CN101738511A

CN101738511A - Manufacturing method and structure of probe card

Info

Publication number: CN101738511A
Application number: CN200810177407A
Authority: CN
Inventors: 顾伟正; 何志浩; 宋宏志
Original assignee: MJC Probe Inc
Current assignee: MJC Probe Inc
Priority date: 2008-11-27
Filing date: 2008-11-27
Publication date: 2010-06-16

Abstract

The invention provides a probe card. The probe card has a probe substrate which attaches at least one insulation material to a support material in an injection molding mode; a conductive contact is arranged on the insulation material for transmitting test signals needed by the probe card; the characteristic of electrical insulation between conductive contacts adjacent to the conductive contact is achieved through the insulation material having high resistance characteristic; and the strength of the probe card is provided through the rigidity of the support material, so that the probe card can bear stress source directly received by the insulation material during tests, and simultaneously resists the deformation of the insulation material because of the environmental factors of temperature and stress changes so as to maintain the stability of the probe card.

Description

Probe making method and structure thereof

Technical field

The present invention is relevant with probe, is meant a kind of probe making method and structure thereof that effectively prevents the probe leakage problem especially.

Background technology

In the integrated circuit (IC) wafer test, probe circuit board in order to transmitted test signal is to supply the measuring head point of tester table to touch, with the test signal of acceptance test board and be sent on the probe of the nearly intensive setting in place, center in circuit board below, behind the wafer electronic component acceptance test signal that each probe corresponding point is touched, then by probe return pairing electrical specification to tester table for analysis, so in entire wafer level test process, the circuit transmission design of probe circuit board occupies very significant effects to the test result of electronic component, especially along with electronics technology tend towards superiority more speed running, test process need operate in the working at high speed condition of actual correspondence, so the making of transmission line more need meet the operating conditions of high speed signal.

With " low current measures the semiconductor probe card of usefulness " that Figure 1 shows that United States Patent (USP) is provided for No. 5808475, this probe 1 structural area is divided into the contact circuit plate 10 of top, the probe card 12 of below and several middle interval materials 14, wherein, contact circuit plate 10 is provided with the test contacts 11 as coaxial transmission line structure, can avoid contact circuit plate 10 dead resistances that media environment produced own to cause leakage problem, it is right because contact plate 10 is directly to supply the measuring head point of tester table 1 ' to touch, probe card 12 is for being provided with being provided with probe 13, if contact plate 10 or probe card 12 itself do not have enough support strengths and certain rigid body thickness, when tester table 1 ' presses down and imposes stress and desires in whole probe card 1 structure, contact plate 10 then produces the problem of deformation because of stressed contact plate 10 or the probe card 12 of making easily with the plane of constraint of probe card 12, moreover when 13 of each probes touch wafer plane, probe card 12 front ends then need constantly bear the reacting force that produces from wafer plane separately, so under the stress, probe card 12 front ends also are easy to generate deformation in order to the planar structure that probe 13 is set.

Even if can be illustrated in figure 2 as existing another probe 2 structures, its signals transmission for via the circuit of being laid on the multilayer board 20 21 from outside to inside and extension from top to bottom wear stacked circuit board 20, send by probe 22 then, so the overall construction intensity plane of constraint single with it of circuit board 20 can on average disperse this acting force when meeting with stresses, the stressed problem of deformation that produces takes place in permissible deformation model and reduce; Right multilayer board 20 is to form with the pressing of compound glass fiber material institute, be laid with metal wire rod on each layer structure to form lead 21 structures, so not only need expend suitable cost and man-hour on making, and when transmission line 21 is laid in circuit board inside, circuit board 20 materials between adjacent lines 21 is laid, if with existing is that glass fibre (FRP) material is an example, its volume resistance (Volume resistance) is about in 1013 ohm. centimetre, the as easy as rolling off a log main cause that causes leakage current, add the energy dissipation that interface reflection takes place when the via circuit 210 that is worn because of circuit board 10 each layer structure easily makes signal vertically transmit, so all have a strong impact on the transport property of high-frequency signal, and can't meet the high speed test demand of electronic circuit component.

