TWI360658B - - Google Patents

Description

1360658 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a test apparatus, particularly a probe test apparatus for testing an integrated circuit wafer.

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[Prior Art] In the integrated circuit wafer test, the probe card circuit board for transmitting the test signal is touched by the test head of the test machine to receive the test signal of the test machine and is transmitted to the underside of the circuit board. ^ Probes densely placed in the premises. After the probes corresponding to the touched chip electronic components receive the test signal, the probe card is passed back to the corresponding electrical characteristics of the job machine for analysis: thus, during the entire wafer level test, the probe The circuit transmission of the card circuit board has a very important influence on the electronic component test results, especially with the higher-speed operation of the electronic technology, the test process is transferred to the actual corresponding high-speed, as a condition, so the transmission secret production It is more necessary to comply with the high-speed money operation bar = the first figure shows the semiconductor system of the H system provided by the US Patent Test No.. 'The probe card is divided into the upper 1G and the lower probe. The board 12 and a plurality of spacer test joints in the middle=the road board 10 is provided with a measuring and reducing joint 11' such as a coaxial transmission line structure, which can avoid the parasitic resistance of the dielectric ring contacting the circuit board 1G itself. However, by (4) touch (four) board i == test head touch, probe board 12 is provided for setting probe '- fixed body body; two has sufficient support strength and Tiantian/bei M machine table 1 is pressed and applied When the stress is to be applied to the entire 20-slide 2 card structure, the problem that the contact circuit board 1〇 and the probe board 12 are subjected to the force plane is liable to cause the contact circuit board 1G or the probe card 12 to be deformed due to uneven local stress. Moreover, when the probes 13 touch the wafer plane, the front end of the needle plate 12 is continuously subjected to the reaction from the wafer plane for such a long time, and the probe card 12 is provided with a probe at the front end. The planar structure of 13 is also prone to deformation. :. Even though the other probe card 2 structure can be used as shown in the second figure, the signal transmission process is performed from the outside to the inside and from the top to the bottom through the line 21 disposed on the multilayer printed circuit board 2G. The laminated circuit board is strong and then sent by the probe 22, so that the overall structural strength of the circuit board 2 and its single receiving plane can disperse the force evenly when subjected to stress, without causing deformation of the local cross-force unevenness. problem. However, the multilayer printed circuit board 2 is formed by laminating a plurality of layers of glass fiber material or shouting material, and each layer structure is provided with a metal wire (4) to form a line 21 structure, so that it is not only costly and labor-intensive to manufacture, but also When the transmission line 21 is disposed inside the circuit board, the main reason why the circuit board 2 between the adjacent lines 21 is disposed is likely to cause leakage current, and the conduction hole line 2W which is formed by the structure of each layer of the circuit board 2G is easy to make the signal. The energy loss of interface reflection occurs during longitudinal transmission, which seriously affects the transmission characteristics of high frequency jobs, and cannot meet the south speed test requirements of electronic circuit components. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a probe testing device which has high structural strength and can be transferred to high quality transmission characteristics. J658 A second invention - the aim is to provide - a heterogeneous test with a South efficiency and low cost. /, /, Still another object of the present invention is to provide a probe test that blocks external moisture from coming into contact with internal signal lines. The test signal sent by the test machine can be used to perform the pre-existing 'deployment of the present invention' to test the power of the circuit wafer. The probe testing device is connected to the circuit layer of the near-center, hetero-support-material I test machine from the top of the probe testing device. The outer ring of the support material is subjected to the stress of the lower pressure switch: when the probe set by the probe set corresponds to the electronic component