201018917 九、發明說明： 【發明所屬之技術領域】 、本發明係與探針卡有關，特別是指一種有效防止探針 卡漏電流問題之探針卡製作方法及其結構。 5【先前技術】 積體電路晶圓測試中，用以傳輸測試訊號之探針卡電 路板係供測試機台的測試頭點觸，以接收測試機台的測試 春訊號並傳送至電路板下方近中心處所密集設置之探針上， 當各探針對應點觸的晶圓電子元件接收測試訊號後，則透 1〇過探針卡回傳所對應的電氣特性至測試機台以供分析，如 此在整個晶圓級測試過程中，探針卡電路板的電路傳輸設 計對電子元件的測試結果佔有很重要的影響，尤其隨著電 子科技越趨高速之運作，測試過程需操作於實際對應的高 速運作條件’故傳輸線路之製作更需符合高速訊號的操作 15條件。 © 以第一圖所示為美國專利第5808475號所提供之『低 電流量測用之半導體探針卡』，該探針卡1結構區分為上方 的接觸電路板10、下方的探針板12及中間的數個間隔材 - 14，其中，接觸電路板10上設置有如同軸傳輸線結構之測 • 20試接點11，町避免接觸電路板10本身的介質環境所產生的 寄生電阻導致漏電流問題，然由於接觸板10為直接供測試 機台Γ的測試頭點觸，探針板12為供以設置探針13,若接 觸板10或探針板12本身沒有足夠的支撐強度與一定的剛 體厚度，當測試機台1，下壓且施以應力欲於整個探針卡1 4 201018917 5 10 15 ❹ 結構時，接觸板10與探針板12的受力平面則容易因受力 而使接觸板10或探針板12產生形變的問題，況且當各探 針13點觸晶圓平面時，單獨探針板12前端則需不斷的承 受來自晶圓平面產生的反作用力，如此應力作用下，探針 板12前端用以設置探針13的平面結構亦容易產生形變。 縱使可如第二圖所示為習用之另一探針卡2結構，其 訊號傳輸過程為經由多層印刷電路板2〇上所佈設之線路 21由外至内且由上至下的延伸穿設層疊之電路板2〇，然後 由探針22送出，故電路板2〇之整體結構強度與其單—受 力平面可於承受應力時平均分散此制力，喊少發生受 力所產生形變的問題到可容許的形變範内；舒層印刷電 路板20係以多層玻璃纖維材f所壓合而成，各層結構上 設有金屬線材以形成導線21結構，故製作上不但需粍費相 田的成本與I時，且將傳輸線路21佈設於電路板内部 相鄰線路21佈設之間的電路板2()材質，若以習用的為 ί =(=)材'其體積電阻(V°1Ume㈣纽e)約為 k姆·公分，極料造成漏電流的主因，加上 結構所穿設料通孔線路2ig易使訊號縱向傳 遞時發生"面反射的能量耗損 的傳輸特性，而I法符人雷早心㈣同頻afl號 …、次好口電子電路元件的高速測試需求。 的電路傳導於基板内部的漏電流問提及層間介質 耗’雖可將導電線路佈設於具有高絕緣阻值以及 ==陶_表面，然後與中心所接設之探針 接以改善傳輸線路之間的漏電流、串音現象 20 201018917201018917 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a probe card, and more particularly to a probe card manufacturing method and structure thereof for effectively preventing leakage of a probe card. 5 [Prior Art] In the integrated circuit wafer test, the probe card circuit board for transmitting the test signal is touched by the test head of the test machine to receive the test signal of the test machine and transmitted to the lower part of the circuit board. On the probes densely arranged near the center, when the probe electronic components corresponding to the probes receive the test signals, the corresponding electrical characteristics are transmitted back to the test machine for analysis. Thus, during the entire wafer level test process, the circuit design of the probe card circuit board has an important influence on the test results of the electronic components, especially as the electronic technology becomes more and more high-speed operation, the test process needs to be operated in the actual corresponding High-speed operating conditions 'Therefore, the production of transmission lines is more in line with the operation 15 conditions of high-speed signals. In the first figure, the "semiconductor probe card for low current measurement" provided in U.S. Patent No. 5,808,475, the structure of the probe card 1 is divided into an upper contact circuit board 10 and a lower probe card 12 And a plurality of spacers in the middle - 14, wherein the contact circuit board 10 is provided with a test circuit such as a coaxial transmission line structure, and the parasitic resistance generated by the medium environment of the circuit board 10 itself avoids leakage current problem. However, since the contact plate 10 is directly touched by the test head of the test machine, the probe card 12 is provided with the probe 13 if the contact plate 10 or the probe card 12 itself does not have sufficient supporting strength and a certain rigid body. Thickness, when the test machine 1 is pressed down and the stress is applied to the entire probe card 1 4 201018917 5 10 15 ❹ structure, the force plane of the contact plate 10 and the probe card 12 is easily contacted by force. The board 10 or the probe card 12 has a problem of deformation. Moreover, when the probes 13 touch the plane of the wafer, the front end of the single probe card 12 needs to continuously withstand the reaction force generated from the plane of the wafer. The front end of the probe card 12 is used to set The planar structure of the probe 13 is also susceptible to deformation. Even though the other probe card 2 structure can be used as shown in the second figure, the signal transmission process is performed from the outside to the inside and from the top to the bottom through the line 21 disposed on the multilayer printed circuit board 2 The stacked circuit board 2〇 is then sent out by the probe 22, so the overall structural strength of the circuit board 2〇 and its single-force plane can disperse the force evenly when subjected to stress, and the problem of deformation caused by the force is less. To the allowable deformation range; the dry layer printed circuit board 20 is formed by laminating a plurality of layers of glass fiber material f, and each layer is provided with a metal wire to form a wire 21 structure, so that the cost of manufacturing the phase is not only required to be produced. When I and I, the transmission line 21 is disposed on the circuit board 2 () material disposed between the adjacent lines 21 inside the circuit board, if the conventional one is ί = (=) material 'the volume resistance (V ° 1 Ume (four) neoe ) is about k·cm, the main cause of leakage current, and the transmission characteristic of the energy loss of the "face reflection occurs when the through-hole line of the material is easily passed through the structure, and the I method is used. Lei Xianxin (four) same frequency afl number..., sub-good mouth electronic circuit High-speed testing requirements for components. The leakage current of the circuit conducted inside the substrate refers to the interlayer dielectric consumption. Although the conductive circuit can be disposed on the surface with high insulation resistance and == ceramic surface, and then connected with the probe connected to the center to improve the transmission line. Leakage current, crosstalk phenomenon 20 201018917