Conduct in the leakage problem of substrate inside and the energy loss of inter-level dielectric when considering circuit, though the conducting wire can be laid in ceramic circuit board surface with high insulation resistance value and low-dielectric loss, connecing the probe of establishing with the center then directly electrically connects, to improve the leakage current between the transmission line, cross-talk phenomenon and medium absorption etc. influence the transmission quality and the reaction velocity problem of test signal, but with the process conditions that on ceramic base material, form the conducting wire of a probe 30 shown in Figure 3, be attached on the ceramic base material 32 after Copper Foil metal 31 back sides of full wafer need being attached adhesion glue, in the chemical etching mode Copper Foil metal 31 is patterned to signal transmission wire again, right chemical etching also can't be removed the adhesion glue at Copper Foil metal 31 back sides, there is gum residual between the lead and often make, form the path of leakage current between lead, thereby reduce the electrical measurement yield of integrated circuit and influence the efficient that integrated circuit (IC) wafer is made.

Even if be illustrated in figure 4 as No. 522449 disclosed a kind of probe 35 of TaiWan, China patent announcement, be propose with the mode of machining carve milled ceramic substrate 36 and on conducting metal 37 and form line pattern, make the gap between the circuit go deep into substrate 36 surfaces, exempted the residual problem of gum between the above-mentioned lead 38 simultaneously, and utilize air as the isolated medium of circuit, cooperate again ceramic substrate 36 have high rigidity, be difficult for the material of deformation and high-insulativity, with promote probe electrically and structural quality; Yet successively conducting metal 37 and ceramic substrate 36 are also processed simultaneously and need be finished stage by stage with different process conditions in the machining mode, more need accurate mechanical CONTROL PROCESS condition if desire on line construction, to do trickle change, so the increase of process complexity has then reduced the process efficiency of probe, therefore as how best probe card configuration, taking into account the probe material selects, may to reduce leakage current unnecessary in the electrical measurement environment, even can accomplish best coupling with process efficiency and cost expenditure, real is a big problem of the engineering of high precision measurement now.

Summary of the invention

Therefore, fundamental purpose of the present invention is to be to provide a kind of low electric leakage and high-intensity probe, the high-frequency test quality that effectively promotes probe with the cost expenditure of saving most and simple and easy, high efficiency technology.

Take off purpose for before reaching, a kind of probe provided by the present invention and preparation method thereof, this probe is to have a probe substrate and a probe groups, this probe substrate is for to make at least one insulation material depend on a fid with injection molding method, this fid is distinguished to be had one first base portion that is positioned at the center and is surrounded on this first base portion one first extension on every side, the insulation material that depends on this first base portion is one second base portion, the insulation material that depends on this first extension is one second extension, be defined as a probe region of this probe substrate corresponding to this first and second base portion, be defined as a test section of this probe substrate corresponding to this first and second extension, this test section is formed with two relative surfaces, be to be a bottom surface of this first extension and a surface of contact of this second extension, this surface of contact also is provided with a plurality of conductive junction points, this probe group is in this probe region, have a plurality of probes and electrically connect described conductive junction point respectively, by providing insulating material in order to described conductive junction point to be set with high value characteristic, make the adjacent characteristic that is electrically insulated of respectively reaching between this conductive junction point, efficiently solve test signal leakage current effects between the adjacent transmission signals when in dielectric material, transmitting, increase the rigidity of whole this probe probe region and test section again by the rigidity (stiffness) of this fid, this fid can together be out of shape with probe substrate, the stress that utilizes the fid distortion to produce is shared the acting force from conductive junction point and probe, or share the stress that in assembling or use, causes that causes from each element of probe itself, reduce this probe simultaneously and under the environmental factor of temperature variation, produce deformation, needing to be particularly suitable for the occasion of utmost point low-leakage current with the stability of keeping described probe, for example wafer is accepted test (Wafer AcceptanceTest) or high-frequency test.

