200842365 九、發明說明 【發明所屬之技術領域】 探針 本發明係·-麵針轉，尤辆奸絲其刺穿式 結構。 【先前技術】 笔子組裝;貝式包括兩種基本類型·親^ 在完成線路板生產後進行，主=====__ ⑷ 一姐路開路、網表的導通性。名 =程中：多其他的檢查和•方法。加載測試在組裝製 成後進订，它比裸板測試複雜。 Γ胁卻及其咖岭。最w，組裝測試 謇 線檢測。_供電路板的 焊點橋_。 知__像，從而確定虛焊及 通常的測試有五種類型’它們主要的功能如下：i板 個單柄零路7;3.壯與:認註每 々、一 · · um正電路的功能模組的運作；5· 、、且。測忒·線上測試和功能測試的組合測試。 200842365 除了上述針對印刷電路板的測試以外，當然也有針對IC或ic載板(例 如BGA封裝體）的測試。例如：中華民國專利公告號第侧打號 導體封裝元件之測試治具」 如第1圖所示，第1圖為習知封裝體之戦治具的示意圖。如第1圖 所:，為習知封裝體之測試治具主要具有針板14、設置在針板Μ中回 的複數個探針16 ’而封裝體10則具有複數個錫球12。 在進行測試時，將封裝體10放入針板14的凹槽内後，封農體】备 數_球12會接__複數讎針16，並由複數雜針二 裝體10輸入測試訊號，而進行測試工作。 、 然而，在封裝體10的複數個錫球12接觸到相對的複數個探針16時， 操針16很容易會使錫球12脫落，導致封裝體1G無法 須送回封裝體1〇的製造商重新填上錫球12。 運用，必 【發明内容】 籌’八依據％路設計，利用足夠尖銳且堅硬的複數個探針端子，刺穿 P刷電路板對封裝體_的連接線路，而達到間接地透過印刷電路板 的連接線路對封裝體作測試，完全避免損壞封震體。 =:，明封裝體的測試方Μ其刺穿式探針結構主要包 二 !針套筒、由該探針套筒内部凸設而出的複數個探 ㈣子以及連接至該些個探針端子的導線。藉著足,、 , |t]f ^ 200842365 步的瞭解 線路，並經轉_輸職峨至連魏路，輯行 關於本發明之優點與精神可以藉由以下的發明詳述及‘ 【實施方式】 請參閱第2 _ 3A侧。第2 _本發明刺穿式探針 圖。第3㈣圖為利用本發明刺穿式探針結構之操作示^構之示着 姑來說，如第3B圖所示，為了避免在戰咖為6 _ 導f刪曝12脫落，可利附·軸針結= 尖銳且堅硬的複數個探針端子22，刺穿印刷電路板3〇緣夠 而電性接觸到封裝體戦如BGA)在印刷電路板3〇上的連接=， :而=間接地透過印刷電路板3_接線路％對嶋Μ作測 试’元王避免損壞封裝體10。底下，先詳細說明本 式針士 構，__咖本發穿聽構作靡_。 ^ 套同20、由採針套筒2〇内部凸設而出的複數讎針端子&以及電性 連接至_固探針端子22的導線24。複數個探針端子22均為金屬材 貝¥線’同時導線24會在探針套筒2〇内部電性連接至該些個探針端 ㈣，且又電性連接至測試訊號源（未描•因此該測試訊號源的測 試訊號可經由導線24被同時傳輸至複數個探針端子22。 如第3A 3B圖所不’待測的印刷電路板3〇上已具有連接線路32(為方 便說明起見在此僅描綠其中一條線路，但實際上應該會有複數條線 200842365 路），並在預錄置絲㈣紐1G。_縱料路設計圖，連 線路32除了會紐連接至職體ια的職腳位（即如第丨騎示 球12)以外’還會電性連接到其他電子元件或線路。此外，如第 所示，待測的印刷t路板30進一步還包含基板％、以及覆蓋住“ 線路32的絕緣層34(例如防嬋綠漆）。 如第3B贿示’在進娜鱗，先依魏路設計圖，灿封裝體10 的特定腳位所電性連接_連接線路32，織再彻本發明刺穿式_ 針結射足触銳且堅硬的複數讎針端子22，對魏娜針端子= 施加力量，而前_電路㈣醜緣層34，触電性接觸至連接 線路32，而達到透過印刷電路板3()的連接線路犯對封裝體1〇間接 地作測試，完全避免損壞封裝體10。 除此之外，林發明前式探射，紐购針辭22 可對稱的3支。如此，在刺穿印刷電路板3〇的絕緣層34時，因為平 均地分散了刺穿力量，避免過度刺穿，進而意外地刺穿超過連接線路 .3j ’ .而電性接觸到其他層面相線路，致使無法順糊試。 ^由以上祕具體實酬之詳述，鱗望能更加清楚贿本發明之特 徵與精神’而並非社觸揭露的她具體獅例賴本發明之範嘴 加以限制。相反地，其目的是希望能涵蓋各種改變及具相雜的安: 於本發明所欲申請之專利範圍的範疇内。 【圖式簡單說明】 第1圖為習知封裝體之測試治具的示意圖。 200842365 參 第2圖為本發明刺穿式探針結構之示意圖。 第3A〜3B圖為利用本發明刺穿式探針結構之操作示意圖 【主要元件符號說明】 10封裝體 12錫球 14針板 _ 16探針 20探針套筒 22探針端子 24導線 30印刷電路板 32連接線路 34絕緣層 • 36基板200842365 IX. INSTRUCTIONS OF THE INVENTION [Technical Field to Be Invented by the Invention] Probe The present invention relates to a face-to-needle rotation, and in particular to a piercing structure. [Prior Art] Pen assembly; shell type includes two basic types · pro ^ after the completion of the production of the circuit board, the main =====__ (4) the opening of a sister road, the continuity of the netlist. Name = Cheng Zhong: Many other checks and methods. The load test is ordered after the assembly is made, which is more complicated than the bare board test. It is not the same as Ka Ridge. Most w, assembly test 謇 line detection. _ solder joint bridge for the board _. Knowing __, to determine the virtual soldering and the usual tests have five types' their main functions are as follows: i single-handle zero-way 7; 3. strong and: each note, one · um positive circuit The operation of the function module; 5·, and. Test combination test of on-line test and functional test. 200842365 In addition to the above tests for printed circuit boards, there are of course tests for IC or ic carrier boards (eg BGA packages). For example, the test fixture of the conductor package component on the side of the Republic of China Patent Bulletin No. 1 is a schematic view of a conventional fixture. As shown in Fig. 1, the test fixture for the conventional package mainly has a needle plate 14, a plurality of probes 16' disposed in the middle of the needle plate, and the package 10 has a plurality of solder balls 12. During the test, after the package 10 is placed in the groove of the needle plate 14, the sealing body _ ball 12 will be connected to the __ plural 雠 pin 16, and the test signal is input by the plurality of splicing pins 2 And carry out the test work. However, when a plurality of solder balls 12 of the package 10 are in contact with the opposite plurality of probes 16, the handle pins 16 can easily cause the solder balls 12 to fall off, resulting in the package 1G being unable to be returned to the package 1 . Refill the solder ball 12. Application, must [invention content] to raise 'eight according to the % road design, using a sufficiently sharp and rigid multiple probe terminals, pierce the connection circuit of the P-brush circuit board to the package _, indirectly through the printed circuit board