KR20220025657A - Electrical contact structure of electrical contactor and electrical connecting apparatus - Google Patents

Abstract

The present invention is capable of shortening the length of a conduction path in which an electrical contact flows so as to stably contact a conductive part of the electrical contact and an electrode part. An electrical contact structure of an electrical contact according to the present invention comprises: a support hole with an opening formed on one side of a support substrate; an electrical contact which is inserted into the support hole and makes electrical contact with an object to be inspected; and an electrode part installed near the opening of the support hole. The electrical contact includes: a non-conductive part with a bent part, and a conductive part provided on one end side of the non-conductive part. The bent part bends so that when one end of the conductive part is in electrical contact with the object to be inspected, the other end side of the conductive part is short-circuited with the electrode part.

Description

ELECTRICAL CONTACT STRUCTURE OF ELECTRICAL CONTACTOR AND ELECTRICAL CONNECTING APPARATUS

The present invention relates to an electrical contact structure of an electrical contactor and an electrical connection device.

For example, a probe card as an electrical connection device is used for inspection of electrical characteristics of a plurality of semiconductor integrated circuits formed on a semiconductor wafer.

In general, a probe card is constituted by arranging a plurality of electrical contacts (hereinafter, referred to as "contactors", "probes", etc.) on the lower surface of an insulating substrate, and the probe card includes each integrated circuit (subject to be inspected). It is mounted on the inspection device to be inspected. At the time of inspection, each contact of the probe card is pressed against each electrode of each integrated circuit, and the electrical characteristics of each integrated circuit are inspected.

[0003] A probe card as an electrical connection device has what is called a vertical probe card for electrically contacting each contact vertically with respect to each electrode of an object to be inspected. In addition, there are, for example, a spring type and a needle type of electrical contactor used in the vertical probe card.

Since the spring-type contactor has elasticity in a direction perpendicular to the subject, it can elastically and reliably contact the electrode of the subject.

Since the needle-type contactor is linear (rod-shaped), it can reliably make electrical contact with the electrodes of the subject arranged at a narrow pitch, but it is difficult to have elasticity in the vertical direction. .

Therefore, the structure for supporting the plurality of contacts 34 is, as illustrated in FIG. 2 , a top plate (Top plate) 43 supporting the upper portion of each of the needle-type contacts 34, and each Each of the contactors 34 is supported by using a bottom plate (bottom plate) 41 that supports the lower portion of the contactors 34 . Here, in order to have the elasticity in the vertical direction, the position of the support hole 43A of the upper plate (top plate) 43 and the position of the support hole 41A of the lower plate (bottom plate) 41 are plane ( ) are arranged so that they are relatively staggered in the direction. By setting it as such a structure, each contactor 34 is curved locally, and it is made to have elasticity in a vertical direction.

In recent years, with the ultra-miniaturization and ultra-high integration of semiconductor integrated circuits, electrical contacts (probes) provided on probe cards are required to respond to reduction of electrode area on semiconductor chips and narrowing of pitch between pads. Moreover, there exists a tendency for the signal frequency of an input/output pin to increase with the speedup of the operation speed of a semiconductor integrated circuit, and it is also calculated|required that electrical contactors (probes) be made to respond|correspond to a high frequency characteristic.

Patent Documents 1 and 2 disclose a probe head (or a test head) for inspecting a semiconductor integrated circuit. For example, a plurality of guide holes for accommodating a plurality of contact probes are provided in the probe head. In addition, in order to have elasticity in the vertical direction, the contact probe is curved in an S-shape. The contact probe extends along the longitudinal direction between the first end and the second end, and includes a first end and a second end in contact with the electrode of the subject. Moreover, the contact probe comprises, between a 1st end and a 2nd end, a non-conductive 1st part, and the 2nd part from the said 1st part to a 2nd end. Furthermore, a conductive part is provided in the guide hole, and the second part of the contact probe and the conductive part are electrically connected to short circuit.

[Patent Document 1] International Publication No. 2018/108790 [Patent Document 2] International Publication No. 2019/091946

However, as in the techniques described in Patent Documents 1 and 2, when the conductive contact portion of the contact probe is electrically brought into contact with the conductive portion (electrode portion) of the guide hole, the contact point may become a sliding contact, There arises a possibility that the contact part of a contact probe, or an electroconductive part wears, As a result, the contact part deteriorates, and an influence may arise also in a high-precision test|inspection.

Accordingly, there is a demand for an electrical contact structure and an electrical connection device for an electrical contact capable of shortening the length of the conductive path through which the electrical contact flows and stably bringing the conductive portion and the electrode portion of the electrical contact into contact.

In order to solve this problem, the electrical contact structure of the electrical contactor according to the first present invention includes (1) a support hole in which an opening is formed on one side of a support substrate, and (2) a support hole inserted into the support hole, an electrical contactor in electrical contact with, (3) an electrode portion provided near the opening of the support hole; and (5) the bent portion is characterized in that when one end of the conductive portion is in electrical contact with the subject, the other end side of the conductive portion is bent so as to short-circuit with the electrode portion.

An electrical connection device according to a second aspect of the present invention includes a support substrate for supporting a plurality of electrical contacts, and electrically connects an object to be inspected and an inspection device. It has the electrical contact structure of the contactor.