1515
以及"吳吸收等影響測試訊號的傳輸品質及反應速度問 題，但以第三圖所示於陶瓷基材上形成一探針卡30之導電 ，路的製程條件而言，需將整片的銅箔金屬31背面沾附黏 著膠後貼附於陶瓷基材32上，再以化學蝕刻方式將銅箔金 屬31圖案化成訊號傳輸導線’然化學蝕刻並無法去除銅箔 金屬31背面之黏著膠，而往往使導線之間有背膠殘留，形 成導線間漏電流的路徑，因而降低積體電路之電測良率並 影響積體電路晶圓製造的效率。 縱使有如第四圖所示為台灣專利公告第522449號所揭 露之種探針卡35，係提出以機械加工之方式雕刻研磨陶 瓷基板36及其上之導電金屬37而形成線路圖案，使線路 之間的間隙深入基板36表面，同時免除了上述導線之間背 膠38。殘留的問題，並利用空氣作為線路隔絕的介質，再配 合陶兗基板36所具有高硬度、w形變且高絕緣性的材 質’以增進探針卡的電性與結構品f;然而以機械加工方 式先後對導電金屬37及陶究基板36同時力σ工亦需以不同 =製^件分階段完成，級於線路結構上作細微的改變 的機械控制製程條件’如此製程複雜度的增加則 播善Γ針卡的製程效率’目此如何以最佳的探針卡結 探針卡材料選擇，以降低電測環境中不必要的漏 :眘Γ ’甚域與製喊率及成本支出做到最佳的匹 ，貫為現今高精密度量測卫程的—大課題。 【發明内容】 20 201018917 因此，本發明之主要目的乃在於提供一種低漏電且古 強度之探針卡，以最節省的成本支出及簡易、高效率= 程有效提升探針卡之高頻測試品質。 ' 5 10 15 20 為達成前揭目的，本發明所提供一種探針卡及其製 方法，該探針卡係具有一探針基板及一探針組，該探針美 板為以射出成型方式使至少一絕緣材依附於一支撐材，^ 支撐材區分有位於中心之H部及環繞於該第一基^ 周圍之-第-延伸部，依附於該第—基部之絕緣材為一^ 二基部，依附於該第一延伸部之絕緣材為一第二延伸 對應於該第-及第二基部定義為該探針基板之—探針區， 對應於該第-及第二延伸部定義為該探針基板之_測試 區’該測試區形成有相狀二表面，係為料—延伸部之 底面與該第二延伸部之_接觸面，該接觸面並設有多數 個導電接點，該探針組設於簡㈣，具有多 連接!些導電接點，藉由提供具有高阻值特性= 用以β又置該些導電接點’使相鄰各該導電接點之間 電性絕緣之雜，有效解決了職訊號於介質材料中 專遞時相鄰傳輸訊號之間的漏電流效應，再藉由該支撑材 =剛性(Stiffness)增加整㈣探針卡騎區及測試區之剛 性’該支科可與探針基板―同變形，支撑材變形產 擔來自導電接點以及探針的作用力，或是分 ^ ^ 本身各兀件造成的在組裝或使用過程中造成 ' Ζ ]同時減少該探針卡在溫度變化之環境因素下產生 y ，以維持該些探針之穩定性特別適合用於需要極低漏 7 201018917 電一之暴& ’例如晶圓接受測試(Wafer Acceptance Test)或 是高頻測試。。 【實施方式】 5 =下，兹配合圖示列舉若干較佳實施例，用以對本發 ^之結構與功效作詳細說明，其中所賴示之簡要說明如 下· 圖係本發明所提供第一較佳實施例之組合立體示 惠圓， 圖係上述第—較佳實施例之結構示意圖； 第七圖係本發明所提供第二較佳實施例之結構示意 園， 章圖第乂圖係本發明所提供第三較佳實施例之組合立體示 15 2圖係上述第三較佳實施例之結構示意圖； 圖；_本發明所提供第四較佳實施例之結構示意 圖；十圖係本發明所提供第五較佳實施例之結構示意 十圓係本發明所提供第六較佳實施例之結構示意 201018917 40、一探針組50及多數條訊號線60 : 5 ❹ 10 15 ❹ 20 a.提供一支撐材41，係為不易產生形變之高硬度材質， 於美國材料與試驗學會（American Society for Testing and Materials，ASTM)所定義D790測試標準下具有每平方公 分大於100公斤之彎曲強度（flexural strength)規格，一般 剛體結構如鋼材、金屬等’或習用電路板使用之基材如陶 瓷、玻璃纖維板等大致即可符合此高硬度的需求，當然若 以不銹鋼或鋁合金等剛體結構則能提供更好的抗拉、抗折 特性，具有每平方公分大於1000公斤之彎曲強度規格以及 ASTM所定義D638測試標準下每平方公分大於2〇〇〇公斤 之抗拉強度（tensil strength)規格，該支撐材41區分有位 於中心之一第一基部42及環繞於該第一基部42周圍之一 第-延伸部43 ’該基部42與延伸部43係形成有相互平行 之-頂面421、431及-底面422、432，且該基部42之底 =422與延伸部43之頂φ 431間縱向連接多數個連接部 数们導電金屬塊置入一模具（圖中未式）中，並 =樓材41自第-基部-之頂…=使; 於對應該第—延伸部43，再利用高絕緣 之結構主f —讀出成财式形成贿針基板4〇 CM的材料，亦即^絕緣材係使用體積阻抗大於1〇14Ω · 係數之材f㈣成〜做賴該讀材41為低導電 高體積電阻的絕ί特::施 卜㈣具有耐磨、耐衝擊之機械 9 201018917 ❻ 15 強度特性’如聚氣乙婦（PVC )、聚醋膠（pet )、聚甲酸 (POM )、ABS 樹脂、聚二®| 酮（peek )、電木 (BAKELITE)、高分子聚乙烯（UPE)、聚乙烯（pE)、聚 丙稀（PP)、聚己内醯胺（Nylon 6)、尼龍鋼（mc Nylon)、 鐵氟龍（PTFE)或聚碳酸醋（PC)等—般普通廉價的工程 塑膠，其中依附於該第一基部42底面422以及該些連接部 44之間之絕緣材為一第二基部45 ’依附於該第一延伸部43 頂面431以及該些連接部44外圍之絕緣材為一第二延伸部 46，為了使上述該些訊號線60有足夠之空間佈設於該探針 基，40，該第二延伸部46與該第一及第二基部42、45相 附著處相隔有適當之距離，可供該魏號線6()容置分佈並 f過該些連接部44之間，對應於該第一及第二基部42、衫 定義為該探針基板40之-探針區4()1，該探針區4〇1形成 ^目對之二表面，為該第-基部42之項面421及該第二基 Ϊ 一探測面451，對應於該第一及第二延伸部43、46 ^曰二雜針基板4〇之—測試區4G2，該測試區402形成 之二表面’為該第—延伸部之底面從及該第二延 面461Λ—接觸面46卜該些導電金屬即為外露於該接觸 的妹人^數個第—導電接點47，為了使支料和絕緣材 構==上鑽孔’固定咖 成型到出夕數個孔洞，再把一絕緣材射出 緣材固化=後並=絕緣材進入該些孔洞中，當絕 數個突出，伸二中的絕緣材也固化成為多 甲μ—孔洞，可以固定支撐材和絕緣材，此 20 201018917 外也可以明絲、膠水把絕緣材固定在支撐材上； c. 於該探針基板40之第二某邱仏田闲 ’ 多數個通孔452’並自該測試面451於各該= 導電接點47，經该支標材41之連接部44 通孔452以電性連接該第二導電接點48 . ❸ 15 ❹ d. 備製多數個具良好導電性之懸臂式探針51及一 =之=’將各該探針51之針身511黏著;: 固疋私52，使各该探針51之針尖512凸出該固定環^之 頂面521為该固定環52所環繞且針尖末端妓 平面P ’因此製成該探針組50，各該探針5;之針=十二 該固定環52有適當轉之力臂長度，提供該些針尖51 = 點觸待測7C件時有適當的彈性回復力； e. 將該固定環52之底自522設至該第二基部45And "Wu absorption and other factors affecting the transmission quality and reaction speed of the test signal, but forming the conductivity of a probe card 30 on the ceramic substrate as shown in the third figure, the process conditions of the road need to be the whole piece. The back surface of the copper foil metal 31 is adhered to the ceramic substrate 32 after being adhered to the ceramic substrate 32, and the copper foil metal 31 is patterned into a signal transmission wire by chemical etching. However, the adhesive on the back surface of the copper foil metal 31 cannot be removed. However, there is often a backing residue between the wires, which forms a path of leakage current between the wires, thereby reducing the electrical measurement yield of the integrated circuit and affecting the efficiency of the integrated circuit wafer fabrication. Even if the probe card 35 disclosed in Taiwan Patent Publication No. 522449 is shown in the fourth figure, it is proposed to mechanically engrave the polished ceramic substrate 36 and the conductive metal 37 thereon to form a line pattern, so that the line is formed. The gap between the layers penetrates the surface of the substrate 36 while eliminating the backing 38 between the wires. Residual problem, and use air as the medium for circuit isolation, and then match the material with high hardness, w shape and high insulation of the ceramic substrate 36 to improve the electrical properties and structure of the probe card; however, it is machined. In the same way, the conductive metal 37 and the ceramic substrate 36 are simultaneously required to be completed in different stages, and the mechanical control process conditions for subtle changes in the line structure are so that the complexity of the process is increased. How to improve the process efficiency of the needle card? How to choose the best probe card probe card material to reduce unnecessary leakage in the electrical test environment: careful Γ 甚 与 甚 甚 甚 甚 甚 甚 甚 甚 甚 甚 甚 甚The best horse is the big subject of today's high-precision measurement and measurement. SUMMARY OF THE INVENTION 20 201018917 Therefore, the main object of the present invention is to provide a probe card with low leakage and ancient strength, which can effectively improve the high-frequency test quality of the probe card with the most cost-saving and simple and high efficiency. . 