TW202215056A - Electrical contact structure of electrical contactor and electrical connecting apparatus - Google Patents

Abstract

It is possible to shorten the length of the conduction path that flows through the electrical contacts, and to stably contact the conductive portions of the electrical contacts with the electrode portions. [Solution] The electrical contact structure of the electrical contact according to the invention is characterized by comprising: a support hole having an opening formed on one surface of the support substrate; an electrical contact; and an electrode portion provided near the opening of the support hole, the electrical contact having a non-conductive portion having a bent portion and a conductive portion provided on one end side of the non-conductive portion, in the bent portion, when one end portion of the conductive portion is in electrical contact with the inspected object, the side of other end portion of the conductive portion is bent so as to be short-circuited with the electrode portion.

Description

Electrical contact structure and electrical connection device of electrical contacts

The present invention relates to the technology of the electrical contact structure and the electrical connection device of the electrical contactor.

For example, a probe card, which is an electrical connection device, is used for inspection of electrical characteristics of a plurality of semiconductor integrated circuits formed on a semiconductor wafer.

In general, a probe card is configured by disposing a plurality of electrical contacts (hereinafter referred to as "contacts", "probes", etc.) on the lower surface of an insulating substrate, and the probe card is mounted on each integrated body for inspection An inspection device for circuits (objects to be inspected). During inspection, each contactor of the probe card is pressed against each electrode of each integrated circuit to inspect the electrical characteristics of each integrated circuit.

In a probe card as an electrical connection device, there is a so-called vertical probe card in which each contactor is made to be in electrical contact with each electrode in a vertical direction with respect to the object to be inspected. In addition, the electrical contact sub-systems used in the vertical probe card include, for example, a spring type and a pin type.

The spring-type contact sub-system has elasticity in the vertical direction with respect to the object to be inspected, so it can elastically and surely make contact with the electrodes of the object to be inspected.

Since the needle-type contactor is linear (rod-like), it can reliably make electrical contact with the electrodes of the test object arranged at a narrow pitch, but it is difficult to make it elastic in the vertical direction.

Therefore, the structure for supporting the plurality of contacts 34 is as illustrated in FIG. 2 , using: an upper plate (top plate) 43 supporting the upper part of each contactor 34 of the pin type, and a lower plate (bottom plate) supporting the lower part of each contactor 34 41, to support each contact 34. Here, in order to have elasticity in the vertical direction, the positions of the support holes 43A of the upper plate (top plate) 43 and the positions of the support holes 41A of the lower plate (bottom plate) 41 are relatively displaced in the plane direction. By forming the structure as described above, each contactor 34 is partially bent so as to have elasticity in the vertical direction.

In recent years, with the ultra-miniaturization and ultra-high integration of semiconductor integrated circuits, the electrical contacts (probes) provided in the probe card are related to the reduction of the area of the electrodes on the semiconductor wafer and the distance between the pads. The narrowing of the spacing. In addition, as the operating speed of the semiconductor integrated circuit increases, the signal frequency of the I/O pins tends to increase, and corresponding high-frequency characteristics are also sought for electrical contacts (probes).

Patent Documents 1 and 2 disclose probe heads (or test heads) for inspecting semiconductor integrated circuits. For example, the probe head is provided with a plurality of guide holes for accommodating a plurality of contact probes. In addition, the contact probe is bent in an S shape so as to have elasticity in the vertical direction. The contact probe extends along the longitudinal direction between the first end portion and the second end portion, and is constituted by the first end portion and the second end portion that is in contact with the electrode of the object to be inspected. In addition, the contact probe is between the first end portion and the second end portion, and constitutes a non-conductive first portion and a second portion extending from the first portion to the second end portion. In addition, a conductive portion is provided in the guide hole, and the second portion of the contact probe is electrically connected to the conductive portion to be short-circuited. [Prior Art Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2018/108790 [Patent Document 2] International Publication No. 2019/091946

(The problem that the invention intends to solve)

However, as shown in the techniques described in Patent Documents 1 and 2, if it is attempted to electrically contact the conductive portion (electrode portion) of the guide hole with the conductive contact portion of the contact probe, the contact portion may become a sliding contact. Therefore, the contact part of the contact probe and/or the conductive part may be worn out, and as a result, the contact part is deteriorated, which affects the high-precision inspection.

Therefore, an electrical contact structure and an electrical connection device of the electrical contact can be obtained which can shorten the length of the conduction path flowing through the electrical contact and can stably contact the conduction portion of the electrical contact with the electrode portion. (Technical means to solve problems)

In order to solve this problem, the electrical contact structure of the electrical contact element of the first invention is characterized by comprising: (1) a support hole formed with an opening on one surface of the support substrate; (2) inserted into the support hole, An electrical contact for making electrical contact with the object to be inspected; and (3) an electrode portion provided in the vicinity of the aforementioned opening of the support hole, (4) the electrical contact having: a non-conductive portion having a bent portion, and In the case of the conducting portion provided on one end of the non-conducting portion, (5) the folded portion is when one end of the conducting portion is in electrical contact with the object to be inspected, and the other end of the conducting portion is connected to the electrode. Bend in a short-circuit manner.

The electrical connection device of the second invention is provided with a support substrate supporting a plurality of electrical contacts, and is an electrical connection device that electrically connects the object to be inspected and the inspection device, and has: the first invention of the present invention The electrical contact structure of the electrical contactor. (effect of invention)

According to the present invention, the length of the conduction path flowing through the electrical contact can be shortened, and the conduction portion of the electrical contact can be stably contacted with the electrode portion.

