TW533317B - Testing device for electronic device substrate - Google Patents

Abstract

A testing device for electronic device substrate is disclosed, wherein the storage portion 200 is configured with two tray accommodation portions 212, 214, the lifter 206, the middle arm 208, and the setup plate 210. The measurement portion 102 is configured with a testing trough 50 and an ejection plate 76. The memory module 10 as the testing object is moved into the measurement portion 102 under the status of being carried on the testing tray 20.

Description

533317 V. Description of the invention (1) 4 [Technical field of the invention] The present invention relates to a test device for electronic component substrates, which is used to test electronic components such as memory modules. [Known technology] Soil In the manufacturing process of electronic component substrates such as memory substrates, a memory device and the like that are finally manufactured require a test device. One such test device is known for testing a memory module at a temperature above or below normal temperature. Due to the characteristics of the memory module, such a test device must ensure that it can perform well at high or low temperatures. When using the conventional memory module test device for high temperature test or low temperature test, the memory module before the test is heated or cooled in the heating part or the cold part of the test device, and then it is taken and placed (? 卜卜and_place) Mechanism = The heated or cooled memory module is transferred to the measurement department, and the high temperature test or low temperature test is performed according to the heat added to the seven memory module. ^ Again ^ This type of test device may also apply a predetermined pattern of test signals to the memory module to be tested. This is a device for measuring electrical characteristics, commonly referred to as a 1 c tester. This type of IC tester Mostly, one kind of device is connected. When the memory module is transported to the measurement unit, the measurement unit electrically connects the grooves of the memory module and the test head by electrical milking, and then tests the memory. The module removes bad text from the crotch to classify it. Such a transfer processing device is generally called a processing port and an er. In this manual, the processor is an integrated connection type.

Page 4 ^ 533317 V. Description of the invention (2) The test device is only based on electronic components. However, in this conventional electric device, it is called that: several memory modules should be installed from the attack. Each was transported to the measurement department so that 彳 1 卩 2. In addition, the performance of moving the memory module to the target is not bad. Here, the temperature will be changed, and the test result will be added to the temperature of the memory module. Double accuracy difference is difficult to correct, especially in the low temperature test, the fear of condensation on the surface of the module, as the cooling memory: "Yes, the low temperature test is known to measure the temperature of chromium." The moisture of the road will adhere to the knots on the Si-Fruit group, which will adversely affect the test. The Si-Wu terminal or grooved end is to remove this incompatible phenomenon; the ministry (or cooling section) or the measuring section , Cover the grabbing room and add f. However, the memory module inside the grabbing room 'and 隹 =: except for constant temperature such access and put mechanism becomes complicated = two actions, except for the large, which leads to the test device A w is not even more ideal. R1 is large, complicated, and costly, and when it is moved in or moved out # 阴 side 4 boards, a large electronic component such as a fruit group is used. Base ^. The tray with the substrates arranged upright. For this kind of support, there is a tray one by one: a fixedly placed moving-in section and a moving-out section, but when it is in the drawer-like storage section, the drawer is $ Second, the storage department. The problem of the device itself becoming larger ...

533317 V. Description of the invention (3) The other side has a problem with the component substrate. Therefore, the pallets of the pallets are re-documented to make the pallets work. However, Li will need to increase the size of the tray to store and test it (hereinafter referred to as, for example, use.) [The invention is intended to be installed at the temperature of the device. In addition, the test device (1) is provided. On the one side, "like moving in or out of memory-like molds", although the electronic component substrate is considered, it is impossible to stack a plurality of disks in the carrying-in portion of a conventional test device and a drawer-like tray to store the components out of the pedestal or The components are moved into the tray storage section and raised and lowered automatically, so that the dead angle caused by the trajectory of the tray storage section is raised and lowered automatically, and then 4. It also uses the handle plate of the electronic component substrate in front of the tray storage section ( The problem is that the tray storage section of the receiving section and the tray used to store the completed electrical storage tray is empty and the supply tray cannot be solved. The first purpose is to provide an electronic element that can improve the test performance and make the test The second object of the present invention is to miniaturize and simplify the test device. The tray of the device is versatile and includes: For the stated purpose, according to the present invention, a large set of electrons such as a test device group of electronic component substrates are arranged upright on a tray. A accommodating section is provided in the carrying-out section, and the height of the hand stand is based on the movement of the tray in and out of the tray. # 6 盘The storage unit has a method for lowering the test device. Using the structure called the supply tray sub-element substrate support as a separate test for the storage tray component substrate can accurately and cost-effectively. Several types. 'Will test tray 533317

In and out, at least include: a storage section for storing the substrate of the test piece and a test and measurement section for testing; the electronic component substrate of the electronic yuanyue before or after the test is provided in the above-mentioned department: —Tray storage section, the first tray is independent and can receive the second tray storage section in the up-down direction, and the second tray is independent and can receive the second tray tray for storing the water in the second tray tray, and the first and the above are performed. Water connection: Wide: The device is installed on the first tray storage section and above; it can be raised and lowered, and the first tray or the second tray can be placed between the first tray support and the second tray storage section. It is installed on the above-mentioned first tray storage section, above and the first lifting device described above, and can move in the direction of J, and can be installed on the first tray or the second tray. Handover; and a can be raised and lowered for the destination, and the first tray or the second tray can be transferred between itself and the Qianda delivery device. In the above measurement section, a test groove is provided, which can be removed from the substrate terminal. And a die plate for an electronic component within the recess in the trial Chi state of the disc; manufactured by inserting the electronic component of the electronic component mounted on the test board substrate with the substrate terminal of the substrate is pressed into the geodetic

533317 V. Description of the invention (5) The terminal entry part can be inserted into the two parts of the electronic component board in a state where the holder on the side of the substrate of the electronic component board can move freely. The test equipment f of the electronic component substrate of the pallet can be improved during testing. The second measurement is based on an electronic component substrate. In addition, this test does not need to be performed in the test and measurement department, so it can simplify the internal structure of the test device, so as to serve the entire test and renewal class, ... Reduction of Ip, W ^ 51, lip end, and low cost in the maintenance cabin. In addition, by using temperature accuracy and :::: or a certain temperature of low temperature, | 5 can improve the anti-five test to make a correct test. In addition, miscellaneous | 丄 The tray storage unit itself ^ MEMS test equipment of the electronic component substrate, the sending device and the first but through the first-lifting equipment 1, the horizontal moving part of the dead end: the problem clothing f to transfer ,? It is not formed on the tray storage portion. At least in the height direction, the entire device can be compactly entered into both sides of the collection :: The device is installed between the tray storage section, and the transfer rate can be increased. This can not only improve the efficiency of the tray transfer, but also Can be received: order of degrees of freedom. In addition, no matter which tray is in the tray section, you can pick up j, and in which tray is stored without throwing the number of categories * 4 out, so you can be flexible in the above invention C without changing the device itself. Processing. And the first section is equipped with the first conveying device, so that

533317 V. Description of the invention (6) The first electronic component tray of the board is tested before the electronic component base is loaded. The electronic component substrate is used from the * or the second tray is sent to the above test. = Electronic component base In addition, it is advisable to enter a second board with two second substrates for loading and testing, and then place them on the first and second trays for testing the first and second trays of the Mann electronics board and store the trays. Sub-component substrate tray, and the other side ^ :, as a tray for the board. r is a tray on which the post-test electronic component substrate is preferably mounted in the first tray storage section. ^ a Partially receivable category. The support of the side inserts the board freely; the board of the electronic component above or below should be a retest disc. Furthermore, the “one tray and the second tray should be of the same type, and it should include the above-mentioned pressing plate from the above and correct the electronic component and its sieve. In addition, the test device should be fitted with a matching plate. The steps include maintaining the above-mentioned pressing device. The test device is further suitable and the test tray on the right is closer to the moving device. # 芙; The above drive device is used to move the above electrons by the above-mentioned pressing plate-to move in the above-mentioned test tray and press the above-mentioned electric element substrate mule into the groove, an auxiliary driving device for moving the matching plate of the substrate . < " ^ The plate is further included in the above-mentioned design groove with respect to the above-mentioned m-type device.

