TWI260416B - Coplanar test board - Google Patents

Abstract

A coplanar test board includes a substrate, a plurality of testing pads, and a plurality of conductors. The testing pads are disposed on a first surface of the substrate. Each testing pads has a plane for a coplanar contact of a high frequency probe. The conductors are disposed on a second surface of the substrate and electrically connected to the corresponding testing pads through a plurality of vias of the substrate. Each conductor has a concave surface to contact a plurality of spherical electrodes of a DUT (device under test). In order to test the DUT, the concave surfaces of the conductors contact the spherical electrodes of the DUT. A high frequency probe can test the DUT though the testing pads. Accordingly, the coplanar test board can prevent the damage of the DUT made by the high frequency probe and reduce contamination of the high frequency probe and it could be used repeatedly.

Description

1260416

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit test fixture in which a conductor contacts a spherical electrode of a test object and provides a coplanar measurement plate for measuring the high frequency 仏 needle. Negative [Prior Art] Sun He! In the semiconductor process of ^^, after completing a semiconductor package structure, the girth semiconductor package was measured to finally analyze the electrical performance of the product. A conventional method of measuring and detecting is to use a specially designed high frequency probe (1^Crowave probes) as a coaxial cable (c〇axiai "Η. and the contact interface between the microwave components and the secret wave to directly transmit Measuring the semiconductor package structure to be tested. The high frequency probe is usually coplanar (c〇plana〇 type, such as common GSG (Gr〇und-Signal-Ground) and G-s (Ground-Signal) Referring to FIG. 1 , when a test object 10 is measured, it uses a high frequency probe 20 to contact a plurality of spherical electrodes η of the test object 10 to measure the test object 10 . The high frequency probe 20 includes two 5" probes 蟑 21 ', one of the probe ends 21 is a signal end, and the other probe end 21 is a rabbit ground. Since the spherical electrodes are arcs In the face, the probe 2 or the probe end 21 is non-coplanar to detect the spherical electrodes, so it is easy to cause the probe ends 21 of the south frequency probe 21 to fail to probe, and affect the electricity. In addition, in order for the probe terminals 21 of the high frequency probe 2 to accurately touch the spherical electrodes 11, usually The case 21 will be pressed so that the plurality of high frequency probe tip of the probe 21 actually probing the plurality of ball electrodes 11, but thus causing the system

Page 7 1260416 V. INSTRUCTION DESCRIPTION (2) ^ High-frequency probe 2 1 scratches the spherical electrode 丨丨 and stains the high-frequency probe 2 【 [Abstract] The main object of the present invention is to provide a The common plane measurement several measurement system is set on the first surface of one of the substrates, and the first surface of the substrate, the second surface of the k W earth plate, the substrate The plurality of via holes are electrically connected (4) to measure the 塾 and the conductors, and each of the measuring pads has a coplanar detection and measurement of the one-two-frequency probe. A second object of the present invention is to provide an amount <RTIgt;</RTI>> disposed on one surface of a substrate, each of which has a guide. The arcuate concave surfaces of the conductors are used to contact the object to be measured by the measuring plate, and the amount == does not need to be welded with the (4) object, so the 槪0 can be reused The measuring plane of the measuring plane mainly comprises a substrate, a plurality of conductors, the substrate having a first surface and a plurality of surfaces, the guiding holes are penetrated by the first surface through the first surface, the guiding surface The measuring pads are disposed on the first surface and have electrical holes. The guiding systems are disposed on the second surface and connected to the corresponding measuring pads via a first measuring pad. A coplanar probe of a ==X-same frequency probe, each of the guiding systems, and a plurality of spherical electro-optical stylus systems for contacting a sample to be tested, the coplanar measurement The measurement of the board and the measurement are performed, so that the high frequency probe can be avoided.

ΙΗ page 8 Ί260416

, failure 'and can prevent the high frequency probe from injuring the object to be tested so that the high frequency probe is contaminated, and the coplanar measurement plate can be reused. Embodiments Referring to FIGS. 2 and 3, a coplanar measuring panel 1 mainly includes a substrate 11{), a plurality of measuring pads 120, and a plurality of conductors 130. The substrate 110 has a first surface 111, a second surface 112, and a plurality of via holes 113. The via holes 113 of the substrate 110 are penetrated from the first surface to the second surface. The measurement pads 120 are disposed on the first surface lu of the substrate 110 and electrically connected to the via holes 113 of the substrate 110. In this embodiment, the coplanar measuring plate 1 further comprises a solder mask layer 4 〇, the solder resist layer 4 is formed on the first surface U1 of the substrate 110, the solder resist The layer 14 is exposed to the measurement pads 120. Each of the measurement pads 120 has a plane 121 to facilitate coplanar detection of a high frequency probe 20, and the planes 12 are coplanar. Preferably, the measuring pads 120 protrude from the solder resist layer 14 Q, so that the plurality of probe ends 21 of the β-Hannan frequency probe 20 detect the measured values 塾1 2 〇 The planes 121 (as shown in FIG. 4), the materials of the measuring pads 12〇 may include nickel gold. The conductors 130 are disposed on the second surface 11 2 of the substrate 11 and electrically connected to the corresponding pads 1 12 via the vias 3 of the substrate 11 , wherein Each of the conductors 13 has an arcuate concave surface 131 to contact a plurality of spherical electrodes 11 of the object to be tested (as shown in FIG. 4). Referring to FIG. 4, the object to be tested 1 can be a wafer, a wafer size package or a ball grid array package, and the spherical electrodes can be

