moving the board pusher is provided.

An electronic component substrate testing apparatus according to the present invention comprises:
It is preferable that a tray transport base for elastically holding the electronic component substrate test tray on the test socket at predetermined intervals is further provided.

It is preferable that a return spring is provided inside the test socket so as to urge the board terminal of the electronic component substrate out of the test socket.

In the present invention, as the electronic component substrate,
Although not particularly limited, a memory module is exemplified.

[0021]

In the electronic component board test apparatus using the electronic component board test tray according to the present invention, the inside of the test apparatus is moved while the plurality of electronic component boards are held on the test tray, and the test measurement section is operated. In addition, a plurality of electronic component substrates can be tested at the same time, and the test throughput is greatly improved. Further, in the test and measurement section, it is not necessary to perform the pick and place operation of the electronic component substrate, so that the internal structure of the test apparatus can be simplified, and the size, simplification, and cost reduction of the entire test apparatus can be reduced. Can be planned. Further, by disposing all or a part of the test apparatus according to the present invention inside the chamber and maintaining the inside of the chamber at a constant high or low temperature, the temperature accuracy at the time of testing the electronic component substrate is improved, Accurate testing is possible.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. FIG. 1 is a sectional view of a main part of a memory module test apparatus according to an embodiment of the present invention, FIG. 2 is a partially exploded perspective view of a memory module test tray used in the test apparatus shown in FIG. 1, and FIG. FIG. 2 (B) is a plan view of the insert shown in FIG. 2, and FIG.
4 (C) is a cross-sectional view of the main part when the insert is attached to the test tray, FIG. 4 is a partially exploded perspective view of the socket, and FIG. 5 is a VV line shown in FIG. 6 (A) to 6 (D) are process diagrams showing the operation of the test apparatus shown in FIG. 1, and FIGS. 7 (A) to 7 (C) are process diagrams showing a continuation of FIG. 8A is a schematic plan view showing the entire configuration of the test apparatus, FIG. 8B is a schematic sectional view taken along the line VIIIB-VIIIB shown in FIG. 9A, and FIG. 9 is used in the test apparatus shown in FIG. FIG. 10 is a schematic perspective view of the memory module transfer device, and FIG.
FIG. 3 is a perspective view showing an example of trays 202 and 204 shown in FIG.

First Embodiment As shown in FIGS. 1 and 2, a memory module test apparatus according to the present embodiment is configured such that a memory module 10 as an electronic component substrate is stored in a memory module test tray 20 inside. This is an apparatus for simultaneously testing a plurality of memory modules 10.

As shown in detail in FIG. 2, the memory module test tray 20 includes an insert 30 in which the memory module 10 is removably accommodated, and a plurality of inserts 3.
And a tray main body 20a that holds the 0s in a line along the X direction. The tray main body 20a has a rectangular upper frame 22 and a rectangular lower frame 24 of the same size, and these frames 22 and 24 are connected by a plurality of rod-like spacers 26 in a substantially parallel manner.

Upper frame 22 and lower frame 24
In the figure, holding holes 21 and 23 for penetrating and holding the respective inserts 30 are formed at predetermined intervals along the X direction. In the vicinity of both ends in the Y direction (perpendicular to the X direction in the horizontal plane) of the holding hole 21 formed in the upper frame 22, a pair of positioning holes 25 are formed so as to be displaced in the X direction. As shown in FIG. 3C, positioning pins 42 formed on the inserts 30 are fitted into these positioning holes 25, and each insert 30 is positioned with respect to the tray main body 20a. Note that pin 4
A cap 43 is attached to the lower end of 2, and the insert 30 is prevented from coming off with respect to the tray main body 20a.

As shown in FIGS. 2 and 3A and 3B, the insert 30 has a pair of side walls 32 in which inverted trapezoidal cutouts 31 are formed. These side walls 32 are integrated by end walls 33a and 33b so that a housing space 34 is formed. Each insert 30 is made of, for example, a synthetic resin.

As shown in FIG. 3B, bosses 35 projecting from the accommodation space 34 are formed inside the end walls 33a and 33b. A groove 36 and a holding bottom wall 37 are formed. FIG. 3 (A)
As shown in (B) and (B), the bottom of the accommodation space 34 formed between the pair of side plates 32 is a through hole 38 between the opposing bosses 35 and 35, and the holding groove 36 is formed.
Module 10 held between the holding bottom walls 37
Are exposed downward through the through holes 38.

