201111790 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種高頻垂直式探針卡結構，尤其是具有用導 電材料與空氣(或真空）包圍探針本體並用絕緣材料支撐的結構。 【先前技術】 近年來，包含積體電路的晶片已具有越來越複雜功能，且隨 春著應用上的普及’許多晶片的使用數量相當魔大，往往在數百萬 或數千萬社，而為確保晶片㈣氣品f，⑸被封裝前先 • 進行晶片級量測，以避免浪費封裝資源。-般晶片級量測係使用 k針卡（pr〇be card) ’利用探針卡的探針接觸晶片的測試點，比 如焊塾’壯㈣卡的電路板將電氣㈣連制測試機 (Tester) ’使職機傳送職細號到晶片或接收晶片的輸出信 號’藉以量測晶片的電氣特性，同時剔除不良晶片而筛選出合格 籲的日日片’以進订後續的封裝處理。成熟的商品化探針卡有懸臂式 探針(⑽u· probe)與垂蚊探針卡(Vert —加以c㈣。 〃參閱第―®’㈣技術彈簧垂直式探針卡結構的示意圖。如 第圖所不’習用技術的彈簧探針卡結構包括電路板卜固定模組 2以及探針3 ’其中探針3具有探針尖端4，用以接觸晶片（圖中未 顯示）的測試點，探針3係電氣連接至電路板卜且電路板i進一 步連接至外部測試機（圖中未顯示），因此，外部測試機可藉由探 ’十3傳導電而對晶片進行電氣量測。固定模組2提供固定 201111790 探針3的功能’以加強探針3的機械強度與操作穩定性，避免探 針3接觸到晶片的職點時發生損壞。此外，探針3接觸到測試 點所承受的外力可藉與探針3連結的賴财未顯示）而緩衝， 確保探針3對測試點的施力不過大而壓壞測試點。 習用技術的缺點是，探針3中除探針尖端4外的其餘部分具 有相當大比縦裸露於空氣中’造成高頻電氣錢經探針3傳輸 時易受外在雜訊干擾且會改變探針3的高頻阻抗，使得量測的广 •號摻有外在雜訊，且使得阻抗匹配不易達成，因而影響量測的精 確度。因此，需要-種同時能提高對外在雜訊干擾之抵抗能力以 _及具有⑥娜祕配之概的高直式彈簧辆卡結構，藉以 - 解決上述習用技術的缺點。 曰 【發明内容】 本發明之主要目的在提供—種高麵直式探針卡結構，包括 至少-探針以及由上而下堆疊的電路板、第—絕緣材料、導電材 料本體、空氣以及第二絕緣材料，探針貫穿第—絕緣材料、導電 =體、空氣以及第二絕緣材料’並裸露出探針尖端用以接觸 =4^關試點’探針連接料触電顿，使龍針能在 2編则糊嶋錢，_物被導電材 ^本，圍’祕顺導電材料本體之間具有_，使探針本體 作為介質，提供探針本體具有低介電特性傳導，進而改 —頻電氣信號的傳輸品質’提高對待測試晶片的測試精確度。 201111790 本發明之另一目的在提供一種高頻垂直式探針卡結構，利用 探針本體的橫向尺寸大於棟針尖端的橫向尺寸，而以第二絕緣材 料支撐探針本體，以隔絕開待測試晶片的測試點與導電材料本 體’提供電氣絕緣而避免發生短路。 【實施方式】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency vertical probe card structure, and more particularly to a structure in which a probe body is surrounded by a conductive material and air (or vacuum) and supported by an insulating material. [Prior Art] In recent years, wafers containing integrated circuits have become more and more complicated, and with the popularity of spring applications, the number of wafers used is quite large, often in the millions or tens of millions of companies. In order to ensure the wafer (4) gas f, (5) before the package is first • wafer level measurement to avoid wasting package resources. The general wafer level measurement system uses a k-pin card (pr〇be card) 'use the probe card probe to contact the test point of the wafer, such as the soldering plate 'strong (four) card's circuit board will be electrical (four) continuous test machine (Tester The 'output signal of the job number to the wafer or the receiving chip' is used to measure the electrical characteristics of the wafer, while rejecting the defective wafer and screening out the qualified day-to-day film to order the subsequent packaging process. The mature commercial probe card has a cantilever probe ((10) u· probe) and a mosquito probe card (Vert — with c (4). 〃 See the schematic of the “®” (4) technology spring vertical probe card structure. The spring probe card structure of the conventional technology includes a circuit board fixing module 2 and a probe 3 'where the probe 3 has a probe tip 4 for contacting a test point of a wafer (not shown), a probe The 3 series is electrically connected to the circuit board, and the circuit board i is further connected to an external test machine (not shown). Therefore, the external test machine can electrically measure the wafer by detecting the '13 conductive power. 2 Provides the function of fixing the 201111790 probe 3' to strengthen the mechanical strength and operational stability of the probe 3, and avoid damage when the probe 3 contacts the position of the wafer. In addition, the probe 3 is exposed to the external force of the test point. It can be buffered by the money that is connected to the probe 3, which is not shown. It is ensured that the force applied by the probe 3 to the test point is not too large and the test point is crushed. A disadvantage of the conventional technique is that the rest of the probe 3 except the probe tip 4 is considerably larger than that exposed to the air', causing high frequency electrical money to be susceptible to external noise interference and will change when transmitted through the probe 3. The high-frequency impedance of the probe 3 makes the measured wide-band doped with external noise, and makes the impedance matching