JPWO2009011201A1 - Inspection structure - Google Patents

Abstract

An inspection structure is attached to the lower surface side of the circuit board in the probe card. The inspection structure includes a pedestal portion, a substrate-like contact portion attached to the lower surface of the pedestal portion, and a holding portion that holds the pedestal portion. The contact portion is formed by laminating a wiring layer, an insulating layer, and an elastic layer in this order from the bottom, and each probe pin is formed by bending a part of the surface of the contact portion downward. It has a laminated structure having a layer and an elastic layer. The conductive wire and the dielectric portion are coaxially arranged in the conductor portion of the pedestal portion. The conductive wire is electrically connected to the probe pin and the circuit board.

Description

  The present invention relates to an inspection structure attached to a lower surface of a circuit board of a probe card.

  For example, the inspection of the electrical characteristics of an electronic circuit such as an IC or LSI formed on a semiconductor wafer is performed using, for example, a circuit card or a probe card having a probe needle. This is done by bringing the probe pins into electrical contact with the electrode pads of the electronic circuit on the wafer.

In order to absorb the distortion of the circuit board and the variation in the height of the electrode pad on the wafer, or to scrape the oxide film on the surface of the electrode pad, the probe pin needs to have elasticity and strength in the vertical direction. For this reason, the probe pin is formed using a material having excellent electrical characteristics such as conductivity and excellent mechanical characteristics such as elasticity (see Patent Document 1).
JP 2007-57439 A

  By the way, in recent years, the miniaturization of the pattern of the electronic circuit has progressed, the electrode pads have become finer, and the distance between the electrode pads has become further narrow, so that it is necessary to form probe pins with a finer and narrower pitch on the probe card. There is. For this reason, even if it is fine, a probe pin with higher mechanical properties that can sufficiently secure the amount of shrinkage due to elasticity and also can sufficiently secure the strength is required. In addition, since more precise and strict inspection is required, it is necessary to further improve the electrical characteristics of the probe pin.

  However, at present, there is no material having both such electrical characteristics and mechanical characteristics, and the development of the material is not easy.

  Moreover, in the present probe card, although the impedance matching with respect to the electrical signal for a test | inspection is performed roughly, the impedance matching of the part including a probe pin is not performed. For this reason, deterioration is observed in the electrical signal sent from the tester to the probe pin during the inspection. In order to perform strict inspection with higher accuracy, it is necessary to perform more strict impedance matching.

  The present invention has been made in view of the above points, and provides an inspection structure having a probe pin having high electrical characteristics and mechanical characteristics and capable of performing impedance matching strictly. Is the purpose.

  In order to achieve the above object, the present invention provides an inspection structure attached to a lower surface of a circuit board of a probe card, and is attached to a pedestal portion and a lower surface of the pedestal portion, and a plurality of probe pins are formed. A substrate-like contact portion and a holding portion for holding the pedestal portion on the lower surface side of the circuit board, and at least the wiring layer, the insulating layer, and the elastic layer are laminated in this order from the bottom. Each probe pin is formed by bending a part of the surface of the contact portion downward, and has a laminated structure including the wiring layer, an insulating layer, and an elastic layer. A plurality of conductive lines electrically connected to the probe pins of the contact part and the circuit board and provided in the vertical direction; a dielectric part surrounding each of the conductive lines; and around the dielectric parts Surround One and grounded conductor unit, and having a.

  According to the present invention, since the probe pin of the contact portion has a wiring layer and an elastic layer, for example, a material having excellent electrical characteristics can be used for the wiring layer, and a material having excellent mechanical characteristics can be used for the elastic layer. Thus, a probe pin having high electrical characteristics and mechanical characteristics can be realized. Further, the impedance matching of the entire probe card including the probe pin can be performed strictly by the coaxial structure or the strip structure including the conductive wire, the dielectric part, and the conductor part of the pedestal part. Therefore, it is possible to inspect an inspection object having finer and narrower pitch electrodes with high accuracy.

  The body of the pedestal part is formed of a conductor to form the conductor part, and the pedestal part is formed with a through hole that is surrounded by the conductor part and penetrates in the vertical direction, and the conductive line and the dielectric part May be provided coaxially in the through hole.

  A plurality of connection terminals connected to the probe pins by wiring may be formed in the wiring layer of the contact portion, and each of the conductive lines may be electrically connected to the corresponding connection terminal.