Both ends of the memory module 10 can be detachably inserted into the holding groove 36 from above, and as shown in FIG. Hold both sides of the memory module 10 with the holding grooves 3
A tapered guide groove 42 for guiding into the inside 6 is formed. Inside the insert 30, the memory module 1
0 is positioned by the holding bottom wall 37 of the holding groove 36 with a slight clearance in the X and Y directions, held by its own weight, and accommodated with a relatively wide clearance so as not to come into contact with other parts of the insert 30. A space in the space 34 is formed.

A flange 39 is integrally formed on the upper portions of the end walls 33a and 33b. As shown in FIG. 2, the flange 39 is placed on the edge of the holding hole of the upper frame 22 in a state where the insert 30 is penetrated and held in the holding holes 21 and 23 of the tray body 20a.
From falling down from the holding holes 21 and 23. As shown in FIGS. 2 and 3, positioning pins 42 project from the lower surface of the flange 39. These positioning pins 42 are formed on the upper frame 22 as shown in FIG. 3C. Into the positioning hole 25.

At the lower end of the positioning pin 42, a cap 4
3 is attached, and the insert 30 is prevented from coming off upward with respect to the tray main body 20a. As a result, each insert 30 is positioned and held with respect to the tray main body 20a. However, it is preferable that the clearance between the positioning hole 25 and the positioning pin 42 is configured such that the insert 30 can be moved by about 0.5 to 1.5 mm in the X and Y directions with respect to the tray main body 20a. As described later, each insert 30 needs to be positioned with respect to each board pusher 76 and each socket 50, and needs to be movable with respect to the tray main body 20a. Further, since each insert 30 needs to be slightly movable in the Z direction with respect to the tray main body 20a, the cap 43 shown in FIG.
It is attached to the lower end of the positioning pin 42 so as to allow relative movement in the Z direction between the insert 30 and the tray main body 20a. Note that the clearance of the lower end outer shape of the insert 30 with respect to the holding hole 23 formed in the lower frame 24 is substantially the same as the clearance between the positioning hole 25 and the positioning pin 42, and the insert 30 is required for the tray body 20a. The inclination is prevented as described above.

In particular, as shown in FIG.
And 33b, an upper positioning hole 40 (first positioning means) formed so as to penetrate the flange 39,
A lower positioning hole 41 (second positioning means) is formed at the bottom of the end walls 33a and 33b. Positioning pins 80 formed on the holding plate 78 of the board pusher 76 shown in FIG. 1 are inserted into the upper positioning holes 40,
The board pusher 76 and the insert 30 are positioned. A positioning pin 56 formed on the socket guide 52 of the test socket 50 shown in FIG. 1 is inserted into the lower positioning hole 41, and the memory module held by the insert 30 with respect to the test socket 50. The ten substrate terminals 12 are positioned.

As shown in FIG. 1, the test tray 20 holding the insert 30 is placed on a tray transport base 44 and can be transported, for example, in the X direction. The tray transport base 44 is elastically held by a means such as a spring 46 (or a pressure cylinder) with respect to a test head base 48 holding the socket 50. As a result, the test tray 20 is placed on the tray transport base 44 on the test head base 48 by the socket 5.
A spring force is applied in a direction away from zero.

As shown in FIG. 4, the test head base 4
On socket 8, a plurality of sockets 50 are arranged along the X direction via a common test board 64 and an individual test board 66. The number of sockets 50 shown in FIG. 4 depends on the number of inserts 3 held in the test tray 20 shown in FIG.
It is preferable that the number of 0 is 1 / integer. Also,
The arrangement pitch between the sockets 50 shown in FIG. 4 in the X direction is preferably an integral multiple of the arrangement pitch in the X direction of the insert 30 shown in FIG.

