KR101365097B1 - Substrate inspection apparatus - Google Patents

Abstract

(assignment)
Provides a board inspection apparatus capable of responding to various inspection requirements by one inspection apparatus.
(Solution)
The inspection main body of the board inspection apparatus includes a conveying zone for conveying the inspected substrate from the carrying in side to the carrying out side, and an inspecting region for arranging an inspection jig for conducting a predetermined inspection on the inspected substrate, and arranged in the conveying region. And a first conveying apparatus for conveying the substrate under test from the carrying in side to the carrying out side, and a second conveying apparatus arranged to convey the inspected substrate in a direction orthogonal to the conveying direction of the first conveying apparatus. A second conveying device is provided for conveying the substrate under test between a predetermined position of the apparatus and a position where the inspection jig in the inspection area is arranged, and the second conveying apparatus is provided with a holding device for supporting the substrate under test.

Description

Substrate Inspection Equipment {SUBSTRATE INSPECTION APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate inspection apparatus which detects electrical characteristics between inspection points set in advance on an inspection object and performs conduction inspection or leak inspection between inspection points.

The board | substrate inspection apparatus is equipped with the jig and inspection apparatus which attached many contactors, a probe, a probe, a contact pin, etc. The inspection apparatus brings the jig closer to the inspection object to contact the tip of a contactor or the like with the inspection point, and supplies a current or an electrical signal from the inspection device to the inspection point via the contactor or the like, while the electrical signal from the inspection point. By detecting, the electrical characteristics between the inspection points are detected to inspect for the presence or absence of leakage or leakage of conduction between the inspection points.

Examples of the object include various substrates such as printed wiring boards, flexible substrates, ceramic multilayer wiring boards, electrode plates for liquid crystal displays and plasma displays, package substrates and film carriers for semiconductor packages, semiconductor wafers, semiconductor chips and CSPs ( A semiconductor device (LSI (Large Scale Integration), etc.) such as a chip size package) is applicable.

For example, when a test object is a board | substrate and what is mounted in it is a semiconductor circuit, such as IC, and an electrical / electronic component, such as a resistor, the wiring and the electrode formed in the board | substrate become a test target. In this case, wiring is formed on the printed wiring board, liquid crystal panel, or plasma display panel before mounting the electrical and electronic components to ensure that the wiring of the inspection object can accurately transmit electrical signals to them. The electrical characteristics such as the resistance value and the leakage current between the inspection points formed on the circuit board are measured, and the quality of the wiring is judged.

When the object is an LSI, an electronic circuit formed in the LSI becomes a target portion, and the surface pads of the electronic circuit become target points, respectively. In this case, in order to ensure that the electronic circuit formed in the LSI has desired electrical characteristics, the electrical characteristics between the inspection points are measured and the quality of the electronic circuit is judged.

In the board | substrate inspection apparatus, a board | substrate is conveyed from a loading apparatus to an inspection apparatus using a conveyance apparatus, and the said inspection is performed by the inspection apparatus, and the board | substrate with which the inspection was completed is conveyed from the inspection apparatus to the sorting storage part by a conveyance apparatus. The sorting storage unit classifies and stores the substrate in a predetermined position according to the inspection result. In the inspection apparatus, when the substrate is conveyed, the connecting terminal (contactor, probe, probe, contact pin, etc.) for inspection in the substrate connecting jig is moved to the target point of the substrate under test by the jig movement means. Then, a predetermined inspection is performed on the object, and when the inspection is completed, the jig is moved by the jig moving means from the target point to the standby position. This movement is repeated until the inspection on the predetermined target point is completed.

Japanese Laid-Open Patent Publication No. 2010-54228 Patent Document 1 discloses a circuit board inspection apparatus including a pair of support portions for supporting a substrate, and an inspection portion for correcting a misalignment (displacement) between the transfer mechanism and the contact position of the substrate.

The circuit board inspection apparatus of Patent Literature 1 improves inspection accuracy by providing a means for correcting a misalignment of a contact position. Recently, in order to reduce the price of the final product after inspection to reflect the economic downturn, the demand for cost reduction at the manufacturing stage is increasing.