Description of drawings

Below, conjunction with figs. is enumerated some preferred embodiments, in order to structure of the present invention and effect are elaborated, wherein:

Fig. 1 is the structural representation of No. 5808475 probe that provides of United States Patent (USP);

Fig. 2 is the structural representation of an existing cantalever type probe card;

Fig. 3 is the structural representation of the ceramic circuit board of existing probe;

Fig. 4 is the structural representation of No. 522449 probe that provides of TaiWan, China patent announcement;

Fig. 5 is the combination schematic perspective view of first preferred embodiment provided by the present invention;

Fig. 6 is the online cut-open view of 5-5 among Fig. 5;

Fig. 7 is the structural representation of second preferred embodiment provided by the present invention;

Fig. 8 is the combination schematic perspective view of the 3rd preferred embodiment provided by the present invention;

Fig. 9 is the online cut-open view of 9-9 among Fig. 8;

Figure 10 is the structural representation of the 4th preferred embodiment provided by the present invention;

Figure 11 is the structural representation of the 5th preferred embodiment provided by the present invention;

Figure 12 is the structural representation of the 6th preferred embodiment provided by the present invention.

Embodiment

Seeing also as Fig. 5 and shown in Figure 6, be the probe 4 that the present invention's first preferred embodiment is provided, is with the formed probe substrate 40 of following method, a probe groups 50 and many signal line 60:

A., one fid 41 is provided, be for being difficult for producing the high rigidity material of deformation, in U.S. material and (the American Society for Testing and Materials of test association, ASTM) define and have every square centimeter under the D790 testing standard greater than 100 kilograms bending strength (flexuralstrength) specification, general rigid structure such as steel, metal etc., or the base material such as the pottery of the use of available circuit plate, glass mats etc. roughly can meet the demand of this high rigidity, certainly if then can provide better tension with rigid structures such as stainless steel or aluminium alloys, anti-folding characteristic, have every square centimeter and define under the D638 testing standard every square centimeter greater than 2000 kilograms tensile strength (tensile strength) specification greater than 1000 kilograms bending strength specification and ASTM, this fid 41 is distinguished to be had one first base portion 42 that is positioned at the center and is surrounded on this first base portion 42 one first extension 43 on every side, this base portion 42 is to be formed with an end face 421 that is parallel to each other with extension 43,431 and one bottom surface 422,432, and the bottom surface 422 of this base portion 42 vertically is connected a plurality of connecting portions 44 with 431 of the end faces of extension 43;

B. a plurality of conducting metal pieces are inserted in the mould (among the figure not formula), and this fid 41 inserted from end face 421 directions of first base portion 42, described conducting metal piece is distributed in should first extension 43, the insulation material that utilizes high insulation resistance value characteristic again forms the main structure body of this probe substrate 40 with injection molding method, preferably, the insulation material is to use the volume impedance greater than 10 ¹⁴The material of Ω CM, that is this insulation material is to use made for the material of low electrical conductivity than this fid 41.Provide this insulation material in the present embodiment except insulation characterisitic with high volume resistance, have wear-resisting simultaneously, impact-resistant mechanical strength property, as Polyvinylchloride (PVC), polyester glue (PET), polyoxymethylene (POM), ABS resin, poly-diether ketone (PEEK), bakelite (BAKELITE), high-molecular polythene (UPE), tygon (PE), polypropylene (PP), polycaprolactam (Nylon 6), nylon steel (MC Nylon), the engineering plastics of Teflon (PTFE) or polycarbonate general common, inexpensive such as (PC), the insulation material that wherein depends between these first base portion, 42 bottom surfaces 422 and the described connecting portion 44 is one second base portion 45, the insulation material that depends on these first extension, 43 end faces 431 and described connecting portion 44 peripheries is one second extension 46, in order to make above-mentioned described signal wire 60 have enough spaces to be laid in this probe substrate 40, this second extension 46 and this first and

second base portion

42,45 mutually the place of adhering to be separated with suitable distance mutually, can and pass between the described connecting portion 44 for described signal wire 60 ccontaining distributions, corresponding to this first and

second base portion

42,45 are defined as a probe region 401 of this probe substrate 40, this probe region 401 is formed with two relative surfaces, be the end face 421 of this first base portion 42 and a test surface 451 of this second base portion 45, corresponding to this first and

