JP2001033518A - Insert for electronic component-testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insert excellent in holding property of an electronic component to be tested. SOLUTION: This insert 16 is provided with a latch part 163a which moves between a position where holding is performed covering the upper surface of an electronic component IC to be tested which is accommodated in the insert 16 and a position where retreating is performed from the upper surface of the electronic component, and a latch arm part 163d which rotatably supports the latch part 163a on an insert main body 161. A tip part of the latch part 163a and a rotation center 163b of the latch arm part 163d are arranged on almost the same vertical line when these are viewed from a side surface of the insert 16. The latch part 163a and the rotation center of the latch arm part 163d are offset when viewed from a plane of the insert 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component testing apparatus for testing electronic components (hereinafter, also simply referred to as ICs) such as semiconductor integrated circuit devices, and a tray and an insert used for the same, and more particularly, to a device under test. The present invention relates to an insert, a tray, and an electronic component testing apparatus which are excellent in IC holding properties.

[0002]

2. Description of the Related Art In an electronic component test apparatus called a handler, a large number of ICs stored in a tray are conveyed into a test apparatus, and each IC is brought into electrical contact with a test head to test an electronic component. Apparatus body (hereinafter also referred to as tester)
Have the test performed. When the test is completed, each IC is taken out of the test head and placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

[0003] A conventional electronic component test apparatus includes an I
A tray (hereinafter, also referred to as a customer tray) for storing C or a tested IC is different from a tray (hereinafter, also referred to as a test tray) circulated and transported in the electronic component test apparatus. In this type of electronic component test apparatus, the IC is replaced between the customer tray and the test tray before and after the test, and the test is performed by bringing the IC into contact with the test head. In the process, the IC is pressed against the test head while being mounted on the test tray.

In a test tray of a conventional electronic component testing apparatus, an IC mounting tool called an insert, for example, 64 is mounted.
The insert 16 has a lever plate 162 which approaches and separates from the insert body as shown in FIG. The lever plate 162 is mechanically connected to a latch 163 for holding (preventing jumping out) the IC, and is shown in the upper diagram of FIG. Thus, the latch 163 is in the closed state to prevent the IC from jumping out during transport. On the other hand, when the lever plate 162 is pushed down from the outside, the latch 163 is opened as shown in the lower diagram of FIG.

[0005]

The contact portion of the test head is composed of a plurality of contact pins provided so as to be able to protrude and retract by a spring. When a ball grid array (BGA: Ball Grid Aray) type IC is to be tested, the contact portion thereof is required. The tip is a conical recess corresponding to the ball-shaped input / output terminal.

In the conventional electronic component test apparatus, the position of the IC under test and the contact pins are aligned using the outer shape of the package mold of the IC. However, in an IC such as a chip size package (CSP), In addition, the dimensional accuracy of the package mold is extremely rough, and the positional accuracy between the outer peripheral shape and the solder ball is not always guaranteed. For this reason, when positioning is performed on the outer periphery of the IC package mold, the solder ball is pressed in a state shifted from the contact pin, and there is a possibility that the solder ball may be damaged by the sharp tip of the contact pin.

Therefore, the present inventors have developed a device in which positioning is performed not by a package mold but by a solder ball itself. This not only prevents the solder balls from being damaged, but also allows the inserts to be shared even if the external shapes are different as long as the arrangement matrix of the solder balls is the same.

However, for example, when two types of ICs having different external shapes as shown in FIG. 17 and having the same arrangement matrix of solder balls are mounted on one type of insert, it is difficult to hold the above-mentioned latch 163.

That is, if the IC is positioned with respect to the insert 16 by a solder ball, the height of the solder ball itself is extremely small, so that even a slight vibration causes the IC to come off the guide. Therefore, latch 1
The vertical clearance z between 63 and the IC needs to be as small as possible. To do so, the tip of the latch 163 shown in FIG.

However, when the tip of the latch 163 is extended, the opening / closing amount x when the latch 163 is opened is reduced as shown in the lower diagram of FIG. The IC and the IC cannot be held by the same latch 163.

[0011] If the rotation angle of the latch 163, that is, the amount by which the lever plate 162 is pushed down is increased, the opening / closing amount x of the latch 163 also increases.
It is difficult to increase the depression amount of 62 due to restrictions on the handler test process. Further, the opening / closing amount x of the latch 163 increases even if the rotation center of the latch 163 is moved downward in the drawing. However, if the rotation center of the latch 163 is shifted downward, the insert itself becomes larger downward. There is a risk of interference with other mechanisms during transport to the printer.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems of the prior art, and has as its object to provide an insert, a tray, and an electronic component testing apparatus which are excellent in holding an electronic component under test. .