5 5 15 20 In order to achieve the foregoing, the present invention provides a probe card having a probe substrate and a probe set, and the probe plate is formed by injection molding. The at least one insulating material is attached to a supporting material, and the supporting material is divided into a central portion H portion and a first-extension portion surrounding the first base portion, and the insulating material attached to the first base portion is a second The base portion, the insulating material attached to the first extension portion is a second extension corresponding to the first and second base portions defined as the probe substrate, and the first and second extension portions are defined as The test area of the probe substrate is formed with two phases, which are a contact surface between the bottom surface of the material-extension portion and the second extension portion, and the contact surface is provided with a plurality of conductive contacts. The probe set is set in the simple (four), has multiple connections! Some conductive contacts, by providing high resistance characteristics = for β and the conductive contacts 'to make electrical connection between the adjacent conductive contacts Insulation is mixed, effectively solving the problem between adjacent transmission signals when the job signal is transmitted in the media material. Leakage current effect, and then the support material = rigidity increases the rigidity of the whole (four) probe card riding area and the test area. The branch can be deformed together with the probe substrate, and the support material is deformed and produced from the conductive contact. And the force of the probe, or the resulting damage caused by the components of the ^ ^ itself during assembly or use, while reducing the probe card to generate y under the environmental factors of temperature changes to maintain the probes The stability is particularly suitable for applications requiring extremely low leakage, such as the Wafer Acceptance Test or the high frequency test. . [Embodiment] 5 = Down, a number of preferred embodiments are listed in conjunction with the drawings for a detailed description of the structure and function of the present invention, and the brief description thereof is as follows. A combination of a preferred embodiment of the present invention is a schematic view of the structure of the first preferred embodiment; and a seventh structural diagram of the second preferred embodiment of the present invention, which is a schematic diagram of the present invention. 3 is a schematic structural view of a third preferred embodiment of the present invention; FIG. 3 is a schematic structural view of a fourth preferred embodiment of the present invention; The structure of the fifth preferred embodiment is shown as a ten-circle system. The structure of the sixth preferred embodiment provided by the present invention is shown in 201018917 40, a probe set 50 and a plurality of signal lines 60: 5 ❹ 10 15 ❹ 20 a. A support material 41 is a high-hardness material that is not easily deformed, and has a bend of more than 100 kg per square centimeter under the D790 test standard defined by the American Society for Testing and Materials (ASTM). Flexural strength specifications, generally rigid body structures such as steel, metal, etc. or substrates used in conventional circuit boards such as ceramics, fiberglass boards, etc. can roughly meet the requirements of high hardness, of course, if rigid structures such as stainless steel or aluminum alloy It can provide better tensile and flexural properties, with a flexural strength specification of more than 1000 kg per square centimeter and a tensile strength specification of more than 2 kg per square centimeter under the ASTM defined D638 test standard. The support member 41 is divided into a first base portion 42 located at a center and a first extension portion 43 ′ surrounding the first base portion 42. The base portion 42 and the extension portion 43 are formed with mutually parallel top surfaces 421, 431 and - bottom surface 422, 432, and the bottom of the base portion 42 = 422 and the top φ 431 of the extension portion 43 are longitudinally connected between the plurality of connecting portions of the conductive metal block placed in a mold (not shown), and = floor The material 41 is from the top of the first base - the top ... is made; and corresponding to the first extension portion 43, and then the high-insulation structure main f - read into the financial form to form the material of the bristle substrate 4 〇 CM, that is, the insulation Material use The volumetric impedance is greater than 1〇14Ω · The