An object of this invention is to provide the board | substrate inspection apparatus which can respond to various inspection requirements with one inspection apparatus in order to meet such a request.

An object of the present invention is to provide a substrate inspection apparatus capable of reducing the operating cost of a substrate inspection apparatus by performing substrate inspection at a high speed.

An object of the present invention is to provide a substrate inspection apparatus capable of reducing the operating cost of a substrate inspection apparatus by facilitating assembly and maintenance of the jig.

Moreover, an object of this invention is to provide the board | substrate inspection apparatus which can reduce the operating cost of a board | substrate inspection apparatus by efficiently controlling the movement of a jig at the time of inspection.

Therefore, the inspection main body part of the board | substrate inspection apparatus which concerns on this invention is provided with the conveyance area which conveys a board | substrate to be inspected from an import side to an export side, and the inspection area which arrange | positions the inspection fixture for carrying out a predetermined | prescribed inspection | inspection to the said to-be-tested substrate. And a first conveying device which is arranged in the conveying zone and conveys the substrate under test from the carrying in side to the carrying out side, and the substrate under test in a direction orthogonal to the conveying direction of the first conveying apparatus. A second conveying apparatus arranged to convey, comprising: a second conveying apparatus for conveying the inspected substrate between a predetermined position of the first conveying apparatus and a position where the inspecting jig in the inspecting region is arranged; The second conveying apparatus is characterized by comprising a holding device for supporting the substrate to be inspected.

In the inspection main body portion of such a substrate inspection apparatus, the inspection jig may include a jig head portion provided with a probe and a scanner block for switching signals to the probe.

In the inspection main body of such a substrate inspection apparatus, the holding device in the second conveying apparatus includes an upper fixing portion and a lower pressing portion, and the lower pressing portion rotates to support or release the substrate under test. You can do it.

In the inspection main body of any one of the substrate inspection apparatuses, the inspection fixture of the inspection main body includes a CD camera, and the CD camera detects a predetermined mark on the inspection target board, whereby the horizontal direction and The shift in the vertical position and the shift in the inclination can be corrected.

In addition, the substrate inspection apparatus according to the present invention includes a carrying-in portion including a conveying device for carrying in one sheet to be inspected, the inspection main body according to any one of claims 1 to 4, and the inspection body portion as described above. And a sorting storage section for sorting and storing the substrate under test according to the test result, wherein the substrate to be inspected is supplied from the carry-in section to the carry-in side of the inspection main body, and is conveyed from the carry-out side to the sorting storage section. It is characterized by.

In such a substrate inspection apparatus, the inspection body portion is formed of a rectangular parallelepiped frame, and an inlet portion connected to the carry-in portion on one of the carrying-in sides of the frame is formed on the other carry-out side of the frame. An outlet part connected to the sorting storage part is formed, and the first conveying device is arranged to convey the substrate under test linearly from the inlet part to the outlet part, and the second conveying device is the first conveying part. It is arrange | positioned at the right angle from the said predetermined position of a device, and may move the said to-be-tested board reciprocally from the predetermined position of the said 1st conveying apparatus to the position which arrange | positioned the said test fixture in the said inspection area.

In such a substrate inspection apparatus, the carry-in portion may be provided with a suction device for sucking and lifting the substrate under test to be mounted on the conveying apparatus.

In any one of the above-described substrate inspection apparatuses, there is a possibility of disconnection, short-circuit, or short-circuit of the substrate under test depending on the inspection result. Can be sorted and stored.

In addition, according to the present invention, a method of inspecting a substrate and selecting and storing the substrate according to an inspection result includes stacking the inspected substrates and bringing them into the inspection main body one by one, and the inspected substrates imported from the carry-in process. A first conveying step for conveying in a straight line until the carrying out step and a first conveying substrate to the inspection area in a direction orthogonal to the conveying direction at a predetermined position in the conveying path in the first conveying step (2) a conveying process, an alignment process for aligning the position of the inspection fixture and the inspected substrate in the inspection region in the inspection region, and the electrical characteristics of the inspected substrate in the inspection region; The inspection screening process for sorting out the possibility of disconnection, the possibility of short circuit, or the like, and from the inspection area A third transport step of transporting the inspected substrate to a predetermined position on the transport path of the first transport process; an ejection process of transporting the inspected substrate out of the inspection zone; and the blood transported in the transport process And a storage process of storing the test substrates at respective positions selected according to the test screening result.