According to the present invention, the length of the conduction path through which the electrical contactor flows can be shortened, so that the conducting portion of the electrical contactor can be stably brought into contact with the electrode portion.

1 is a plan view showing the configuration of an electrical connection device according to an embodiment.
[ Fig. 2 ] It is a configuration diagram showing the configuration of an electrical connection structure of a conventional contactor.
[Fig. 3] Fig. 3 is a front view showing the configuration of an electrical connection device according to an embodiment.
4 is a partial cross-sectional view showing the configuration of an electrical connection structure of a contactor according to an embodiment.
[ Fig. 5] Fig. 5 is a configuration diagram showing the configuration of a probe according to an embodiment.
[ Fig. 6] Fig. 6 is a diagram showing the state of the probe during non-contact and during contact.
Fig. 7 is a partial cross-sectional view showing the configuration of an electrical connection structure of a contactor according to a modified embodiment (part 1).
Fig. 8 is a partial cross-sectional view showing the configuration of an electrical connection structure of a contactor according to a modified embodiment (part 2).
[Fig. 9] Fig. 9 is a partial cross-sectional view showing the configuration of an electrical connection structure of a contactor according to a modified embodiment (part 3).
[Fig. 10] Fig. 10 is a configuration diagram showing the configuration of the probe and the electrical connection structure of the contactor according to the modified embodiment.

(A) Main embodiment

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an electrical contact structure and an electrical connection device of an electrical contactor according to the present invention will be described in detail with reference to the drawings.

(A-1) Configuration of the embodiment

In this embodiment, using the present invention, an inspection apparatus (hereinafter referred to as a "tester") that performs inspection (eg, energization inspection, etc.) of electrical characteristics of a plurality of semiconductor integrated circuits formed on a semiconductor wafer. It is also called.) and is an example of application to the electrical connection device mounted on the

In the following description, an "inspection object" is an object for which an inspection apparatus inspects electrical characteristics, and indicates, for example, an integrated circuit, a semiconductor wafer, or the like. A "semiconductor wafer" has a plurality of integrated circuits in which circuit patterns are formed on the wafer, and assumes a state before dosing.

An "electrical connection device" has a plurality of contactors electrically contacting each electrode of an object to be inspected, and electrically connects the object to be inspected and the inspection apparatus. The electrical connection device is, for example, a probe card or the like, and in this embodiment, a vertical probe card is exemplified.

A "contactor" is an electrical contactor that makes electrical contact with an electrode of a subject. For the contactor, for example, a probe can be applied, and a needle-type probe formed of a linear member, a probe formed of a thin member of a thin plate, or the like can be applied. In this embodiment, the case where the contactor is a needle-type probe formed entirely of a linear member is exemplified.

A "support substrate" is a plate-shaped substrate that supports a plurality of contacts (electrical contacts). The support substrate has a plurality of support holes in which openings are formed on one side thereof, and each contactor (electrical contactor) is inserted into each support hole of the support substrate to support each contactor. The support substrate can be, for example, a probe support body 17 or a wiring board 2 described later.

(A-1-1) Detailed configuration of electrical connection device 1

1 is a plan view showing the configuration of an electrical connection device 1 according to an embodiment. 3 is a front view showing the configuration of the electrical connection device 1 according to the embodiment. 4 is a partial cross-sectional view showing the configuration of the electrical connection structure of the contactor (probe) 21 according to the embodiment.

The electrical connection device 1 includes a wiring board 2 , a connection board 3 , a plurality of wirings 4 , and a probe assembly 5 .

The wiring board 2 is a board|substrate formed in the shape of a disk. In a central portion on one side (eg, upper surface) side of the wiring board 2 , a spherical shape penetrating the board in the thickness direction (Z direction, plate thickness direction) of the wiring board 2 is formed. An opening 7 is formed. On one surface (eg, upper surface) of the wiring board 2 , a plurality of connection lands 9 as connection portions are formed in alignment along opposite sides of a pair of spherical openings 7 . Moreover, in the outer edge part of one surface (for example, upper surface) of the wiring board 2, the some tester land (tester connection part) connected with the electric circuit of an inspection apparatus (tester) is formed. . Each connection land 9 and the corresponding test land 8 are electrically connected via a conductive path (not shown) of the wiring board 2 similarly to the conventional electrical connection apparatus.

The connection board 3 is formed of an electrically insulating material and is a member attached to a substantially central portion on one side (eg, upper surface) side of the wiring board. The connecting substrate 3 has a spherical planar spherical portion 11 accommodated in the opening 7 , and a spherical portion 11 on one surface (eg, upper surface) of the spherical portion 11 . It has a spherical annular flange (Ring-shape flange) (12) extending to the outer edge of the. The connecting board 3 has a plurality of spherical parts 11 in the opening 7 of the wiring board 2 in a state where the annular flange 12 is mounted on the edge of the opening 7 . The annular flange 12 is mounted on one surface (eg, upper surface) of the wiring board 2 by means of a screw member 13 .

As shown in FIG. 1, in the spherical part 11 of the connection board|substrate 3, the several through-hole 14 penetrating through the board|substrate in the thickness direction (Z direction, plate|board thickness direction) of the board|substrate is formed. Each of the plurality of through holes 14 is formed in correspondence with the position of the electrode 16 of the integrated circuit as the object 15 to be inspected.

