TW533317B - Testing device for electronic device substrate - Google Patents
Testing device for electronic device substrate Download PDFInfo
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- TW533317B TW533317B TW089100140A TW89100140A TW533317B TW 533317 B TW533317 B TW 533317B TW 089100140 A TW089100140 A TW 089100140A TW 89100140 A TW89100140 A TW 89100140A TW 533317 B TW533317 B TW 533317B
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- tray
- test
- electronic component
- substrate
- component substrate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Operations Research (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
533317 五、發明說明(1) 4 【發明之技術領域】 本發明是有關一種電子元件基板之測試裝置,用來測 試記憶體模組等電子元件芙拓。 【習知之技術】 土 在記憶體基板等電子元件基板的製造過程中,最後製 造好的記憶體模組等需要一個測試裝置。 已知有一種這樣的測試裝置,在高於常溫或低於常溫 的溫度條件下用於測試記憶體模組。由於記憶體模組的特 性’此種測試裝置必須保證無論在高溫或低溫下均能有良 好的作動。 利用習知之記憶體模組用測試裝置進行高溫測試或低 溫測試時,測試前之記憶體模組在測試裝置内之加熱部或 冷部部進行加熱或冷卻,再使用取及放(?卜卜and_place) 機構=加熱或冷卻過之記憶體模組搬送至測定部,根據加 在七憶體模組上的熱量,進行高溫測試或低溫測試。 ^又^此種測試裝置,也可能會在欲加以測試的記憶體 模組上施加既定樣式的測試信號,此為一種测定電氣特性 的裝置,一般稱為1 c測試器,此種I C測試器多半連接一種 ,迗ί,裝置,當記憶體模組被搬送至測定部,在此測定 部以電乳方式使記憶體模組和測試頭之凹槽接士 束後,將測試好的記憶體模組從敎部搬出 不良文來分類。此種搬送處理裝置一般被稱為處理口和 an er 。在本說明書中,處理器為一體連接型式之、、則533317 V. Description of the invention (1) 4 [Technical field of the invention] The present invention relates to a test device for electronic component substrates, which is used to test electronic components such as memory modules. [Known technology] Soil In the manufacturing process of electronic component substrates such as memory substrates, a memory device and the like that are finally manufactured require a test device. One such test device is known for testing a memory module at a temperature above or below normal temperature. Due to the characteristics of the memory module, such a test device must ensure that it can perform well at high or low temperatures. When using the conventional memory module test device for high temperature test or low temperature test, the memory module before the test is heated or cooled in the heating part or the cold part of the test device, and then it is taken and placed (? 卜卜and_place) Mechanism = The heated or cooled memory module is transferred to the measurement department, and the high temperature test or low temperature test is performed according to the heat added to the seven memory module. ^ Again ^ This type of test device may also apply a predetermined pattern of test signals to the memory module to be tested. This is a device for measuring electrical characteristics, commonly referred to as a 1 c tester. This type of IC tester Mostly, one kind of device is connected. When the memory module is transported to the measurement unit, the measurement unit electrically connects the grooves of the memory module and the test head by electrical milking, and then tests the memory. The module removes bad text from the crotch to classify it. Such a transfer processing device is generally called a processing port and an er. In this manual, the processor is an integrated connection type.
第4頁 1 ^ 533317 五、發明說明(2) 試裝置,只以電子元件 但,在這種習知之電^裝置來稱, :要將好幾個記憶體模組從袭置中,由於 乍個個搬送到測定部,使得彳1二卩。卩以取及放的動 外,將記憶體模組搬送到㈤定的效能非t糟。此 上=溫度會改,’使得在測定部的:产J加於記憶體模組 溫度進行測試。 精度雙差,難以正確的 特別是在低溫測試中, 模組表面產生結露的顧慮,作^杏ί二下已冷卻的記憶體 :”中有,低溫測試的彳習知之測 鉻日寸此結路的水分會附著思-果組上產生結 子上對測試造成不良的影響。思、—吴組的端子或凹槽端 為了解除這種不相容的現象 ;部(或冷卻部)或測定部,將搶官室覆蓋加 f。但,在搶室内部進行記憶體模組‘及隹=:定溫 此種取及放機構變得繁雜之外 =二動作,除了 大,於是導致測試裝置的A w 亦不付不狄計得更 不理想。 r1的大型化、複雜化和高成本化,並 又’在搬入或搬出後#陰躺4 板時,使用了ί 果組這樣大的電子元件基 ^ . 子疋件基板直立排列之托盤,作此種托 中,設有將托盤一個一:固收置的搬入部和搬出部 但’當在抽屜狀之收納部中八,壑抽屜$之二,收納部。 置本身走向大型化的問題目越來越…測試裝Page 4 ^ 533317 V. Description of the invention (2) The test device is only based on electronic components. However, in this conventional electric device, it is called that: several memory modules should be installed from the attack. Each was transported to the measurement department so that 彳 1 卩 2. In addition, the performance of moving the memory module to the target is not bad. Here, the temperature will be changed, and the test result will be added to the temperature of the memory module. Double accuracy difference is difficult to correct, especially in the low temperature test, the fear of condensation on the surface of the module, as the cooling memory: "Yes, the low temperature test is known to measure the temperature of chromium." The moisture of the road will adhere to the knots on the Si-Fruit group, which will adversely affect the test. The Si-Wu terminal or grooved end is to remove this incompatible phenomenon; the ministry (or cooling section) or the measuring section , Cover the grabbing room and add f. However, the memory module inside the grabbing room 'and 隹 =: except for constant temperature such access and put mechanism becomes complicated = two actions, except for the large, which leads to the test device A w is not even more ideal. R1 is large, complicated, and costly, and when it is moved in or moved out # 阴 side 4 boards, a large electronic component such as a fruit group is used. Base ^. The tray with the substrates arranged upright. For this kind of support, there is a tray one by one: a fixedly placed moving-in section and a moving-out section, but when it is in the drawer-like storage section, the drawer is $ Second, the storage department. The problem of the device itself becoming larger ...
533317 五、發明說明(3) 另一方 元件基板時 上的問題, 因此, 將托盤一個 段的托盤再 據,使得托 作。 但,利 上將需要升 大型化的問 來收納測試 )的托盤收 盤(以下稱 造,例如, 使用。 【發明所欲 本發明 置,該裝置 溫度下進行 另外, 之測試裝置 (1 )為 提供一 面’在搬入或搬出像記憶體模 ’雖然考量了將電子元件基板 這麼做卻無法將複數個把盤堆 在習知之測試裝置的搬入部和 一個收納起來的抽屜狀之托盤 以元件搬出台座或元件搬入台 盤收納部自體升降,以進行該 用托盤收納部自體升降的方法 降軌跡所產生的死角,於是又 4。又’使用托盤收納部自體 前之電子元件基板的把盤(以 納部和用來收納測試完畢之電 收納用托盤)的托盤收納部為 空出來的供給用托盤無法拿來 解決之課題】 之第一目的係提供一種電子元 可以提昇測試的效能,使得測 ’將測試裝置小型化、單純化 本發明之第二目的亦在提供一 ’該裝置之托盤用途廣泛且包 I成上述目的,藉由本發明, 種電子元件基板之測試裝置 組這樣大的電子 直立排列於托盤 疊起來。 搬出部中設置可 收納部,作為手 座的高度為依 托盤的出入動 ’各#6盤收納部 有測試裝置需要 身降的方法,用 下稱供給用托盤 子元件基板之托 互相獨立的構 作為收納用托盤 件基板之測試袭 試可以在正確的 及低成本化。 種電子元件基板 括數個種類。 ’將測試用托盤 533317533317 V. Description of the invention (3) The other side has a problem with the component substrate. Therefore, the pallets of the pallets are re-documented to make the pallets work. However, Li will need to increase the size of the tray to store and test it (hereinafter referred to as, for example, use.) [The invention is intended to be installed at the temperature of the device. In addition, the test device (1) is provided. On the one side, "like moving in or out of memory-like molds", although the electronic component substrate is considered, it is impossible to stack a plurality of disks in the carrying-in portion of a conventional test device and a drawer-like tray to store the components out of the pedestal or The components are moved into the tray storage section and raised and lowered automatically, so that the dead angle caused by the trajectory of the tray storage section is raised and lowered automatically, and then 4. It also uses the handle plate of the electronic component substrate in front of the tray storage section ( The problem is that the tray storage section of the receiving section and the tray used to store the completed electrical storage tray is empty and the supply tray cannot be solved. The first purpose is to provide an electronic element that can improve the test performance and make the test The second object of the present invention is to miniaturize and simplify the test device. The tray of the device is versatile and includes: For the stated purpose, according to the present invention, a large set of electrons such as a test device group of electronic component substrates are arranged upright on a tray. A accommodating section is provided in the carrying-out section, and the height of the hand stand is based on the movement of the tray in and out of the tray. # 6 盘The storage unit has a method for lowering the test device. Using the structure called the supply tray sub-element substrate support as a separate test for the storage tray component substrate can accurately and cost-effectively. Several types. 'Will test tray 533317
入及搬出,至少包括:用來收納測試 件基板之收納部及用來測試上述測試 測定部; 前或測試後之電子元 月ίι之電子元件基板之 在上述格納部中設有: 納 納 第—托盤收納部,第一托盤獨立且可在上下方向收 第二托盤收納部,第二托盤獨立且可在上^方向收 第 二托盤 盤收納 托盤的 水 之第二 此的並 進行上 第 上述水 接; :广:裝置’於上述之第一托盤收納部和上 被設;成可以升降,且可在上述第-托 =述苐二托盤收納部之間進行第—托盤或第二 置,設置於上述之第—托盤收納部、上述 及Ϊ述之第一升降裝置之上部,可在彼 J方向和動,且可在本身和上述第—升降裝 述第一托盤或上述第二托盤的交接;及 a 可針對目的部位升降,且可在本身和 千搬达裝置之間進行上述第一托盤或第二托盤之交 在上述測定部中, 設有:測試用凹槽,可自 基板端子;及壓出板,在上述 拕盤的狀態下用來將電子元件 試用凹槽内; 由插入上述電子元件基板之 電子元件基板安裝於測試用 基板之基板端子壓進上述測In and out, at least include: a storage section for storing the substrate of the test piece and a test and measurement section for testing; the electronic component substrate of the electronic yuanyue before or after the test is provided in the above-mentioned department: —Tray storage section, the first tray is independent and can receive the second tray storage section in the up-down direction, and the second tray is independent and can receive the second tray tray for storing the water in the second tray tray, and the first and the above are performed. Water connection: Wide: The device is installed on the first tray storage section and above; it can be raised and lowered, and the first tray or the second tray can be placed between the first tray support and the second tray storage section. It is installed on the above-mentioned first tray storage section, above and the first lifting device described above, and can move in the direction of J, and can be installed on the first tray or the second tray. Handover; and a can be raised and lowered for the destination, and the first tray or the second tray can be transferred between itself and the Qianda delivery device. In the above measurement section, a test groove is provided, which can be removed from the substrate terminal. And a die plate for an electronic component within the recess in the trial Chi state of the disc; manufactured by inserting the electronic component of the electronic component mounted on the test board substrate with the substrate terminal of the substrate is pressed into the geodetic
533317 五、發明說明(5) 端子入部,•成可使上述電子元件基板之基板 側端部的伊持^自由移動的狀態下插入電子元件基板之兩 槪知:路出且保持上述嵌入部。 一 托盤之電子元件基板之測試裝f ’可在測試用 提昇了丄二::時測賴個電子元件基板,是以大幅 取及放的動你犯。又,此蚪不需要在測試測定部内進行 而傕俨敕/ ,於是可將測試裝置的内部構造單純化,進 而使侍整個測續鞋班,… 丨。退 由維持艙室内Ip古、w ^51化、端唇化且低成本化。又,藉 温度精度並::::或低溫之一定溫|5可提昇測試時的 反五作出正確的測試。 除此之外,雜|丄 托盤收納部本身^ Μlx明之電子元件基板之測試裝置, 送裝置及第而是藉由第-升降裝1、水平搬 部產生死角的:題衣f來移送,?以沒有在托盤收納部上 化。 、至少可以在高度方向將裝置整體小型 進入兩方之托ί收::裝置設置於托盤收納部之間’可以 率,亦可增進移送浐2,這樣不但可以提高托盤移送的效 收納部,都可以收:序的自由度。並且,無論哪一個托盤 部的托盤,都可以取托j,而無淪收納在哪一個把盤收納 下對分類數目的掷* 4出,所以可在不改變裝置本身的情況 在上述發明C彈性的處理。 且進一部具備第一搬送裝置,藉此將533317 V. Description of the invention (5) The terminal entry part can be inserted into the two parts of the electronic component board in a state where the holder on the side of the substrate of the electronic component board can move freely. The test equipment f of the electronic component substrate of the pallet can be improved during testing. The second measurement is based on an electronic component substrate. In addition, this test does not need to be performed in the test and measurement department, so it can simplify the internal structure of the test device, so as to serve the entire test and renewal class, ... Reduction of Ip, W ^ 51, lip end, and low cost in the maintenance cabin. In addition, by using temperature accuracy and :::: or a certain temperature of low temperature, | 5 can improve the anti-five test to make a correct test. In addition, miscellaneous | 丄 The tray storage unit itself ^ MEMS test equipment of the electronic component substrate, the sending device and the first but through the first-lifting equipment 1, the horizontal moving part of the dead end: the problem clothing f to transfer ,? It is not formed on the tray storage portion. At least in the height direction, the entire device can be compactly entered into both sides of the collection :: The device is installed between the tray storage section, and the transfer rate can be increased. This can not only improve the efficiency of the tray transfer, but also Can be received: order of degrees of freedom. In addition, no matter which tray is in the tray section, you can pick up j, and in which tray is stored without throwing the number of categories * 4 out, so you can be flexible in the above invention C without changing the device itself. Processing. And the first section is equipped with the first conveying device, so that
533317 五、發明說明(6) 板之第一 述電子元 托盤載送 測試前電 子元件基 納搭载測 ^述電子元件基板從用*搭 或第二托盤载送到上述測試用把=電子元件基 又,宜進一部具備第二搬二 件基板從用來搭载測試後 从f置,猎此將上 到上述第一或第二托盤曼電子凡件基板之測試用 再者且使上述托盤收納Λ 子元件基板之托盤,而另一方^ :、作為搭載 板之托盤。 r為搭载測試後電 上述第一托盤收納部中宜 試後電子元件基板之托盤。 ^ a 一部份可收 之類別。 類之托 側端插入 板自由移 ;者上=後之電子元件基板宜為再測試 盤。再者上“一托盤和第二托盤宜為同一種 宜包括上述壓出板從上述 並校正上述電子元件其柘夕“子兀件基板之兩 于凡件基板之傾斜度之導引溝。 又,該測試裝置宜進一牛’ 動之匹配板。 步包括保持上述壓出 该測試裝置進一步宜且右 述測試用托盤接近移冑m2 = 配板相對於』 、、牧处秒動以及離開移動之驅動裝置。 #芙;上述驅動裝置為了藉由上述壓由板使上述電子- 在上述測試用托盤内移動且將上述電ί元 基板鳊子壓進凹槽内,宜 牛基板之 配板移動之輔助驅動裝置。< "^板相對於上述迅 者m式裝置宜進一步包括在上述設用凹槽上以533317 V. Description of the invention (6) The first electronic component tray of the board is tested before the electronic component base is loaded. The electronic component substrate is used from the * or the second tray is sent to the above test. = Electronic component base In addition, it is advisable to enter a second board with two second substrates for loading and testing, and then place them on the first and second trays for testing the first and second trays of the Mann electronics board and store the trays. Sub-component substrate tray, and the other side ^ :, as a tray for the board. r is a tray on which the post-test electronic component substrate is preferably mounted in the first tray storage section. ^ a Partially receivable category. The support of the side inserts the board freely; the board of the electronic component above or below should be a retest disc. Furthermore, the “one tray and the second tray should be of the same type, and it should include the above-mentioned pressing plate from the above and correct the electronic component and its sieve. In addition, the test device should be fitted with a matching plate. The steps include maintaining the above-mentioned pressing device. The test device is further suitable and the test tray on the right is closer to the moving device. # 芙; The above drive device is used to move the above electrons by the above-mentioned pressing plate-to move in the above-mentioned test tray and press the above-mentioned electric element substrate mule into the groove, an auxiliary driving device for moving the matching plate of the substrate . < " ^ The plate is further included in the above-mentioned design groove with respect to the above-mentioned m-type device.