According to the present invention, it is possible to provide a substrate inspection apparatus capable of responding to various inspection requirements by one inspection apparatus.

According to the present invention, it is possible to provide a substrate inspection apparatus which reduces the operating cost of the substrate inspection apparatus by inspecting the substrate at high speed.

According to the present invention, it is possible to provide a substrate inspection apparatus which reduces the operating cost of the substrate inspection apparatus by facilitating assembly and maintenance of the jig.

Further, according to the present invention, it is possible to provide a substrate inspection apparatus which reduces the operating cost of the substrate inspection apparatus by controlling the movement of the jig during inspection.

1 is a plan view showing a schematic configuration of a substrate inspection apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged front view showing a schematic configuration which is a part of one embodiment of a gripping portion of a work holder. FIG.
FIG. 3 is an enlarged view briefly showing the structure of the inspection main body as seen in the direction of the arrow from the 3A-3A line in FIG.
4 is an enlarged front view schematically showing a part of the device in the inspection position in order to explain the method of substrate inspection in the inspection area of the substrate inspection apparatus shown in FIG.
Fig. 5A is a perspective view briefly shown for explaining the relationship between the inspection subject region and the movement of the inspection jig in the substrate inspection.
Fig. 5B is a plan view briefly shown for explaining the relationship between the movement of the inspection jig and the inspection speed when the inspection subject region of the substrate under test is different.

EMBODIMENT OF THE INVENTION Below, the board | substrate inspection apparatus which concerns on this invention is demonstrated based on attached drawing. In each of the accompanying drawings, the thickness, length, shape, spacing, etc. of each member are appropriately enlarged, reduced, deformed, simplified, etc. for easy understanding. The same members are denoted by the same reference numerals between the drawings, and description thereof will be omitted.

[Schematic of Board Inspection Device]

1 shows a schematic configuration of a substrate inspection apparatus 1 according to an embodiment of the present invention. The board | substrate test | inspection apparatus 1 is equipped with the carry-in part 10, the test | inspection main-body part 12, and the sorting | storing storage part 14.

The carrying-in unit 10 stacks a plurality of inspected substrates and conveys them into the inspection main body portion 12 one by one from the uppermost inspected substrate in order. The inspected portion at the top of the stacked inspected substrates is transported. A suction device (not shown) for sucking and lifting the substrate and a pair of conveyors 18-1 for conveying the substrate under test into the inspection main body portion 12 one by one are provided.

1 shows the substrate 20-1 to be inspected as the topmost substrate to be inspected. The suction device sucks and lifts a plurality of predetermined positions on the substrate 20-1 to be tested, and mounts both side cross-sections of the substrate on the pair of conveyors 18-1. The inspected substrate 20-1 mounted on the conveyor 18-1 is conveyed into the inspection main body 12 by the conveyor 18-1.

The inspection main body portion 12 is formed in a rectangular parallelepiped frame, and has an inlet portion (not shown in the drawing) connected to the carry-in portion 10 through the inlet portion 10. The inspection board is brought in. In addition, the inspection main body 12 includes a pair of conveyors 18-2, 18-3, and 18-4 for conveying the substrate under test from the carrying-in portion 10 side to the sorting storage portion in a straight line. (First conveying apparatus) and an inspection area 12d for inspecting a substrate to be inspected. 1 shows a state in which one test substrate 20-2, 20-3, 20-4 is mounted on each conveyor 18-2, 18-3, 18-4 at a certain time. However, the present invention is not limited thereto, and each conveyor can carry a predetermined number of inspected substrates as needed. On the other hand, from the viewpoint of explaining the concept of conveying the substrate under test, it may be understood that FIG. 1 shows a state in which one substrate to be inspected is sequentially conveyed from 20-1 to 20-4.