One end of each wiring 4 is inserted into each through hole 14 of the connection board 3 . A front end surface of one end of each wiring 4 inserted into each through hole 14 is electrically connected to each corresponding probe 21 supported by the probe assembly 5 . Each wiring 4 may be directly connected to each corresponding probe 21, and may be connected to each probe 21 indirectly via a conductive path and a terminal. On the other hand, the other end of each wiring 4 is connected to each corresponding connection land 9 . Each probe 21 is connected to each connection land 9 via each wiring 4 . Therefore, each probe 21 is connected to the electric circuit of an inspection apparatus (tester) via each connection land 9 and the corresponding tester land 8 electrically connected.

The probe assembly 5 is attached to the other surface (for example, the lower surface) side of the connection board 3 . The probe assembly 5 has a probe support 17 that supports a plurality of probes 21 .

The probe support body 17 is a plate-shaped member formed of an electrically insulating member. The probe support body 17 has an opening formed on the other surface (for example, the lower surface) 18 of the probe support body 17, and faces upward (ie, plate thickness direction, Z direction), a plurality of probes ( 21) has a plurality of support holes 19 for receiving each. In other words, each support hole 19 can be said to be a recessed portion in which an opening is formed in the lower surface 18 of the probe support body 17 .

Each support hole 19 of the probe support body 17 is formed at a position corresponding to the position of each electrode 16 of the subject 15 . The number of support holes 19 of the probe support body 17 is equal to the number of the electrodes 16 of the object 15 to be inspected.

The ceiling portion 192 of each support hole 19 supporting each probe 21 supports the supported portion 51 at the first end (eg, upper end) of the probe 21 . For example, as illustrated in FIG. 4 , a hole portion for supporting the first end of the probe 21 is provided in the ceiling portion 192 of the support hole 19 , and the second end of the probe 21 is provided in the hole portion. By inserting one end, the probe 21 accommodated in the support hole 19 can be supported. That is, the probe 21 supported by the ceiling portion 192 is received in the support hole 19 by draining the inside of the support hole 19 , and at the second end side of each probe 21 . A part or all of the conduction portion 212 (refer to FIG. 5 ) is provided to protrude below the lower surface 18 of the support hole 19 .

In addition, the method of supporting the probe 21 in the support hole 19 is not specifically limited. For example, after inserting the supported portion 51 of the probe 21 into a hole made in the ceiling portion 192 of the support hole 19, it may be fixed with an adhesive material or the like. Moreover, the cross section of each support hole 19 may be a circular or elliptical hole, and a square, rectangular, or polygonal hole may be sufficient as a cross section.

Each electrode terminal 20 is provided on the lower surface 18 of the probe support body 17 in the vicinity of each support hole 19 . Here, as will be described later, a non-conductive guide portion 211 having a bent portion 54 is formed on the first end side of each probe 21 (refer to FIG. 5 ). When each probe 21 and the electrode 16 of the subject 15 are in contact with each other during the inspection of the subject 15, each probe 21 supported by each support hole 19 is elastically deformed ( For example, bending, etc.).

Each electrode terminal 20 is in electrical contact with the conduction part 212 (refer FIG. 5) of each probe 21 deformed by a contact load. In other words, each electrode terminal 20 is a terminal electrically connected to the conductive portion 212 of each deformed probe 21 .

Moreover, each electrode terminal 20 is connected to each conductive path 22 formed in the probe support body 17 . Each conductive path 22 is a part through which an electric signal flows between each electrode terminal 20 and each corresponding wiring 4 . Accordingly, the conductive portion 212 of each probe 21 is electrically connected to each corresponding wiring 4 via each electrode terminal 20 and the conductive path 22 .

In addition, the conductive path 22 may be formed inside the board|substrate of the probe support body 17 . Also, for example, in the case of the probe support 17 formed of a multilayer structure substrate, a part of the conductive path 22 may be formed in the plane direction of the probe support 17 (ie, on the XY plane).

Here, it demonstrates comparing the support structure of the some probe 21 in embodiment, and the support structure of the conventional some contactor (probe) 34 illustrated in FIG.

The conventional probe support structure in FIG. 2 includes an upper plate (top plate) 43 supporting an upper portion of each contactor 34 and a lower plate (bottom plate) 41 supporting a lower portion of each contactor 34 . is used to support each contactor 34 having a substantially S-shape.

On the other hand, in the plurality of probe support structures in the embodiment, at least the lower end plate (bottom plate) 41 is not provided. As will be described later, in the probe 21 of the embodiment, the non-conductive guide part 211 is responsible for the elastic function.

Therefore, in the embodiment, the length of the probe assembly 5 in the thickness direction (Z direction) can be made shorter than that of the conventional probe assembly in the thickness direction (Z direction). In other words, the length of the conductive path of the current flowing between the electrode 16 of the subject 15 and the wiring 4 through the probe 21 can be shortened during the inspection of the subject 15 . there is. As a result, inspection precision can be improved. Moreover, the cost of the probe assembly 5 can also be suppressed.

In addition, in the conventional probe support structure in FIG. 2, the position of the support hole 43A of the upper plate (top plate) 43 and the position of the support hole 41A of the lower plate (bottom plate) 41 are, They are arranged so as to be relatively staggered in the plane direction.