533317 V. Description of the invention (7) The tray transport base of the above-mentioned test tray is maintained at a predetermined interval. Λι π ^ ƒ The trial groove should include two grooves in the interior of the test groove:. In the direction of the substrate terminal of the 7 ° substrate, an elastic rebound is added. In addition, in order to achieve the above object, the present invention provides an electronic component substrate test tray including: 卩, forming the substrate terminal of the electronic component substrate to be exposed and , #, Β are moved into the grooves at both ends of the electronic component substrate under the moving state, and +, ^ ^ ^, so that the substrate terminals of the electronic component substrate are exposed and the high-speed embedded portion is maintained. In this case, the inserting portion includes a positioning device for positioning the brother with respect to the push-out plate for pressing the electronic component into the test groove. The J Di entry section includes a second positioning device for determining the positions of the electronic component substrate and the test groove. A number of embedded parts should be held in the tray racks to be held and in order to achieve the above-mentioned purpose, a test device for a burial board, including: 1 Provide an electronic component base nm m ^ • The above-mentioned tray for electronic component substrate testing, Pressure-measuring groove: freely insertable, the substrate terminals of the above-mentioned electronic component substrate; and the substrate terminals for mounting the f ϊ Γ element on the thunder vehicle on the test tray With groove inside. The i-out board includes plugs from both sides of the electronic component substrate.

Page 10 533317 V. Description of the invention (8) Guide grooves for entering and correcting the inclination of the above-mentioned electronic component substrate. The test of the electronic component substrate of the present invention 2 The above-mentioned pressing plate is a freely-matching matching plate. In addition, the test device for holding the electronic component substrate of the present invention is preferably a driving device for moving the above-mentioned matching plate with respect to the above-mentioned test device. Λ The tray is moved close to and away from the drive device. In order to move the upper plate in the test tray by the above-mentioned push-out plate and press the base terminal into the groove, it is advisable to cover the substrate movement of the component substrate. Driving device. … The test board for the electronic component substrate of the present invention with respect to the above-mentioned matching board of the room-out board should preferably be enclosed in the design groove at a predetermined pitch 雊 # 乂 and transported to the base. π The flexible tray holding the above-mentioned test tray. The above-mentioned test grooves are used to pull out the electronic components in the interior of the basin and include a spring to the above-mentioned test grooves. The soil plate is the direction of the spring with a rebound elastic body: if there are no special restrictions, 5 electronic component substrates are based on a note :: electronic component substrates for sub-component substrate test trays, mobile test "== holding multiple At this time, the electronics does not greatly improve the performance of the test. In addition, the loading and unloading operations are carried out in the testing unit of the test device, so that the internal money can be simplified, thereby making the entire test device small 533317 V. Description of the invention (9) -Internal or j: f low f. In addition, due to the total low of the test device of the present invention: IS 舱 inside the cabin, by maintaining the high temperature or degree inside the cabin and making 2 纟 'can improve the sub-component substrate to be tested At the time, the correct test is performed under the precise temperature of XI 1. Sending clothes (set 3), to achieve the above purpose, by the present invention, provide-a kind of tray transfer, · Department 'at least-independent of the tray and can be received in the up and down direction Yes, 3 C f is set to be connected between the pair of tray storage sections. Σ The transfer of the trays between the pair of tray storage sections is described above. In Γ: Zhiyi further includes a set in the above. Two trays Lifting and jealous placement :: move side by side, and can be moved on and off: horizontal transfer device for transfer of trays. It can be lifted and lowered for the destination part, and it can be lowered. Transfer between trays After the second liter loading test, the two trays of the sub-component substrate. The tray 'and the other-as the other' By the present invention, __ 接 _ ^ h The first tray storage section, the first tray is independent and can be Including: tray storage section, the second tray is independent and can be stored in the up and down direction: the first tray storage section above the second fan and the above-mentioned second tray

533317 5. Description of the invention (10) The second tray is set up between the receiving department and the second tray is received :::: into J: in the upper J-th tray storage section to connect to ... A tray storage section and the above-mentioned first lifting section = 2 storage sections, the above-mentioned j can be moved in a parallel direction, and can be lifted in itself: 2 liters can be lifted and lowered at the target location, and the second lifting device The above-mentioned general body and the above-mentioned horizontal transfer are carried in the above-mentioned invention. Fang is used as one of the tray storage sections before the test, and the other is used as a tray after the test, and the other part is used as a tray. In jJ: Bu}, g, substrates; for the category of retest. After the test ^. The above-mentioned brother-the official in the tray storage department 5 W, the taxi a father connected; before the test, electricity, empty dry plate of the component substrate. One # can be stored. The present and second tray should be the same-type tray. Instead, it is a maintenance device. The tray storage unit itself is not raised to transfer the F, the second lifting center, the horizontal transfer device, and the second lifting device. In addition, the entire device is miniaturized in the azimuth direction. Enter the two sides ^ ^ The first lifting device is installed between the tray storage sections, and it can also capture two tray storage sections, which can not only improve the efficiency of the tray transfer, but also the freedom of the transfer process. In addition, no matter which tray is 533317 V. Description of the invention (π) The storage section can store the tray, and the tray stored in any tray storage section can be taken out, so it can be classified without changing the device itself Increasing the number takes a flexible approach. [Brief description of the drawings] FIG. 1A is a conceptual plan view showing a testing device for an electronic component substrate of the present invention. Fig. 1B is a B-B sectional view of Fig. 1A. Fig. 2 is a side sectional view. Fig. 3 is a perspective view showing an example of a supply or receiving tray used in this embodiment. Fig. 4A is a perspective view showing a memory module storage section according to the embodiment. FIG. 4B is a perspective view showing the tray storage portion and a part of the lifting device. Fig. 5 is a perspective view showing a memory module holding mechanism used in the XY-direction conveying device according to the embodiment. FIG. 6 is a cross-sectional view showing the entire measurement section of the embodiment. Fig. 7 is a perspective view showing a test tray used in this embodiment. FIG. 8A is a plan view showing the insertion of the test tray of FIG. 7. FIG. FIG. 8B is a front view showing that the test tray of FIG. 7 is inserted. FIG. 8C is a side view showing the insertion of the test tray of FIG. 7. FIG. FIG. 9 is a perspective view showing a test head according to this embodiment. FIG. 10 is a cross-sectional view showing the contact state between the memory module and the groove of the test head. 533317

V. Description of the invention (12) Fig. 11A to Fig. 1E are conceptual diagrams for explaining the processing method of the supply or storage tray of the present invention. Figs. 12A to 12G are cross-sectional views of portions of Cao for explaining the operation in the measurement section of Fig. 1. Figs. Fig. 1 3A is a plan conceptual diagram showing an implementation form of a test basin for an electronic component substrate of the present invention. Fig. 13B is a B-B sectional view of Fig. 13A. [Implementation Mode of the Invention] In the following implementation mode, the object is ‘but the 无法 memory core group’ in the test device of the present invention includes other incapable elements. The memory module in Figure 3 as the test object is not limited to the same picture.

First of all, a device is constructed with a group of 10 heads, a tester TS in the memory module, and a tester TS in which the head TH is stored. Generally speaking, two = the type of attitude ... As shown in the figure below, the test of this implementation type test of this test head TΗ Test of electrical contact test: TV-type test signal and recording, the device can be applied to all test heads TH Or the test of Λ or the tester TS in FIG. 2 is omitted in FIG. 2 only in other illustrations. ί ιΐ〇 理, m column ί, consisting of: a memory module with a memory module ^ will be tested after the test test and a memory module of 5 memory module 1 after the test is installed Storage department 200,

