JP2022036615A - Electrical contact structure of electrical contact, and electrical connection device - Google Patents

Abstract

To shorten the length of a conduction path in which an electrical contact flows, and to stably contact a conductive part of the electrical contact and an electrode part.SOLUTION: An electrical contact structure of an electrical contact comprises a support hole with an opening formed on one side of a support substrate, an electrical contact that is inserted into the support hole and makes electrical contact with an object to be inspected, and an electrode part provided near the opening of the support hole. The electrical contact has a non-conductive part with a bent part, and a conductive part provided on one end side of the non-conductive part. The bent part bends so that when one end of the conductive part is in electrical contact with the object to be inspected, the other end side of the conductive part is short-circuited with the electrode part.SELECTED DRAWING: Figure 4

Description

The present invention is a technique relating to an electrical contact structure of an electrical contactor and an electrical connection device.

For example, a probe card as an electrical connection device is used for inspecting the electrical characteristics of a plurality of semiconductor integrated circuits formed on a semiconductor wafer.

Generally, a probe card is configured by arranging a plurality of electrical contacts (hereinafter referred to as "contacts", "probes", etc.) on the lower surface of an insulating substrate, and each probe card is integrated. It is attached to an inspection device that inspects a circuit (object to be inspected). At the time of inspection, each contact of the probe card is pressed against each electrode of each integrated circuit to inspect the electrical characteristics of each integrated circuit.

As a probe card as an electrical connection device, there is a probe card called a vertical probe card in which each contactor is electrically contacted perpendicularly to each electrode of an inspected object. Further, as the electric contact used for the vertical probe card, for example, there are a spring type and a needle type.

Since the spring type contactor has elasticity in the direction perpendicular to the inspected object, it can be elastically and surely in contact with the electrode of the inspected object.

Since the needle type contactor is linear (rod-shaped), it can be reliably electrically contacted with the electrodes of the object to be inspected arranged at a narrow pitch, but it is difficult to give elasticity in the vertical direction.

Therefore, as illustrated in FIG. 2, the structure that supports the plurality of contacts 34 supports the upper plate (top plate) 43 that supports the upper portion of each needle type contactor 34 and the lower portion of each contactor 34. Each contactor 34 is supported by using a lower plate (bottom plate) 41. Here, in order to have elasticity in the vertical direction, the position of the support hole 43A of the upper plate (top plate) 43 and the position of the support hole 41A of the lower plate (bottom plate) 41 are relatively displaced in the plane direction. It is arranged like this. With such a structure, each contactor 34 is locally curved so as to have elasticity in the vertical direction.

In recent years, along with the ultra-miniaturization and ultra-high integration of semiconductor integrated circuits, the electrical contacts (probes) provided on probe cards correspond to the reduction of the electrode area on the semiconductor chip and the narrowing of the pitch between pads. It is required to make it. Further, as the operating speed of the semiconductor integrated circuit is increased, the signal frequency of the input / output pin tends to increase, and the electrical contact (probe) is also required to correspond to the high frequency characteristic.

Patent Documents 1 and 2 disclose a probe head (or test head) for inspecting a semiconductor integrated circuit. For example, the probe head is provided with a plurality of guide holes for accommodating a plurality of contact probes. Further, the contact probe is curved in an S shape in order to have elasticity in the vertical direction. The contact probe extends along the longitudinal direction between the first end and the second end, from the first end and the second end in contact with the electrode of the inspected object. It is configured. Further, the contact probe has a non-conducting first portion and a second portion from the first portion to the second end between the first end portion and the second end portion. Consists of. Further, a conductive portion is provided in the guide hole, and the second portion of the contact probe and the conductive portion are electrically connected to be short-circuited.

International Publication No. 2018/108790 International Publication No. 2019/091946

However, as in the techniques described in Patent Documents 1 and 2, when the conductive contact portion of the contact probe is to be electrically contacted with the conductive portion (electrode portion) of the guide hole, the contact portion is slid. Since it can be a dynamic contact, the contact portion and / or the conductive portion of the contact probe may be worn, and as a result, the contact portion may be deteriorated, which may affect high-precision inspection.

Therefore, an electric contact structure and an electric connection device of an electric contact capable of shortening the length of the conduction path flowing through the electric contact and stably contacting the conductive portion and the electrode portion of the electric contact can be obtained. It has been demanded.

In order to solve such a problem, the electric contact structure of the electric contact according to the first invention has (1) a support hole in which an opening is formed on one surface of the support substrate and (2) a support hole. The electrical contact is provided with an electrical contact that is inserted and electrically in contact with the object to be inspected, and (3) an electrode portion provided near the opening of the support hole, and (4) the electrical contact has a non-bent portion. It has a conductive portion and a conductive portion provided on one end side of the non-conducting portion. (5) In the bent portion, one end of the conductive portion is electrically contacted with the object to be inspected. At that time, the other end side of the conductive portion is bent so as to be short-circuited with the electrode portion.

The second electrical connection device according to the present invention is an electrical connection device that includes a support substrate that supports a plurality of electrical contacts and electrically connects between the inspected object and the inspection device. Has the electrical contact structure of the electrical contacts of the present invention.