[0013]

(1) In order to achieve the above object, according to a first aspect of the present invention, a tray on which an electronic component under test is mounted and routed in an electronic component test apparatus is provided.
An insert provided so as to be finely movable, and a latch portion that moves between a position where the insert is held on the upper surface of the electronic component under test stored in the insert and a position where the electronic device is retracted from the upper surface of the electronic device under test. A latch arm portion rotatably supporting the latch portion on the insert body,
In the side view of the insert, the tip of the latch portion and the rotation center of the latch arm portion are disposed on substantially the same vertical line, and the latch portion and the rotation center of the latch arm portion are offset from each other in plan view of the insert. An insert is provided.

At this time, although not particularly limited, it is more preferable to have an elastic body that urges the latch arm in a direction in which the latch portion moves to the holding position.

In the insert according to the present invention, when holding and releasing the electronic device under test, the rotation center of the latch arm and the latch arm are substantially co-linear in side view. Even if the angle is small, the opening / closing amount (difference between the holding position and the retracted position) of the tip of the latch portion geometrically increases. Thus, electronic components having different package mold sizes can be mounted on the same insert. Further, in the insert of the present invention, since the latch portion and the rotation center of the latch arm portion are offset in plan view, the latch arm portion does not hinder the insertion / removal of the electronic component into / from the insert.

Although not particularly limited in the above invention,
The power point of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, and an external force acts on the power point via a lever plate provided on the insert body. (See FIGS. 6 and 11) or the force of the latch arm is
It may be provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, so that an external force acts directly on the force point (see FIG. 12).

(2) In order to achieve the above object, according to a second aspect of the present invention, an insert movably provided on a tray on which an electronic component under test is mounted and routed in an electronic component testing apparatus. And a guide core movably provided with respect to the insert body, the guide core on which the electronic component under test is mounted, a position covering the upper surface of the electronic component under test stored in the insert, and a position of the electronic component under test. A latch mechanism having a latch portion that moves between a position retracted from the upper surface, a latch arm portion that rotatably supports the latch portion on the insert body, a movement of the guide core with respect to the insert body, and an operation of the latch portion. And an interlocking mechanism for interlocking movement.

At this time, it is preferable that the interlocking mechanism moves the latch portion to the retracted position after separating the guide core from the insert body. Further, it is preferable that the interlocking mechanism causes the guide core to approach the insert body after moving the latch portion to the holding position.

In the insert of the present invention, when the electronic component is held and released by the latch mechanism, the guide core on which the electronic component is mounted is also moved toward and away from the insert body.

That is, when mounting the electronic component, the electronic component is mounted with the latch portion moved to the retracted position, the guide core moved to the separating position, and then the latch portion is moved to the holding position. Then, bring the guide core close to the insert body. That is, since the guide core is at the separated position at least when the latch portion is closed, the latch portion does not interfere with the electronic component even if the thickness of the electronic component is different.

When taking out the electronic component, the guide core is first separated from the insert body from the state where the latch portion is in the holding position and the guide core is in the approach position, and then the latch portion is moved to the retracted position. In other words, at least when the latch portion opens, the guide core is at the separated position,
Even if the thickness of the electronic component is different, the latch does not interfere with the electronic component.

As described above, according to the insert of the present invention, electronic components having different package mold thicknesses can be mounted on the same insert.

(3) The electronic component under test applied in the present invention is not particularly limited, and includes all types of electronic components. In particular, a so-called ball in which the terminals of the electronic component under test are ball-shaped terminals The effect is particularly remarkable when applied to a grid array type IC.

At this time, it is preferable that the insert of the present invention has a guide for contacting and positioning the terminal of the electronic component under test.

As described above, instead of positioning the package mold of the electronic component under test, the terminal itself pressed against the contact portion is directly positioned by the guide, so that the terminal of the electronic component under test with respect to the contact portion is positioned. The positioning accuracy is significantly improved, and damage to the terminals and the like can be prevented.

Also, if the arrangement matrix of the terminals of the electronic components under test is common, the insert can be shared even if the shape of the package mold is different, and the cost required for the setup work time such as production or replacement of a dedicated component. Can be reduced.

The shape, set position, number, material, etc. of this type of guide are not particularly limited as long as it has a function of contacting and positioning the terminal of the electronic component under test. Stuff is included.

For example, the guide may be a hole into which the ball-shaped terminal of the ball grid array type IC is fitted. In this case, holes for fitting into all the ball-shaped terminals may be provided, or holes for fitting into some of the ball-shaped terminals may be provided. Further, in addition to the means for fitting one ball-shaped terminal into one hole, one end of one ball-shaped terminal and one end of another ball-shaped terminal can be fitted into one hole. . The “hole” mentioned here is intended to include not only a through hole penetrating the guide core but also a concave portion not penetrating the guide core.

(4) In order to achieve the above object, according to a third aspect of the present invention, an electronic component to be tested is loaded into a contact portion of a test head of an electronic component testing apparatus, and a tray for unloading the electronic component under test. Accordingly, a tray having the insert is provided.

