KR20030023214A - Handler for Testing Semiconductor Devices - Google Patents

Abstract

PURPOSE: A handler for testing semiconductor device is provided, which is capable of exactly testing a semiconductor device under various temperature conditions. CONSTITUTION: A loading stacker(2) is installed at one side of a handler body(1) and trays at which semiconductor devices to be tested are contained are loaded on the loading stacker(2). Unloading stackers(3) are installed at one side of the loading stacker(2), and a loading buffer(6) is installed at a rear side of the loading stacker(2). A test site having a test socket(12) is placed at a rear side of the handler body(1). The first and second shuttles(8,9) are installed at rear sides of the loading stacker and the unloading stackers, respectively. A loading picker(17) and an unloading picker(18) are installed at front and center portions of the handler body(1). The first and second shortening pickers(10,11) are installed at a front side of the test site and between initial positions of the first and second shuttles(8,9). The first and second index heads(13,14) are installed at an upper side of a test socket(12) of the test site.

Description

Handler for Testing Semiconductor Devices

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handler device for testing semiconductor devices, and more particularly, to a handler for testing semiconductor devices that enables the semiconductor devices to be tested under normal and high temperature environments while the semiconductor devices are horizontally transferred between processes.

In general, semiconductor devices manufactured in the production line are tested to determine whether they are good or defective before shipping. The horizontal handler is a QFP or BGA, which is a non-memory semiconductor package. This equipment is used to test various logic semiconductor devices such as PGA, SOP, etc., and the semiconductor devices contained in the trays are transferred to the horizontal state automatically during the process, and they are mounted on the test sockets of the horizontal test site, and then the desired tests are performed. According to the test result, it was classified into several grades and unloaded into the tray again.

Meanwhile, as the environment in which semiconductor devices are used is diversified recently, the semiconductor devices are required to perform stable functions not only at room temperature but also at a specific temperature environment of high or low temperatures. It is required to create an environment and test the performance of semiconductor devices at a predetermined temperature.

Accordingly, the present invention has been made to satisfy the above requirements, so that it is possible to perform the accurate temperature test under a specific temperature environment of high temperature and low temperature as well as the room temperature of the semiconductor device with a simple configuration without complicating the entire configuration of the handler. Its purpose is to provide a handler for testing a semiconductor device.

1 is a plan view schematically showing the configuration of one embodiment of a handler according to the present invention

2A to 2L are action diagrams sequentially showing an operation example of the handler of FIG. 1.

3A to 3G are functional views sequentially showing another operation example of the handler of FIG.

Explanation of the reference numerals of the main components of the drawings

1-handler body 2-loading stacker

3-Unloading Stacker 4-Retest Stacker

5-Reject Multi Stacker 6-Loading Buffer

7-Sorting Buffer 8-First Shuttle

9-2nd Shuttle 10-1st Speed Picker

11-2nd Speed Picker 12-Test Socket

13-1st indexhead 14-2nd indexhead

17-Loading Picker 18-Unloading Picker

In order to achieve the above object, the present invention, the loading unit is installed on the front side of the handler body is loaded with a tray containing the semiconductor elements to be tested; An unloading unit installed at one side of the loading unit to load trays for classifying and re-storing the semiconductor devices tested according to a test result; A test site positioned behind the handler body and installed to be electrically connected to an external test device, the test site including a test socket for testing a semiconductor device; A loading buffer temporarily installed on the rear side of the loading unit in a front-rear direction of the main body to temporarily mount semiconductor elements to be tested; A sorting buffer installed at a rear side of the unloading unit so as to be movable in the front-rear direction of the main body and receiving a tested semiconductor element; A first shuttle installed at a rear side of the loading unit so as to be moved forward and backward to a test socket one side to transfer the semiconductor element; A second shuttle installed at a rear side of the unloading unit so as to be moved forward and backward to a test socket other side to transfer the semiconductor element; A loading picker which is horizontally movable left and right and front and rear on an upper side of the handler main body portion in which the loading unit is installed, and supplies a semiconductor device to be tested to the loading buffer or the first shuttle; An unloading picker installed horizontally to the left and the right and the front and the back of the handler main body portion in which the unloading part is installed to classify and transfer the tested semiconductor elements of the sorting buffer to the unloading part; A first short axis picker and a second short axis picker installed to be movable to the left and right in front of the test site immediately to transfer the semiconductor element between the loading buffer and the first and second shuttles and the sorting buffer; A pair of first index heads and second index heads installed horizontally horizontally above the test site to transfer and mount semiconductor elements between the first and second shuttles and the test sockets supplied to the test site; To provide a handler for testing a semiconductor device configured.