533317 五、發明說明(7) 既定間距維持上述測試托盤之彈性的托盤搬送基部。 Λι π ^ ί f试用凹槽在其内部宜包括有朝上述測試兩凹槽 彈:。 子7°件基板之基板端子的方向附加彈力之反彈 - 又,為達成上述目的,藉由本發明提供一種電子 兀件基板測試用托盤,包括: 卩,形成使上述電子元件基板之基板端子露出且 、、#· β移動的狀恶下插入電子元件基板之兩側端部的保 符溝,及 、+、^ ^ ^,使上述電子元件基板之基板端子露出且保持 上速嵌入部。 在况下,上述嵌入部相對於用來將上述電子元件 子壓進測試用凹槽内之壓出板,s包括有定 位之弟一定位裝置。 之J迪入部包括有用㈣定上述電子元件基板 ΐ:子和測試用凹槽此兩者位置之第二定位裝置。 受到保持1稷數個嵌入部宜在上述托盤架中的位置保持且 為達成上述目的,葬 板之測試裝置,包Ϊ 1 提供一種電子元件基 nm m ^ •上述電子疋件基板測試用托盤,測 壓槽:可自由插,上述電子元件基板之基板端子;及 用來將雷车上f ϊ Γ兀件基板安裝於測試用托盤的狀態下 μ二、兀土板之基板端子壓進上述測試用凹槽内。 述i出板且包括有從上述電子元件基板之兩側端插533317 V. Description of the invention (7) The tray transport base of the above-mentioned test tray is maintained at a predetermined interval. Λι π ^ ƒ The trial groove should include two grooves in the interior of the test groove:. In the direction of the substrate terminal of the 7 ° substrate, an elastic rebound is added. In addition, in order to achieve the above object, the present invention provides an electronic component substrate test tray including: 卩, forming the substrate terminal of the electronic component substrate to be exposed and , #, Β are moved into the grooves at both ends of the electronic component substrate under the moving state, and +, ^ ^ ^, so that the substrate terminals of the electronic component substrate are exposed and the high-speed embedded portion is maintained. In this case, the inserting portion includes a positioning device for positioning the brother with respect to the push-out plate for pressing the electronic component into the test groove. The J Di entry section includes a second positioning device for determining the positions of the electronic component substrate and the test groove. A number of embedded parts should be held in the tray racks to be held and in order to achieve the above-mentioned purpose, a test device for a burial board, including: 1 Provide an electronic component base nm m ^ • The above-mentioned tray for electronic component substrate testing, Pressure-measuring groove: freely insertable, the substrate terminals of the above-mentioned electronic component substrate; and the substrate terminals for mounting the f ϊ Γ element on the thunder vehicle on the test tray With groove inside. The i-out board includes plugs from both sides of the electronic component substrate.
第10頁 533317 五、發明說明(8) 入並校正上述電子元件基板之傾斜度之導引溝。 本發明之電子元件基板之測試 二 上述壓出板自由移動之匹配板。 且 Y匕括保持 本發明之電子元件基板之測試裝置宜 使上述匹配板相對於上述測# m紅 枯用來 動之驅動裝置。 Λ用托盤接近移動以及離開移 上述驅動裝置為了藉由上述壓出板使上 板在上述測試用托盤内移動且 电卞凡件基 端子壓進凹槽内,宜包元件基板之基板 移動之輔助驅動裝置。…屋出板相對於上述匹配板 本發明之電子元件基板之測試裝置宜進 述設用凹槽上以既定間距雊# 乂匕括在上 搬送基部。 π持上述測試托盤之彈性的托盤 上述測試用凹槽在盆内部古a 内部拔出電子元件美包括有朝上述測試用凹槽 彈箬。 土 土板為子的方向附加彈力之反彈 憶體:若無特殊的限制5電子元件基板則以記 件基使::子元件基板測試用托盤之電子元 件基板,移動測”==持複數個電子兀 此時不是以大幅提昇了測試的性能。又, 測試裝測定部内進行取及放的動作,於是可將 的内錢造單純化,進而使得整個測試裝置小型 533317 五、發明說明(9) - 部或j : f低f本化。又,由於本發明之測試裝置之全 低:之IS Ϊ 艙室内部,藉由維持艙室内部高溫或 度並作出2纟’可提昇€子元件基板被測試時的溫度精 X I 1下出正確的測試。 送裳(置3 ),\^成上述目的,藉由本發明,提供—種托盤移 納,· 部’至少—對托盤獨立且可在上下方向收 可以;降,3 C f於亡述这對托盤收納部之間被設置成 接。 σ在上述這對托盤收納部之間進行托盤的交 收納ϊίΤ兄;在Γ:置宜進一步包括設置於上述兩托盤 述第-升降妒置;:的並列方向移冑,且可在本身和上 又:進行托盤的交接之水平搬送裝置。 在本身和包括可針對目的部位升降,且可 降裝置。 置間進仃托盤之交接之第二升 搭載測試後,子元件基板之二盤。托盤’而另-方則作為 再者’藉由本發明,接供__接_^ h 第1盤收納部,第一托盤獨立且可包括: 盤收納部,第二托盤獨立且可在上下:方向收納;第 於上迷之第一托盤收納部和上述之第二托二收Page 10 533317 V. Description of the invention (8) Guide grooves for entering and correcting the inclination of the above-mentioned electronic component substrate. The test of the electronic component substrate of the present invention 2 The above-mentioned pressing plate is a freely-matching matching plate. In addition, the test device for holding the electronic component substrate of the present invention is preferably a driving device for moving the above-mentioned matching plate with respect to the above-mentioned test device. Λ The tray is moved close to and away from the drive device. In order to move the upper plate in the test tray by the above-mentioned push-out plate and press the base terminal into the groove, it is advisable to cover the substrate movement of the component substrate. Driving device. … The test board for the electronic component substrate of the present invention with respect to the above-mentioned matching board of the room-out board should preferably be enclosed in the design groove at a predetermined pitch 雊 # 乂 and transported to the base. π The flexible tray holding the above-mentioned test tray. The above-mentioned test grooves are used to pull out the electronic components in the interior of the basin and include a spring to the above-mentioned test grooves. The soil plate is the direction of the spring with a rebound elastic body: if there are no special restrictions, 5 electronic component substrates are based on a note :: electronic component substrates for sub-component substrate test trays, mobile test "== holding multiple At this time, the electronics does not greatly improve the performance of the test. In addition, the loading and unloading operations are carried out in the testing unit of the test device, so that the internal money can be simplified, thereby making the entire test device small 533317 V. Description of the invention (9) -Internal or j: f low f. In addition, due to the total low of the test device of the present invention: IS 舱 inside the cabin, by maintaining the high temperature or degree inside the cabin and making 2 纟 'can improve the sub-component substrate to be tested At the time, the correct test is performed under the precise temperature of XI 1. Sending clothes (set 3), to achieve the above purpose, by the present invention, provide-a kind of tray transfer, · Department 'at least-independent of the tray and can be received in the up and down direction Yes, 3 C f is set to be connected between the pair of tray storage sections. Σ The transfer of the trays between the pair of tray storage sections is described above. In Γ: Zhiyi further includes a set in the above. Two trays Lifting and jealous placement :: move side by side, and can be moved on and off: horizontal transfer device for transfer of trays. It can be lifted and lowered for the destination part, and it can be lowered. Transfer between trays After the second liter loading test, the two trays of the sub-component substrate. The tray 'and the other-as the other' By the present invention, __ 接 _ ^ h The first tray storage section, the first tray is independent and can be Including: tray storage section, the second tray is independent and can be stored in the up and down direction: the first tray storage section above the second fan and the above-mentioned second tray
533317 五、發明說明(10) 納部之間被設罟 · 及上述第二托盤收::::進J:在上J第-托盤收納部 接…搬送裝置,』第二托盤的交 之第一托盤收納部及上述之第一升降壯=2收納部、上述 j的並列方向移動,且可在本身:上2 ί之广可在彼 可針對目的部位升降,且接,及第二升降裝 置之間進行上述第般 身和上述水平搬送裝 在上述發明ΐ雖托盤之交接。 方作為搭载測試前 -述托盤收納部的一 搭载測試後電子之托盤,而另-方則作為 载測^後少有-部份可收納搭 + 7 — 土 之托盤。在 jJ:卜}杳、、g t 件基板;為再測試之類別。 試後 ^ . 上述弟—托盤收納部中官5 W、士 a 父接;試前電,元件基板之空乾盤。有一#份可收納 藉由本和第二托盤宜為同-種類之托盤。 降,而是养^楚 裝置,托盤收納部本身不升 置來移送f所、二升降衷置、水平搬送裝置及第二升降裝 至少可以名古以沒有在托盤收納部上部產生死角的問題, 又,向度方向將裝置整體小型化。 進入兩方^ ^第一升降装置設置於托盤收納部之間,可以 率,亦可擷2盤收納部,這樣不但可以提高托盤移送的效 曰移运程序的自由度。並且,無論哪一個托盤 533317 五、發明說明(π) 收納部,都可以收納托盤,而無論收納在哪一個托盤收納 部的托盤,都可以取出,所以可在不改變裝置本身的情況 下對分類數目的增加採取彈性的處理。 【圖式簡單說明】 圖1 Α是表示本發明之電子元件基板之測試裝置之平面 概念圖。 圖1B是圖1 A的B-B剖面圖。 圖2為側面剖面圖。 圖3是一立體圖,表示用於本實施型態之供給用或收 納用托盤之一範例。 圖4A是表示本實施型態之記憶體模組儲存部之立體 圖。 圖4B是表示托盤收納部和一部份升降裝置之立體圖。 圖5是表示在本實施型態的XY方向搬送裝置上所使用 之記憶體模組把持機構之立體圖。 圖6是表示本實施型態之全體測定部之剖面圖。 圖7是表示於本實施型態中所使用之測試用托盤之立 體圖。 圖8A是表示圖7之測試用托盤嵌入之俯視圖。 圖8B是表示圖7之測試用托盤嵌入之前視圖。 圖8C是表示圖7之測試用托盤嵌入之側視圖。 圖9是表示本實施型態之測試頭部之立體圖。 圖1 0是表示在測試頭部之記憶體模組和凹槽之間的接 觸狀態之剖面圖。 533317533317 5. Description of the invention (10) The second tray is set up between the receiving department and the second tray is received :::: into J: in the upper J-th tray storage section to connect to ... A tray storage section and the above-mentioned first lifting section = 2 storage sections, the above-mentioned j can be moved in a parallel direction, and can be lifted in itself: 2 liters can be lifted and lowered at the target location, and the second lifting device The above-mentioned general body and the above-mentioned horizontal transfer are carried in the above-mentioned invention. Fang is used as one of the tray storage sections before the test, and the other is used as a tray after the test, and the other part is used as a tray. In jJ: Bu}, g, substrates; for the category of retest. After the test ^. The above-mentioned brother-the official in the tray storage department 5 W, the taxi a father connected; before the test, electricity, empty dry plate of the component substrate. One # can be stored. The present and second tray should be the same-type tray. Instead, it is a maintenance device. The tray storage unit itself is not raised to transfer the F, the second lifting center, the horizontal transfer device, and the second lifting device. In addition, the entire device is miniaturized in the azimuth direction. Enter the two sides ^ ^ The first lifting device is installed between the tray storage sections, and it can also capture two tray storage sections, which can not only improve the efficiency of the tray transfer, but also the freedom of the transfer process. In addition, no matter which tray is 533317 V. Description of the invention (π) The storage section can store the tray, and the tray stored in any tray storage section can be taken out, so it can be classified without changing the device itself Increasing the number takes a flexible approach. [Brief description of the drawings] FIG. 1A is a conceptual plan view showing a testing device for an electronic component substrate of the present invention. Fig. 1B is a B-B sectional view of Fig. 1A. Fig. 2 is a side sectional view. Fig. 3 is a perspective view showing an example of a supply or receiving tray used in this embodiment. Fig. 4A is a perspective view showing a memory module storage section according to the embodiment. FIG. 4B is a perspective view showing the tray storage portion and a part of the lifting device. Fig. 5 is a perspective view showing a memory module holding mechanism used in the XY-direction conveying device according to the embodiment. FIG. 6 is a cross-sectional view showing the entire measurement section of the embodiment. Fig. 7 is a perspective view showing a test tray used in this embodiment. FIG. 8A is a plan view showing the insertion of the test tray of FIG. 7. FIG. FIG. 8B is a front view showing that the test tray of FIG. 7 is inserted. FIG. 8C is a side view showing the insertion of the test tray of FIG. 7. FIG. FIG. 9 is a perspective view showing a test head according to this embodiment. FIG. 10 is a cross-sectional view showing the contact state between the memory module and the groove of the test head. 533317
五、發明說明(12) 圖11 A至圖1 1 E是用來說明本發明之供給用或收納 盤之處理方式之概念圖。 圖1 2A至圖1 2G是用來說明圖1之測定部中動作之曹 部位剖面圖。 圖1 3 A是表示本發明之電子元件基板之測試袭置盆 實施型態之平面概念圖。 圖13B是圖1 3A的B-B剖面圖。 【發明之實施型態】 在以下的實施型態中以 對象’但本發明之測試裝置 中的§己憶體核組’其他無法 元件也包括在内。 圖3中的記憶體模組作為測試 的測试對象並不僅限於同一圖 以堆疊方式放入收納部的電子V. Description of the invention (12) Fig. 11A to Fig. 1E are conceptual diagrams for explaining the processing method of the supply or storage tray of the present invention. Figs. 12A to 12G are cross-sectional views of portions of Cao for explaining the operation in the measurement section of Fig. 1. Figs. Fig. 1 3A is a plan conceptual diagram showing an implementation form of a test basin for an electronic component substrate of the present invention. Fig. 13B is a B-B sectional view of Fig. 13A. [Implementation Mode of the Invention] In the following implementation mode, the object is ‘but the 无法 memory core group’ in the test device of the present invention includes other incapable elements. The memory module in Figure 3 as the test object is not limited to the same picture.