(A) Main Embodiment

Embodiments of the electrical contact structure and the electrical connection device of the electrical contacts of the present invention will be described in detail below with reference to the drawings.

(A-1) Configuration of Embodiment In the present embodiment, the present invention is exemplified in an inspection apparatus (hereinafter also referred to as "" Tester”) the case of the electrical connection device.

In the following description, the "object to be inspected" refers to an object to be inspected for electrical properties by the inspection apparatus, and refers to, for example, an integrated circuit, a semiconductor wafer, or the like. A "semiconductor wafer" has a plurality of integrated circuits with circuit patterns formed on the wafer, and is assumed to be in a state before dicing.

The "electrical connection device" has a plurality of contacts that are in electrical contact with the electrodes of the object to be inspected, and electrically connects the object to be inspected and the inspection device. The electrical connection device is, for example, a probe card, and in the present embodiment, a vertical probe card is exemplified.

A "contactor" is an electrical contactor that makes electrical contact with the electrodes of the object to be inspected. As the contact sub-system, for example, a probe can be applied, a needle-shaped probe formed by a linear member, a probe formed by a thin-plate thin member, and the like can be applied. In this embodiment, the case where the contactor is a needle-shaped probe formed entirely of a linear member is exemplified.

The "supporting substrate" is a plate-like substrate that supports a plurality of contacts (electrical contacts). The support substrate has a plurality of support holes with openings formed on one surface thereof, and contacts (electrical contacts) are inserted through the support holes of the support substrate to support the contacts. The support substrate can be, for example, the probe support body 17, the wiring substrate 2, and the like, which will be described later.

(A-1-1) Detailed structure of the electrical connection device 1 FIG. 1 is a plan view showing the configuration of an electrical connection device 1 according to the embodiment. FIG. 3 is a front view showing the configuration of the electrical connection device 1 according to the embodiment. FIG. 4 is a partial cross-sectional view showing the configuration of the electrical connection structure of the contactor (probe) 21 of the embodiment.

The electrical connection device 1 includes a wiring board 2 , a connection board 3 , a plurality of wirings 4 , and a probe assembly 5 .

The wiring board 2 is formed as a disk-shaped board. A rectangular opening 7 penetrating the wiring board 2 in the thickness direction (Z direction, plate thickness direction) of the wiring board 2 is formed in the center portion on one surface (eg, upper surface) side of the wiring board 2 . On one surface (for example, the upper surface) of the wiring board 2, along a pair of opposite sides of the rectangular opening 7, a plurality of connection lands 9 as connection parts are formed in a row. In addition, a plurality of tester island portions (tester connection portions) connected to the electrical circuit of the inspection device (tester) are formed on the outer edge portion of one surface (eg, upper surface) of the wiring board 2 . Each of the connection island portions 9 and the corresponding tester island portion 8 are electrically connected via a conductive circuit (not shown) of the wiring board 2 as in a conventional electrical connection device.

The connection board 3 is formed of an electrically insulating material, and is attached to a substantially central portion of one surface (for example, the upper surface) side of the wiring board. The connection board 3 includes a rectangular portion 11 having a rectangular planar shape accommodated in the opening 7 , and a rectangular annular flange 12 protruding toward the outer edge of the rectangular portion 11 on one surface (for example, the upper surface) of the rectangular portion 11 . . The rectangular portion 11 of the connection board 3 is accommodated in the opening 7 of the wiring board 2, and in a state where the annular flange 12 is placed on the edge of the opening 7, by a plurality of screw members 13, one side ( For example, an annular flange 12 is mounted on the upper surface.

As shown in FIG. 1 , the rectangular portion 11 of the connection substrate 3 is formed with a plurality of through holes 14 penetrating the substrate in the thickness direction (Z direction, plate thickness direction) of the substrate. Each of the plurality of through-holes 14 is formed corresponding to the position of the electrode 16 which is the integrated circuit of the object to be inspected 15 .

One end of each wiring 4 is inserted into each through hole 14 of the connection board 3 . The front end surfaces of the ends of the wires 4 inserted into the through holes 14 are electrically connected to the corresponding probes 21 supported by the probe assembly 5 . Each wiring 4 can be directly connected to each corresponding probe 21 , or can be indirectly connected to each probe 21 through a conductive circuit and a terminal. On the other hand, the other end portion of each wiring 4 is connected to each corresponding connection island portion 9 . Each probe 21 is connected to each connection island 9 through each wiring 4 . Therefore, each probe 21 is connected to the electrical circuit of the inspection apparatus (tester) via the corresponding tester island 8 electrically connected to each connection island 9 .

The probe assembly 5 is mounted on the other surface (for example, the lower surface) side of the connection substrate 3 . The probe assembly 5 has a probe support 17 that supports a plurality of probes 21 .

The probe support 17 is a plate-shaped member formed of an electrically insulating member. The probe holder 17 has an opening formed on the other surface (for example, the lower surface) 18 of the probe holder 17, and faces upward (that is, the plate thickness direction, the Z direction), and has a plurality of numbers for accommodating each of the plurality of probes 21. Support hole 19. In other words, each support hole 19 can also be said to be a concave portion having an opening formed in the lower surface 18 of the probe support body 17 .