(5) According to a fourth aspect of the present invention, there is provided an electronic component test apparatus for performing a test by pressing a terminal of an electronic component under test against a contact portion of a test head. Accordingly, an electronic component test apparatus having the above tray is provided.

[0031]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the electronic component test apparatus of the present invention, FIG. 2 is a flowchart of a tray showing a method of handling the electronic component under test in the electronic component test apparatus of FIG. 1, and FIG. IC for parts testing equipment
FIG. 4 is a perspective view showing a structure of a stocker, FIG. 4 is a perspective view showing a customer tray used in the electronic component test apparatus of FIG. 1, and FIG.
8 is a partially exploded perspective view showing a test tray used in the electronic component test apparatus of FIG. 1, FIG. 6 is an exploded perspective view showing an embodiment of the insert of the present invention, FIG. 7 is a plan view of the insert shown in FIG. Is a sectional view taken along line VIII-VIII of FIG. 7 (latch closed), FIG. 9 is a sectional view taken along line VIII-VIII of FIG. 7 (latch open), and FIG. 10 is a pusher, insert, and socket in the test head of FIG. FIG. 11 is an exploded perspective view showing another embodiment of the insert of the present invention, FIG. 12 is an exploded perspective view showing still another embodiment of the insert of the present invention, and FIG. FIG. 14 is an exploded perspective view showing still another embodiment of the insert of the present invention, FIG. 14 is a sectional view taken along line XIV-XIV of FIG.
5 is an exploded perspective view showing still another embodiment of the insert of the present invention, FIG. 16 is a sectional view showing a conventional insert, and FIG. 17 is a side view showing a general ball grid array type IC.

FIG. 2 is a diagram for understanding a method of handling an electronic component under test (hereinafter, also simply referred to as an IC or an IC) in the electronic component test apparatus according to the present embodiment. In some parts, members arranged in the vertical direction are shown in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

[First Embodiment] The electronic component test apparatus 1 of the present embodiment operates properly under the condition that the IC under test is subjected to high or low temperature stress or not. Test (inspection)
A device for classifying ICs according to the test results. An operation test in a state in which such a temperature stress is applied or not is performed in a tray (hereinafter, referred to as a customer tray) on which a large number of ICs to be tested are mounted. Also called KST.
The test IC is mounted on a test tray TST (see FIG. 5) transported from the electronic component test apparatus 1 (see FIG. 4).

For this reason, as shown in FIGS. 1 and 2, the electronic component test apparatus 1 of the present embodiment stores ICs to be tested from now on, and classifies and stores tested ICs. A storage unit 200, a loader unit 300 for sending an IC under test sent from the IC storage unit 200 to the chamber unit 100, a chamber unit 100 including a test head,
And an unloader section 400 for classifying and extracting the tested ICs tested in the chamber section 100.

The IC storage unit 200 stores the pre-test IC stocker 201 for storing the IC under test before the test, and the tested IC stocker 202 for storing the IC under test classified according to the test result.
Are provided.

The pre-test IC stocker 201 and the tested IC stocker 202, as shown in FIG. 3, have a frame-shaped tray support frame 203, and enter from the lower portion of the tray support frame 203 and move upward and downward. Elevator 2 made possible
04 is provided. Tray support frame 203
, A plurality of customer trays KST are stacked and supported, and only the stacked customer trays KST are moved up and down by the elevator 204.

The pre-test IC stocker 201 includes:
While the customer trays KST in which the ICs to be tested are stored are stacked and held, the customer tray KST in which the ICs to be tested are appropriately classified is stored in the tested IC stocker 202. Laminated and held.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the pre-test IC stocker 201 and the tested IC stocker 2 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIGS. 1 and 2, two stockers STK-B are provided in the pre-test stocker 201, and an empty stocker STK-B sent to the unloader unit 400 is provided next to the two stockers STK-B.
E and two stockers STK-1, STK-2,..., STK-
8 are provided so as to be sorted and stored in a maximum of eight categories according to the test results. In other words, apart from good and bad products, among the good products, those with high operating speeds,
They are classified into medium-speed ones, low-speed ones, and failures that require retesting.

Loader section 300 The above-described customer tray KST is a tray transfer arm 2 provided between the IC storage section 200 and the apparatus substrate 105.
05 to the window 306 of the loader unit 300.
It is carried from the bottom of 05. Then, the loader unit 300
In the above, the IC under test loaded on the customer tray KST is once transferred to the preciser 305 by the XY transfer device 304, where the mutual positions of the ICs under test are corrected, and further transferred to the preciser 305. The test tray TS stopped on the loader 300 by using the XY transfer device 304 again for the IC under test.
Transfer to T.

