CN110133354B - PCB Rogowski coil for measuring current of crimping IGBT module chip - Google Patents
PCB Rogowski coil for measuring current of crimping IGBT module chip Download PDFInfo
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- CN110133354B CN110133354B CN201910341855.3A CN201910341855A CN110133354B CN 110133354 B CN110133354 B CN 110133354B CN 201910341855 A CN201910341855 A CN 201910341855A CN 110133354 B CN110133354 B CN 110133354B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/20—Instruments transformers
- H01F38/22—Instruments transformers for single phase ac
- H01F38/24—Voltage transformers
Abstract
The invention discloses a PCB Rogowski coil for measuring the current of a crimping IGBT module chip, which comprises: a circular PCB bottom plate, boss through holes and measuring coils; the plurality of boss through holes are distributed on the circular PCB bottom plate, and the distribution positions and sizes correspond to those of boss structures inside the crimping IGBT module; the measuring coil forms a multi-turn coil structure through upper and lower layers of routing and through holes of the circular PCB bottom plate and is uniformly distributed around each boss through hole; the PCB Rogowski coil is embedded between boss structures inside the crimping IGBT module and is superposed on a grid wiring PCB inside the crimping IGBT module; when the changed current flows in the boss branch circuit, induced potential is generated on the corresponding measuring coil, and the current change of the boss branch circuit is obtained by carrying out integral transformation on the induced potential. The PCB Rogowski coil can measure the current of a branch at any position, improves the current measurement precision, is simple to operate, and greatly reduces the current measurement cost of a parallel branch of a crimping IGBT module.
Description
Technical Field
The invention belongs to the technical field of current measurement, and particularly relates to a PCB Rogowski coil for measuring the current of a chip of a crimping IGBT module.
Background
The main packaging forms of the high-power IGBT (Insulated Gate Bipolar Transistor) module comprise welding type packaging and crimping type packaging, and compared with the welding type packaging, the crimping type packaging module has higher output power, has the advantages of double-sided heat dissipation and low parasitic inductance, and is more suitable for being applied to converter valves and circuit breakers. The distribution positions and stress distributions of the chips of the compression joint type packaging module are inconsistent, so that the parasitic inductance and the contact resistance of each branch circuit are different, and the current among the chips has different degrees of dispersion. The branch circuit with small parasitic inductance and contact resistance may cause the chip to be damaged by overstress, and other branch circuits bear total current, so that the damage of the device is accelerated. The distribution of the current in the internal branches of the pressure welding type packaging module is influenced by various factors, and the current distribution caused by non-linear elements such as semiconductors, parasitic parameters and the like is difficult to calculate, so that the current of each branch needs to be measured to research the current distribution characteristics of multiple chips.
In the crimping IGBT module, due to the large number of chips and the small chip spacing, the current measurement of the chips is not easy to realize, so that the measurement equipment is required to have small size and flexibility, and a commercial flexible current probe with a small wire diameter can be used as a solution. The front end of the flexible current probe is small in coil wire diameter (smaller than 2 mm), the coil structure is sleeved on a crimping IGBT boss structure, current distribution of the boss branch can be measured, appropriate commercial equipment can be selected according to the current size and the change rate, the precision and the sensitivity are high, and real-time accurate measurement of current waveforms can be achieved.
However, the flexible current probe needs thicker and longer wires at the rear end to lead out the measurement signals besides the front-end measurement coil, and the number of chips of the IGBT module is large and the pitch is small, so that the method can only measure the chips distributed at the edge inside the compression joint IGBT module, and the chip currents at other positions cannot be measured. In addition, when the number of the measured boss branches is increased, the number of devices needs to be correspondingly increased, and the current measurement cost is greatly increased because the flexible current probe is a precise device.
Generally, the existing precision measurement equipment has the problems of multiple leads, complex operation and capability of only measuring chip currents distributed at the edge when measuring the chip currents of the IGBT module.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a PCB Rogowski coil for measuring the chip current of a crimping IGBT module, and aims to conveniently measure the chip current at any position of the IGBT module.