For example, when 16 inserts 30 shown in FIG. 2 are arranged along the X direction, the socket 50 shown in FIG.
It is arranged in the number of arrangements. Further, each socket 5 shown in FIG.
In the X direction arrangement pitch between 0, the insert 30 shown in FIG.
Is twice the arrangement pitch in the X direction. By arranging the sockets 50 with such arrangement numbers and arrangement pitches, the test of all the memory modules 10 held in the test tray 20 is divided into a plurality of times (for example, twice) as shown below. It can be performed. That is, first, among the memory modules 10 held in each insert 30 of the test tray 20 shown in FIG. 2, the odd-numbered (or even-numbered) memory modules 1 along the X direction are set.
The substrate terminal 12 of the No. 0 is inserted into the socket groove 51 of each socket 50 shown in FIG. Thereafter, the test tray 20 shown in FIG. 2 is moved along the X direction at the same interval as the pitch of the inserts 30 in the X direction, and the board terminals of the even-numbered (or odd-numbered) memory modules 10 along the X direction are moved. 12 with each socket 50 shown in FIG.
And the test is performed at the same time. In this way, all the memory modules 10 held in the test tray 20 can be tested.

As shown in FIG. 4, each socket 50
It has a socket body 53 having a socket groove 51 formed along the direction, and a pedestal 68 for holding the socket body 53. The pedestal 68 is connected to the upper part of the individual test board 66. On the upper part of the pedestal 68, on the outer periphery of the socket main body 53, a socket guide 52 having an elongated through hole 54 formed in the Y direction is mounted, and between the both ends of the socket main body 53 in the Y direction and the socket guide 52. A relief groove 55 corresponding to both ends of the through hole 54 is formed.
As shown in FIG. 1, the bosses 35 formed at the lower ends of the end walls 33 a and 33 b of the insert 30 enter these escape grooves 55, and both ends are held in the holding grooves 36 of the boss 35. A board terminal 12 of a certain memory module 10
However, it can be conveniently inserted into the socket groove 51 of the socket 50.

As shown in FIG. 5, a socket terminal 58 is disposed inside the socket groove 51 of the socket 50. The socket terminal 58 is electrically connected to the board terminal 12 in a state where the board terminal 12 formed at the lower end of the memory module 10 is inserted into the inside of the socket groove 51. The socket terminal 58 includes a pedestal 68, an individual test board 66, a common test board 64, and a test head base 48.
The test signal generation (not shown)
It is connected to a receiving device, and can read a test result for each memory module 10.

In this embodiment, as shown in FIG. 5, a pad 60 for receiving the lower end of the module 10 and a return spring 62 for applying a spring force for pushing the pad 60 upward are provided at the bottom of the socket groove 51. Is provided. Therefore, when no external force acts on the memory module 10, the lower end of the memory module 10 is pushed upward from the socket groove 51.

As shown in FIG. 1, a Z-axis drive unit 70 (for moving the board pusher 76 in the vertical direction (Z direction)) is provided above the test tray 20 held on the transport base 44. Drive means). The Z-axis drive unit 70 has a common drive plate 72, a match plate 74, and a holding plate 78 that holds a board pusher 76.

On the lower surface of the board pusher 76, a pressing surface 71 for finally pressing the upper end of each memory module 10 is formed. Guide projections 73 projecting downward from the lower surface of the board pusher 76 are integrally formed at the positions of both ends in the Y direction of the pressing surface 71. Guide projection 73
Can enter the inside of the accommodation space 34 of the insert 30.

Inside the guide projection 73, both upper end portions of the memory module 10 are inserted, and the guide groove 77 for calibrating the inclination in the insert 30 of the module 10 is provided.
Is formed. The lower end of the guide groove 77 has a tapered portion 7
5 are formed so that both upper end portions of the memory module 10 can be easily inserted into the guide grooves 77.

A holding plate 78 for holding the board pusher 76
Positioning pins 80 are provided on the lower surface of both ends in the Y direction. When the holding plate 78 moves downward in the Z direction, the positioning pin 80
0 to position the board pusher 76 and the memory module 10.

The board pusher 76 and the holding plate 78
A plurality of sockets 50 are arranged along the X direction at intervals and the number of arrangements corresponding to the X direction arrangement pitch, and each holding plate 78 is fixed to the lower end of each of the plurality of suspension rods 82. The upper end of the suspension rod 82 is fixed to the lower surface of the individual drive plate 84. A plurality of individual driving plates 84 are also arranged along the X direction at intervals and the number of arrangements corresponding to the arrangement pitch of the socket 50 in the X direction.
Are mounted movably in the Z direction in the respective accommodation grooves 86 formed on the upper surface of the single match plate 74 along the X direction. A mortar-shaped taper is formed on the inner side wall of each accommodation groove 86, and the board pusher 76 is suspended and held on the match plate 74 via the holding plate 78, the suspension rod 82 and the individual driving plate 84. In this state, the individual driving plate 84 is positioned and held in the accommodation groove 86.