on the wafer, the inner ring portion of the support frame receives the wafer from the wafer The reaction force enables the structural strength of the support frame to be applied to the circuit layer and the probe structure of all the equivalent transmission signals. Moreover, since the circuit layer is an insulating material structure, the layer thickness is higher than that of the multilayer printing. The circuit board is thin, even if the occupational requirements penetrate the circuit layer, it is only a very short path, which effectively solves the leakage current effect between adjacent transmission signals when the test signal is transmitted in the dielectric material, and effectively reduces the multilayer printed circuit such as the conventional one. The complicated production process of the board. [Embodiment] The following is a list of preferred embodiments for illustrating the structure and function of the present invention. 5 Qing, as shown in the third to fifth figures, the probe testing device 3' of the first preferred embodiment of the present invention can transmit a test signal sent by a test machine, and use 20 1360658 to make an integrated circuit wafer. Electrical test. The probe testing device 3 includes a support frame 30, a circuit layer 4A, a cantilever probe set 5A, and a plurality of signal lines 60. 15 Referring to the sixth figure, the support frame 30 is a ring-shaped rigid body of considerable strength. The size is equivalent to the size of a general semiconductor wafer, and is formed by forming a metal shell (such as stainless steel) in a thickness equivalent to a conventional multilayer. The structure of the printed circuit board can withstand the stress applied by the probe testing device 3 during the test operation without changing the flatness of the rigid body so as not to change. The support frame 30 has upper and lower opposite upper surfaces 3 and a surface 302, and one of the first ring portions η, the second ring portion 32, and the plurality of diameter portions 33, which are sequentially distributed from the periphery toward the center. a third ring portion %, and a fourth ring ^ 3 - 5, wherein the second ring portion 32 and the diameter portions 33 form one of the support frames 3 < the: support portion 36, the cross-sectional range of which corresponds to the circuit ^ 4" "horizontal wearing range and with the circuit layer 4 - the horizontal plane is completely _, can provide the stress on the supporting circuit layer 40, and the fourth ring portion 35 = second, the part 'to provide the probe set 5G and provide the stress effect of the papers in the group of the needles, with reference to the fifth figure. Referring to Si and FIG. 5, the circuit layer 4 has insulating properties. The early-layer printed circuit board is disposed on the upper surface 3 of the support frame 3 and located on the first support portion 36. The circuit layer 4G has a plurality of the above test machines electrically connected to receive the test signal 1 for the positions of the test contacts 41 to be disposed through the corresponding holes and the equal holes 42 of the corresponding holes. The signal line 40 is electrically connected to the signal line 60 and transmitted to the signal line 60 by the test signal received by the system. The phantom joint 41 7 20 W and the fourth and fifth figures are referenced, and the probe set 5 () has a _ support yoke 52 and a recording arm _ 53. The female 51 is located below the bribe section 35 of the material, and is made of the second of the financial insulation and shockproof characteristics. The needle is used to wear the needle 53 and the probe is suspended from the probe base. 51 below; the adapter plate 52 is made of an insulating single-layer material, and is disposed on the third and fourth points of the support frame 3Q, and has a plurality of guide holes 52G, and the guide holes are different. The line 60 and the probe 53 are, for example, squashed or connected to the signal line 60 and the probe 53. In this case, the present invention utilizes the rigid structure of the support frame 3Q to support the probe base 51 in the square. Therefore, when the machine is self-explored, the test contact 41 of the circuit layer 4 is pressed downwards. j A support portion 36 is subjected to the stress of the depression point, and when the probes 53 correspond to the electric contact on the wafer, the self-supporting portion is subjected to the second support portion to receive the miscellaneous ^ (4) ί # ' It not only reduces the complicated manufacturing process of the conventional multilayer printed circuit board, but also shortens the circuit layer and probe group structure for fixing all the equivalent transmission signals by making a large number of single-structures of the dicing