KR102599969B1 - Test socket - Google Patents

Abstract

The test socket according to the present invention is a test socket that performs an electrical test of the device under test by connecting the terminal of the device under test to the pad of a tester that generates a test signal, including a first contact pin contacting the pad, and a terminal. An inspection probe including a second contact pin and a body in contact with a plurality of signal probes, a power probe, and a ground probe, and a plurality of socket holes into which one end of the inspection probe is inserted. A socket housing made of metal, a metal support plate disposed at the bottom of the socket housing to support the inspection probe, and having a plurality of support holes into which the other end of the inspection probe is inserted, and a signal probe or power probe. It includes an insulating layer formed on the inner surface of the socket hole and the support hole to be inserted, and the signal probe or power probe is disposed so that a space is formed between the insulating layer and the insulating cap interposed, and the grounding probe is located between the socket hole and the support hole. It is placed to contact the inner self. The insulating cap has a shape with two cut surfaces and two side surfaces where both sides of the cylinder are cut. It has a pinhole in the center through which the first or second contact pin passes vertically, and a protrusion is formed on the upper side of the side. It is coupled to the support hole or socket hole using an interference fit method.

Description

test socket{TEST SOCKET}

The present invention relates to a test socket, and more specifically to a test socket equipped with an insulating cap suitable for electrical testing of radio frequency (RF) devices.

The device being inspected (e.g., semiconductor package) is formed by high-density integration of fine electronic circuits, and during the manufacturing process, each electronic circuit undergoes a test process to determine whether it is normal. The test process is a process that tests whether the device under test operates normally and selects good and defective products.

To test a device under test, a test device is used to electrically connect a terminal of the device under test and a pad of a tester that applies a test signal. Test devices have various structures depending on the type of device being tested. The test device and the device being inspected are not directly connected to each other, but indirectly connected through a test socket.

Among conventional semiconductor packages, in the case of a Ball Grid Array (BGA) package that uses solder balls as external connection terminals, the test socket has a structure in which socket pins are built into a socket body made of plastic, and is manufactured through molding and machining. It is manufactured using a method such as As a socket pin, a pogo pin with its own elasticity is used.

Recently, the development of RF test sockets capable of signal shielding and impedance control for testing the electrical characteristics of RF devices operating at high speeds of tens of GHz or higher has been actively developed.

When inspecting radio frequency (RF) devices, the noise component generated during testing deteriorates the high-frequency signal characteristics, so a test socket with a shielding structure that blocks the noise component generated during testing is required. Existing test sockets perfectly prevent interference between signals. There is a problem that noise components are generated and signal characteristics are deteriorated because it cannot be prevented.

Additionally, impedance matching is important in radio frequency (RF) devices that operate at high speeds. Impedance matching reduces power loss, thereby maximizing power transmission. However, if impedance matching is not achieved, there is a problem in that signal power is reflected and loss occurs.

To solve this problem, conventional test sockets consider minimizing current loss by keeping the signal path as short as possible, but due to the basic shape and structure of the self-elastic pogo pin used as the socket pin, the length of the socket pin There is a limit to reducing . In other words, if the length of the inspection pin is shortened, the length of the spring is also shortened. The shortened spring length makes it difficult to secure a stable contact load and contact stroke, and if the length of the spring is lengthened to ensure a stable contact stroke, pogo inevitably occurs. ) As the length of the pin increases, there is a limit to minimizing current loss by reducing the length of the socket pin.

In addition, a variety of technologies are being developed for coaxial test sockets that complement the weaknesses of existing plastic test sockets. Conventional technologies have various structures for signal shielding or impedance matching. However, a metal housing is applied to shield the signal, and it is manufactured using various dielectrics for impedance matching, but many processes are required to manufacture the metal housing for shielding, and a complicated process for insulating the signal probe and the power probe is required. There were problems with rising costs due to the processing process and a lot of time being spent on production.

In addition, various dielectrics have been used for impedance matching, but when a material with a high dielectric constant is applied, there is a problem in that the outer diameter of the signal probe, etc. must be made small, and when air with a low dielectric constant is used as a dielectric, it is necessary to make the outer diameter of the signal probe, etc. Because the section was long, there was a problem that the section using air with a low dielectric constant became smaller.