首先 結構作一 裝置由以 組1 0的處 頭ΤΗ、在 憶體模組 此外 測試器TS 此顯於 其中 頭TH的艙 類儲存測 個大致的說二= 貫所施型態心…置的整體 下各邻八^ ^ ^ 所示,本實施型態之測試 此測試頭ΤΗ 電氣方式接觸之測試 之測試的測試:TV 式之測試信號且實行記 ,忒裝置可適用於所有的測試頭TH或 圖2中而Λ的測試賤或測試器TS,所以僅將 圖2中,而在其他圖示中省略。 ί ιΐ〇理,m列ί部,所構成:安裝有測試 試後之^將進仃测試的記憶體模組丨〇且分 乂後之5己憶體模組1〇的記憶體模組儲存部2〇〇、First of all, a device is constructed with a group of 10 heads, a tester TS in the memory module, and a tester TS in which the head TH is stored. Generally speaking, two = the type of attitude ... As shown in the figure below, the test of this implementation type test of this test head TΗ Test of electrical contact test: TV-type test signal and recording, the device can be applied to all test heads TH Or the test of Λ or the tester TS in FIG. 2 is omitted in FIG. 2 only in other illustrations. ί ιΐ〇 理, m column ί, consisting of: a memory module with a memory module ^ will be tested after the test test and a memory module of 5 memory module 1 after the test is installed Storage department 200,
533317 五、發明說明(13) 將σ己憶體模組1 〇送進餘室1 Q 〇 室~〇的載入部3〇〇、分類取出在艙 】畢之$憶體模組1〇的卸下部4〇〇。 该處理器1是一種測試( 予高溫或低溫的壓力狀離下θ 記憶體模組10在給 試結果八_ β降触= 疋否能適當地運作且根據該測 作動測試Γ^夕ί 的I置’在此溫度壓力狀態下的 托般20 2在文搬°、、,_夕田屑5式對象亦即記憶體模組1 0的供給用 nizuz在搬运處理哭1之、目f上士 #、丨丄 口口之〆則喊用托盤20中進行載送。 该測試用托盤20在載入部3〇()换%^ /仃戰i 送人搶室100且被該測試用托般 5 ^ f模組1 0之後 的钏中都1 η 〇 , 祀凰^ 0 ‘载的狀態下於艙室1 0 0 情體模=:1記憶體模組i0。之後,測試完畢的記 部400被搬運出,然後在該卸下部_處 各吕己fe肢拉組10載送於對應於測試結果的收納用托盤 般20 ΪΓ又由 '列各部分所構成:給予堆疊於測試用托 ^1〇1 5己憶體模組1 〇目標高温或低溫之溫度壓力的恆溫 Ϊ1 1、丄恆溫槽1 〇 1内給予熱壓力狀態下之記憶體模 ,、且10和測忒頭TH之凹槽5〇接觸之測定部1〇2、從經由 = 測試過之記憶體模組除去先前之熱壓力的除熱槽 若曾在恆溫槽1〇1施加高溫,則藉由除熱槽103,可 以在對記憶體模組10送風來冷卻,返回至室溫, 自 ^卻返回至室溫附近。相對於此’若曾在怪溫槽 101靶加攝氏負三十度的低溫,則以溫風或加埶突 憶體模組10加熱,可以返回不再結露的溫度。然°*後,再將 533317 五、發明說明(14) 此除熱過的記憶體模組1 〇搬運至卸下部4〇〇。 此外,除熱槽103宜在熱量上和恆溫槽1〇ί或测定 102斷絕關係,雖然在本例中,除熱槽1〇3設置於艙室】⑽ 之外,但在概念上艙室1〇〇亦包括除熱槽在内。 接下來將進一步詳細說明記憶體模組儲存部2〇 〇、載 入部30 0、艙室100以及卸下部4〇〇各部位的結構。 ^ 記憶體模組儲存部2 (1 f) 百先,作為測試對象之記憶體模組i 0相對於處理器 1,、,呈現端子12向下之直立姿勢,被圖3中托盤2〇2, 2〇4搭 載亚搬入,又以相同的模樣被搬出。在同一圖中所示 2 0 5為用來保持記憶體模組丨〇為直立姿勢之凸部。 此外,雖然稱搭載測試前記憶體模組1〇之托盤 f ί盤202,彳冉搭載測試後記憶體模組1 〇之托盤為收W 托盤2〇4,托盤2 02, 204可以是同一形狀或不同形=肩周533317 V. Description of the invention (13) The σ self-recalling body module 1 〇 is sent to the loading room 300 of the remaining room 1 Q 〇 ~ 〇, sorted out in the cabin】 The removal section 400. The processor 1 is a test (pre-high temperature or low temperature pressure-off θ memory module 10 in the test results eight _ β drop contact = 疋 whether it can properly operate and test according to the test operation I set up in this temperature and pressure state. 20 2 in the text. ° ,,, _ Xitian shavings 5 type objects, that is, the supply of the memory module 1 0. Nizuz during the handling process 1 cry, sergeant f # 、 丨 丄 口 口 之 〆 is called to carry in the tray 20. The test tray 20 is changed in the loading section 30 ()% ^ / 仃 i is sent to grab the room 100 and is held by the test After 5 ^ f module 1 0, all of the following are 1 η 〇, worship ^ 0 'in the state of the cabin 1 0 0 emotional phantom =: 1 memory module i0. After that, the test section 400 is completed It is carried out, and each Lu Jife limb pull group 10 at the unloading part _ is carried on a storage tray corresponding to the test result. 20 ΪΓ is composed of each part of the column: given to the stack for testing ^ 1 〇1 5 memory module 1 〇 target high-temperature or low-temperature temperature and pressure constant Ϊ1 1, 1 constant temperature tank 1 〇1 is given a memory phantom under thermal pressure, and 10 and test The measuring section 102 in which the groove TH of the head TH contacts is 102, and the heat removing tank for removing the previous thermal pressure from the memory module passed the test. If a high temperature has been applied to the thermostatic bath 101, the heat is removed by The tank 103 can be cooled by supplying air to the memory module 10 and returning to room temperature, but it returns to the vicinity of the room temperature. On the other hand, if a low temperature of minus thirty degrees Celsius has been added to the target of the strange temperature tank 101, Then use warm air or increase the temperature of the memory module 10 to return to the temperature where no condensation will occur. Then ° *, then 533317 V. Description of the invention (14) This de-heated memory module 1 〇 To the unloading section 400. In addition, the heat removal tank 103 should be thermally disconnected from the thermostatic bath 10 or the measurement 102, although in this example, except that the heat tank 103 is installed in the cabin] ⑽, but Conceptually, the cabin 100 also includes a heat sink. Next, the structure of the memory module storage unit 2000, the loading unit 300, the cabin 100, and the unloading unit 400 will be described in further detail. ^ Memory module storage 2 (1 f) Baixian, the memory module i 0 as the test object is relative to the processor 1 The terminal 12 is in an upright posture, and it is carried in by trays 002 and 204 in Fig. 3, and it is carried out in the same shape. In the same figure, 205 is used to hold the memory. The module 丨 〇 is a convex part in an upright position. In addition, although the tray f 202 tray 202 equipped with the memory module 10 before the test is called, the tray equipped with the memory module 1 〇 after the test is a tray W 2. 4, tray 2 02, 204 can be the same shape or different shapes = shoulder circumference
但,希望至少供給用托盤2〇2具備決定被搭載之記情體 組10之位置的功能。搭載於供給用托盤202之記且 =搬入處理器i内藉由拾取(pick_up)裝置(後:之且xv 搬达裝置303)進行載送等操作。 A 本貫施型態之記憶體模組儲存部2 〇 〇中 一 J納部212, 214。如圖u、圖1β、圖2、圖4及圖4b對托盤 f-方的收納部2i2中’已搭載即將進行測試之 ;’ T1。的供給用托盤202並未堆疊,而是互相獨立並; ί 47, # ^ ^ ^ ^ ^ μ Λ ,Γ 十測忒後兄憶體模組丨〇作適當分類之收納用托般However, it is desirable that at least the supply tray 202 has a function of determining the position of the memory unit 10 to be mounted. The record mounted on the supply tray 202 = is carried into the processor i, and is carried out by a picking device (later: and xv conveying device 303). A Memory module storage unit in the invariant mode. 2000. J. J Nabu 212, 214. As shown in Fig. U, Fig. 1β, Fig. 2, Fig. 4 and Fig. 4b, the storage section 2i2 of the tray f-side is already equipped with "the one to be tested;" T1. The supply trays 202 are not stacked, but are independent of each other; ί 47, # ^ ^ ^ ^ ^ μ Λ, Γ After the ten-test test, the memory module is used as a suitable storage tray.
533317 五、發明說明(15) ‘ 2〇4也是同樣地,並未堆疊,而是互相獨立並維持在上下 方向進行收納。換句話說,托盤202,204被收納於托盤收 納部2 1 2,2 1 4如棚狀的抽屜中。 此外’在托盤收納部21 2,2 1 4中並未特別限定可以收 納的托盤數,可根據處理器1的大小和分類能力等相對關 ϋ作出適當的決定。在本例中,各托盤收納部2 1 2, 2 1 4中 最多可收納7個托盤202, 20 4。 之後將會再詳細敘述,托盤收納部2 1 2,2 1 4互為相同 的構造,所以供給用托盤20 2、收納用托盤204彼此可以收 納彼此。亦即,若希望測試結果之分類除了有良品和不良 品之分,在良品中又分出動作速度之高速、中速、低速, 或者在不良品中又分出需要再測試等等的眾多分類,可綜 合使闬兩個托盤收納部2 1 2,21 4來進行。 一對推盤收納部212,214之間,升降器206被設置成 可以升降。此升降器20 6如圖4Α所示,藉由球狀螺絲驅動 裝置2 0 6 a,至少從各托盤收納部2 1 2,2 1 4之最下面一段到 最上面一段之間可以控制上下方向的移動。 此升降器20 6和各托盤收納部2 12,214之間進行托盤 202,204之交接。這樣的動作如圖4B所示,在托盤2〇2, 2 04或載置它們的平板上,藉由引導流體油封2〇此之負荷 並進退驅動流體油封2〇6b,可進行使托盤202,204進出的 操作。 在托盤收納部2 1 2, 2 1 4及升降器2 0 6的正上方,中間 臂2 08被設置成沿著圖中所示之正負X軸方向自由移動。此533317 V. Description of the invention (15) ‘204 is also the same, it is not stacked, but is independent of each other and kept in the up-down direction for storage. In other words, the trays 202 and 204 are housed in tray-like drawers 2 1 2 and 2 1 4. In addition, the number of trays that can be received in the tray storage sections 21 2 and 2 1 4 is not particularly limited, and an appropriate decision can be made according to the relative importance of the size and sorting ability of the processor 1. In this example, a maximum of 7 trays 202, 20 4 can be stored in each of the tray storage sections 2 1 2 and 2 1 4. As will be described in detail later, the tray storage sections 2 1 2 and 2 1 4 have the same structure as each other, so that the supply tray 20 2 and the storage tray 204 can receive each other. In other words, if you want to classify the test results in addition to good and bad products, you can divide the high-speed, medium-speed, and low-speed movement speeds in the good products, or the many classifications that require re-testing among the bad products. It can be performed by using two tray storage sections 2 1 2 and 21 4 in combination. A lifter 206 is provided between the pair of push-plate storage sections 212 and 214 so as to be able to lift and lower. As shown in FIG. 4A, the lifter 20 6 can control the up-down direction from at least the lowermost section to the uppermost section of each tray storage section 2 1 2, 2 1 4 by a ball screw driving device 2 0 6 a. Mobile. The lifter 20 6 and each of the tray storage sections 2 12 and 214 transfer the trays 202 and 204. Such an action is shown in FIG. 4B. On the trays 202, 204, or a plate on which the trays are placed, the fluid oil seal 20 is guided and the fluid oil seal 206b is driven forward and backward to perform the tray 202. 204 operations in and out. Directly above the tray storage portions 2 1 2, 2 1 4 and the lifter 2 0 6, the intermediate arm 20 08 is provided to move freely along the positive and negative X-axis directions shown in the figure. this
533317 五、發明說明(16) -----— :間臂208藉由球狀螺絲驅動裝置2〇8&沿著正負χ軸方向所 希望的位置控制移動。中間臂2〇8於升降器2〇6接收 的托盤202, 204 ’然後交接至受述之設定板21〇,再反^ 來於设定板210接收被載置的托盤2〇2,2〇4,交接於升降 器206中。此時,為了保持及解放托盤20 2,204,鉤狀機 構208b (請參照圖UA)被設置為可以開閉。 此外,於本實施型態中,中間臂2〇8之可動方向只沿 正負X軸設定,但亦可在正負z方向作升降,也可以在托"盤 202,204父接之際在正負2軸方向升降。又,亦可沿正負γ 軸方向移動,亦可在後述之設定板2丨〇之設定範圍内 自由度。 ”一 在本實施型態中,中間臂20 8正上方設有三個設定板 210。這些設定板2 10可藉由球狀螺絲驅動裝置21〇a各自獨 立並在正負Z轴方向升降,至少可以在比中間臂2 〇 8還低的 位置和比中間臂2 0 8還高的位置之間升降。這裡所說的下 限位置為托盤20 2, 204交接之際的位置,而上限位置為托 盤202, 2 04的設定位置(亦即,藉由χγ搬送裝置3〇3將記 憶體模組10引渡至測試用托盤20的位置以及藉由χγ搬送裝 置4 0 3從測試用托盤2 0接收記憶體模組1 〇的位置)。、 此外,在本例中設有三個設定板21 〇,圖4 A左方那一 個作為載入部30 0的設定板2 1 0,右方的那兩個則作為卸下 部4 0 0的設定板2 1 〇,2 1 0。但是,本發明並未限定此點, 兩個設定板或四個以上的設定板都可以使用於本發明中。 載入部3 ο η533317 V. Description of the invention (16) ------: The intermediate arm 208 is controlled to move in a desired position along the positive and negative x-axis directions by a ball screw driving device 208 & The middle arm 208 receives the trays 202, 204 'received by the lifter 206, and then transfers to the described setting plate 21o, and in turn receives the placed trays 202, 2 at the setting plate 210. 4. Transfer to the lifter 206. At this time, in order to hold and release the trays 20 and 204, the hook mechanism 208b (refer to FIG. UA) is provided to be opened and closed. In addition, in this embodiment, the movable direction of the middle arm 208 is only set along the positive and negative X axis, but it can also be raised and lowered in the positive and negative z direction, and it can also be positive or negative when the tray 202 and 204 are connected Lifting in 2 axes. In addition, it can also move in the positive and negative γ axis directions, and it can also have a degree of freedom within a setting range of a setting plate 2 丨 0 described later. First, in this embodiment, three setting plates 210 are provided directly above the middle arm 20 8. These setting plates 2 10 can be independently moved by ball screw driving devices 21 10a and can be raised and lowered in the positive and negative Z-axis directions, at least Elevating between a position lower than the middle arm 2 08 and a position higher than the middle arm 2 08. The lower limit position here is the position at the time when the pallets 20 2, 204 are transferred, and the upper limit position is the pallet 202 The setting position of 204 (that is, the position where the memory module 10 is extradited to the test tray 20 by the χγ transfer device 3303 and the memory is received from the test tray 20 by the χγ transfer device 4 0 3 Position of the module 10). In addition, in this example, there are three setting plates 210, the left one in FIG. 4A is the setting plate 2 1 0 in the loading section 30, and the two in the right are The setting plates 2 1 0, 2 1 0 as the removal portion 400. However, the present invention is not limited to this, and two setting plates or more than four setting plates can be used in the present invention. Loading portion 3 ο η