Hereinafter, a preferred embodiment of a handler for testing a semiconductor device according to the present invention will be described in detail with reference to the accompanying drawings.

1 illustrates an embodiment of a handler configuration configured to allow a temperature test as described above, and a loading stacker 2 in which trays in which semiconductor elements to be tested are stored is loaded on one side of the front of the handler body 1. On the side of the loading stacker 2, unloading stackers 3 on which trays for storing semiconductor elements classified as good results of the tested semiconductor elements are loaded are installed. At the rear of 2), a loading buffer 6 having a heating means (not shown) and a cooling means (not shown) therein is installed to be able to move back and forth. Here, the loading buffer 6 may be selectively used by the user.

In addition, one side of the loading stacker 2 is provided with a tracer stacker 2a for loading a tray which is emptied after all the semiconductor elements stored in the tray of the loading stacker 2 are transferred for a test. On one side and the rear side of the unloading stacker 3, a retest stacker 4 and a reject multi-stacker 5 for storing semiconductor devices, which are determined as a test result and a defective test result, by grade are respectively installed. have.

At the rear end of the handler body 1 is a test site having a test socket 12 electrically connected to external test equipment and testing a semiconductor device.

The rear of the loading stacker 2 and the rear of the unloading stacker 3 receive a semiconductor element to be tested and transfer it to a test site, or receive a semiconductor element tested at the test site and transfer it to the front side of the handler body. The first shuttle 8 and the second shuttle 9 are provided so as to be able to move forward and backward, respectively.

It is preferable that heating means (not shown) and / or cooling means (not shown) are provided inside the first and second shuttles 8 and 9 so as to transfer or cool heat to the semiconductor elements mounted thereon. .

In addition, a sorting buffer 7 is provided at a rear portion of the unloading stacker 3 so as to receive the tested semiconductor device and transfer the same to the unloading position.

On the other hand, the fixing frame (15a, 15b, 15c) is fixed to the front and rear sides and the middle portion of the front of the handler body 1 in the front and rear directions, respectively, and a pair of the fixing frame (15a, 15b, 15c) The moving frames 16a and 16b are installed to be movable in the front and rear directions along the fixed frames 15a, 15b and 15c, and the moving frames 16a and 16b move left and right along the moving frames 16a and 16b. The loading picker 17 and the unloading picker 18 are installed respectively.

Between the front side of the test site and the initial position of the first and second shuttles (8, 9) for transferring the semiconductor element to be tested of the loading buffer 6 or the first shuttle (8) to the second shuttle (9) The first single-axis picker 10 and the second single-axis picker 11 for transferring the tested semiconductor elements of the first shuttle 8 and the second shuttle 9 to the sorting buffer 7 are horizontally movable from side to side. It is.

In addition, the semiconductor devices of the first and second shuttles 8 and 9 are transported and mounted on the test sockets 12, and the semiconductor devices of the test sockets 12 are again mounted on both sides of the test sockets 12 of the test site. The first index head 13 and the second index head 14, which are sequentially transported and mounted to the first and second shuttles 8 and 9, are horizontally movable. The first and second index heads 13 14 are pressed by the semiconductor device to a predetermined pressure while the semiconductor device is mounted on the test socket 12 during the test, and heating means (not shown) on its own to maintain the desired temperature during the test. And / or cooling means (not shown).

The moving frames 16a and 16b, the loading picker 17, the unloading picker 18, and the index heads 13 and 14 are known as L-guides, linear motors, or ball screws and servomotors. It can be configured to linear movement by the guide member and the drive means.

The handler configured as above operates as follows.

First, the handler operation when the room temperature test is performed without using the loading buffer 6 is performed as follows in FIGS. 2A to 2L.

When the operator loads the trays containing the semiconductor devices to be tested in the loading stacker 2 and then operates the handler, the loading picker 17 shown in FIG. 2A is used to load the semiconductor devices D of the loading stacker 2. A plurality of pickups are transported and mounted to the first shuttle 8, and the second shuttle 9 is moved to a position where the semiconductor element can be received by the first short picker 10. At this time, the number of semiconductor elements D mounted on the first shuttle 8 by the loading picker 17 is twice the number of test sockets 12 provided at the test site (8 in the figure).

Subsequently, as shown in FIG. 2B, when the first shuttle 8 is moved to the position of the first short picker 10, the first short picker 10 is divided into four semiconductor elements of the semiconductor elements on the first shuttle 8. The device D is picked up and transported to the second shuttle 9 so that the first shuttle 8 can be picked up by the first index head 13 of the test site as shown in FIG. 2C. Go to location.