In order to achieve the purpose, the invention provides a PCB Rogowski coil for measuring the chip current of a crimping IGBT module, wherein the PCB Rogowski coil is embedded between boss structures inside the crimping IGBT module and is superposed on a grid wiring PCB inside the crimping IGBT module;
the PCB Rogowski coil comprises: a circular PCB bottom plate, boss through holes and measuring coils;
the boss through holes are distributed on the circular PCB base plate, and the distribution positions and sizes correspond to the boss structures in the crimping IGBT module;
the measuring coil forms a multi-turn coil structure through the upper and lower layers of wiring and the through holes of the circular PCB bottom plate, is uniformly distributed around each boss through hole and is used for measuring boss current;
when the changed current flows in the boss branch circuit, induced potential is generated on the corresponding measuring coil, and the current change of the boss branch circuit is obtained by carrying out integral transformation on the induced potential.
Preferably, the plane of each turn of coil is perpendicular to the plane of the PCB Rogowski coil, so that the magnetic flux generated by the boss branch passes through the coil completely, and the mutual inductance is increased.
Preferably, the number and the structure of the measuring coils distributed around each boss perforation are the same, so as to eliminate the magnetic field generated by the interference current parallel to the branch current of the tested boss.
Further, the more the number of turns of the measuring coil is, the larger the mutual induction voltage is, and the higher the current measurement precision is.
Preferably, the measuring coil has 52 turns.
Further, the width and the length of the measuring coil are as large as possible, so that mutual inductance value and mutual inductance voltage are increased, and influence of fluctuation interference is reduced.
Preferably, the length and width of the measuring coil per turn are 2mm and 1.6mm, respectively.
Furthermore, a circle of backwinding wire is wound inside the measuring coil so as to reduce an interference magnetic field perpendicular to the plane of the PCB coil.
Preferably, the area enclosed by the backwinding wire is equal to the equivalent area surrounded by the measuring coil, so as to eliminate the interference magnetic field perpendicular to the plane of the PCB coil.
Preferably, in the current measuring process, the IGBT module embedded in the PCB rogowski coil is far away from the external conductor, and the current direction of the external conductor is not perpendicular to the current direction of the chip in the IGBT module, so as to prevent the external conductor from generating an interference magnetic field perpendicular to the plane of the PCB rogowski coil.
Through the technical scheme, compared with the prior art, the invention has the following beneficial effects:
(1) the measuring coil forms a multi-turn coil structure through the upper and lower layers of routing and the through holes of the PCB bottom plate, the coil integration level is high, the problems of multiple lead wires and complex operation of the measuring coil due to the fact that the number of chips is large and the distance between the chips is small in the IGBT module are solved, the current of branches at any positions can be measured, and the research on the current distribution characteristics is facilitated.
(2) The PCB Rogowski coil improves mutual inductance in various aspects such as coil routing position, coil distribution quantity, length and width, eliminates electromagnetic interference, and ensures current measurement accuracy.
(3) Compared with the current measurement by using a large number of commercial devices, the PCB Rogowski coil is simple to operate and reduces the current measurement cost of crimping the parallel branch of the IGBT module.
Drawings
FIG. 1 is a cross-sectional view of a PCB Rogowski coil of the present invention embedded within a crimped IGBT module;
FIG. 2 is a diagram of a measurement coil routing profile on a Rogowski coil of a PCB of the present invention;
fig. 3 is a routing diagram of a single measurement coil on a rogowski coil of a PCB of the present invention on the top and bottom layers of the PCB backplane.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the crimping IGBT module, a collector molybdenum sheet, an IGBT chip, an emitter molybdenum sheet, a silver sheet boss and a plastic fixing frame are used as a subunit, collectively referred to as a sub-module, and fig. 1 shows a cross-sectional view of two sub-modules of the crimping IGBT module. The upper and lower layers of molybdenum sheets can keep uniform contact pressure on two sides and reduce thermal expansion of the IGBT chip at high temperature, and can well conduct current and device loss as a good conductor of electricity and heat. The buffering silver sheet can well alleviate the problem of thermal stress caused by temperature change. The plastic frame surrounding the individual sub-modules serves to fix the chip and molybdenum plate position. The grid routing PCB introduces external driving signals to the grids of the chips to realize synchronous control of the chips connected in parallel.