第19頁 533317 五、發明說明(17) 」上述供給用托盤2〇2從載入部3〇〇之窗部下 該載入部3〇〇,原先裝載於供給用托盤2〇2之 ς ’ 乂 之後被裝載於停止於載入部300之測試用托盤2厂。脰杈、'且1 〇 2。之:ϊ = ϊ202將記憶體模組10裝載於測 之擻k衣置如圖以所示,使用τχγ搬送 送裝置303具備:Υ軸執道3〇1、添加於此¥軸=3 在供給用托盤20 2和測試用托盤2〇之間以正負γ = 可 之X軸執道302、沿此Χ軸軌道3〇2且可在 X ° 之可動頭304。 貝X袖向移動 此ΧΥ搬送裝置3 03之可動頭3〇4於向下方 5所示之記憶體模組把持機㈣卜同 。者正負Z軸方向移動之流體油封5〇2、一 閉動作之流體油封504。於是,可藉由流體油封丄= :504亚抓住或放開記憶體模組j 〇之兩侧緣 二口 體油=5〇2來升降被抓住的記憶體模組1〇。 I 了猎由〜 這樣的話把持機構5 〇 Q可一邊抓住記憶體模彳】 :邊移動,+從供給用托盤202把持住記憶體模組1〇〜,再將 此5己憶體杈組10裝載於測試用托盤2〇。本例中之、 500相對於可動頭3 03可以安裝至八根的程度,—次 /個6己憶體杈組1 0裝载於測試用托盤2 〇内。 、 此外,於供給用托盤202中,為了搭 形成的凹槽形狀上較記憶體模組i。來得大,所: 533317Page 19 533317 V. Description of the invention (17) "The above-mentioned supply tray 200 is loaded from the loading section 300 under the window section of the loading section 300, and was originally loaded on the supply tray 2002. After that, it was loaded in the second test tray stopped at the loading section 300.脰 枝, 'and 1 02. No .: ϊ = ϊ202. Load the memory module 10 on the 擞 k clothes. As shown in the figure, using the τχγ transfer device 303 is equipped with: Υ 执 道道 301, added here ¥ 轴 = 3 In the supply Between the tray 20 2 and the test tray 20, a positive and negative γ = possible X-axis is used to execute the road 302, along this X-axis orbit 30, and the movable head 304 can be at X °. The movement of the sleeve X is to move the movable head 304 of the XY transport device 3 03 to the memory module holding machine shown below 5. The fluid oil seal 502 that moves in the positive and negative Z-axis directions is a fluid oil seal 504 that is closed. Then, the fluid memory seal 丄 =: 504 can be used to grasp or release the two edges of the memory module j 〇 two ports of body oil = 502 to lift the held memory module 10. I 猎 由 ~ In this way, the holding mechanism 5 〇Q can hold the memory module 彳]: Move while holding the memory module 1 〇 ~ from the supply tray 202, and then the 5 memory module group 10 is mounted on the test tray 20. In this example, 500 can be mounted to eight moving heads relative to the movable head 303, and the number of 6 sets of 6 memory blocks 10 is loaded in the test tray 200. In addition, in the supply tray 202, the shape of the groove formed in order to overlap is larger than the memory module i. Come big, so: 533317
ΐ ΐΐ / 憶體模組10之位置多少顯得零 ί: 丄 狀態下,記憶體模組10藉由把持機構500 托盤2。之嵌入部30 0在放入正確位/時有也因了難一則试用 ::试,盤2。之間設有一個稱為修正器3。5的位|^ 裝置,用來修正記憶體模組10之位置。此修正哭; 了 IS憶體模組1〇這樣程度的深度凹部,此:部的周緣 2傾斜面圍起的形狀。並且,•記憶體模組心= 。%,圮憶體模組10之落下位置藉由傾斜面被修 必匕,八個記憶體模組10之間的相互位置可以正確地定下 正過之記憶體模組10再次藉由把持機構5。。被 及住並衣載於測試用托盤20上,將精度良好的圮 10裝載於測試用托盤2〇之嵌入部3〇。 。心 、、’ 艙室100 側述,測試用托盤20將記憶體模組ig裝載於載入 。〇〇中,搬至恆溫槽101。雖然圖示省略,但在怪溫槽 叫η /ΐ ΐ垂直搬送裝置,藉由此垂直搬送裝置,在測定 #102空出之前,複數個測試用托盤以被保持的狀能來 « t之後,在預備的這段時間中對記憶體模組1()^加高溫 或低溫之溫度壓力。 在測定部102中,測試頭TH被配置於其中央,凹槽5〇 相對於測定部1〇2内從下方設定上來。然後,在此設^好 之測試頭TH之上搬運測試用托盤2G,複數個記憶體^組1〇ΐ ΐΐ / The position of the memory module 10 appears to be somewhat zero ί: In the state of 丄, the memory module 10 is held by the holding mechanism 500 tray 2. The embedding part 300 has some problems when it is put in the correct position. Try it out :: try, disk 2. A bit device ^ called a corrector 3.5 is used to correct the position of the memory module 10. This correction cries; the depth of the recessed portion of the IS memory body module 10 to this extent, this: the peripheral edge of the portion 2 is the shape surrounded by the inclined surface. And, • Memory module heart =. %, The falling position of the memory module 10 is fixed by the inclined surface, and the mutual position of the eight memory modules 10 can be correctly determined. The memory module 10 passing through is again controlled by the holding mechanism. 5. . The tester 20 was held and clothed, and the test piece 20 with good accuracy was placed in the insertion portion 30 of the tester tray 20. . As described on the side of the chamber 100, the test tray 20 loads the memory module ig. 〇〇, moved to the thermostat 101. Although the illustration is omitted, the strange temperature bath is called η / ΐ ΐ vertical conveying device. With this vertical conveying device, before measurement # 102 is vacated, a plurality of test trays can be held in a held shape. During the preparation period, apply high or low temperature pressure to the memory module 1 () ^. In the measurement unit 102, the test head TH is disposed at the center thereof, and the groove 50 is set from below in the measurement unit 102. Then, the test tray 2G is carried on the set test head TH, and a plurality of memories ^ group 1〇
第21頁 533317Page 21 533317
ϊ i : ί ϊ ί Ϊ個凹槽50以電氣的方式接觸並進行測試。 i〇t溫产θ ^ ^,托盤20在除熱槽103除熱,記憶體模組 4〇〇。皿又。< 到室溫或相當於室溫後,便被搬入卸下部 值^ = 5卸下部400之測試用托盤20經由圖夕卜之滾輪 傳运▼再被运回載入部3〇〇以及艙室1〇〇。 、如圖7之詳細圖示,記憶體模組之測試用牦盤20具有 可以自由安裝方式收容記恃辦爐 1 η 山 ν、 你山X加— 己心體杈組1 0之肷入部30和使複數 =者X轴方向保持一列的托盤本體2〇&。托盤本 m〇a具有矩形之上部框22和同樣地下之矩形下部框24, 這些框22及24藉由複數個桿狀間隔器26以約略 連結。 ,〜μ刀八 上部框22及下部框24中,周來貫串並保持各個嵌入部 30之保持孔21, 23各自以既定間隔沿著χ軸方向形成。 上部框22形成之保持孔21之γ軸方向之兩端附近沿著X 向以錯開位置的方式形成一對定位孔2 5。在這些定位孔託 中,如圖8C所示,於嵌入部30形成之定位針孔&嵌人且 喪入部30相對於托盤本體20a決定了位置。此外,於^ 42之下端安裝有蓋子43,嵌入部30可相對於托盤本體2〇& 保持。 如圖7、圖8A及圖8B所示,嵌入部3〇具有一對形 石 梯形之凹口 3 1的側壁3 2,為了在這些側壁3 2之間形成_】 體模組收容空間’這些側壁32藉由端壁33a,33b而一體憶 化。各嵌入部3 0以合成樹脂構成。 —ϊ i: ί ϊ ί A groove 50 is electrically contacted and tested. Iot produces θ ^^ at a warm temperature, the tray 20 removes heat from the heat removal tank 103, and the memory module 400. Dish again. < After reaching room temperature or equivalent, it is carried into the unloading section ^ = 5 The test tray 20 of the unloading section 400 is transported via the roller of Tu Xibu ▼ and then returned to the loading section 300 and the cabin 100%. 7. As shown in the detailed diagram of FIG. 7, the test disk 20 for the memory module has a freely-installable storage furnace 1 η mountain ν, your mountain X plus — the heart body body group 1 10 of the entry 30 And the tray body 20 & The tray book moa has a rectangular upper frame 22 and a rectangular lower frame 24 which are also underground. These frames 22 and 24 are connected approximately by a plurality of rod spacers 26. In the upper frame 22 and the lower frame 24, holding holes 21 and 23 of each of the inserting portions 30 are successively formed and held along the χ-axis direction at predetermined intervals. A pair of positioning holes 25 are formed in the vicinity of both ends of the holding hole 21 formed in the upper frame 22 in the γ-axis direction along the X direction. Among these positioning hole holders, as shown in FIG. 8C, the positioning pin hole & inlay and funneling portion 30 formed in the insertion portion 30 determines the position with respect to the tray body 20a. In addition, a cover 43 is attached to the lower end of ^ 42, and the inserting portion 30 can be held with respect to the tray body 20 &. As shown in FIG. 7, FIG. 8A and FIG. 8B, the embedding portion 30 has a pair of side walls 32 of the notch 31 in the shape of a stone trapezoid, in order to form a space between these side walls 32. The side wall 32 is integrally memorized by the end walls 33a, 33b. Each of the inserting portions 30 is made of a synthetic resin. —
533317 五、發明說明(20) 如圖8所示,在端壁33a 空間34突出之突起部35,各 36和保持用底壁37。如圖8A 間所形成之收容空間34的底 間形成一個貫通孔38,保持 持之記憶體模組1 0之基板端 方。 及33b的内側形成相對於收容 突起部3 5的内周則形成保持溝 及圖8 B所示,在一對側板3 2之 部於所面對之突起部35及35之 溝36之保持用底壁37之間所保 子12通過貫通孔3 8並露出於下 在保持孔36中,記憶體模組10之兩側端部可從上方以 自由安裝的方式插入,如圖8所示,於保持溝3 6之上方形 成了將記憶體模組1 0兩側端部導入保持溝36内之錐狀導引 溝42。在嵌入部30之内部,記憶體模組1〇在乂軸方向以及γ 軸方向僅僅留下一點空隙以保持溝36之保持用底壁37來定 ,並維持本身的重量,為了避免和嵌入部3 〇及其他部分接 觸’收容空間3 4形成了比較大的間隙。 凸緣39於端壁33a以及33b之上部一體成形。凸緣39 圖7所示,由於嵌入部30於托盤本體2〇a之保持孔以以及$ 内貫通而呈現被保持的狀態,被放置於上部框22之保持 緣部,防止嵌入部30從保持孔21及23於下方落下。如 ^圖8所不,在凸緣39之下面,有各個定位針孔42突出·, ^些定位針孔42如圖8C所示,相對於上部框22形成之 針孔2 5而嵌合。 定位針孔42之下端安裝有蓋子43,嵌入部3〇可相 本體2 0a向上方保持。於是,各嵌入部3〇相對於托、 20a可定位並被支撐住。但是,定位孔託和定位針533317 V. Description of the invention (20) As shown in FIG. 8, the protrusions 35, 36 each protruding from the space 34 of the end wall 33a, and the bottom wall 37 for holding. A through hole 38 is formed in the bottom of the accommodation space 34 formed as shown in Fig. 8A to hold the substrate end of the memory module 10 held. And 33b are formed on the inner side with respect to the inner periphery of the accommodating protrusion 35, and a retaining groove is formed as shown in FIG. 8B. The protectors 12 between the bottom walls 37 pass through the through holes 38 and are exposed in the lower holding holes 36. Both ends of the memory module 10 can be inserted freely from above as shown in FIG. A tapered guide groove 42 is formed above the holding groove 36 to introduce the ends of both sides of the memory module 10 into the holding groove 36. Inside the insertion portion 30, the memory module 10 leaves only a little space in the y-axis direction and the γ-axis direction to hold the groove 36. The bottom wall 37 is used to maintain its own weight. 30 and other parts contact the 'containment space 34', forming a relatively large gap. The flange 39 is integrally formed on the upper portions of the end walls 33a and 33b. Flange 39 As shown in FIG. 7, the inserting portion 30 is held in the holding hole of the tray body 20a and penetrates inside, and is held in the retaining edge portion of the upper frame 22 to prevent the inserting portion 30 from being held. The holes 21 and 23 fall below. As shown in FIG. 8, below the flange 39, each positioning pin hole 42 protrudes. As shown in FIG. 8C, the positioning pin holes 42 are fitted to the pin holes 25 formed in the upper frame 22. A cover 43 is attached to the lower end of the positioning pin hole 42, and the insertion portion 30 can be held upward with respect to the body 20a. Then, each of the inserting portions 30 can be positioned and supported with respect to the holder 20a. However, positioning holes and pins
在 盤 體 於托 盤本In the tray
533317 五、發明說明(21) 孔42之間的空隙宜設定得大些,使之到可以讓嵌入部3〇對 於托盤本體20a沿著X軸方向及γ軸方向移動的程度。°如後 所述,各嵌入部30必須相對於各壓出板76及各凹槽5〇決定 各f的位置,因為必須相對於托盤本體2〇a而移動曰。又、,、 各嵌入部30由於需要相對於托盤本體2〇3在2軸方向剛好可 ^移ί,所以如圖8C所示之蓋子43相對於定位針孔42之下 L: Ϊ裝ί ί許嵌入部30和托盤本體20a之間z軸方向的相 對私動。此外’下部框24上形成保持孔23,相對於此之參 入部3〇之下端部外形之空隙和定位孔25、定位針孔49之心 略同一,喪入部3〇相對於托盤本體…防止不必 凸緣定=广及331)形成了,為了貫通 部的下方定位孔41 ::;4定2:二於端壁仏·之底 出柘7fi夕仅杜』π 在上方疋位孔上插入如圖6所示之壓 =之:持板78上所形成之定位針孔8533317 V. Description of the invention (21) The gap between the holes 42 should be set larger so that the insertion part 30 can move to the tray body 20a along the X-axis direction and the γ-axis direction. ° As will be described later, the positions of each f must be determined relative to each of the push-out plates 76 and each of the grooves 50, because they must be moved relative to the tray body 20a. Also, since each of the inserting portions 30 needs to be movable in the two-axis direction with respect to the tray body 203, the cover 43 shown in FIG. 8C is positioned below the positioning pin hole 42. L: Ϊ 装 ί ί The z-axis direction may move relatively privately between the embedding portion 30 and the tray body 20a. In addition, a holding hole 23 is formed in the lower frame 24, and the gap of the outer shape of the lower end of the engaging portion 30 is the same as the center of the positioning hole 25 and the positioning pin hole 49. The recessed portion 30 is relative to the tray body. Flange set = Guang and 331) was formed, in order to locate the lower hole 41: ;; 4 set 2: two to the end wall 仏 · bottom out 柘 7fi Xi Du only in the upper part of the through hole Pressure shown in FIG. 6 = of: positioning pin hole 8 formed on the holding plate 78