second extension

43,46 are defined as a test section 402 of this probe substrate 40, this test section 402 is formed with two relative surfaces, be the bottom surface 432 of this first extension and a surface of contact 461 of this second extension 46, described conducting metal is a plurality of first conductive junction points 47 that expose to this surface of contact 461, in order to make fid better with the combination of insulation material, can on fid, hole in advance, fixing mode can be to get out a plurality of holes on reinforced structure in advance, the material ejection formation insulate to one to reinforced structure again, and allow this insulation material enter in the described hole, after the insulation material is solidified into substrate, insulation material in the described hole also is solidified into a plurality of outstanding, stretch into described hole, can the fixed support material and the insulation material, also can use screw in addition, glue is fixed on the insulation material on the fid;

C. around second base portion 45 of this probe substrate 40, wear a plurality of through holes 452 with annular distribution, and this test surfaces 451 embeds a plurality of second conductive junction points 48 in this through hole 452 respectively certainly, again described signal wire 60 is electrically connected this first conductive junction point 47, after between the connecting portion 44 of this fid 41, penetrate described through hole 452 to electrically connect this second conductive junction point 48;

D. the cantalever type probe 51 and for preparing a plurality of tool satisfactory electrical conductivities has the set collar 52 of insulation characterisitic, the needle body 511 of this probe 51 respectively is adhered to this set collar 52, make end face 521 that the needle point 512 of this probe 51 respectively protrudes these set collars 52 for 52 of this set collars around and the common needle point plane P that forms of tip end, therefore make this probe groups 50, respectively the needle point 512 of this probe 51 has the arm of force length of suitable distance from this set collar 52, provides described needle point 512 that suitable elastic-restoring force is arranged when point touches element under test;

E. the bottom surface 522 of this set collar 52 is established to the test surfaces 451 of this second base portion 45 for 48 of described second conductive junction points around, respectively the backshank 513 of this probe 51 electrically connects this second conductive junction point 48 again, makes the needle point plane P of described probe 51 be parallel to the bottom surface 432 of this first extension 43 and the test surface 451 of this second base portion 45.

Therefore utilize this probe 4 of said method made, aim at the bottom surface 432 of this first extension 43 and the plane parallel degree of wafer to be measured in the operation at the beginning earlier, make the measuring head point of electrical measurement board touch described first conductive junction point 47 of these 402 peripheries, test section again, receive by described first conductive junction point 47 with output test signal to this probe 4, be sent to second conductive junction point 48 of this probe region 401 so that this probe 51 via described signal wire 50, can export test signal to the measured electronic elements that touches wafer of putting by described probe 51, and, can when surveying, reach the excellent electrical property contact jointly because described probe 51 has common needle point plane P; In addition, because in order to this second base portion 45 and second extension 46 that described conductive junction point 47,48 is set is made with the insulating material of high value, make adjacently respectively between this first conductive junction point 47 and adjacently respectively reach the characteristic that is electrically insulated between this second conductive junction point 48, efficiently solve test signal leakage current effects between the adjacent transmission signals when in dielectric material, transmitting; And signal is for vertically to run through this probe substrate 40 with described signal wire 60, need not pass through inter-level dielectric on the path, therefore unlikely generation is consumed problem as the dielectric consume and the through-hole construction face of existing multilayer board in the energy reflection of inter-level dielectric, make this probe 4 keep the good signal impedance matching property, have the constant low-loss high frequency signal transmitting quality in order to the high-frequency test process; Moreover, with this probe substrate 40 of ejection formation in manufacture process or as the structural strength behind the finished product a little less than, its operable Material Strength is relatively poor, tensile strength every square centimeter below 1000 kilograms or bending strength at every square centimeter below 2000 kilograms, the intensity of these probe 4 probe region 401 and test section 402 is provided by the rigid body characteristic of this fid 41, to bear 451 stress source that directly receive of this surface of contact 461 and test surface, avoid this probe 4 under the environmental factor of temperature variation, to produce deformation and make probe 51 needle points layout also with distortion, effectively keep the accuracy that probe 51 needle points are arranged, the layout that also can avoid first conductive junction point 47 also with distortion make to link between probe 4 and the tester table and be affected, effectively keep the reliability of electrically connect between probe 4 and the tester table, therefore this probe 4 not only has good electrical measurement reliability, needing to be particularly suitable for the occasion of utmost point low-leakage current, for example wafer is accepted test (Wafer AcceptanceTest) or high-frequency test, more replace existing stupalith simultaneously because of intensity and the insulation characterisitic that is had with this probe substrate 40, and its manufacture that penetrates the shape type is minimized manufacturing time and cost, and the relative minimizing of expenditure of probe cost of manufacture and the engineering of making circuit are simplified relatively.