In this embodiment, a structure design of a PCB rogowski coil applied to a 1200V/900A crimping IGBT module and a connection manner with the crimping IGBT module are described as an example, as shown in fig. 2, a PCB rogowski coil for measuring a chip current of the crimping IGBT module provided in an embodiment of the present invention includes: a circular PCB bottom plate, boss through holes and measuring coils;
the boss through holes are distributed on the circular PCB base plate, and the distribution positions and sizes correspond to the boss structures in the crimping IGBT module;
the measuring coil forms a multi-turn coil structure through the upper and lower layers of wiring and the through holes of the circular PCB bottom plate and is uniformly distributed around each boss through hole;
the PCB Rogowski coil is embedded between boss structures inside the crimping IGBT module, is superposed on a grid wiring PCB inside the crimping IGBT module, and is fixed on the emitter terminal through three through holes by screws;
the grid spring needle penetrates through the boss through hole to be in contact with a grid contact end on the grid wiring PCB at the bottom layer, so that the contact end of the grid spring needle is reserved at the corner of the through hole of each boss. Because the PCB rogowski coil is superimposed on the gate trace PCB, it is necessary to properly cut off an arc length of the PCB rogowski coil to expose a pad position of an input end of the driving signal.
Due to the compact structure design and symmetrical layout among the submodules, the PCB rogowski coil in fig. 2 only prints a measuring coil at the position of 8 branches for the measurement of the 8 branches. These currents represent typical current distribution information for the various branches of the overall module. Two incoming lines and two outgoing lines of each measuring coil are led out to the outgoing line end in fig. 2 in a centralized mode through the PCB wiring, and the number of the 8 chip measuring coils is 16.
Each measurement coil forms a 52 turn coil structure (13 turns per side) in a clockwise progression direction through the PCB upper and lower layer traces and vias as shown in fig. 3. The plane defined by the routing of each turn of coil on the top layer and the bottom layer must be vertical to the plane of the PCB, so as to ensure that the magnetic field of the current-carrying conductor can completely pass through each turn of coil and increase the mutual inductance coefficient; the number and the structure of the measuring coils distributed around each boss through hole are the same so as to eliminate a magnetic field generated by interference current parallel to the branch current of the boss to be measured; the more the turns of the coil are, the larger the mutual induction voltage is, and the higher the current measurement precision is; the width and the length of the measuring coil are as large as possible so as to increase mutual inductance value and mutual inductance voltage and reduce the influence of fluctuation interference; in this embodiment, the length of each turn of the measuring coil is slightly smaller than the distance between the bosses, the width is the thickness of the PCB, and the length and the width are respectively 2mm and 1.6 mm.
And after one turn of forward winding is finished, a reverse winding coil of one turn is wound anticlockwise, and the reverse winding coil of the single turn is called a backwinding coil, so that the influence of a magnetic field vertical to the plane of the PCB on the current measurement result of the branch circuit is reduced. Since the 52-turn down coil structure forms an equivalent down-wound coil on the PCB plane, a disturbing magnetic field perpendicular to the equivalent down-wound coil generates a disturbing induced electromotive force therein. The back winding is provided in order to allow an interference magnetic field to generate an induced electromotive force in the back winding opposite to that in the forward winding, thereby eliminating such interference.
In order to completely offset the interference electromotive force in the equivalent forward-wound single-turn winding, the areas of the equivalent forward-wound single-turn coil and the reverse-wound single-turn coil are ensured to be the same. A backwinding is therefore printed on the top layer of each measuring coil and passes 2 times each from the inner and outer turns of the four-sided winding to ensure equal area requirements as previously described.
When changing current flows in the boss branch circuit, induced potential is generated in the corresponding measuring coil, and the induced potential is subjected to integral transformation by measuring the voltage of the inlet wire end and the outlet wire end of the coil corresponding to each chip to obtain the current change of the boss branch circuit.
In the current measuring process, the IGBT module embedded in the PCB Rogowski coil is far away from the external conductor, and the current direction of the external conductor is not perpendicular to the current direction of the chip in the IGBT module, so that an interference magnetic field perpendicular to the plane of the PCB Rogowski coil is prevented from being generated by the external conductor.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A PCB Rogowski coil for measuring the chip current of a crimping IGBT module is characterized in that the PCB Rogowski coil is embedded between boss structures inside the crimping IGBT module and is superposed on a grid wiring PCB inside the crimping IGBT module;
the PCB Rogowski coil comprises: a circular PCB bottom plate, boss through holes and measuring coils;
the boss through holes are distributed on the circular PCB base plate, and the distribution positions and sizes correspond to the boss structures in the crimping IGBT module;
the measuring coil forms a square and annular multi-turn coil structure through the upper and lower layers of wiring and the through holes of the circular PCB bottom plate, is uniformly distributed around each boss through hole and is used for measuring boss current; two incoming lines and two outgoing line ends of each measuring coil are led out to fixed positions in a centralized manner through PCB wiring; a circle of winding wire is wound on the upper layer of the PCB bottom plate, and the area surrounded by the winding wire is equal to the equivalent area surrounded by the measuring coil; the more the turns of the coil are, the larger the mutual induction voltage is, and the higher the current measurement precision is; the width and the length of the measuring coil are as large as possible so as to increase mutual inductance value and mutual inductance voltage and reduce fluctuation interference.