Public Patent Publication No. 2005-0087300 (2005. 08. 31)

The present invention was developed in consideration of the above-mentioned points, and improves the shielding of a high-frequency (RF) test socket and simplifies the test socket manufacturing process and structure to provide a high-frequency (RF) test socket with a low manufacturing cost. The purpose is to provide

The test socket according to the present invention for solving the above-mentioned object is a test socket that performs an electrical test of the device under test by connecting the terminal of the device under test to the pad of a tester that generates a test signal, An inspection probe including a first contact pin in contact with a pad, a second contact pin in contact with the terminal, and a body, and including a plurality of signal probes, a power probe, and a ground probe, the A socket made of metal having a plurality of socket holes having a second through hole in which the upper part of the body of the inspection probe is accommodated and a second mounting hole with a smaller diameter than the second through hole through which the second contact pin penetrates. a housing, a first through hole disposed in a lower portion of the socket housing to support the inspection probe, a first through hole in which a lower part of the body of the inspection probe is accommodated, and a first through hole through which the first contact pin passes. It includes a support plate made of metal on which a plurality of support holes having a first mounting hole of a smaller diameter are formed, an insulating layer formed on an inner surface of the socket hole and the support hole into which the signal probe or the power probe is inserted, and the signal probe or power probe is inserted. The probe or power probe is disposed so that a space is formed between the insulating layer and the insulating cap, and the grounding probe is disposed to contact the inner surfaces of the socket hole and the support hole, and the insulating cap is disposed as a cylinder. It has a shape with two cut surfaces and two side surfaces, and has a pinhole in the center through which the first or second contact pin penetrates vertically, and a protrusion is formed on the upper side of the side surface to penetrate the first contact pin. It is coupled to the hole or the second through hole in an interference fit manner.

A groove-shaped absorption portion may be formed around the protrusion in the test socket.

In the test socket, the metal material is aluminum metal, and the insulating layer may be formed by an anodizing process.

The space in the test socket may be filled with air.

In the test socket, the insulating cap may be coupled to a second through-hole portion adjacent to the second mounting hole of the socket housing.

An insulating support cap may be coupled to the lower portion of the second through hole of the socket housing to which the insulating cap is coupled in an interference fit manner.

The insulating support cap may have the same external shape as the insulating cap.

In the test socket, the insulating cap may be coupled to a first through-hole portion adjacent to the first mounting hole of the support plate.

In the test socket, the insulating cap may be respectively coupled to a second through-hole portion adjacent to the second mounting hole of the socket housing and a first through-hole portion adjacent to the first mounting hole of the support plate.

In the test socket, the ground probe may have an outer diameter larger than that of the signal probe or the power probe.

The test socket 100 of the present invention has a coaxial structure, and air with a low dielectric constant is used as a dielectric in the space 160, thereby providing controlled impedance to the electrical signal passing between the device under test and the tester, resulting in signal transmission loss. It enables stable testing without testing.

In addition, since air with a low dielectric constant is used as a dielectric, the outer diameter of the signal probe 1401 or the power probe 1402 can be sufficiently large, so there is no problem of increased cost or process difficulty due to manufacturing a fine pitch probe.

In addition, since the signal probe 1401 or the power probe 1402 is supported by the insulating cap 150, the inner surface of the support hole 111 of the support plate 110 and the socket hole 121 of the socket housing 120 Even if the insulating layer formed on is damaged, an electrical short can be prevented from occurring.

In addition, the insulating cap 150 can be simply joined using the pressure fitting method using the protrusions of the insulating cap 150, and the insulating cap 150 can be easily taken out using the two cutting surfaces, making assembly simple and absorbing the pressed portion of the protrusion. There is an advantage that the socket housing or support plate is not deformed even by interference fitting due to the absorbent portion. In addition, if the inspection probe is damaged or needs to be replaced because its lifespan has expired, it can be easily replaced by simply removing the inspection probe from the insulating cap 150, so there is an advantage in that repairs can be performed with minimal replacement cost.

Therefore, the test socket according to the present invention has a simple structure, a simplified manufacturing process, can be manufactured at low cost, and has the characteristics of minimizing signal leakage.