As shown in FIG. 2D, the first index head 13 picks up the semiconductor elements of the first shuttle 8 and transfers them to the test socket 12 to execute the test. During the test, the first shuttle 8 moves to the initial position where the semiconductor element can be supplied by the loading picker 17, and the second shuttle 9 on which the semiconductor element is mounted as described above has the second index head 14 ) And wait for the test with the second index head 14 picking up the semiconductor devices.

Subsequently, as shown in FIG. 2E, the first shuttle 8, which is supplied with only four other semiconductor devices to be tested, is moved back to the position of the first index head 13 at the test site, the semiconductor device is passed, and the empty agent is supplied. The second shuttle 9 moves to the position of the first short picker 10 and waits until the semiconductor element is supplied, and the second short picker 11 moves on the first shuttle 8 moving path and is tested. Prepare to receive the device.

When the test is completed in the test socket, as shown in FIG. 2F, the first index head 13 transfers the tested semiconductor device to the first shuttle 8 and selects another semiconductor device to be tested on the first shuttle 8. Pick-up and waiting, while the first index head 13 is moved toward the first shuttle 8, the second index head 14 is moved to the test socket 12, the semiconductor element in the test socket 12 Install and run the test.

As shown in FIG. 2G, the first shuttle 8 moves the tested semiconductor to the position of the second short picker 11 with the device as shown in FIG. 2G while the test is performed on the test socket 12. (11) picks up the tested semiconductor elements on the first shuttle (8) and transfers them to the sorting buffer (7). Subsequently, the first shuttle 8 moves to an initial position where the semiconductor device is supplied by the loading picker 17 and receives new semiconductor devices.

Subsequently, as shown in FIG. 2H, the first shuttle 8 is moved to the position of the first short picker 10. At this time, when the sorting buffer 7 equipped with the tested semiconductor device is moved forward to the position where the unloading picker 18 can pick up, the unloading picker 18 picks up the tested semiconductor device and performs a test result. The unloaded stacker 3 is unloaded into the unloading stacker 3, the semiconductor device required to be retested into the retest stacker 4, and the defective product into the reject multi-stacker 5.

Meanwhile, as shown in FIG. 2I, the first short picker 10 transfers the new semiconductor element of the first shuttle 8 to the second shuttle 9, and the first shuttle 8 is returned to its initial position. Move to receive a new semiconductor device.

As shown in FIG. 2J, the second shuttle 9 supplied with the semiconductor element moves to the pickup position of the second index head 14 of the test site and waits. When the test is completed, the second index head 14 transfers and mounts the tested semiconductor device to the second shuttle 9, picks up a new semiconductor device on the second shuttle 9, and waits.

As the second index head 14 moves to the second shuttle 9, the first index head 13 moves to the upper side of the test socket 12 and picks up the semiconductor element that is picked up on the test socket 12. To run the test. At this time, the first shuttle 8 equipped with the new semiconductor element immediately moves to the pickup position of the first index head 13.

Subsequently, as shown in FIG. 2K, the second shuttle 9 moves to the pick-up position of the second single-axis picker 11, and as shown in FIG. 2L, the second single-axis picker 11 has a second shuttle ( The tested semiconductor device of 9) is picked up and transferred to the sorting buffer 7 and then moved to the standby position, and the second shuttle 9 is also moved to the position of the first short picker 10 to wait.

When the test is completed, the first index head 13 transfers and mounts the tested semiconductor device on the first shuttle 8, and then picks up a new semiconductor device and waits. At this time, the sorting buffer 7 is moved to the pick-up position of the unloading picker 18 as described above to perform the unloading operation.

After that, the handler performs the test while continuously repeating the above-described process.

Meanwhile, the operation of the handler when the room temperature test, the high temperature test, or the low temperature test is performed using the loading buffer 6 will be described with reference to FIGS. 3A to 3G, and the loading buffer 6 during the high temperature test. The test is performed by heating the semiconductor element on the loading buffer 6 to a predetermined temperature by activating the heating means, and during the low temperature test, the semiconductor element is cooled by performing the cooling means of the loading buffer 6 to perform the test. The high temperature test and the low temperature test as described above are made in the same process as the room temperature test.

When the handler starts operation, the loading picker 17 (see FIG. 1) transfers and supplies the semiconductor elements to be tested to the loading buffer 6, at which time the first shuttle 8 and the first shuttle 8 and the first shuttle 8 are made as shown in FIG. The two shuttles 9 all move to a loading standby position where the semiconductor element can be supplied by the first short picker 10.