1260416 V. Description of invention (4) is a bump or solder ball. In this embodiment, the conductors 3 are equidistant and correspond to the spherical electrodes 11. In addition, the conductors 130 temporarily contain 63% tin and 37% lead. When the measurement is performed, the spherical electrodes 11 of the pair 10 are directed toward the coplanar measuring plate 1 , and the curved concave surfaces 131 of the conductors 130 are in contact with the object to be tested 1 . The ball "shaped electrode 1 1 , preferably, the arc sounds of the orbital concave surfaces 1 3 1 of the conductors 丨 3 大于 are larger than the arcs of the spherical electrodes i 以 to facilitate contact of the conductors 130 Talk about some spherical electrodes 11 of X. Then, with the high frequency probe 2, the probes are touched? The planes 121 of the 塾120 are measured for electrical measurement, and the probe ends 21 of the 咼 frequency probe 20 are coplanarly probed by the planes, 1 2 1 The high frequency probe 2 failed to detect. The coplanar measuring plate 1 of the present invention does not need to be entangled with the object to be tested, and the arcuate concave surfaces 131 of the conductors 130 are in contact with the spherical elements of the object 10 Electric (4), and because the guiding holes 113 are electrically inductive to the measuring pads 120 and the conductors 130', the high frequency probes can co-planely touch the measuring pads 12 The planes 121 are measured to prevent the high frequency probe from scratching the 'to avoid contamination of the high frequency probe 2G. In addition, the coplanar = 100 series can be reused to measure different analytes with the same electrode spacing. In addition, 'when measuring, if you need to make pre-t; short: when you only need a silver glue or - conductor (not shown) "2" measuring pad 12 〇 can make the predetermined line formation Short circuit, measurement. β 1 Please refer to Figure 5, the conductors of the coplanar measuring board 1

Page 10 1260416

The forming method is explained below. First, a plurality of spherical conductors 132 are disposed on the second surface 112 of the substrate U 。. Next, a forming plate 30 having a plurality of metal balls 31 is provided, wherein the melting points of the metal balls 31 are higher than the melting points of the spherical conductors 132. For example, the metal balls 42 may have a higher lead content. The high-lead material, wherein the spherical conductor 132 is made of 63% tin and 370%, is coated with a release agent 40 from the metal balls 31 or the spherical conductors 132. Next, a heating step is performed to raise the temperature of the spherical conductors 1 32 between the melting points of the metal balls 32 and the melting points of the spherical conductors 132 to make the spherical conductors 132 exhibits a state in which it is semi-melted or melted and remains solid. Then, the metal balls 32 of the forming plate 3 are pressed down to the spherical conductors 132, so that the spherical conductors 132 are formed with the curved concave surface 131 (as shown in FIG. 2), wherein the The release agent 40 has a characteristic of isolating the metal balls 32 from the spherical conductors 132 to prevent the metal balls 32 from being fused with the spherical conductors 132. The metal balls 32 and the spherical conductors 132 are separated to form the conductors 130 (as shown in Fig. 2). The scope of the present invention is defined by the scope of the appended claims. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention belong to the protection of the present invention. garden.

1260416 Schematic diagram of the simple description of the diagram] Coplanar measurement board The coplanar measurement board of the coplanar measurement board should be the cross-sectional view of the measured object in the conventional high-frequency measurement process, 2 A schematic cross-sectional view of one embodiment of the invention. Figure 3 is a top view, in accordance with an embodiment of the present invention. 4 is a cross-sectional view showing a high-frequency measurement of a test object according to an embodiment of the present invention. FIG. 5 is a cross-sectional view of the coplanar measurement plate formed in a curved concave surface according to an embodiment of the present invention. A schematic cross-section of the process. Brief description of component symbols: 10 DUT 11 Spherical electrode 20 Southern probe 21 Probe end 30 Forming plate 31 Metal ball 40 Release agent 100 Coplanar measuring plate 110 Substrate 111 First surface 113 Guide hole 120 Measuring pad 121 Plane 130 Conductor 131 Curved Concave 140 Solder Mask 112 Second Surface 132 Spherical Conductor

Page 12

Claims (1)

1260416 ——*—— Scope of application for patents [Scope of application for patent application] A coplanar measuring plate comprises: a substrate having a first surface, a second surface and a plurality of guiding holes, the guiding holes being the first The surface penetrates to the second surface; a plurality of measuring pads are disposed on the first surface and electrically connected to the guiding holes, each measuring pad has a plane; and a plurality of conductors, the setting On the second surface and electrically connected to the corresponding measurement pads via the via holes. 2. The coplanar measuring plate of claim 1, wherein each of the guiding systems has a five-concave surface. 3. The coplanar measuring plate of claim 1, wherein the guiding systems have a fixed spacing. 4. The coplanar measuring plate of claim 1, further comprising a solder resist layer formed on the first surface of the substrate, the measuring pads protruding from the solder resist layer. 5. The coplanar measuring plate according to item 4 of the patent application, wherein the measuring lanthanum system comprises nickel gold. 6. The coplanar measuring plate according to claim 1, wherein the materials of the conductors comprise 63% tin and 37% lead. 7. The coplanar measuring plate of claim 1 wherein the planes of the measuring pads are coplanar. Page 13