  A through-hole penetrating the contact portion in the vertical direction is formed at a position of the connection terminal of the wiring layer, and each conductive wire is inserted into the through-hole of the contact portion and electrically connected to the connection terminal. May be.

  In the wiring layer, a probe pin formation region in which the plurality of probe pins are formed and a connection terminal formation region in which the plurality of connection terminals are formed may be separately formed.

  A wiring board on which an electronic circuit is formed is interposed between the contact part and the pedestal part, and the conductive wire passes through a through hole formed in the wiring board and is electrically connected to the wiring of the wiring board. It may be connected to.

  The electronic circuit may be a circuit that removes noise of an electric signal passing through the conductive line.

  A recess may be formed on the lower surface of the pedestal, and the electronic circuit of the wiring board may be accommodated in the recess. Note that the recess includes a through hole.

  An insulating substrate may be interposed between the contact portion and the pedestal portion, and the conductive wire may pass through a through hole formed in the insulating substrate.

  A conductive member having elasticity may be provided in a contact portion between each conductive wire of the pedestal portion and the circuit board.

  The inspection structure may further include a holding portion that holds the pedestal portion on the lower surface side of the circuit board, and the holding portion may be capable of holding a plurality of pedestal portions in the same plane.

  The holding portion may be formed in a flat plate shape, a plurality of through holes may be formed in a lattice shape, and the pedestal portion may be inserted and locked into each through hole from above.

  The pedestal portion may be one and may be attached to the lower surface side of the circuit board by a support portion.

  According to the present invention, the probe pin of the probe card has high electrical characteristics and mechanical characteristics, and the impedance matching of the probe card can be strictly performed. The inspection object can be inspected with high accuracy.

It is explanatory drawing which shows the outline of a structure of a probe apparatus. It is a perspective view which shows the structure of a test | inspection block. It is a longitudinal cross-sectional view which shows the structure of a test | inspection block. It is the schematic diagram which simplified the structure in a base part, Comprising: (a) is a cross-sectional view, (b) is a cross-sectional view. It is a perspective view of a contact part. It is a bottom view which shows the structure of the holding plate holding many test | inspection blocks. It is a longitudinal cross-sectional view of the test | inspection block which provided the wiring board. It is a schematic diagram which shows the other coaxial structure in a base part, Comprising: (a) is a cross-sectional view, (b) is a cross-sectional view. It is a schematic diagram which shows the stripline structure in a base part, Comprising: (a) is a cross-sectional view, (b) is a cross-sectional view. It is explanatory drawing which shows the outline of a structure of the probe apparatus in case a base part is one.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe apparatus 2 Probe card 10 Circuit board 13 Inspection structure 20 Inspection block 30 Base part 30a Conductor part 31 Contact part 31a Wiring layer 31b Insulating layer 31c Elastic layer 40 Conductive pin 40a Conductive wire 40b Dielectric part 60 Probe pin U electrode Pat W Wafer

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is an explanatory diagram showing an outline of the configuration of a probe device 1 having an inspection structure according to the present embodiment.

  The probe device 1 is provided with, for example, a probe card 2 and a mounting table 3 on which a wafer W as an object to be inspected is mounted. The probe card 2 is disposed above the mounting table 3. The mounting table 3 is configured to be movable in the horizontal direction and the vertical direction, for example, and can move the mounted wafer W three-dimensionally.

  The probe card 2 includes, for example, a circuit board 10 for sending an electrical signal for inspection to the wafer W mounted on the mounting table 3, a holder 11 for holding and fixing the circuit board 10, and an upper surface of the circuit board 10. A reinforcing plate 12 that is attached and reinforces the circuit board 10 and is attached to the lower surface side of the circuit board 10, and contacts the electrode pad U on the wafer W at the time of inspection to establish electrical continuity between the circuit board 10 and the wafer W. An inspection structure 13 or the like is provided.

  The circuit board 10 is electrically connected to a tester (not shown), and can transmit and receive an inspection electrical signal from the tester to the lower inspection structure 13. The circuit board 10 is formed in a substantially disk shape, for example. An electronic circuit is formed inside the circuit board 10, and a plurality of terminals 10 a of the electronic circuit are formed on the lower surface of the circuit board 10.

  A support portion 14 that penetrates the circuit board 10 and protrudes downward from the circuit board 10 is attached to the lower surface of the outer peripheral portion of the reinforcing plate 12. The inspection structure 13 is supported by the support portion 14.