1 is a perspective view of a test socket according to an embodiment of the present invention.
Figure 2 is an exploded perspective view of the test socket of Figure 1.
Figure 3 is an enlarged view of portion "A" in Figure 2.
Figure 4 is a cross-sectional view showing an inspection probe provided in a test socket according to an embodiment of the present invention.
Figure 5 is a cross-sectional view showing the support plate and socket housing of a test socket according to an embodiment of the present invention.
Figure 6 is a perspective view showing an insulating cap of a test socket according to an embodiment of the present invention.
Figure 7 is a cross-sectional view of a test socket in an assembled state according to an embodiment of the present invention.
Figure 8 is a cross-sectional view illustrating the assembly process of a test socket according to an embodiment of the present invention.
Figure 9 is a perspective view of the test socket in an assembled state according to an embodiment of the present invention.
Figure 10 is a perspective view showing an insulating support cap of a test socket according to an embodiment of the present invention.
Figure 11 is a cross-sectional view illustrating the assembly process of a test socket according to another embodiment of the present invention.
Figures 12 and 13 are cross-sectional views illustrating the state in which a test socket operates in a test.

Hereinafter, the test socket according to the present invention will be described in detail with reference to the drawings.

Figure 1 is a perspective view of a test socket of the present invention, Figure 2 is an exploded perspective view of the test socket of Figure 1, and Figure 3 is an enlarged view of portion "A" in Figure 2.

As shown in the drawing, the test socket 100 according to an embodiment of the present invention is used to perform an electrical test of the device under test by connecting the terminal of the device under test to the pad of a tester that generates a test signal, It includes a support plate 110, a socket housing 120, a frame 130, and an inspection probe 140 and an insulating cap 150 disposed between the support plate 110 and the socket housing 120.

The socket housing 120 may be screwed to the frame 130, and the support plate 110 may be screwed to the socket housing 120.

3 and 4 show the inspection probe 140. As shown in FIG. 3, the inspection probe 140 includes a plurality of signal probes 1401, a power probe 1402 that supplies power for circuit operation, and a ground probe 1403 that facilitates the flow of signals. ) and consists of. In drawings, each probe is sometimes indicated by S for signal probes, P for power probes, and G for ground probes instead of the reference symbols. A part of the inspection probe 140 may be the power probe 1402 or the ground probe 1403, and the remaining part may be composed of the signal probe 1401, or all of the inspection probe 140 may be composed of the signal probe 1401.

The signal probe 1401 may have an outer diameter smaller than that of the ground probe 1403 for impedance matching, and the power probe 1402 may have a smaller outer diameter than the ground probe 1403 to prevent electrical short circuits.

As shown in FIG. 4, the inspection probe 140 may include a body 141, a first contact pin 142, and a second contact pin 143. The body 141 may have a tube shape, and the first contact pin 142 and the second contact pin 143 have a smaller diameter than the body 141, so a step 145 is formed between the contact pins and the body. .

At least a portion of the first contact pin 142 and the second contact pin 143 may be disposed within the body 141, and the first contact pin 142 and the second contact pin 143 may be disposed within the body 141. It can be connected to the disposed spring 144 and formed to be able to slide with respect to the body 141. Of course, it is also possible to combine the second contact pin 143 with the body 141 so that the second contact pin 143 and the body 141 slide together.

12 and 13, the support plate 110 and the socket housing 120 are positioned so that the first contact pin 142 is electrically connected to the pad 21 of the tester 20, and the second contact pin 142 is electrically connected to the pad 21 of the tester 20. The pin 143 may be positioned to contact the terminal 11 of the device under test 10.

The inspection probe 140 may be made of a conductive material such as a gold-coated copper alloy so that an electrical connection is formed between the first contact pin 142, the second contact pin 143, and the body 141.

Figure 5 is a cross-sectional view showing the support plate 110 and the socket housing 120. As shown in FIG. 5, the support plate 110 supports the inspection probe 140, and a plurality of support holes 111 are formed (three support holes are shown as an example in FIG. 5). ), the lower portion of the inspection probe 140 is mounted in the support hole 111. The support hole 111 has a first through hole 112 of a certain diameter in which a lower portion of the body of the inspection probe is accommodated, and a first through hole 112 between the lower part of the first through hole 112 and the lower end of the support plate 110. It is formed with a smaller diameter than the through hole 112 and consists of a first mounting hole 113 through which the first contact pin 142 of the inspection probe 140 passes. Accordingly, a first stopping protrusion 114 is formed between the first through hole 112 and the first mounting hole 113.