The match plate 74 and the common drive plate 72 are connected to the connecting block 9 as shown in FIGS.
2, which are movable in the Z direction while maintaining the same interval. Match plate 7
A drive mechanism (such as a pressure cylinder or a motor actuator) for moving the common drive plate 4 and the common drive plate 72 in the Z direction is not shown.

As shown in FIG. 1, on the lower surface of the common drive plate 72, a pair of contact cylinders 88 (auxiliary drive means) are mounted in the Y direction corresponding to the upper portions of the individual drive plates 84. Each contact cylinder 88 has a pressing pad 90
Are provided so as to be freely driven in the Z direction, and as described later,
At a predetermined timing, the individual driving plate 84 floating from the match plate 74 can be pressed downward.

Next, the operation of the test apparatus shown in FIG. 1 will be described with reference to FIGS. First, a test tray 20 holding a plurality of memory modules 10 shown in FIG.
As shown in FIG. 1, the socket 50 fixed on the upper portion of the test head base 48 by the tray transport base 44.
Is transported from another position to the position above the
And stops.

Next, from the position shown in FIG.
The Z-axis drive unit 70 is moved down in the Z direction to the position shown in FIG. Then, the positioning pins 80 formed on the lower surface of the holding plate 78 shown in FIG.
Upper positioning holes 4 formed in each insert 30
0, the board pusher 78 and the memory module 10 held by the insert 30 are positioned. At the same time, the guide projections 7 of each board pusher 76
3 enters the inside of the accommodation space 34 of the insert 30,
Both upper ends of the memory module 10 are inserted into the guide grooves 77, the inclination of the memory module 10 housed inside the insert 30 is calibrated, and the memory module 10 is moved against the pressing surface 71 of the board pusher 76. It is kept almost vertical. At that time, the holding plate 78 of the board pusher 76 shown in FIG.
The insert 30 is pressed downward together with the tray 20.
However, at that time, the pressing surface 71 of the board pusher shown in FIG. 1 is not completely in contact with the upper end of the memory module 10.

Thereafter, as shown in FIG. 6C, when the drive unit 70 is further moved down in the Z direction,
The lower end of the connection block 92 corresponds to the upper end of the tray transport base 44. Z between match plate 74 and common drive plate 72
Since the test interval 20 does not change and the test tray 20 is held with respect to the transport base 44, the board pusher 76 in contact with the upper surface of the insert 30 moves together with the individual driving plate 84 with respect to the match plate 74. Lifts slightly upward. However, even at that time, the pressing surface 71 of the board pusher 76 shown in FIG. 1 does not completely contact the upper end of the memory module 10 housed inside the insert 30.

Next, as shown in FIG. 6 (D), when the drive unit 70 is further moved down in the Z direction, the connection block 92 causes the tray transport base 44 to move by the force of the spring 46 shown in FIG. Press down against as a result,
Test tray 20 held on tray transport base 44
1 is also pushed down along the Z direction, and the lower end of the boss 35 of the insert 30 shown in FIG.
And the lower end of the memory module 10 comes into contact with the socket 50. At the same time, the positioning pins 56 of the socket 50 enter the lower positioning holes 41 of the insert 30, and the insert 30 and the socket 50 are positioned.

As shown in FIG. 7A, the drive unit 7
When the memory module 10 is further moved downward in the Z direction, the lower end of the memory module 10 shown in FIG. 5 starts to enter the socket groove 51 of the socket 50, and the repulsive force of the socket terminal 58 causes only the memory module 10 to move to its position. Stay in. That is, the memory module 10 includes the insert 3
Since it is stationary against the downward movement of the tray 0 and the tray 20, it is relatively pushed back upward, and as a result, the upper end of the memory module 10 contacts the pressing surface 71 shown in FIG. The tray 20 including the insert 30 other than the memory module 10, the transport base 44, the match plate 74, and the common driving plate 72 will continue to move downward.
However, by mounting a spring mechanism such as a spring at any position of the socket 50 shown in FIG. 1, the insert 30 may be configured to temporarily stop the downward movement together with the memory module 10.

As shown in FIG. 7B, the drive unit 7
0 is further moved downward, the connection block 44 is moved to the mechanical stopper 9 provided on the test head base 48.
4, the lowering movement of the drive unit 70 is stopped. When the drive unit 70 is driven by a motor actuator or the like other than the pressure cylinder, the downward movement may be stopped at an accurate position by numerical control without using the mechanical stopper 94.