From the customer tray KST to the test tray T
As shown in FIG. 1, as an IC transfer device 304 for transferring the IC under test to the ST, two rails 301 provided on the upper part of the device substrate 105 and the two rails 301
A movable arm 302 capable of reciprocating between the test tray TST and the customer tray KST (this direction is defined as a Y direction), supported by the movable arm 302, and capable of moving in the X direction along the movable arm 302. And a movable head 303.

The movable head 3 of the XY transport device 304
At 03, a suction head (not shown in detail) is mounted downward, and this suction head moves while sucking air to suck the IC under test from the customer tray KST. The IC under test is transferred to the test tray TST. Such a suction head is a movable head 303
For example, about eight ICs can be mounted on the test tray TST at a time.

The test tray TST that chamber section 100 described above is fed into the chamber portion 100 after the IC has been loaded in the loader unit 300, the IC under test is tested while mounted on the test tray TST .

The chamber section 100 includes a test tray TST
Temperature chamber 101 for applying a desired high or low temperature thermal stress to the IC under test loaded in
A test chamber 102 for contacting the IC under test, which has been subjected to thermal stress with the test head, to a test head 104;
It comprises a heat removal tank 103 for removing a given thermal stress from the IC under test tested in the test chamber 102.

In the heat removal tank 103, when a high temperature is applied in the constant temperature bath 101, the IC under test is cooled by blowing air to return to room temperature, and when a low temperature of approximately −30 ° C. is applied in the constant temperature bath 101, Then, the IC under test is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. And
The heat-removed IC under test is carried out to the unloader section 400.

As shown in FIG. 1, a constant temperature bath 101 and a heat removal bath 103 of a chamber 100 are provided with a test chamber 102.
It is arranged so as to project upward. As shown conceptually in FIG. 2, the thermostatic chamber 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 becomes empty. While waiting. Mainly, during this standby, high-temperature or low-temperature thermal stress is applied to the IC under test.

In the test chamber 102, a test head 104 is disposed at the center, a test tray TST is carried on the test head 104, and the input / output terminals HB of the IC under test are connected to the contact pins 51 of the test head 104. The test is performed by making electrical contact. On the other hand, the test tray TST after the test is completed
After the heat is removed at 3 and the temperature of the IC is returned to room temperature, it is discharged to the unloader section 400.

Further, as shown in FIG. 1, an apparatus substrate 105 is inserted in front of the constant temperature bath 101 and the heat removal bath 103.
A test tray transport device 108 is mounted on the device substrate 105. The test tray TST discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 is returned to the constant temperature bath 101 via the unloader unit 400 and the loader unit 300.

FIG. 5 is an exploded perspective view showing the structure of the test tray TST used in this embodiment. The test tray TST includes a plurality of bars 1 on a rectangular frame 12.
3 are provided in parallel and at equal intervals, and a plurality of mounting pieces 14 are formed on both sides of these bars 13 and on sides 12a of the frame 12 facing the bars 13 so as to protrude at equal intervals. An insert storage portion 15 is formed between the bars 13, between the bars 13 and the side 12 a, and the two mounting pieces 14.

Each insert storage section 15 has one
Each of the inserts 16 is housed, and the insert 16 is attached to the two attachment pieces 14 using a fastener 17 in a floating state (a state in which the insert 16 can be finely moved). For this purpose, mounting holes 21 for mounting the mounting pieces 14 are formed at both ends of the insert 16. For example, about 16 × 4 inserts 16 are attached to one test tray TST.

Each of the inserts 16 has the same shape and the same dimensions.
A C storage section 19 is formed, and the IC under test is stored therein. The details will be described later.

Here, the IC under test connected to the test head 104 at one time has 4 rows × 1 as shown in FIG.
If the ICs to be tested are arranged in six columns, for example, ICs to be tested in four rows every four columns are tested simultaneously. That is, 1
In the first test, 16 rows arranged every 4 rows from the first row
The ICs to be tested are connected to the contact pins 51 of the test head 104, and the test is performed. In the second test, the test trays TST are moved by one column, and the ICs to be tested are arranged every four columns from the second column. Is tested in the same manner, and this test is repeated four times to test all the ICs under test (so-called simultaneous measurement of 16 ICs). The result of this test is stored in an address determined by, for example, the identification number given to the test tray TST and the number of the IC under test allocated inside the test tray TST.

A guide hole 191 (a guide according to the present invention) having an opening as shown in FIG. 7 is formed in the IC housing portion 19. The guide hole 191 is a ball grid array, which is an IC under test. It is formed corresponding to the position of the solder ball HB of the mold IC. Even if the size of the outer peripheral surface of the package mold is slightly different, as long as the arrangement matrix of the solder balls HB of the IC under test is the same, the solder balls HB smoothly fit into the guide holes 191 without any obstacle. A small gap S is formed on the bottom surface of the IC housing portion 19 so as to be able to be formed.