Certainly, in the through hole 452 of this second base portion 45 described second conductive junction point 48 being set in the foregoing description is for electrically connecting the function of described probe 51 and signal wire 60, the convenient described probe 51 of adapter that can any tool metallic conduction characteristic is locked in through hole 452 in welding firm on the test surface 451 and convenient described signal wire 60 and is established, if better signal transmission characteristics consider, except the coaxial transmission line that described signal wire 60 can have the high-frequency transmission characteristic made, described second conductive junction point 48 is also selected the coaxial fitting with described signal wire 60 impedance matchings for use, what is more, probe 5 that can also second preferred embodiment provided by the present invention as shown in Figure 7, has a probe substrate 49, one probe groups 53 and a plurality of signal wire 61, the difference that is provided with above-mentioned first preferred embodiment is:

Though this probe substrate 49 same step a with the foregoing description, b forms first,

second base portion

42,45 and extension 43,46,452 confessions of through hole that so are formed at this second base portion 45 respectively this signal wire 61 wear and extend to this probe groups 53 and directly electrically conduct with each probe 54, in the signal wire 61 that when high frequency measures demand, signal is transmitted to mostly to have the high-frequency transmission characteristic, just export signal to probe 54 until set collar 52 with probe 54 electric connections near probe groups 53, more can save setting, reduce any interface reflection factor of signal transduction process as second conductive junction point 48 as described in the above-mentioned embodiment.

See also as Fig. 8 and Figure 9 shows that the probe 6 that the present invention's the 3rd preferred embodiment is provided, except probe groups 53 and the signal wire 61 that is provided as above-mentioned second preferred embodiment is provided, one probe substrate 70 is more arranged, and the difference that is provided with above-mentioned second preferred embodiment is:

Though this probe substrate 70 is similarly with injection molding mode this fid 41 that material depends on to be provided as above-mentioned embodiment step a that will insulate, have by insulation one second base portion 71 and one second extension 72 that material constituted, right this second extension 72 has from a surface of contact 721 towards a plurality of grooves 722 that inner predetermined depth was arranged with, also embedding a plurality of conductive junction points 73 on this surface of contact 721 electrically connects for described signal wire 61, because adjacent respectively have this groove 722 between this conductive junction point 73, utilize groove 722 formed recesses can hold the characteristic of air, then can be by air as increasing the adjacent insulation resistance value that respectively may form drain current path between this conductive junction point 73 at interval, thereby promote the adjacent respectively electrically isolated effect between this conductive junction point 73, simultaneously, when described groove 722 also can be avoided operating personnel's contact probe card 6, form adjacent respectively leakage current factor between this conductive junction point 73 because of spot is residual, more can effectively reduce drain current path between the signal transmission than the foregoing description, and described groove 722 has completed when insulation material one ejection formation, can remove as shown in Figure 4 the machining that needs to form groove on ceramic circuit board as the existing probe from makes, therefore make this probe 6 not only have low electric leakage, dynamical signal transmitting quality more can form high-quality probe card configuration with the easy production method of manufacturing materials utilization cheaply.

A probe 7 that is provided for the present invention's the 4th preferred embodiment as shown in figure 10 is provided, except the probe groups 50 that is provided as above-mentioned first preferred embodiment is provided, have more a probe substrate 80 and many signal line 62, the difference that is provided with above-mentioned first preferred embodiment is:

It is made that this probe substrate 80 depends on a fid 82 in the injection molding mode with an insulation material 81, wherein first base portion 821 at these fid 82 centers has a common plane P with its first extension 822 on every side on the same side ', this fid 82 that depends on this first base portion 821 with side direction forms one second base portion 811, and this fid 82 that depends on the plane normal direction n of this first extension 822 forms one second extension 812.