frame 30. (4) Equipment (4) Working period. Moreover, since the adapter plate 52 is a single-layer thick insulating material structure, the through holes 42 and 52 of the circuit sound 40 and the adapter plate 52 are only extremely short paths. When the leakage between the adjacent transmission signals, the LEDs 42 and 520 do not need to pass through the interlayer interface in the longitudinal through-pass path, when the remaining test signals are transmitted to the via holes 42, 520, the multilayer printed circuit board does not occur. The through hole structure faces the energy loss problem of the interlayer 1360658 medium, so that the probe testing device 3 maintains good signal impedance matching characteristics during the high frequency test. Please refer to the seventh figure, which is the signal frequency characteristic curve of the probe testing device 3. The reflection loss curve S11 in the figure shows that the probe testing device 3 transmits the high frequency signal with excellent impedance matching, and the insertion loss in the figure. Curve S12 further shows that the -3dB gain passband transmission frequency of the high-frequency signal can be as high as several GHz, and has low loss and good matching high-frequency signal transmission quality. It should be noted that, within the scope of the energy loss problem, the structure of the circuit layer 4〇 and the adapter plate 52 is not limited to a single-layer thickness, and a two-layer thickness may be formed to increase the circuit layer 4 turns and turns. The structural strength of the web 52. Above the eighth figure, the probe test device 3 can support "30 15 branches can be = 7 genera: quality = porcelain, etc.. The model can be processed in the ninth diagram of the pottery 52, which can be guided by the circuit layer 4G. The conductive hole 520 of the hole 42 plaque board is respectively disposed between the grounding hole 42 of the grounding plate and the guiding hole 转接 of the adapter plate 52, and the circuit line 62 is electrically connected, wherein the same wire The shaft of the shaft 62 is inserted into the guide hole 42 of the circuit layer 4 and the guide hole of the adapter plate 52 is respectively connected to the circuit layer 4 at both ends of the grounding metal. The guide hole 44 and the grounding guide hole 54 of the adapter plate 52. Grounding 20 1360658 It is worth mentioning that, for better high frequency signal transmission considerations, as shown in the tenth embodiment, the probe testing device 4 of the second preferred embodiment of the present invention is provided. The probe testing device 4 has a support frame 30, a circuit layer 45, a cantilever probe set 55, and a plurality of signal lines 65, which differ from those provided by the first preferred embodiment in that: the circuit layer 45 has A plurality of test contacts 46 and a through hole 47 are formed in the positions corresponding to the test contacts 46. The through holes 47 are respectively passed through the signal lines 65 for electrically connecting the test contacts 46. The needle set 55 has a probe base 51 and a plurality of cantilever probes 56. The probes 56 are respectively connected to the respective signal lines 65 at the adjacent 10 probe bases 51. Therefore, after the test contacts 46 receive the high frequency test signals transmitted by the test machine, the high frequency test signals are directly transmitted to the probes 56 through the signal lines 65 designed for high frequency transmission. Therefore, the probe test is performed. The device 4 can further eliminate the leakage current effect between the test signal transmission in the dielectric material to effectively prevent the adjacent transmission signal 15, and provide a single and high-quality signal transmission environment, and has a low loss, good matching high frequency. Signal transmission quality. Of course, the test device provided by the present invention can be used as the probe test device of the third preferred embodiment of the present invention, in addition to the application of the cantilever probe structure of the above embodiment. 5, the probe testing device 2 〇 5 is a vertical probe structure application, comprising a support frame 3, a circuit layer 70, a vertical probe set 80, and a plurality of signal lines 9 〇, and the above embodiment The difference between the providers is that the circuit layer 70 has a plurality of test contacts 71 and one of the signal solder joints 72 electrically connected to the adjacent positions of the test contacts 71. Each signal solder 10 10360658