  The inspection structure 13 includes a plurality of inspection blocks 20 and a holding plate 21 as a holding portion that holds and fixes the inspection blocks 20.

  As shown in FIG. 2, the inspection block 20 includes a pedestal portion 30 and a substrate-like contact portion 31 attached to the lower surface of the pedestal portion 30.

  The pedestal portion 30 is formed in a substantially rectangular parallelepiped shape. For example, as shown in FIG. 3, a through hole A is formed as a quadrangular recess in the center of the pedestal 30. The main body 30a of the pedestal portion 30 is formed of a conductor such as metal. The main body (conductor portion) 30a is grounded. The conductor portion 30a is formed with a plurality of round through holes 30b penetrating in the vertical direction, and linear conductive pins 40 are inserted into the respective through holes 30b. A large number of conductive pins 40 are arranged on both sides of the through hole A, for example.

  For example, as shown in FIG. 4, each conductive pin 40 is provided with a conductive wire 40a such as tungsten on the central axis, and a dielectric portion 40b such as a resin is annularly covered around the conductive wire 40a so as to be coaxial. It has become. Therefore, as shown in FIG. 4, the pedestal 30 is provided with a dielectric portion 40b so as to surround each conductive line 40a, and the conductor portion 30a is provided so as to surround the dielectric portion 40b. It has been. Thereby, the pedestal portion 30 has a coaxial structure that can adjust the impedance with respect to the electrical signal passing through the conduction pin 40.

  As shown in FIG. 3, the conductive pin 40 protrudes from the upper and lower surfaces of the conductive portion 30a of the pedestal portion 30, and the protruding portion is not covered with a dielectric and the conductive wire 40a is exposed. For example, the upper end portion of the conductive wire 40a of the conduction pin 40 is connected to the terminal 10a of the circuit board 10 with a connection pin 50 as a conductive member having elasticity. The connection pin 50 is made of, for example, conductive rubber. The connection pin 50 of each conduction pin 40 passes through the upper surface substrate 51 and is held by the upper surface substrate 51. The upper substrate 51 is formed in a square shape. The top substrate 51 is attached to the pedestal portion 30 by being fitted into a recess 30 c provided on the top surface of the pedestal portion 30, for example.

  As shown in FIG. 2, the contact portion 31 is formed in a rectangular substrate shape having the same size as the lower surface of the pedestal portion 30. As shown in FIG. 3, the contact portion 31 has a three-layered structure of a wiring layer 31a, an insulating layer 31b, and an elastic layer 31c in order from the bottom. A plurality of probe pins 60 are formed by bending the vicinity of the center of the contact portion 31 downward. Therefore, the probe pin 60 has a three-layer structure including a wiring layer 31a, an insulating layer 31b, and an elastic layer 31c.

  For example, as shown in FIG. 5, the probe pins 60 are formed in two rows in the center of the contact portion 31. The tips of the probe pins 60 in one row and the tips of the probe pins 60 in the other row face each other. Thus, the central portion of the contact portion 31 is a region where the probe pin 60 is formed. A large number of connection terminals 61 connected to the corresponding probe pins 60 by wiring are formed on both sides of the probe pin 60 formation region of the wiring layer 31a of the contact portion 31. That is, both sides of the probe pin 60 formation region of the contact portion 31 are the connection terminal 61 formation regions.

  A through hole 62 that penetrates the contact portion 31 is formed at the position of each connection terminal 61. As shown in FIG. 3, the conductive wire 40a of the conduction pin 40 is inserted into the through hole 62, and the conductive wire 40a and the connection terminal 61 are electrically connected by solder or the like. Thus, each probe pin 60 is electrically connected to the circuit board 10 through the connection terminal 61, the conductive wire 40 a and the connection pin 50.

  The insulating layer 31b of the contact portion 31 is formed of an insulating material such as polyimide or Teflon (registered trademark of DuPont). The insulating layer 31b insulates the wiring layer 31a and the elastic layer 31c. The elastic layer 31c is formed of an elastic material such as rubber metal, BeCu, or carbon steel. Due to the elastic layer 31c, each probe pin 60 has high elasticity in the vertical direction.

  Here, a method for manufacturing the contact portion 31 will be described. First, a lower layer substrate 70 composed of a wiring layer 31a and an insulating layer 31b and an upper layer substrate 71 composed of an elastic layer 31c are formed. The lower layer substrate 70 is manufactured by forming a wiring layer 31b having a predetermined pattern on the lower surface of the insulating layer 31b serving as a base material by, for example, photolithography. The upper substrate 71 is formed by, for example, an electroforming technique.