On electrically connecting, this second base portion 811 provides the guide hole 83 of a plurality of tool electric conductivity, the surface of contact 813 of this second extension 812 is provided with a plurality of conductive junction points 84, described conductive junction point 84 electrically connects by described signal wire 62 and described guide hole 83 respectively, this probe groups 50 directly is located on this fid 82 and is supported by first base portion 821, each probe 51 of this probe groups 50 electrically connects this guide hole 83, and the needle point plane P of keeping described probe 51 is parallel to the base plane P ' of this fid 82, therefore than the various embodiments described above, this probe 7 more can effectively avoid this probe 7 to influence the stability of described probe 51 under the environmental factor of temperature variation by the rigid structure of this fid 82.

What deserves to be mentioned is, the insulation material that above-mentioned each example of the present invention provided is to be all can supply to depend on fid and ejection formation, make probe not only by the rigid structure of fid provide each position corresponding insulation material opposing of adhering to be heated, the deformation factor that may cause by stress, and reach interference and the leakage phenomenon that prevents adjacent signals on the signal transmission path with insulation characterisitic with high value, as for if when discussing with respect to the thin portion in the insulation material position of fid both sides, the side that the measuring head point of power supply survey board touches is emphatically with wear-resisting, impact-resistant mechanical strength property is considered, make effective buffering avoid the wearing and tearing of material from the contact stress of measuring head, a side of touching element under test for point is then higher because of the space closeness that signal transfers to before the probe, need more emphatically with anti-deformation, the characteristic of low electric leakage is considered, so probe 8 that can be provided for the present invention's the 5th preferred embodiment as shown in figure 11, except probe groups 50 and the signal wire 60 that is provided as above-mentioned first preferred embodiment is provided, have more a probe substrate 90, the difference that is provided with above-mentioned first preferred embodiment is:

This probe substrate 90 is with the supportive body of a fid 91 as this probe 8, in the both sides of this fid 91 respectively one first insulation material 92 and one second insulation material 93 are successively depended on injection molding method these pairing base portions 911 of fid 91 central authorities and around a pairing extension 912, wherein this first insulation material 92 has than this second insulation material 93 and is high heat resisting temperature and insulation resistance value, the end face of this first insulation material 92 depends on this fid 91, its bottom surface then is provided with being provided with the set collar 52 of this probe groups 50 as a test surfaces 921 of this probe 8, the bottom surface of this second insulation material 93 depends on this fid 91, its end face touches as a surface of contact 931 of this probe 8 measuring head point for the electrical measurement board, therefore promptly a plurality of first conductive junction points 94 are set after this second insulation material 93 forms in end face 931, certainly also can as place in advance as above-mentioned first embodiment mould and this second insulation material 93 simultaneously ejection formation to make; Described signal wire 60 runs through the base portion 911 of this fid 91 and this first insulation material 92, and two ends electrically connect this test surfaces 921 set second conductive junction point 95 and this first conductive junction point 94 respectively; Each probe 51 of this probe groups 50 electrically connects this second conductive junction point 95, and the needle point plane P of described probe 51 is parallel to this test surfaces 921.

Because having than this second insulation material 93, this first insulation material 92 is high heat resisting temperature, therefore be enough to bear follow-up hot environment on the manufacturing conditions with these second insulation material, 93 ejection formations, and since these probe 8 reality in order to the test process often element under test need operate in the high temperature test condition, also even to these probe 8 each local differentiations, except this probe groups 50 is directly with element under test contacts, this probe substrate 90 be the temperature environment of the most approaching heating test with the first insulation material 92, so that but elasticity selects for use this first heat-resisting quality that insulate material 92 to make is preferable in this second material 93 that insulate; Moreover, consider with signals transmission, from these probe substrate 90 peripheries behind set first conductive junction point, the 94 acceptance test signals of the second insulation material 93, through this signal wire 60 towards these probe substrate 90 central distribution to the second set conductive junction point 95 of this first insulation material 92, the adjacent signals spacing is to dwindle gradually in transmission path, cause the influence of leakage current factor that need consider between adjacent signals with increase, so but that elasticity selects for use insulation characterisitic of this first insulation material 92 to make is preferable in this second insulation material 93.