material of the coefficient f(4) is made ~ Do the reading material 41 is the low-conductivity and high-volume resistance of the material:: Shib (4) Machine with wear resistance and impact resistance 9 201018917 ❻ 15 Strength characteristics such as Polyethylene (PVC), polyester (pet), polyformic acid (POM), ABS resin, peek, peek, BAKELITE, high molecular polyethylene (UPE), polyethylene ( pE), polypropylene (PP), polyhexylamine (Nylon 6), nylon steel (mc Nylon), Teflon (PTFE) or polycarbonate (PC), etc. - ordinary cheap plastic engineering, which is attached The insulating material between the bottom surface 422 of the first base portion 42 and the connecting portions 44 is a second base portion 45 ′ attached to the top surface 431 of the first extending portion 43 and the insulating material on the periphery of the connecting portions 44. The second extending portion 46 is disposed in the probe base 40 so that the second extending portion 46 is spaced apart from the first and second base portions 42 and 45. The distance between the connecting portions 44 and the first and second base portions 42 is corresponding to the distance between the connecting lines 44 and the connecting portions 44. The shirt is defined as a probe region 4()1 of the probe substrate 40, and the probe region 4〇1 forms a second surface, which is a face 421 of the first base portion 42 and the second substrate The detecting surface 451 corresponds to the first and second extending portions 43 and 46, and the test area 4G2 of the two-pin substrate 4 is formed. The two surfaces formed by the test area 402 are the bottom surface of the first extending portion. The second extension surface 461 Λ - the contact surface 46, the conductive metal is the number of the first conductive contact 47 exposed to the contact person, in order to make the support and the insulation material == upper hole 'fixed coffee Forming a few holes into the Eve, and then ejecting an insulating material to the edge material to cure = after and = the insulating material enters the holes, when the number of protrusions, the insulation material in the extension 2 also solidifies into a multi-μ μ hole, Fixing support material and insulating material, this 20 201018917 can also be used to fix the insulating material on the support material with clear wire and glue; c. on the second substrate of the probe substrate 40, Qiu Tiantian's 'most through holes 452' and The test surface 451 is electrically connected to the second conductive connection via the through hole 452 of the connecting portion 44 of the supporting member 41. Point 48 . ❸ 15 ❹ d. Prepare a plurality of cantilever probes 51 with good electrical conductivity and a === stick the needles 511 of each of the probes 51; The needle tip 512 of the needle 51 protrudes from the top surface 521 of the fixing ring, and the tip end of the fixing ring 52 is surrounded by the tip end plane P'. Thus, the probe set 50 is formed, and each of the probes 5; The fixing ring 52 has a suitable arm length, and the needle tip 51 is provided; when the 7C member to be tested is touched, there is a proper elastic restoring force; e. The bottom of the fixing ring 52 is provided from the 522 to the second base 45.
Si 3=二導電接點48所環繞’再將各該探針;1 電I1 生連接該第二導電接點48 之針尖平面P平行_1_卩43之底針^ 基部45之探測面451。 弟一 因此利用上述方法所製作之該探針卡4,操作上 ^準該第一延伸部43之底面432與待測晶圓之平面平^ 度’再使㈣機台之職賴麟職區外圍之該此 第-導電接點47，以輸⑽試訊號至該探針卡4由該^ 導電接點47接收，經由該些訊號線％傳送至 侧之第二導電接點48以至該探針S1，即可藉由該^探^ 20 201018917 51將測試訊號輸出皇所點觸晶圓之待測電子元件，且由於 該些探針Μ具有共同之針尖平面Ρ，可在點測時共同達: 良好的電性接觸；另，由於用以設置該些導電接點47、牦 之該第二基部45及第二延伸部46為以高阻值之絕緣材料 所製成，使相鄰各該第一導電接點47之間及相鄰各該第二 導電接點48之間達成電性絕緣之特性，有效解決了 ^試& 號於介質材料中傳遞時相鄰傳輸訊號之間的漏電流效應. 且訊號為以該些訊號線60縱向貫穿該探針基板4〇7路徑上 不需經過層間介質，因此不致發生如習用多層印刷電:板 之介電耗損及貫孔結構所面臨於層間介質之能量反射耗損 問題，使該探針卡4用以高頻測試過程維持有良好的訊^ 阻抗匹配特性，具有低損耗的高頻訊號傳輸品質；再者: 以射出成型之該探針基板40在製造過程中或是作 始 15 Ο 的結構強度較弱，其可以使用之材質強度較差，^拉2 在每平方公分1000公斤以下或彎曲強度在每平方公= 2000公斤以下，藉由該支撐材41之剛體特性提供該探^ 4探針區4〇1及測試區402之，以承受該接觸面46ι 及探測面451所直接接收的應力來源，避免該探針卡 溫度變化之環境因素下產生形變岐得探針51針尖的 也隨之變形，有效_探針51針尖佈置之準雜，亦可 免第-導電接點47的佈置也隨之變形使得探針卡4和測試 機台之間連結受到影響’有效維持探針卡4和測試機二之 可靠性’因此該探針卡4不但具有很“電 測可罪性’特別適合用於需要極低漏電流之場合，例如晶 12 20 201018917 圓接受測試(Wafer Acceptance Test)或是高頻測試，更因以 §亥探針基板40所具有的強度及絕緣特性同時取代習用之陶 瓷材料，且其射出形型的製造方式得以降低製造時間以及 成本’使探針卡製作成本的支出相對減少且製作線路的工 5 程相對簡化。 當然，上述實施例中於該第二基部45之通孔452設置 該些第二導電接點48係為電性連接該些探針51與訊號線 60之功能作用，可以任何具金屬導電特性之轉接頭方便該 些探針51於探測面451上穩固的焊接以及方便該些訊號線 60於通孔452中鎖設，若為了更佳的訊號傳輸特性考量， 除了該些訊號線60可以具有高頻傳輸特性之同軸傳輸線所 製成，5亥些第二導電接點48亦選用與該些訊號線6〇阻抗 =配之同軸接頭，更甚者，亦可以如第七圖所示本發明所 提供第二較佳實施例之一探針卡5，具有一探針基板49、 15 一探針组5 3及多數個訊號線6卜與上述第一較佳實施例所 提供者之差異在於： 該探針基板49雖同樣以上述實施例之步驟a、b形成 第、第二基部42、45及延伸部43、46，然形成於該第二 2基°卩45之通孔452則供各該訊號線61穿設且延伸至該探 20針組/3與各探針54直接電性導通，在高頻量測需求時可 使訊號大多傳遞於具有高頻傳輸特性之訊號線61中，直至 接近探針組53之固定環52才與探針54電性連接將訊號輸 出至彳衣針54，更可省去如上述實施例之該些第二導電接點 48之設置，減少訊號傳遞過程之任何介面反射因素。 201018917 請參閱如第八及第九圖所示為本發明第三較佳實施例 所提供之一探針卡6’除了具有如上述第二較佳實施例所提 供之探針組53及訊號線61，更有一探針基板7〇，與上述 第二較佳實施例所提供者之差異在於： … 該探針基板70雖同樣為以射出成形方式將絕緣材依附 於如上述實施例步驟a所提供之該支撐材41，具有由絕緣 材所構成之-第二基部71及一第二延伸部72，然該第二延 15 伸部72具有自-鋪® 721朝内部預定深度所凹設之多數 個溝槽722 ’該接觸面721上亦喪入多數個導電接點73供 該些訊號線61電性連接，由於相鄰各該導電接點乃之間 具有-該溝槽722’利用溝槽722所形成之凹處可以容納空 氣的特性’則可藉由空氣作為間隔增加相鄰 73之間可能形成漏電流路徑的絕緣阻值m 該導電接點73之間的電性隔絕效果，同時，該m 722 接之:針電V4: Γ漬殘留:形成相 有效減少訊麟輸之_漏電鱗徑Him更^ 絕緣材-體射出成型時即已-屏槽722於 示習用探針卡般需於陶究電路板如第四圖所 作，因此使該探針卡6不但= 籌槽之機械加工製 較佳霄轭例所提供之探 20 201018917 針組50，更具有一探針基板8〇及多數條訊號線62，與上 述第一較佳實施例所提供者之差異在於： 該探針基板80以射出成形方式將一絕緣材81依附於 一支撐材82所製成，其中該支撐材82中心之第一基部8以 與其周圍之第一延伸部822於同一側上具有共同之〜 ϋ， * 十面 Ρ，以側向依附於該第一基部82ΐ之該支撐材82形成一第 參 15 ❹ 20 二基部811，依附於該第一延伸部822之平面法線方向打 該支揮材82形成一第二延伸部8J2。 