CN214427506U - PCB level current sensor - Google Patents
PCB level current sensor Download PDFInfo
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- CN214427506U CN214427506U CN202023124175.3U CN202023124175U CN214427506U CN 214427506 U CN214427506 U CN 214427506U CN 202023124175 U CN202023124175 U CN 202023124175U CN 214427506 U CN214427506 U CN 214427506U
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Abstract
The utility model relates to a sensor field, concretely relates to PCB level current sensor. The method comprises the following steps: the PCB comprises a secondary side signal layer, a primary side lead layer and a bonding pad layer which are sequentially arranged, wherein the magnetic sensor chip is electrically connected with the secondary side signal layer through a needle-shaped pin and is detachably fixed above the secondary side signal layer; the primary wire layer comprises a plurality of current wire layers, and the current wire layers in different layers are electrically connected in parallel through the needle-shaped pins. The PCB-level current sensor adopts the needle-shaped pins to realize the electric connection between the magnetic sensor chip and the secondary side signal layer, thereby avoiding the situation that the distribution of a magnetic field is influenced by metal welding spots and the current detection accuracy is finally influenced; the magnetic sensor chip is detachably connected above the secondary side signal layer, and the type of the magnetic sensor chip can be freely changed, so that the application range of the PCB-level current sensor is expanded.
Description
Technical Field
The utility model relates to a sensor field, concretely relates to PCB level current sensor.
Background
The current sensor is an interface device between high and low voltages that detects a current value using a magnetic field generated by a current in an electrically insulated state. It is mainly divided into four categories: hall (Hall) current sensors, Anisotropic Magnetoresistive (AMR) current sensors, Giant Magnetoresistive (GMR) current sensors, tunnel junction magnetic (TMR) current sensors.
The prior art PCB level current sensor usually adopts the SOP packaging technology, for example, the prior art discloses a PCB level current sensor, in which the PCB level current sensor needs to be soldered on the PCB body. When current detection is carried out, the welded metal welding points can influence the distribution of a magnetic field, so that the accuracy of current detection is influenced, and the PCB-level current sensor packaged by the SOP packaging process is not easy to disassemble.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in overcoming prior art, carries out current detection time measuring, and welded metal solder joint can influence magnetic field distribution, and then influences current detection's accuracy and the difficult defect of dismantling to a PCB level current sensor is provided, include: the magnetic sensor chip comprises a magnetic sensor chip and a PCB body, wherein the PCB body comprises a secondary side signal layer, a primary side lead layer and a bonding pad layer which are sequentially arranged,
the magnetic sensor chip is electrically connected with the secondary side signal layer through the needle-shaped pins and is detachably fixed above the secondary side signal layer;
the primary side wire layer comprises a plurality of current wire layers, and the current wire layers in different layers are electrically connected in parallel through the needle-shaped pins.
Preferably, the magnetic sensor chip is mounted above the secondary signal layer by a clip.
Preferably, the secondary side signal layer includes a top layer and a ground layer, and the magnetic sensor chip is mounted on the top layer, wherein a prepreg is disposed between the top layer and the ground layer.
Preferably, prepregs are disposed between the secondary signal layer and the primary wire layer and between the primary wire layer and the pad layer.
Preferably, a prepreg or a core board is arranged between the current lead layers.
Preferably, the top layer, the ground layer, the current lead layer and the pad layer each have a thickness in the range of 2 to 3 ounces.
Preferably, the current conductor layer is 3 layers, and the thicknesses of the top layer, the ground layer, the three current conductor layers and the pad layer are 2 ounces, 3 ounces, 2 ounces and 2 ounces in sequence.
Preferably, the thickness of the prepreg between the top layer, the ground layer, the three current lead layers and the pad layer is 0.1 mm.
Preferably, the magnetic sensor chip comprises one or more of a hall chip, an anisotropic magnetoresistance chip, a giant magnetoresistance chip, and a tunnel junction magnetoresistance chip.