Therefore present embodiment provides the production method of the probe substrate 90 of this probe 8 with twice ejection formation, make the material of insulation material select for use and can divide two kinds to consider, the material of avoiding based on taking into account all quality factors integral insulation material all must select for use similarity condition to limit is so provide the probe of high-quality condition when can effectively save cost of manufacture; Certainly, wherein first and second the

insulation material

92,93 different insulative characteristic is considered the spacing difference that is based on described first conductive junction point 94 and second conductive junction point 95, cause the environmental medium condition of second conductive junction point 95 higher resistance need be arranged to reduce the drain current path that may exist because of littler spacing, if use the difference that the structure-improved of above-mentioned second preferred embodiment can needn't limit this first insulation material 92 and the second insulation material, 93 insulation characterisitics, the probe 9 that provided of the present invention's the 6th preferred embodiment as shown in figure 12, provide this probe groups 53 and the signal wire 61 that probe substrate 96 cooperates as above-mentioned second preferred embodiment is provided, wherein this probe substrate 96 above-mentioned the 5th preferred embodiment provided then for not being provided with conductive junction point in this first insulation material 92, the transmission path that can make signal is for receiving the back directly exports this probe groups 53 to by this signal wire 61 probe 54 from this first conductive junction point 94, this first material that insulate material 92 is selected for use only need be considered than this second insulation material 93 has resistant to elevated temperatures characteristic, more promotes the elasticity that process materials is selected.

Certainly, probe that the probe with low electric leakage and high-strength characteristic provided by the present invention is stuck in above-mentioned each preferable enforcement institute exemplary application is not limited to the cantalever type probe structure, such as vertical probe and use the probe of micro electronmechanical technology also to have the application of equivalence.

Only, above-described, only be preferable possible embodiments of the present invention, so the equivalent structure that every application instructions of the present invention and claim are done changes, ought to be included in the claim scope of the present invention.

Claims

1. probe making method includes:

A., one fid is provided;

B., at least one insulation material is provided, makes this insulation material depend on this fid and form a probe substrate with injection molding method, this probe substrate has a relative bottom surface and a surface of contact, and this surface of contact is provided with a plurality of conductive junction points; And,

C., a plurality of probes are provided, are fixed in this bottom surface, and make respectively that this probe electrically connects a signal wire to electrically connect this conductive junction point by this signal wire.

2. according to the described probe of claim 1 making method, this fid has this bottom surface, and among the step b, this insulation material has this surface of contact.

3. according to the described probe of claim 2 making method, among the step b, wear a plurality of through holes in this insulation material, respectively this signal wire is to electrically connect this conductive junction point and wear to this through hole in this surface of contact.

4. according to the described probe of claim 3 making method, the set conductive junction point of this surface of contact is first conductive junction point, among the step b, respectively also be provided with one second conductive junction point on this through hole, respectively these signal wire two ends connect respectively and establish this first and second conductive junction point, among the step c, described probe electrically connects respectively this second conductive junction point respectively.

5. according to the described probe of claim 2 making method, among the step b, this insulation material is equipped with the perforation of a plurality of tool electric conductivity, and respectively these perforation two ends electrically connect this signal wire and this probe respectively.

6. according to claim 3 or 4 or 5 described probe making methods, this fid has one first extension and a plurality of connecting portion that are surrounded on around one first base portion and links this first base portion and first extension, this first extension has this bottom surface, among the step b, be once to penetrate with the single insulating material to form one second base portion and one second extension, be respectively and depend on this first base portion and first extension, this second base portion and second extension are in respectively being connected mutually between this connecting portion.

7. according to the described probe of claim 6 making method, first base portion of this fid has a bottom surface, among the step b, this second base portion is the bottom surface that depends on this first base portion, among the step c, also provide a set collar with insulation characterisitic to be located at this second base portion, respectively this probe needle point of being located at this set collar and probe for this set collar institute around.