According to the present invention, the length of the conduction path flowing through the electrical contact can be shortened, and the conduction portion and the electrode portion of the electrical contact can be stably brought into contact with each other.

It is a top view which shows the structure of the electric connection apparatus which concerns on embodiment. It is a block diagram which shows the structure of the electric connection structure of the conventional contact. It is a front view which shows the structure of the electric connection device which concerns on embodiment. It is a partial cross-sectional view which shows the structure of the electrical connection structure of the contactor which concerns on embodiment. It is a block diagram which shows the structure of the probe which concerns on embodiment. It is a figure which shows the state of a probe at the time of non-contact and at the time of contact. It is a partial cross-sectional view which shows the structure of the electrical connection structure of the contact according to the modification embodiment (No. 1). It is a partial cross-sectional view which shows the structure of the electrical connection structure of the contact according to the modification embodiment (the 2). It is a partial cross-sectional view which shows the structure of the electrical connection structure of the contactor which concerns on a modification embodiment (the 3). It is a block diagram which shows the structure of the probe which concerns on the modification embodiment, and the structure of the electrical connection structure of a contact.

(A) Main Embodiments In the following, the electrical contact structure of the electrical contactor and the embodiment of the electrical connection device according to the present invention will be described in detail with reference to the drawings.

(A-1) Configuration of Embodiment In this embodiment, an inspection device (for example, energization inspection) for inspecting electrical characteristics (for example, energization inspection) of a plurality of semiconductor integrated circuits formed on a semiconductor wafer by using the present invention ( In the following, a case where it is applied to an electric connection device attached to a “tester”) will be illustrated.

In the following description, the "inspected object" is an object for which an inspection device inspects electrical characteristics, and indicates, for example, an integrated circuit, a semiconductor wafer, or the like. The "semiconductor wafer" has a plurality of integrated circuits in which a circuit pattern is formed on the wafer, and assumes a state before dowsing.

The "electrical connection device" has a plurality of contacts that are in electrical contact with each electrode of the test object, and electrically connects the test body and the test device. The electrical connection device is, for example, a probe card or the like, and in this embodiment, a case where it is a vertical probe card is exemplified.

A "contact" is an electrical contact that makes electrical contact with an electrode of an object to be inspected. As the contact, for example, a probe can be applied, and a needle type probe formed of a linear member, a probe formed of a narrow member of a thin plate, or the like can be applied. In this embodiment, the case where the contact is a needle type probe formed of a linear member as a whole is illustrated.

A "support substrate" is a plate-shaped substrate that supports a plurality of contacts (electrical contacts). The support substrate has a plurality of support holes having openings formed on one surface, and each contact (electrical contact) is inserted into each support hole of the support substrate to support each contact. The support board may be, for example, a probe support 17, a wiring board 2, or the like, which will be described later.

(A-1-1) Detailed Configuration of Electrical Connection Device 1 FIG. 1 is a plan view showing the configuration of the electrical connection device 1 according to the embodiment. FIG. 3 is a front view showing the configuration of the electrical connection device 1 according to the embodiment. FIG. 4 is a partial cross-sectional view showing the configuration of the electrical connection structure of the contact (probe) 21 according to the embodiment.

The electrical connection device 1 includes a wiring board 2, a connection board 3, a plurality of wirings 4, and a probe assembly 5.

The wiring board 2 is a board formed in a disk shape. A rectangular opening 7 that penetrates the substrate in the thickness direction (Z direction, plate thickness direction) of the wiring board 2 is formed in the central portion on one surface (for example, the upper surface) side of the wiring board 2. On one surface (for example, the upper surface) of the wiring board 2, a large number of connection lands 9 as connection portions are aligned and formed along a pair of opposite sides of a rectangular opening 7. Further, a plurality of tester lands (tester connection portions) connected to the electric circuit of the inspection device (tester) are formed on the outer edge portion of one surface (for example, the upper surface) of the wiring board 2. Each connection land 9 and the corresponding tester land 8 are electrically connected to each other via a conductive path (not shown) of the wiring board 2 as in the conventional electrical connection device.

The connection board 3 is a member formed of an electrically insulating material and attached to a substantially central portion on one surface (for example, the upper surface) side of the wiring board. The connection substrate 3 has a rectangular portion 11 having a rectangular planar shape housed in the opening 7, and a rectangular annular flange 12 projecting from the outer edge of the rectangular portion 11 on one surface (for example, the upper surface) of the rectangular portion 11. In the connection board 3, the rectangular portion 11 is housed in the opening 7 of the wiring board 2, and the annular flange 12 is placed on the edge of the opening 7, and the annular flange 12 is formed by the plurality of screw members 13 on the wiring board 2. Attached to one surface (eg, top surface).

As shown in FIG. 1, a plurality of through holes 14 penetrating the substrate in the thickness direction (Z direction, plate thickness direction) of the substrate 3 are formed in the rectangular portion 11 of the connection substrate 3. Each of the plurality of through holes 14 is formed corresponding to the position of the electrode 16 of the integrated circuit as the inspected body 15.