The socket housing 120 is a portion on which the upper part of the inspection probe 140 is mounted, and has a plurality of socket holes 121 formed therein. The socket hole 121 has a second through hole 122 of a certain diameter in which the upper part of the body of the inspection probe is accommodated, and a second through hole 122 is provided between the upper part of the second through hole 122 and the upper end of the socket housing 120. It is formed with a smaller diameter than the through hole 122 and consists of a second mounting hole 123 through which the second contact pin 143 of the inspection probe 140 passes. Accordingly, a second stopping protrusion 124 is formed between the second through hole 122 and the second mounting hole 123.

A tapered guide hole 125 that widens in the direction of the terminal may be formed on the second mounting hole 123 to guide the terminal of the device being inspected.

The support plate 110 and the socket housing 120 may be coupled with screws, and when coupled, the first through hole 112 of the support plate 110 and the second through hole 122 of the socket housing 120 are connected. to accommodate the inspection probe 140, the first contact pin 142 protrudes through the first mounting hole 113, and the second contact pin 143 protrudes through the second mounting hole 123. It has a structure that does.

The support plate 110 and the socket housing 120 are made of a metal material such as aluminum, and an insulating layer is formed on the inner surface of the support hole 111 of the support plate 110 and the socket hole 121 of the socket housing 120. can be formed. When the support plate 110 and the socket housing 120 are made of aluminum metal, the insulating layer can be formed by an anodizing process that forms an oxide layer of alumina oxide using an electrochemical method on the surface of the aluminum metal.

However, an insulating layer is not formed on the inner surface of the support hole 111 of the support plate 110 where the grounding probe 1403 is mounted and the socket hole 121 of the socket housing 120, and the grounding probe 1403 is The grounding effect can be improved by directly contacting the metal support plate 110 and the socket housing 120.

Figure 6 shows the insulating cap 150. As shown in FIG. 6, the insulating cap 150 is used to form a coaxial structure by arranging the signal probe 1401 or the power probe 1402 to be spaced apart from the support plate 110 and the socket housing 120. will be.

The insulating cap 150 is made of an elastic insulating material and has an external shape having two opposing cut surfaces 151 with both sides cut in a cylindrical shape and two opposing side surfaces 152 that are not cut. have A pinhole 153 is formed in the center through which the first contact pin 142 or the second contact pin 143 of the signal probe 1401 or power probe 1402 can penetrate vertically, before being cut. The diameter of the cylinder is the same as or slightly smaller than the diameter of the first through hole 112 or the second through hole 122. Accordingly, the two side surfaces 152 of the insulating cap 150 have the outer shape of a cylinder and thus have an outer diameter that can be tightly or slightly loosely fitted into the first through hole 112 or the second through hole 122.

A plurality of protrusions 154 are formed symmetrically on the upper sides of the two side surfaces 152 of the insulating cap 150. Of course, it can also be formed symmetrically on two sides in such a way that only one protrusion is formed on each side. Since the protrusion 154 is formed on the side of the insulating cap 150, the outer diameter of the insulating cap 150 on the upper side 152 where the protrusion 154 is formed is the first through hole 112 or the second through hole 122. It is formed slightly larger than the diameter of. Accordingly, the insulating cap 150 made of an elastic insulating material may be assembled into the first through hole 112 or the second through hole 122 in an interference fit manner.

In addition, when the protrusion 154 of the insulating cap 150 is assembled to the first through hole 112 or the second through hole 122 in an interference fit manner, the protrusion 154 is attached to the support plate 110 and the socket housing 120. ) can be formed around where the protrusion 154 is formed.

The absorbing portion 155 is formed in a groove shape around the protrusion 154 so that the pressed protruding portion is absorbed into the groove portion to prevent deformation of the support plate 110 or the socket housing 120. It plays a role in preventing

In addition, the two cut surfaces of the insulating cap 150 are formed in a state that does not contact the first through hole 112 or the second through hole 122, so that the two cut surfaces of the insulating cap 150 are not in contact with the first through hole 112 or the second through hole 122. Since a gap is formed between the insulating caps 150, the insulating cap 150 can be more easily inserted into the first through hole 112 or the second through hole 122, and also, if the insulating cap 150 needs to be replaced, In this case, insert a tool such as tweezers into the space above to easily remove it.

The insulating cap 150 is connected to the step 145 of the signal probe 1401 and the power probe 1402 and the first locking step 114 or the second locking step 124 of the support plate 110 or the socket housing 120. ) It is better to have a height equal to or smaller than the gap between them.