On the other hand, in the probe support structure in the embodiment, the probe 21 supported by the support hole 19 of the probe support body 17 is disposed extending from the support point in the vertical direction (Z direction).

Therefore, by using the probe support structure of the embodiment, it is easy to control the alignment of the probe 21 brought into contact with the electrode 16 on the semiconductor wafer as the object 15 to be inspected, and the alignment accuracy can be improved. there is.

In addition, in this embodiment, the case where the some probe 21 is supported by the probe support body 17 of the probe assembly 5 is illustrated. However, it is not limited to this example, and the same structure as each support hole 19 of the probe support body 17 is provided on the lower surface of the wiring board 2, and each support hole 19 provided in the wiring board 2 is provided. ), each probe 21 may be supported. In this case, there is also no need to provide the upper plate (top plate) 43 .

(A-1-2) Configuration of the probe (21)

Fig. 5A is a side view showing the configuration of the probe 21 according to the embodiment, and Fig. 5B is a front view showing the configuration of the probe 21 according to the embodiment. In addition, the size, wire diameter, length, bending degree, etc. of the probe 21 illustrated in FIG.5(A) and FIG.5(B) are highlighted.

The probe 21 has a non-conductive guide portion 211 having a bent portion 54 , and a conductive portion 212 provided on one end side of the non-conductive guide portion 211 , and is formed. The probe 21 may be a needle-type contactor formed of, for example, a thin wire of an insulating material and a conductive metal, as the whole of the probe 21 . Incidentally, the probe 21 is not limited to a linear member, and may be formed of, for example, a thin plate-like member having a small width of an insulating material and a conductive metal. In this embodiment, what the probe 21 was formed of the linear member is illustrated.

The wire diameter (diameter of the probe 21) and overall length of the probe 21 are not particularly limited, and can be appropriately determined according to the size of the electrode 16 of the semiconductor wafer to be inspected, etc. . For example, the wire diameter of the probe 21 may be about several tens of μm, and the length may be about several mm.

The non-conductive guide portion 211 of the probe 21 is formed of an insulating material such as an insulating synthetic resin material. The non-conductive guide part 211 has an elastic function of giving elasticity to the entire probe 21 in the vertical direction (Z direction). In addition, the non-conductive guide part 211 functions as a conductive part support member for supporting the conductive part 212 of the probe 21 . In other words, the non-conductive guide portion 211 has a function as a conductive portion supporting member having elasticity.

The non-conductive guide portion 211 formed in a linear shape of an insulating material includes the supported portion 51 supported by the support hole 19 in which the probe 21 is accommodated, and the supported portion 51 along the length direction of the probe 21 . It has a lower portion extending downward of the supported portion 51 . The lower portion is integrally connected with the supported portion 51 .

In a substantially central portion of the lower portion of the non-conductive guide portion 211, a bent portion 54 in which the lower portion is bent by, for example, bending is formed. For example, during the inspection of the subject 15 , the lower end of the probe 21 (the lower end of the conductive portion 212 ) is in contact with the electrode 16 of the subject 15 , and the probe 21 is A contact load is applied. At this time, since the bent portion 54 is formed in the lower portion, the entire probe 21 is deformed with the bent portion 54 as a starting point, the probe 21 is greatly curved, and the entire probe 21 is has elasticity in the vertical direction (Z direction).

In addition, although the bent part 54 which was greatly bent is shown in FIG.5(A), it may be sufficient as long as it is a degree of bend which can deform|transform the probe 21 with the bent part 54 as a starting point at the time of a contact. The bent part 54 may be formed by bending, and the wire diameter of the bent part 54 may be made smaller than the wire diameter of the non-conductive guide part 211 so that it may bend easily.

Here, among the lower portions of the non-conductive guide portion 211 , a portion from the supported portion 51 to the bent portion 54 is referred to as a first guide portion 52 , and from the bent portion 54 to the non-conductive guide portion 211 . ) up to the lower end of the second guide part 53 is called.

The conduction portion 212 of the probe 21 is provided at the lower end of the second guide portion 53 of the non-conduction guide portion 211 . The conduction portion 212 is formed of a conductive material. Conductive portion 212 is, for example, to be formed of a metal such as copper, copper alloy, beryllium copper alloy, for example, a rubber material having conductivity such as elastomer, a synthetic resin material having conductivity, etc. it's free to do Further, the conductive portion 212 may be formed by plating or the like on the surface of the lower end of the non-conductive guide portion 211 . In this embodiment, the conductive part 212 exemplifies the case where it is generally formed of a thin conductive metal wire.

The conductive part 212 provided in the non-conductive guide part 211 may be attached to the second guide part 53 of the non-conductive guide part 211 with an adhesive or the like, for example.

The conductive portion 212 includes a second contact portion 56 in contact with the electrode terminal 20 of the other surface (eg, lower surface) of the probe support 17 , and the electrode 16 of the subject 15 , and It has a first contact portion 55 in contact. In other words, the conductive portion 212 is connected to the second contact portion 56 for wiring connection with the wiring 4 via the electrode terminal 30 and the conductive path 22 , and to the electrode 16 of the subject 15 . It has a first contact portion 55 in electrical contact with the .

