JP2014071091A - Probe unit and inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably cause a pair of probes to come into contact with a probing object.SOLUTION: A probe unit is configured such that base end parts 31 of a pair of parallely arranged probes 12 are connected in an insulation state and a tip end part 32 of each probe 12 can simultaneously come into contact with one probing object, and the probe 12 has a thin thickness part 33, which is thinner than other parts in the probe 12, formed between the base end part 31 and the tip end part 32, and is configured to be deformable with the thin thickness part 33 as a supporting point such that the tip end part 32 secedes from the tip end part 32 of the other probe 12.

Description

  The present invention relates to a probe unit configured by connecting a pair of probes, and an inspection apparatus including the probe unit.

  As a probe unit having two connected probes, a high-frequency probe disclosed by the applicant in Japanese Patent Laid-Open No. 2002-357630 is known. The high-frequency probe includes a signal terminal and a ground terminal each formed in a rod shape, and is configured such that both terminals are connected in parallel. In this case, when the conductor pattern (conductor to be inspected) provided on the substrate is inspected using this high-frequency probe, the arm having the high-frequency probe attached to the tip is moved so as to be close to the conductor pattern (probing) And both the signal terminal and the ground terminal are brought into contact with the conductor pattern simultaneously (at a time). Next, electrical characteristics are measured based on signals input / output via the signal terminal and the ground terminal, and the quality of the conductor pattern is inspected from the measurement result.

JP 2002-357630 A (page 3-4, FIG. 6)

  However, the above high frequency probe has the following problems to be improved. That is, since this high-frequency probe is configured by connecting a pair of rod-shaped terminals in parallel, each terminal is perpendicular to a planar conductor pattern (parallel to the surface of the substrate). When probing is performed, both terminals can be simultaneously brought into contact with the conductor pattern. However, when probing, for example, a hemispherical solder bump formed on a conductor pattern, one terminal is located above the top of the solder bump and the other terminal is above the portion off the top. When located, only one terminal may contact the solder bump, and the other terminal may not contact the solder bump.

  This invention is made | formed in view of this subject, and it aims at providing the probe unit and test | inspection apparatus which can make a pair of probe contact the probe object reliably.

  In order to achieve the above object, the probe unit according to claim 1 is configured such that the base end portions of a pair of probes arranged in parallel are connected in an insulated state so that the tip portions of the probes can simultaneously contact one probing target. A probe unit configured, wherein the probe has a thin portion formed between the proximal end portion and the distal end portion, which is thinner than other portions of the probe, and the distal end portion is the other probe. The thin portion is configured to be deformable with the thin portion as a fulcrum so as to be separated from the tip portion.

  The probe unit according to claim 2 is the probe unit according to claim 1, wherein the probe unit includes a first restricting member that restricts deformation of the probe by a predetermined amount or more in a direction in which the tip portions approach each other. I have.

  A probe unit according to claim 3 is the probe unit according to claim 1 or 2, wherein the probe unit restricts deformation of the probe by a predetermined amount or more in a direction in which the tip portions are separated from each other. A member is provided.

  According to a fourth aspect of the present invention, there is provided an inspection apparatus including the probe unit according to any one of the first to third aspects and the probes of the probe unit that are in contact with a conductor portion of the substrate as the probing target. And an inspection unit for inspecting the substrate based on the electrical signal.

  In the probe unit according to claim 1 and the inspection apparatus according to claim 4, a thin portion is formed between the proximal end portion and the distal end portion of the probe so that the distal end portion is separated from the distal end portion of the other probe. The probe is configured to be deformable with the thin portion as a fulcrum. In this case, since it is difficult to deform the tip of the probe in which the thin portion is not formed, for example, when probing a solder bump as a probing target formed in a hemisphere, the center of the solder bump When the vertical line passing through and the center line between each probe in the probe unit do not match, only one tip of the pair of probes in the probe unit is in contact with the solder bump, and the other probe is in a non-contact state The descent may stop and inspection may not be possible. On the other hand, in this probe unit and inspection apparatus, even when the vertical line of the solder bump and the center line of the probe unit do not coincide with each other, the tip of the probe that comes into contact with the solder bump first serves as a fulcrum. The probe unit is lowered until the tip of the other probe comes into contact with the solder bump while elastically deforming, whereby both of the tips of each probe can be brought into contact with the solder bump. Therefore, according to the probe unit and the inspection apparatus, a pair of probes in the probe unit can be reliably brought into contact with a solder bump as a probing target.