As shown in FIG. 7, the insulating cap 150 is located on the upper part of the second through hole 122 where the signal probe (1401, S) and the power probe (1402, P) among the inspection probes are disposed, that is, the second 2 It is fastened to a portion adjacent to the mounting hole 123 so that the signal probe 1401 and the power probe 1402 are disposed spaced apart from the support plate 110 and the socket housing 120, and the first through hole 112 ) and serves as a guide to align vertically within the second through hole 122.

A space 160 is formed between the signal probe 1401 or the power probe 1402, the support plate 110, and the socket housing 120 by the insulating cap 150. The space 160 is filled with air with a dielectric constant of 1.

A test socket having a signal probe 1401 or a power probe 1402 having a space 160 formed by a metal support plate 110, a socket housing 120, and an insulating cap 150 has a coaxial structure. This has the advantage of providing a controlled impedance to the electrical signal passing between the device under test and the tester. In other words, the signal probe 1401 plays the role of transmitting a signal transmitted from an external high-frequency power source to the device being inspected. Since the signal probe 1401 is placed adjacent to each other at a fine pitch, the neighboring signal probe 1401 is an antenna that generates electromagnetic waves. Signal interference may occur by functioning as an air-filled space 160 functions to block or suppress such signal interference, so impedance can be controlled and high-frequency characteristics can be improved.

In addition, the insulating cap 150 is connected to the step 145 of the signal probe 1401 and the power probe 1402 and the first locking step 114 or the second locking step of the support plate 110 or the socket housing 120 ( 124), sufficient space is secured to use air with a low dielectric constant, so the outer diameter of the signal probe 1401 or the power probe 1402 can be sufficiently large, preventing an increase in cost due to manufacturing a fine pitch probe. and the difficulty of the process is significantly improved.

In addition, since the signal probe 1401 or the power probe 1402 is supported by the insulating cap 150, the inner surface of the support hole 111 of the support plate 110 and the socket hole 121 of the socket housing 120 Even if the insulating layer formed on is damaged, an electrical short can be prevented from occurring.

In addition, the insulating cap 150 can be simply joined using the pressure fitting method using the protrusions of the insulating cap 150, and the insulating cap 150 can be easily taken out using the two cutting surfaces, making assembly simple and absorbing the pressed portion of the protrusion. There is an advantage that the socket housing or support plate is not deformed even by interference fitting due to the absorbent portion. In addition, if the inspection probe is damaged or needs to be replaced because its lifespan has expired, it can be easily replaced by simply removing the inspection probe from the insulating cap 150, so there is an advantage in that repairs can be performed with minimal replacement cost.

As shown in FIG. 8, the signal probe 1401 or power probe 1402 equipped with an insulating cap according to the present invention can be assembled as follows.

According to one embodiment of the present invention, the insulating cap 150 is connected to the second mounting hole 123 of the socket housing 120 where the second contact pin 143 of the signal probe 1401 or the power probe 1402 is located. It may be coupled to a portion of the second through hole 122 adjacent to . Figure 8 exemplarily shows this case, and Figure 9 is a perspective view of the test socket in an assembled state.

Figure 8(a) is a cross-sectional view showing each element separated before assembly, and Figure 8(b) is a cross-sectional view showing each element turned over for assembly. As shown in FIG. 8(b), the top of the socket housing 120 (the part where the second mounting hole 123 is formed) is turned over and placed on the floor, and the second penetration of the socket housing 120 is performed. Insert the insulating cap 150 into the hole 122 in an interference fit manner, and connect the second contact pin 143 of the signal probe 1401 or the power probe 1402 to the insulating cap 150 as shown in FIG. 8(c). When mounted by inserting into the pinhole 153, the insulating cap 150 is fixed between the second locking step 124 and the step 145 of the signal probe 1401 or the power probe 1402. At this time, the grounding probe 1403 is also mounted in the socket hole 121.

And with the top of the support plate 110 (the part where the first through hole 112 is formed) turned over to face the floor, a signal probe 1401 or a power probe ( 1402) can be assembled by inserting the other end (see FIG. 8(d)) and connecting the socket housing 120 and the support plate 110 with screws.

In addition, instead of first inserting the insulating cap 150 into the second through hole 122 of the socket housing 120 by force fitting, the second contact pin 143 of the signal probe 1401 or the power probe 1402 is used. Insert into the pinhole 153 of the insulating cap 150 and connect the signal probe 1401 or power probe 1402 to which the insulating cap 150 is coupled through the second through hole 122 of the socket housing 120. They can also be combined by inserting them. The completed test socket assembled as above is shown in Figures 7 and 9.