出板76和嵌入部3〇的位 伏疋J I 圖6所示之於測#用凹^又在下方定位孔41插入了如 孔56,相對於it用凹凹 引52所形成之定位針 記憶體模組Η之基::=位Ϊ可決定維持於嵌入部30之 ^ ^ ^ ^ ^2 0 ^ ^ 搬送基部44相料保持凹_ 軸方向搬送。托盤 彈簧46 (或壓力油封) 2试頭基底48,藉由諸如 部“中’於測試頭基底48上二=二是,在托盤搬送基 列4用托盤2〇從離開凹槽50的 533317 五、發明說明(22) 方向施加彈簣力 在測疋部1 0 2之測試用托盤2 〇和測試頭冗的構造關係 如下所述·· a 4 ^先如圖9所示,測試頭基底4 8之上經由共通測試 及個別測試基板66沿x轴方向配置複數個凹槽5〇。 20中為到W凹槽50之配置數目宜為圖7所示於測試用托盤 〇中又到保持之嵌入部3 〇配置數目之整數分之一。 图q所一如胃圖7所不之嵌人部3 G沿X軸方向配置成1 6時, 圖所不之凹槽50則沿X軸方向以16個的1/2,亦個 置數目來配置。又,图q辦—^Z亦即8個的配 間距岸A PI 7 :斤不之各凹槽間之X軸方向的配置 户。2 =二之:欠入部30於x軸方向之配置間距的兩 ;=樣的配置數目和配置間距來配置凹槽50,才會如 維持的全兩次)為測試用托盤内20所 記之;= ::::;Γ之;板端子12沿著x輛方向被插入數如編圖: 丁之各凹槽5 0之凹槽溝51中並同時作 ΰ9所 所不之測試用托盤20沿乂軸方:二使圖7 配置間距移動,接下來偶數 ^入wox軸方向之 模組10之基板端子12沿著X軸方^祜可數編唬)之記憶體 槽50之凹槽溝51中並同時作 Η9所不之各凹 盤2° 2 ίΓ有記憶體模組10才得以二亍測ί持於測試用托 圖9所示’各凹槽50具有:由沿著Υ軸方向之凹槽溝The position 76 of the output plate 76 and the embedding portion 30 is shown in FIG. 6. The recess for the test # is inserted into the positioning hole 41 below, such as the hole 56, and the positioning pin memory formed by the recessed recess 52 for it. The base of the module :: == Ϊ can decide to maintain the ^ ^ ^ ^ ^ 2 0 ^ ^ in the embedding section 30. The conveying base 44 phase material is kept concave _ axis direction. Tray spring 46 (or pressure oil seal) 2 Test head base 48, such as the part "in the middle" on the test head base 48, two = two, in the tray transport base 4 with the tray 20 from the groove 50 from 533317 five 2. Description of the invention (22) An elastic force is applied in the direction of the test tray 2 of the test section 10 and the redundant structural relationship between the test head and the test head is as follows: a 4 ^ First, as shown in FIG. 9, the test head base 4 A plurality of grooves 50 are arranged along the x-axis direction through the common test and the individual test substrate 66 on the top 8. The number of the grooves 50 to the W groove 50 in 20 should be shown in FIG. 7 in the test tray 0 and held. The embedded part 3 is an integer one of the number of placements. As shown in the figure q, the embedded part 3 G shown in FIG. 7 is arranged along the X axis direction to 16 and the groove 50 shown in the figure is along the X axis direction. It is arranged with 1/2 of 16 and the number of units. Also, the figure q— ^ Z, that is, the eight pitches A PI 7: the user who arranges the grooves in the X-axis direction. 2 = two: two of the arrangement pitch of the under-entry portion 30 in the x-axis direction; = the number of sample arrangements and the arrangement pitch to configure the groove 50, and then it will be maintained twice as it is) for the test support What is written in Nei 20; = ::::; Γ; The plate terminal 12 is inserted in the direction of x vehicles as shown in the drawing: each groove of D is in groove 51 of groove 0 and it is also used as ΰ9. The test tray 20 is along the y-axis: Secondly, move the arrangement in Figure 7 to the next distance, and then evenly insert the substrate terminals 12 of the module 10 in the wox-axis direction along the x-axis (^ (countable)) The grooves 51 of 50 are also simultaneously used as each of the indentations 2 ° 2 which are not in the 9th position. Only when the memory module 10 is used, can it be measured. The test results are shown in FIG. 9 'Each groove 50 has: Groove groove
第25頁 533317Page 533 317
51所形成之凹槽本體53和維持此凹槽本體53之台座68。a 座68連結於個別測試基板66之上部。又經由台座μ : 槽本體53之外周安裝有沿γ軸方向之細長貫通孔54 凹槽導引52 ’在凹槽本體㈣軸方向之兩端和 ^ a導引52之間形成和貫通孔54之兩端部對應之迴避 。如圖6所示,在這些迴避溝55中,嵌入部3〇之端辟 及33b之下端所形成之突起部35可進入,在突起部=保 ,溝36維持兩侧端之記憶體模組1〇之基板端子丨2可以好 插入凹槽50之凹槽溝51内。 σA groove body 53 formed by 51 and a pedestal 68 maintaining the groove body 53. The a seat 68 is connected to the upper portion of the individual test substrate 66. Via the pedestal μ: the groove body 53 is provided with an elongated through hole 54 along the γ axis direction along the y-axis direction. A groove guide 52 is formed between the both ends of the groove body ㈣ axis direction and the ^ a guide 52. Avoidance at both ends corresponds. As shown in FIG. 6, in these avoidance grooves 55, the protrusions 35 formed at the ends of the embedding portion 30 and the lower end of 33b can enter, and the protrusions = guaranteed, and the grooves 36 maintain the memory modules on both sides The substrate terminal 10 of 10 can be inserted into the groove groove 51 of the groove 50. σ
再者,如圖10所示,在凹槽5〇之凹槽溝51内部配置有 ,槽端子58。凹槽端子58在記憶體模組1()之下端形成之基 J =12插入凹槽溝51内的狀態下,相對於基板端子。以 Μ孔u Γ連接著。凹槽端子58透過台座68、個別測試基板 δίΤίί ,1則ί基板64及測試頭基底48之内部配線連接測試 田 凋忒盗TS,因而可讀取各記憶體模組1 0之測試結 又,本實施型態中,如圖1〇所示,在凹槽溝51底部設 有接巧憶體模組1 〇下端之襯墊6〇和向上給予襯墊6〇彈簧 f之反ί彈肖6 2。並且’在對於記憶體模組1G不施任何外 的狀悲下,可將記憶體模組10之下端從凹槽溝51向上壓 9Π Μ Ϊ ΐ ,在維持於搬送基底44之上的測試用托盤 J的上。Ρ ’配置有用來在垂直方向(ζ方向)移動壓 76之Ζ軸驅動單元70。此2轴驅動單元7〇具有:共通驅動板Further, as shown in FIG. 10, a groove terminal 58 is disposed inside the groove groove 51 of the groove 50. The groove terminal 58 is opposite to the substrate terminal in a state where the base J = 12 formed at the lower end of the memory module 1 () is inserted into the groove groove 51. They are connected by M holes u Γ. The groove terminals 58 pass through the pedestal 68, the individual test substrates δίΤί, 1 ί substrate 64 and the internal wiring of the test head base 48 to test the field TS, so that the test results of each memory module 10 can be read. In this embodiment, as shown in FIG. 10, a gasket 60 for the lower end of the memory module 10 is provided at the bottom of the groove 51, and a spring 6 is provided to the gasket 6 upward. 2. And 'without any sorrow to the memory module 1G, the lower end of the memory module 10 can be pressed upward from the groove groove 51 by 9Π Μ Ϊ ΐ for the test maintained on the transport substrate 44 On tray J. P 'is provided with a Z-axis drive unit 70 for moving the pressure 76 in the vertical direction (ζ direction). This 2-axis drive unit 70 has: a common drive board
533317 五、發明說明(24) 72、匹配板74、保持壓出板76之保持板78。 在壓出板7 6之下面形成最後用來按壓各記憶體模組1 〇 上端部之按壓面71。在按壓面71之Y軸方向之兩端部之位 置’突出於下方之導引突起73從壓出板76之下面一體成 形。又,導引犬起73可進入嵌入部3〇之收容空間34之内 部0 在導引突起73之内部,形成一導引溝77,可使記憶體 換組1 0之兩上端部被插入且校正記憶體模組丨〇之嵌入部3 〇 之傾斜度。於導引溝7 7之下端形成錐狀部7 5,可輕易將記 憶體模組1 0之兩上部側端部插入導引溝7 7内。533317 V. Description of the invention (24) 72, matching plate 74, holding plate 78 holding the pressing plate 76. A pressing surface 71 for pressing the upper end of each memory module 10 is formed below the pressing plate 76. The guide projections 73 protruding below the positions of both ends of the pressing surface 71 in the Y-axis direction are integrally formed from the lower surface of the pressing plate 76. In addition, the guide dog 73 can enter the inside of the accommodation space 34 of the embedding portion 30. A guide groove 77 is formed inside the guide protrusion 73, so that two upper ends of the memory replacement group 10 can be inserted and Correct the inclination of the embedded part 30 of the memory module 丨 〇. A tapered portion 75 is formed at the lower end of the guide groove 7 7 so that the two upper side end portions of the memory module 10 can be easily inserted into the guide groove 7 7.
在保诗壓出板76之保持板78之Y轴方向之兩端部的下 =,設有定位針孔80。當保持板78往2軸方向之下方移動 時,此定位針孔80被插入嵌入部3〇之上方定位孔4〇之内 部,於是可決定壓出板7 6和記憶體模組的位置。 壓出板76及保持板78以相對應於凹槽5〇之^軸方向之 配置間距的間距和西己署私β、L # v ^ 70 s柙配置數目沿者X軸方向配置複數個,各 自被保持於複數個懸架桿82的下端。懸架桿82 相斟:3保ΐ於個別驅動板84的下面。個別驅動板84亦以Positioning pin holes 80 are provided below the two ends of the holding plate 78 in the Y-axis direction of the Bosch press plate 76. When the holding plate 78 is moved downward in the two-axis direction, the positioning pin hole 80 is inserted into the positioning hole 40 above the insertion portion 30, so that the positions of the pressing plate 76 and the memory module can be determined. The pressing plate 76 and the holding plate 78 are arranged at a distance corresponding to the arrangement distance in the ^ -axis direction of the groove 50 and the arrangement number of β, L # v ^ 70 s. Each is held at the lower end of the plurality of suspension levers 82. Suspension lever 82: 3 is secured under the individual drive plate 84. Individual drive boards 84 are also
机荖)τι/古凹^曰50之χ軸方向之配置間距的間距和配置數目 由移動的複;個收容溝86内部以自 別驅動板84相對於匹過=板78、懸架桿82及個 配板74呈一懸吊支撐狀態,個別驅動机 ι) τι / 古 凹 ^ 50 The arrangement distance and the number of arrangement distances in the χ-axis direction of 50 are determined by the number of movements; the interior of each receiving groove 86 is driven by a separate drive plate 84 relative to the plate = 78, the suspension rod 82, and Each distribution plate 74 is in a suspended support state, and is individually driven
533317533317
板84相對於收容溝86決定並保持位置。 匹配板74和共通驅動板72如圖12A至圖12G所示,以連 結塊92連結,彼此之間一面維持同一間隔,一面可沿z轴 方向移動。此外’用來在z軸方向移動匹配板74和共通驅 動板72的驅動機構(壓力汽缸或馬達驅動嚣等)在圖示中 如圖6所示,在共同驅動板72之下面,對應於各個別 驅動板84上部,沿著γ軸方向安裝有一對接觸汽缸88。在 各接觸汽缸88裡,按壓襯墊9〇被設置為可以在2軸方向自 由驅,,如後所述,藉由既定的時間表,可以按壓從匹配 板7 4浮上來之個別驅動板8 &至下方。 卸下部4 0 0 在卸下部40 0中亦設有:設於載入部3〇〇之)^搬送裝置 303和同一構造之χγ搬送裝置4〇3。此〇搬送裝置4〇3亦具 備:Y軸軌道401、添加於此γ軸軌道4 〇1且可在收納用托盤 2 04和測試用托盤2〇之間以正負γ轴方向移動之χ軸執道 402、沿此X軸軌道4〇 2且可在正負X轴方向移動之可動頭 4 0 4 ’在此可動頭4 〇 4安裝有如圖5所示之記憶體模組把持 機構50 0。藉由此χγ搬送裝置4〇3,可從搬送至卸下部The plate 84 determines and maintains a position with respect to the receiving groove 86. As shown in Figs. 12A to 12G, the matching plate 74 and the common driving plate 72 are connected by a connecting block 92, while maintaining the same interval between each other, while being movable in the z-axis direction. In addition, a driving mechanism (such as a pressure cylinder or a motor driving mechanism) for moving the matching plate 74 and the common driving plate 72 in the z-axis direction is shown in FIG. 6. Below the common driving plate 72, corresponding to each A pair of contact cylinders 88 are mounted on the individual drive plates 84 along the γ-axis direction. In each contact cylinder 88, the pressing pad 90 is set to be able to drive freely in the two-axis direction. As described later, with a predetermined schedule, an individual driving plate 8 floating from the matching plate 74 can be pressed. & to the bottom. The unloading section 400 is also provided in the unloading section 400: a transfer device 303 provided in the loading section 300) and a χγ transfer device 403 having the same structure. The 〇 transport device 403 also includes a y-axis rail 401, a γ-axis rail 401 added to the γ-axis rail 401, and a χ-axis holder that can be moved in the positive and negative γ-axis directions between the storage tray 204 and the test tray 20. Track 402, a movable head 4 0 4 that can move in the positive and negative X-axis directions along this X-axis track 4 0 2 'here, the movable head 4 0 4 is equipped with a memory module holding mechanism 50 0 as shown in FIG. 5. With this χγ transfer device 403, it is possible to transfer from the transfer to the unloading section.