Next, as shown in FIG. 7C, the contact cylinder 88 shown in FIG.
Is pushed down, and the individual drive plate 84 floating above the match plate 74 is pushed down. As a result, the pressing surface 71 of the board pusher 76 pushes down the memory module 10, and
As shown in FIG. 5, the lower end of the memory module 10 completely enters the inside of the socket groove 51, and the board terminal 12 is electrically connected to the socket terminal. At this time, FIG.
The contact cylinder 88 shown in FIG.
It is designed so that it has a necessary and sufficient pressing force for inserting the “0” into the socket groove 51 of the socket 50 and does not apply an excessively large force. Memory module 10
Is a mechanical end (not shown) provided in the socket 50
And positioning in the height direction is performed. At this time, the contact cylinder 88 is designed to have a sufficient stroke, absorb a height dimensional error (for example, about 0.3 mm) of the memory module 10, and press the memory module 10 downward with a constant force. I have.

In the state shown in FIG. 7B, if the insert 30 is also configured to temporarily stop the downward movement together with the memory module 10, in the state shown in FIG. With the board pusher 76 shown in FIG.
Along with the memory module 10, the insert 30 is also pushed down.

In the state shown in FIG. 7 (C), as shown in FIG. 5, the substrate terminals 12 of each memory module 10 are electrically connected to the socket terminals 58, and the plurality of memories are accommodated in the tray 20. Testing of module 10 is performed simultaneously.

After the test is completed, the pressing by the contact cylinder 88 shown in FIG. 1 is released, and the drive unit 70 is moved upward. As a result, the tray transport base 44 holding the tray 20 attempts to return to the original tray transport height by a return mechanism such as a spring 46 or a pressure cylinder. The lower end of the memory module 10 is pulled out of the socket groove 51 by the spring force of the return spring 62 mounted on the bottom of the socket groove 51 of the socket 50 shown in FIG. In the present invention, the return spring 62 shown in FIG.
It is possible to use not only a socket having a self-extracting force but also a socket without a self-extracting force.

In this case, since the socket itself has no pulling force, the memory module 10 tries to stay in the socket 50. For this reason, the spring shown in FIG. 1 acts on the tray transport base 44 shown in FIG. 1 so that the force for pulling out the memory module 10 from the socket 50 and the force for lifting the tray 20 together with the insert 30 to the tray transport height are applied. Design lifting force of 46 or pressure cylinder. Note that a force for removing the memory module 10 from the socket is applied to the insert 30 or the socket 50 by a spring or the like that causes a force for separating the insert 30 and the socket 50 when the insert 30 and the socket 50 are positioned. You may respond by mounting.

By adopting such a structure, the memory module 10 can be inserted into and removed from the socket 50 without applying any extra force. Also, even if the insertion of the memory module 10 into the socket 50 fails, the contact cylinder 88 shown in FIG. 1 does not attempt to push down the memory module 10 with a force greater than the insertion force into the socket 50. There is little damage to the module 10 and no extra load acts on the tray 20.

In the memory module test apparatus using the test tray 20 according to the present embodiment, the test tray 20
It is possible to move the inside of the test apparatus while holding the plurality of memory modules 10 at the same time, and to simultaneously test the plurality of memory modules 10 in the test measurement unit,
Test throughput is greatly improved. In the test and measurement section, the pick-and-
There is no need to perform a place operation, the internal structure of the test apparatus can be simplified, and the size, simplification, and cost of the entire test apparatus can be reduced. In addition, by placing all or a part of the test apparatus according to the present embodiment inside the chamber and maintaining the inside of the chamber at a constant high or low temperature, the temperature accuracy during the test of the memory module 10 is improved. , Accurate testing becomes possible.

The present invention is not limited to the above embodiment, and various modifications and changes are possible. For example, in the present invention, the means for positioning each member is:
There is no particular limitation, and other means other than the positioning pin and the positioning hole may be employed. Further, the socket body 52 and the socket body 53 may have an integral structure.

Further, the board pusher 76 is not limited to the embodiment shown in FIG. 1. In the present invention, the guide projection 73, the guide groove 77 and the tapered portion 75 are not necessarily essential, and at least the pressing surface 71 may be used. However, it is preferable to provide the positioning pin 80 as the positioning means.