533317 V. Description of the invention (13) The σ self-recalling body module 1 〇 is sent to the loading room 300 of the remaining room 1 Q 〇 ~ 〇, sorted out in the cabin】 The removal section 400. The processor 1 is a test (pre-high temperature or low temperature pressure-off θ memory module 10 in the test results eight _ β drop contact = 疋 whether it can properly operate and test according to the test operation I set up in this temperature and pressure state. 20 2 in the text. ° ,,, _ Xitian shavings 5 type objects, that is, the supply of the memory module 1 0. Nizuz during the handling process 1 cry, sergeant f # 、 丨 丄 口 口 之 〆 is called to carry in the tray 20. The test tray 20 is changed in the loading section 30 ()% ^ / 仃 i is sent to grab the room 100 and is held by the test After 5 ^ f module 1 0, all of the following are 1 η 〇, worship ^ 0 'in the state of the cabin 1 0 0 emotional phantom =: 1 memory module i0. After that, the test section 400 is completed It is carried out, and each Lu Jife limb pull group 10 at the unloading part _ is carried on a storage tray corresponding to the test result. 20 ΪΓ is composed of each part of the column: given to the stack for testing ^ 1 〇1 5 memory module 1 〇 target high-temperature or low-temperature temperature and pressure constant Ϊ1 1, 1 constant temperature tank 1 〇1 is given a memory phantom under thermal pressure, and 10 and test The measuring section 102 in which the groove TH of the head TH contacts is 102, and the heat removing tank for removing the previous thermal pressure from the memory module passed the test. If a high temperature has been applied to the thermostatic bath 101, the heat is removed by The tank 103 can be cooled by supplying air to the memory module 10 and returning to room temperature, but it returns to the vicinity of the room temperature. On the other hand, if a low temperature of minus thirty degrees Celsius has been added to the target of the strange temperature tank 101, Then use warm air or increase the temperature of the memory module 10 to return to the temperature where no condensation will occur. Then ° *, then 533317 V. Description of the invention (14) This de-heated memory module 1 〇 To the unloading section 400. In addition, the heat removal tank 103 should be thermally disconnected from the thermostatic bath 10 or the measurement 102, although in this example, except that the heat tank 103 is installed in the cabin] ⑽, but Conceptually, the cabin 100 also includes a heat sink. Next, the structure of the memory module storage unit 2000, the loading unit 300, the cabin 100, and the unloading unit 400 will be described in further detail. ^ Memory module storage 2 (1 f) Baixian, the memory module i 0 as the test object is relative to the processor 1 The terminal 12 is in an upright posture, and it is carried in by trays 002 and 204 in Fig. 3, and it is carried out in the same shape. In the same figure, 205 is used to hold the memory. The module 丨 〇 is a convex part in an upright position. In addition, although the tray f 202 tray 202 equipped with the memory module 10 before the test is called, the tray equipped with the memory module 1 〇 after the test is a tray W 2. 4, tray 2 02, 204 can be the same shape or different shapes = shoulder circumference

However, it is desirable that at least the supply tray 202 has a function of determining the position of the memory unit 10 to be mounted. The record mounted on the supply tray 202 = is carried into the processor i, and is carried out by a picking device (later: and xv conveying device 303). A Memory module storage unit in the invariant mode. 2000. J. J Nabu 212, 214. As shown in Fig. U, Fig. 1β, Fig. 2, Fig. 4 and Fig. 4b, the storage section 2i2 of the tray f-side is already equipped with "the one to be tested;" T1. The supply trays 202 are not stacked, but are independent of each other; ί 47, # ^ ^ ^ ^ ^ μ Λ, Γ After the ten-test test, the memory module is used as a suitable storage tray.

533317 V. Description of the invention (15) ‘204 is also the same, it is not stacked, but is independent of each other and kept in the up-down direction for storage. In other words, the trays 202 and 204 are housed in tray-like drawers 2 1 2 and 2 1 4. In addition, the number of trays that can be received in the tray storage sections 21 2 and 2 1 4 is not particularly limited, and an appropriate decision can be made according to the relative importance of the size and sorting ability of the processor 1. In this example, a maximum of 7 trays 202, 20 4 can be stored in each of the tray storage sections 2 1 2 and 2 1 4. As will be described in detail later, the tray storage sections 2 1 2 and 2 1 4 have the same structure as each other, so that the supply tray 20 2 and the storage tray 204 can receive each other. In other words, if you want to classify the test results in addition to good and bad products, you can divide the high-speed, medium-speed, and low-speed movement speeds in the good products, or the many classifications that require re-testing among the bad products. It can be performed by using two tray storage sections 2 1 2 and 21 4 in combination. A lifter 206 is provided between the pair of push-plate storage sections 212 and 214 so as to be able to lift and lower. As shown in FIG. 4A, the lifter 20 6 can control the up-down direction from at least the lowermost section to the uppermost section of each tray storage section 2 1 2, 2 1 4 by a ball screw driving device 2 0 6 a. Mobile. The lifter 20 6 and each of the tray storage sections 2 12 and 214 transfer the trays 202 and 204. Such an action is shown in FIG. 4B. On the trays 202, 204, or a plate on which the trays are placed, the fluid oil seal 20 is guided and the fluid oil seal 206b is driven forward and backward to perform the tray 202. 204 operations in and out. Directly above the tray storage portions 2 1 2, 2 1 4 and the lifter 2 0 6, the intermediate arm 20 08 is provided to move freely along the positive and negative X-axis directions shown in the figure. this

533317 V. Description of the invention (16) ------: The intermediate arm 208 is controlled to move in a desired position along the positive and negative x-axis directions by a ball screw driving device 208 & The middle arm 208 receives the trays 202, 204 'received by the lifter 206, and then transfers to the described setting plate 21o, and in turn receives the placed trays 202, 2 at the setting plate 210. 4. Transfer to the lifter 206. At this time, in order to hold and release the trays 20 and 204, the hook mechanism 208b (refer to FIG. UA) is provided to be opened and closed. In addition, in this embodiment, the movable direction of the middle arm 208 is only set along the positive and negative X axis, but it can also be raised and lowered in the positive and negative z direction, and it can also be positive or negative when the tray 202 and 204 are connected Lifting in 2 axes. In addition, it can also move in the positive and negative γ axis directions, and it can also have a degree of freedom within a setting range of a setting plate 2 丨 0 described later. First, in this embodiment, three setting plates 210 are provided directly above the middle arm 20 8. These setting plates 2 10 can be independently moved by ball screw driving devices 21 10a and can be raised and lowered in the positive and negative Z-axis directions, at least Elevating between a position lower than the middle arm 2 08 and a position higher than the middle arm 2 08. The lower limit position here is the position at the time when the pallets 20 2, 204 are transferred, and the upper limit position is the pallet 202 The setting position of 204 (that is, the position where the memory module 10 is extradited to the test tray 20 by the χγ transfer device 3303 and the memory is received from the test tray 20 by the χγ transfer device 4 0 3 Position of the module 10). In addition, in this example, there are three setting plates 210, the left one in FIG. 4A is the setting plate 2 1 0 in the loading section 30, and the two in the right are The setting plates 2 1 0, 2 1 0 as the removal portion 400. However, the present invention is not limited to this, and two setting plates or more than four setting plates can be used in the present invention. Loading portion 3 ο η

Page 19 533317 V. Description of the invention (17) "The above-mentioned supply tray 200 is loaded from the loading section 300 under the window section of the loading section 300, and was originally loaded on the supply tray 2002. After that, it was loaded in the second test tray stopped at the loading section 300.脰 枝, 'and 1 02. No .: ϊ = ϊ202. Load the memory module 10 on the 擞 k clothes. As shown in the figure, using the τχγ transfer device 303 is equipped with: Υ 执 道道 301, added here ¥ 轴 = 3 In the supply Between the tray 20 2 and the test tray 20, a positive and negative γ = possible X-axis is used to execute the road 302, along this X-axis orbit 30, and the movable head 304 can be at X °. The movement of the sleeve X is to move the movable head 304 of the XY transport device 3 03 to the memory module holding machine shown below 5. The fluid oil seal 502 that moves in the positive and negative Z-axis directions is a fluid oil seal 504 that is closed. Then, the fluid memory seal 丄 =: 504 can be used to grasp or release the two edges of the memory module j 〇 two ports of body oil = 502 to lift the held memory module 10. I 猎 由 ~ In this way, the holding mechanism 5 〇Q can hold the memory module 彳]: Move while holding the memory module 1 〇 ~ from the supply tray 202, and then the 5 memory module group 10 is mounted on the test tray 20. In this example, 500 can be mounted to eight moving heads relative to the movable head 303, and the number of 6 sets of 6 memory blocks 10 is loaded in the test tray 200. In addition, in the supply tray 202, the shape of the groove formed in order to overlap is larger than the memory module i. Come big, so: 533317

ΐ ΐΐ / The position of the memory module 10 appears to be somewhat zero ί: In the state of 丄, the memory module 10 is held by the holding mechanism 500 tray 2. The embedding part 300 has some problems when it is put in the correct position. Try it out :: try, disk 2. A bit device ^ called a corrector 3.5 is used to correct the position of the memory module 10. This correction cries; the depth of the recessed portion of the IS memory body module 10 to this extent, this: the peripheral edge of the portion 2 is the shape surrounded by the inclined surface. And, • Memory module heart =. %, The falling position of the memory module 10 is fixed by the inclined surface, and the mutual position of the eight memory modules 10 can be correctly determined. The memory module 10 passing through is again controlled by the holding mechanism. 5. . The tester 20 was held and clothed, and the test piece 20 with good accuracy was placed in the insertion portion 30 of the tester tray 20. . As described on the side of the chamber 100, the test tray 20 loads the memory module ig. 〇〇, moved to the thermostat 101. Although the illustration is omitted, the strange temperature bath is called η / ΐ ΐ vertical conveying device. With this vertical conveying device, before measurement # 102 is vacated, a plurality of test trays can be held in a held shape. During the preparation period, apply high or low temperature pressure to the memory module 1 () ^. In the measurement unit 102, the test head TH is disposed at the center thereof, and the groove 50 is set from below in the measurement unit 102. Then, the test tray 2G is carried on the set test head TH, and a plurality of memories ^ group 1〇