之測試用托盤20將測試完畢之記憶體模組10裝載於^納用 托盤2 0 4。 又’在卸下部400設有一對窗部406a,406b,可使被 運送至該卸下部4〇〇之收納托盤2〇4從下方迎上來。如所記 述的’在各個窗部4〇 6a, 40 6b的下側設有用來升降收納用The test tray 20 loads the tested memory module 10 in the tray 204 for receiving. Furthermore, a pair of window portions 406a, 406b are provided in the unloading portion 400, and a storage tray 204 that is transported to the unloading portion 400 can be brought up from below. As described in the description below, 'the lower side of each window portion 406a, 406b is provided for lifting and storing.
533317 五、發明說明(26) 一 托盤204之設定板210,210,可在此降落載滿測試完畢記 憶體模組10之收納用托盤204,此載滿之托盤2 〇4再交接給 中間臂208。 ° 附可一提’在本實施型態中’可分類之類別的最大數 目即使是8種,在卸下部400之窗部406a,406b最多只能配 置兩個收納用托盤204。而且,同一時間可以分出的類別 限制於兩類。一般來說,良品可以分為高速反應零件、中 素反應零件、低速反應零件三個類別,於此再加上不良品 則為四個類別以很充分,有時在測試結果不明確的時候需 要再測試,會在這些類別之外增加其他類別。 如此’卸下部400之窗部4〇6a,406b所配置之兩個收 納用托盤2 0 4若出現在此分類以外的記憶體模組丨〇,宜從 卸下部400將一個收納用托盤2〇4送回儲存部2〇〇,取而代 之將新產生類別之記憶體模組丨〇用收納用托盤2 〇4傳送至 卸下部4 0 G,儲存該記憶體模組丨〇。 但’在分類作業途中進行收納用托盤2 〇 4之代換時, 其間必須中斷分類作業,於是出現性能下降的問題。於 是’在本實施型態之處理器1中,卸下部4 〇 〇之測試用托盤 20和窗部406a,40 6b之間設有緩衝部4〇5,此緩衝部40 5可 暫時負責保管偶而產生的記憶體模組丨〇類別。 例如,在緩衝部405中除了具有儲存3〇〜50個之多的記 憶體模組1 0的容量,也設置有記憶裝置,該記憶裝置將緩 衝部4 0 5各個健存位置所儲存的記憶體模組丨〇類別記憶起 來’每次都會記憶每個暫時被保管於缓衝部4 〇 5之記憶體533317 V. Description of the invention (26) A setting plate 210, 210 of the tray 204 can be dropped here to the storage tray 204 filled with the memory module 10 which has been completely tested, and the filled tray 2 is then transferred to the middle arm. 208. ° Note that even if the maximum number of categories that can be classified ‘in this embodiment’ is 8 types, a maximum of two storage trays 204 can be arranged in the window portions 406 a and 406 b of the removal unit 400. Moreover, the categories that can be separated at the same time are limited to two categories. Generally speaking, good products can be divided into three categories: high-speed reaction parts, medium-reaction reaction parts, and low-speed reaction parts. In addition, there are four categories for defective products, which are sufficient. Sometimes when the test results are not clear, it is necessary Retesting will add other categories beyond these. In this way, if the two storage trays 204 arranged in the window sections 406a and 406b of the unloading section 400 appear in a memory module other than this classification, one storage tray 2 should be removed from the unloading section 400. 4 Return it to the storage unit 200, and replace it with the newly generated type memory module 丨 〇 using the storage tray 208 to the unloading unit 40 G to store the memory module 丨 〇. However, when the replacement of the storage tray 204 in the middle of the sorting operation, the sorting operation must be interrupted in the meantime, and a problem of performance degradation occurs. Therefore, in the processor 1 of the present embodiment, a buffer portion 400 is provided between the test tray 20 of the unloading portion 400 and the window portions 406a and 40 6b, and this buffer portion 40 5 can temporarily take care of the occasional storage. The generated memory module category. For example, in the buffer section 405, in addition to the capacity of storing 30 to 50 memory modules 10, a memory device is also provided. The memory device stores the memory stored in each of the healthy positions in the buffer section 405. Body module 丨 〇Category memorize each time will memorize each memory temporarily stored in the buffer section 405
第29頁 533317Page 533 317
杈組l 〇的類別和位置。然後,在分類作業的空 4〇5載滿時,在緩衝部4G5所保管的記憶體模組^類別= 之收納用托盤204會從儲存部200叫出,收納 收二, 此時,緩衝箱中暫時保管之記以 有可能包括複數個類別,若是如此’則宜於叫出收納 Γ 盤204之際,一次將複數個收納部托盤2〇4叫至 € 之窗部406a, 406b 。 以下說明動作。 首先,將配合圖11A〜圖11E說明記憶體模組儲存部2〇 的動作。在圖11 A〜圖11E中,載滿測試前記憶體模組1〇之 供給用托盤2 02收納於托盤收納部21 2的每一層中,以下狀 連續說明將此設定於處理器1之載入部3〇〇中二動作和將^ 滿於處理器1之卸下部40 0測試完畢記憶體模組1〇之收納用 托盤204移送至托盤收納部214的動作。 ' 例如,從托盤收納部21 2之最上層取出供給用托盤2〇2 時,圖11 A所示之升降器2 0 6被移動到托盤收納部2丨2之最 上層的咼度位置’在圖4B所示之流體汽红206a中將托盤收 納部212最上層之供給用托盤2〇2壓送至升降器206中。大 約在此時,使中間臂208朝升降器20 6之直上方向移動。 接下來,載置供給用托盤20 2之升降器上升至和中間 臂2 08交接的位置,藉由中間臂2 08的鉤狀機構2 08b的關 閉’可維持供給用托盤202的接收。於是,於是可朝目的 位置之載入部30 0之下部移動中間臂208。在此移動之前, 必須先將載入部3 0 0之設定板21 〇下降至下限位置。The type and position of the branch group l0. Then, when the space 405 of the sorting operation is full, the storage module 204 stored in the buffer unit 4G5 ^ category = storage tray 204 is called out from the storage unit 200, and the storage is closed. At this time, the buffer box The temporary storage notes in China may include multiple categories. If so, it is appropriate to call the storage Γ tray 204 at a time, and call the storage trays 204 to the windows 406a and 406b at one time. The operation will be described below. First, the operation of the memory module storage unit 20 will be described with reference to FIGS. 11A to 11E. In FIGS. 11A to 11E, the supply tray 2 02 that is fully loaded with the pre-test memory module 10 is stored in each layer of the tray storage section 21 2, and the following description will be continued to set the load on the processor 1. The second operation of the input unit 300 and the operation of transferring the storage tray 204 of the memory module 10 to the tray storage unit 214 after the test of the unloading unit 400 that is full of the processor 1 are completed. 'For example, when the supply tray 20 is taken out from the uppermost layer of the tray storage section 21 2, the lifter 2 06 shown in FIG. 11A is moved to the uppermost position of the tray storage section 2 丨 2' at In the fluid vapor red 206a shown in FIG. 4B, the supply tray 202 of the uppermost layer of the tray storage portion 212 is pressure-fed into the lifter 206. At about this time, the intermediate arm 208 is moved in the straight upward direction of the lifter 20 6. Next, the lifter on which the supply tray 202 is placed is raised to a position where it intersects with the intermediate arm 20 08, and the receiving of the supply tray 202 can be maintained by closing the hook mechanism 20 08b of the intermediate arm 20 08 '. Then, the intermediate arm 208 can be moved toward the lower portion of the loading portion 300 in the destination position. Before this movement, the setting plate 21 of the loading section 300 must be lowered to the lower limit position.
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此狀態如圖11 B所示,在此僅上升設定板21 〇 (或者, 當附加使中間臂2 0 8朝正負Z軸方向升降之功能時,僅下降 中間臂208側),中間臂208之鉤狀機構208b開啟,供給用 托盤20 2被交接至設定板21〇。然後,從此位置等待中間臂 208通過之後,如圖1 ic所示,設定板210上升至上限位置 且供給用托盤2 〇 2被設定於載入部3 0 0中。就這樣,載滿測 試前記憶體模組1〇之供給用托盤202被設定於載入部3〇〇的 動作完成。This state is shown in FIG. 11B. Here, only the setting plate 21 is raised (or, when the function of raising and lowering the intermediate arm 208 in the positive and negative Z axis direction is additionally added, only the intermediate arm 208 side is lowered). The hook mechanism 208b is opened, and the supply tray 202 is transferred to the setting plate 21o. Then, after waiting for the middle arm 208 to pass from this position, as shown in FIG. 1 ic, the setting plate 210 is raised to the upper limit position and the supply tray 2 02 is set in the loading section 300. In this way, the operation of setting the supply tray 202 loaded with the pre-test memory module 10 in the loading section 300 is completed.
在圖11C中,位於載入部3〇〇下部之中間臂2〇8由於接 收載滿測試完畢記憶體模組丨〇之收納闬托盤2〇4,移動至 卸下部400的右側。在此移動之前,卸下部4〇〇右側的設定 板210下降至下限位置。然後,在此僅上升設定板21〇 (或 者’當附加使中間臂2 〇 8朝正負Z軸方向升降之功能時,僅 下降中間臂2 0 8側),藉由中間臂2 〇 8之鉤狀機構2 0 8b之關 閉’可維持將收納用托盤2 〇 4交接至中間臂2 〇 8的動作。In FIG. 11C, the middle arm 208 located at the lower part of the loading section 300 receives the storage tray 404 of the memory module that has been fully tested, and moves to the right side of the unloading section 400. Before this movement, the setting plate 210 on the right side of the removal section 400 is lowered to the lower limit position. Then, only the setting plate 21o is raised here (or 'When the function of raising and lowering the intermediate arm 208 in the positive and negative Z axis direction is added, only the intermediate arm 208 side is lowered], by the hook of the intermediate arm 208 The closing of the shape mechanism 2 0b can maintain the operation of transferring the storage tray 2 04 to the middle arm 2 08.
接下來如圖11 D所示,中間臂2 0 8被移動至上升位置預 備之升降器2 06上部,在此中間臂20 8之鉤狀機構20 8b開 啟’收納用托盤20 4被交接於升降器20 6上。然後,如圖 UE中所示,升降器206下降至托盤收納部21〇既定之空層 ^在本例中從上數下來第三層)之後,使用如圖4所示之 流體汽缸206b將收納用托盤204引進托盤收納部214。就這 樣’將載滿測試完畢記憶體模組1〇之收納用托盤2〇4從卸 下部40 0移送至托盤收納部2 14的動作完成。 如此,使用本實施型態之托盤移送裝置時,不需要升Next, as shown in FIG. 11D, the middle arm 2 0 8 is moved to the upper part of the lifter 20 06 prepared, where the hook mechanism 20 8 b of the middle arm 20 8 is opened, and the storage tray 20 4 is handed over to the elevator. Device 20 6 on. Then, as shown in FIG. UE, the lifter 206 descends to the tray storage section 21 (the predetermined empty floor ^ in this example, counts down from the third floor in this example), and then uses the fluid cylinder 206b shown in FIG. 4 to store the storage The tray accommodating portion 214 is introduced with the tray 204. In this way, the operation of transferring the storage tray 204 filled with the tested memory module 10 from the lower part 400 to the tray storage section 214 is completed. In this way, when using the tray transfer device of this embodiment, there is no need to lift
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降托盤收納部2 1 2 2〗4,张1、/ πν τ ^ 邱?1?叫4夕u*, 所亦不需要設定這些牦盤收納Lower tray storage section 2 1 2 2〗 4, Zhang 1, / πν τ ^ Qiu? 1? It is called 4 evening u *, so you do n’t need to set these trays for storage.
^ ^ 邛包括升降軌跡的空間。而且,測試裝I 至少可以在高度方向小型化。 』式裝置 此外,圖11 A〜圖1 1 E所示之處理程序只不過是其 個例子’根據本發明弁隊哭9 〇 p1? 914,,^7 升降15 20 6可進入一對托盤收納部 212’ 214所收納的托盤2〇2,2〇4任何一者的構造, 載入部300及卸下部4〇〇和托盤收納部212,214之間可= 進入讓合一個托盤2〇2,204。^ ^ 邛 Includes space for trajectories. Moreover, the test device I can be miniaturized at least in the height direction. In addition, the processing procedures shown in Fig. 11A to Fig. 1E are just an example. According to the present invention, the team cries 9 〇p1? 914 ,, ^ 7 can be raised and lowered 15 20 6 to enter a pair of tray storage The structure of any one of the trays 202, 204 accommodated in the section 212 '214, and between the loading section 300 and the unloading section 400, and the tray storage sections 212, 214 = access to a single tray 200 , 204.
士例如,當供給用托盤20 2和收納用托盤2〇4為同一托盤 時:載滿記憶體模組10之供給用托盤2〇2可如圖丨u〜圖^ ^ 所示之步驟被移送至載入部300,然後此載入部300之估己 用托盤202空出時,在中間臂2〇8直接或間接將此移送至卸 下部40 0作為收納用托盤204來使用。 又’於卸下部4 〇 〇載滿記憶體模組丨〇之收納用托盤拖 長被收納至托盤收納部2丨4之一方,但利用托盤收納部2工2 那邊的二層可增加分類數目,作出彈性的處理。For example, when the supply tray 202 and the storage tray 204 are the same tray: The supply tray 202 filled with the memory module 10 can be transferred as shown in the steps shown in FIG. When it arrives at the loading section 300, and then the estimated tray 202 of the loading section 300 is vacated, it is directly or indirectly transferred to the unloading section 400 by the middle arm 208 and used as the storage tray 204. Also, the storage tray filled with memory modules in the unloading section 4000 is extended to one of the tray storage sections 2 and 4, but the classification can be increased by using the second floor of the tray storage section 2 and 2 Number, make flexible treatment.