  Further, according to the probe unit according to claim 2 and the inspection device according to claim 4, the first restricting member that restricts the deformation of the probe beyond a predetermined deformation amount in the direction in which the tip portions approach each other. By providing, the contact of front-end | tip parts can be prevented reliably. For this reason, according to the probe unit and the inspection apparatus, it is possible to reliably prevent a situation in which the substrate is inspected in a state in which the tip portions are in contact with each other, thereby making an erroneous pass / fail judgment.

  Further, according to the probe unit according to claim 3 and the inspection device according to claim 4, the second restricting member for restricting the deformation of the probe beyond a predetermined deformation amount in the direction in which the tip portions are separated from each other. By providing, separation | separation beyond the predetermined distance of front-end | tip parts can be restrict | limited reliably. For this reason, according to the probe unit and the inspection apparatus, the pressing force from the distal end portion against the probing target is reduced as the distal end portions of the probes are separated from each other by a predetermined distance or more. It is possible to reliably avoid a situation in which the electrical connection with the probing target is insufficient.

1 is a configuration diagram showing a configuration of an inspection apparatus 1. FIG. 2 is a perspective view showing a configuration of a probe unit 3. FIG. 3 is an exploded perspective view of the probe unit 3. FIG. It is the 1st explanatory view explaining the inspection method using inspection device 1. It is the 2nd explanatory view explaining the inspection method using inspection device 1. It is the 3rd explanatory view explaining the inspection method using inspection device 1. It is the 4th explanatory view explaining the inspection method using inspection device 1. It is a 5th explanatory view explaining the inspection method using inspection device 1. It is the 6th explanatory view explaining the inspection method using inspection device 1.

  Hereinafter, embodiments of a probe unit and an inspection apparatus will be described with reference to the accompanying drawings.

  First, the configuration of the inspection apparatus 1 as an example of the inspection apparatus will be described. As an example, the inspection apparatus 1 shown in FIG. 1 is configured to be able to inspect a disconnection or a short circuit of a conductor pattern 101 (see FIG. 4) provided on a substrate 100 as a probing target. Specifically, as shown in FIG. 1, the inspection apparatus 1 includes a support base 2, two probe units 3, a probing mechanism 4, a measurement unit 5, an operation unit 6, a storage unit 7, and a control unit 8. Has been.

  The support base 2 includes a clamp part (not shown) and is configured to be able to support the substrate 100 to be inspected.

  2 and 3, the probe unit 3 includes a support portion 11 and a pair of probes 12, and solder bumps formed on the conductor pattern 101 of the substrate 100 as shown in FIG. An electric signal can be input / output to / from the solder bump 102 in a state where each probe 12 is in contact with 102 (conductor portion).

  As shown in FIGS. 2 and 3, the support portion 11 includes a base portion 21, a fixing portion 22, a first restriction member 23, and two second restriction members 24, and is integrally configured. Further, the support portion 11 is formed of a high-strength material (as an example, ceramics such as silicon carbide and silicon nitride) having insulating properties (non-conductive).

  The base portion 21 is configured to be attachable to an arm 41 (see FIG. 1) of the probing mechanism 4. In this case, as shown in FIGS. 2 and 3, two insertion holes 21 a are formed in the base portion 21, and the base portion 21 is attached to the arm 41 by an unillustrated mounting screw inserted through the insertion hole 21 a. Attached to.

  The fixing part 22 is configured to fix the probe 12. Specifically, as shown in FIG. 3, the fixing portion 22 has four screw holes 22 a (only two are shown in the figure), and the proximal end portion 31 of the probe 12. The probe 12 is fixed to the fixing portion 22 by screwing a fixing screw 13 (for example, a cap screw) inserted into the insertion hole 31a formed in the screw hole 22a.

  As shown in FIGS. 2 and 3, the first restricting member 23 is formed in a plate shape (rectangular column shape) that protrudes downward from the central portion in the width direction of the fixing portion 22 (the left-right direction in both drawings). The first restricting member 23 is configured such that when the distal end portion 32 side is elastically deformed by a predetermined amount in a direction in which the distal end portions 32 of the pair of probes 12 are close to each other (that is, inward), the distal end portion 32 is deformed. It functions as a stopper that abuts and restricts further elastic deformation to prevent contact between the tip portions 32.