Each support hole 19 of the probe support body 17 is formed at a position corresponding to the position of each electrode 16 of the test object 15 . The supporting holes 19 of the probe supporting body 17 are formed in the same number as the number of the electrodes 16 of the subject 15 .

The ceiling portion 192 that supports each support hole 19 of each probe 21 supports the supported portion 51 located at the first end portion (eg, the upper end portion) of the probe 21 . For example, as illustrated in FIG. 4 , a hole for supporting the first end of the probe 21 is provided in the ceiling portion 192 of the support hole 19, and the first end of the probe 21 is inserted into the hole, thereby The probe 21 accommodated in the support hole 19 can be supported. That is, the probes 21 supported by the ceiling portion 192 hang down to the inside of the supporting holes 19 and are accommodated in the supporting holes 19 , and part or all of the conducting portions 212 on the second end side of each probe 21 (Refer to FIG. 5 ) It is provided to protrude further downward than the lower surface 18 of the support hole 19 .

However, the method of supporting the probe 21 in the supporting hole 19 is not particularly limited. For example, the supported portion 51 of the probe 21 may be inserted into the hole drilled in the ceiling portion 192 of the support hole 19, and then fixed with an adhesive or the like. In addition, each support hole 19 can also be a hole with a circular or oval cross section, or a square, rectangular or polygonal hole in the cross section.

Each electrode terminal 20 is provided in the vicinity of each support hole 19 on the lower surface 18 of the probe support body 17 . Here, as will be described later, a non-conductive guide portion 211 having a bent portion 54 is formed on the first end portion side of each probe pin 21 (see FIG. 5 ). When the test object 15 is inspected, when the probes 21 and the electrodes 16 of the test object 15 come into contact with each other, the probes 21 supported by the support holes 19 are elastically deformed (eg, deflected).

Each electrode terminal 20 is in electrical contact with the conductive portion 212 (see FIG. 5 ) of each deformed probe 21 by the contact load. In other words, each of the electrode terminals 20 is a terminal that is electrically connected to the conductive portion 212 of each of the deformed probes 21 .

In addition, each electrode terminal 20 is connected to each conductive path 22 formed in the probe support body 17 . Each conductive circuit 22 is a portion where electrical signals flow between each electrode terminal 20 and each corresponding wiring 4 . Therefore, the conductive portion 212 of each probe 21 is electrically connected to each corresponding wiring 4 via each electrode terminal 20 and the conductive circuit 22 .

The conductive circuit 22 may also be formed inside the substrate of the probe support body 17 . In addition, in the case of forming the probe support body 17 formed of, for example, a multilayer structure substrate, the portion of the conductive circuit 22 may be formed in the surface direction of the probe support body 17 (that is, on the XY plane).

Here, the support structure of the plurality of probes 21 in the embodiment and the support structure of the conventional plural contacts (probes) 34 illustrated in FIG. 2 will be described.

The conventional probe support structure in FIG. 2 supports a substantially S-shape by using an upper plate (top plate) 43 supporting the upper part of each contactor 34 and a lower plate (bottom plate) 41 supporting the lower part of each contactor 34 . of each contact 34.

On the other hand, in the plural probe support structure in the embodiment, at least the lower plate (bottom plate) 41 is not provided. As will be described later, in the probe 21 of the embodiment, the non-conductive guide portion 211 has an elastic function.

Therefore, in the embodiment, the length in the thickness direction (Z direction) of the probe assembly 5 can be made shorter than the thickness direction (Z direction) of the conventional probe assembly. In other words, when the object to be inspected 15 is inspected, the length of the conductive path of the current flowing between the electrode 16 of the object to be inspected 15 and the wiring 4 via the probe 21 can be shortened. As a result, the inspection accuracy can be improved. In addition, the cost of the probe assembly 5 can also be suppressed.

2 is arranged such that the position of the support hole 43A of the upper plate (top plate) 43 and the position of the support hole 41A of the lower plate (bottom plate) 41 are relatively displaced in the plane direction.

On the other hand, in the probe supporting structure in the embodiment, the probes 21 supported by the supporting holes 19 of the probe supporting body 17 are arranged to extend in the vertical direction (Z direction) from the supporting points.

Therefore, by forming the probe support structure of the embodiment, it becomes easy to control the alignment of the probes 21 in contact with the electrodes 16 on the semiconductor wafer as the object to be inspected 15, and the alignment accuracy can be improved.

However, in the present embodiment, the case where the probe supports 17 of the probe assembly 5 support the plurality of probes 21 is exemplified. However, it is not limited to this example, and the lower surface of the wiring board 2 may be provided with the same structure as the support holes 19 of the probe support body 17 , and the support holes 19 provided in the wiring board 2 may support the probes 21 . In this case, the upper plate (top plate) 43 also becomes unnecessary.

(A-1-2) Configuration of Probe 21 FIG. 5(A) is a side view showing the configuration of the probe 21 according to the embodiment, and FIG. 5(B) is a front view showing the configuration of the probe 21 according to the embodiment. Among them, the size, wire diameter, length, degree of bending, etc. of the probe 21 illustrated in FIGS. 5(A) and 5(B) are highlighted.