The second contact portion 56 of the conductive portion 212 comes into contact with the electrode terminal 20 when the probe 21 subjected to a contact load is elastically deformed. The shape of the 2nd contact part 56 is not specifically limited, For example, it is good also as a shape, such as an inverted triangular prism or an inverted triangular pyramid which has roundness. In this case, the contact area between the upper surface portion 561 or its peripheral portion of the second contact portion 56 and the electrode terminal 20 is increased, and the electrical contact property is improved.

The first contact portion 55 of the conduction portion 212 is a linear portion extending downward from the second contact portion 56 . The lower end 551 of the first contact portion 55 formed in a linear shape is in contact with the electrode 16 of the object 15 to be inspected. In addition, the lower end part 551 of the 1st contact part 55 is also called "contact part" which contacts the electrode 16. As shown in FIG.

The first contact portion 55, like the second contact portion 56, is made of, for example, a conductive material such as copper, a copper alloy, or a beryllium copper alloy. The second contact portion 56 and the first contact portion 55 may be formed integrally with the same material. By forming integrally with the same material, conduction|electrical_connection characteristic becomes favorable and a high-precision test|inspection becomes possible.

In the probe 21 , a conductive portion 212 is provided at the lower end of the non-conductive guide portion 211 . As will be described later, by shortening the length of the conduction portion 212 , the length of the conduction path during the inspection of the subject 15 can be shortened. For example, by shortening the length of the second contact portion 56 and the conductive portion 212 having the second contact portion, the conduction path can be shortened.

For example, the non-conductive guide part 211 formed of an insulating synthetic resin material is easy to process the shape, length, wire diameter, etc. of the non-conductive guide part 211 . Accordingly, the length or shape of the non-conductive guide portion 211 may be changed regardless of the length of the conductive portion 212 .

For example, when the length of the conductive portion 212 of the probe 21 is set to a predetermined length and the probe pressure for contacting the probe 21 with the electrode 16 of the subject 15 is increased , When the length of the non-conductive guide part 211 is relatively short and the needle pressure is reduced, the length of the non-conductive guide part 211 may be relatively long.

(A-1-3) Electrical contact structure of probe 21

Fig. 6(A) is a diagram showing the state of the probe 21 at the time of non-contact, and Fig. 6(B) is a diagram showing the state of the probe 21 at the time of contact. Incidentally, the size, wire diameter, length, and degree of bending and curvature of the probe 21 illustrated in FIGS. 6A and 6B are highlighted.

FIG. 6(A) shows a state in which, among the non-conductive guide portions 211 of the probe 21 , the supported portion 51 is supported by the ceiling portion 192 of the support hole 19 .

The non-contact probe 21 is installed extending vertically downward from the position of the supported portion 51 . The lower end 551 of the first contact portion 55 formed in the conductive portion 212 is generally on the line C or the line (C) descending from the position of the supported portion 51 that is the support point of the probe 21 C) is located nearby.

Conventionally, as illustrated in FIG. 2 and Patent Documents 1 and 2, a probe formed in an S-shape is disposed. Accordingly, the position of the upper portion of the probe and the position of the lower end of the probe that are brought into contact with the electrode of the subject are staggered. On the other hand, as in this embodiment, by positioning the lower end 551 on a vertical line C passing through the position of the supported portion 51, the position of the supported portion 51 and the position of the lower end 551 are to match (consistent or nearly coincide). Therefore, according to this embodiment, it becomes easy to control the alignment of the probe 21 with respect to the electrode 16 of the subject 15, and the alignment precision also improves.

Moreover, it is preferable that the probe 21 at the time of a non-contact is accommodated without contacting the inner wall of the support hole 19. As shown in FIG. Although the curved portion 54 is formed in the non-conductive guide portion 211 , it is preferable that the curved portion 54 does not contact the inner wall of the support hole 19 and the probe 21 is accommodated in the support hole 19 . In other words, in the support hole 19 , the position of the supported portion 51 supported does not need to be the central position of the ceiling portion 192 of the support hole 19 . The supported portion 51 may be supported by the ceiling portion 192 of the support hole 19 so that the bent portion 54 does not contact the inner wall of the support hole 19 .

In addition, although the elasticity of the probe 21 may become weak, as a modification, the bent part 54 of the probe 21 at the time of non-contact, etc. may be in contact with the inner wall of the support hole 19. As shown in FIG.

In addition, the probe 21 during non-contact is accommodated in the support hole 19 so that the conductive portion 212 protrudes from the lower surface 18 of the probe support body 17 . For example, the probe 21 is supported by the support hole 19 so that the position of the second contact portion 56 in the conduction portion 212 is lower than the lower surface 18 of the probe support body 17 . . This is to make the second contact portion 56 and the electrode terminal 20 electrically contact when the probe 21 is in contact and when the probe 21 is elastically deformed.

6B shows the probe 21 when the lower end 551 of the probe 21 is in contact with the electrode 16 of the subject 15 and a contact load is applied to the probe 21 . indicates the status.