Then, as shown in FIG. 3B, the first short picker 10 picks up the semiconductor element of the loading buffer 6 and supplies it to the first shuttle 8, and the first shuttle 8 is shown in FIG. 3C. As shown, the first index head 13 is moved to the pick-up position, and the first index head 13 picks up the semiconductor element, mounts it to the test socket 12, and executes the test. At this time, the first short picker 10 moves to the loading buffer 6 again and transfers the new semiconductor element to the second shuttle 9.

Subsequently, as shown in FIG. 3D, the first shuttle 8 moves back to the pick-up position of the first short picker 10, is supplied with a new semiconductor element by the first short picker 10, and the first index head ( 13), the second shuttle 9 moves to the second index head 14 pick-up position, and the second index head 14 waits for the test with the second index head 14 picking up the semiconductor element of the second shuttle 9 do.

As shown in FIG. 3E, the second shuttle 9 is moved to the pick-up position of the first short picker 10 and is supplied with a new semiconductor element by the first short picker 10. When the test is completed in the test socket 12, the first index head 13 transfers the tested semiconductor device back to the first shuttle 8, and picks up and waits for a new semiconductor device to be tested of the first shuttle 8. . At this time, the test is completed and the first index head 13 exits from the test socket 12, and at the same time, the second index head 14 moves to the test socket 12 and picks up the semiconductor device that has been picked up. 12) to perform the test.

Subsequently, as shown in FIG. 3F, the first shuttle 8 moves to the pick-up position of the second short picker 11 to pick up the semiconductor element tested by the second short picker 11 to the sorting buffer 7. The first shuttle 8 moves back to the first short picker 10 pick-up position. On the other hand, the second shuttle 9 equipped with the new semiconductor element moves to the pickup position of the second index head 14.

Finally, as shown in FIG. 3E, when the test is completed in the test socket 12, the second index head 14 transfers and mounts the tested semiconductor device to the second shuttle 9, and then the second shuttle ( A new semiconductor element of 8) is picked up and waiting, and the first shuttle 8 enters the pick-up position of the first index head 13. At this time, the second index head 14 exits from the test socket 12 position and the first index head 13 moves to the test socket 12.

Subsequently, the second shuttle 9 supplied with the tested semiconductor element is moved to the pick-up position of the second short picker 11, transferred to the sorting buffer 7 by the second short picker 11, and then unloaded.

Since the process of unloading by the unloading picker 18 (see FIG. 1) after the tested semiconductor device is mounted on the sorting buffer 7 is the same as described above with reference to FIGS. 2A to 2L, a description thereof will be omitted. .

After that, the handler performs the test while continuously repeating the above-described process.

As described above, according to the present invention, a high temperature test and a low temperature test as well as a room temperature test of a semiconductor device can be easily performed in one handler with a simple configuration, and the test is terminated by one index head at the test site for unloading. As soon as it exits from the test socket location, other index heads that are waiting can enter the test, which improves test productivity to reduce index time.

Claims (3)

A loading unit installed at the front side of the handler body and having trays containing the semiconductor elements to be tested; An unloading unit installed at one side of the loading unit to load trays for classifying and re-storing the semiconductor devices tested according to a test result; A test site positioned behind the handler body and installed to be electrically connected to an external test device, the test site including a test socket for testing a semiconductor device; A loading buffer temporarily installed on the rear side of the loading unit in a front-rear direction of the main body to temporarily mount semiconductor elements to be tested; A sorting buffer installed at a rear side of the unloading unit so as to be movable in the front-rear direction of the main body and receiving a tested semiconductor element; A first shuttle installed at a rear side of the loading unit so as to be moved forward and backward to a test socket one side to transfer the semiconductor element; A second shuttle installed at a rear side of the unloading unit so as to be moved forward and backward to a test socket other side to transfer the semiconductor element; A loading picker which is horizontally movable left and right and front and rear on an upper side of the handler main body portion in which the loading unit is installed, and supplies a semiconductor device to be tested to the loading buffer or the first shuttle; An unloading picker installed horizontally to the left and the right and the front and the back of the handler main body portion in which the unloading part is installed to classify and transfer the tested semiconductor elements of the sorting buffer to the unloading part; A first short axis picker and a second short axis picker installed to be movable to the left and right in front of the test site immediately to transfer the semiconductor element between the loading buffer and the first and second shuttles and the sorting buffer; A pair of first index heads and second index heads installed horizontally horizontally above the test site to transfer and mount semiconductor elements between the first and second shuttles and the test sockets supplied to the test site; Handler for semiconductor device test. The handler for testing a semiconductor device according to claim 1, wherein the loading buffer has heating means for heating a semiconductor device mounted on an upper surface thereof. The handler for testing a semiconductor device according to claim 1 or 2, wherein the loading buffer further includes cooling means for cooling the semiconductor device seated on an upper surface thereof.