One end of each wiring 4 is inserted into each through hole 14 of the connection board 3. The tip surface of one end of each wiring 4 inserted into each through hole 14 is electrically connected to each corresponding probe 21 supported by the probe assembly 5. Each wiring 4 may be directly connected to each corresponding probe 21 or may be indirectly connected to each probe 21 via a conductive path and a terminal. On the other hand, the other end of each wiring 4 is connected to each corresponding connection land 9. Each probe 21 is connected to each connection land 9 through each wiring 4. Therefore, each probe 21 is connected to the electric circuit of the inspection device (tester) via the corresponding tester land 8 that is electrically connected to each connection land 9.

The probe assembly 5 is attached to the other surface (for example, the lower surface) side of the connection substrate 3. The probe assembly 5 has a probe support 17 that supports a plurality of probes 21.

The probe support 17 is a plate-shaped member formed of an electrically insulating member. The probe support 17 has an opening formed in the other surface (for example, the lower surface) 18 of the probe support 17, and accommodates each of the plurality of probes 21 upward (that is, in the plate thickness direction and the Z direction). It has a plurality of support holes 19. In other words, each support hole 19 can be said to be a recess in which an opening is formed in the lower surface 18 of the probe support 17.

Each support hole 19 of the probe support 17 is formed at a position corresponding to the position of each electrode 16 of the inspected body 15. The number of support holes 19 of the probe support 17 is the same as the number of electrodes 16 of the object to be inspected 15.

The ceiling portion 192 of each support hole 19 that supports each probe 21 supports the supported portion 51 at the first end portion (for example, the upper end portion) of the probe 21. For example, as illustrated in FIG. 4, the ceiling portion 192 of the support hole 19 is provided with a hole portion for supporting the first end portion of the probe 21, and the first end portion of the probe 21 is provided in the hole portion. By inserting the portion, the probe 21 accommodated in the support hole 19 can be supported. That is, the probe 21 supported by the ceiling portion 192 hangs down inside the support hole 19 and is accommodated in the support hole 19, and at the same time, a part of the conduction portion 212 on the second end side of each probe 21 or All (see FIG. 5) are provided so as to project below the lower surface 18 of the support hole 19.

The method of supporting the probe 21 in the support hole 19 is not particularly limited. For example, the supported portion 51 of the probe 21 may be inserted into the hole made in the ceiling portion 192 of the support hole 19 and then fixed with an adhesive or the like. Further, each support hole 19 may be a hole having a circular or elliptical cross section, or a hole having a square, rectangular or polygonal cross section.

On the lower surface 18 of the probe support 17, each electrode terminal 20 is provided in the vicinity of each support hole 19. Here, as will be described later, a non-conducting guide portion 211 having a bent portion 54 is formed on the first end side of each probe 21 (see FIG. 5). When each probe 21 and the electrode 16 of the inspected body 15 come into contact with each other during the inspection of the inspected body 15, each probe 21 supported by each support hole 19 elastically deforms (for example, bends or the like).

Each electrode terminal 20 electrically contacts the conductive portion 212 (see FIG. 5) of each deformed probe 21 due to the contact load. In other words, each electrode terminal 20 is a terminal that is electrically connected to the conductive portion 212 of each deformed probe 21.

Further, each electrode terminal 20 is connected to each conductive path 22 formed in the probe support 17. Each conductive path 22 is a portion through which an electric signal flows between each electrode terminal 20 and each corresponding wiring 4. Therefore, the conductive portion 212 of each probe 21 is electrically connected to each corresponding wiring 4 via each electrode terminal 20 and the conductive path 22.

The conductive path 22 may be formed inside the substrate of the probe support 17. Further, for example, in the case of a probe support 17 formed of a multilayer structure substrate, a part of the conductive path 22 may be formed in the plane direction of the probe support 17 (that is, on the XY plane).

Here, the support structure of the plurality of probes 21 in the embodiment will be described while comparing the support structure of the conventional plurality of contacts (probes) 34 illustrated in FIG.

The conventional probe support structure in FIG. 2 uses an upper plate (top plate) 43 that supports the upper portion of each contactor 34 and a lower plate (bottom plate) 41 that supports the lower portion of each contactor 34. Each S-shaped contactor 34 is supported.

On the other hand, the plurality of probe support structures in the embodiment do not have at least a lower plate (bottom plate) 41. As will be described later, in the probe 21 of the embodiment, the non-conducting guide portion 211 has an elastic function.

Therefore, in the embodiment, the length of the probe assembly 5 in the thickness direction (Z direction) can be made shorter than that of the conventional probe assembly in the thickness direction (Z direction). In other words, when inspecting the inspected object 15, the length of the conductive path of the current flowing between the electrode 16 of the inspected object 15 and the wiring 4 via the probe 21 can be shortened. As a result, the inspection accuracy can be improved. In addition, the cost of the probe assembly 5 can be suppressed.

Further, in the conventional probe support structure in FIG. 2, the position of the support hole 43A of the upper plate (top plate) 43 and the position of the support hole 41A of the lower plate (bottom plate) 41 are relatively displaced in the plane direction. Arranged like this.

On the other hand, in the probe support structure in the embodiment, the probe 21 supported by the support hole 19 of the probe support 17 is arranged so as to extend in the vertical direction (Z direction) from the support point.