The utility model discloses technical scheme has following advantage:
1. the utility model provides an among the PCB level current sensor, PCB level current sensor adopts the wire of PCB board main part as former limit wire layer for PCB level current sensor's the internal resistance that switches on obtains reducing by a wide margin, and calorific capacity is too big when having avoided letting in the electric current. In addition, the PCB-level current sensor adopts the needle-shaped pins to realize the electric connection between the magnetic sensor chip and the secondary side signal layer, and the current lead layers of different layers are also electrically connected by the needle-shaped pins, so that the condition that the distribution of a magnetic field is influenced by metal welding spots and the current detection accuracy is influenced finally is avoided; and the current lead layers of different layers are connected in parallel by adopting the needle-shaped pins, so that the lightning stroke resistant current transformer has the characteristics of small impedance and strong lightning stroke resistant current. Meanwhile, the magnetic sensor chip is detachably connected above the secondary side signal layer, and the type of the magnetic sensor chip can be freely changed, so that the application range of the PCB-level current sensor is expanded.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a PCB-level current sensor according to the present invention;
fig. 2 is a top view of the PCB level current sensor of the present invention;
fig. 3 is a schematic diagram of a layer structure of a PCB board in the PCB level current sensor of the present invention;
fig. 4 is a relative accuracy curve diagram obtained by actually measuring the PCB level current sensor of the present invention;
fig. 5 is a diagram of the external dimensions of the PCB level current sensor of the present invention.
Reference numerals:
100. a PCB level current sensor; 101. a PCB board main body; 102. a magnetic sensor chip; 1011. a top layer; 1012. a ground plane; 1013. a first current layer; 1014. a second current layer; 1015. a third current layer; 1016. a pad layer; 201. a primary current conductor; 202. and a secondary side signal line.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The present embodiment provides a PCB-level current sensor 100 for current detection, as shown in fig. 1 and fig. 2, comprising a magnetic sensor chip 102 and a PCB (printed circuit board) body 101, wherein the PCB body 101 comprises a secondary signal layer, a primary lead layer and a pad layer 1016, which are sequentially disposed. The magnetic sensor chip 102 is electrically connected to the secondary signal layer by needle-shaped pins (not shown), and the magnetic sensor chip 102 is detachably fixed above the secondary signal layer; the primary wire layer comprises a plurality of current wire layers, and the current wire layers of different layers are electrically connected by needle-like pins (not shown) to realize parallel connection of the current wire layers.
In the above embodiment, the PCB level current sensor 100 uses the conductive wire of the PCB main body as the primary conductive wire layer, so that the on-resistance of the PCB level current sensor 100 is greatly reduced, and the excessive heat generation when the current is introduced is avoided. In addition, the PCB-level current sensor 100 provided in this embodiment adopts the needle-shaped pin to electrically connect the magnetic sensor chip 102 and the secondary signal layer, and the current lead layers of different layers are also electrically connected by the needle-shaped pin, so as to avoid the situation that the distribution of the magnetic field is affected by the metal solder joint, and the current detection accuracy is ultimately affected; and the current lead layers of different layers are connected in parallel by adopting the needle-shaped pins, so that the lightning stroke resistant current transformer has the characteristics of small impedance and strong lightning stroke resistant current. Meanwhile, the magnetic sensor chip 102 is detachably connected above the secondary signal layer, and the type of the magnetic sensor chip 102 can be freely changed, so that the application range of the PCB-level current sensor is expanded.
As shown in fig. 1 and 2, the magnetic sensor chip 102 is mounted above the secondary signal layer by a clip (not shown). In some embodiments, the magnetic sensor chip 102 may also be removably attached over the secondary signal layer by way of a snap fit.
The secondary signal line 202 in the secondary signal layer is used to supply power and output power to the magnetic sensor chip 102. As shown in fig. 3, the secondary signal layer includes a TOP layer (TOP layer) 1011 and a ground layer (GND layer) 1012, the magnetic sensor chip 102 is detachably mounted on the TOP layer 1011, and prepregs are disposed between the TOP layer 1011 and the ground layer 1012, between the secondary signal layer and the primary wire layer, between the primary wire layer and the pad layer 1016, and between the multiple current wire layers, wherein the prepregs serve to insulate the TOP layer 1011 and the ground layer 1012, between the secondary signal layer and the primary wire layer, between the primary wire layer and the pad layer 1016, and between the multiple current wire layers, and the thickness of the prepregs is preferably selected to be 0.1mm, and when the thickness of the prepregs is less than 0.1mm, the insulation effect is not good; when the thickness of the prepreg is greater than 0.1mm, the thickness of the PCB main body is excessively large.