Incidentally, the guide hole 191 shown in FIG.
Although the opening is configured as one opening so that only the outermost solder ball HB among the solder balls HB of the BGA type IC fits, the guide of the present invention may take various forms other than this. For example, a number of guide holes are provided on the bottom surface of the IC housing portion 19 so as to fit all the solder balls HB of the BGA type IC so that the contact pins 51 can contact all the solder balls HB from below. It may be a through hole. Also, a guide hole 191 is formed on the bottom surface of the IC housing portion 19, for example, in which only two rows of solder balls HB from the outside of the solder balls HB of the BGA type IC are fitted, and contact pins are provided for the other solder balls HB. An opening may be formed at the center of the bottom surface of the IC housing 19 so that the IC card 51 can come into contact therewith.

In particular, the insert 16 of the present embodiment is the same as that of FIG.
Latch 163, coil spring 164 and pin 16 shown in FIG.
5 is provided. The latch 163 of this latch mechanism has a latch portion 163a formed at one end.
The latch arm 163d is connected to this, and a power point 163c is provided on the latch arm 163d. Also,
A through hole serving as a rotation center 163b is formed in the latch arm portion 163d between the latch portion 163a and the force point 163c, and the pin 165 is inserted into the through hole, so that the latch 163 can rotate on the insert body 161. Supported by

The latch section 163a of the latch 163 is shown in FIG.
As shown in FIG. 9, a position (hereinafter, also referred to as a holding position or a closed position) that covers the upper surface of the IC mounted on the IC storage unit 19 to prevent the IC from jumping out, and from the upper surface of the IC as shown in FIG. The IC can be moved between a position where the IC can be retracted and the IC can be put in and out (hereinafter, also referred to as a retracted position or an open position).

On the other hand, the power point 163c of the latch arm portion 163d contacts a lever plate 162 described later,
As the lever plate 162 moves up and down, an external force is input from the force point 163c, and the
Opens.

In the latch mechanism of this embodiment, FIG.
In the side view of the insert 16 shown in FIG.
2a and the rotation center 16 of the latch arm 163d.
3b are disposed on substantially the same vertical line. Thus, even when the lever plate 162 moves up and down by about 1.5 mm, the opening and closing movement amount D of the tip of the latch portion 163a shown in FIG. 8 increases. In the latch mechanism of the present embodiment, the latch arm 163d is provided at a position offset from the latch 163a, that is, the IC housing 19, in a plan view of the insert 16 shown in FIG. Thereby, the IC can be put in and out of the IC storage section 19 without any interference. The coil spring 164 interposed between the other end of the latch arm portion 163d and the insert body 161 is provided when the external force from the lever plate 162 is not acting.
Is maintained at the holding position shown in FIG.
During the transportation of the test tray TST or the like, the IC is held by the latch portion 163a, and the IC is prevented from jumping out.

The lever plate 162 provided on the insert 16 is urged to a raised position shown in FIG. 8 by a coil spring 166 provided between the insert body 161, and the protrusion 16 formed on the lever plate 162.
2a and a recess 161 formed in the insert body 161
The upper limit of the ascending position is regulated by the engagement of the a.

FIG. 10 is a sectional view showing the structure of the pusher 30, the insert 16 (on the test tray TST side), the socket guide 40 and the socket 50 having the contact pins 51 in the test head 104 of the same electronic component testing apparatus. Is provided above the test head 104 and is moved up and down in the Z-axis direction by a Z-axis driving device (for example, a fluid pressure cylinder) not shown. The pushers 30 are attached to the Z-axis driving device in accordance with the intervals of the ICs to be tested at one time (in the test tray, four rows every four columns, a total of 16 pushers).

A pusher 31 for pressing an IC under test is formed at the center of the pusher 30, and guide pins 3 inserted into guide holes 20 of the insert 16 and a guide bush 41 of the socket guide 40 described later on both sides thereof.
2 are provided. Further, the pressing element 31 and the guide pin 3
2, a stopper guide 33 for regulating the lower limit when the pusher 30 is lowered by the Z-axis driving means.
When the stopper guide 33 comes into contact with the stopper surface 42 (only one side is shown) of the socket guide 40, the lower limit position of the pusher that presses with an appropriate pressure that does not destroy the IC under test is determined. You.

As described with reference to FIG. 5, the insert 16 holds the fastener 1 with respect to the test tray TST.
The guide holes 20 into which the guide pins 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are respectively inserted from above and below are formed on both sides thereof. When the pusher 30 is lowered, the upper half of the guide hole 20 on the left side of the figure is a small-diameter hole into which the guide pin 32 of the pusher 30 is inserted and positioning is performed, and the lower half is the socket guide 40.
The guide bush 41 is a large-diameter hole into which positioning is performed. Incidentally, the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are in a loosely fitted state.