The connection line tests the package to completely avoid damage to the seal body. =: The test package of the bright package has its piercing probe structure mainly comprising a second needle sleeve, a plurality of probes protruding from the inside of the probe sleeve, and connected to the probes. The wire of the terminal. By means of the foot, , , |t]f ^ 200842365 steps to understand the line, and after the transfer _ transfer to the Wei Road, the advantages and spirit of the invention can be explained by the following invention and Method] Please refer to the 2nd _ 3A side. 2nd - Puncture probe of the present invention. The third (fourth) diagram shows the operation of the piercing probe structure of the present invention. As shown in FIG. 3B, in order to avoid the detachment 12 in the war coffee, it can be attached. • Axle pinion = a sharp and rigid plurality of probe terminals 22 that pierce the printed circuit board 3 and electrically connect to the package, such as BGA) on the printed circuit board 3〇 =, and = Intermittent grounding through the printed circuit board 3_ connected to the line % test ' 'Yuan Wang to avoid damage to the package 10. Underneath, first explain the style of the needle structure, __ 咖本发穿穿制作靡_. The same as 20, a plurality of pin terminals & which are protruded from the inside of the needle sleeve 2, and a wire 24 electrically connected to the probe terminal 22. The plurality of probe terminals 22 are all metal materials, and the wires 24 are electrically connected to the probe terminals (4) inside the probe sleeve 2〇, and are electrically connected to the test signal source (not depicted) • Therefore, the test signal of the test signal source can be simultaneously transmitted to the plurality of probe terminals 22 via the wires 24. As shown in FIG. 3A 3B, the printed circuit board 3 on the test board 3 has a connection line 32 (for convenience) At first glance, only one of the lines is green, but in fact there should be a plurality of lines 200842365), and in the pre-recorded wire (four) New 1G. _ vertical line design, even line 32 in addition to the New Zealand connection to The position of the job ια (ie, as in the case of the 丨 riding ball 12) is also electrically connected to other electronic components or circuits. Further, as shown, the printed t-board 30 to be tested further includes a substrate. %, and cover the "insulation layer 34 of the line 32 (such as smash-proof green paint). If the 3B bribe shows 'in the Jinna scale, first according to Wei Road design, the specific position of the can package 10 is electrically connected _Connecting line 32, weaving the puncture type of the invention _ needle knotting foot sharp and hard plural The pin terminal 22 applies force to the Wei Na pin terminal = while the front _ circuit (four) ugly edge layer 34 electrically contacts the connection line 32 to reach the package body through the connection line through the printed circuit board 3 (). Inter-ground test for complete avoidance of damage to the package 10. In addition, Lin invented the front-end probe, and the new purchase can be symmetrically three. Thus, when piercing the insulating layer 34 of the printed circuit board 3 Because the average penetration of the piercing power, avoiding excessive piercing, and then accidentally piercing beyond the connection line.3j '. And electrical contact with other layers of phase lines, so that can not be tried. ^ From the above secret specific pay In detail, the scale can more clearly understand the characteristics and spirit of the invention. It is not the specific lion case of the invention that is exposed by the social touch. In contrast, the purpose is to cover various changes and phases. Miscellaneous An: It is within the scope of the patent scope of the present invention. [Simplified Schematic] Fig. 1 is a schematic view of a test fixture of a conventional package. 200842365 Reference Fig. 2 is a piercing probe of the present invention. Schematic diagram of the needle structure. 3A~3B The figure shows the operation of the piercing probe structure of the present invention. [Main component symbol description] 10 package body 12 solder ball 14 pin plate _ 16 probe 20 probe sleeve 22 probe terminal 24 wire 30 printed circuit board 32 connection Line 34 insulation • 36 substrates