As shown in fig. 3, an inner core board is further disposed between the current lead layers, and the thickness of the inner core board is 0.30 mm. In this embodiment, the PCB main body 101 includes six layers, which are a top layer 1011, a ground layer 1012, a first current layer 1013, a second current layer 1014, a third current layer 1015 and a pad layer 1016(BOT layer) in this order, wherein the secondary signal layer includes the top layer 1011 and the ground layer 1012, and the primary wire layer includes the first current layer 1013, the second current layer 1014 and the third current layer 1015. Prepregs are disposed between the top layer 1011 and the ground layer 1012, between the ground layer 1012 and the first current layer 1013, between the second current layer 1014 and the third current layer 1015, between the third current layer 1015 and the pad layer 1016, and a core board is disposed between the first current layer 1013 and the second current layer 1014.
As shown in fig. 2 and 3, each of the first current layer 1013, the second current layer 1014, and the third current layer 1015 includes a primary current wire 1015, and the primary current wire 201 in the first current layer 1013, the second current layer 1014, and the third current layer 1015 allows the primary current to flow through, so that the on-resistance of the PCB-level current sensor 100 can be reduced due to the small internal resistance of the primary current wire, and compared with the current PCB-level current sensor of the same size, the on-resistance can be reduced from 1.2 milliohm to not more than 0.4 milliohm.
As shown in fig. 3, the top layer 1011, ground layer 1012, current lead layers and pad layer 1016 all have a thickness in the range of 2-3 ounces. In this embodiment, the top layer 1011, the ground layer 1012, the first current layer 1013, the second current layer 1014, the third current layer 1015, and the pad layer 1016 have thicknesses of, in order, 2 ounces (oz), 3 ounces (oz), 2 ounces (oz), and 2 ounces (oz). In some embodiments, the thicknesses of the top layer 1011, the ground layer 1012, the first current layer 1013, the second current layer 1014, the third current layer 1015 and the pad layer 1016 may also be 3 ounces, 2 ounces, 3 ounces and 3 ounces, which can be reasonably set by one skilled in the art according to specific situations, and are not limited herein, i.e., the layer process of the PCB body 101 is not limited to 223322(oz), other copper thickness processes are also applicable, and the number of layers of the PCB body 101 is not limited to six.
In the PCB-level current sensor 100 provided in this embodiment, as shown in fig. 1 and fig. 2, a primary current I flows into a primary current wire 201 in the PCB board body 101, because a magnetic field is generated when the primary current I flows through the primary current wire 201, the magnetic sensor chip 102 detects the magnetic field generated by the primary current, and after being converted by a Programmable Gain Amplifier (PGA), the magnetic field is converted into a voltage signal to be output, and the output voltage signal is in direct proportion to a corresponding measured current, thereby realizing detection of the primary current I and output of an analog signal. The magnetic sensor chip 102 may be one or more of a hall chip, an anisotropic magnetoresistance chip, a giant magnetoresistance chip, and a tunnel junction magnetoresistance chip, and is preferably, but not limited to, a tunnel junction magnetoresistance (TMR) chip.
As shown in fig. 4, the present embodiment provides a sensor-relative-accuracy graph of the PCB-level current sensor 100 obtained in an actual test, and it can be known from the data in fig. 4 that the PCB-level current sensor 100 has good accuracy characteristics.
At present, some SOP8 packaged PCB level current sensors integrated with a primary side current wire are directly manufactured by adopting a copper substrate process, and the current flowing through the primary side current wire is detected by magnetosensitive devices such as Hall (Hall) or GMR (giant magneto resistance); some SOP8 packaged PCB level current sensors without integrated primary side current wires are directly manufactured by adopting a copper substrate process, and the current flowing through the primary side current wires of the client side PCB is detected by Hall (Hall) or GMR (giant magneto resistance) magnetosensitive devices.