Therefore, by adopting the probe support structure of the embodiment, it becomes easy to control the alignment of the probe 21 in contact with the electrode 16 on the semiconductor wafer as the inspected object 15, and the alignment accuracy can be improved.

In this embodiment, a case where a plurality of probes 21 are supported on the probe support 17 of the probe assembly 5 will be exemplified. However, the present invention is not limited to this example, and a structure similar to that of each support hole 19 of the probe support 17 is provided on the lower surface of the wiring board 2, and each probe 21 is supported by each support hole 19 provided in the wiring board 2. You may do so. In this case, it is not necessary to provide the upper plate (top plate) 43 as well.

(A-1-2) Configuration of Probe 21 FIG. 5 (A) is a side view showing the configuration of the probe 21 according to the embodiment, and FIG. 5 (B) shows the configuration of the probe 21 according to the embodiment. It is a front view. The size, wire diameter, length, degree of bending, etc. of the probe 21 exemplified in FIGS. 5 (A) and 5 (B) are highlighted.

The probe 21 is formed by having a non-conducting guide portion 211 having a bent portion 54 and a conductive portion 212 provided on one end side of the non-conducting guide portion 211. The probe 21 can be a needle-type contactor formed of, for example, an insulating material and a thin wire of a conductive metal as the whole probe 21. The probe 21 is not limited to the linear member, and may be formed of, for example, an insulating material and a thin plate-shaped member having a small width of the conductive metal. In this embodiment, the probe 21 is exemplified by a linear member.

The wire diameter (diameter of the probe 21) and the total length of the probe 21 are not particularly limited, and can be appropriately determined according to the size of the electrode 16 of the semiconductor wafer to be inspected and the like. For example, the wire diameter of the probe 21 can be about several tens of μm, and the length can be about several mm.

The non-conducting guide portion 211 of the probe 21 is formed of an insulating material such as an insulating synthetic resin material. The non-conducting guide portion 211 has an elastic function that gives elasticity to the entire probe 21 in the vertical direction (Z direction). Further, the non-conducting guide portion 211 functions as a conductive portion supporting member that supports the conductive portion 212 of the probe 21. In other words, the non-conducting guide portion 211 has a function as an elastic conductive portion supporting member.

The non-conducting guide portion 211 formed of a linear insulating material has a supported portion 51 supported by a support hole 19 in which the probe 21 is housed, and the supported portion 51 along the longitudinal direction of the probe 21. It has a lower portion extending below the portion 51. The lower portion is integrally connected to the supported portion 51.

A bent portion 54 is formed in a substantially central portion of the lower portion of the non-conducting guide portion 211 by bending the lower portion, for example, by bending. For example, at the time of inspection of the inspected body 15, the lower end portion of the probe 21 (the lower end portion of the conductive portion 212) comes into contact with the electrode 16 of the inspected body 15, and a contact load acts on the probe 21. At this time, since the bent portion 54 is formed in the lower portion, the entire probe 21 is deformed starting from the bent portion 54, the probe 21 is greatly curved, and the entire probe 21 is in the vertical direction (Z direction). Will have the elasticity of.

Although FIG. 5A shows a bent portion 54 that has been greatly bent, the bending portion may be bent to such an extent that the probe 21 can be deformed from the bent portion 54 at the time of contact. The bent portion 54 may be formed by bending, or the wire diameter of the bent portion 54 may be smaller than the wire diameter of the non-conducting guide portion 211 in order to facilitate bending.

Here, among the lower portions of the non-conducting guide portion 211, the portion from the supported portion 51 to the bent portion 54 is referred to as a first guide portion 52, and the portion from the bent portion 54 to the lower end portion of the non-conducting guide portion 211 is referred to. It is called a second guide unit 53.

The conductive portion 212 of the probe 21 is provided at the lower end portion of the second guide portion 53 of the non-conducting guide portion 211. The conductive portion 212 is made of a conductive material. The conductive portion 212 may be formed of, for example, a metal such as copper, a copper alloy, or a beryllium copper alloy, for example, a conductive rubber material such as an elastomer, a conductive synthetic resin material, or the like. Further, the surface of the lower end portion of the non-conducting guide portion 211 may be plated or the like to form the conductive portion 212. In this embodiment, the case where the conductive portion 212 is generally formed of a conductive metal thin wire is exemplified.

The conductive portion 212 provided in the non-conducting guide portion 211 may be provided by being adhered to the second guide portion 53 of the non-conducting guide portion 211 with, for example, an adhesive.

The conductive portion 212 has a second contact portion 56 in contact with the electrode terminal 20 on the other surface (for example, the lower surface) of the probe support 17 and a first contact portion 55 in contact with the electrode 16 of the inspected body 15. Have. In other words, the conductive portion 212 is the first contact that electrically contacts the second contact portion 56 that is wired and connected to the wiring 4 via the electrode terminal 30 and the conductive path 22 and the electrode 16 of the inspected body 15. It has a portion 55.

The second contact portion 56 of the conductive portion 212 comes into contact with the electrode terminal 20 when the probe 21 under the contact load is elastically deformed. The shape of the second contact portion 56 is not particularly limited, and may be, for example, a rounded inverted triangular prism or an inverted triangular pyramid. In that case, the contact area between the upper surface portion 561 of the second contact portion 56 or the peripheral portion thereof and the electrode terminal 20 becomes wide, and the electrical contact property becomes good.