Page 21 533317

ϊ i: ί ϊ ί A groove 50 is electrically contacted and tested. Iot produces θ ^^ at a warm temperature, the tray 20 removes heat from the heat removal tank 103, and the memory module 400. Dish again. < After reaching room temperature or equivalent, it is carried into the unloading section ^ = 5 The test tray 20 of the unloading section 400 is transported via the roller of Tu Xibu ▼ and then returned to the loading section 300 and the cabin 100%. 7. As shown in the detailed diagram of FIG. 7, the test disk 20 for the memory module has a freely-installable storage furnace 1 η mountain ν, your mountain X plus — the heart body body group 1 10 of the entry 30 And the tray body 20 & The tray book moa has a rectangular upper frame 22 and a rectangular lower frame 24 which are also underground. These frames 22 and 24 are connected approximately by a plurality of rod spacers 26. In the upper frame 22 and the lower frame 24, holding holes 21 and 23 of each of the inserting portions 30 are successively formed and held along the χ-axis direction at predetermined intervals. A pair of positioning holes 25 are formed in the vicinity of both ends of the holding hole 21 formed in the upper frame 22 in the γ-axis direction along the X direction. Among these positioning hole holders, as shown in FIG. 8C, the positioning pin hole & inlay and funneling portion 30 formed in the insertion portion 30 determines the position with respect to the tray body 20a. In addition, a cover 43 is attached to the lower end of ^ 42, and the inserting portion 30 can be held with respect to the tray body 20 &. As shown in FIG. 7, FIG. 8A and FIG. 8B, the embedding portion 30 has a pair of side walls 32 of the notch 31 in the shape of a stone trapezoid, in order to form a space between these side walls 32. The side wall 32 is integrally memorized by the end walls 33a, 33b. Each of the inserting portions 30 is made of a synthetic resin. —

533317 V. Description of the invention (20) As shown in FIG. 8, the protrusions 35, 36 each protruding from the space 34 of the end wall 33a, and the bottom wall 37 for holding. A through hole 38 is formed in the bottom of the accommodation space 34 formed as shown in Fig. 8A to hold the substrate end of the memory module 10 held. And 33b are formed on the inner side with respect to the inner periphery of the accommodating protrusion 35, and a retaining groove is formed as shown in FIG. 8B. The protectors 12 between the bottom walls 37 pass through the through holes 38 and are exposed in the lower holding holes 36. Both ends of the memory module 10 can be inserted freely from above as shown in FIG. A tapered guide groove 42 is formed above the holding groove 36 to introduce the ends of both sides of the memory module 10 into the holding groove 36. Inside the insertion portion 30, the memory module 10 leaves only a little space in the y-axis direction and the γ-axis direction to hold the groove 36. The bottom wall 37 is used to maintain its own weight. 30 and other parts contact the 'containment space 34', forming a relatively large gap. The flange 39 is integrally formed on the upper portions of the end walls 33a and 33b. Flange 39 As shown in FIG. 7, the inserting portion 30 is held in the holding hole of the tray body 20a and penetrates inside, and is held in the retaining edge portion of the upper frame 22 to prevent the inserting portion 30 from being held. The holes 21 and 23 fall below. As shown in FIG. 8, below the flange 39, each positioning pin hole 42 protrudes. As shown in FIG. 8C, the positioning pin holes 42 are fitted to the pin holes 25 formed in the upper frame 22. A cover 43 is attached to the lower end of the positioning pin hole 42, and the insertion portion 30 can be held upward with respect to the body 20a. Then, each of the inserting portions 30 can be positioned and supported with respect to the holder 20a. However, positioning holes and pins

In the tray

533317 V. Description of the invention (21) The gap between the holes 42 should be set larger so that the insertion part 30 can move to the tray body 20a along the X-axis direction and the γ-axis direction. ° As will be described later, the positions of each f must be determined relative to each of the push-out plates 76 and each of the grooves 50, because they must be moved relative to the tray body 20a. Also, since each of the inserting portions 30 needs to be movable in the two-axis direction with respect to the tray body 203, the cover 43 shown in FIG. 8C is positioned below the positioning pin hole 42. L: Ϊ 装 ί ί The z-axis direction may move relatively privately between the embedding portion 30 and the tray body 20a. In addition, a holding hole 23 is formed in the lower frame 24, and the gap of the outer shape of the lower end of the engaging portion 30 is the same as the center of the positioning hole 25 and the positioning pin hole 49. The recessed portion 30 is relative to the tray body. Flange set = Guang and 331) was formed, in order to locate the lower hole 41: ;; 4 set 2: two to the end wall 仏 · bottom out 柘 7fi Xi Du only in the upper part of the through hole Pressure shown in FIG. 6 = of: positioning pin hole 8 formed on the holding plate 78

The position 76 of the output plate 76 and the embedding portion 30 is shown in FIG. 6. The recess for the test # is inserted into the positioning hole 41 below, such as the hole 56, and the positioning pin memory formed by the recessed recess 52 for it. The base of the module ：: == Ϊ can decide to maintain the ^ ^ ^ ^ ^ 2 0 ^ ^ in the embedding section 30. The conveying base 44 phase material is kept concave _ axis direction. Tray spring 46 (or pressure oil seal) 2 Test head base 48, such as the part "in the middle" on the test head base 48, two = two, in the tray transport base 4 with the tray 20 from the groove 50 from 533317 five 2. Description of the invention (22) An elastic force is applied in the direction of the test tray 2 of the test section 10 and the redundant structural relationship between the test head and the test head is as follows: a 4 ^ First, as shown in FIG. 9, the test head base 4 A plurality of grooves 50 are arranged along the x-axis direction through the common test and the individual test substrate 66 on the top 8. The number of the grooves 50 to the W groove 50 in 20 should be shown in FIG. 7 in the test tray 0 and held. The embedded part 3 is an integer one of the number of placements. As shown in the figure q, the embedded part 3 G shown in FIG. 7 is arranged along the X axis direction to 16 and the groove 50 shown in the figure is along the X axis direction. It is arranged with 1/2 of 16 and the number of units. Also, the figure q— ^ Z, that is, the eight pitches A PI 7: the user who arranges the grooves in the X-axis direction. 2 = two: two of the arrangement pitch of the under-entry portion 30 in the x-axis direction; = the number of sample arrangements and the arrangement pitch to configure the groove 50, and then it will be maintained twice as it is) for the test support What is written in Nei 20; = ::::; Γ; The plate terminal 12 is inserted in the direction of x vehicles as shown in the drawing: each groove of D is in groove 51 of groove 0 and it is also used as ΰ9. The test tray 20 is along the y-axis: Secondly, move the arrangement in Figure 7 to the next distance, and then evenly insert the substrate terminals 12 of the module 10 in the wox-axis direction along the x-axis (^ (countable)) The grooves 51 of 50 are also simultaneously used as each of the indentations 2 ° 2 which are not in the 9th position. Only when the memory module 10 is used, can it be measured. The test results are shown in FIG. 9 'Each groove 50 has: Groove groove

Page 533 317

A groove body 53 formed by 51 and a pedestal 68 maintaining the groove body 53. The a seat 68 is connected to the upper portion of the individual test substrate 66. Via the pedestal μ: the groove body 53 is provided with an elongated through hole 54 along the γ axis direction along the y-axis direction. A groove guide 52 is formed between the both ends of the groove body ㈣ axis direction and the ^ a guide 52. Avoidance at both ends corresponds. As shown in FIG. 6, in these avoidance grooves 55, the protrusions 35 formed at the ends of the embedding portion 30 and the lower end of 33b can enter, and the protrusions = guaranteed, and the grooves 36 maintain the memory modules on both sides The substrate terminal 10 of 10 can be inserted into the groove groove 51 of the groove 50. σ