換句話說,各自獨立使用供給用托盤2〇2和收納用托 盤204時,若供給用托盤數為a,收納用托盤數為b,分類 數為η ’收納用托盤2〇2若未在B = A + (n-1)以上個,則無法 連續動作,但藉由這些托盤2〇2,2〇4的共用,可進行到 n = B + l個連續分類動作。 其次,供給用托盤2 02從上述之記憶體模組儲存部200 被設定於載入部3〇〇之窗部306中,在供給用托盤202載滿 之測試前記憶體模組1〇在如圖1A及圖1B所示之χγ搬送裝置In other words, when the supply tray 202 and the storage tray 204 are used independently, if the number of supply trays is a, the number of storage trays is b, and the number of classifications is η ', the storage tray 202 is not in B. = A + (n-1) or more, continuous operation cannot be performed. However, by sharing these trays 202 and 204, n = B + 1 continuous classification operations can be performed. Next, the supply tray 202 is set from the above-mentioned memory module storage section 200 in the window section 306 of the loading section 300, and the memory module 10 is tested before the supply tray 202 becomes full. Χγ transfer device shown in FIGS. 1A and 1B
第32頁 533317 五、發明說明(30) 3〇3被移載至記憶體模組之測試 試用托盤20的狀態下被搬送=後二在搭載於測 :二隐體模組〗。於·…101=予:^ 贩或低溫)或被冷卻,然後在測定部1〇2之測=问 住。此朝測試頭方向之按壓係在搭載於、則用 '被按 態下進行,可同時按壓好幾個記憶體模㈣。毛疏20之狀 用托: 示之ϊ持複數個記憶體模組10之測試 用托孤20如圖6所不,猎由托盤搬送基部44從苴 搬,至保持於測試頭基底48上部之凹槽5〇之上方位彳,置 決定出相對於凹槽5 〇之位置而停止。 ° 其次,從如圖12Α所示之位置至如圖12β ❻驅動單元7〇沿ζ方向下降移動。於是,如圖 持板78下面所形成之定位針孔8〇進入測試用乾入 部30所形成之上方定位孔40内部,維持於壓出板78^== 部3 0之記憶體模組1 〇的位置於是決定。 人 同時,各壓出板76之導引突起73進入嵌入部3〇之 空間34之内部,記憶體模組10之兩上部側端部於是插入 引溝77,收容於嵌入部30之記憶體模組1〇之傾斜度因此 校正’記憶體模組1 0相對於壓出板7 6之按壓面7丨約略保持 直 此時’如圖6所示之壓出板76之保持板78對接於巍入 部30之上面’肷入部30和托盤20 —起被按壓至下方 作 此時,如圖6所示之壓出板之按壓面71和記憶體模組1 〇一上’ 端部完全不接觸。 ' °Page 32 533317 V. Description of the invention (30) 3〇3 is transferred to the test of the memory module The trial tray 20 is transported = the next two are installed in the test: two hidden module. Yu ... 101 = I: ^ vendor or low temperature) or cooled down, and then measured in the measurement section 102 = ask. The pressing in the direction of the test head is carried in the "pressed" state, and several memory modules can be pressed at the same time. The support for the shape of the Maoshu 20: The test support 20 shown in FIG. 6 holding a plurality of memory modules 10 is shown in FIG. 6. The orientation above the groove 50 is 彳, and the positioning is stopped relative to the groove 50. ° Secondly, from the position shown in FIG. 12A to FIG. 12β, the driving unit 70 moves downward in the ζ direction. Then, the positioning pin hole 80 formed under the holding plate 78 enters the upper positioning hole 40 formed by the test dry-in portion 30, and is maintained in the memory module 1 of the pressing plate 78 ^ == section 30. His position was decided. At the same time, the guide protrusions 73 of each of the pressing plates 76 enter the space 34 of the embedding portion 30, and the two upper side end portions of the memory module 10 are then inserted into the introduction grooves 77 to be accommodated in the memory phantom of the embedding portion 30. The inclination of the group 10 is therefore corrected. 'The pressing surface 7 of the memory module 10 with respect to the pressing plate 76 is kept approximately straight at this time.' As shown in FIG. 6, the holding plate 78 of the pressing plate 76 is docked with Wei. The upper part of the entry part 30, the 'entrance part 30 and the tray 20, are pressed down together at this time. As shown in FIG. 6, the pressing surface 71 of the ejection plate and the end of the memory module 101 are not in contact at all. '°
533317 五、發明說明(31) 其後,如圖12C所示’驅動單元7〇進一步沿著z方向被 下降移動時,連結塊92之下端對上盤搬送基底44之上端。 匹配板7 4和共通驅動板7 2在Z方向之間隔不變,相對於搬 送基底4 4測試用托盤2 0受到支持,所以接觸於嵌入部3 〇上 面之壓出板7 6和個別驅動板8 4 —起相對於匹配板7 4抬至上 方。但,此時如圖6所示之壓出板76之按壓面71亦和收容 於嵌入部30内部之記憶體模組1 〇上端完全不接觸。 其次,如圖12D所示,驅動單元7〇進一步沿著z方向被 下降移動時,連結塊92抵抗圖6所示之彈簧46力量將托般 基底44壓下,圖6所示之嵌入部30之突起部35下端進入^ 槽5 0之迴避溝5 5,記憶體模組1 〇下端和凹槽5 〇接觸。同 k ’凹槽50之定位針孔56進入嵌入部30之下方定位孔41 内’決定嵌入部30和凹槽50之位置。 動時, 槽溝51 在該位 盤20之 記憶體 憶體模 板74及 示任何 可和記 構0 圖12E所示,驅動單元70進一步沿著z方向被下降移 圖10所示之記憶體模組1〇下端開始進入凹槽5〇之凹 内,藉由凹槽端子50之排斥力使得記憶體模組丨〇停 置。換句話說,記憶體模組10相對於嵌入部3〇及托 向下移動而靜止,所以相對地被押回上方,於是, 模組10之上端部和圖6所示之按壓面接觸。包'括\己 組10以外之嵌入部30的托盤20、搬送基底以、匹配 共通驅動板72皆繼續下降移動。但,藉由在圖6所 一個凹槽之位置安裝彈簧等彈簧機構,嵌入部3〇亦 憶體模組10 —樣包括有在下降移動時暫時停止之社533317 V. Description of the invention (31) Thereafter, as shown in FIG. 12C, when the driving unit 70 is further lowered and moved in the z direction, the lower end of the connection block 92 faces the upper end of the upper tray transport substrate 44. The distance between the matching plate 74 and the common drive plate 72 in the Z direction is constant, and the test tray 20 is supported with respect to the conveying substrate 44. Therefore, it is in contact with the push-out plate 76 and the individual drive plate on the insertion portion 30. 8 4 —Lift up to the mating plate 7 4. However, at this time, the pressing surface 71 of the press-out plate 76 shown in FIG. 6 is also completely out of contact with the upper end of the memory module 10 stored in the embedding portion 30. Next, as shown in FIG. 12D, when the driving unit 70 is further moved downward in the z direction, the connecting block 92 resists the force of the spring-like base 44 shown in FIG. 6 to push the support-like base 44 down, and the embedding portion 30 shown in FIG. 6 The lower end of the protruding portion 35 enters the avoidance groove 55 of the groove 50, and the lower end of the memory module 10 is in contact with the groove 50. The positioning pin hole 56 of the same k 'as the groove 50 enters the positioning hole 41 below the insertion portion 30' determines the position of the insertion portion 30 and the groove 50. When moving, the groove 51 is in the memory memory template 74 of the disk 20 and shows any reconcilable structure. As shown in FIG. 12E, the driving unit 70 is further moved down in the z direction and the memory model shown in FIG. The lower end of the group 10 starts to enter the recess of the recess 50, and the repulsive force of the recess terminal 50 causes the memory module to stop. In other words, the memory module 10 moves downward with respect to the embedding portion 30 and the holder to be stationary, so it is relatively pushed back upward, so that the upper end portion of the module 10 contacts the pressing surface shown in FIG. 6. The tray 20 including the embedded portion 30 other than the self-assembly unit 10, the transport base, and the matching common drive plate 72 all continue to move downward. However, by installing a spring mechanism, such as a spring, at the position of a groove in FIG. 6, the inserting portion 30 also recalls the body module 10. This includes a company that temporarily stops during the lowering movement.
533317 五、發明說明(32) ‘一 士如圖12F所示’驅動單元7〇進一步沿著z方向被下降移 動,’連結塊44碰上測試頭基底48所具備之停止器94,因 而停止驅動單元70之下降移動。此外,藉由壓力汽缸以外 之馬達驅動等來啟動驅動單元7〇時,亦可不使用停止器 9 4 ’經由數值控制在正確的位置停止下降移動。 其次’如圖1 2 G所示,圖6所示之接觸汽缸8 8被啟動, 壓下按壓概塾90 ’且壓下浮出於匹配板74上部之個別驅動 板84 °結果’壓出板76之按壓面71壓下記憶體模組1〇,如 圖1 0所不’記憶體模組丨〇下端完全進入凹槽溝51之内部, 基板端子1 2相對於凹槽端子以電氣方式接觸。此時,圖6 所示之接觸汽缸88為了將記憶體模組10插入凹槽5〇之凹槽 溝51内部,需要具備充分的按壓力,設計上不給予超過需曰 要的過大施力。記憶體模組丨〇碰上設置於凹槽5 〇之機構端 部(在圖示中省略),決定了高度方向的位置。此時,接 ,汽缸88在行程中留下一小部份,吸收了記憶體模組1〇在 兩度尺寸上的誤差(譬如〇.3mm),藉由一定的力署圮情 體模組10設計成被按壓至下方。 二Λ u 此外’如圖12F所示之狀態’在喪入部3〇和記憶體模 、、且10的結構上皆被設計為下降動實惠暫時停止的情況下, 再如圖12G所示的狀態,藉由圖6所示之壓出板76,嵌入部 3 0和記憶體模組1 〇 —起被壓至下方。 在圖12G所示的狀態中’如圖10所示,各記憶體模組 1〇之基板端子12和凹槽端子58以電氣方式接觸,在收容於 托盤20的狀態下同時進行複數個記憶體模組1〇的測試。圖533317 V. Description of the invention (32) 'One driver is shown in FIG. 12F' The driving unit 70 is further moved downward in the z direction, and the 'connection block 44 hits the stopper 94 provided in the test head base 48, and thus stops driving. The lowering of the unit 70 moves. In addition, when the drive unit 70 is started by a motor drive or the like other than a pressure cylinder, the stop movement can be stopped at a correct position without using a stopper 9 4 ′ through numerical control. Secondly, as shown in FIG. 12G, the contact cylinder 88 shown in FIG. 6 is activated, and the pressing mechanism 90 is depressed, and the individual driving plate floating at the upper part of the matching plate 74 is pressed at 84 °. The pressing surface 71 of 76 depresses the memory module 10, as shown in FIG. 10, the lower end of the memory module 丨 〇 completely enters the inside of the groove groove 51, and the substrate terminal 12 is in electrical contact with the groove terminal. . At this time, in order to insert the memory module 10 into the groove groove 51 of the groove 50, the contact cylinder 88 shown in FIG. 6 needs to have sufficient pressing force, and is not designed to give excessive force more than necessary. The memory module 丨 〇 meets the end of the mechanism (not shown in the figure) provided in the groove 50, and determines the position in the height direction. At this time, then, the cylinder 88 left a small part in the stroke, absorbing the error of the memory module 10 in two degrees (such as 0.3mm), and using a certain force to sign the emotional module 10 is designed to be pressed down. 2 Λ u In addition, in the state shown in FIG. 12F, the structure of the funerary part 30, the memory model, and 10 is designed to be temporarily lowered when the descending movement is stopped, and then the state is shown in FIG. 12G. With the push-out plate 76 shown in FIG. 6, the inserting portion 30 and the memory module 100 are pressed down together. In the state shown in FIG. 12G 'as shown in FIG. 10, the substrate terminal 12 and the recessed terminal 58 of each memory module 10 are electrically contacted, and a plurality of memories are simultaneously carried out in a state of being accommodated in the tray 20. Testing of Module 10. Figure
533317 五、發明說明(33) 所不之接觸汽缸88之按壓被解除,驅動單元7〇被移動至 上方於疋,維持托盤20之托盤搬送基部44藉由彈簧46或 ,力=封等的返回機構返回至原來托盤搬送之高度。又, 赭由於圖1〇所示之凹槽50之凹槽高51底部之^彈彈筈 62之彈百力,記憶體模組1 〇之下端部自凹槽溝5 1下方彈過 。此外,在本發明中,作為凹槽,它不僅是圖丨〇 簧62等具有自身彈力之㈣,亦可以作為不具有自 身彈力之凹槽來使用。 憶體Ϊ Γ下二由於凹槽本身不具有1身彈力,所以記 i搬、Γ其邦/然停留在凹槽5〇上°因此,在圖6所示之托 力旦^二:4中,為了使得從凹槽5 0拔出記憶體模組丨〇的 :乇盤20及嵌入部30 —起舉至搬送高度的力量一起 外,用出圖6所示之彈簣46或壓力汽缸之上舉力。此 和凹枰50 —ί憶體模組1〇從凹槽彈過去的力量在嵌入部30 力旦二搜ίΐ之後,亦可將引起拉開嵌入部30和凹槽50之 里=彈更女裝於嵌入部3〇或凹槽5〇上,作為調整。 力卽^ it ^種構造的採用,記憶體模組1 〇無須作用多餘的 2::二槽广並可從㈣5。彈出…萬-記憶體模 藉由古於奸曰的動作失敗,圖6所示的接觸汽缸8 8亦可 i少二槽50的力防止記憶體模組10被下壓,於是 負荷。1心_模組10的損壞且也不會對托盤20作用多餘的 ’、】式用托盤20上,只移動處理器1的内533317 V. Description of the invention (33) The pressure of contacting the cylinder 88 is released, the drive unit 70 is moved to the upper side, and the tray transporting base 44 of the tray 20 is maintained by the spring 46 or the force = seal return. The mechanism returns to the height of the original pallet. In addition, since the bottom of the groove height 51 of the groove 50 shown in FIG. 10 and the elastic bullet 62 at the bottom of the elastic force 62, the lower end of the memory module 10 is bounced from below the groove groove 51. In addition, in the present invention, as the groove, it is not only a spring having a spring force such as the spring 62, but also a groove having no spring force of its own. Recalling the body Ϊ Γ lower two because the groove itself does not have a body elasticity, so I will move, Γ Qibang / Ran stay on the groove 50 °. Therefore, in the Tori Dan shown in Figure 6 ^ 2: 4 In order to pull out the memory module from the groove 50: the disk 20 and the embedding portion 30 together with the force of lifting to the transport height, use the spring 46 or pressure cylinder shown in FIG. 6 Lift up. This and the recess 50 — the power of the body module 10 that has been ejected from the groove in the insertion portion 30 can also cause the insertion portion 30 and the groove 50 to be pulled apart after the insertion portion 30 = the more female It is mounted on the insertion portion 30 or the groove 50 for adjustment. With the adoption of various structures, the memory module 1 〇 does not need to play an extra 2: 2: two slots wide and can be used from 5. Eject ... 10,000-memory module By the failure of the old-fashioned action, the contact cylinder 8 8 shown in FIG. 6 can also reduce the force of the two grooves 50 to prevent the memory module 10 from being pressed down and load. 1 heart _ module 10 is damaged and does not act on the tray 20 ’, the tray 20 is used to move only the inside of the processor 1
533317 五、發明說明(34) # ’在測定 因而大幅提 須進行記憶 得以單純化 成本化。又 整體或一部 高溫或低溫 溫度精度, 此外, 決定各零件 孑L以外,亦 體53亦可為 再者, 在本發明中 物,至少具 定位針孔80 昇測試中的#叮能门時又則广在複數個記憶體模組1 〇 體模二:二::試;定物中,無 ,於是處理器1整體得以小々理器。1内部構造 ,本實施型態之處理器丨中,、單純化及低 份配置於艙室的内部,所此種測試機構之 的-定溫度,藉此提高測:二内部得以維持 作出正確的測試。 D °己拖體模組10時之 本發明不限於上述之實施型 位置的方法並無特別限定^定匕方說’用來 可採用其他的方法。又,凹k二針孔或定位 -體的構造。 日槽本體52和凹槽本 壓出板76方面,不限於圖^所干 — ,之貫施型態, V弓丨大起73導引溝77及錐狀部75並非必須 有按壓面71就可以了。但,宜具備用來定位的 〇 根據此^驟測試完畢時,測試用托购被搬送至除熱 9 _使仔/則试完畢的記憶體模組10溫度降回室溫附 近這主要的目的是為了防止施加低溫之後會結露。 載滿降回室溫之記憶體模組10的測試用托盤20被搬送 至卸下部400,在此使用χγ搬送裝置4〇3將測試完畢的記憶 體模組10移送至收納用托盤2〇4中。此時,各記憶體模組、 1 0被移送至對應各測試結果的收納用托盤2 〇 4中。在圖j Α 所示的耗例中,「合格」的記憶體模組丨〇被移送至設於卸533317 V. Description of the invention (34) # ’In the measurement, it is greatly required to memorize, to be simplified and cost-effective. It also has high or low temperature accuracy as a whole or a part. In addition, besides determining the parts 以外 L, the body 53 can also be another. In the present invention, at least 80 liters of positioning pinholes in the test Then there are multiple memory modules 1 0. Phantom 2: 2: Trial; fixed; none, so the processor 1 as a whole can be a small processor. 1 internal structure, the processor of this implementation type, simplistic and low-level configuration inside the cabin, so the temperature of this type of testing institution-to increase the measurement: the internal can be maintained to make the correct test . The method at the time of the D body module 10 is not limited to the above-mentioned embodiment. The method of the position is not particularly limited. It can be used in other methods. In addition, the structure of a pinhole or a positioning body is concave. In terms of the sun groove body 52 and the grooved pressing plate 76, it is not limited to the pattern shown in the figure. The V bow 丨 large 73 guide groove 77 and the tapered portion 75 do not necessarily have a pressing surface 71. Okay. However, it should be provided for positioning. According to this step, when the test is completed, the test consignment is moved to heat removal 9 _ to bring the temperature of the completed memory module 10 back to near room temperature. This is the main purpose. This is to prevent condensation from forming when low temperatures are applied. The test tray 20 filled with the memory module 10 returned to room temperature is transferred to the unloading section 400. Here, the tested memory module 10 is transferred to the storage tray 204 using the χγ transfer device 4 in. At this time, each memory module 10 is transferred to a storage tray 204 corresponding to each test result. In the consumption example shown in Figure jA, the "qualified" memory module is transferred to the unloading unit.