Second Embodiment The above-described apparatus for testing an electronic component substrate of the present invention can be applied to a so-called handler. 2. Description of the Related Art A test apparatus for an electronic component such as a semiconductor device applies a test signal of a predetermined pattern to a memory module to be tested, for example, and measures its electrical characteristics. The test apparatus is generally called an IC tester. In the tester, the memory module is transported to the measuring unit, where the memory module is brought into electrical contact with the socket of the test head, and after the test is completed, the tested memory module is unloaded from the measuring unit, and based on the test results. In many cases, a transfer processing device that classifies the tested memory modules into non-defective and non-defective products is connected. This type of transport processing apparatus is generally called a handler. In the following embodiment, a test unit shown in FIG. 1 is provided with a measuring unit 102 located inside a chamber 100 provided inside a handler 1 shown in FIG. Here is an example of actually incorporating it. Hereinafter, in addition to FIGS. 1 to 7 described above, FIGS.
0, the same members as those described in FIGS. 1 to 7 are denoted by the same reference numerals in FIG.

FIG. 8A is a schematic plan view showing the overall configuration of the handler 1 of the present embodiment, and FIG. 8B is a schematic sectional view taken along the line VIIIB-VIIIB. A memory module storage unit 200 stores a chamber 100 in which a test head base 48 is provided and a memory module 10 to be tested from now on, and classifies and stores the tested memory modules 10. A loader unit 300 for sending the memory module 10 into the chamber 100;
And an unloader section 400 for classifying and taking out the tested memory modules 10 that have been tested.

The handler 1 has a memory module 10
The memory module 10 is tested (inspected) for proper operation in a state where high or low temperature stress is applied to the memory module 1, and according to the test result, the memory module 1 is tested.
The operation test in a state where such a temperature stress is applied is a test tray transported in the handler 1 from a supply tray 202 on which a large number of memory modules 10 to be tested are mounted. 20 (see FIG. 2).

The test tray 20 includes a loader 300
After the memory module 10 is loaded in the chamber 1
00, and each memory module 10 is tested in the measuring section 102 of the chamber 100 while being mounted on the test tray 20. The operation at this time is shown in FIG.
This is the operation described with reference to FIG.

The tested memory module 10 is mounted on the test tray 20 while the unloader section 40 is mounted.
After being transported to 0, each memory module 10 is replaced in the storage tray 204 according to the test result in the unloader section 400.

The memory module storage section 200 has a supply tray 2 full of the memory modules 10 before the test.
02 and a storage tray 204 for storing the tested memory module 10 are stored in drawer shelves independently without being stacked on top of each other.
The tray storage unit 2 on the left side of FIG.
Reference numeral 12 mainly stores the supply tray 202.
The tray storage section 214 on the right side of FIG.
This is a storage section for storing the information.

FIG. 10 shows an example of the supply tray 202 and the storage tray 204. The memory module 10 to be tested is placed in an upright posture with the terminal 12 down with respect to the handler 1. Tray 202 shown in FIG.
It is loaded on 204 and carried out again in the same package. Reference numeral 205 shown in FIG. 5 denotes a protrusion for keeping the memory module 10 in an upright posture. These trays 202, 2
04 may have the same shape or different shapes.

An elevator 206 is provided between the pair of tray storage sections 212 and 214 so as to be able to move up and down. The elevator 206 is controlled to move up and down at least between the lowermost stage and the uppermost stage of each of the tray storage units 212 and 214 by, for example, a ball screw driving device. 2
04 is delivered.

A transfer arm 208 is provided immediately above the tray storage sections 212 and 214 and the elevator 206.
It is provided movably in ± X directions. The transfer arm 208 is driven by ± X
The tray 202 is controlled to move to a desired position in the direction, and receives the trays 202 and 204 placed on the elevator 206 and transfers them to a set plate 210 described later, or conversely receives the trays 202 and 204 placed on the set plate 210 and Hand over to elevator 206.

Further, in this embodiment, the transfer arm 20
8, three set plates 210 are provided. The set plates 210 can be independently raised and lowered in the ± Z directions by, for example, a ball screw driving device, and can be raised and lowered at least between a position lower than the transfer arm 208 and a position higher than the transfer arm 208. . The lower limit position here is the tray 20
The upper limit position is the set position of the trays 202 and 204 (that is, the memory module 10 is moved to the test tray 2 by the XY transfer device 303).
0 and the position where the memory module 10 is received from the test tray 20 by the XY transport device 403).