Further, as shown in FIG. 10, a groove terminal 58 is disposed inside the groove groove 51 of the groove 50. The groove terminal 58 is opposite to the substrate terminal in a state where the base J = 12 formed at the lower end of the memory module 1 () is inserted into the groove groove 51. They are connected by M holes u Γ. The groove terminals 58 pass through the pedestal 68, the individual test substrates δίΤί, 1 ί substrate 64 and the internal wiring of the test head base 48 to test the field TS, so that the test results of each memory module 10 can be read. In this embodiment, as shown in FIG. 10, a gasket 60 for the lower end of the memory module 10 is provided at the bottom of the groove 51, and a spring 6 is provided to the gasket 6 upward. 2. And 'without any sorrow to the memory module 1G, the lower end of the memory module 10 can be pressed upward from the groove groove 51 by 9Π Μ Ϊ ΐ for the test maintained on the transport substrate 44 On tray J. P 'is provided with a Z-axis drive unit 70 for moving the pressure 76 in the vertical direction (ζ direction). This 2-axis drive unit 70 has: a common drive board

533317 V. Description of the invention (24) 72, matching plate 74, holding plate 78 holding the pressing plate 76. A pressing surface 71 for pressing the upper end of each memory module 10 is formed below the pressing plate 76. The guide projections 73 protruding below the positions of both ends of the pressing surface 71 in the Y-axis direction are integrally formed from the lower surface of the pressing plate 76. In addition, the guide dog 73 can enter the inside of the accommodation space 34 of the embedding portion 30. A guide groove 77 is formed inside the guide protrusion 73, so that two upper ends of the memory replacement group 10 can be inserted and Correct the inclination of the embedded part 30 of the memory module 丨 〇. A tapered portion 75 is formed at the lower end of the guide groove 7 7 so that the two upper side end portions of the memory module 10 can be easily inserted into the guide groove 7 7.

Positioning pin holes 80 are provided below the two ends of the holding plate 78 in the Y-axis direction of the Bosch press plate 76. When the holding plate 78 is moved downward in the two-axis direction, the positioning pin hole 80 is inserted into the positioning hole 40 above the insertion portion 30, so that the positions of the pressing plate 76 and the memory module can be determined. The pressing plate 76 and the holding plate 78 are arranged at a distance corresponding to the arrangement distance in the ^ -axis direction of the groove 50 and the arrangement number of β, L # v ^ 70 s. Each is held at the lower end of the plurality of suspension levers 82. Suspension lever 82: 3 is secured under the individual drive plate 84. Individual drive boards 84 are also

机 ι) τι / 古 凹 ^ 50 The arrangement distance and the number of arrangement distances in the χ-axis direction of 50 are determined by the number of movements; the interior of each receiving groove 86 is driven by a separate drive plate 84 relative to the plate = 78, the suspension rod 82, and Each distribution plate 74 is in a suspended support state, and is individually driven

533317

The plate 84 determines and maintains a position with respect to the receiving groove 86. As shown in Figs. 12A to 12G, the matching plate 74 and the common driving plate 72 are connected by a connecting block 92, while maintaining the same interval between each other, while being movable in the z-axis direction. In addition, a driving mechanism (such as a pressure cylinder or a motor driving mechanism) for moving the matching plate 74 and the common driving plate 72 in the z-axis direction is shown in FIG. 6. Below the common driving plate 72, corresponding to each A pair of contact cylinders 88 are mounted on the individual drive plates 84 along the γ-axis direction. In each contact cylinder 88, the pressing pad 90 is set to be able to drive freely in the two-axis direction. As described later, with a predetermined schedule, an individual driving plate 8 floating from the matching plate 74 can be pressed. & to the bottom. The unloading section 400 is also provided in the unloading section 400: a transfer device 303 provided in the loading section 300) and a χγ transfer device 403 having the same structure. The 〇 transport device 403 also includes a y-axis rail 401, a γ-axis rail 401 added to the γ-axis rail 401, and a χ-axis holder that can be moved in the positive and negative γ-axis directions between the storage tray 204 and the test tray 20. Track 402, a movable head 4 0 4 that can move in the positive and negative X-axis directions along this X-axis track 4 0 2 'here, the movable head 4 0 4 is equipped with a memory module holding mechanism 50 0 as shown in FIG. 5. With this χγ transfer device 403, it is possible to transfer from the transfer to the unloading section.

The test tray 20 loads the tested memory module 10 in the tray 204 for receiving. Furthermore, a pair of window portions 406a, 406b are provided in the unloading portion 400, and a storage tray 204 that is transported to the unloading portion 400 can be brought up from below. As described in the description below, 'the lower side of each window portion 406a, 406b is provided for lifting and storing.

533317 V. Description of the invention (26) A setting plate 210, 210 of the tray 204 can be dropped here to the storage tray 204 filled with the memory module 10 which has been completely tested, and the filled tray 2 is then transferred to the middle arm. 208. ° Note that even if the maximum number of categories that can be classified ‘in this embodiment’ is 8 types, a maximum of two storage trays 204 can be arranged in the window portions 406 a and 406 b of the removal unit 400. Moreover, the categories that can be separated at the same time are limited to two categories. Generally speaking, good products can be divided into three categories: high-speed reaction parts, medium-reaction reaction parts, and low-speed reaction parts. In addition, there are four categories for defective products, which are sufficient. Sometimes when the test results are not clear, it is necessary Retesting will add other categories beyond these. In this way, if the two storage trays 204 arranged in the window sections 406a and 406b of the unloading section 400 appear in a memory module other than this classification, one storage tray 2 should be removed from the unloading section 400. 4 Return it to the storage unit 200, and replace it with the newly generated type memory module 丨 〇 using the storage tray 208 to the unloading unit 40 G to store the memory module 丨 〇. However, when the replacement of the storage tray 204 in the middle of the sorting operation, the sorting operation must be interrupted in the meantime, and a problem of performance degradation occurs. Therefore, in the processor 1 of the present embodiment, a buffer portion 400 is provided between the test tray 20 of the unloading portion 400 and the window portions 406a and 40 6b, and this buffer portion 40 5 can temporarily take care of the occasional storage. The generated memory module category. For example, in the buffer section 405, in addition to the capacity of storing 30 to 50 memory modules 10, a memory device is also provided. The memory device stores the memory stored in each of the healthy positions in the buffer section 405. Body module 丨 〇Category memorize each time will memorize each memory temporarily stored in the buffer section 405

Page 533 317

The type and position of the branch group l0. Then, when the space 405 of the sorting operation is full, the storage module 204 stored in the buffer unit 4G5 ^ category = storage tray 204 is called out from the storage unit 200, and the storage is closed. At this time, the buffer box The temporary storage notes in China may include multiple categories. If so, it is appropriate to call the storage Γ tray 204 at a time, and call the storage trays 204 to the windows 406a and 406b at one time. The operation will be described below. First, the operation of the memory module storage unit 20 will be described with reference to FIGS. 11A to 11E. In FIGS. 11A to 11E, the supply tray 2 02 that is fully loaded with the pre-test memory module 10 is stored in each layer of the tray storage section 21 2, and the following description will be continued to set the load on the processor 1. The second operation of the input unit 300 and the operation of transferring the storage tray 204 of the memory module 10 to the tray storage unit 214 after the test of the unloading unit 400 that is full of the processor 1 are completed. 'For example, when the supply tray 20 is taken out from the uppermost layer of the tray storage section 21 2, the lifter 2 06 shown in FIG. 11A is moved to the uppermost position of the tray storage section 2 丨 2' at In the fluid vapor red 206a shown in FIG. 4B, the supply tray 202 of the uppermost layer of the tray storage portion 212 is pressure-fed into the lifter 206. At about this time, the intermediate arm 208 is moved in the straight upward direction of the lifter 20 6. Next, the lifter on which the supply tray 202 is placed is raised to a position where it intersects with the intermediate arm 20 08, and the receiving of the supply tray 202 can be maintained by closing the hook mechanism 20 08b of the intermediate arm 20 08 '. Then, the intermediate arm 208 can be moved toward the lower portion of the loading portion 300 in the destination position. Before this movement, the setting plate 21 of the loading section 300 must be lowered to the lower limit position.

533317

This state is shown in FIG. 11B. Here, only the setting plate 21 is raised (or, when the function of raising and lowering the intermediate arm 208 in the positive and negative Z axis direction is additionally added, only the intermediate arm 208 side is lowered). The hook mechanism 208b is opened, and the supply tray 202 is transferred to the setting plate 21o. Then, after waiting for the middle arm 208 to pass from this position, as shown in FIG. 1 ic, the setting plate 210 is raised to the upper limit position and the supply tray 2 02 is set in the loading section 300. In this way, the operation of setting the supply tray 202 loaded with the pre-test memory module 10 in the loading section 300 is completed.