The first contact portion 55 of the conductive portion 212 is a linear portion extending downward from the second contact portion 56. The lower end portion 551 of the first contact portion 55 formed in a linear shape comes into contact with the electrode 16 of the inspected body 15. The lower end portion 551 of the first contact portion 55 is also referred to as a “contact portion” that comes into contact with the electrode 16.

Like the second contact portion 56, the first contact portion 55 is formed of a conductive material such as copper, a copper alloy, or a beryllium copper alloy. The second contact portion 56 and the first contact portion 55 may be integrally formed of the same material. By forming them integrally with the same material, the conduction characteristics are improved and high-precision inspection is possible.

The probe 21 is provided with a conductive portion 212 at the lower end of the non-conducting guide portion 211. As will be described later, by shortening the length of the conduction portion 212, the length of the conduction path at the time of inspection of the inspected body 15 can be shortened. For example, the conduction path can be shortened by shortening the length of the second contact portion 56 and the conduction portion 212 having the second contact portion.

For example, the non-conducting guide portion 211 made of an insulating synthetic resin material can easily process the shape, length, wire diameter, etc. of the non-conducting guide portion 211. Therefore, the length and shape of the non-conducting guide portion 211 may be deformed without depending on the length of the conductive portion 212.

For example, when the length of the conductive portion 212 of the probe 21 is set to a predetermined length and the stylus pressure for bringing the probe 21 into contact with the electrode 16 of the object to be inspected 15 is to be increased, the length of the non-conducting guide portion 211 is relatively long. On the other hand, when it is desired to reduce the stylus pressure, the length of the non-conducting guide portion 211 may be relatively long.

(A-1-3) Electrical Contact Structure of Probe 21 FIG. 6 (A) is a diagram showing the state of the probe 21 at the time of non-contact, and FIG. 6 (B) is a diagram showing the state of the probe 21 at the time of contact. It is a figure which shows. The size, wire diameter, length, degree of bending / bending, etc. of the probe 21 exemplified in FIGS. 6 (A) and 6 (B) are highlighted.

FIG. 6A shows a state in which the supported portion 51 of the non-conducting guide portion 211 of the probe 21 is supported by the ceiling portion 192 of the support hole 19.

The probe 21 at the time of non-contact is provided so as to extend vertically downward from the position of the supported portion 51. The lower end portion 551 of the first contact portion 55 formed on the conductive portion 212 is generally located on or near the line C vertically below the position of the supported portion 51 which is the support point of the probe 21. ..

Conventionally, as illustrated in FIG. 2, Patent Documents 1 and 2, an S-shaped probe is arranged. Therefore, the position of the upper part of the probe and the position of the lower end of the probe in contact with the electrode of the inspected object are deviated from each other. On the other hand, as in this embodiment, by locating the lower end portion 551 on the perpendicular line C passing through the position of the supported portion 51, the position of the supported portion 51 and the position of the lower end portion 551 are aligned (matched). Or almost match). Therefore, according to this embodiment, it becomes easy to control the alignment of the probe 21 with respect to the electrode 16 of the object to be inspected 15, and the alignment accuracy is also improved.

Further, it is desirable that the probe 21 at the time of non-contact is accommodated without contacting the inner wall of the support hole 19. Although the bent portion 54 is formed in the non-conducting guide portion 211, it is desirable that the probe 21 is housed in the support hole 19 without the bent portion 54 coming into contact with the inner wall of the support hole 19. In other words, in the support hole 19, the position of the supported portion 51 to be supported does not have to be the center position of the ceiling portion 192 of the support hole 19. The supported portion 51 may be supported by the ceiling portion 192 of the support hole 19 so that the bent portion 54 does not come into contact with the inner wall of the support hole 19.

The elasticity of the probe 21 may be weakened, but as a modification, the bent portion 54 or the like of the probe 21 at the time of non-contact may be in contact with the inner wall of the support hole 19.

Further, the probe 21 at the time of non-contact is housed in the support hole 19 so that the conductive portion 212 protrudes from the lower surface 18 of the probe support 17. For example, the probe 21 is supported by the support hole 19 so that the position of the second contact portion 56 in the conductive portion 212 is located below the lower surface 18 of the probe support 17. This is to ensure that the second contact portion 56 and the electrode terminal 20 are in electrical contact with each other when the probe 21 is in contact and when the probe 21 is elastically deformed.

FIG. 6B shows the state of the probe 21 when the lower end portion 551 of the probe 21 is in contact with the electrode 16 of the object to be inspected 15 and a contact load is applied to the probe 21.

When the lower end portion 551 of the probe 21 comes into contact with the electrode 16 and a contact load acts on the probe 21, the probe 21 is deformed. That is, the bent portion 54 formed in the non-conducting guide portion 211 becomes the starting point, the linear non-conducting guide portion 211 strengthens the curvature, and the bent portion 54 comes into contact with the inner wall of the support hole 19. Due to the contact between the bent portion 54 and the inner wall surface of the support hole 19, the second end of the conductive portion 212 toward the axis of the support hole 19 (for example, a perpendicular line C from the supported portion 51). The contact portion 56 of 2 is moved. Then, almost at the same time, in the conductive portion 212 of the probe 21, the lower end portion 551 in contact with the electrode 16 becomes the starting point, and the linear first contact portion 55 is curved by the contact load. As a result, the second contact portion 56 of the conductive portion 212 moves upward, and the second contact portion 56 of the conductive portion 212 and the electrode terminal 20 come into contact with each other.