在電性連接上，該第二基部8U貫設有多數個具導電 性之導孔83，該第二延伸部812之接觸面813設有多數個 導電接點84，該些導電接點84分別透過該些訊號線幻與 該些導孔83電性連接，該騎組5G直接設於該支撐材^ 上為第一基部821所支撐，該探針組5〇之各探針51電性 連接該導孔83,且維持該些探針51之針尖平面p平行於該 士撑材82之底部平面p，，因此較之上述各實施例，該探針 卡7更可藉由鼓撐材82之·結構，有效避免該探針卡 7在溫^化之環境时下影響該些探針51之穩定性。 比a值侍一提的是，本發明上述各實例所提供之絕緣材係 ^可d附於支料㈣出成型，使探針卡不但藉由支 =之剛體結構提供各部位所對應附著之絕緣材抵抗受 二又應力可此造成的形變因素’並以具有高阻值之絕緣 =性達_止訊號傳輪路徑上_訊號之種及漏電流現 至於封目躲支撐糾狀崎材部她部討論時， /、、則機σ之測试碩點觸之一側著重以耐磨、耐衝擊之 15 201018917 5 15 械強度特性考量’使有效緩衝來自測試頭之接觸應力避免 材料之磨損，供點觸待測元件之—側則因訊號傳輸至探針 ^空間密集度較高’需更著重以抗形變、低漏電之特性 里因此可如第十-圖所不為本發明第五較佳實施例所 提，之-探針卡8’除了具有如上述第—較佳實施例所提供 =針組50及訊號線60，更具有一探針基板9〇，與上述 第一較佳實施例所提供者之差異在 :探針基㈣仙-支料 1作__卡8之支 j體’於該支撑材91之兩侧分別將—第—絕緣材％及 由f 一絕緣材93先後以射出成型方式依附於該支撐材91 =_之-基部911及周圍所對應之一延伸部912，其 度^絕緣材92具有較該第二絕緣材93為高的耐熱溫 =，，該第—絕緣材92之頂面依附於該支樓材 探針组:作為該探針卡8之一測試面921供以設置該 支撐材^環52，該第二絕緣材93之底面依附於該 測機台之測試頭卡8之一接觸面931以供電 ㈣設置乡^_==緣成後即於頂 . t L 弗導電接點94，當然亦可如上述第一 二製成1此置於模具中與該第二絕緣材93同時射出成型 第2緣6Q f f鼓#材91之基部911及該 m _ _ ，兩端分別電性連接該測試面921所設置之 探針51㈣點％及該第一導電接點94 ;該探針組50之各 ,,、平 連接該第二導電接點95，且該些探針51之針 穴千面p平行於該测試面921。 r 20 201018917 而樣^ 絕緣材92具有較該第二絕緣材93為高的 因此製作條件上足以承受後續將該第二絕緣材 出成i之尚溫_，且由於該探針卡8實際用 =程往往制科需操作於高溫測試條件中，亦即若對 :::8各局部區分，除了該探針組50為直接與待測元 針基板9G以第—絕緣材92為最接近μ 度環境，故可彈性選用該第-絕緣材92之耐熱品、 自該第二絕緣材％ ;再者’以訊號傳輸過程考量， 以探針基板90外圍於第二絕緣材％所設之第一 點=接收測試訊號後，經該訊號線6〇朝該 =佈，第-絕緣材92所設之第二導電接點95，相鄰= 之、傳輸路徑中係逐漸縮小’致使相鄰訊號間需考量 4 丨L影響因素隨之增加，故可彈性選用該第一纟 15 20 %之絕緣特性使較佳於該第二絕緣材93選用4絕緣材 射出==提:該探針卡8之探針基板9〇以兩次 曰雄洛甘乍方式，使絕緣材之材質選用上可分兩種考 :條於ί顧所有品質因素而整體絕緣材皆須選用同 $ 料’故㈣有效節省製作成本之同時提供 二質條 =之探針卡；#然，其中第—及第二絕緣材92、 -導電接5點邑=特性考量係基於該些第一導電接點94與第 二間距差異，致使第二導電接點95之環境 電流路徑，若應:：^以降低因更小間距可能存在之漏 ’、、上述第一較佳實施例之改良結構即可不 必r疋該第-絕緣材92與第二絕緣材93絕緣特性之差 17 201018917 之上述第五較佳實施例所提供者則為於該第一絕緣材％不 设有導電接點，即可使訊號之傳輸路徑為自該第一導電接 點94接收後透過該訊號線61直接輸出至該探針組53之探Si 3 = two conductive contacts 48 are surrounded by 'each of the probes; 1 electric I1 is connected to the second conductive contact 48, the tip plane P parallel_1_1卩43 bottom pin ^ base 45 detection surface 451 . Therefore, the probe card 4 manufactured by the above method is operated to align the bottom surface 432 of the first extension portion 43 with the plane of the wafer to be tested, and then the position of the (4) machine is in the Lai Lin area. The first conductive contact 47 of the periphery is received by the (10) test signal to the probe card 4 by the conductive contact 47, and is transmitted to the second conductive contact 48 via the signal line % to the probe The needle S1 can output the test signal to the electronic component to be tested of the wafer by the probe 20 201018917 51, and since the probes have a common tip plane, they can be common at the time of the measurement. Up to: good electrical contact; in addition, since the second base portion 45 and the second extension portion 46 for arranging the conductive contacts 47 and the second portion are made of a high-resistance insulating material, adjacent ones are made The electrical insulation property between the first conductive contacts 47 and the adjacent second conductive contacts 48 effectively solves the problem between the adjacent transmission signals when the test & Leakage current effect. The signal is that the signal lines 60 extend longitudinally through the probe substrate 4〇7 without inter-layer intermediation. Quality, so it does not occur as a conventional multilayer printed circuit: the dielectric loss of the board and the energy reflection loss of the interlayer dielectric faced by the via structure, so that the probe card 4 maintains a good signal impedance during the high frequency test process. Matching characteristics, low-loss high-frequency signal transmission quality; Furthermore: the probe substrate 40 that is injection-molded during the manufacturing process or the initial 15 Ο structural strength is weak, and the material strength that can be used is poor, ^ Pulling 2 is less than 1000 kilograms per square centimeter or bending strength is less than 2000 kilograms per square centimeter, and the probe body region 4〇1 and the test zone 402 are provided by the rigid body characteristics of the support member 41 to withstand the The source of the stress directly received by the contact surface 46 ι and the detecting surface 451 prevents the deformation of the probe card from occurring under the environmental factors of the probe card temperature change, and the tip of the probe 51 is also deformed, and the effective _ probe 51 needle tip arrangement is quasi-difference. It is also possible to prevent the arrangement of the first conductive contact 47 from being deformed so that the connection between the probe card 4 and the test machine is affected 'effectively maintaining the reliability of the probe card 4 and the test machine 2'. Therefore, the probe card 4 Not only have "Electricity testability" is especially suitable for applications requiring extremely low leakage current, such as wafer 12 20 201018917 Wafer Acceptance Test or high frequency test, and more because of the Detector 40 The strength and insulation properties simultaneously replace the conventional ceramic materials, and the manufacturing method of the injection shape can reduce the