In FIG. 11C, the middle arm 208 located at the lower part of the loading section 300 receives the storage tray 404 of the memory module that has been fully tested, and moves to the right side of the unloading section 400. Before this movement, the setting plate 210 on the right side of the removal section 400 is lowered to the lower limit position. Then, only the setting plate 21o is raised here (or 'When the function of raising and lowering the intermediate arm 208 in the positive and negative Z axis direction is added, only the intermediate arm 208 side is lowered], by the hook of the intermediate arm 208 The closing of the shape mechanism 2 0b can maintain the operation of transferring the storage tray 2 04 to the middle arm 2 08.

Next, as shown in FIG. 11D, the middle arm 2 0 8 is moved to the upper part of the lifter 20 06 prepared, where the hook mechanism 20 8 b of the middle arm 20 8 is opened, and the storage tray 20 4 is handed over to the elevator. Device 20 6 on. Then, as shown in FIG. UE, the lifter 206 descends to the tray storage section 21 (the predetermined empty floor ^ in this example, counts down from the third floor in this example), and then uses the fluid cylinder 206b shown in FIG. 4 to store the storage The tray accommodating portion 214 is introduced with the tray 204. In this way, the operation of transferring the storage tray 204 filled with the tested memory module 10 from the lower part 400 to the tray storage section 214 is completed. In this way, when using the tray transfer device of this embodiment, there is no need to lift

533317

Lower tray storage section 2 1 2 2〗 4, Zhang 1, / πν τ ^ Qiu? 1? It is called 4 evening u *, so you do n’t need to set these trays for storage.

^ ^ 邛 Includes space for trajectories. Moreover, the test device I can be miniaturized at least in the height direction. In addition, the processing procedures shown in Fig. 11A to Fig. 1E are just an example. According to the present invention, the team cries 9 〇p1? 914 ,, ^ 7 can be raised and lowered 15 20 6 to enter a pair of tray storage The structure of any one of the trays 202, 204 accommodated in the section 212 '214, and between the loading section 300 and the unloading section 400, and the tray storage sections 212, 214 = access to a single tray 200 , 204.

For example, when the supply tray 202 and the storage tray 204 are the same tray: The supply tray 202 filled with the memory module 10 can be transferred as shown in the steps shown in FIG. When it arrives at the loading section 300, and then the estimated tray 202 of the loading section 300 is vacated, it is directly or indirectly transferred to the unloading section 400 by the middle arm 208 and used as the storage tray 204. Also, the storage tray filled with memory modules in the unloading section 4000 is extended to one of the tray storage sections 2 and 4, but the classification can be increased by using the second floor of the tray storage section 2 and 2 Number, make flexible treatment.

In other words, when the supply tray 202 and the storage tray 204 are used independently, if the number of supply trays is a, the number of storage trays is b, and the number of classifications is η ', the storage tray 202 is not in B. = A + (n-1) or more, continuous operation cannot be performed. However, by sharing these trays 202 and 204, n = B + 1 continuous classification operations can be performed. Next, the supply tray 202 is set from the above-mentioned memory module storage section 200 in the window section 306 of the loading section 300, and the memory module 10 is tested before the supply tray 202 becomes full. Χγ transfer device shown in FIGS. 1A and 1B

Page 32 533317 V. Description of the invention (30) 3〇3 is transferred to the test of the memory module The trial tray 20 is transported = the next two are installed in the test: two hidden module. Yu ... 101 = I: ^ vendor or low temperature) or cooled down, and then measured in the measurement section 102 = ask. The pressing in the direction of the test head is carried in the "pressed" state, and several memory modules can be pressed at the same time. The support for the shape of the Maoshu 20: The test support 20 shown in FIG. 6 holding a plurality of memory modules 10 is shown in FIG. 6. The orientation above the groove 50 is 彳, and the positioning is stopped relative to the groove 50. ° Secondly, from the position shown in FIG. 12A to FIG. 12β, the driving unit 70 moves downward in the ζ direction. Then, the positioning pin hole 80 formed under the holding plate 78 enters the upper positioning hole 40 formed by the test dry-in portion 30, and is maintained in the memory module 1 of the pressing plate 78 ^ == section 30. His position was decided. At the same time, the guide protrusions 73 of each of the pressing plates 76 enter the space 34 of the embedding portion 30, and the two upper side end portions of the memory module 10 are then inserted into the introduction grooves 77 to be accommodated in the memory phantom of the embedding portion 30. The inclination of the group 10 is therefore corrected. 'The pressing surface 7 of the memory module 10 with respect to the pressing plate 76 is kept approximately straight at this time.' As shown in FIG. 6, the holding plate 78 of the pressing plate 76 is docked with Wei. The upper part of the entry part 30, the 'entrance part 30 and the tray 20, are pressed down together at this time. As shown in FIG. 6, the pressing surface 71 of the ejection plate and the end of the memory module 101 are not in contact at all. '°

533317 V. Description of the invention (31) Thereafter, as shown in FIG. 12C, when the driving unit 70 is further lowered and moved in the z direction, the lower end of the connection block 92 faces the upper end of the upper tray transport substrate 44. The distance between the matching plate 74 and the common drive plate 72 in the Z direction is constant, and the test tray 20 is supported with respect to the conveying substrate 44. Therefore, it is in contact with the push-out plate 76 and the individual drive plate on the insertion portion 30. 8 4 —Lift up to the mating plate 7 4. However, at this time, the pressing surface 71 of the press-out plate 76 shown in FIG. 6 is also completely out of contact with the upper end of the memory module 10 stored in the embedding portion 30. Next, as shown in FIG. 12D, when the driving unit 70 is further moved downward in the z direction, the connecting block 92 resists the force of the spring-like base 44 shown in FIG. 6 to push the support-like base 44 down, and the embedding portion 30 shown in FIG. 6 The lower end of the protruding portion 35 enters the avoidance groove 55 of the groove 50, and the lower end of the memory module 10 is in contact with the groove 50. The positioning pin hole 56 of the same k 'as the groove 50 enters the positioning hole 41 below the insertion portion 30' determines the position of the insertion portion 30 and the groove 50. When moving, the groove 51 is in the memory memory template 74 of the disk 20 and shows any reconcilable structure. As shown in FIG. 12E, the driving unit 70 is further moved down in the z direction and the memory model shown in FIG. The lower end of the group 10 starts to enter the recess of the recess 50, and the repulsive force of the recess terminal 50 causes the memory module to stop. In other words, the memory module 10 moves downward with respect to the embedding portion 30 and the holder to be stationary, so it is relatively pushed back upward, so that the upper end portion of the module 10 contacts the pressing surface shown in FIG. 6. The tray 20 including the embedded portion 30 other than the self-assembly unit 10, the transport base, and the matching common drive plate 72 all continue to move downward. However, by installing a spring mechanism, such as a spring, at the position of a groove in FIG. 6, the inserting portion 30 also recalls the body module 10. This includes a company that temporarily stops during the lowering movement.

533317 V. Description of the invention (32) 'One driver is shown in FIG. 12F' The driving unit 70 is further moved downward in the z direction, and the 'connection block 44 hits the stopper 94 provided in the test head base 48, and thus stops driving. The lowering of the unit 70 moves. In addition, when the drive unit 70 is started by a motor drive or the like other than a pressure cylinder, the stop movement can be stopped at a correct position without using a stopper 9 4 ′ through numerical control. Secondly, as shown in FIG. 12G, the contact cylinder 88 shown in FIG. 6 is activated, and the pressing mechanism 90 is depressed, and the individual driving plate floating at the upper part of the matching plate 74 is pressed at 84 °. The pressing surface 71 of 76 depresses the memory module 10, as shown in FIG. 10, the lower end of the memory module 丨 〇 completely enters the inside of the groove groove 51, and the substrate terminal 12 is in electrical contact with the groove terminal. . At this time, in order to insert the memory module 10 into the groove groove 51 of the groove 50, the contact cylinder 88 shown in FIG. 6 needs to have sufficient pressing force, and is not designed to give excessive force more than necessary. The memory module 丨 〇 meets the end of the mechanism (not shown in the figure) provided in the groove 50, and determines the position in the height direction. At this time, then, the cylinder 88 left a small part in the stroke, absorbing the error of the memory module 10 in two degrees (such as 0.3mm), and using a certain force to sign the emotional module 10 is designed to be pressed down. 2 Λ u In addition, in the state shown in FIG. 12F, the structure of the funerary part 30, the memory model, and 10 is designed to be temporarily lowered when the descending movement is stopped, and then the state is shown in FIG. 12G. With the push-out plate 76 shown in FIG. 6, the inserting portion 30 and the memory module 100 are pressed down together. In the state shown in FIG. 12G 'as shown in FIG. 10, the substrate terminal 12 and the recessed terminal 58 of each memory module 10 are electrically contacted, and a plurality of memories are simultaneously carried out in a state of being accommodated in the tray 20. Testing of Module 10. Figure