On the other hand, on both sides of the socket guide 40 fixed to the test head 104, two guide pins 32 of the pusher 30 are inserted, and these two guide pins 3
A guide bush 41 for positioning with the insert 16 is provided. The guide bush 41 on the left side of the guide bush 41 also performs positioning with the insert 16.

A socket 50 having a plurality of contact pins 51 is fixed below the socket guide 40, and the contact pins 51 are urged upward by a spring (not shown). Therefore, even if the IC under test is pressed, the contact pins 51 are not
The contact pins 51 can contact all the ball terminals HB even if the IC under test is slightly inclined and pressed down while retreating to the upper surface of zero.

[0065] Also in the unloader section 400 unloader section 400, X-Y transport device having the same structure as X-Y conveyor 304 provided in the loader section 300 40
4, 404 are provided, and the XY transfer devices 404, 4 are provided.
04, the tested ICs are transferred from the test tray TST carried out to the unloader section 400 to the customer tray KS.
Transferred to T.

As shown in FIG. 1, the unloader section 40
The pair of windows 406, 406 in which the customer tray KST carried to the unloader unit 400 faces the upper surface of the device substrate 105, is opened on the device substrate 105 of the No. 0.

Although not shown, a lifting table for raising and lowering the customer tray KST is provided below each window 406, and the tested ICs to be tested are reloaded here. The fully loaded customer tray KST is placed and lowered, and the full tray is transferred to the tray transfer arm 205.

In the electronic component test apparatus 1 of this embodiment, although the maximum number of sortable categories is eight, only four customer trays KST can be arranged in the window 406 of the unloader unit 400. Can not.
Therefore, the categories that can be sorted in real time are 4
Restricted to classification. Generally, a good product is a fast response element,
It is classified into three categories of medium-speed response element and low-speed response element, and four categories are added with defective products. However, for example, such as those requiring retest,
There may be categories that do not belong to these categories.

As described above, the window 4 of the unloader section 400
When the IC under test is classified into a category other than the category assigned to the four customer trays KST arranged at 06, the unloader unit 400 outputs one IC.
Return the customer tray KST to the IC storage unit 200,
Instead, the customer tray KST for storing the IC under test of the newly generated category is provided in the unloader section 400.
, And store the IC under test. However,
If the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time.
There is a problem that the throughput is reduced. For this reason, in the electronic component test apparatus 1 of the present embodiment, the buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and the IC under test of the category that rarely occurs in the buffer unit 405 is provided. Is to be kept temporarily.

For example, 20 to 30
In addition to providing a capacity capable of storing about the number of ICs to be tested,
A memory for storing each category of C is provided, and the category and position of the IC under test temporarily stored in the buffer unit 405 are stored for each IC under test. Then, during the sorting operation or when the buffer unit 405 becomes full, the customer tray KST of the category to which the IC under test belonging to the buffer unit 405 belongs is stored in the IC storage unit 2.
00 and stored in the customer tray KST. At this time, the IC under test temporarily deposited in the buffer unit 405 may cover a plurality of categories. In such a case, when the customer tray KST is called, a plurality of customer trays KST are simultaneously loaded into the unloader unit 400.
Can be called to the window section 406 of FIG.

Next, the operation of the insert 16 will be described mainly with reference to FIGS. For example, a case where the IC mounted on the test tray TST is taken out using the XY transfer device 304 will be described as an example. FIG. 8 shows a state in which the IC under test is mounted on the test tray TST. In this state, when the suction head of the XY transfer device 304 approaches each insert 16, the lever plate 162 is pushed down by a part of the suction head. Can be Along with this, the power point 163c of the latch arm 163d is also pushed down, and the latch arm 163d rotates clockwise about the rotation center 163b in the figure. In this example, it is about 20 °.

FIG. 9 shows this state.
a moves from the upper surface of the IC to a completely retracted position, whereby the IC can be held by the suction head. Note that FIG. 8 shows an IC having a large device size and an IC having a small device size. As shown in FIG. 8, as long as the arrangement matrix of the solder balls HB is the same for each IC, the size of the package is small. Even if they are different, they can be completely held by the latch section 163a of this example.

FIGS. 11 and 12 show a modification of the first embodiment. In the insert 16 shown in FIG. 11, the elastic body interposed between the latch arm portion 163d and the insert main body 161 is used as a winding spring 164, and this is used as a rotation center 163.
b. In the insert shown in FIG. 12, the lever plate 162 is omitted, and the power point 163c of the latch arm 163d is directly pushed down. The other configurations are the same as those in FIG. 6 described above, and thus the same reference numerals are given and the detailed description is omitted.

[Second Embodiment] According to the insert 16 of the first embodiment described above, an IC having a large device size and an IC having a small device size can be mounted on the same insert 16 as shown in FIG. In addition, the clearance between the tip of the latch portion 163a and the upper surface of the IC can be made as small as possible.