  As shown in FIGS. 2 and 3, the second restricting members 24 are each formed in a plate shape (a prism shape) protruding downward from both end portions of the base portion 21. The second restricting member 24 comes into contact with the distal end portion 32 when the distal end portion 32 side is elastically deformed by a predetermined amount in a direction (outward direction) in which the distal end portions 32 of the pair of probes 12 are separated from each other. Thus, it functions as a stopper that restricts further elastic deformation and limits the separation between the tip portions 32 by a predetermined distance or more.

  The probe 12 is formed into a square column as a whole as shown in FIGS. 2 and 3, using a material having conductivity and elasticity (for example, beryllium copper alloy, SKH (high speed tool steel) and tungsten steel). Has been. Further, as shown in FIG. 3, a plurality of (two in this example) insertion screws through which the fixing screws 13 for fixing to the fixing portion 22 of the support portion 11 can be inserted into the proximal end portion 31 of the probe 12. A hole 31a is formed. Further, the tip portion 32 of the probe 12 is provided with an inclined surface 32 a that is inclined with respect to the length direction of the probe 12.

  Furthermore, between the base end portion 31 and the distal end portion 32 of the probe 12, a thin portion 33 is provided that is thinner than other portions of the probe 12. In this case, the thin portion 33 is formed by notching two opposing side surfaces of the probe 12 in an arc shape. In the probe 12, the thin portion 33 is provided between the proximal end portion 31 and the distal end portion 32, so that the thin portion 33 is supported as a fulcrum in a state where the proximal end portion 31 is fixed to the fixing portion 22 of the support portion 11. As a result, the tip 32 can be elastically deformed.

  As shown in FIG. 1, the probing mechanism 4 includes two arms 41, and in accordance with the control of the control unit 8, the direction along the surface of the substrate 100 supported by the support base 2 (XY direction) and the substrate 100 A probing process is performed in which each arm 41 is moved downward and upward (Z direction) in contact with and away from the probe 100 to probe (contact) the probe 12 of the probe unit 3 with the solder bump 102 of the substrate 100.

  The measurement unit 5 determines the resistance between the conductor patterns 101 connected to each solder bump 102 based on an electric signal input / output via each probe 12 of each probe unit 3 probed on each solder bump 102 of the substrate 100. The measurement process which measures this by the four-terminal method is executed. The operation unit 6 includes various switches and keys, and outputs an operation signal when these are operated.

  The storage unit 7 stores position data indicating the position of each solder bump 102 where each probe unit 3 is to be probed. In addition, the storage unit 7 stores a reference value of the resistance value used for the inspection of the substrate 100 (conductor pattern 101).

  The control unit 8 controls the probing process by the probing mechanism 4 and the measurement process by the measurement unit 5. The control unit 8 functions as an inspection unit together with the measurement unit 5, and the quality of the substrate 100 based on the resistance value measured by the measurement unit 5, specifically, as an example, the insulation between the conductor patterns 101. Check the condition.

  Next, a method for assembling the probe unit 3 will be described with reference to the drawings. First, as shown in FIG. 3, the fixing screw 13 is inserted into each insertion hole 31 a of the base end portion 31 of one probe 12 (for example, the left probe 12 in FIG. 3). Next, the base end portion 31 of the probe 12 in this state is inserted into the gap between the fixing portion 22 of the support portion 11 and the second restriction member 24. In this case, as shown in the figure, the inclined surface 32a of the tip 32 of the probe 12 is made to face the first regulating member 23 side of the support 11. Subsequently, the base end portion 31 is fixed to the fixing portion 22 by screwing each fixing screw 13 into each screw hole 22 a of the fixing portion 22 using a tool (for example, a hexagon wrench).

  Next, similarly, the base end portion 31 of the other probe 12 (the right probe 12 in FIG. 3) is fixed to the fixing portion 22. As a result, as shown in FIG. 2, the base end portions 31 are connected via the support portion 11 in a state where the pair of probes 12 are arranged in parallel and insulated from each other, thereby assembling the probe unit 3. Is completed. As shown in FIG. 4, the assembled probe unit 3 is attached by fixing the base portion 21 of the support portion 11 to the distal end portion of the arm 41 in the probing mechanism 4 using a fixing screw or the like. .