That is, the bent portion 54 is on the other end side of the conductive portion 212 when the lower end portion 511 at one end of the conductive portion 212 is electrically contacted with the electrode 16 of the object to be inspected 15. The second contact portion 56 functions to bend so as to be short-circuited with the electrode terminal 20.

At this time, the probe 21 supported by the support hole 19 is supported by the contact point in contact with the electrode 16 and the contact point in contact with the inner wall of the support hole 19, so that the posture of the probe 21 Can be stabilized. Since the second contact portion 56 comes into contact with the electrode terminal 20 in a state where the posture of the probe 21 is stable, the sliding of the second contact portion 56 with respect to the electrode terminal 20 can be suppressed. As a result, wear of the electrode terminal 20 and the second contact portion 56 can be suppressed, deterioration of the contact portion can be suppressed, and inspection accuracy can be improved.

The case where the inspected body 15 is inspected in the state of the probe 21 at the time of contact in FIG. 6B will be described.

In the conductive portion 212 of the probe 21, the lower end portion 551 of the first contact portion 55 electrically contacts the electrode 16 of the object to be inspected 15, and the second contact portion 56 electrically contacts the electrode terminal 20. ing. Therefore, the conduction path through which the electric signal flows is the path between the contact point where the lower end portion 551 of the first contact portion 55 contacts the electrode 16 and the contact point where the second contact portion 56 contacts the electrode terminal 20. Therefore, the conduction path can be shortened as compared with the conventional case.

For example, with the increase in the operating speed of the integrated circuit as the inspected object 15, the probe card is required to correspond to the high frequency characteristics of the inspected object 15. As the length of the probe 21 used for inspection becomes longer, the reactance component becomes larger by that amount, which may affect the inspection accuracy of high frequency characteristics in particular.

According to this embodiment, by using the probe 21 formed by the non-conducting guide portion 211 and the short conducting portion 212, the conduction path is shortened, so that the inspection accuracy can be improved.

(A-2) Modification Example of Embodiment Below, a modification of the above-described embodiment will be described with reference to the drawings.

(A-2-1) FIG. 7 (A) is a diagram showing a state of the probe 21 at the time of non-contact in the modified embodiment, and FIG. 7 (B) is a diagram showing a state of the probe 21 at the time of contact in the modified embodiment. It is a figure which shows.

In the above-described embodiment, the case where the electrode terminal 20 is provided on the lower surface 18 of the probe support 17 is illustrated, but in FIGS. 7A and 7B, the electrode terminal connected to the conductive path 22 is illustrated. 20 exemplifies the case where the probe support 17 is provided on the inner wall surface of the support hole 19 of the probe support 17. For example, in this case, the electrode terminal 20 may be provided on the inner wall surface where the second contact portion 56 of the probe 21 having the enhanced curvature comes into contact with the inner wall of the support hole 19 at the time of contact.

In addition, in FIGS. 7A and 7B, among the inner wall of the support hole 19 accommodating the probe 21, a part of the inner wall of the support hole 19 with which the second contact portion 56 of the probe 21 comes into contact at the time of contact. The case where the electrode terminal 20 is provided is illustrated. However, for example, an electrode terminal 20 having a predetermined width and length in the Z direction may be provided over the entire circumference of the inner wall of the support hole 19. Further, for example, the electrode terminals 20 may be provided on the entire surface of the inner wall of the support hole 19.

With such a structure, the length of the portion of the probe 21 (that is, the linear first contact portion 55 of the conductive portion 212) protruding downward from the lower surface 18 of the probe support 17 can be increased. Can be shortened. Further, the diameter (diameter) of the support hole 19 accommodating the probe 21 can be made larger. Therefore, the probe 21 can be easily accommodated in the support hole 19.

(A-2-2) Another modified embodiment is illustrated in FIG. FIG. 8A is a diagram showing a state of the probe 21 at the time of non-contact in the modified embodiment, and FIG. 8B is a diagram showing a state of the probe 21 at the time of contact in the modified embodiment.

In FIGS. 8 (A) and 8 (B), in the probe support 17, a part of the open end portion of the support hole 19 is cut out, and a part surface or the entire surface of the cutout portion (slope) 191 is formed. The electrode terminal 20 connected to the conductive path 22 may be provided.

For example, the electrode terminal 20 is provided on both or one of the surface of the notch 191 which is a slope provided at the open end of the support hole 19 and the inner wall surface of the support hole 19 which is connected to the notch 191. You may do it. Also in this case, the electrode terminal 20 connected to the conductive path 22 may be provided on the entire inner wall of the support hole 19.

The cutout portion 191 may be provided on the entire circumference of a substantially circular opening end of the support hole 19, for example. In other words, the open end portion of the support hole 19 may be provided with a notch portion 191 processed into a tapered shape whose diameter becomes smaller toward the upper side in the Z direction.

