CN109473422A - Packaging structure and current testing method of crimping device - Google Patents
Packaging structure and current testing method of crimping device Download PDFInfo
- Publication number
- CN109473422A CN109473422A CN201811153245.2A CN201811153245A CN109473422A CN 109473422 A CN109473422 A CN 109473422A CN 201811153245 A CN201811153245 A CN 201811153245A CN 109473422 A CN109473422 A CN 109473422A
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- CN
- China
- Prior art keywords
- circuit board
- crimping
- rogowski coil
- crimping device
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002788 crimping Methods 0.000 title claims abstract description 76
- 238000012360 testing method Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title claims abstract 9
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000004804 winding Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 15
- 238000010998 test method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
Abstract
本发明涉及压接器件技术领域，具体公开了一种压接器件的封装结构和电流测试方法，封装结构包括设置于电路板上的若干压接芯片，所述电路板的外围设置有若干错位过孔，导电线沿错位方向依次绕制于各所述错位过孔形成罗氏线圈。一方面，可以通过罗氏线圈对电路板上的压接芯片进行电流检测；另一方面，罗氏线圈相当于直接设置于电路板内部，减小了罗氏线圈所占用的空间，无需扩大整个压接器件的封装结构的尺寸，仍然能够保证压接器件整体的高功率密度。另外，由于罗氏线圈是直接设置于电路板内部的，因此无需对罗氏线圈进行装配，使用非常方便。
The invention relates to the technical field of crimping devices, and specifically discloses a packaging structure and a current testing method for a crimping device. The packaging structure includes a plurality of crimping chips arranged on a circuit board, and a plurality of dislocation terminals are arranged on the periphery of the circuit board. A Rogowski coil is formed by winding the conductive wire around each of the dislocation via holes in sequence along the dislocation direction. On the one hand, the current detection of the crimping chip on the circuit board can be performed through the Rogowski coil; on the other hand, the Rogowski coil is equivalent to being directly arranged inside the circuit board, which reduces the space occupied by the Rogowski coil and does not need to expand the entire crimping device The size of the package structure can still ensure the high power density of the crimping device as a whole. In addition, since the Rogowski coil is directly arranged inside the circuit board, there is no need to assemble the Rogowski coil, which is very convenient to use.
Description
Technical field
The present invention relates to crimping device arts, and in particular to it is a kind of crimp device encapsulating structure and testing current side
Method.
Background technique
Electric system high-power IGBT device mainly includes solder type IGBT device and crimp type IGBT device at present,
In, crimp type IGBT device because have many advantages, such as unique short circuit failure mode characteristic, be easy to connect, it is compact-sized obtain extensively
Using.
But it is compact just because of crimp type IGBT device inner space, cause to be difficult to install inside it current sensor with
Monitor its operating status.Especially when crimp type device is installed in the equipment such as frequency converter, power cell, it is total that it can only be monitored
Electric current cannot be separately monitored the electric current of its internal each chip to assess its working condition and service life.
To solve the above-mentioned problems, in the prior art, the boss housing inside the encapsulating structure of crimp type IGBT device
If Rogowski coil, by Rogowski coil come acquisition chip electric current.But this mode undoubtedly needs to expand the size of entire device
Assembly space could be provided for Rogowski coil, this causes device volume to increase, and easily leads to asking for device power density decline
Topic.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of encapsulating structures and current test method for crimping device, with solution
Certainly the setting of Rogowski coil causes to crimp the problem of device volume increases, power density declines in the prior art.
According in a first aspect, including being set to circuit the embodiment of the invention provides a kind of encapsulating structure for crimping device
Several crimping chips on plate, the periphery of the circuit board are provided with several dislocation via holes, conductor wire along dislocation direction successively around
It is formed on each dislocation via hole and forms Rogowski coil.
Optionally, several dislocation via holes include several inner ring via holes and several outer ring via holes, several inner ring mistakes
Hole is uniformly distributed along inner ring, and several outer ring via holes are uniformly distributed along outer ring；
The conductor wire successively the first surface of circuit board described in pile warp, the inner ring via hole, the circuit board second
Surface and the outer ring via hole, circulation forms the Rogowski coil according to this.
Optionally, circuit board periphery with a thickness of 1-2mm.
Optionally, the number of turns of the Rogowski coil is no less than 500 circles.
Optionally, the input/output terminal external impressed current test cell of the Rogowski coil.
Optionally, control terminal, and each driving signal are drawn and connected to the drive signal line of each crimping chip
Control switch is in series on line.
Optionally, it connects a substitutional resistance on the drive signal line of each crimping chip.