8. according to the described probe of claim 6 making method, the bottom surface of this fid is positioned at this first base portion and this first extension, and among the step b, this second base portion is to depend on this first base portion along the direction that is parallel to this bottom surface.

9. according to the described probe of claim 1 making method, among the step b, this fid wears a plurality of through holes, and respectively this signal wire is to electrically connect this conductive junction point and wear to this through hole in this surface of contact.

10. according to the described probe of claim 1 making method, among the step b, be to have one first and one second insulation material to penetrate with secondary to form a base portion and an extension respectively, this extension is surrounded on around this base portion, and this extension has this surface of contact.

11. according to the described probe of claim 10 making method, it is high heat resisting temperature that this first insulation material has than this second insulation material, among the step b, is successively to depend on this fid ejection formation with this first and second insulation material.

12. according to claim 10 or 11 described probe making methods, it is high resistance value that this first insulation material has than this second insulation material, among the step b, this base portion wears a plurality of through holes, the set conductive junction point of this surface of contact is first conductive junction point, and respectively this through hole is in last one second conductive junction point that also is provided with, and respectively these signal wire two ends are to connect respectively to establish this first and second conductive junction point, among the step c, described probe is located at respectively this second conductive junction point respectively.

13. according to the described probe of claim 1 making method, among the step b, this insulation material also is formed with a plurality of grooves, is to be concaved with the predetermined degree of depth towards inside from this surface of contact, respectively this groove is between adjacent two these conductive junction points.

14. according to the described probe of claim 13 making method, among the step b, described conductive junction point is to be formed at this surface of contact in the time of this at least one insulation material ejection formation, and this surface of contact embeds certainly the predetermined degree of depth, and the degree of depth of this conductive junction point in this surface of contact towards inside is less than the degree of depth of this groove.

15. according to the described probe of claim 1 making method, this fid is made with the high rigidity material that be difficult for to produce deformation, has every square centimeter greater than 100 kilograms bending strength specification under the testing standard of U.S. material and test association.

16. according to the described probe of claim 15 making method, this fid be select with materials such as stainless steel, metal, pottery or glass fibre one made.

17. according to the described probe of claim 15 making method, this fid is to be that every square centimeter of material greater than 1000 kilograms is made with the bending strength specification.

18. according to claim 15 or 17 described probe making methods, the made material of this fid in the tensile strength specification of ASTM be for every square centimeter greater than 2000 kilograms.

19. a probe includes:

One probe substrate makes at least one insulation material depend on a fid with injection molding method, and this probe substrate is formed with a relative bottom surface and a surface of contact;

A plurality of conductive junction points are located at this surface of contact; And,

One probe groups is located at this bottom surface, has a plurality of probes, and described probe electrically connects described conductive junction point, and the needle point of described probe is positioned on the needle point plane.

20. according to the described probe of claim 19, this insulation material is equipped with many signal line, respectively this probe electrically connects this conductive junction point by this signal wire.

21. according to the described probe of claim 20, described conductive junction point is first conductive junction point, this insulation material is provided with a plurality of second conductive junction points, and respectively these signal wire two ends are arranged in this first and second conductive junction point respectively, and respectively this probe is located at this second conductive junction point.

22. according to the described probe of claim 19, this insulation material is equipped with the perforation of a plurality of tool electric conductivity, respectively these perforation two ends electrically connect a signal wire and this probe respectively, and this signal wire electrically connects this conductive junction point.

23. according to claim 20 or 21 or 22 described probe, this probe substrate is once to penetrate with the single insulating material to form a base portion and an extension, this extension is surrounded on around this base portion.

24. according to the described probe of claim 19, this fid is penetrated with a plurality of through holes, respectively this through hole is provided with a signal wire, and respectively this probe electrically connects this conductive junction point by this signal wire.

25. according to the described probe of claim 24, this probe substrate is to penetrate with one first and one second insulation material secondary to form a base portion and an extension respectively, this extension is surrounded on around this base portion.

26. according to the described probe of claim 19, this insulation material is with made for the material of low electrical conductivity than this fid.

27. according to the described probe of claim 19, this insulation material is to use the volume impedance greater than 10 ¹⁴The material of Ω CM is made.