533317 V. Description of the invention (33) The pressure of contacting the cylinder 88 is released, the drive unit 70 is moved to the upper side, and the tray transporting base 44 of the tray 20 is maintained by the spring 46 or the force = seal return. The mechanism returns to the height of the original pallet. In addition, since the bottom of the groove height 51 of the groove 50 shown in FIG. 10 and the elastic bullet 62 at the bottom of the elastic force 62, the lower end of the memory module 10 is bounced from below the groove groove 51. In addition, in the present invention, as the groove, it is not only a spring having a spring force such as the spring 62, but also a groove having no spring force of its own. Recalling the body Ϊ Γ lower two because the groove itself does not have a body elasticity, so I will move, Γ Qibang / Ran stay on the groove 50 °. Therefore, in the Tori Dan shown in Figure 6 ^ 2: 4 In order to pull out the memory module from the groove 50: the disk 20 and the embedding portion 30 together with the force of lifting to the transport height, use the spring 46 or pressure cylinder shown in FIG. 6 Lift up. This and the recess 50 — the power of the body module 10 that has been ejected from the groove in the insertion portion 30 can also cause the insertion portion 30 and the groove 50 to be pulled apart after the insertion portion 30 = the more female It is mounted on the insertion portion 30 or the groove 50 for adjustment. With the adoption of various structures, the memory module 1 〇 does not need to play an extra 2: 2: two slots wide and can be used from 5. Eject ... 10,000-memory module By the failure of the old-fashioned action, the contact cylinder 8 8 shown in FIG. 6 can also reduce the force of the two grooves 50 to prevent the memory module 10 from being pressed down and load. 1 heart _ module 10 is damaged and does not act on the tray 20 ’, the tray 20 is used to move only the inside of the processor 1

533317 V. Description of the invention (34) # ’In the measurement, it is greatly required to memorize, to be simplified and cost-effective. It also has high or low temperature accuracy as a whole or a part. In addition, besides determining the parts 以外 L, the body 53 can also be another. In the present invention, at least 80 liters of positioning pinholes in the test Then there are multiple memory modules 1 0. Phantom 2: 2: Trial; fixed; none, so the processor 1 as a whole can be a small processor. 1 internal structure, the processor of this implementation type, simplistic and low-level configuration inside the cabin, so the temperature of this type of testing institution-to increase the measurement: the internal can be maintained to make the correct test . The method at the time of the D body module 10 is not limited to the above-mentioned embodiment. The method of the position is not particularly limited. It can be used in other methods. In addition, the structure of a pinhole or a positioning body is concave. In terms of the sun groove body 52 and the grooved pressing plate 76, it is not limited to the pattern shown in the figure. The V bow 丨 large 73 guide groove 77 and the tapered portion 75 do not necessarily have a pressing surface 71. Okay. However, it should be provided for positioning. According to this step, when the test is completed, the test consignment is moved to heat removal 9 _ to bring the temperature of the completed memory module 10 back to near room temperature. This is the main purpose. This is to prevent condensation from forming when low temperatures are applied. The test tray 20 filled with the memory module 10 returned to room temperature is transferred to the unloading section 400. Here, the tested memory module 10 is transferred to the storage tray 204 using the χγ transfer device 4 in. At this time, each memory module 10 is transferred to a storage tray 204 corresponding to each test result. In the consumption example shown in Figure jA, the "qualified" memory module is transferred to the unloading unit.

533317 V. Description of the invention (35) Two storage trays 204, 204 of the lower 400 window sections 406a, 406b, and the "rejected" or "retest required" storage tray 204 are provided on the window of the unloading section 400 Part 406a or 406b, the memory module 10 placed in the buffer part 405 is sent away according to the classification. According to the above steps, the memory module can be tested and classified according to the test results. The invention can be further modified. FIG. 13A is a schematic plan view of the processing line 1 of another embodiment of the present invention, and FIG. 13B is a schematic cross-sectional view (BB line cross-section) of the same thing. First, the structure of the memory module storage section 200 is different. 0

That is, although the storage section 2 1 2 for storing the supply tray 2 0 2 and the storage section 2 1 4 for storing the storage section tray 2 0 4 are provided, the lifter 2 0 6 A, 2 0 6 as the first lifting device. B is not between them, but is set independently. In addition, there is only one position (shown in the window portion 306) of the supply tray 002 to the f-in section 300 (at the position adjacent to this), and the supply tray 002 is manually entered and exited. 1 * Next 'Using the lifter 206A, the supply tray 002 loaded with the memory module 10 from the tray accommodating section 212 is taken out, and it is set in the loading section except that the lifter 206A maintains the ascending operation. Outside the window portion 306 of 300, all the memory modules 10 are moved to the test tray 20, and then the lift-down 206A is lowered as usual, and the empty supply tray 002z is received in the tray storage section 21 2. According to the above operation, the memory module before testing is put into processing # 2, but the supply tray 2 is taken out from the tray storage section 2 1 2; on the contrary, the "tray 2 02" is stored to During the tray storage section 212, the u-type tray 2o of the XY transfer device should be in a standby state. So in this neutral position

533317

V. Description of the invention (36) In the case of 'from the supply tray set by manual operation, the transfer device 3 0 3 is used to transfer the memory module 1 0 to the test tray 2 0. Accordingly, it is possible to suppress a decrease in the performance of the processor 1. On the other hand, in the removal portion 400, the tray storage portion 214 is provided with an empty storage cup and tray 204 from only one window portion (the right window portion 406b in this example) and the other window portion An empty storage tray 2 0 4 z is manually installed at a corresponding position in the portion 406 a. And 'near here, in the empty two supply trays 202, one (20 20 is used to place the non-compatible memory modules' one $ (2 0 2 r) is used to place the memory modules to be tested again. After the test is completed, the test tray 20 that has been transferred to the unloading section 4 00 uses the XY transfer device 4 0 3 to transfer the qualified memory module 1 0 to the main installation 4 0 6 b on the right side. The storage tray 2 0 4 is full. After the storage tray 2 0 4 is fully loaded, the lifter 2 0 6 B is lowered and stored in the tray storage unit 214. The next empty storage tray 2 0 4 is set. In the window section 4 6a. During this period, the qualified memory module 丨 〇 was transferred to the left-hand storage tray 2 〇4. The unqualified memory module 1 〇 was transferred to the left The supply tray 20f set manually on the side, and the memory module 10 to be retested are similarly transferred to the supply tray 2 〇2r on the right side. After these supply trays 202f and 202r are fully loaded, , Manually exchange empty supply trays 202f, 202r. At this time, full The supply tray 2 0 2 r of the memory module 1 0 to be retested is still located at the right side of the window portion 306 of the tray storage portion 2 12 or the loading portion 3 0 0. The implementation with this configuration Type of processor 1, you do not need to drop

Page 39

Claims (1)