The probe 21 includes a non-conductive guide portion 211 having a bent portion 54 , and a conductive portion 212 provided on one end side of the non-conductive guide portion 211 . The probe needle 21 can be formed as a needle-shaped contactor formed of, for example, an insulating material, a thin wire of a conductive metal, or the like in the entirety of the probe needle 21 . Here, the probe 21 is not limited to the linear member, and may be formed of, for example, an insulating material or a thin plate-shaped member of a conductive metal with a small width. In the present embodiment, the probe 21 is exemplified as being formed of a linear member.

The wire diameter of the probe 21 (diameter of the probe 21 ) or the overall length is not particularly limited, and can be appropriately determined according to the size of the electrode 16 of the semiconductor wafer to be inspected, and the like. For example, the wire diameter of the probe 21 may be about several tens of μm, and the length may be about several mm.

The non-conductive guide portion 211 of the probe 21 is formed of an insulating material such as an insulating synthetic resin material. The non-conductive guide portion 211 has an elastic function of making the entire probe 21 elastic in the vertical direction (Z direction). In addition, the non-conductive guide portion 211 functions as a conductive portion supporting member that supports the conductive portion 212 of the probe 21 . In other words, the non-conductive guide portion 211 functions as an elastic conductive portion supporting member.

The non-conductive guide portion 211 formed in a linear shape of an insulating material includes: a supported portion 51 supported by a support hole 19 in which the probe 21 is accommodated; A lower portion extending below the aforementioned supported portion 51 . The aforementioned lower portion is integrally connected to the supported portion 51 .

In a substantially central portion of the lower portion of the non-conductive guide portion 211 , a bent portion 54 that bends the lower portion is formed by, for example, bending. For example, when the object to be inspected 15 is inspected, the lower end portion of the probe 21 (the lower end of the conducting portion 212 ) contacts the electrode 16 of the object to be inspected 15 , and a contact load acts on the probe 21 . At this time, since the bent portion 54 is formed in the lower portion, the entire probe 21 is deformed from the bent portion 54 as a starting point, the probe 21 is greatly bent, and the entire probe 21 has elasticity in the vertical direction (Z direction).

5(A) shows the bent portion 54 that is greatly bent, but the probe 21 may be bent to the extent that the probe 21 can be deformed using the bent portion 54 as a starting point during contact. The bent portion 54 may be formed by bending, or the wire diameter of the bent portion 54 may be smaller than the wire diameter of the non-conductive guide portion 211 because it is easy to bend.

Here, in the lower portion of the non-conductive guide portion 211 , the portion from the supported portion 51 to the bent portion 54 is referred to as the first guide portion 52 , and the portion from the bent portion 54 to the non-conductive guide portion 211 is referred to as the first guide portion 52 . The lower end portion of , is referred to as the second guide portion 53 .

The conductive portion 212 of the probe 21 is provided at the lower end portion of the second guide portion 53 of the non-conductive guide portion 211 . The conduction portion 212 is formed of a conductive material. The conduction portion 212 may also be formed of metals such as copper, copper alloy, beryllium copper alloy, etc., conductive rubber materials such as elastomers, conductive synthetic resin materials, and the like. In addition, the conductive portion 212 may be formed by applying a plating process or the like to the surface of the lower end portion of the non-conductive guide portion 211 . In the present embodiment, the case where the conduction portion 212 is roughly formed by a thin conductive metal wire is exemplified.

The conductive portion 212 provided in the non-conductive guide portion 211 may be provided, for example, by using an adhesive or the like to follow the second guide portion 53 of the non-conductive guide portion 211 .

The conduction portion 212 has a second contact portion 56 that is in contact with the electrode terminal 20 on the other surface (for example, the lower surface) of the probe holder 17 , and a first contact portion 55 that is in contact with the electrode 16 of the object to be inspected 15 . . In other words, the conducting portion 212 has the second contact portion 56 that is wired to the wiring 4 via the electrode terminal 30 and the conducting circuit 22 , and the first contact portion 55 that electrically contacts the electrode 16 of the object to be inspected 15 .

The second contact portion 56 of the conducting portion 212 makes contact with the electrode terminal 20 when the probe 21 subjected to the contact load is elastically deformed. The shape of the second contact portion 56 is not particularly limited, and may be formed, for example, in a shape such as an inverted triangular prism or an inverted triangular pyramid having a round portion. At this time, the contact area between the upper surface portion 561 of the second contact portion 56 or its peripheral portion and the electrode terminal 20 is widened, and the electrical contact property becomes good.

The first contact portion 55 of the conduction portion 212 is a linear portion extending downward from the second contact portion 56 . The lower end portion 551 of the linearly formed first contact portion 55 is in contact with the electrode 16 of the object to be inspected 15 . Here, the lower end portion 551 of the first contact portion 55 is also referred to as a “contact portion” that is in contact with the electrode 16 .

The first contact portion 55 is formed of a conductive material such as copper, copper alloy, beryllium copper alloy, etc., similarly to the second contact portion 56 . The second contact portion 56 and the first contact portion 55 may be formed integrally with the same material. By integrally forming it with the same material, the conduction characteristic becomes good and high-precision inspection is possible.

The probe 21 is provided with a conductive portion 212 at the lower end portion of the non-conductive guide portion 211 . As will be described later, by shortening the length of the conduction portion 212 , the length of the conduction path during the inspection of the object to be inspected 15 can be shortened. For example, by shortening the lengths of the second contact portion 56 and the conduction portion 212 having the second contact portion, the conduction path can be shortened.