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The point 72 is electrically connected to the signal line 90 for transmitting the test signal received by each test contact 71 to the signal line 90. The probe set 80 has a mount 81, a probe holder 82, and a plurality of vertical probes 83. The fixing base 81 is disposed on the fourth ring portion 35 of the support frame 30, and has an opening 811 facing upward and a base 812. The signal lines 9 are extended from the opening 811 and pass through the base 812. The base 812 is below the probe. The base 82 is fixedly connected, and the probe base 82 is made of an insulating material, and each of the probes 83 is longitudinally disposed through the probe base 82, so that the end-end of the ship line is suspended from the probe base. Below 82. Therefore, the probe testing device 5 also supports the circuit layer 70 on the upper side by using the support frame 3, and the source of the stress is transmitted by the test signal _ after receiving the signals. Line 4 === Effectively reduce the case of adjacent transmission signals, and the port j N is guilty of a transmission environment. The leakage current effect between u, provide high quality information, please refer to the twelfth $笸== test heart, == Ming = (1) upper and lower (four) 2; = connected with the measuring platform for the test machine component _, with the test circuit of the hybrid circuit wafer to be tested to the integrated circuit wafer (4) = ^ $ test signal from top to bottom - support 3G, - * electric test. The probe test device 3' includes a signal line 60. Road layer 4〇', - cantilever probe set 50, and a plurality of 20 1360658 • Please refer to the twelfth and fifteenth figures for reference, support frame 30, divided into inner and outer •. Two-piece rigid body structure of the circle They are the first support portion 31 of the outer ring and the second support portion 32' of the inner ring. The first supporting portion 31' is an annular structure, which is equivalent to the transverse cross-sectional size of the circuit layer 40', and is provided with a circuit layer 4〇, and supports the electric stress: -5 layer 40' is subjected to the stress, and the first supporting portion 31, having an inner frame. 311'' and wearing a plurality of perforations 312 for the signal lines 6〇, piercing; the second φ second support portion 32' is an annular frame body, having an outer frame 321, and a majority The radially distributed ribs 322, the outer frame 321 and the first support portion 31, the inner frame 311 are interlocked with each other and protrude from the bottom of the first support portion 31 by a height, so that the first branch portion A plurality of gaps 33 are formed between the 31' and the second support portion 32, and the plurality of gaps 60' are provided from the support frame 30, and the outer ring extends through the gaps 33 to the support frame 30 and the inner ring; The ribs 322 are the same plane diameter as the outer frame 321, and can provide higher strength support to set the probe set 5〇, and the average stress and the stress of the probe set 50, and the The ribs are provided between the signal lines 60 of the Lu 15 and passed through, so that the signal lines 6〇 are connected to the probe set 5〇. Jing cooperates with the twelfth, fourteenth and sixteenth figures to refer to the circuit layer 40, . Also located above the first support portion 31 in the probe testing device 3, the upper side 3a circuit layer 4' has a plurality of test contacts ^, for the test machine 20 to touch to receive the test signal, and can be vertically turned on To the circuit layer 4〇, the lower side is electrically connected to each signal line 60', so (4) test some signal lines 60'. Please refer to the twelfth, fourteenth and seventeenth drawings. The probe set 5〇 has an adapter plate 51, a probe holder 52', a fixing ring 53, and a plurality of 12 1360658 cantilever Probe Μ,. The adapter board M is disposed on the first floor portion 32, below the probe testing device 3, on the lower side, and has a plurality of solder joints on the upper and lower sides of the switch ^=, The upper side is provided with a plurality of sub-components for electrically connecting the solder joints 51 〇, and the solder joints 51 〇 are provided with solder signal lines 6 〇 on the upper and lower sides of the interposer board, and the probes %, 60' And the probes 54 are electrically connected to each other in the longitudinal direction, or can be processed by the electronic signal to transmit the signal line 6G, and the signal is processed to the corresponding probe 54, and the probe holder 52 is disposed on the adapter. The plate 51 is made of a material near the center of the bag; the fixing ring 53 is disposed on the probe base 52 and is made of an adhesive 3 insulating material; the probe 54 is fixed by the fixing ring 53 Seat 52, 'Make the probes 54, the tip of the needle protrudes from the fixed ring 53, = square. Please refer to the twelfth to the first drawing, the