manufacturing time and cost. The expenditure for the production cost of the probe card is relatively reduced and the manufacturing process of the circuit is relatively simplified. Of course, the above implementation In the example, the second conductive contacts 48 are disposed in the through holes 452 of the second base portion 45 to electrically connect the probes 51 and the signal lines 60, and can be conveniently used for any metal conductive characteristics. The probes 51 are stably soldered on the detecting surface 451 and facilitate the locking of the signal lines 60 in the through holes 452. For better signal transmission characteristics, the signal lines 60 may have high frequency transmission characteristics. The coaxial transmission line is made, and the second conductive contacts 48 of the 5th hole are also selected to be coaxial with the signal line 6〇 impedance=matching, or even the invention can be as shown in the seventh figure. The probe card 5 of the second preferred embodiment has a probe substrate 49, a probe set 53 and a plurality of signal lines 6 which are different from those provided by the first preferred embodiment in that: The probe substrate 49 also forms the second and second base portions 42 and 45 and the extension portions 43 and 46 in the steps a and b of the above embodiment, and the through holes 452 formed in the second base portion 45 are provided for each. The signal line 61 is disposed and extends to the probe 20/3 and is electrically connected to each of the probes 54. When the high frequency measurement is required, the signal is mostly transmitted to the signal line 61 having the high frequency transmission characteristic. Until the fixing ring 52 of the probe group 53 is electrically connected to the probe 54 to output the signal to the clothespin 54, the setting of the second conductive contacts 48 as in the above embodiment can be omitted, and the signal transmission can be reduced. Any interface reflection factor of the process. 201018917 Please refer to the eighth and ninth figures for providing a probe card 6' according to a third preferred embodiment of the present invention, in addition to the probe set 53 and the signal line provided in the second preferred embodiment. 61, further having a probe substrate 7A, which is different from the above-described second preferred embodiment in that: the probe substrate 70 is also attached to the insulating material in the injection molding manner as in the step a of the above embodiment. The support member 41 is provided with a second base portion 71 and a second extension portion 72 composed of an insulating material, and the second extension portion 72 has a recessed portion of the self-paving® 721 toward a predetermined depth inside. A plurality of trenches 722 ′ also have a plurality of conductive contacts 73 on the contact surface 721 for electrically connecting the signal lines 61. Since the adjacent conductive contacts have between the trenches 722 ′ The recess formed by the slot 722 can accommodate the characteristic of the air. The air can be used as an interval to increase the electrical insulation between the adjacent 73 and the insulating resistance of the conductive path 73. , the m 722 is connected: Needle electric V4: Γ 残留 residue: form phase Reduce the speed of the lining loss _ leakage scale diameter Him more ^ insulation material - body injection molding is already - the screen slot 722 in the training probe card is required to study the circuit board as shown in the fourth picture, so the probe card 6 Not only = the machining process of the groove is better, the probe provided by the yoke example 20 201018917 The needle set 50 has a probe substrate 8 〇 and a plurality of signal lines 62, which are provided by the first preferred embodiment. The difference is that the probe substrate 80 is formed by attaching an insulating material 81 to a support member 82 in an injection molding manner, wherein the first base portion 8 at the center of the support member 82 is identical to the first extension portion 822 around the periphery thereof. The support member 82 laterally attached to the first base portion 82 is formed on the side to form a ginseng 15 ❹ 20 base portion 811, and the plane method attached to the first extension portion 822 The branching member 82 is formed in the line direction to form a second extending portion 8J2. In the electrical connection, the second base portion 8U is provided with a plurality of conductive vias 83. The contact surface 813 of the second extending portion 812 is provided with a plurality of conductive contacts 84. The conductive contacts 84 are respectively The plurality of guide holes 83 are electrically connected to the guide holes 83. The ride group 5G is directly disposed on the support member, and is supported by the first base portion 821. The probes 51 of the probe set 5 are electrically connected. The guide hole 83 maintains the tip plane p of the probes 51 parallel to the bottom plane p of the struts 82. Therefore, the probe card 7 can be further supported by the bulge 82 as compared with the above embodiments. The structure effectively prevents the probe card 7 from affecting the stability of the probes 51 in a warm environment. It