The inspection main body 12 also reciprocates the inspected substrate 20-3 conveyed by the pair of conveyors 18-3 to a predetermined inspection position 20p in the inspection region 12d in the orthogonal direction. A pair of conveying apparatus 19 (2nd conveying apparatus) for carrying out is provided. The pair of conveying apparatuses 19 are provided with the work holder 22 shown by a dashed-dotted line, and conveys the test | inspection board | substrate 20 to the test | inspection position 20p by moving the work holder 22. As shown in FIG. The workpiece holder 22 will be described later.

The inspected substrate inspected in the inspection area 12 is returned from the inspection position 20p onto the pair of conveyors 18-3 by the pair of conveying devices 19, and then the pair of conveyors 18 Up to -4) and up to the sorting storage unit 14. The inspection body portion 12 is provided with an outlet portion (not shown) connected to the sorting storage portion 14 on the carrying out side of the frame, so that the substrate to be inspected passes through the outlet portion. ) Is returned to the sorting storage unit 14.

The sorting storage unit 14 is divided into an OPEN storage area 14-1, a LEAK storage area 14-2, and a PASS storage area 14-3, and has a pair of conveyor belts across their area ( 18-5).

The OPEN storage area 14-1 is an area for storing the inspected substrate that is determined to have the possibility of disconnection as a result of the inspection, and the LEAK storage area 14-2 is a zone for leakage current or short circuit. The PASS storage area 14-3 is an area for storing the test substrate judged to be possible, and the PASS storage area 14-3 does not correspond to them and is judged to have no problem. After the board | substrate inspected by the test | inspection main-body part 12 is mounted in the conveyor belt 18-5, it is stored in either area according to a test result.

In addition, a pair of sticky rollers 23 arranged in the vertical direction at the inlet of the inspection main body 12 may be provided to remove dust and garbage by passing the substrate under test therebetween. .

  (Work holder)

The work holder 22 is provided with the holding | gripping tool 42 which opposes and attached to each of a pair of conveying apparatus 19. As shown in FIG. On each conveying apparatus 19, three to four holding apparatuses 42 are attached, and before and after the conveying direction of the inspected substrate 20-3 conveyed by the pair of conveyors 18-3 again. In other words, the end face of the side facing the carrying-in part 10 and the sorting storage part 14 of the board | substrate inspection apparatus 1 is gripped (FIG. 2). The number of holding devices used can be changed depending on the size of the substrate under test.

As shown in Fig. 2, each holding device 42 has an upper fixing part 42f and a lower pressing part 42g. When the substrate to be inspected is not supported, the lower pressing portion 42g rotates downward to open between the upper fixing portion 42f and the lower pressing portion 42g, as indicated by the dashed-dotted line. When the substrate 20-3 to be inspected is mounted on the conveyor belt 18-3 and reaches the position indicated by the dashed-dotted line, the substrate 20-3 indicated by the dashed-dotted line by a device not shown in the figure. It is lifted upwards. When the substrate under test is lifted in contact with the lower surface of the upper fixing portion 42f, the lower pressing portion 42g is rotated at that time to press the lower surface of the substrate under test 20-3, As a result, the substrate 20-3 to be inspected is supported between the upper fixing part 42f and the lower pressing part 42g. In this state, the pair of conveying devices 19 move the work holder 22 to convey the substrate under test to the inspection position 20p (Fig. 1) of the inspection area.

 (Inspection Area)

In the inspection area 12d, a pair of inspection fixtures 26U and 26D are arranged up and down (Fig. 3). Each inspection jig is provided with a base 28, on which the alignment CD camera 21, the head 34, and the scanner blocks 27-1 and 27-2 are attached. have.

The head part 34 supports the probe which contacts the predetermined test | inspection point on a to-be-tested board | substrate. The probe is connected to a control device of a substrate inspection device not shown in the drawing via the scanner blocks 27-1 and 27-2, and transmission and reception of a signal for substrate inspection is performed between the control device and the probe. In addition, the control apparatus checks the substrate inspected on the basis of the signal received from the probe, in the OPEN storage area 14-1, LEAK storage area 14-2, or PASS storage area 14-3 of the sorting storage unit 14. Decide on which one to store. For this determination, for example, applied test voltages: 1V to 250V, set resistance values: 1Ω to 10MΩ, test currents: 0.5mA to 20mA, and the like are selected and used according to the test contents.