Optionally, several boss are provided on the circuit board, each crimping chip is respectively arranged at each boss
On, the boss is electrically connected with the driving signal receiving end of the crimping chip, and the drive signal line is direct by the boss
It draws.
According to second aspect, the embodiment of the invention provides a kind of current test methods for crimping device, including following step
It is rapid:
Closure needs to carry out the control switch on drive signal line corresponding to the crimping chip of testing current, disconnects remaining
Crimp the control switch on drive signal line corresponding to chip；
Control terminal issues driving signal to the drive signal line；
The current signal of the circuit board is flowed through by the Rogowski coil acquisition of circuit board periphery, wherein the Roche line
Circle is set to inside the circuit board.
Technical solution provided by the invention has the advantage that
Several dislocation via holes are arranged in the periphery of circuit board in the encapsulating structure of crimping device provided in an embodiment of the present invention,
It is successively wound on each dislocation via hole by conductor wire along dislocation direction, forms Rogowski coil.On the one hand, Roche line can be passed through
It encloses and current detecting is carried out to the crimping chip on circuit board；On the other hand, in this implementation, Rogowski coil, which is equivalent to, to be directly arranged at
Inside circuit board, the occupied space of Rogowski coil is reduced, the size of the encapsulating structure without expanding entire crimping device, still
It can so guarantee the high power density of crimping device entirety.In addition, since Rogowski coil is directly arranged inside circuit board,
It is very easy to use there is no need to be assembled to Rogowski coil.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the package structure diagram of crimping device provided in an embodiment of the present invention；
Fig. 2 is the flow diagram of the current test method of crimping device provided in an embodiment of the present invention.
Appended drawing reference:
1- circuit board；2- crimps chip；3- dislocation via hole；31- inner ring via hole；The outer ring 32- via hole；4- is conductive
Line；5- boss；6- drive signal line；7- control terminal；8- control switch；9- substitutional resistance.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.
According in a first aspect, the embodiment of the invention provides a kind of encapsulating structures for crimping device, as shown in Figure 1, including
Several crimping chips 2 being set on circuit board 1, the periphery of circuit board 1 are provided with several dislocation via holes 3, and conductor wire 4 is along dislocation
Direction is successively wound in each dislocation via hole 3 and forms Rogowski coil.
Wherein, crimping chip 2 is igbt chip, and igbt chip is generally distributed on circuit board 1 in matrix arrangement mode.Example
Such as, four column arrangement mode of three rows, five column arrangement mode or four rows, three column arrangement mode or four rows etc., can depending on actual demand,
This is not particularly limited.
In the present embodiment, crimping chip 2 is set to the relatively intermediate position of circuit board 1, and dislocation via hole 3 is set to circuit
The peripheral region of plate 1.Specifically, dislocation via hole 3 refer to from 1 center of circuit board with a distance from the via hole of not grade be staggered in
The peripheral region of circuit board 1, as dislocation via hole 3.Conductor wire 4 is successively wound in each dislocation via hole 3 along dislocation direction, forms spiral shell
Shape coil is revolved, that is, forms Rogowski coil.Wherein, dislocation direction refer to from a distance from 1 center of circuit board compared with as far as from
The direction that 1 center of circuit board is closer, or be closer from from 1 center of circuit board to from 1 center of circuit board
The direction positioned remote from.
In the present embodiment, conductor wire 4 has two parts, and one is the conductor wire 4 for being distributed in 1 surface of circuit board, and two be distribution
In the conductor wire 4 in via hole.Wherein, the track when conductor wire 4 for being distributed in 1 surface of circuit board is printed circuit board 1, distribution
In the conductive material that the conductor wire 4 in via hole is in injection via hole, such as metal etc..
The encapsulating structure of crimping device provided in an embodiment of the present invention, on the one hand, can be by Rogowski coil to circuit board 1
On crimping chip 2 carry out current detecting；On the other hand, in the present embodiment, Rogowski coil, which is equivalent to, is directly arranged at circuit board 1
Inside reduces the occupied space of Rogowski coil, and the size of the encapsulating structure without expanding entire crimping device still is able to
Guarantee the high power density of crimping device entirety.In addition, since Rogowski coil is directly arranged at 1 inside of circuit board,
It is very easy to use without being assembled to Rogowski coil.