  Thereafter, the lower layer substrate 70 and the upper layer substrate 71 are pressed and bonded together. Next, a cut is made along the shape of each probe pin, for example, by laser processing with the laser irradiation apparatus B. Thereafter, the probe pin formation region is pressed from the upper substrate 71 side by, for example, a plate-like member, and a part of the probe pin formation region is bent downward to form the probe pin 60. Even if the lower layer substrate 70 and the upper layer substrate 71 are not bonded together to form the contact portion 31 as described above, an insulating material is directly deposited on the upper layer substrate 71 to form a circuit on the wiring layer 31a. The insulating layer 31b may be formed.

  As shown in FIG. 3, an insulating substrate 80 made of an insulator is interposed between the lower surface of the pedestal portion 30 and the contact portion 31. As the insulating substrate 80, for example, a rectangular substrate having the same size as the contact portion 31 is used. A large number of through holes 80a are formed in the insulating substrate 80, and the conductive wires 40a are inserted into the through holes 80a. A through hole D corresponding to the through hole A of the pedestal 30 is formed in the central portion of the insulating substrate 80. The insulating substrate 80 insulates the conductor portion 30a of the pedestal portion 30 and the contact portion 31 from each other.

  As described above, each inspection block 20 is configured by integrating the upper substrate 51, the pedestal portion 30, the insulating substrate 80, and the contact portion 31.

  The holding plate 21 is formed in a flat plate shape as shown in FIG. 6, for example. The holding plate 21 has a large number of rectangular through holes 21a formed in a lattice pattern in the vertical and horizontal directions. The through hole 21 a is formed so that the inspection block 20 can be inserted from above. The pedestal portion 30 is locked to the frame portion 21 b of the through hole 21 a, and the inspection block 20 is held by the holding plate 21.

  The holding plate 21 is fixed to the support portion 14 as shown in FIG. The holding plate 21 is fixed to the support portion 14 by a leaf spring 91 fixed to the support portion 14 with bolts 90. By this fixing, the upper terminal (connection pin 50) of each inspection block 20 is connected to the terminal 10a of the circuit board 10.

  Next, the operation of the probe device 1 configured as described above will be described. First, when the wafer W is mounted on the mounting table 3, the mounting table 3 is raised and the wafer W is pressed against the inspection structure 13 from below. Thereby, each electrode pad U of the wafer W contacts each corresponding probe pin 60. Next, an electrical signal for inspection from the tester is sent to the inspection structure 13 through the circuit board 10, and sent to each electrode pad U on the wafer W through the connection pin 50, the conduction pin 40, the probe pin 60, and the like. It is done. Thus, the electrical characteristics of the circuit on the wafer W are inspected.

  According to the above embodiment, the probe pin 60 of the contact portion 31 is formed in a three-layer structure including the wiring layer 31a, the insulating layer 31b, and the elastic layer 31c, and the electrically conductive portion of the probe pin 60 and the elastic Since the portions are separated, a material having a low resistance and an excellent electrical characteristic can be used for the wiring layer 31a, and a material having a strong elasticity and a high mechanical characteristic can be used for the elastic layer 31c. As a result, a probe pin having both high electrical characteristics and mechanical characteristics can be realized. In addition, since the strip structure including the conductive wire 40a, the dielectric portion 40b, and the conductor portion 30a is formed on the pedestal portion 30 and the impedance adjusting portion is provided, the impedance matching of the entire probe card 2 including the probe pin 60 is strictly regulated. Can be done. Therefore, the inspection of the wafer W having the finer and narrow pitch electrodes U can be performed with high accuracy.

  Since the main body of the pedestal part 30 is a conductor part 30a, a through hole 30b is formed in the conductor part 30a, and the conductive wire 40a and the dielectric part 40b of the conductive pin 40 are coaxially inserted into the through hole 30b. A coaxial or strip structure can be formed in the portion 30 with a relatively simple structure.

  Further, a connection terminal 61 communicating with the probe pin 60 is formed in the wiring layer 31a of the contact portion 31, a through hole 62 is formed at the position of the connection terminal 61, and the conductive wire 40a is inserted into the through hole 62, Since the conductive wire 40a and the probe pin 60 are electrically connected, wiring from the probe pin 60 to the circuit board 10 is simplified.