support frame 30, the circuit piece 4〇, and the probe set 50' are assembled, then an upper and lower cover, 302' are respectively locked on both sides, and the upper cover is respectively The 301' is disposed on the first support portion 31, and the inner frame 311 is provided with an adapter plate 51 for sealing the plurality of wires (9) inside the probe measuring device 3', which has an appearance and prevents foreign matter from being inside. The formation of contamination '^ ensures the quality of the probe test device 3. "β ' 20 Therefore, the probe testing device 3 provided by the present invention utilizes a rigid structure, and the probe support is supported by the first support portion 31 and the branch circuit layer 4 5〇,, so when the test machine is pressed from the upper side 3a of the probe test device 3 to touch the circuit layer 4〇, the test contact Μ, the first branch portion 31, withstand the stress of the pressing point, And when the lower side% of the probes 54 correspond to the electronic components on the wafer, the second branch is <S) 13 1360658

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The part 32' withstands the reaction force from the wafer, which not only reduces the complicated manufacturing process of the conventional multilayer printed circuit board, but also can be used to fix all the circuits capable of equivalently transmitting signals by making a large number of support frames. The layer and probe set structure 'effectively shortens the production schedule of the entire test device. Furthermore, since both the circuit layer 40 and the interposer 51 are of a good insulating material structure, the signal penetrates the circuit layer 40' and the interposer 52, and is only a very short path, effectively solving the test signal. The leakage current effect between adjacent transmission signals when transmitting in the dielectric material, and the interlayer medium does not need to pass through the interlayer medium, so that the energy loss of the interlayer dielectric faced by the through-hole structure of the conventional multilayer printed circuit board does not occur. The probe test device and the frequency test process maintain a good signal impedance matching characteristic, and have high-frequency signal transmission quality with low power consumption and good matching. _ , It should be noted that, within the scope permitted by the energy consumption problem, the structure of the layer 40 and the adapter plate 52 is not limited to the thickness of the single layer, and the thickness of the layer is 2, 加5 In addition, as shown in Figure 18, the support frame 3. The first and second support portions 32 and the outer frame 321' may be filled with a colloidal resin). In addition to the addition of the probe device (for example, the signal lines 60 may be enclosed therein, the number is used. Line 60, contact. r-mediated water emulsion and til, as shown in the nineteenth and twentieth figures, is a needle reading position 4 of the embodiment of the present invention, which has a branching point = line 60' and - The integrated probe set 7〇, the integrated probe set ^, in the support frame 30, the: cut 32, below, and the above fine = 20 1360658. The difference between the examples is that the wafer is touched The probe of the electronic component is a microelectromechanical product structure, wherein: the integrated probe set 70' is an adapter plate 71 and an integrated structure of a microelectromechanical probe device 72'. 71, with circuit space conversion function, -5 is a space transformer made of a multi-layered organic (Multi-Layered 〇rganic, ML〇) structure or a multilayer ceramic (MLC) junction structure with insulating properties. a plurality of wires 710 are disposed in the middle, and the wires 710 are arranged to gradually reduce the adjacent pitches from top to bottom. The upper part can be electrically connected to each of the signal lines 60, and the signal lines 6G' can be vertically connected to the lower microelectromechanical probe device 72. The microelectromechanical probe is mounted, and 72' is formed by an insulating substrate. The needle holder 72〇, the conductive plurality of through holes 721, and the corresponding - (four) type probe 722, respectively, the assembly manner of the integrated probe set 70' is the through holes 721, respectively Electrically connecting the adapter board 71, each of the wires 71〇, ##=The field circuit layer 40' receives the test signal transmitted by the test machine, and the line 2 is 6〇, that is, the test signal is transmitted to the adapter board. 71, the wire 710, and even the probe 722 of the 2's probe 72', therefore, the probe testing device 4, with the equivalent function of the fourth embodiment, can also be used by the microelectromechanical probe 20 The fine pitch is applied to measure the finer pitch of the wafer electrons to the second: the second probe device provided by the present invention can also be as shown in the twenty-first (four)^three figure, which is the sixth comparison provided by the present invention. The preferred embodiment of the probe # 4 and 5 'for the application of the vertical probe structure' includes a - circuit 支撑 a support frame 80', A plurality of signal lines 65 ', an upper, lower cover 501 ,, 1513606585