In this example, three set plates 21
8 is set as the set plate 210 of the loader unit 300 on the left side of FIG.
Set plates 210, 210.

The loader section 300 includes a Y-axis rail 301.
And the supply tray 202 along the Y-axis rail 301.
XY transport device having an X-axis rail 302 capable of moving in the ± Y-axis direction between the device and the test tray 20, and a movable head 304 capable of moving in the ± X-axis direction along the X-axis rail 302 303 is provided.

The movable head 30 of the XY transport device 304
4, a memory module gripping mechanism 500 shown in FIG. 9 is mounted downward. The gripping mechanism 500 shown in FIG.
A fluid pressure cylinder 502 for moving the gripped memory module 10 in the ± Z-axis direction;
It comprises a pair of chucks 504 for grasping both side edges of the "0" and a fluid pressure cylinder 504 for opening and closing the pair of chucks 504. By opening and closing the chuck 504 by the fluid pressure cylinder 504, both side edges of the memory module 10 can be grasped or released, and the grasped memory module 10 can be moved up and down by the fluid pressure cylinder 502.

As described above, when the gripping mechanism 500 moves while grasping the memory module 10, the window 3 is moved.
The memory module 10 is gripped from the supply tray 202 exposed at the top from 06, and the memory module 10 is transferred to the test tray 20. The gripping mechanism 500 of the present example
Are mounted on the movable head 304, for example, so that eight memory modules can be transferred to the test tray 20 at one time.

In this embodiment, the supply tray 20
2 between the installation position of the test tray 20 and the test tray 20
There is provided a position correcting means for the memory module 10, which is referred to as "05". The precisor 305 has a relatively deep concave portion into which the memory module 10 can be inserted.
The periphery of the recess is shaped to be surrounded by an inclined surface.
Therefore, when the memory module 10 is dropped into the recess, the falling position of the memory module 10 is corrected on the inclined surface. As a result, the mutual positions of the eight memory modules 10 are accurately determined, and the memory modules 10 whose positions have been corrected are sucked again by the gripping mechanism 500 and are reloaded on the test tray 20, whereby the test tray 2 is moved.
The memory module 10 can be transshipped with high precision to the 0 insert 30.

The chamber 100 is a soak chamber (constant temperature chamber) for applying a desired high or low temperature stress to the memory module 10 loaded on the test tray 20.
101 and a measuring unit 102 for bringing the memory module 10 in a state where thermal stress has been applied in the soak chamber 101 into contact with the socket 50 of the test head base 48
And an unsoak chamber (heat removal tank) 103 for removing a given thermal stress from the memory module 10 tested by the measurement unit 102.

In the unsoak chamber 103, when a high temperature is applied in the soak chamber 101, the memory module 10 is cooled by blowing air to return to room temperature, or is naturally cooled to return to near room temperature. On the other hand, when a low temperature of, for example, about −30 ° C. is applied in the soak chamber 101, the memory module 10 is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. Then, the heat-removed memory module 10 is carried out to the unloader unit 400.

Since the unsoak chamber 103 is preferably thermally disconnected from the soak chamber 101 and the measuring unit 102, the unsoak chamber 103 is provided outside the chamber 100 in this example, but conceptually. The chamber 100 may also include a soak chamber 103.

The unloader section 400 also has the loader section 300
An XY transfer device 403 having the same structure as the XY transfer device 303 provided in the test tray 2 is provided by the XY transfer device 403.
0 to the tested memory module 10
04,204.

The unloader section 400 has a pair of windows 406a and 406b in which the storage tray 204 carried to the unloader section 400 is arranged so as to face from below.
Has been established. As described, each window 4
Set plates 210 and 210 for raising and lowering the storage tray 204 are provided below the storage trays 06a and 406b. Here, the storage tray 204 in which the memory modules 10 that have been tested are reloaded and filled up is loaded. The tray 204 is put down and transferred to the transfer arm 208.

In the thus configured handler 1 according to the present embodiment, the inside of the handler 1 is moved while the plurality of memory modules 10 are held in the test tray 20, and the plurality of The memory module 10 can be tested, and the test throughput is greatly improved. In the test measurement section 102 inside the chamber 100, the memory module 10
Need to perform the pick-and-place operation, the internal structure of the chamber 100 can be simplified, and the entire handler 1 can be reduced in size, simplified, and reduced in cost. In addition, by maintaining the inside of the chamber 100 at a constant high or low temperature, the temperature accuracy at the time of testing the memory module 10 is improved, and an accurate test can be performed.