When the lower end 551 of the probe 21 comes into contact with the electrode 16 and a contact load is applied to the probe 21 , the probe 21 is deformed. That is, the bent portion 54 formed in the non-conductive guide portion 211 serves as a starting point, and the linear non-conductive guide portion 211 strengthens the curvature, and the bent portion 54 contacts the inner wall of the support hole 19 . . By the contact between the bent portion 54 and the inner wall surface of the support hole 19, toward the axis of the support hole 19 (for example, it may be a perpendicular C from the supported portion 51), The second contact portion 56 at the other end of the conductive portion 212 is moved. And at about the same time, in the conduction part 212 of the probe 21, the lower end part 551 which is in contact with the electrode 16 becomes a starting point, and the linear 1st contact part 55 is curved by a contact load. do. Accordingly, the second contact portion 56 of the conductive portion 212 moves upward, and the second contact portion 56 of the conductive portion 212 and the electrode terminal 20 come into contact with each other.

That is, the bent portion 54 is at the other end side of the conductive portion 212 when the lower end 511 at one end of the conductive portion 212 electrically contacts the electrode 16 of the subject 15 . The second contact portion 56 on the pole functions to be bent so as to be short-circuited with the electrode terminal 20 .

At this time, since the probe 21 supported by the support hole 19 is supported by the contact point in contact with the electrode 16 and the contact point in contact with the inner wall of the support hole 19 , the probe 21 ) to stabilize the posture. Since the second contact portion 56 is in contact with the electrode terminal 20 in a state where the posture of the probe 21 is stable, sliding of the second contact portion 56 with respect to the electrode terminal 20 can be suppressed. . As a result, abrasion between the electrode terminal 20 and the second contact portion 56 can be suppressed, deterioration of the contact portion can be suppressed, and the inspection accuracy can also be improved.

A case in which the test subject 15 is inspected in the state of the probe 21 at the time of contact of FIG. 6B will be described.

In the conduction portion 212 of the probe 21 , the lower end 551 of the first contact portion 55 is in electrical contact with the electrode 16 of the subject 15 , and the second contact portion 56 is It is in electrical contact with the electrode terminal 20 . Therefore, the conduction path through which the electric signal flows is a contact point where the lower end 551 of the first contact part 55 contacts the electrode 16 and the contact point where the second contact part 56 contacts the electrode terminal 20 . It becomes a path between them, and the conduction path|route can be shortened compared with the prior art.

For example, with the increase in the operating speed of the integrated circuit as the subject 15 , the probe card is required to correspond to the high-frequency characteristics of the subject 15 . As the length of the probe 21 used for inspection increases, the reactance component increases accordingly, and in particular, the inspection accuracy of high-frequency characteristics may be affected.

According to this embodiment, by using the probe 21 formed of the non-conductive guide portion 211 and the short conductive portion 212 , the conduction path is shortened, so that the inspection accuracy can be improved.

(A-2) Modifications of the embodiment

Hereinafter, a modified example of the above-described embodiment will be described with reference to the drawings.

(A-2-1) FIG. 7(A) is a diagram showing the state of the probe 21 at the time of non-contact in the modified embodiment, and FIG. 7(B) is the contact at the time of contact in the modified embodiment. It is a figure which shows the state of the probe 21. As shown in FIG.

In the above-described embodiment, the case in which the electrode terminal 20 is provided on the lower surface 18 of the probe support body 17 is exemplified. In Figs. 7A and 7B, the conductive path 22 is A case in which the electrode terminal 20 connected to the probe is provided on the inner wall surface of the support hole 19 of the probe support body 17 is exemplified. For example, in this case, the electrode terminal 20 may be provided on the inner wall surface where the second contact portion 56 of the curved probe 21 is in contact with the inner wall of the support hole 19 at the time of contact. Do.

Incidentally, in FIGS. 7A and 7B , among the inner walls of the support hole 19 for accommodating the probe 21 , the support hole where the second contact portion 56 of the probe 21 comes into contact with each other. The case where the electrode terminal 20 is provided on a part of the inner wall of (19) is exemplified. However, for example, the electrode terminals 20 having a predetermined width in the Z direction may be provided over the entire perimeter of the inner wall of the support hole 19 . Further, for example, the electrode terminals 20 may be provided on the entire surface of the inner wall of the support hole 19 .

With such a structure, the length of the portion of the probe 21 protruding downward from the lower surface 18 of the probe support 17 (that is, the first contact portion 55 on the line of the conductive portion 212) can be made shorter. can Moreover, the diameter (diameter) of the support hole 19 which accommodates the probe 21 can be made larger. Therefore, it becomes easy to accommodate the probe 21 in the support hole 19 .

(A-2-2) Another modified embodiment is illustrated in FIG. 8 . Fig. 8(A) is a diagram showing the state of the probe 21 at the time of non-contact in the modified embodiment, and Fig. 8(B) shows the state of the probe 21 at the time of contact in the modified embodiment. It is a city shown

8(A) and 8(B), in the probe support body 17, a part of the open end of the support hole 19 is notch cut, and this cut-out part (slope) The electrode terminal 20 connected to the conductive path 22 may be provided on a partial surface or the entire surface of 191 .

For example, in both or one of the surface of the cutout 191, which is a slope provided at the open end of the support hole 19, and the surface of the inner wall of the support hole 19 connected to the cutout 191, the electrode The terminal 20 may be provided. Also in this case, the electrode terminal 20 connected to the conductive path 22 may be provided on the entire inner wall of the support hole 19 .