As a kind of optional embodiment, in the present embodiment, several dislocation via holes 3 include several inner ring via holes 31 and several
Outer ring via hole 32, several inner ring via holes 31 are uniformly distributed along inner ring, and several outer ring via holes 32 are uniformly distributed along outer ring；Conductor wire 4
The successively first surface of pile warp circuit board 1, inner ring via hole 31, the second surface of circuit board 1 and outer ring via hole 32, recycle according to this
Form Rogowski coil.The Rogowski coil distribution of this kind of mode is more uniform, guarantees that coil parameter difference is smaller, test performance is more
Stablize.
Wherein, inner ring and outer ring can be circle, or rectangle or other shapes, it specifically need to be according to actual circuit
Depending on the shape of plate 1, inner ring and outer ring here mainly indicates that via hole is distributed along 1 periphery of circuit board, and surrounds closed shape
Shape or close to closed shape.Preferably, inner ring and outer ring is circle.
The first surface and second surface of circuit board 1 refer to the tow sides of circuit board 1, one end connection first of via hole
Surface, the other end then connect second surface.Assuming that the coiling by the first surface of circuit board 1 of conductor wire 4, then through inner ring mistake
The second surface of circuit board 1 is arrived in hole 31, then arrives the outer ring via hole 32 adjacent with the inner ring via hole 31, then arrives the first of circuit board 1
Next surface is exactly to be wound in the inner ring via hole 31 adjacent with last round of inner ring via hole 31, second surface of circuit board 1 etc.
Deng circuiting sequentially.
In the present embodiment, the Rogowski coil of 1 periphery of circuit board has signal input part and signal output end, both external
Testing current unit is handled by the electric signal that testing current unit generates Rogowski coil, and then obtains chip current.
As a kind of optional embodiment, in the present embodiment, the thickness of 1 peripheral region of circuit board is greater than the thickness in other regions
Degree, wherein the periphery of circuit board 1 with a thickness of 1-2mm.That is, passing through 1 peripheral region of circuit board where increase Rogowski coil
Thickness increases the magnetic flux across coil section, improves the measurement sensitivity of Rogowski coil.
As a kind of optional embodiment, in the present embodiment, the number of turns of Rogowski coil is no less than 500 circles.
As a kind of optional embodiment, in the present embodiment, each drive signal line 6 for crimping chip 2 is drawn and is connected
Control terminal 7, control terminal 7 is used to send driving signal to each crimping chip 2, and is in series with control on each drive signal line 6 and opens
Close 8.That is, being operated alone to each crimping chip 2 can be realized by the disconnection and closure of switching control switch 8.As a result,
When needing to carry out testing current to single crimping chip 2, can be closed on the corresponding drive signal line 6 of crimping chip 2
Control switch 8, and the control switch 8 on other crimping corresponding drive signal lines 6 of chip 2 is disconnected, at this point, control terminal 7 is independent
The crimping chip 2 is driven to work, electric current measured by Rogowski coil is the electric current of the crimping chip 2.That is, through this embodiment
The encapsulating structure of provided crimping device facilitates practical application, it can be achieved that each independent detection for crimping 2 electric current of chip
When, each crimping chip 2 in crimping device is individually assessed.
As a kind of optional embodiment, in the present embodiment, series connection is first-class on each drive signal line 6 for crimping chip 2
It is worth resistance 9.The resistance value of substitutional resistance 9 is preferably 1-5 ohm.The setting of substitutional resistance 9 helps to eliminate different crimping chips 2
The difference of driving signal caused by 6 mutual inductance of drive signal line and self-induction difference.
As a kind of optional embodiment, in the present embodiment, several boss 5 are provided on circuit board 1, it is each to crimp chip 2
It is respectively arranged on each boss 5, boss 5 is electrically connected with the driving signal receiving end of crimping chip 2, and drive signal line 6 is by boss 5
It directly leads out.When practical application, using the gate pole of igbt chip as driving signal receiving end, electrically connect with one end of boss 5
It connects, drive signal line 6 is to connect with this one end (one end connecting with gate pole) of boss 5.As long as being put as a result, by igbt chip
When being placed on boss 5, it is ensured that the gate pole of igbt chip and boss 5 are corresponding with one end that drive signal line 6 connects and are electrically connected
?.
According to second aspect, the embodiment of the invention provides a kind of current test methods for crimping device, as shown in Fig. 2,
The following steps are included:
Step S11, closure needs to carry out the control switch on drive signal line corresponding to the crimping chip of testing current,
Disconnect the control switch on drive signal line corresponding to remaining crimping chip.
Step S12, control terminal issues driving signal to drive signal line.
As being only closed the control switch for needing to carry out on drive signal line corresponding to the crimping chip of testing current,
Therefore when control terminal issues driving signal, driving signal can be only transmitted on the crimping chip for needing to carry out testing current, real
Now crimping chip is operated alone.