533317 五、發明說明(35) 下部400窗部406a,406b之兩個收納用托盤204,204, 「不合格」或「需再測試」的收納用托盤2〇4被設置於卸 下部400之窗部4〇6a或406b,載置於緩衝部405之記憶體模 組1 0根據分類而被送走。根據以上的步驟,可進行記憶體 模組的測試並根據測試結果分類。 本發明可進一步作修改。圖1 3 A為本發明其他實施型 fe之處理裔1的概略平面圖,圖1 3 B為同一物的概略剖面圖 (B-B線剖面圖),首先記憶體模組儲存部2〇〇的構造不 同0533317 V. Description of the invention (35) Two storage trays 204, 204 of the lower 400 window sections 406a, 406b, and the "rejected" or "retest required" storage tray 204 are provided on the window of the unloading section 400 Part 406a or 406b, the memory module 10 placed in the buffer part 405 is sent away according to the classification. According to the above steps, the memory module can be tested and classified according to the test results. The invention can be further modified. FIG. 13A is a schematic plan view of the processing line 1 of another embodiment of the present invention, and FIG. 13B is a schematic cross-sectional view (BB line cross-section) of the same thing. First, the structure of the memory module storage section 200 is different. 0
亦即,雖然設有收納供給用托盤2 〇 2的收納部2 1 2和收 納收納部托盤2 〇 4的收納部2 1 4,作為第一升降裝置的升降 裔2 0 6 A,2 0 6 B不在它們之間,而是各自獨立設置。又,到 f入部300之供給闬托盤2〇2之設置位置只有一個(示於窗 部306) ’在鄰接於此的位置,供給用托盤2〇2藉由手動方 式進出。 一 *接下來’使用升降器2〇6A從托盤收納部212載滿記憶 體模組10的供給用托盤2〇2被取出,除了藉升降器2〇 6A維 持上升的動作而設置於載入部30 0的窗部306外,全部的記 憶體模組10被移到測試用托盤2〇之後,升降·2〇6Α便照舊 下降,空的供給用托盤2〇2z則被收到托盤收納部21 2。 抑根據以上的動作,測試前的記憶體模組丨〇被投入處理 二,# ’但從托盤收納部2 1 2取出供給用托盤2 〇 2,相反 甘""托盤2 02被收納至托盤收納部212期間,XY搬送裝置 則u式用托盤2 〇應為待機狀態。因此,在此空檔產生That is, although the storage section 2 1 2 for storing the supply tray 2 0 2 and the storage section 2 1 4 for storing the storage section tray 2 0 4 are provided, the lifter 2 0 6 A, 2 0 6 as the first lifting device. B is not between them, but is set independently. In addition, there is only one position (shown in the window portion 306) of the supply tray 002 to the f-in section 300 (at the position adjacent to this), and the supply tray 002 is manually entered and exited. 1 * Next 'Using the lifter 206A, the supply tray 002 loaded with the memory module 10 from the tray accommodating section 212 is taken out, and it is set in the loading section except that the lifter 206A maintains the ascending operation. Outside the window portion 306 of 300, all the memory modules 10 are moved to the test tray 20, and then the lift-down 206A is lowered as usual, and the empty supply tray 002z is received in the tray storage section 21 2. According to the above operation, the memory module before testing is put into processing # 2, but the supply tray 2 is taken out from the tray storage section 2 1 2; on the contrary, the "tray 2 02" is stored to During the tray storage section 212, the u-type tray 2o of the XY transfer device should be in a standby state. So in this neutral position
533317533317
五、發明說明(36) 時候’從藉由手動方式所設置的供給用托盤別匕使用^搬 送裝置3 0 3將記憶體模組1 〇移送到測試用托盤2 〇。據此, 可抑制處理器1的性能下降。 另一方面,在卸下部40 0中,從托盤收納部214僅在一 邊的窗部(本例中為右側的窗部4 〇 6 b )設置空的收納用杯 盤204,在另一邊的窗部406a中相當的位置以手動方式設 置空的收納用托盤2 0 4 z。又’在此附近,空的供給兩托盤 202中,一個(20 20用來放置不合袼的記憶體模組'一個$ (2 0 2 r )用來放置需再測試的記憶體模組。 接下來’測試完畢後,從被搬送至卸下部4 〇 〇的測試 用托盤2 0使用XY搬送裝置4 0 3將合格的記憶體模組1 〇移送 至主要設置於右側窗部4 0 6 b的收納用托盤2 0 4,此收納用 托盤2 0 4滿載之後,升降器2 〇 6 B便會下降,將之收納至托 盤收納部214中,接下來的空的收納用托盤2〇4被設於窗部 4 0 6a。在此期間,合格的記憶體模組丨〇被移送至左側以手 動方式設置的收納用托盤2 〇 4。 又’不合格的記憶體模組1 〇被移送至左侧以手動方式 設置之供給用托盤2〇2f,需再測試之記憶體模組1〇則同樣 地被移送至右側之供給用托盤2 〇 2 r。然後,這些供給用托 盤202f,202r滿載之後,以手動方式交換空的供給用托盤 202f,202r。此時,載滿將進行再測試之記憶體模組1 〇之 供給用托盤2 0 2 r仍然被設於托盤收納部2 1 2或載入部3 0 0之 窗部306右邊的位置。 藉由如此構成之實施型態之處理器1,便不需要會降V. Description of the invention (36) In the case of 'from the supply tray set by manual operation, the transfer device 3 0 3 is used to transfer the memory module 1 0 to the test tray 2 0. Accordingly, it is possible to suppress a decrease in the performance of the processor 1. On the other hand, in the removal portion 400, the tray storage portion 214 is provided with an empty storage cup and tray 204 from only one window portion (the right window portion 406b in this example) and the other window portion An empty storage tray 2 0 4 z is manually installed at a corresponding position in the portion 406 a. And 'near here, in the empty two supply trays 202, one (20 20 is used to place the non-compatible memory modules' one $ (2 0 2 r) is used to place the memory modules to be tested again. After the test is completed, the test tray 20 that has been transferred to the unloading section 4 00 uses the XY transfer device 4 0 3 to transfer the qualified memory module 1 0 to the main installation 4 0 6 b on the right side. The storage tray 2 0 4 is full. After the storage tray 2 0 4 is fully loaded, the lifter 2 0 6 B is lowered and stored in the tray storage unit 214. The next empty storage tray 2 0 4 is set. In the window section 4 6a. During this period, the qualified memory module 丨 〇 was transferred to the left-hand storage tray 2 〇4. The unqualified memory module 1 〇 was transferred to the left The supply tray 20f set manually on the side, and the memory module 10 to be retested are similarly transferred to the supply tray 2 〇2r on the right side. After these supply trays 202f and 202r are fully loaded, , Manually exchange empty supply trays 202f, 202r. At this time, full The supply tray 2 0 2 r of the memory module 1 0 to be retested is still located at the right side of the window portion 306 of the tray storage portion 2 12 or the loading portion 3 0 0. The implementation with this configuration Type of processor 1, you do not need to drop
第39頁Page 39
Claims (1)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11004276A JP2000206191A (en) | 1999-01-11 | 1999-01-11 | Test device of electronic component board |
JP00427799A JP4164182B2 (en) | 1999-01-11 | 1999-01-11 | Tray transfer device |
JP11003792A JP2000206194A (en) | 1999-01-11 | 1999-01-11 | Tray for electronic component board test and test device of electronic component board |
Publications (1)
Publication Number | Publication Date |
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TW533317B true TW533317B (en) | 2003-05-21 |
Family
ID=27275971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089100140A TW533317B (en) | 1999-01-11 | 2000-01-06 | Testing device for electronic device substrate |
Country Status (3)
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KR (2) | KR20000053458A (en) |
SG (1) | SG102563A1 (en) |
TW (1) | TW533317B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI465746B (en) * | 2011-12-28 | 2014-12-21 | Advantest Corp | Electronic component testing device |
TWI480559B (en) * | 2011-12-28 | 2015-04-11 | Advantest Corp | An electronic component transfer device, an electronic component processing device, and an electronic component testing device |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100826467B1 (en) * | 2005-12-15 | 2008-04-30 | (주)테크윙 | Test handler and shutter test handler |
KR100787857B1 (en) * | 2006-06-02 | 2007-12-24 | 송욱일 | bonding apparatus of camera module and F-PCB by pulse heating |
CN101563620A (en) * | 2006-12-21 | 2009-10-21 | 株式会社爱德万测试 | Electronic component testing equipment and method of testing electronic component |
KR101308050B1 (en) * | 2008-04-01 | 2013-09-12 | (주)테크윙 | Loading method of apparatus in order to support testing an electric device |
KR102072390B1 (en) * | 2013-06-18 | 2020-02-04 | (주)테크윙 | Test handler |
KR102674152B1 (en) * | 2019-03-07 | 2024-06-12 | (주)테크윙 | Handler for testing electronic devices |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5290134A (en) * | 1991-12-03 | 1994-03-01 | Advantest Corporation | Pick and place for automatic test handler |
US5588797A (en) * | 1994-07-18 | 1996-12-31 | Advantek, Inc. | IC tray handling apparatus and method |
JP3226780B2 (en) * | 1996-02-27 | 2001-11-05 | 東芝マイクロエレクトロニクス株式会社 | Test handler for semiconductor devices |
-
2000
- 2000-01-06 SG SG200000083A patent/SG102563A1/en unknown
- 2000-01-06 TW TW089100140A patent/TW533317B/en not_active IP Right Cessation
- 2000-01-11 KR KR1020000001176A patent/KR20000053458A/en not_active Application Discontinuation
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2002
- 2002-01-18 KR KR1020020003009A patent/KR20020021150A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI465746B (en) * | 2011-12-28 | 2014-12-21 | Advantest Corp | Electronic component testing device |
TWI480559B (en) * | 2011-12-28 | 2015-04-11 | Advantest Corp | An electronic component transfer device, an electronic component processing device, and an electronic component testing device |
US9340361B2 (en) | 2011-12-28 | 2016-05-17 | Advantest Corporation | Electronic device transfer apparatus, electronic device handling apparatus, and electronic device testing apparatus |
US9586760B2 (en) | 2011-12-28 | 2017-03-07 | Advantest Corporation | Electronic component transfer shuttle |
Also Published As
Publication number | Publication date |
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KR20000053458A (en) | 2000-08-25 |
SG102563A1 (en) | 2004-03-26 |
KR20020021150A (en) | 2002-03-18 |
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