In addition, you may make it provide the notch 191 in the whole perimeter of the substantially circular open end of the support hole 19, for example. In other words, you may make it provide the cutout 191 machined to the taper shape whose diameter becomes narrower as it goes upward in the Z direction with respect to the open end of the support hole 19. As shown in FIG.

With such a structure, the contact between the second contact portion 56 of the probe 21 and the electrode terminal 20 is improved at the time of contact, and the contact area between the second contact portion 56 and the electrode terminal 20 is also increased. get bigger As a result, the inspection precision is improved.

(A-2-3) Another modified embodiment is illustrated in FIG. 9 . Fig. 9(A) is a diagram showing the state of the probe 21 at the time of non-contact in the modified embodiment, and Fig. 9(B) shows the state of the probe 21 at the time of contact in the modified embodiment. It is a city shown

9(A) and 9(B) exemplify a case in which the support hole 19 of the probe support body 17 is provided in an oblique direction with respect to the semiconductor wafer which is the object to be inspected 15 . That is, a case in which the support hole 19 having a predetermined inclination with respect to the vertical direction of the Z-axis is provided and the probe 21 is also supported in the inclined direction corresponding to the inclination of the support hole 19 is exemplified.

In this case, the inner wall surface of the support hole 19 is also inclined. On the other hand, a vertical conductive path 22 is provided in the probe support 17 . Therefore, even if the conductive path 22 in the vertical direction in the probe support 17 intersects the support hole 19 and the portion of the conductive path 22 appearing on the inner wall surface of the support hole 19 is the electrode terminal 20 . free 9(A) and 9(B), the electrode terminals 20 are installed over a wide range from the lower end of the inclined inner wall surface of the support hole 19 to the vicinity of the inner wall center of the support hole 19 It exemplifies a case where

With such a structure, the contact between the second contact portion 56 of the probe 21 and the electrode terminal 20 is improved at the time of contact, and the contact area between the second contact portion 56 and the electrode terminal 20 is also increased. get bigger As a result, the inspection precision is improved.

(A-3) Effects of the embodiment

As described above, according to the embodiment, the probe 21 is formed having the non-conductive guide portion 211 and the conductive portion 212 , and the probe 21 supported by the support hole 19 is subjected to a contact load. By deforming, the second contact portion 56 of the conductive portion 212 comes into contact with the electrode terminal 20 in the vicinity of the support hole 19 . Therefore, the conduction path of the current flowing between the electrode 16 of the subject 15 and the electrode terminal 20 via the probe 21 can be shortened. As a result, the inspection accuracy of the electrical characteristics of the inspected object 15 can be improved.

Further, according to the embodiment, when the probe 21 is brought into contact with the electrode 16 of the subject 15 , the probe 21 is taken from the bent portion 54 formed in the non-conductive guide portion 211 as a starting point. ) is transformed. The posture of the probe 21 is stabilized by the contact point at which the bent portion 54 comes into contact with the inner wall of the support hole 19 and the contact point at which the lower end 551 comes into contact with the electrode 16 . Therefore, sliding and abrasion of the 2nd contact part 56 with respect to the electrode terminal 20 can be suppressed.

(B) another embodiment

Although the above-mentioned embodiment also mentioned various modified embodiment, this invention is applicable also to the following modified embodiment.

(B-1) The electrical contactor (probe) which concerns on this invention is not limited to the structure demonstrated in the above-mentioned embodiment. For example, it is applicable also to the structure of the probe 21A illustrated in FIG.10(A).

Fig. 10(A) is a block diagram showing the configuration of the probe 21A according to the modified embodiment, and Fig. 10(B) is a diagram showing the state of the probe 21A during contact according to the modified embodiment. .

In Fig. 10(A), the probe 21A is formed having a non-conductive guide portion 211A of a thin wire or narrow plate-like member and a conductive portion 212A of a thin wire or narrow plate-like member. .

The conduction portion 212A is formed to overlap from the substantially central portion of the non-conductive guide portion 211A to the lower end portion of the non-conduction guide portion 211A, and the lower end of the conduction portion 212A is connected to the non-conduction guide portion 211A. ) protrudes downward from the lower end.

For example, you may make it the conduction|electrical_connection part 212A formed in one surface (left side of FIG. 10(A)) of the non-conductive guide part 211A made into the narrow plate-shaped member. The conduction part 212A may be a narrow plate-shaped member. In that case, the width length of the narrow plate-shaped conduction portion 212A may be the same as the width length of the non-conduction guide portion 211A, or may be slightly smaller.

The non-conductive guide portion 211A includes a supported portion 51A supported by the support hole 19 from above, a support portion 58 , a first guide portion 52A, a second guide portion 53A, and a bent portion ( 54A). On the other hand, the conduction part 212A has the to-be-guided part 57, the 2nd contact part 56A, and the 1st contact part 55A from above. The lower end 551A of the first contact portion 55A is in contact with the electrode 16 of the object 15 to be inspected.

The first guide portion 52A, the bent portion 54A, and the second guide portion 53A of the non-conductive guide portion 211A include the guided portion 57 of the conductive portion 212A, the second contact portion 56A and It overlaps with the 1st contact part 55A.