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502' and a vertical probe set 9〇. The support frame 80 is a first support portion 81' having an outer ring and a second support portion 82 of the inner ring, respectively provided with the circuit layer 45' and the probe set 90'' and the fifth embodiment. The difference is that the vertical probe set 90 is a probe holder composed of an upper and lower guide plates 91, 92, and a positioning seat 93 for fixing a plurality of vertical probes. The upper guiding plate 91' is fixed to the supporting frame 8'', and the second supporting portion 82 is below, so that the vertical probes 94 can be respectively fixed to the respective signal lines 65'; the upper and lower guiding plates 91' '92' and positioning seat 93' are made of insulating material, for each probe, longitudinally, so that the probe 94, one end is electrically connected to the signal line 65, and the other end point is suspended in the lower guide Bit plate 92, below. Therefore, the probe testing device 5 provided by the present invention also utilizes the support frame 80, and the rigid structure is supported on the upper supporting circuit layer 45 to support the probe set 90' underneath, effectively withstanding the circuit layer 45, and the needle pin% The directly received stress source i is directly connected to the signal lines 65 and the electrical spitting connection. The circuit layer 45 receives the test signals transmitted by the test machine, that is, through the signal lines 65. Directly passed to each of the probes 94, the signal line 65 can be omitted, and the probe 94, the external circuit switching structure can be set. The above description is only for the preferred embodiments of the present invention, and the equivalent structures of the present invention and the scope of the claims are intended to be included in the scope of the present invention. 16 20 [Simple description of the diagram] The schematic diagram is the structure of the probe card provided by US Pat. No. 475. The second diagram is a schematic diagram of another conventional cantilever probe card. The second figure is the first comparison of the present invention. The top view of the preferred embodiment; the fourth view is a bottom view of the first preferred embodiment of the present invention; the fifth view is a cross-sectional view along the Α-Α line in the third figure; The seventh embodiment of the present invention provides a structure of the perfusion gel of the first preferred embodiment of the present invention. The ninth embodiment is a schematic view of a second preferred embodiment of the present invention. The eleventh figure is a schematic view of the second preferred embodiment of the present invention. FIG. 12 is an exploded perspective view of a fourth preferred embodiment of the present invention; FIG. 13 is a bottom perspective view of a fourth preferred embodiment of the present invention; A schematic view of the structure of the embodiment; the fifteenth figure is the fourth preferred embodiment of the present invention The bottom view of the support frame provided by the embodiment; FIG. 16 is a top view of the combination of the partial structure provided by the fourth preferred embodiment of the present invention, which mainly shows that the support frame is provided with a circuit layer, a signal line and a probe set. 1360658 Fig. 17 is a bottom view of Fig. 16; Fig. 18 is a schematic view of the structure of the fourth preferred embodiment of the present invention after injecting a colloid, and Fig. 19 is a fifth comparison provided by the present invention 20 is a schematic structural view of a fifth preferred embodiment of the present invention; and FIG. 11 is an exploded perspective view of a sixth preferred embodiment of the present invention, The figure is a bottom perspective view of a sixth preferred embodiment of the present invention; and a twenty-third figure is a schematic structural view of a sixth preferred embodiment of the present invention. [Main component symbol description] "First embodiment" 15 3 probe test device 30 support frame 301 upper surface 302 lower surface 31 first ring portion 32 second ring portion 33 diameter portion 34 third ring portion 35 fourth ring portion 20 3 6 First support part 37 Colloid 