difficult to achieve, thus affecting the accuracy of the measurement. Therefore, it is necessary to have a high-straight spring card structure capable of improving the resistance to external noise interference and having a 6-nano secret, thereby solving the disadvantages of the above-mentioned conventional techniques. SUMMARY OF THE INVENTION The main object of the present invention is to provide a high-profile straight probe card structure comprising at least a probe and a circuit board stacked from top to bottom, a first insulating material, a conductive material body, air, and a first Two insulating materials, the probe penetrates through the first-insulating material, the conductive body, the air, and the second insulating material' and exposes the probe tip for contact = 4^ off the pilot' probe connection material to make the dragon needle In the 2 series, the money is smeared, the material is electrically conductive, and there is a _ between the body of the conductive material, so that the probe body acts as a medium, and the probe body has low dielectric property conduction, and then the frequency is changed. The transmission quality of electrical signals 'increased the test accuracy of the wafers to be tested. 201111790 Another object of the present invention is to provide a high frequency vertical probe card structure, wherein the probe body has a lateral dimension larger than a lateral dimension of the tip end of the pin, and the probe body is supported by the second insulating material to be isolated for testing. The test points of the wafer are electrically insulated from the body of conductive material to avoid short circuits. [Embodiment]
以下配合圖式及元件符號對本發明之實施方式做更詳細的說 明，俾使熟習該項技藝者在研讀本說明書後能據以實施。 參閱第二目’本發明高麵直式探針切_示意圖。如第 二圖所示’本發明的高頻垂直式探針卡結構包括至少一探針ι〇、 電路板20、第一絕緣材料30、導電材料本體40 u及第二絕緣材 料70 ’用以傳導待測試晶片9〇的測試點議的高頻電氣信號，藉 以進行量測，其中測試點副可為焊墊。為方便說明本發明的特 點，第二圖中只顯示出單—探針，不過要注意的是，本發 圍係包括一個或多個探針。 探針10具有採針尖端12、探針本體14與探針連接部^ 針尖端12連接至探針本體14的—端，比如圖中的下端，且細 連接部16連接至探針本體14的另—端，比如圖中的上端，探金 10内具有彈簧及可.f折材料等（圖中未顯示）的其中至少—種。 探針本體14的橫向尺寸大於探針尖端12的橫向尺寸，比如 ‘針賴14的寬度或餘大於探針尖端12的寬度或直徑。 弟一絕緣材料30位於電路板2〇底下，且具具有第—通孔， 201111790 板針連接部16貫穿第-通孔而連接至電路板2q。導電材料本體 —於第、，巴緣材料30底下，且具有一腔體5〇。腔體5〇位於第 一絕緣材料30的第-通孔底下與探針本體14係配置於腔體5〇 且腔㈣之賴探針本體14之間具咖，而該間隙為 具空或包含空氣。為進一步清楚 n 疋】解这特點，凊配合參閱第三圖， 一圖AA横截面的斷面示意圖，1巾 ，、針本體14是位於由導 噶材料本體40所形成之腔體5〇内， 铋針本體14與導電材料本 40係刀離開而不相互接觸。 假設探針本體14的直徑為d及腔體 外友认入 勹11汉股體50的内徑為D，且真空或 的，，電常數為er，則探針的阻抗2〇為： 、 60 d I r .... 1111 _ι 丨 % Λ —·ΐ?Ιι1Ι丨·眶屋 vsr dThe embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Referring to the second item, the high-profile straight probe of the present invention is cut away. As shown in the second figure, the high frequency vertical probe card structure of the present invention includes at least one probe ι, the circuit board 20, the first insulating material 30, the conductive material body 40 u and the second insulating material 70 ′. The high-frequency electrical signal of the test point of the test wafer 9 is transmitted, thereby performing measurement, wherein the test point pair may be a solder pad. For convenience of description of the present invention, only the single-probe is shown in the second figure, but it should be noted that the present invention includes one or more probes. The probe 10 has a needle tip 12, a probe body 14 and a probe connecting portion, the needle tip 12 is connected to the end of the probe body 14, such as the lower end in the drawing, and the thin connecting portion 16 is connected to the probe body 14. The other end, such as the upper end of the figure, has at least one of a spring and a foldable material (not shown) in the gold detector 10. The lateral dimension of the probe body 14 is greater than the lateral dimension of the probe tip 12, such as 'the width or balance of the needle 14 is greater than the width or diameter of the probe tip 12. The insulating material 30 is located under the circuit board 2 and has a first through hole, and the 201111790 board pin connecting