The alignment CD camera 21 detects a predetermined mark on the substrate to be inspected to detect misalignment or inclination of the position of the head 34 in the vertical and horizontal directions with respect to the substrate to be inspected. Based on this detection signal, the base 28 is moved or rotated in a linear direction to correct the position or inclination, and the alignment of the inspection point of the substrate under test with the tip position of the head 34 is achieved. do. The movement of each test fixture 26U, 26D is made by a linear motor mechanism, for example.

The scanner blocks 27-1 and 27-2 are circuit devices for switching signals for a probe to be operated. For example, in the present embodiment, if each scanner block can switch signals of up to 8,000 probes at the same time, up to 16,000 probes can be operated in one scan to enable substrate inspection. For this reason, if the number of scanner blocks attached to the base 28 is increased, the number of probes that can be simultaneously scanned at the same time in calculation is proportional to the number of the scanner blocks. For example, if two more scanner blocks having the same performance are added to four in total, it is possible to simultaneously inspect up to 32,000 inspection points in one scan. In order to expand the scanner block, however, it is necessary to expand the expectations as necessary or to increase the strength of the expectations in consideration of the weight of the scanner blocks. However, it is not necessary to inspect the maximum number of inspection points by one scan, and the number of inspection points to be scanned once and the number of times of scanning can be arbitrarily selected as necessary. The relationship between the function of the scanner block and the number of inspection points on the substrate to be inspected will be described later with reference to Figs. 5A and 5B.

FIG. 3 is an enlarged view schematically showing a part of the apparatus in the inspection area 12d in the inspection main body portion 12 viewed in the arrow direction from the line 3A-3A in FIG. In Fig. 3, the inspection zone 12d is in the direction indicated by the arrow. In the inspection area 12d, the substrate 20-3 to be inspected is conveyed by the work holder 22 between the inspection jig 26U and 26D disposed at the upper and lower positions. Each inspection jig 26U, 26D detects a predetermined mark on the inspection board by the alignment CDC camera 21, and moves or rotates each inspection jig 26U, 26D in a linear direction based on the reference mark. The inspection fixtures 26U and 26D are arranged at predetermined positions before the inspection by correcting the position and the inclination.

Fig. 4 shows a state in which the inspection fixtures 26U and 26D are arranged at predetermined positions before the inspection. As shown in this figure, the substrate 20-3 to be inspected is disposed between the upper and lower head portions 34 of the inspection fixtures 26U and 26D in a state where both sides of the substrate are supported by the holding device 42. It is. The tip portion of the probe p protrudes from each head portion 34, and when the inspection starts, the two head portions 34 approach the substrate 20-3 together to determine the tip portion of the probe p. In contact with the inspection point of the block, the signal is transmitted and received by the control device (not shown) of the substrate inspection apparatus, and the inspection of the substrate is performed. If necessary, the head 34 is moved to an adjacent block to perform the same inspection. If necessary, as shown by the intersecting arrows in Fig. 3, the inspection fixtures 26U and 26D are moved, and these steps are repeated.

  (Inspection fixture)

In each inspection jig 26U, 26D, the scanner blocks 27-1, 27-2 and the head 34 are connected by electrical wiring via the base 28 and the connecting portion 32. In such a case, when the two are directly connected, the inspection jig can be used as a dedicated device for 8,000 inspection points or 16,000 inspection points. Instead, if the connection portion 32 has an adapter function, the head portion 34 can be detached, and the probe can be reused, it is possible to cope with the inspection of all the substrates to be tested at low cost. In addition, if the connection portion 32 has a conversion function, it is possible to cope with inspection of all inspected substrates without changing the wiring.