With such a structure, the contact property between the second contact portion 56 of the probe 21 and the electrode terminal 20 becomes good at the time of contact, and the contact area between the second contact portion 56 and the electrode terminal 20 becomes larger. Become. As a result, the inspection accuracy is improved.

(A-2-3) Another modified embodiment is illustrated in FIG. FIG. 9A is a diagram showing a state of the probe 21 at the time of non-contact in the modified embodiment, and FIG. 9B is a diagram showing a state of the probe 21 at the time of contact in the modified embodiment.

9 (A) and 9 (B) exemplify a case where the support hole 19 of the probe support 17 is provided in an oblique direction with respect to the semiconductor wear which is the inspected body 15. That is, the case where the support hole 19 having a predetermined inclination with respect to the vertical direction of the Z axis is provided and the probe 21 is also supported in the oblique direction corresponding to the inclination of the support hole 19 is illustrated.

In this case, the inner wall surface of the support hole 19 is also inclined. On the other hand, a vertical conductive path 22 is provided in the probe support 17. Therefore, the portion of the conductive path 22 in the probe support 17 where the conductive path 22 in the vertical direction intersects the support hole 19 and appears on the surface of the inner wall of the support hole 19 may be used as the electrode terminal 20. In FIGS. 9A and 9B, when the electrode terminal 20 is provided over a wide range from the lower end of the inclined inner wall surface of the support hole 19 to the vicinity of the central portion of the inner wall of the support hole 19. Is illustrated.

With such a structure, the contact property between the second contact portion 56 of the probe 21 and the electrode terminal 20 becomes good at the time of contact, and the contact area between the second contact portion 56 and the electrode terminal 20 becomes larger. Become. As a result, the inspection accuracy is improved.

(A-3) Effect of the Embodiment As described above, according to the embodiment, the probe 21 is formed to have the non-conducting guide portion 211 and the conductive portion 212, and the probe 21 supported by the support hole 19 is provided. By being deformed by the contact load, the second contact portion 56 of the conductive portion 212 comes into contact with the electrode terminal 20 near the support hole 19. Therefore, the conduction path of the current flowing between the electrode 16 of the object to be inspected 15 and the electrode terminal 20 via the probe 21 can be shortened. As a result, the inspection accuracy of the electrical characteristics of the object to be inspected 15 can be improved.

Further, according to the embodiment, when the probe 21 is brought into contact with the electrode 16 of the object to be inspected 15, the probe 21 is deformed starting from the bent portion 54 formed in the non-conducting guide portion 211. The posture of the probe 21 is stabilized by the contact point where the bent portion 54 contacts the inner wall of the support hole 19 and the contact point where the lower end portion 551 contacts the electrode 16. Therefore, it is possible to suppress sliding and wear of the second contact portion 56 with respect to the electrode terminal 20.

(B) Other Embodiments Although various modified embodiments have been mentioned in the above-described embodiments, the present invention can also be applied to the following modified embodiments.

(B-1) The electrical contact (probe) according to the present invention is not limited to the configuration described in the above-described embodiment. For example, it can be applied to the configuration of the probe 21A illustrated in FIG. 10 (A).

FIG. 10A is a configuration diagram showing the configuration of the probe 21A according to the modified embodiment, and FIG. 10B is a diagram showing the state of the probe 21A at the time of contact of the modified embodiment.

In FIG. 10A, the probe 21A is formed to have a non-conducting guide portion 211A of a narrow wire or narrow plate-shaped member and a conductive portion 212A of the narrow wire or narrow plate-shaped member.

The conductive portion 212A is formed so as to be overlapped from the substantially central portion of the non-conducting guide portion 211A to the lower end portion of the non-conducting guide portion 211A, and the lower end portion of the conductive portion 212A is the lower end portion of the non-conducting guide portion 211A. It protrudes downward.

For example, the conductive portion 212A may be formed on one surface (the left side surface of FIG. 10A) of the non-conducting guide portion 211A which is a narrow plate-shaped member. The conductive portion 212A may be a narrow plate-shaped member. In that case, the width of the narrow plate-shaped conductive portion 212A may be the same as or slightly smaller than the width of the non-conducting guide portion 211A.

The non-conducting guide portion 211A has, from above, a supported portion 51A supported by the support hole 19, a support portion 58, a first guide portion 52A, a second guide portion 53A, and a bent portion 54A. On the other hand, the conductive portion 212A has a guided portion 57, a second contact portion 56A, and a first contact portion 55A from above. The lower end portion 551A of the first contact portion 55A comes into contact with the electrode 16 of the inspected body 15.

The first guide portion 52A, the bent portion 54A, and the second guide portion 53A of the non-conducting guide portion 211A overlap with the guided portion 57, the second contact portion 56A, and the first contact portion 55A of the conductive portion 212A. There is.

Further, the bent portion 54A is formed at a portion where the non-conducting guide portion 211A and the conductive portion 212A overlap. Along with the bending of the bent portion 54A, the conductive portion 212A is also bent, and the bent portion of the conductive portion 212A is formed as the second contact portion 56A.