However, when assembling the signal probe 1401 or power probe 1402 and the ground probe 1403 equipped with the insulating cap 150 in the socket housing 120, the signal probe 1401 or power probe 1402 Since there is a space 160 between the other end of and the second through hole 122 of the socket housing 120, the signal probe 1401 or the power probe 1402 is used as indicated by an arrow in FIG. 8(c). A phenomenon in which the other end is tilted may occur. When the other end of the signal probe 1401 or the power probe 1402 is tilted, it is difficult to insert the other end of the signal probe 1401 or the power probe 1402 into the support hole 111 of the support plate 110. There is a problem of low work efficiency.

In order to solve this problem, according to another embodiment of the present invention, an insulating support cap 1500 is placed at the lower part of the second through hole 122 of the socket housing 120 into which the insulating cap 150 is inserted, thereby forming a signal probe. By preventing the other end of (1401) or the power probe 1402 from being tilted, the support plate 110 can be easily assembled into the socket housing 120.

Figure 10 shows an insulating support cap 1500. As shown in FIG. 10, the insulating support cap 1500 is formed of the same material as the insulating cap 150 shown in FIG. 6, and has two cut surfaces 151, two side surfaces 152, and a plurality of protrusions ( 154) and the absorption portion 155, it has the same appearance, but the body 141 of the signal probe 1401 or the power probe 1402 must penetrate vertically inside the insulating support cap 1500, so it is insulated. There is some difference only in that it has a body hole 1530 that is larger than the pin hole 153 of the cap 150. Of course, the insulating support cap 1500 may be formed only with a thickness sufficient to support the other end of the signal probe 1401 or the power probe 1402 at the bottom of the socket housing 120, or may be formed in another shape. there is.

As shown in FIG. 11, the signal probe 1401 or power probe 1402 equipped with an insulating cap and an insulating support cap according to the present invention can be assembled as follows.

As shown in FIG. 8(b), the top of the socket housing 120 (the part where the second mounting hole 123 is formed) is turned over and placed on the floor, and the second penetration of the socket housing 120 is made. Insert the insulating cap 150 into the hole 122 using an interference fit method until it touches the second locking protrusion 124, and then attach the insulating support cap to the lower part of the second through hole 122 of the socket housing 120. Insert (1500) using an interference fit method. The state in which the insulating cap 150 and the insulating support cap 1500 are coupled to the second through hole 122 of the socket housing 120 is shown in FIG. 11(a).

In this state, as shown in FIG. 11(b), the second contact pin 143 of the signal probe 1401 or the power probe 1402 is inserted into the pin hole 153 of the insulating cap 150, and the body 141 is It is mounted to be inserted into the body hole 1530 of the insulating support cap 1500.

Next, the top of the support plate 110 (the part where the first through hole 112 is formed) is turned over to face the floor, and then a signal probe 1401 or a power probe is inserted into the support hole 111 of the support plate 110. 1402) can be assembled by inserting the other end (see FIG. 11(c)) and connecting the socket housing 120 and the support plate 110 with screws.

In this way, if the insulating support cap 1500 is placed on the lower part of the socket housing 120 to support the body 141 of the signal probe 1401 or the power probe 1402, the signal probe 1401 or the power probe 1402 Since the other end of 1402 is prevented from tilting, it is smoothly connected to the support plate 110, thereby increasing work efficiency.

According to another embodiment of the present invention, the first through hole adjacent to the first mounting hole 113 of the support plate 110 where the first contact pin 142 of the signal probe 1401 or the power probe 1402 is located. An insulating cap 150 may be coupled to portion (112).

Insert the first contact pin 142 of the signal probe 1401 or the power probe 1402 into the pin hole 153 of the insulating cap 150 and then through the first through hole 112 of the support plate 110. When one end of the signal probe 1401 or power probe 1402 to which the insulating cap 150 is coupled is inserted, the insulating cap 150 is connected to the step 145 of the signal probe 1401 or power probe 1402. 1 It is fixed between the locking jaws 114 in an interference fit manner. In this state, insert the other end of the signal probe 1401 or the power probe 1402 into the second through hole 122 of the socket housing 120, and then The support plate 110 and the socket housing 120 can be coupled with screws.