Step S13, the current signal of circuit board is flowed through by the Rogowski coil acquisition of circuit board periphery, wherein Roche line
Circle is set to inside circuit board.
Need to carry out the crimping chip of testing current due to being operated alone, electric current measured by step S13 is
Electric current caused by the above-mentioned crimping chip being operated alone, and then realize to the independent detection of each crimping chip current, it helps
In practical application, each crimping chip in crimping device is individually assessed.
In the present embodiment, the periphery of circuit board is provided with several dislocation via holes, and conductor wire is successively wound in along dislocation direction
Each dislocation via hole forms Rogowski coil.Preferably, several dislocation via holes include several inner ring via holes and several outer ring via holes, several
Inner ring via hole is uniformly distributed along inner ring, and several outer ring via holes are uniformly distributed along outer ring；Conductor wire successively pile warp circuit board first
Surface, inner ring via hole, the second surface of circuit board and outer ring via hole, circulation forms Rogowski coil according to this.
On the one hand, current detecting can be carried out to the crimping chip on circuit board by Rogowski coil；On the other hand, this reality
It applies in example, Rogowski coil, which is equivalent to, to be directly arranged inside circuit board, the occupied space of Rogowski coil is reduced, without expanding
The size of the encapsulating structure of entire crimping device still is able to guarantee the high power density of crimping device entirety.In addition, due to sieve
Family name's coil is directly arranged inside circuit board, very easy to use there is no need to assemble to Rogowski coil.
Although being described in conjunction with the accompanying the embodiment of the present invention, those skilled in the art can not depart from the present invention
Spirit and scope in the case where various modifications and variations can be made, such modifications and variations are each fallen within by appended claims institute
Within the scope of restriction.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811153245.2A CN109473422B (en) | 2018-09-29 | 2018-09-29 | Packaging structure and current testing method of crimping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811153245.2A CN109473422B (en) | 2018-09-29 | 2018-09-29 | Packaging structure and current testing method of crimping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109473422A true CN109473422A (en) | 2019-03-15 |
| CN109473422B CN109473422B (en) | 2021-04-23 |
Family
ID=65665115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811153245.2A Active CN109473422B (en) | 2018-09-29 | 2018-09-29 | Packaging structure and current testing method of crimping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109473422B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109856441A (en) * | 2019-04-15 | 2019-06-07 | 华北电力大学 | Crimp type IGBT device chip current on-line measurement system |
| CN110133354A (en) * | 2019-04-26 | 2019-08-16 | 华中科技大学 | A PCB Rogowski coil for measuring the chip current of the crimped IGBT module |
| WO2021088187A1 (en) * | 2019-11-05 | 2021-05-14 | 深圳第三代半导体研究院 | Press-fit power module inspection system and inspection method |
| CN112834894A (en) * | 2021-01-07 | 2021-05-25 | 清华大学 | A magnetic field testing device for semiconductor current density inversion |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104459277A (en) * | 2014-12-04 | 2015-03-25 | 国家电网公司 | High-power pressed connection type IGBT module current detection method |
| JP2017152528A (en) * | 2016-02-24 | 2017-08-31 | 日本特殊陶業株式会社 | Wiring board and semiconductor module |
-
2018
- 2018-09-29 CN CN201811153245.2A patent/CN109473422B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104459277A (en) * | 2014-12-04 | 2015-03-25 | 国家电网公司 | High-power pressed connection type IGBT module current detection method |
| JP2017152528A (en) * | 2016-02-24 | 2017-08-31 | 日本特殊陶業株式会社 | Wiring board and semiconductor module |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109856441A (en) * | 2019-04-15 | 2019-06-07 | 华北电力大学 | Crimp type IGBT device chip current on-line measurement system |
| CN109856441B (en) * | 2019-04-15 | 2024-05-10 | 华北电力大学 | Crimping type IGBT device chip current online measurement system |
| CN110133354A (en) * | 2019-04-26 | 2019-08-16 | 华中科技大学 | A PCB Rogowski coil for measuring the chip current of the crimped IGBT module |
| CN110133354B (en) * | 2019-04-26 | 2020-07-10 | 华中科技大学 | PCB Rogowski coil for measuring current of crimping IGBT module chip |
| WO2021088187A1 (en) * | 2019-11-05 | 2021-05-14 | 深圳第三代半导体研究院 | Press-fit power module inspection system and inspection method |
| CN112834894A (en) * | 2021-01-07 | 2021-05-25 | 清华大学 | A magnetic field testing device for semiconductor current density inversion |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109473422B (en) | 2021-04-23 |
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