40 Circuit layer 41 Test contact 42 Guide hole 50 Cantilever probe set 51 Probe holder 52 Adapter plate 520 Guide 53 Cantilever probe 18 1360658 60 signal line S12 insertion loss curve "Second Embodiment" 4 Probe Tester 5 45 Circuit Layer 47 Through Hole 55 Cantilever Probe Set 65 Signal Line "Third Embodiment" ίο 5 Probe Test Apparatus 71 Test Contact 80 Vertical Probe Set 811 Opening 82 probe holder 15 90 signal line "Fourth embodiment" 3' high speed test device 3 a' upper side 30 Γ upper cover 2 〇 30' support frame 311' inner frame 32' second support portion 322' rib 34' colloid S11 Reflection loss curve 46 test contact 51 probe holder 56 cantilever probe 70 circuit layer 72 signal solder joint 81 fixed seat 812 base 83 vertical probe 3b' lower side 302' lower cover 31' first support portion 312' perforation 32Γ outer frame 33' gap 40' circuit layer 19 1360658 41' Contact 51' adapter plate 511' electronic component 53' fixing ring 5 60' signal line "fifth embodiment" 4' high-speed test device 70' integrated probe set 710' wire 10 720' probe holder 722' cantilever Type probe "Sixth embodiment" 5' high speed test device 501' upper cover 15 45' circuit layer 80' support frame 82' second support portion 91' upper guide plate 93' positioning seat 50' cantilever probe set 510 'Welding point 52' probe holder 54' cantilever probe 71' adapter plate 72' microelectromechanical probe device 721' through hole 502, lower cover 65' signal line 81' first support portion 90' vertical probe Group 92' lower guide plate 94' vertical probe 20

Claims (1)

Patent application scope: L A probe test device for transmitting an r-containing: number to an integrated circuit wafer for electrical testing 'this probe; test: two, the first: =, with: upper surface, a relatively upper The surface below the surface, and the red support portion is surrounded by the first-cut portion; the fourth layer is disposed on the upper surface of the mosquito support frame and is located on the first support: the upper layer has a plurality of test joints, For the electrical connection; a probe set having a probe holder and a plurality of probes, the probe holder being made of a material having an insulating property, and disposed on the second support portion of the branch frame, The probes are fixed to the probe holder, and the probe tips of the probes are suspended below the probe holder; and the §fl line of each of the plurality of signal lines are electrically connected to the circuit layer respectively. Test the junction and the probe of the probe set. The probe testing device of claim 1, further comprising a gel interposed between the upper surface and the lower surface of the branch. 3. The probe testing device of claim 1, wherein the support frame is an integrally formed structure. 4. The probe testing device of claim 3, wherein the support frame is made of 20 metal material. 5. The probe testing device of claim 4, wherein the metal material is a non-recorded steel material. 6. The probe testing device of claim 3, wherein the branch is made of a non-metallic material. 21 The first support portion has at least a ring portion and a plurality of portions, wherein the diameter portion of the diameter portion of the support frame corresponds to a diameter portion, and the ring portion and the circuit layers are in contact with the horizontal plane. The lateral cross-section of the 4-way layer and the insulating tape (4) of the probe as described in claim 1 are disposed. The circuit layer is disposed below the junction of the circuit layer. The knife is correspondingly disposed on each of the two guiding holes of the test socket, and the second and second supporting portions are located between the probe group and the second supporting portion. - Branch ns _ - The needle is electrically connected to the adapter plate. 13. ^Provide the probe ^ described in item 12, and make the two-year-old financial connection _ scale with the multi-device 20 guide hole and the probe. The probe holes 'each of the probes as described in the claim </ RTI> are passed through the probe holder, and one of the probes is connected to each of the probe number lines. The heart is large, the other end is the same as the signal 15. The probe of the request item 1 is provided with a plurality of through holes, respectively, for the library #, , the circuit layer j field should be placed under each test contact (S) 22 is provided for each of the signal lines to electrically connect the test contact. I6. The probe testing device of the above-mentioned item i, wherein the circuit layer has a plurality of signal solder joints, and the plurality of signal points are located at the same plane of the circuit layer, and the signal lines are respectively electrically The probe test device of the above-mentioned item 16, wherein