533317 Case No. 89100140 VI. Scope of patent application I. A test device for electronic component substrates and removal, including at least: a storage section for storing test substrates and a test setting section for testing, (1) a set of Yes: January, January Placement, the electrical test before or before the test ϋΤϊϊχ test the electronic component sub-component substrate after the test; the first tray storage section, the first tray is independent and can be stored in the up and down direction; the second tray storage # 'second tray independent The first lifting device can be received in the up-down direction, and the tray storage portion and the second tray receiving tray can be arranged between the first and second tray storage portions; the horizontal transfer device is provided in the second tray storage portion. It can move in the parallel direction as described above, and can be connected between the first tray or the second lifting device and the horizontal conveying device. (2) The measuring section is provided with a test recess. Slot, which can be a substrate terminal; and a press-out plate, which is used to test the electronic element in the groove in the state of the upper tray; and the first tray itself of the receiving section and the second tray of the two tray destination section can be retracted, Meanwhile, the first transfer device is raised and lowered, the first transfer position is raised and lowered, and a tray is freely inserted into the electronic component substrate into the component receiving portion of the substrate and the substrate. The first part can be installed on the first tray or the second tray storage part, and the above upper part can be between the other lifting devices; and it can be installed on the board of the electronic component substrate at the intersection of itself and or the first tray. Press the test terminal into the test 2030-2971-PF2.ptc Page 43 533317 _Case No. 89100140 VI. Patent Application Year & Month > 丨 Modify TJfj and have: Embedded part, formed to expose the substrate terminal of the above electronic component substrate and move freely In the state of being inserted into the holding grooves on both sides of the electronic component substrate; and the tray body, the substrate of the electronic component substrate is routed out and holds the embedded portion. 2 · The test device of the electronic component substrate according to item 1 of the scope of the patent application, wherein the test device further includes the above-mentioned electronic component substrate is carried to the above test from the first or second tray on which the electronic component substrate before the test is mounted. Use the first transfer device of the tray. 3 · As for the test equipment of the electronic component substrate in the first scope of the patent application The test device further includes a transfer device for carrying the electronic component substrate to the above-mentioned first or second tray by a tray for testing the electronic component substrate. One 4 · Ruzhi, where the disc, the other 5 · Ruzhi, where the test after the electricity 6 · Ruzhi, of which 7 · Ru, Zhi, of which 8 · Ruzhi, which inserts and corrects the patent application of the above-mentioned tray receipt It is equipped with the testing and receiving department of the electronic component substrate of the above-mentioned first electronic component substrate, which is equipped with the above-mentioned first supporting element substrate application patent application patent test after the above-mentioned test and the above-mentioned first pressing application patent patent plate. One side is the tray of the electronic component substrate after the electronic component substrate is loaded. At least a part of the test plate storage section of the electronic component substrate surrounding Item 4 can store the mounted tray. The test device component substrate of the electronic component substrate surrounding item 5 is a category for retesting. The second tray for the test equipment of the electronic component substrate of item 1 is the same type of tray. Test equipment for the electronic component substrate of item 1 of the spoon. The two sides of the above electronic component substrate are guided by the inclination of the plate. 533317ϋ U: Revised Cantonese I) Drawing number 89100140 6. Scope of patent application 9. The test device for electronic component substrates, such as the item 丨 of the patent application scope, wherein the test device further includes a matching plate that keeps the above-mentioned pressing plate free to move. 10. The test device for an electronic component substrate according to item 9 of the scope of the patent application, wherein the 3 test devices further include driving means for moving the matching plate closer to and away from the test tray. π. The test device for an electronic component substrate according to item 9 of the scope of the patent application, wherein the driving device moves the electronic component substrate in the test tray by the press plate and moves the electronic component substrate. The substrate terminal is pressed into the groove 'and includes an auxiliary driving device for moving the pressing plate relative to the matching plate. 1 2. The test device for an electronic component substrate according to item 8 of the scope of the patent application, wherein the side test device further includes a tray transport base that maintains the elasticity of the test tray at a predetermined pitch on the above-mentioned design groove. 1 3 · If the test device for the electronic component substrate according to item 8 of the patent application scope, wherein the above-mentioned test groove includes an inward elastic force in the direction of the above-mentioned test recess and the substrate terminal of the electronic component substrate being pulled out • Test equipment for electronic component substrates as claimed in item 1 of the patent scope Installation, which further includes: $ 杜 iy ° 卩, take out the electrical i Γ completed by the test performed in the measurement section, and then transfer it to the storage section; endless categories: 'Set in the above removal section , Temporarily held on the tray element substrate sub-element substrate and / or the endless storage of electricity in the tray ^ 2030-2971-PF2.ptc Page 45 12. 2B / Set, ^ Fan / item 14 of the electronic component substrate test device base ^. ~ # Keep the electronic elements belonging to the category that should be retested 533317 Case No. 89ionun VI. Apply for a patent application, such as the provisional application B: "item 14 of the electronic component substrate test equipment test, j 装% in the above The electronic component substrate of the buffer section is in a batch-type bracket. F M is classified and replaced by standby in the above-mentioned storage section, and the gas measurement of the electronic component substrate of the H patent application item No. 14 is on time. The electronic component substrate of the buffer section is described as follows: = In the waiting period, the tray is replaced to the standby fan storage section according to the test result classification. Zhu Yuyu 1j · Tray for electronic component substrate testing ', including : Jr ^ 2 邛 is formed so that the substrate terminals of the above-mentioned electronic component substrate are inserted into both sides of the electronic component substrate in a moving state: out and shoulder 1, and the p. The substrate terminal of the substrate is exposed with the above-mentioned embedded part. Yang I 1 9 · The electronic component substrate test wind such as the 18th in the scope of patent application, wherein the above-mentioned embedded part is opposite to the electronic component pallet terminal. The recesses that are pressed into the grooves for the test include the base device. The base unit is set to "20 · For example, the wind test of the electronic component substrate according to item 8 of the patent application", wherein the above-mentioned description section includes a method for determining the above-mentioned electronic components. The second positioning device that consumes the positions of the substrate terminal and the test groove. The 2L of the board is as described in ^ | Green's patent scope 丨 8. Electronic component substrate testing secrets 丨 1 ~~-page 46 2030-2971-PF2.ptc 533317 Case No. 89100140 June 6, patent application disk 'where a plurality of embedded parts are held at the above-mentioned tray rack order fixed position. 2 2-— a test device for electronic component substrates, including · · Electronic component substrate test trays, as described in item 18 of the scope of patent application; test grooves for freely inserting the substrate terminals of the above electronic component substrates; and press-out plates' mounted on the electronic component substrates on the test trays It is used to press the substrate terminal of the electronic component substrate into the above-mentioned test groove. 2 3 · As for the test equipment of the electronic component substrate of the patent application No. 22, f ' The output board includes guide grooves that are inserted from both ends 4 on both sides of the electronic component substrate and that correct the inclination of the electronic component substrate. 24. The test device for the electronic component substrate according to item 22 of the patent application, where the test The clothes set further includes a matching plate for keeping the above-mentioned pressing plate free to move. 25 sets, the above-mentioned test set 26, the pieces of the substrate, the substrate, and the end plate move 27 sets. • If the test equipment of the 24th scope of the patent application for electronic component substrate test equipment = 4 / then the 4 device further includes a device for making the above matching plate opposite The '° type is a driving device for the beta disk to move close to and away from it. • Test equipment for electronic component substrates as described in item 4 of the 4th patent scope: the above drive device is used to make the above-mentioned electrons by pressing out the board; move the above-mentioned electronic components substrate in the tray on the test field: In the direction of pressing the concave sample ^ 1 'is included to make the pressing plate relative to the above horse? Auxiliary drive. 中 # 申: The test equipment of the electronic component substrate of the 22nd item of the patent scope ------- the step includes the above-mentioned design groove; 2030-2971-PF2.ptc Page 47 533317 ____car Ιβ 4 E] — VI. Application for n ~ Pitch: Hold the elasticity of the above-mentioned test plate ~ = 2 ”. Basic meaning department. The test groove includes a test groove facing the plate in the inside of the test groove. The test spring of the iij electronic component substrate is pulled out. 29. A kind of additional tray conveying device, including: an anti-tray storage section, at least one pair of Toner, t up and down :: lifting device, in the above pair of trays: the cow's and It may be provided to be connected between the pair of tray storage portions. 30. If the tray in the 29th scope of the patent application is placed between the two tray storage sections Λ, the shock position can be moved, and it can be between itself and the first -liter; Horizontal transfer device for splicing of discs. & Carrying out a step of entrusting the 2nd item of the scope of the patent claim of Tortoyo, including the second lifter that can be raised and lowered for the target part, and the tray can be transferred in the loading room. The horizontal transfer and seeding tray transfer device includes a tray receiving section. The first tray is independent and can hold one tray in the up and down direction. The first tray is like a cup and the tray can be received in the up and down direction. Nadi 533317 The second ... or second = feeding device is arranged between the second tray accommodating parts, and is disposed on the above-mentioned first tray accommodating upper tray accommodating part and the above-mentioned first-lifting device: the direction of the sub-row of the dagger, The above two lifting devices can be transferred between itself and the first lifting second = the first tray or the second tray, and the second lifting device can be raised and lowered according to the destination, and can be connected to the horizontal transfer device. I tray or k tray 3j. For example, the tray transfer device of the 29th scope of the patent application, where the upper l «J ^^^ is the tray equipped with the electronic substrate, and the other 2 is the tray equipped with the electronic component substrate after the test. 34. The tray transfer device according to item 32 of the patent application scope, wherein at least a part of the upper 2 Du I f * tray storage section can store a tray carrying a pantograph base plate after the test. 3 ^ 5 The pallet transfer device as described in item 34 of Shen Qing's patent scope, in which the electronic component substrate after the above-mentioned test is in the category of re-test. 3_6 · If the tray transfer device of the scope of patent application No. 32, among which At least one part of the second tray storage section can hold the empty tray of the electronic component substrate before the handover test. 3,7 • The tray transfer device according to item 32 of the patent application scope, wherein the first tray and the second tray are trays of the same type. 2030-2971-PF2.ptc Page 49