However, in the insert of the first embodiment described above, the package mold has a thick IC and a thin IC.
C on the same insert, the thick I
When C is placed, the tip of the latch portion 163a may interfere with the IC. However, if the clearance between the latch portion and the upper surface of the IC when a thick IC is mounted is used as a reference, interference can be avoided, but when the thin IC is mounted, the clearance becomes large and the solder ball HB is moved from the guide hole 191. It may come off.

In the second embodiment described below, ICs having mainly different thicknesses can be mounted on the same insert. As shown in FIG. 13, in this embodiment, a guide core 167 is provided with a pin 1 at the center of the insert 16.
70 is attached to the insert main body 161.
The pin 170 has both ends attached to the insert body 161 and contacts the flange 1671 of the guide core 167 as shown in the sectional view of FIG.
The guide core 167 is provided in a three-dimensionally finely movable state with respect to the insert body 161 in a so-called floating state.

The guide core 167 is formed with a guide hole 171 (a guide according to the present invention) formed of an opening, and this guide hole 171 is provided for a solder ball HB of a ball grid array type IC which is an IC under test. It is formed corresponding to the position. Note that even if the size of the outer peripheral surface of the package mold is slightly different, the solder ball HB
As long as the arrangement matrix of the solder balls HB
The guide core 167 has a relatively wide bottom surface so that the guide core 167 can be smoothly fitted into the guide hole 171 without any obstacle.

The guide hole 171 shown in FIG.
The opening is configured as one opening so that only the outermost solder ball HB among the solder balls HB of the BGA type IC is fitted. However, the guide of the present invention is the same as the guide hole 191 of the first embodiment described above. Similarly to the above, various other forms are conceivable.

The guide core 167 has the X
Two guide holes 1672 into which the guide pins of the suction head of the Y transport device 304 fit are provided. When the guide pins of the suction head fit into the guide holes 1672 of the guide core 167, the insert body 161 and the test tray TS
Regardless of the position error of T itself, the positioning between the suction head and the guide core 167 is performed directly.

The guide hole 1 of the guide core 167
A guide pin (not shown) of the socket can be fitted into the 672 from below.

Since the latch mechanism 163 has the same configuration as that of the first embodiment, the same reference numerals are given and the detailed description is omitted. In the present embodiment, two lever plates 162 are further provided. Pin 169 is attached,
As shown in FIG. 14, a guide core 167 is
Is mounted. Further, a coil spring 168 for pressing the guide core 167 downward in FIG. 14 is interposed between the guide core 167 and the insert main body 161. The pins 169, 170 and the coil spring 168 cause the lever plate 1 to move.
The relationship between the up and down movement of 62, the up and down movement of the guide core 167, and the opening and closing movement of the latch mechanism 163 is as follows.

First, when no external force is acting on the insert 16, the lever plate 162 is raised with respect to the insert body 161 as shown in FIG. 14A, whereby the latch mechanism 163 is moved to the closed position. , And the guide core 167 is set to the raised position by the pin 169.
At this time, the clearance H1 between the latch portion 163a and the bottom surface of the guide core 167 becomes the smallest. For example, by setting the thickness of the thinnest IC to H1, the latch portion 163a can surely be formed even with a thicker IC. The closed state can be maintained, and the displacement of the IC can be prevented.

FIGS. 8B to 8D show a state where the lever plate 162 is gradually lowered from the state shown in FIG. First, a clearance of H2 is set between the lever plate 162 and the power point 163c of the latch arm 163d.
The latch mechanism 163 does not operate until 2 drops by H2. On the other hand, the guide core 167 has the pin 1
69, the lever plate 16
When 2 drops by H2, the guide core 167 also drops by H2. The state where the lever plate 162 is lowered by H2 is shown in FIG. In this state, the clearance between the latch portion 163a and the bottom surface of the guide core 167 changes from H1 to H1 + H2.

When the lever plate 162 is further lowered, the power point 163c of the latch arm is pushed down, so that the latch 163a starts to open. Also, guide core 1
67 also continues to descend to a position where pin 169 is at the same height as pin 170. This state is shown in FIG.

As shown in FIG. 8D, when the lever plate 162 is lowered to the lower limit position, the latch portion 163a is completely opened and the IC can be taken out. The guide core 167 is supported by the pin 170 and does not descend any further.

The operation when the IC is mounted is reversed. As described above, according to the insert 16 of the present embodiment, when the IC is taken out, the guide core 167 descends to form a clearance between the IC and the latch portion 163a, and then the latch portion 163a starts to open. And conversely I
When mounting C, the guide core 167 starts to rise after the latch portion 163a closes and moves to a position covering the upper surface of the IC, so that the latch portion 163a does not interfere from the side of the IC, and The same insert 16 can be used for ICs of different sizes.