For example, the non-conductive guide portion 211 formed of an insulating synthetic resin material can be easily processed in shape, length, wire diameter, and the like. Therefore, the length or shape of the non-conductive guide portion 211 may be deformed regardless of the length of the conductive portion 212 .

For example, when the length of the conductive portion 212 of the probe 21 is set to a predetermined length and the needle pressure for bringing the probe 21 into contact with the electrode 16 of the object 15 to be inspected is to be increased, the non-conductive guide portion 211 may be The length is relatively short. On the other hand, when the acupuncture pressure is to be reduced, the length of the non-conductive guide portion 211 is relatively long.

(A-1-3) Electrical Contact Structure of Probe 21 FIG.6(A) is a figure which shows the state of the probe needle 21 at the time of non-contact, FIG.6(B) is a figure which shows the state of the probe needle 21 at the time of contact. Among them, the size, wire diameter, length, degree of bending/bending, etc. of the probe 21 illustrated in FIGS. 6(A) and 6(B) are highlighted and displayed.

FIG. 6(A) shows a state in which the supported portion 51 is supported by the ceiling portion 192 of the support hole 19 in the non-conductive guide portion 211 of the probe 21 .

The probe 21 in the non-contact state extends vertically downward from the position of the supported portion 51 . The lower end portion 551 of the first contact portion 55 formed on the conducting portion 212 is located approximately on or near the line C drawn in the vertical direction from the position of the supported portion 51 serving as the support point of the probe 21 .

Conventionally, as shown in FIG. 2 and Patent Documents 1 and 2, the probes are arranged in an S-shape. Therefore, the upper position of the probe is deviated from the position of the lower end of the probe that contacts the electrode of the object to be inspected. On the other hand, as shown in the present embodiment, by positioning the lower end portion 551 on the vertical line C passing through the position of the supported portion 51, the position of the supported portion 51 and the position of the lower end portion 551 are aligned (aligned or substantially aligned) . Therefore, according to this embodiment, it becomes easy to control the alignment of the probe 21 with respect to the electrode 16 of the object 15 to be inspected, and the alignment accuracy is also improved.

In addition, the probe 21 in the non-contact state is preferably accommodated without contacting the inner wall of the support hole 19 . A bent portion 54 is formed in the non-conductive guide portion 211 , but preferably, the bent portion 54 does not contact the inner wall of the support hole 19 and accommodates the probe 21 in the support hole 19 . In other words, in the support hole 19 , the position of the supported portion 51 to be supported does not need to be the center position of the ceiling portion 192 of the support hole 19 . The supported portion 51 may be supported by the ceiling portion 192 of the support hole 19 so that the bent portion 54 does not contact the inner wall of the support hole 19 .

Among them, although the elasticity of the probe 21 may be weakened, the bent portion 54 of the probe 21 and the like may contact the inner wall of the support hole 19 in a non-contact state as a modification.

In addition, the probe 21 during non-contact is accommodated in the support hole 19 such that the conducting portion 212 protrudes from the lower surface 18 of the probe support 17 . For example, the probe 21 is supported by the support hole 19 so that the second contact portion 56 of the conductive portion 212 is positioned below the lower surface 18 of the probe support body 17 . This is because the second contact portion 56 is in electrical contact with the electrode terminal 20 when the probe 21 is elastically deformed when the probe 21 is in contact.

FIG. 6(B) shows the state of the probe 21 when the lower end portion 551 of the probe 21 is in contact with the electrode 16 of the object to be inspected 15 and a contact load is applied to the probe 21 .

When the lower end portion 551 of the probe 21 contacts the electrode 16 and a contact load is applied to the probe 21, the probe 21 is deformed. That is, the bent portion 54 formed in the non-conductive guide portion 211 serves as a starting point, the linear non-conductive guide portion 211 is bent strongly, and the bent portion 54 contacts the inner wall of the support hole 19 . Due to the contact between the bent portion 54 and the inner wall surface of the support hole 19 , the axis of the support hole 19 (for example, the vertical line C from the supported portion 51 may also be used), so that the axis located at the other end of the conducting portion 212 is positioned. The second contact portion 56 moves. Next, almost simultaneously with this, in the conduction portion 212 of the probe 21, the lower end portion 551 in contact with the electrode 16 becomes the starting point, and the linear first contact portion 55 is bent by the contact load. Thereby, the second contact portion 56 of the conducting portion 212 moves upward, and the second contact portion 56 of the conducting portion 212 comes into contact with the electrode terminal 20 .

That is, when the lower end 511 of the bent portion 54 located at one end of the conducting portion 212 is in electrical contact with the electrode 16 of the subject 15 , it is bent so as to be the second contact located on the other end side of the conducting portion 212 . The portion 56 functions so as to be short-circuited with the electrode terminal 20 .

In addition, at this time, the probe 21 supported by the support hole 19 is supported by the contact point of the contact electrode 16 and the contact point with the inner wall of the support hole 19, so that the posture of the probe 21 can be stabilized. When the posture of the probe needle 21 is stable, the second contact portion 56 is in contact with the electrode terminal 20 , so that the sliding of the second contact portion 56 with respect to the electrode terminal 20 can be suppressed. As a result, abrasion of the pole terminal 20 and the second contact portion 56 can be suppressed, deterioration of the contact portion can be suppressed, and inspection accuracy can be improved.