the probe holder is surrounded by a first support portion of the support frame, and each probe is disposed with the probe holder. Each of the probe-ends is the tip of the probe, and the line is connected to the line. 18. If the probe test device described by g π is ascertained, the probe set further has a fixed seat for the branch Surrounded by a second building portion of the pedestal, the probe base is disposed under the pedestal seat, and the signal lines are passed through the fixing base. 19. The probe testing device according to Item 1 of the above, wherein The probe set is a cantilever probe set. 20. The probe test device according to claim 1, wherein the set is a vertical probe set. 15 21. The probe type test is shocked and differentiated. On the upper and lower opposite sides, the upper side is used to electrically |± connect the test machine, and the lower side is used to electrically connect an integrated positive circle to convey the test machine to send out The test signal is used to electrically test the product-and-channel wafer. The probe device includes: 20, 20: the if frame 'has the - the first branch and the second branch, the first branch P. P is surrounded by the first support; the circuit layer is set on the "support" and is located on the upper side of the drum support. The layer has a plurality of test contacts for the electrical test of the test machine. The second branch is located on the lower side of the drum bracket, and the 23 &lt;s 1360658 has a probe base and a plurality of probes, and the probe base is made, and the probes are mosquitoes. Each of the probes is disposed on a lower side of the probe holder for contacting the circuit wafer to the plurality of signal lines, and the two ends of the signal lines are electrically connected to the test contacts of the road layer and the Probe for the probe set. ° 22. The probe testing device of claim 21, the support portion is a ring structure. ^^孩弟- 23. The probe testing device according to claim 22, wherein the support portion is provided with a plurality of perforations 'the signal lines pass through the secret hole ^; the test contacts of the circuit layer are electrically connected. The probe testing device of claim 21, wherein the first supporting portion has a plurality of gaps between the first support portions, and the signal lines are separated by the The probe is electrically connected to the probe of the probe set. The probe test device of claim 24, wherein the first dental portion has two support portions having a simple outer reading a gap between the outer frame of the second support portion and the inner portion of the first support portion. [20. 26. The material testing device according to claim 21, further comprising a winning body, The probe testing device of claim 21, wherein the signal is connected to the circuit layer under the circuit layer. The probe test device of claim 27, wherein the circuit layer has a printed circuit having an insulating property 29. The probe testing device of claim 21, wherein the probe set 24 5 further has an adapter plate disposed at the diagnosis - the needle holder is fixed under the support portion of the adapter extension The side is electrically connected to the signal lines. For the probe device having the insulating raft, the (4) adapter plate is touched by the 电路 电路 brush circuit board structure, and the signal wires are soldered to the side. The probes are electrically connected to the underside of the adapter board, and the probes (4) electrically connected to each of the signal wires are vertically connected in the adapter board. At least the probe testing device is provided, wherein the adapter The electronic component of the board is electrically connected to the signal line and the probe. 10 For the probe, the probe is placed, wherein the adapter plate is made of a plurality of wires, gradually, ^1 The upper side extends to the lower side of the interposer board, and is spaced from the top to the bottom, and the signal lines are respectively electrically connected to the side of the interposer board. The lower side is electrically connected to each of the respective 15 33. The probe testing device of claim 32, wherein the multilayer organic structure or The probe test device of claim 21 or 32, wherein the probes are cantilever probes that are MEMS mounted on the probe holder, 20 the probe holder is disposed There are a plurality of through holes, each of which has an electrical connection between the signal line and the probe. The _. The probe according to the item 21 or 29 or 32. The test device, wherein each of the probes is disposed through the probe holder from top to bottom, and the two ends of the probe are electrically connected to the signal line and suspended on the lower side of the probe holder.