The specific structure of the guide core 161 according to the present invention is not limited to the one shown in FIG. 13 at all, and various other forms are conceivable. For example, in another embodiment shown in FIG. 15, a pin 169 is press-fitted into a guide core 167, and a long hole 162b is formed in a lever plate 162.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

[0089]

As described above, according to the present invention, even if the rotation angle of the latch arm is small, the amount of opening and closing of the tip of the latch is geometrically large, so that the size of the package mold is different. Electronic components can be mounted on the same insert.

Further, since the guide core is separated from the insert body when opening and closing the latch portion, electronic components having different package mold thicknesses can be mounted on the same insert.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus of the present invention.

FIG. 2 is a flowchart of a tray showing a method of handling an electronic component under test in the electronic component test apparatus of FIG. 1;

FIG. 3 is a perspective view showing a structure of an IC stocker of the electronic component test apparatus of FIG.

FIG. 4 is a perspective view showing a customer tray used in the electronic component test apparatus of FIG. 1;

FIG. 5 is a partially exploded perspective view showing a test tray used in the electronic component test apparatus of FIG. 1;

FIG. 6 is an exploded perspective view showing an embodiment of the insert of the present invention.

FIG. 7 is a plan view of the insert shown in FIG. 6;

FIG. 8 is a sectional view taken along the line VIII-VIII in FIG. 7 (latch closed).
It is.

9 is a sectional view taken along line VIII-VIII in FIG. 7 (latch open).
It is.

FIG. 10 is a cross-sectional view showing a structure of a pusher, an insert, a socket guide, and a contact pin in the test head of FIG.

FIG. 11 is an exploded perspective view showing another embodiment of the insert of the present invention.

FIG. 12 is an exploded perspective view showing still another embodiment of the insert of the present invention.

FIG. 13 is an exploded perspective view showing still another embodiment of the insert of the present invention.

FIG. 14 is a sectional view taken along the line XIV-XIV in FIG.

FIG. 15 is an exploded perspective view showing still another embodiment of the insert of the present invention.

FIG. 16 is a sectional view showing a conventional insert.

FIG. 17 is a side view showing a general ball grid array type IC.

[Explanation of symbols]

 IC: IC, IC under test (electronic device under test) HB: solder ball (terminal of electronic device under test) 1: electronic device testing apparatus 100: chamber section 104: test head 51: contact pin (contact section) 300: loader Section 304 XY transfer device KST Customer tray TST Test tray (tray) 16 Insert 161 Insert body 162 Lever plate 163 Latch mechanism 167 Guide core

Claims (12)

[Claims] 1. An insert movably provided on a tray on which an electronic component under test is mounted and routed in an electronic component test apparatus, the insert being held over an upper surface of the electronic component under test stored in the insert. And a latch arm that rotatably supports the latch unit to the insert body, the latch unit moving between a position to be retracted and a position retracted from the upper surface of the electronic component under test, and a side view of the insert. An insert wherein a tip of the latch portion and a rotation center of the latch arm portion are arranged on substantially the same vertical line, and the latch portion and the rotation center of the latch arm portion are offset in a plan view of the insert. 2. The insert according to claim 1, further comprising an elastic body that urges the latch arm in a direction in which the latch portion moves to the holding position. 3. The power point of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, and an external force is applied to the power point via a lever plate provided on the insert body. Claim 1 or 2 which works
Insert as described. 4. The power point of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, and an external force acts directly on the power point. insert. 5. An insert movably mounted on a tray on which an electronic component to be tested is mounted and routed in an electronic component test apparatus, wherein the insert is provided movably with respect to the insert body. A latching part that moves between a position where the guide core is mounted on the upper surface of the electronic component under test accommodated in the insert and a position retracted from the upper surface of the electronic device under test, and the latch. An insert, comprising: a latch mechanism having a latch arm portion rotatably supporting the portion on the insert body; and an interlocking mechanism for interlocking movement of the guide core with respect to the insert body and movement of the latch portion. 6. The insert according to claim 5, wherein said interlocking mechanism moves said latch core to a retracted position after separating said guide core from said insert body. 7. The insert according to claim 5, wherein the interlocking mechanism causes the guide core to approach the insert body after moving the latch portion to the holding position. 8. The insert according to claim 1, wherein the terminals of the electronic component under test are ball terminals. 9. The insert according to claim 1, further comprising a guide for contacting and positioning a terminal of said electronic component under test. 10. The insert according to claim 9, wherein said guide is a hole into which said ball-shaped terminal is fitted. 11. A tray for loading an electronic component under test into a contact portion of a test head of an electronic component testing apparatus and unloading the electronic component under test, the tray having an insert according to any one of claims 1 to 10. 12. An electronic component tester having a tray according to claim 11, wherein the test is performed by pressing a terminal of the electronic component under test against a contact portion of a test head.