Compared with the SOP8 packaged PCB-level current sensor, the PCB-level current sensor provided by the embodiment has better effect. As shown in fig. 5, which is a dimension of the PCB-level current sensor provided in the present embodiment actually manufactured, the dimension unit in the drawing is millimeter, it can be known that the PCB-level current sensor 100 provided in the present embodiment has a smaller dimension and is compatible with the package form of SOP 8; in some embodiments, the PCB level current sensor 100 may also take the form of an LGA (land grid array) package. Compared with an SOP8PCB current sensor adopting a copper substrate packaged integrated primary side current lead, the internal resistance of the primary side lead layer of the PCB current sensor 100 can be smaller, namely the internal resistance of the SOP8PCB current sensor adopting the copper substrate packaged integrated primary side current lead is generally 1.2 milliohm, and the heat productivity is large when the primary side current is introduced, while the internal resistance of the PCB current sensor 100 provided by the embodiment is within 0.4 milliohm, and the heat productivity is smaller when the primary side current is introduced, which is about one third of the heat productivity when the SOP8PCB current sensor adopting the copper substrate packaged integrated primary side current lead is introduced.
Moreover, compared with an SOP8PCB current sensor which is packaged by a copper substrate and does not integrate a primary current wire, the PCB current sensor 100 does not need to consider the thickness of the PCB main body 101, the distance between the primary current wire and the magnetic sensor chip 102, and other factors, so that the PCB current sensor 100 does not need to be calibrated and gained independently during use, and the use is more convenient.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (9)
1. A PCB level current sensor, comprising: the magnetic sensor chip comprises a magnetic sensor chip and a PCB body, wherein the PCB body comprises a secondary side signal layer, a primary side lead layer and a bonding pad layer which are sequentially arranged,
the magnetic sensor chip is electrically connected with the secondary side signal layer through the needle-shaped pins and is detachably fixed above the secondary side signal layer;
the primary side wire layer comprises a plurality of current wire layers, and the current wire layers in different layers are electrically connected in parallel through the needle-shaped pins.
2. The PCB level current sensor of claim 1, wherein the magnetic sensor chip is mounted over the secondary signal layer by a clip.
3. The PCB level current sensor of claim 1, wherein the secondary signal layer comprises a top layer and a ground layer, the magnetic sensor chip being mounted on the top layer, wherein a prepreg is disposed between the top layer and the ground layer.
4. The PCB level current sensor of claim 3, wherein a prepreg is disposed between the secondary signal layer and the primary lead layer and between the primary lead layer and the pad layer.
5. The PCB level current sensor of claim 4, wherein a prepreg or a core board is disposed between the multiple current conductor layers.
6. The PCB level current sensor of claim 4, wherein the top layer, the ground layer, the current lead layer and the pad layer each have a thickness in the range of 2-3 ounces.
7. The PCB level current sensor of claim 6, wherein the current lead layer is 3 layers, and the top layer, the ground layer, the three current lead layers and the pad layer have a thickness of 2 ounces, 3 ounces, 2 ounces and 2 ounces in sequence.
8. The PCB level current sensor of claim 7, wherein a thickness of prepreg between the top layer, the ground layer, the three current lead layers and the pad layer is 0.1 mm.
9. The PCB level current sensor of any one of claims 1-8, wherein the magnetic sensor chip comprises one or more of a hall chip, an anisotropic magnetoresistance chip, a giant magnetoresistance chip, and a tunnel junction magnetoresistance chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023124175.3U CN214427506U (en) | 2020-12-21 | 2020-12-21 | PCB level current sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023124175.3U CN214427506U (en) | 2020-12-21 | 2020-12-21 | PCB level current sensor |
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| CN214427506U true CN214427506U (en) | 2021-10-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114487556A (en) * | 2022-02-09 | 2022-05-13 | 蚌埠希磁科技有限公司 | Current sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114487556A (en) * | 2022-02-09 | 2022-05-13 | 蚌埠希磁科技有限公司 | Current sensor |
| CN114487556B (en) * | 2022-02-09 | 2023-01-20 | 蚌埠希磁科技有限公司 | Current sensor |
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