Hereinafter, the case where the inspection of the object to be inspected 15 is performed in the state of the probe 21 at the time of contact in FIG. 6(B) will be described.

In the conduction portion 212 of the probe 21 , the lower end portion 551 of the first contact portion 55 is in electrical contact with the electrode 16 of the object to be inspected 15 , and the second contact portion 56 is in electrical contact with the electrode terminal 20 . Therefore, the conduction path through which the electric signal flows is the path between the contact point of the lower end portion 551 of the first contact portion 55 contacting the electrode 16 and the contact point of the second contact portion 56 contacting the electrode terminal 20, and the conduction can be shortened more than the conventional one. path.

For example, with the increase in the operating speed of the integrated circuit as the object to be inspected 15 , the high-frequency characteristics corresponding to the object to be inspected 15 are obtained from the probe card system map. When the length of the probe 21 used for the inspection becomes longer, the reactance component becomes large, and the inspection accuracy of the high-frequency characteristic in particular may be affected.

According to this embodiment, by using the probe 21 formed of the non-conductive guide portion 211 and the short-length conductive portion 212 , the conduction path is shortened, so that the inspection accuracy can be improved.

(A-2) Modification of the embodiment Variations of the above-described embodiment will be described below with reference to the drawings.

(A-2-1) FIG. 7(A) is a diagram showing the state of the probe 21 during non-contact in the modified embodiment, and FIG. 7(B) is a diagram showing the state of the probe 21 during contact in the modified embodiment. state diagram.

In the above-mentioned embodiment, the case where the electrode terminal 20 is provided on the lower surface 18 of the probe support body 17 is exemplified, and FIG. 7(A) and FIG. 7(B) illustrate the electrode connected to the conductive path 22. The case where the terminal 20 is provided on the inner wall surface of the support hole 19 of the probe support body 17 . For example, in this case, the electrode terminal 20 may be provided on the inner wall surface of the second contact portion 56 of the reinforced curved probe 21 in contact with the inner wall of the support hole 19 at the time of contact.

7(A) and FIG. 7(B), among the inner walls of the support holes 19 for accommodating the probes 21, the support holes to which the second contact portions 56 of the probes 21 come into contact are illustrated as examples. The case where the electrode terminal 20 is provided in a part of the inner wall of 19 . However, for example, the electrode terminal 20 having a predetermined width in the Z direction may be provided over the entire circumference of the inner wall of the support hole 19 . In addition, for example, the electrode terminal 20 may be provided on the entire surface of the inner wall of the support hole 19 .

By forming the structure as described above, the length of the portion of the probe 21 that protrudes downward from the lower surface 18 of the probe support 17 (that is, the linear first contact portion 55 of the conducting portion 212 ) can be made longer. shorten. In addition, the diameter (diameter) of the support hole 19 in which the probe 21 is accommodated can be further increased. Therefore, the probe 21 can be easily accommodated in the support hole 19 .

(A-2-2) Fig. 8 shows another modified embodiment. FIG. 8(A) is a diagram showing the state of the probe needle 21 during non-contact in the modified embodiment, and FIG. 8(B) is a diagram showing the state of the probe needle 21 during contact in the modified embodiment.

In FIGS. 8(A) and 8(B) , the probe support 17 may be provided with a notch at the opening end of the support hole 19 , and a part of the surface or the whole of the notch (slope) 191 may be cut. The electrode terminal 20 connected to the conductive circuit 22 is provided on the surface.

For example, the electrode terminal 20 may be provided on either or both of the inclined surface provided at the opening end of the support hole 19 , that is, the surface of the cutout portion 191 , and the inner wall surface of the support hole 19 connected to the cutout portion 191 . In this case, the electrode terminal 20 connected to the conductive circuit 22 may be provided on the entire surface of the inner wall of the support hole 19 .

However, the notch part 191 may be provided in the whole circumference of the substantially circular opening end part of the support hole 19, for example. In other words, the opening end portion of the support hole 19 may be provided with a taper-shaped notch portion 191 which is processed so as to become smaller in diameter as it goes upward in the Z direction.

With the above-described structure, the contact between the second contact portion 56 of the probe 21 and the electrode terminal 20 becomes good, and the contact area between the second contact portion 56 and the electrode terminal 20 increases. As a result, the inspection accuracy improves.

(A-2-3) Fig. 9 shows another example of the modified embodiment. FIG. 9(A) is a diagram showing the state of the probe needle 21 during non-contact in the modified embodiment, and FIG. 9(B) is a diagram showing the state of the probe needle 21 during contact in the modified embodiment.

9(A) and 9(B) illustrate the case where the support holes 19 of the probe support body 17 are provided obliquely to the semiconductor wafer serving as the object to be inspected 15 . That is, the case where the supporting hole 19 having a predetermined inclination with respect to the vertical direction of the Z axis is provided, and the probe 21 is also supported in an oblique direction according to the inclination of the supporting hole 19 is exemplified.

At this time, the inner wall surface of the support hole 19 is also inclined. On the other hand, in the probe support body 17, the conductive path 22 in the vertical direction is provided. Therefore, the conductive path 22 in the vertical direction in the probe holder 17 may intersect with the support hole 19 , and the portion of the conductive path 22 present on the inner wall surface of the support hole 19 may be used as the electrode terminal 20 . In FIGS. 9(A) and 9(B) , the electrode terminals 20 are provided over a large area from the lower end portion of the inclined inner wall surface of the support hole 19 to the vicinity of the center portion of the inner wall of the support hole 19 as an example. situation.