Fig. 5A is a perspective view briefly shown in order to explain the relationship between the inspection target region and the movement of the inspection fixture in the substrate inspection. For simplicity of drawing, only one inspection jig 26U located above is shown and the lower inspection jig 26D is omitted, but the same as the upper inspection jig 26U with respect to the lower inspection jig 26D. The relationship is established. 5B is a plan view briefly shown in order to explain the relationship between the movement of the inspection jig and the inspection speed when the inspection subject region of the substrate under test is different.

In FIG. 5A, the inspection target area of the substrate 20 to be inspected is divided into three blocks 20a, 20b, and 20c. For example, if each scanner block is for 3,000 inspection points, and each block of the inspection target area has 8,000 inspection points, the scanner block of the inspection fixture corresponds to 4,000 inspection points using two scanner blocks. Each block is scanned twice. Specifically, the head portion 34 is first moved to a half inner portion of the block 20a to be scanned and the portion is scanned, and then the head portion 34 is moved to the front half portion of the remaining block 20a. Move and inject the corresponding part. In this way, the inspection of the inspection object block 20a is completed. Next, the head 34 is moved to the inner half of the adjacent inspection object block 20b to scan the portion, and then the head 34 is moved to the front half of the remaining half to the corresponding portion. Scan the part to complete the inspection of the inspection object block 20b. Finally, the head portion 34 is scanned about half of the inner portion of the adjacent inspection target block 20c, and then the head portion 34 is moved to the other half portion of the front side, and the portion is scanned. The inspection on the inspection block 20c is completed. As a result, the inspection of the substrate 20 to be inspected is completed.

In Fig. 5B (i), for example, when there are 16,000 inspection points on the inspected substrate, the inspection of the inspected substrate can be ended by one scan, provided that the total of the scanner blocks of the inspection fixtures can correspond thereto. .

In Fig. 5B (ii), for example, when 16,000 inspection points exist on a substrate to be inspected, it may be inspected by dividing it into two blocks. In such a case, one scanner block may be sufficient because each scanner block of the inspection fixture can cope with 8,000 inspection points.

In Fig. 5B (iii), for example, when 15,000 inspection points exist on a substrate to be inspected, it may be inspected by dividing it into three blocks. In such a case, each inspection block becomes 5,000 inspection points, so that when the scanner block of the inspection fixture can correspond to 8,000 inspection points, scanning is sequentially performed on each inspection block using a part of one scanner block.

In Fig. 5B (iv), for example, when 16,000 inspection points exist on a substrate to be inspected, it may be inspected by dividing it into four blocks. In this case, since each inspection block is 4,000 inspection points, when the scanner block of the inspection fixture can cope with 8,000 inspection points, a part of one scanner block is used to scan each inspection block.

In this way, the inspection point can be scanned in one scan up to the maximum number corresponding to the inspection points of the scanner block. However, even if the inspection subject area is divided into several blocks and inspected using several steps as necessary, the time from the start of the test to the end of the test does not increase so much by repeating the scanning and movement by the test tool. For example, according to some test data, if there are 6,000 checkpoints on the substrate under test, the time for scanning it once is about 9.9 seconds, but the time for scanning the 6,000 checkpoints twice with 3,000 checkpoints is about 11.1 seconds, the time that the 6,000 checkpoints were injected three times with 2,000 checkpoints was about 11.9 seconds, and the time when the 6,000 checkpoints were injected four times with 1,500 checkpoints was about 12.7 seconds, increasing the number of heads. The time required to complete the injection was longer, but the delay time did not increase in proportion to the number of patients.

[Summary of Board Inspection Method]

The outline matters at the time of board | substrate inspection using the board | substrate inspection apparatus 1 are demonstrated.

First, the inspection target substrate is stacked on the carrying-in portion 10 of the substrate inspection apparatus 1. In the carrying-in part 10, the board | substrate 20-1 of the uppermost to-be-tested board | substrate is lifted up using a suction apparatus, and both side cross-sections of the board | substrate are lifted on a pair of conveyor 18-1. Mount it. The inspected substrate 20-1 mounted on the conveyor 18-1 is conveyed from the conveyor 18-1 into the inspection main body 12 via the inlet of the inspection main body 12 (loading step).