Other Embodiments The present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention.

For example, the test tray and the electronic component substrate test apparatus according to the present invention can be applied to handlers other than the handler 1 shown in FIG.

[0083]

As described above, according to the electronic component substrate test tray and the test apparatus using the same according to the present invention, the test throughput can be improved and the test at an accurate temperature can be performed. The miniaturization, simplification, and cost reduction of the test apparatus can be realized.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a main part of a memory module test apparatus according to an embodiment of the present invention.

FIG. 2 is a partially exploded perspective view of a memory module test tray used in the test apparatus shown in FIG.

3 (A) is a plan view of the insert shown in FIG. 2, FIG. 3 (B) is a cross-sectional view of a main part along line IIIB-IIIB shown in FIG. 3 (A), and FIG. FIG. 6 is a cross-sectional view of a main part when is attached to a test tray.

FIG. 4 is a partially exploded perspective view of the socket.

FIG. 5 is a cross-sectional view of a main part along line VV shown in FIG. 4;

6 (A) to 6 (D) are process diagrams showing the operation of the test apparatus shown in FIG.

7A to 7C are process diagrams showing a continuation of FIG.

FIG. 8A is a schematic plan view showing the entire configuration of the test apparatus, and FIG. 8B is a schematic sectional view taken along line VIIIB-VIIIB shown in FIG. 8A.

FIG. 9 is a schematic perspective view of a memory module transfer device used in the test device shown in FIG.

FIG. 10 is a perspective view showing an example of the tray shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Handler 100 ... Chamber 200 ... Memory module storage part 300 ... Loader part 400 ... Unloader part 10 ... Memory module (electronic component board) 12 ... Board terminal 20 ... Test tray 20a ... Tray main body 30 ... Insert 36 ... Holding groove 40 ... upper positioning hole (first positioning means) 41 ... lower positioning hole (second positioning means) 44 ... tray transport base 50 ... test socket 62 ... return spring 70 ... drive unit (drive means) 74 ... match plate 76 ... board Pusher 77: Guide groove 88: Contact cylinder (auxiliary drive means)

Claims (11)

[Claims] An insert having a holding groove into which both side ends of the electronic component substrate are movably inserted such that the board terminals of the electronic component substrate are exposed; An electronic component board test tray having a tray body that holds the insert so as to be exposed. 2. The insert according to claim 1, wherein the insert includes first positioning means for positioning a board terminal of the electronic component board with respect to a board pusher for pushing the board terminal into a test socket. Electronic component board test tray. 3. The electronic component board test tray according to claim 1, wherein the insert includes second positioning means for positioning a board terminal of the electronic component board and a test socket. . 4. The electronic component board test tray according to claim 1, wherein a plurality of inserts are positioned and held in said tray body. 5. The electronic component board test tray according to claim 1, a test socket into which a board terminal of the electronic component board is removably inserted, and wherein the electronic component board is an electronic component board. An electronic component board test apparatus having a board pusher for pushing a board terminal of an electronic component board into a test socket while being mounted in a test tray. 6. The test of the electronic component substrate according to claim 5, wherein the board pusher has a guide groove into which both ends of the electronic component substrate are inserted to calibrate the inclination of the electronic component substrate. apparatus. 7. The electronic component substrate test apparatus according to claim 5, further comprising a match plate that movably holds the board pusher. 8. The electronic component substrate testing apparatus according to claim 7, further comprising a driving unit for moving the match plate toward and away from the electronic component substrate test tray. 9. The board pusher moves the electronic component substrate in the electronic component substrate test tray, and pushes a substrate terminal of the electronic component substrate into a socket.
9. The test apparatus for an electronic component substrate according to claim 7, wherein the driving unit includes an auxiliary driving unit for moving the board pusher with respect to the match plate. 10. The electronic component board test apparatus according to claim 5, further comprising a tray transport base for elastically holding the electronic component board test tray at predetermined intervals above the test socket. . 11. The test socket according to claim 5, wherein a return spring is provided inside the test socket so as to urge the board terminal of the electronic component substrate out of the test socket. The testing device for an electronic component substrate according to any one of the above.