  Since the formation region of the probe pin and the formation region of the connection terminal are separately formed in the wiring layer 31a of the contact portion 31, the wiring configuration is simplified and the manufacturing is easy, so that the cost can be reduced.

  Since the insulating substrate 80 is interposed between the contact portion 31 and the pedestal portion 30 and the conductive wire 40a passes through the through hole 80a of the insulating substrate 80, for example, the contact portion 31 and the conductor portion 30a of the pedestal portion 30 are connected to each other. Can be insulated. Thereby, for example, leakage of an electric signal or the like from the contact portion 31 to the conductor portion 30a is eliminated, and a more accurate inspection can be performed.

  Since the connection pin 50 having elasticity is provided at the contact portion between the conductive wire 40a of the pedestal 30 and the circuit board 10, for example, the connection pin 50 can absorb distortion and thermal expansion / contraction of the circuit board 10. Thereby, the contact between the inspection block 20 and the circuit board 10 is stabilized, and the electrical characteristics can be appropriately inspected.

  Since the holding plate 21 can hold a plurality of inspection blocks 20 in the same plane, the wafer W can be inspected using a large number of inspection blocks 20. For this reason, for example, even if one inspection block 20 is damaged, the inspection can be performed using another inspection block 20. Further, since each inspection block 20 has an impedance adjustment function, for example, the impedance can be adjusted for each inspection block 20 to perform inspection within the wafer surface with higher accuracy.

  In addition, a large number of through holes 21a are formed in the holding plate 21 in a lattice shape, and the inspection blocks 20 are inserted and locked from above the through holes 21a, so that each inspection block 20 can be easily removed. Can do. In addition, only the damaged inspection block 20 or only the contact portion 31 can be replaced.

  In the above embodiment, a wiring board having a predetermined electronic circuit may be interposed between the contact part 31 and the pedestal part 30 of the inspection block 20. For example, as shown in FIG. 7, the wiring substrate 110 is interposed between the pedestal 30 and the insulating substrate 80. For example, the wiring substrate 110 is a rectangular substrate having the same size as the contact portion 31. For example, an electronic circuit E is formed in the central portion of the wiring substrate 110 on the pedestal portion 30 side. The electronic circuit E is a circuit that removes noise of an electrical signal passing through the conductive line 40a, for example. The electronic circuit E of the wiring board 110 is accommodated in the through hole A of the pedestal portion 30. A large number of through holes 110a are formed on both sides of the electronic circuit E of the wiring board 110, and the conductive wires 40a are inserted through the through holes 110a. The conductive line 40 a is electrically connected to the wiring that leads to the electronic circuit E of the wiring board 110. In such a case, each inspection block 20 can remove the noise of the electric signal, so that the inspection with higher accuracy can be performed. Further, for example, when the electronic circuit E is damaged, the inspection block 20 may be replaced. Therefore, the electronic circuit E can be easily replaced.

  In the above example, the electronic circuit provided on the wiring board 110 may be an electronic circuit having another function such as an impedance matching circuit using a termination resistor or a switching circuit using a relay. In the above example, a plurality of wiring boards having different functions may be sandwiched between the pedestal portion 30 and the contact portion 31.

  In the above embodiment, the through-hole 30b is formed in the conductor part 30a of the pedestal part 30, and the conduction pin 40 having the conductive wire 40a and the derivative part 40b is inserted into the through-hole 30b. However, the coaxial structure may be formed by other configurations. For example, as shown in FIG. 8, a conductive wire 120a is provided on the central axis, the conductor portion 120b is covered with a dielectric portion 120b, and the conductor portion 120c is grounded around the conductor portion 120b. The pin 120 may be provided in the pedestal 30 to form a coaxial structure. In this case, the main body of the pedestal 30 around the pin 120 may be formed by the insulator 121. Further, as shown in FIG. 9, a conductive wire 130 extending in the vertical direction is disposed at the center of the pedestal portion 30, and a dielectric portion 131 is disposed so as to surround the conductive wire 130, and outside the dielectric portion 131. Two opposing plate-like conductor portions 132 may be arranged. Further, in this case, for example, a gap may be formed between the conductive wire 130 and the dielectric portion 131, and the conductive wire 130 may have elasticity in the vertical direction. In such a case, for example, the conductive wire 130 has a zigzag shape and may be formed in a spring shape. The stripline is configured by the structure shown in FIG.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be made within the scope of the ideas described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  For example, the inspection structure 13 described in the above embodiment has a large number of pedestal portions 30, but may have a single pedestal portion 30. In such a case, for example, as shown in FIG. 10, the pedestal portion 30 has the same diameter as the circuit board 10, and the outer peripheral portion is supported by, for example, the support portion 14. A large number of conductive pins 40 are inserted into the pedestal portion 30 in the above-described coaxial structure or stripline structure. For example, an insulating substrate 80 having the same size as the lower surface of the pedestal portion 30 is attached to the lower surface of the pedestal portion 30, and a large number of contact portions 31 are attached to the lower surface of the insulating substrate 80. On the upper surface of the pedestal portion 30, for example, an upper surface substrate 51 having the same size as the upper surface of the pedestal portion 30 is attached to support a large number of connection pins 50. According to this example, a highly accurate inspection can be performed with a simpler structure. In this example as well, a recess is formed on the lower surface of the pedestal 30 as described above, and the wiring board 110 is interposed between the insulating substrate 80 and the pedestal 30 so that the electronic circuit E is accommodated in the recess. May be.