2. The Rogowski coil for measuring the chip current of a crimped IGBT module according to claim 1, wherein the plane of each turn of the coil is perpendicular to the plane of the Rogowski coil.
3. The PCB Rogowski coil for measuring the chip current of a crimping IGBT module as claimed in claim 1, wherein the number and structure of the measuring coils distributed around each boss penetration hole are the same.
4. The PCB Rogowski coil for measuring the chip current of the crimping IGBT module as claimed in claim 3, wherein the measuring coil is 52 turns.
5. A PCB Rogowski coil for measuring current of a crimped IGBT module chip according to claim 4, wherein the coil length and width of each turn of the measuring coil are 2mm and 1.6mm respectively.
6. The PCB Rogowski coil for measuring the current of a crimping IGBT module chip as claimed in any one of claims 1-5, wherein in the current measuring process, the IGBT module embedded in the PCB Rogowski coil is far away from the external conductor, and the current direction of the external conductor is not perpendicular to the current direction of the chip in the IGBT module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910341855.3A CN110133354B (en) | 2019-04-26 | 2019-04-26 | PCB Rogowski coil for measuring current of crimping IGBT module chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910341855.3A CN110133354B (en) | 2019-04-26 | 2019-04-26 | PCB Rogowski coil for measuring current of crimping IGBT module chip |
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| CN110133354A CN110133354A (en) | 2019-08-16 |
| CN110133354B true CN110133354B (en) | 2020-07-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112578261A (en) * | 2019-09-29 | 2021-03-30 | 北京交通大学 | Square PCB Rogowski coil |
| CN112730943A (en) * | 2019-10-14 | 2021-04-30 | 北京交通大学 | Circular PCB Rogowski coil for measuring internal current of crimping type IGBT |
| CN110780185B (en) * | 2019-10-31 | 2020-08-04 | 华北电力大学 | Parallel current sharing test platform and method and metal electrode assembly |
| CN112505388B (en) * | 2020-12-02 | 2022-05-10 | 国网宁夏电力有限公司电力科学研究院 | Current measuring device and current measuring system |
| CN112834894B (en) * | 2021-01-07 | 2022-06-28 | 清华大学 | Magnetic field testing device for semiconductor current density inversion |
| CN114019216A (en) * | 2021-11-01 | 2022-02-08 | 华北电力大学 | Online measurement system for chip current of elastic compression joint IGBT device |
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| CN109856441A (en) * | 2019-04-15 | 2019-06-07 | 华北电力大学 | Crimp type IGBT device chip current on-line measurement system |
Family Cites Families (2)
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| JP2004039749A (en) * | 2002-07-01 | 2004-02-05 | Denso Corp | Multi-phase inverter module |
| CN102914708B (en) * | 2012-09-27 | 2015-09-23 | 中国电力科学研究院 | Metal oxide test product is response characteristics testing device under steep pulse |
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|---|---|---|---|---|
| CN104459277A (en) * | 2014-12-04 | 2015-03-25 | 国家电网公司 | High-power pressed connection type IGBT module current detection method |
| CN109473422A (en) * | 2018-09-29 | 2019-03-15 | 全球能源互联网研究院有限公司 | Crimp the encapsulating structure and current test method of device |
| CN109856441A (en) * | 2019-04-15 | 2019-06-07 | 华北电力大学 | Crimp type IGBT device chip current on-line measurement system |
Non-Patent Citations (1)
| Title |
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| 压接式IGBT器件内部芯片电流测量的研究;黄聪;《中国优秀硕士学位论文全文数据库 信息科技辑》;20180615;论文正文第32-56页 * |
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