With the above-described structure, the contact between the second contact portion 56 of the probe 21 and the electrode terminal 20 becomes good, and the contact area between the second contact portion 56 and the electrode terminal 20 also increases. As a result, the inspection accuracy improves.

(A-3) Effects of Embodiment As described above, according to the embodiment, the probe 21 is formed to include the non-conductive guide portion 211 and the conductive portion 212, and the probe 21 supported by the support hole 19 is deformed by the contact load, whereby the conductive portion 212 is formed. The second contact portion 56 contacts the electrode terminal 20 in the vicinity of the support hole 19 . Therefore, the conduction path of the current flowing between the electrode 16 and the electrode terminal 20 of the object to be inspected 15 via the probe 21 can be shortened. As a result, the inspection accuracy of the electrical characteristics of the object to be inspected 15 can be improved.

Furthermore, according to the embodiment, when the probe 21 is brought into contact with the electrode 16 of the object to be inspected 15 , the probe 21 is deformed starting from the bent portion 54 formed in the non-conductive guide portion 211 . The posture of the probe 21 is stabilized by the contact point where the bent portion 54 contacts the inner wall of the support hole 19 and the contact point where the lower end portion 551 contacts the electrode 16 . Therefore, sliding and abrasion of the electrode terminal 20 by the second contact portion 56 can be suppressed.

(B) Other Embodiments In the above-mentioned embodiment, various modified embodiments are also mentioned, but the present invention can also be applied to the following modified embodiments.

(B-1) The electrical contactor (probe) of the present invention is not limited to the configuration described in the above embodiment. For example, the configuration of the probe 21A illustrated in FIG. 10(A) can also be applied.

FIG. 10(A) is a configuration diagram showing the configuration of the probe needle 21A according to the modified embodiment, and FIG. 10(B) is a diagram showing the state of the probe needle 21A at the time of contact in the modified embodiment.

In FIG. 10(A) , the probe 21A is formed by having a non-conductive guide portion 211A of a thin wire or a thin plate-like member, and a conductive portion 212A of the thin wire or a thin plate-like member.

The conducting portion 212A is formed by overlapping the substantially central portion of the non-conducting guide portion 211A over the lower end portion of the non-conducting guide portion 211A, and the lower end portion of the conducting portion 212A protrudes further downward than the lower end portion of the non-conducting guide portion 211A.

For example, the conducting portion 212A may be formed on one surface (the left side surface in FIG. 10(A) ) of the non-conducting guide portion 211A which is a thin plate-like member. The conduction portion 212A may be a thin plate-like member. At this time, the width of the conductive portion 212A in the shape of a thin plate may be the same as the width of the non-conductive guide portion 211A, or slightly smaller.

The non-conductive guide portion 211A includes a supported portion 51A supported by the support hole 19 , a support portion 58 , a first guide portion 52A, a second guide portion 53A, and a bent portion 54A. On the other hand, the conducting portion 212A includes the guided portion 57 , the second contact portion 56A, and the first contact portion 55A, as described above. The lower end portion 551A of the first contact portion 55A is in contact with the electrode 16 of the object to be inspected 15 .

The first guide portion 52A, the bent portion 54A, and the second guide portion 53A of the non-conductive guide portion 211A overlap with the guided portion 57 , the second contact portion 56A, and the first contact portion 55A of the conductive portion 212A. .

Further, the bent portion 54A is formed at a portion where the non-conductive guide portion 211A and the conductive portion 212A overlap. The conduction portion 212A is also bent along with the bending of the bending portion 54A, and the bent portion of the conduction portion 212A is formed as the second contact portion 56A.

Therefore, as shown in FIG. 10(B) , when contact is made, the lower end portion 551A of the probe 21A contacts the electrode 16, and when a contact load acts, the bent portion 54A of the non-conductive guide portion 211A becomes a starting point, and the probe 21A is deformed .

At this time, the second contact portion 56A located at the position corresponding to the bent portion 54A contacts the electrode terminal 20 located on the inner wall of the support hole 19, and the support portion 58 of the non-conductive guide portion 211A is bent to contact the support hole 19's inner wall.

At this time, the probe 21A supported by the support hole 19 is also contacted by the contact point of the contact electrode 16 and the contact point with the inner wall of the support hole 19 (the second contact portion 56A and the contact point 58A of the support portion 58 ). ), the posture of the probe 21A can be stabilized.

That is, the second contact portion 56A is in contact with the electrode terminal 20 when the posture of the probe 21A is stable, so that the sliding of the second contact portion 56A with respect to the electrode terminal 20 can be suppressed. As a result, abrasion of the electrode terminal 20 and the second contact portion 56A can be suppressed, deterioration of the contact portion can be suppressed, and inspection accuracy can be improved.

However, in FIG. 10(B), the case where the electrode terminal 20 is provided on the inner wall surface of the support hole 19 is exemplified. However, the electrode terminal 20 may be provided on the lower surface 18 of the probe support body 17 as illustrated in FIGS. 6(A) and 6(B) , or may also be illustrated in FIGS. 8(A) and 8(B) . It is provided in the notch part 191 and/or the inner wall surface of the support hole 19 .