is to be noted that the insulating material provided by the above examples of the present invention can be attached to the supporting material (4) to be molded, so that the probe card not only provides the corresponding attachment of each part by the rigid body structure of the support = The insulating material resists the deformation factor caused by the two stresses, and the insulation with high resistance value is on the transmission path of the signal signal. The signal type and leakage current are now in the eyes of the support. When she discussed it, /, and then the test of the machine σ one side focused on wear resistance and impact resistance 15 201018917 5 15 mechanical strength characteristics considerations to effectively buffer the contact stress from the test head to avoid material wear For the touch of the component to be tested - the side is transmitted due to the signal to the probe ^ space is more dense ' needs to be more focused on the characteristics of anti-deformation, low leakage, so as the tenth - figure is not the fifth In the preferred embodiment, the probe card 8' has a probe set 90 and a signal line 60 as provided in the above preferred embodiment. The difference provided by the examples is as follows: probe base (four) sin-support 1 as __card 8 The body j is respectively extended on the two sides of the support member 91, and the first insulating material 93 and the f-insulating material 93 are successively attached to the supporting member 91=_the base portion 911 and one of the surrounding portions. a portion 912, the insulating material 92 has a heat resistance temperature higher than the second insulating material 93, and the top surface of the first insulating material 92 is attached to the branch material probe set: as the probe card 8 A test surface 921 is provided to set the support material ring 52, and the bottom surface of the second insulating material 93 is attached to one of the contact faces 931 of the test head card 8 of the measuring machine for power supply (4) setting township ^_== edge formation After that, it is at the top. t L conductive contact 94, of course, can also be formed as the first two in the above, and placed in the mold and the second insulating material 93 simultaneously to form the base of the second edge 6Q ff drum #材91 The 911 and the m _ _ are electrically connected to the probe 51 (four) point % and the first conductive contact 94 respectively disposed on the test surface 921; each of the probe sets 50 is connected to the second conductive The contacts 95 are located, and the pinholes p of the probes 51 are parallel to the test surface 921. r 20 201018917 and the insulating material 92 is higher than the second insulating material 93, so that the manufacturing condition is sufficient to withstand the subsequent temperature of the second insulating material to be i, and since the probe card 8 is actually used The process is often required to operate in a high temperature test condition, that is, if the :::8 is locally distinguished, except that the probe set 50 is directly closest to the first to be tested substrate 9G with the first insulating material 92 being μ. The environment is such that the heat-resistant product of the first-insulating material 92 can be flexibly selected from the second insulating material; and the number of the probe substrate 90 is set at the periphery of the second insulating material by the signal transmission process. One point = after receiving the test signal, the second conductive contact 95 of the first-insulating material 92 is adjacent to the =, and the adjacent conductive path is gradually reduced by the signal line 6 to cause the adjacent signal to be caused. Considering the influence factor of 4 丨L, the elastic factor of the first 纟 15 20% can be flexibly selected so that the second insulating material 93 is preferably selected from the 4 insulating material. == Lifting: The probe card 8 The probe substrate 9 is divided into two types: the material of the insulating material can be divided into two types: In view of all quality factors, the overall insulation material must be selected from the same material. Therefore, (4) effectively save the production cost while providing the probe card of the second quality bar = #然, where the first and second insulation materials 92, - conductive 5 points 特性 = characteristic considerations based on the difference between the first conductive contacts 94 and the second spacing, resulting in an environmental current path of the second conductive contacts 95, if:: ^ to reduce leakage due to smaller spacing The improved structure of the first preferred embodiment described above may not necessarily provide the difference between the insulating properties of the first insulating member 92 and the second insulating member 93. The above-described fifth preferred embodiment of 201018917 is provided by The first insulating material % is not provided with a conductive contact, so that the signal transmission path is received from the first conductive contact 94 and directly outputted to the probe set 53 through the signal line 61.