As a 1st conveyance process, the test | inspection board | substrate 20-2 carried in in the test | inspection main-body part 12, and mounted in the conveyor 18-2 is conveyed to the next conveyor 18-3, and the Synchronized with that, the substrate 20-1 to be brought in from the carrying-in unit 10 is conveyed onto the conveyor 18-2 in place of the substrate 20-2 to be inspected.

The substrate 20-3 to be conveyed by the conveyor 18-3 is lifted from below, and as shown in FIG. 2, the work holders 22 provided on the pair of conveying apparatuses 19 face each other. It is conveyed between the holding devices 42. When the front and rear edge portions of the substrate 20-3 thus lifted are in contact with the lower surface of the fixing portion 42f on the upper side of each holding device 42, the lower pressing portion 42g is rotated and inspected. The lower surface of the substrate 20-3 is pressed, thereby supporting the substrate 20-3 to be inspected between the upper fixing portion 42f and the lower pressing portion 42g. In this state, a pair of conveying apparatus 19 moves the work holder 22, and conveys a board | substrate under test to the test | inspection position 20p (FIG. 1) of a test area (2nd conveyance process).

When the substrate to be inspected is arranged at the inspection position 20p, a pair of inspection fixtures 26U and 26D are arranged above and below the inspection substrate. A predetermined mark on the inspection target board is detected by the alignment of the inspection camera CD camera 21, and the position and inclination of the inspection fixture are corrected. Thus, the tip of the probe in the head 34 of each inspection fixture is corrected. The position and inspection point of the substrate to be inspected are aligned (alignment process).

When the board inspection starts, the two heads 34 approach the substrate 20-3 to be inspected so that the tip of the probe p is brought into contact with the inspection point of the predetermined block, and the control device of the substrate inspection apparatus (Fig. (Not shown), the signal is transmitted and received to inspect the substrate. If necessary, the head 34 is moved to an adjacent inspection target block to perform the same inspection, and such movement is repeated as necessary.

The control device of the board inspection apparatus is based on the data obtained by the inspection, and the board under test is based on the OPEN storage area 14-1, LEAK storage area 14-2 or PASS storage area ( 14-3) decide where to store. In such inspection, the inspection substrate 20-3 is considered to be no problem if there is no possibility of disconnection and no leakage current or short circuit as a result of the inspection. Based on these results, the control device of the substrate inspection apparatus determines that the substrate 20-3 to be inspected is stored in the PASS storage area 14-3 (inspection selection process).

When the board inspection is completed, the inspection fixtures 26U and 26D are removed from the substrate 20-3 to be inspected, and the conveying apparatus 19 moves the work holder 22 to move the substrate 20-3 to the conveyor ( 18-3) Return to phase (third transfer step). When the substrate under test 20-3 reaches the conveyor 18-3, the pressing portion 42g at the lower side of the holding device 42 is rotated downward to open and the substrate under inspection 20-3 is opened. In addition, the lower support device (not shown) is mounted on the conveyor 18-3 while supporting the substrate 20-3 to be inspected.

When the substrate 20-3 to be inspected is mounted on the conveyor 18-3, the conveyor 18-3 passes through the outlet of the inspection main body 20 to move the substrate to the next conveyor 18-4. It is conveyed so that it may be mounted in (the carrying out process). The conveyor 18-4 subsequently mounts the substrate on the conveyor 18-5 of the sorting storage 14. The conveyor 18-5 moves the inspected substrate 20-3 to the OPEN storage area 14-1 and the LEAK storage area 14-2 based on a signal indicating an inspection result from the control device of the substrate inspection device. It passes back to the PASS storage area 14-3 and stores it there (storage process).

As mentioned above, although one Embodiment of the board | substrate test | inspection apparatus which concerns on this invention was described, this invention is not limited to this embodiment, Addition, deletion, modification, etc. which a person skilled in the art can easily make are to this invention. The technical scope of the present invention is also to be determined by the description of the appended claims.