portion 16 is connected to the circuit board 2q through the through hole. The body of conductive material is under the first, rim material 30 and has a cavity 5 〇. The cavity 5 is located under the first through hole of the first insulating material 30, and the probe body 14 is disposed between the cavity 5 and the cavity (4) between the probe body 14 and the gap is empty or included. air. To further clarify the characteristics of the 疋 凊 凊 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 参阅 AA AA AA AA AA AA AA AA AA AA AA The cymbal body 14 and the conductive material 40 knives leave without contacting each other. Assuming that the diameter of the probe body 14 is d and the inner diameter of the outer body of the probe body is D, and the vacuum is or, the electrical constant is er, the impedance of the probe is 2〇: 60 d I r .... 1111 _ι 丨% Λ —·ΐ?Ιι1Ι丨·眶屋vsr d
Zo 其中Ln為自然對數(Natural L〇g)。 料真空)包圍或被作為介質的空氣(亦即間：4(亦即間 時’探針本體14具有低介電特性傳導。 1真滿）包圍 第二絕緣材料70位於導電材料本體4〇底下， :，探針尖端12貫穿第二通孔，用以接觸或接近待二有第二通 1〇0 ° 70 , ；； 5'^ 90 =針___。所產生的：： 本體14，亚由探針1Q内的彈簧及可f折材料等的叹幻木針 以緩衝該外力，以避免損壞測試點100。 /、至少-種， 201111790 第-絕緣材料30包括電氣絕緣性塑膠材料或陶究材料，比如 商品為密拉(Mylar)的聚醋材料。導電材料本體4〇包括導電金屬 或導電合金’比如銅或銅合金。第二絕緣材料7()包括電氣絕 娜材料或陶赌料，比如商品為密拉(Mylar)的聚醋材料。 上述本發_特點在於，_導電材料本體4()包圍探針本體 14 ’以提*騎對外界環境與電氣錢的干擾能力，同時利用探 針本體14的橫向尺寸大於探針尖端12的橫向尺寸而藉第二絕緣 材料7〇的機顧度讀探針本體14,並提供絕緣以隔絕開導 電材料本體40與測試點1〇〇。 以上所述者僅為用以解釋本發明之較佳實施例，並非企圖據 以對本發明齡何形式上之_，是以，凡有在相同之發明精神 下所作有關本發明之任何修倚或變更，皆仍應包括在本發明 保護之範疇。 【圖式簡單說明】 第-圖為技術彈簧探針卡結構的示意圖。 第二圖為本發明高麵直式探針卡結構的示意圖。 第三圖為本發明高頻垂直式探針卡結構的斷面示意圖。 【主要元件符號說明】 1電路板 2固定模組 3探針 201111790 4探針尖端 10探針 12探針尖端 14探針本體 16探針連接部 20電路板 30第一絕緣材料 • 40導電材料本體 50腔體 ， 70第二絕緣材料 9 0待測試晶片 100測試點(焊墊)Zo where Ln is the natural logarithm (Natural L〇g). The air that surrounds or is used as a medium (ie, between: 4 (ie, the probe body 14 has a low dielectric property to conduct. 1 true) surrounds the second insulating material 70 under the conductive material body 4 , :, the probe tip 12 extends through the second through hole for contacting or approaching the second pass 1〇0° 70; ; 5'^ 90 = pin ___. Generated by: body 14, sub The external force is buffered by a spring in the probe 1Q and a slanting wood needle such as a f-fold material to avoid damage to the test point 100. /, at least -, 201111790 The first insulating material 30 includes an electrically insulating plastic material or ceramic The material, such as the polyester material of Mylar, the conductive material body 4〇 includes a conductive metal or a conductive alloy such as copper or copper alloy. The second insulating material 7 () includes an electrical material or a ceramic material. For example, the product is a polyester material of Mylar. The above-mentioned feature is that the body 4 of the conductive material surrounds the probe body 14' to improve the ability of the rider to interfere with the external environment and electric money. The lateral dimension of the probe body 14 is greater than the lateral dimension of the probe tip 12 The second insulating material 7〇 is read by the probe body 14 and provides insulation to isolate the conductive material body 40 from the test point 1〇〇. The above is merely a preferred embodiment for explaining the present invention. It is not intended to be in any way that the invention may be included in the scope of the present invention. Description: The first figure is a schematic diagram of the structure of the spring probe card. The second figure is a schematic diagram of the structure of the high-profile straight probe card of the present invention. The third figure is a schematic sectional view of the structure of the high-frequency vertical probe card of the present invention. [Main component symbol description] 1 circuit board 2 fixed module 3 probe 201111790 4 probe tip 10 probe 12 probe tip 14 probe body 16 probe connector 20 circuit board 30 first insulating material • 40 conductive material Body 50 cavity, 70 second insulating material 90 to be tested wafer 100 test point (pad)