Further, the bent portion 54A is formed in a portion where the non-conductive guide portion 211A and the conduction portion 212A overlap. With the bending of the bent portion 54A, the conductive portion 212A is also bent, and a bent portion of the conductive portion 212A is formed as the second contact portion 56A.

Therefore, as shown in Fig. 10B, during contact, the lower end 551A of the probe 21A comes into contact with the electrode 16, and when a contact load is applied, the bent portion of the non-conductive guide portion 211A ( 54A) becomes the starting point, and the probe 21A deform|transforms.

At this time, the second contact portion 56A at a position corresponding to the bent portion 54A comes into contact with the electrode terminal 20 on the inner wall of the support hole 19, and the support portion ( 58) is curved to contact the inner wall of the support hole (19).

Also in this case, the probe 21A supported by the support hole 19 includes a contact point in contact with the electrode 16 and a contact point in contact with the inner wall of the support hole 19 (second contact portion 56A); Since it is supported by the contact point 58A of the support portion 58), the posture of the probe 21A can be stabilized.

That is, since the second contact portion 56A is in contact with the electrode terminal 20 in a state where the posture of the probe 21A is stable, sliding of the second contact portion 56A with respect to the electrode terminal 20 can be suppressed. can As a result, abrasion between the electrode terminal 20 and the second contact portion 56A can be suppressed, deterioration of the contact portion can be suppressed, and the inspection accuracy can also be improved.

In addition, in FIG. 10(B), the case where the electrode terminal 20 is provided in the inner wall surface of the support hole 19 is illustrated. However, the electrode terminal 20 may be provided on the lower surface 18 of the probe support body 17 as illustrated in FIGS. 6A and 6B , or FIGS. 8A and 8B . As illustrated in (B), it may be provided on the inner wall surface of the cut-out portion 191 and or the support hole 19 .

(B-2) In the above-mentioned embodiment, the case where the electrode terminal for wiring connection of the probe 21 is provided in the vicinity of the support hole 19 or the inner wall of the support hole 19 was exemplified. The position of the electrode terminal 20 may be any position capable of contacting the second contact portion 56 when the probe 21 is deformed by the contact load, and is not limited to the above-described embodiment.

(B-3) In the above-mentioned embodiment, although the case where the non-conductive guide part 211 of the probe 21 has the bending part 54 was exemplified, the bending part 54 provided in the non-conductive guide part 211 is shown. The number of is not limited to one, and may be plural (for example, two or more).

One … electrical connector,
5 … probe assembly,
15 … subject,
16 … electrode,
17 … probe support,
18 … The lower surface of the probe support,
19 … support hole,
191 … cutout,
192 … ceiling,
20 … electrode terminal,
21 and 21A … electrical contactor (probe);
211 and 211A … non-conductive guide part,
212 and 212A … continuity,
51 and 51A... sebaceous part,
52 and 52A... a first guide unit;
53 and 53A... a second guide unit;
54 and 54A... bend,
55 and 55A … first contact;
551 … lower part,
56 and 56A... second contact;
57 … blood guide,
58 … support.

Claims (9)

a support hole having an opening formed on one side of the support substrate;
an electrical contact inserted into the support hole and in electrical contact with the subject;
An electrode part installed in the vicinity of the opening of the support hole
equipped with
The electrical contactor is
a non-conductive portion having a bent portion;
A conductive portion provided on one end side of the non-conductive portion
is to have
The curved part,
When one end of the conductive part is in electrical contact with the subject, the other end side of the conductive part is bent to short-circuit with the electrode part.
Electrical contact structure of an electrical contactor, characterized in that. According to claim 1,
The electrical contact structure of the electrical contactor, wherein a second contact portion protruding in a direction crossing the axial direction of the conductive portion is provided on the other end side of the conductive portion. According to claim 1,
An electrical contact structure of an electrical contactor, characterized in that the second contact portion of the conductive portion and the electrode portion contact each other by deformation of the electrical contactor. According to claim 1,
Electrical contact of an electrical contact, characterized in that the bending portion and the inner wall surface of the support hole come into contact with each other by deformation of the electrical contactor, thereby moving the other end of the conducting portion in a direction intersecting the axis of the support hole structure. According to claim 1,
The non-conductive portion of the electrical contact is formed of a linear member or a narrow plate-like member,
The second contact portion of the conductive portion is formed of a member in contact with the electrode portion over a large area at the one end of the non-conductive portion,
The first contact portion of the conductive portion is supported by the second contact portion and is formed of a linear member or a narrow plate-like member
Electrical contact structure of an electrical contactor, characterized in that. According to claim 1,
the electrode part,
An electrical contact structure of an electrical contactor, which is a bottom surface of the support substrate and is provided in the vicinity of an opening of the support hole. According to claim 1,
the electrode part,
An electrical contact structure of an electrical contactor, characterized in that it is installed on a partial surface or an entire surface of the inner wall of the support hole. According to claim 1,
the electrode part,
The electrical contact structure of an electrical contactor, characterized in that it is provided on the surface of the slope of the cutout formed by cutting the opening of the support hole, and or on the inner wall surface of the support hole. An electrical connection device comprising a support substrate supporting a plurality of electrical contacts and electrically connecting an object to be inspected and an inspection device, the electrical connection device comprising:
An electrical connection device having an electrical contact structure of an electrical contactor according to any one of claims 1 to 8.

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