Alternatively, the insulating cap 150 is inserted into the first through hole 112 of the support plate 110 in an interference fit manner, and then the first contact pin 142 of the signal probe 1401 or the power probe 1402 is connected. It is mounted by inserting into the insulating cap 150, and the other end of the signal probe 1401 or power probe 1402 is mounted in the second through hole 122 of the socket housing 120, and then the support plate 110 and the socket are installed. The housing 120 can be coupled with screws.

According to another embodiment of the present invention, the second mounting hole of the socket housing 120 where the first contact pin 142 and the second contact pin 143 of the signal probe 1401 or the power probe 1402 are located. The insulating cap 150 is coupled to both the second through hole 122 adjacent to (123) and the first through hole 112 adjacent to the first mounting hole 113 of the support plate 110. You can.

In this case, the first contact pin 142 and the second contact pin 143 are inserted into the pinholes 153 of the insulating cap 150, respectively, and the first through hole 112 of the support plate 110 and the socket housing are connected. Insert the insulating cap 150 into the second through hole 122 of the support plate 110 or into the first through hole 112 of the support plate 110 and the second through hole 122 of the socket housing 120. It can be assembled by inserting the first contact pin 142 and the second contact pin 143 of the signal probe 1401 or the power probe 1402 into the insulating cap 150 while being pressed in. .

When the insulating cap 150 is coupled to both outer sides of the first contact pin 142 and the second contact pin 143 of the signal probe 1401 or the power probe 1402, the inspection probe 140 is It has the advantage of being able to be fixed more firmly, but there is the problem of reducing the space using air with a low dielectric constant, so it is better to select it when necessary depending on the test environment.

In the above embodiments, the ground probe 1403 has an outer diameter of such a size that it can directly contact the first through hole 112 of the support plate 110 and the second through hole 122 of the socket housing 120. is formed by No insulating layer is formed on the inner surface of the support hole 111 of the support plate 110 where the grounding probe 1403 is mounted and the socket hole 121 of the socket housing 120. The ground probe 1403 is assembled simultaneously in the process of assembling the signal probe 1401 or the power probe 1402.

The test socket 100 of the present invention operates in the following manner when performing an electrical test of the device under test 10.

12 and 13, when the device under test 10 is pressed toward the test socket 100, the terminal 11 of the device under test contacts the second contact pin 143 of the test probe 140. And, the first contact pin 142 of the inspection probe 140 contacts the pad 21 of the tester 20. At this time, the test signal generated by the tester 20 is transmitted to the device under test 10 through the test socket 100, so that an electrical test on the device under test 10 can be performed.

At least one of the first contact pin 142 and the second contact pin 143 of the signal probe 1401 and the power probe 1402, and the support hole 111 or the socket housing 120 of the support plate 110. An insulating cap 150 is coupled in an interference fit manner between the inner surface of the socket hole 121, and an insulating layer is formed on the inner surface of the support hole 111 of the support plate 110 and the socket hole 121 of the socket housing 120. Since the signal probe 1401 or the power probe 1402 forms a space 160 between the insulating layer and the insulating cap 150 and is vertically aligned, the test socket 100 of the present invention ) has a coaxial structure, and since air with a low dielectric constant is used as a dielectric in the space 160, a controlled impedance is provided to the electrical signal passing between the device under test 10 and the tester 20 to prevent signal transmission loss. It enables stable testing without any problems.

In addition, since air with a low dielectric constant is used as a dielectric, the outer diameter of the signal probe 1401 or the power probe 1402 can be sufficiently large, thereby improving the problem of increased costs or process difficulties caused by manufacturing fine pitch probes.

In addition, since the signal probe 1401 or the power probe 1402 is vertically supported by the insulating cap 150, the support hole 111 of the support plate 110 and the socket hole 121 of the socket housing 120 Even if the insulating layer formed on the inner surface of the device is damaged, an electrical short can be prevented from occurring.

In addition, the insulating cap 150 can be simply assembled using an interference fit method, making assembly simple, and the insulating cap 150 can be easily removed, so it can be easily replaced if the inspection probe is damaged or needs to be replaced at the end of its life. Therefore, it has the advantage of being able to be repaired with minimal replacement cost.

In addition, if the insulating support cap 1500 is placed on the lower part of the socket housing 120 to support the body 141 of the signal probe 1401 or the power probe 1402, the signal probe 1401 or the power probe ( Since the other end of 1402 is prevented from tilting, it is smoothly connected to the support plate 110, thereby increasing work efficiency.