Therefore, as shown in FIG. 10B, when the lower end portion 551A of the probe 21A comes into contact with the electrode 16 at the time of contact and a contact load is applied, the bent portion 54A of the non-conducting guide portion 211A becomes the starting point, and the probe 21A Transforms.

At this time, the second contact portion 56A at the position corresponding to the bent portion 54A comes into contact with the electrode terminal 20 on the inner wall of the support hole 19, and the support portion 58 of the non-conducting guide portion 211A is curved to support the support hole. Contact the inner wall of 19.

In this case as well, the probe 21A supported by the support hole 19 has a contact point in contact with the electrode 16 and a contact point in contact with the inner wall of the support hole 19 (second contact portion 56A, support portion 58). Since it is supported by the contact point 58A) of the probe 21, the posture of the probe 21A can be stabilized.

That is, since the second contact portion 56A comes into contact with the electrode terminal 20 while the posture of the probe 21A is stable, the sliding of the second contact portion 56A with respect to the electrode terminal 20 can be suppressed. As a result, wear of the electrode terminal 20 and the second contact portion 56A can be suppressed, deterioration of the contact portion can be suppressed, and inspection accuracy can be improved.

Note that FIG. 10B illustrates a case where the electrode terminal 20 is provided on the inner wall surface of the support hole 19. However, the electrode terminal 20 may be provided on the lower surface 18 of the probe support 17 as illustrated in FIGS. 6 (A) and 6 (B), or may be provided in FIGS. 8 (A) and 8 (B). ), It may be provided on the inner wall surface of the notch 191 and / or the support hole 19.

(B-2) In the above-described embodiment, the case where the electrode terminal for wiring and connecting the probe 21 is provided near the support hole 19 or on the inner wall of the support hole 19 is exemplified. The position of the electrode terminal 20 may be any position as long as it can come into contact with the second contact portion 56 when the probe 21 is deformed by the contact load, and is not limited to the above-described embodiment.

(B-3) In the above-described embodiment, the case where the non-conducting guide portion 211 of the probe 21 has the bent portion 54 is exemplified, but the number of the bent portions 54 provided in the non-conducting guide portion 211 is limited to one. However, the number may be plural (for example, two or more).

1 ... Electrical connection device, 5 ... Probe assembly, 15 ... Inspected object, 16 ... Electrode, 17 ... Probe support, 18 ... Bottom surface of probe support, 19 ... Support hole, 191 ... Notch, 192 ... Ceiling, 20 ... Electrode terminals, 21 and 21A ... Electrical contacts (probes), 211 and 211A ... Non-conducting guides, 212 and 212A ... Conducting, 51 and 51A ... Supported parts, 52 and 52A ... First Guide portions, 53 and 53A ... second guide portions, 54 and 54A ... bent portions, 55 and 55A ... first contact portions, 551 ... lower end portions, 56 and 56A ... second contact portions, 57 ... guided portions. Part, 58 ... Support part.

Claims (9)

A support hole with an opening formed on one side of the support substrate,
An electrical contact that is inserted through the support hole and makes electrical contact with the object to be inspected.
It is provided with an electrode portion provided in the vicinity of the opening of the support hole.
The electrical contact has a non-conducting portion having a bent portion and a conductive portion provided on one end side of the non-conducting portion.
The bent portion is characterized in that when one end of the conductive portion is electrically contacted with the object to be inspected, the other end side of the conductive portion bends so as to be short-circuited with the electrode portion. Electrical contact structure of the electrical contactor. The electrical contact of the electric contact according to claim 1, wherein a second contact portion projecting in a direction intersecting the axial direction of the conductive portion is provided on the other end side of the conductive portion. Contact structure. The electrical contact structure of an electrical contact according to claim 1 or 2, wherein the second contact portion of the conductive portion and the electrode portion come into contact with each other due to deformation of the electrical contact. Due to the deformation of the electrical contactor, the bent portion and the inner wall surface of the support hole come into contact with each other to move the other end portion of the conductive portion in a direction intersecting the axis of the support hole. The electrical contact structure of the electrical contact according to any one of claims 1 to 3. The non-conducting portion of the electrical contact is formed of a linear member or a narrow plate-shaped member.
The second contact portion of the conductive portion is formed of a member that contacts the electrode portion in a wide area at the one end portion of the non-conducting portion.
Any of claims 1 to 4, wherein the first contact portion of the conductive portion is formed of a linear member or a narrow plate-shaped member supported by the second contact portion. The electrical contact structure of the electrical contacts described in Crab. The electrical contact structure of an electrical contact according to any one of claims 1 to 5, wherein the electrode portion is a bottom surface of the support substrate and is provided in the vicinity of an opening of the support hole. The electrical contact structure of an electrical contact according to any one of claims 1 to 5, wherein the electrode portion is provided on a partial surface or the entire surface of the inner wall of the support hole. The invention according to any one of claims 1 to 5, wherein the electrode portion is provided on the slope surface of the cutout portion in which the opening of the support hole is cut out, or on the inner wall surface of the support hole. Electrical contact structure of electrical contacts. The electrical contactor according to any one of claims 1 to 8, wherein the electrical connection device includes a support substrate that supports a plurality of electrical contacts and electrically connects between the object to be inspected and the inspection device. An electrical connection device having an electrical contact structure of.

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