  Further, the number and arrangement of the probe pins 60 of the contact portion 31 are not limited to the above example and can be arbitrarily selected. The shapes of the base part 30 and the contact part 31 are not limited to the above example, and can be arbitrarily selected.

  Furthermore, the present invention can also be applied to the case where the object to be inspected is another substrate such as an FPD (flat panel display) other than the wafer W.

  INDUSTRIAL APPLICABILITY The present invention is useful when inspecting electrical characteristics of an object to be inspected having finer and narrower pitch electrodes with high accuracy.

Claims (13)

An inspection structure attached to the lower surface of the circuit board of the probe card,
A pedestal,
A substrate-like contact portion attached to the lower surface of the pedestal portion and having a plurality of probe pins formed thereon;
The contact portion is formed by laminating at least a wiring layer, an insulating layer, and an elastic layer in this order from the bottom,
Each probe pin is formed by bending a part of the surface of the contact portion downward, and has a laminated structure including the wiring layer, an insulating layer, and an elastic layer,
The pedestal portion includes a plurality of conductive lines electrically connected to the probe pins of the contact portion and the circuit board and provided in a vertical direction, a dielectric portion surrounding each conductive line, and each dielectric A conductor portion that surrounds the body portion and is grounded. The inspection structure according to claim 1,
A body of the pedestal portion is formed of a conductor to form the conductor portion;
The pedestal portion is formed with a through hole that is surrounded by the conductor portion and penetrates in the vertical direction,
The conductive wire and the dielectric portion are coaxially provided in the through hole. The inspection structure according to claim 1,
In the wiring layer of the contact portion, a plurality of connection terminals connected to the probe pins by wiring are formed,
Each of the conductive lines is electrically connected to the corresponding connection terminal. The inspection structure according to claim 3,
At the position of the connection terminal of the wiring layer, a through-hole penetrating the contact portion in the vertical direction is formed,
Each of the conductive lines is inserted into a through hole of the contact portion and electrically connected to the connection terminal. The inspection structure according to claim 3,
In the wiring layer, a probe pin formation region in which the plurality of probe pins are formed and a connection terminal formation region in which the plurality of connection terminals are formed are separately formed. The inspection structure according to claim 1,
Between the contact portion and the pedestal portion, a wiring board on which an electronic circuit is formed is interposed,
The conductive line penetrates through a through hole formed in the wiring board and is electrically connected to the wiring of the wiring board. The inspection structure according to claim 6,
The electronic circuit is a circuit for removing noise of an electric signal passing through the conductive line. The inspection structure according to claim 6,
A concave portion is formed on the lower surface of the pedestal portion, and an electronic circuit of the wiring board is accommodated in the concave portion. The inspection structure according to claim 1,
An insulating substrate is interposed between the contact portion and the pedestal portion, and the conductive wire passes through a through hole formed in the insulating substrate. The inspection structure according to claim 1,
A conductive member having elasticity is provided at a contact portion between each conductive wire of the pedestal portion and the circuit board. The inspection structure according to claim 1,
A holding portion for holding the pedestal portion on the lower surface side of the circuit board;
The holding part can hold a plurality of pedestal parts in the same plane. The inspection structure according to claim 11,
The holding portion is formed in a flat plate shape, and a plurality of through holes are formed in a lattice shape,
The pedestal is inserted into the through-holes from above and locked. The inspection structure according to claim 1,
The pedestal part is one and is attached to the lower surface side of the circuit board by a support part.

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