1: Substrate Inspection Equipment
10: import
12: inspection main body
12d: inspection area
14: sorting storage
18-1, 18-2, 18-3, 18-4, 18-5: Conveyor
20, 20-1, 20-2, 20-3, 20-4: Tested substrate
20p: inspection location
21: CD camera
22: work holder
23: adhesive roller
26U, 26D: Inspection fixture
27-1, 27-2: Scanner Block
28: Expectation
34: head part
42: holding device
p: probe

Claims (9)

A return area for returning the inspected substrate from the import side to the export side;
An inspection area in which an inspection jig for conducting a predetermined inspection is placed on the inspected substrate;
As an inspection body part of the board | substrate inspection apparatus provided,
A first conveying apparatus disposed in said conveying zone and conveying said inspected substrate from said carrying side to said carrying side;
A second conveying apparatus arranged to convey the inspected substrate in a direction orthogonal to a conveying direction of the first conveying apparatus, wherein a second conveying apparatus is disposed between a predetermined position of the first conveying apparatus and a position where the inspecting jig in the inspecting area is arranged; A second conveying apparatus for conveying the inspected substrate
Respectively,
An inspection main body portion of a substrate inspection device, wherein the second conveying device includes a holding device for supporting the substrate to be inspected.
The method of claim 1,
An inspection main body portion of a substrate inspection apparatus, wherein the inspection jig includes a jig head portion including a probe and a scanner block for switching a signal to the probe.
3. The method according to claim 1 or 2,
And a holding unit of an upper side and a lower pressurizing unit, wherein the lower pressurizing unit rotates to support or release the substrate under test.
The method of claim 1 ,
The inspection fixture of the inspection main body includes a CD camera, and the CD camera detects a predetermined mark on the inspection target substrate, whereby the deviation of the horizontal and vertical positions of the inspection fixture can be corrected. Inspection body part of the board inspection apparatus.
An importing unit having a conveying device for carrying in the test piece board one by one,
The inspection main body of claim 1 ,
A sorting storage unit for sorting and storing the inspected substrate inspected in the inspecting main body unit according to a test result
Respectively,
The board | substrate test | inspection apparatus supplied to the said carrying-in side of the said test | inspection main body part from the said carrying-in part, and conveyed to the said sorting storage part from the said carrying out side.
The method of claim 5,
The inspection body portion is formed of a rectangular parallelepiped frame,
Moreover, the entrance part connected with the said carry-in part is formed in the said carry-in side of one side of the said frame,
On the other carrying side of the frame, an outlet portion connected to the sorting storage portion is formed,
The first conveying apparatus is arranged to convey the substrate under test linearly from the inlet to the outlet,
The second conveying apparatus is disposed at a right angle from the predetermined position of the first conveying apparatus, and from a predetermined position of the first conveying apparatus to a position where the inspection jig is arranged in the inspection area. And a substrate inspection apparatus for reciprocating the substrate under test.
The method of claim 5 ,
And said carry-in portion is provided with a suction device for sucking and lifting said substrate under test to be mounted on said transfer device.
The method of claim 5 ,
And a sorting storage unit sorting and storing the substrate under test according to a test result as having a possibility of disconnection, a possibility of short circuit, or a possibility of disconnection or short circuit .
As a method of inspecting a substrate and sorting and storing it according to the inspection result,
An import process of stacking inspection boards and bringing them into the inspection body one by one;
A first conveying step of conveying the inspected substrate carried in from the carrying in step in a straight line until the carrying out step;
A second conveyance step of conveying the inspected substrate to the inspection zone in a direction orthogonal to the conveyance direction at a predetermined position in the conveyance path in the first conveyance step;
An alignment step in the inspection zone for aligning the position of the inspection fixture and the inspection target substrate in the inspection zone;
An inspection screening process for inspecting the electrical characteristics of the inspected substrate in the inspection area for sorting out the possibility of disconnection , the possibility of short circuit , or the possibility of disconnection or short circuit ;
A third conveyance step of conveying the inspected substrate from the inspection area to a predetermined position of the conveyance path;
A carrying out step of taking out the inspected substrate from the inspection zone;
A storage step of storing the inspected substrates carried out in the carrying out process at positions selected according to the results of the inspecting sorting process;
Including, the method for inspecting the substrate and storing the sorted according to the test result.

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