(B-2) In the above-described embodiment, the case where the electrode terminals for connecting the probes 21 for wiring are provided in the vicinity of the support hole 19 or on the inner wall of the support hole 19 is exemplified. The position of the electrode terminal 20 may be a position that can be brought into contact with the second contact portion 56 when the probe 21 is deformed by the contact load, and is not limited to the above-described embodiment.

(B-3) In the above-mentioned embodiment, the case where the non-conductive guide portion 211 of the probe 21 has the bent portion 54 is exemplified, but the number of the bent portion 54 provided in the non-conductive guide portion 211 is not limited In one, plural (for example, two or more) may be sufficient.

1: Electrical connection device 2: Wiring board 3: Connect the substrate 4: Wiring 5: Probe assembly 7: Opening 8: Tester Island 9: Connect the island 11: Rectangular part 12: Ring flange 13: Screw components 14: Through hole 15: Examined body 16: Electrodes 17: Probe Support 18: The lower surface of the probe support 19: Support hole 191: Incision part 192: Ceiling Department 20: Electrode terminal 21 and 21A: electrical contacts (probes) 211 and 211A: Non-conducting lead 212 and 212A: conduction part 22: Conductive circuit 30: Electrode terminal 34: Contact (probe) 41: Lower plate (bottom plate) 41A: Support hole 43: Upper plate (top plate) 43A: Support hole 51 and 51A: Supported Departments 52 and 52A: 1st lead 53 and 53A: 2nd lead 54 and 54A: Bends 55 and 55A: Contact 1 551: lower end 56 and 56A: 2nd contact part 561: Upper surface 57: Guided Ministry 58: Support Department 58A: Contact Points C: line (vertical line)

Fig. 1 is a plan view showing the configuration of the electrical connection device of the embodiment. [ Fig. 2] Fig. 2 is a configuration diagram showing the configuration of a conventional electrical connection structure of a contactor. Fig. 3 is a front view showing the configuration of the electrical connection device of the embodiment. 4] It is a partial cross-sectional view which shows the structure of the electrical connection structure of the contactor of embodiment. [ Fig. 5] Fig. 5 is a configuration diagram showing the configuration of the probe according to the embodiment. 6] It is a figure which shows the state of the probe at the time of non-contact and the time of contact. [ Fig. 7] Fig. 7 is a partial cross-sectional view (No. 1) showing the configuration of the electrical connection structure of the contactor according to the modified embodiment. [ Fig. 8] Fig. 8 is a partial cross-sectional view (No. 2) showing the configuration of the electrical connection structure of the contactor according to the modified embodiment. [ Fig. 9] Fig. 9 is a partial cross-sectional view (No. 3) showing the configuration of the electrical connection structure of the contactor according to the modified embodiment. 10 is a configuration diagram showing the configuration of the probe and the configuration of the electrical connection structure of the contacts according to the modified embodiment.

3: Connect the substrate

4: Wiring

5: Probe assembly

14: Through hole

15: Examined body

16: Electrodes

17: Probe Support

18: The lower surface of the probe support

19: Support hole

192: Ceiling Department

20: Electrode terminal

21: Electrical contacts (probes)

22: Conductive circuit

Claims (9)

An electrical contact structure of an electrical contact is characterized by: have: An open support hole is formed on one side of the support substrate; An electrical contact that is inserted into the aforementioned support hole and makes electrical contact with the object to be inspected; and the electrode portion provided in the vicinity of the aforementioned opening of the aforementioned support hole, The electrical contact sub-system has a non-conductive portion having a bent portion, and a conductive portion provided on one end side of the non-conductive portion, In the bending portion, when one end portion of the conducting portion is in electrical contact with the object to be inspected, the other end portion side of the conducting portion is bent so as to be short-circuited with the electrode portion. The electrical contact structure of the electrical contactor according to claim 1, wherein a second contact portion protruding in a direction intersecting the axial direction of the conducting portion is provided on the other end side of the conducting portion. The electrical contact structure of the electrical contact according to claim 1, wherein the second contact portion of the conducting portion is in contact with the electrode portion by deformation of the electrical contact. The electrical contact structure of the electrical contact according to claim 1, wherein the bending portion is in contact with the inner wall surface of the support hole due to the deformation of the electrical contact, whereby the other side of the conducting portion is brought into contact with each other. The end portion moves in a direction intersecting the axis of the aforementioned support hole. The electrical contact structure of the electrical contact according to claim 1, wherein the non-conductive portion of the electrical contact is formed of a linear member or a thin plate-like member, The second contact portion of the conductive portion is formed at the one end portion of the non-conductive portion by a member that contacts the electrode portion with a large area, The first contact portion of the conduction portion is formed of a linear member or a thin plate-shaped member supported by the second contact portion. The electrical contact structure of the electrical contact according to claim 1, wherein the electrode portion is provided on the bottom surface of the support substrate and is in the vicinity of the opening of the support hole. The electrical contact structure of the electrical contact according to claim 1, wherein the electrode portion is provided on a part of the surface or the entire surface of the inner wall of the support hole. The electrical contact structure of the electrical contact according to claim 1, wherein the electrode portion is provided on the sloped surface of the notch portion that cuts the opening of the support hole, or on the inner wall surface of the support hole. An electrical connection device, which is provided with a support substrate supporting a plurality of electrical contacts, and an electrical connection device for electrically connecting an object to be inspected and an inspection device, which has: as claimed in item 1 to claim item 1 The electrical contact structure of any one of the electrical contacts in 8.

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