Although the present invention has been described above with preferred examples, the scope of the present invention is not limited to the form described and shown above.

In the present invention, when the insulating cap 150 is coupled to the second through hole 122 adjacent to the second mounting hole 123 of the socket housing 120, the insulating support cap ( Although the arrangement of 1500) is described, when the insulating cap 150 is coupled to the portion of the first through hole 112 adjacent to the first mounting hole 113 of the support plate 110, the An insulating support cap 1500 may be placed on the upper part, and the insulating cap 150 is connected to the second through hole 122 adjacent to the second mounting hole 123 of the socket housing 120 and the support plate 110. When coupled to both sides of the first through-hole 112 adjacent to the first mounting hole 113, the signal probe 1401 or power probe 1402 is not adjacent to the mounting hole of the socket housing or support plate on which the signal probe 1401 or power probe 1402 is first mounted. It is also possible to prevent the signal probe 1401 or power probe 1402 from being tilted by mounting an insulating support cap 1500 on the through-hole portion on the opposite side.

In the present invention, a pogo pin is described as the inspection probe 140, but it is not limited to this and may include a needle pin, a conductive rubber, or a conductive wire inspection pin.

In addition, the drawing illustrates a Ball Grid Array (BGA) terminal using solder balls as the terminal of the device to be inspected, but it is not limited to this and a flat terminal such as a Land Grid Array (LGA) terminal. Of course, it can also be applied.

Although the present invention has been shown and described in relation to preferred embodiments for illustrating the principles of the present invention, the present invention is not limited to the configuration and operation as shown and described. Rather, those skilled in the art will understand that numerous changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

10: device under test 11: terminal 20: tester
21: pad 100: test socket
110: support plate 111: support hole 112: first through hole
113: first mounting hole 114: first locking protrusion 120: socket housing
121: Socket hole 122: Second through hole 123: Second mounting hole
124: Second locking jaw 125: Guide hole 130: Frame
140: Inspection probe 1401: Signal probe
1402: Probe for power 1403: Probe for ground 141: Body
142: first contact pin 143: second contact pin 144: spring
145: step 150: insulating cap 151: cutting surface
152: Side 153: Pinhole 154: Protrusion
155: absorption part 160: space 1500: insulating support cap
1503: body hole

Claims (10)

In a test socket that performs an electrical inspection of the device under test by connecting the terminal of the device under test to the pad of a tester that generates a test signal,
an inspection probe including a first contact pin in contact with the pad, a second contact pin in contact with the terminal, and a body, and a plurality of signal probes, a power probe, and a ground probe;
Made of metal and having a plurality of socket holes having a second through hole in which the upper part of the body of the inspection probe is accommodated and a second mounting hole with a smaller diameter than the second through hole through which the second contact pin penetrates. socket housing;
It is disposed in the lower part of the socket housing to support the inspection probe, a first through hole in which a lower portion of the body of the inspection probe is accommodated, and a diameter smaller than the first through hole through which the first contact pin penetrates. A support plate made of metal and having a plurality of support holes having a first mounting hole of;
It includes an insulating layer formed on the inner surfaces of the socket hole and the support hole into which the signal probe or the power probe is inserted,
The grounding probe is arranged to contact the inner surfaces of the socket hole and the support hole,
The second contact pin of the signal probe or power probe vertically penetrates the pinhole of the insulating cap coupled to the upper part of the second through hole of the socket housing, and the body of the signal probe or power probe is connected to the second through hole of the socket housing. 2 It is mounted to vertically penetrate the body hole of the insulating support cap coupled to the lower part of the through hole, and the signal probe or power probe is arranged so that a space is formed between the insulating layer and the insulating layer,
The insulating cap and insulating support cap are made of an elastic insulating material,
It has two cut surfaces and two side surfaces where both sides of the cylinder are cut, and a protrusion larger than the diameter of the second through hole is formed on the upper side of the side surface and is coupled to the second through hole in an interference fit manner, and the protrusion A test socket characterized in that a groove-shaped absorption portion is formed around the periphery. delete According to claim 1,
A test socket, wherein the metal material is aluminum metal, and the insulating layer is formed by an anodizing process. According to claim 1,
A test socket, characterized in that the space is filled with air. delete delete delete delete delete According to claim 1,
A test socket, wherein the ground probe has an outer diameter larger than that of the signal probe or the power probe.

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