針54’因此可使該第—_材92之材質翻上僅需考量較 該第二絕緣材93有耐高溫之躲，更提升縣 彈性。 當然，本發明所提供具有低漏電及高強度特性之探針 卡於上述各較佳實施舉應狀騎並不限 =應:如垂直式探針及使用微機電製程之探針二 唯’以上所述者’僅為本發明之較佳可The needle 54' can thus turn over the material of the first material 92, and only needs to be considered to have higher temperature resistance than the second insulating material 93, thereby improving the elasticity of the county. Of course, the probe card provided with low leakage and high-strength characteristics of the present invention is not limited to the above-mentioned preferred embodiments, such as a vertical probe and a probe using a microelectromechanical process. Said 'only preferred for the present invention
異，如第十二圖所示本發明第六較佳實施例所提供之一探 針卡9，係提供一探針基板96配合如上述第二較佳實施例 所提供之該探針組53及訊號線61，其中該探針基板％較 15 =凡書及中請專利範圍所為之構 變化應l3在本發明之專利範圍内。 18 201018917 【圖式簡單說明】 第一圖係美國專利第5808475號所提供探針卡之結構 不意圖， 第二圖係習用一懸臂式探針卡之結構示意圖； 5 第三圖係習用探針卡之陶瓷電路板之結構示意圖； ' 第四圖係台灣專利公告第522449號所提供探針卡之結 構不意圖， © 第五圖係本發明所提供第一較佳實施例之組合立體示 意圖； 10 第六圖係第五圖中5-5連線之剖視圖； 第七圖係本發明所提供第二較佳實施例之結構示意 圖， 第八圖係本發明所提供第三較佳實施例之組合立體示 意圖， 15 第九圖係第八圖中9-9連線之剖視圖； ❹ 第十圖係本發明所提供第四較佳實施例之結構示意 圖， 第十一圖係本發明所提供第五較佳實施例之結構示意 • 圖， 20 第十二圖係本發明所提供第六較佳實施例之結構示意 圖。 【主要元件符號說明】 「第一較佳實施例」 19 201018917 4探針卡 40探針基板 402測5式區 42第一基部 5 422、432 底面 ' 44連接部 451探測面 ⑩ 46第二延伸部 47第一導電接點 ίο 50探針組 511針身 513針尾 521頂面 60訊號線 15 「第二較佳實施例」 φ 5探針卡 42第一基部 45第二基部 . 46第二延伸部 2〇 52固定環 54探針 「第三較佳實施例」 6探針卡 41支撐材 401探針區 41支撐材 421、431 頂面 43第一延伸部 45第二基部 452.通孔 461接觸面 48第二導電接點 51探針 512針尖 52固定環 522底面 P針尖平面 43第一延伸部 452通孔 49探針基板 53探針組 61訊號線 53探針組 20 201018917 61訊號線 71第二基部 721接觸面 73導電接點 5 「第四較佳實施例」 ' 7探針卡 50探針組 ❹ 62訊號線 81絕緣材 ίο 812第二延伸部 82支撐材 822第一延伸部 84導電接點 P’平面 15 「第五較佳實施例」 ❹ 8探針卡 50探針組 52固定環 . 90探針基板 20 911基部 92第一絕緣材 93第二絕緣材 94第一導電接點 P針尖平面 70探針基板 72第二延伸部 722溝槽 51探針 80探針基板 811第二基部 813接觸面 821第一基部 83導孔 P針尖平面 η平面法線方向 51探針 60訊號線 91支撐材 912延伸部 921測試面 931接觸面 95第二導電接點 21 201018917 「第六較佳實施例」 9探針卡 53探針組 54探針 61訊號線 5 93第二絕緣材 96探針基板 92第一絕緣材 94第一導電接點 參 22A probe card 9 according to a sixth preferred embodiment of the present invention, as shown in FIG. 12, provides a probe substrate 96 in cooperation with the probe set 53 provided in the second preferred embodiment. And the signal line 61, wherein the probe substrate % is less than 15 = the scope of the patent and the scope of the patent application is within the scope of the patent of the present invention. 18 201018917 [Simplified description of the drawings] The first figure is not intended to be a structure of a probe card provided in U.S. Patent No. 5,808,475, and the second figure is a schematic view of a structure of a cantilever type probe card; Schematic diagram of the structure of the ceramic circuit board of the card; 'The fourth figure is the structure of the probe card provided by Taiwan Patent Publication No. 522449. The fifth figure is a schematic perspective view of the combination of the first preferred embodiment provided by the present invention; 10 is a cross-sectional view of the fifth embodiment of the fifth embodiment; the seventh embodiment is a schematic view of the second preferred embodiment of the present invention, and the eighth embodiment is a third preferred embodiment of the present invention. 3 is a cross-sectional view of a line 9-9 in the eighth figure; 第十 10 is a schematic structural view of a fourth preferred embodiment of the present invention, and the eleventh figure is provided by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 20 is a schematic view showing the structure of a sixth preferred embodiment of the present invention. [Description of Main Components] "First Preferred Embodiment" 19 201018917 4 Probe Card 40 Probe Substrate 402 Measuring 5 Region 42 First Base 5 422, 432 Bottom '44 Connecting Port 451 Detection Surface 10 46 Second Extension Portion 47 first conductive contact ίο 50 probe set 511 pin 513 pin tail 521 top surface 60 signal line 15 "second preferred embodiment" φ 5 probe card 42 first base 45 second base. 46 second extension Part 2〇52 fixing ring 54 probe "third preferred embodiment" 6 probe card 41 support member 401 probe region 41 support member 421, 431 top surface 43 first extension portion 45 second base portion 452. through hole 461 Contact surface 48 second conductive contact 51 probe 512 needle tip 52 fixing ring 522 bottom surface P needle tip plane 43 first extension portion 452 through hole 49 probe substrate 53 probe group 61 signal line 53 probe group 20 201018917 61 signal line 71 Second base portion 721 contact surface 73 conductive contact 5 "Fourth preferred embodiment" '7 probe card 50 probe set ❹ 62 signal line 81 insulator ίο 812 second extension 82 support 822 first extension 84 Conductive contact P' plane 15 "Fifth preferred embodiment" ❹ 8 probe card 50 probe set 52 fixed 90 probe substrate 20 911 base 92 first insulating material 93 second insulating material 94 first conductive contact P pin tip plane 70 probe substrate 72 second extension portion 722 groove 51 probe 80 probe substrate 811 second base 813 contact surface 821 first base portion 83 guide hole P needle tip plane η plane normal direction 51 probe 60 signal line 91 support member 912 extension portion 921 test surface 931 contact surface 95 second conductive contact 21 201018917 "Sixth preferred implementation Example 9 Probe Card 53 Probe Set 54 Probe 61 Signal Line 5 93 Second Insulation Material 96 Probe Substrate 92 First Insulation Material 94 First Conductive Contact Point 22