  Next, a method for inspecting the substrate 100 using the inspection apparatus 1 will be described with reference to the drawings.

  First, the substrate 100 is placed on the support base 2, and then the substrate 100 is fixed by a clamp part (not shown). Next, the operation unit 6 is operated to instruct the start of inspection. In response to this, the control unit 8 starts the inspection process. In this inspection process, the control unit 8 reads position data from the storage unit 7 and specifies the position of the solder bump 102 where the probe unit 3 is to be probed.

  Subsequently, the control unit 8 controls the probing mechanism 4 to execute the probing process. In this probing process, the probing mechanism 4 moves one arm 41 along the surface of the substrate 100, and moves the tip 32 of each probe 12 in the probe unit 3 attached to the arm 41 to one solder bump 102. Position it above. Similarly, the probing mechanism 4 positions the tip 32 of each probe 12 in the probe unit 3 attached to the other arm 41 above the other one solder bump 102. Next, as shown in FIG. 4, the probing mechanism 4 moves (lowers) each arm 41 in a direction (downward) close to the surface of the substrate 100.

  Further, the control unit 8 controls the measurement unit 5 to measure the resistance value between the two probes 12 in each probe unit 3 during execution of the probing process by the probing mechanism 4. In this case, when the resistance value is equal to or less than the specified value, the control unit 8 conducts the distal end portions 32 of the two probes 12 through the solder bumps 102 (that is, both the distal end portions 32 of the two probes 12). And the probing mechanism 4 is controlled to further lower the arm 41 by a predetermined amount of movement from that point, and then the lowering of the arm 41 is stopped. In addition, the control unit 8 determines that both the tip portions 32 of the two probes 12 are not in contact with the solder bumps 102 when the arm 41 is lowered by a predetermined movement amount from the start of the probing process. Sometimes, the lowering of the arm 41 is stopped.

  Here, as shown in FIG. 4, in the probing process, a vertical line passing through the center of the hemispherical solder bump 102 (hereinafter also referred to as “vertical line L1 of the solder bump 102”) and two probes in the probe unit 3 are used. When the center line between 12 coincides with the center line (hereinafter also referred to as “center line L2 of the probe unit 3”), both the tip portions 32 of the probes 12 in the probe unit 3 are in contact with the solder bumps 102. Subsequently, when the arm 41 is further lowered, as shown in FIG. 5, the thin portion 33 so that the distal end portion 32 of the probe 12 is separated from the distal end portion 32 of the other probe 12 facing (that is, outward). It is elastically deformed using as a fulcrum. For this reason, as a result of the tip part 32 pressing the solder bump 102 by the elastic force accompanying the elastic deformation, the tip part 32 and the solder bump 102 are electrically connected reliably.

  Next, when the arm 41 is further lowered, as shown in FIG. 6, each distal end portion 32 of each probe 12 is further elastically deformed outward with the thin portion 33 as a fulcrum. In this case, when the amount of elastic deformation of the distal end portion 32 reaches a specified amount, the distal end portion 32 comes into contact with the second restricting member 24 of the support portion 11 as shown in FIG. For this reason, as a result of restricting further elastic deformation and restricting the separation beyond the specified distance between the tip portions 32, a situation in which the contact state between the tip portion 32 and the solder bump 102 is released is avoided.

  On the other hand, as shown in FIG. 7, in the probing process, the vertical line L1 of the solder bump 102 and the center line L2 of the probe unit 3 do not match (in this example, the center line L2 is on the left side of the vertical line L1). ), The tip 32 of one probe 12 (in this example, the right probe 12) in the probe unit 3 comes into contact with the solder bump 102 first. When the arm 41 is further lowered in this state, as shown in FIG. 8, the distal end portion 32 of the probe 12 is elastically deformed outward with the thin portion 33 as a fulcrum, and the other probe 12 (in this example, the left side) The tip 32 of the probe 12) contacts the solder bump 102. Thereby, both the tip portions 32 of the probes 12 are surely brought into contact with the solder bumps 102.

  Subsequently, the control unit 8 controls the measurement unit 5 to execute measurement processing. In this measurement process, the measurement unit 5 measures the resistance value between the conductor patterns 101 connected to the solder bumps 102 by a four-terminal method. Specifically, the measurement unit 5 outputs a measurement signal (for example, a constant current). At this time, measurement signals are supplied to the two solder bumps 102 (two conductor patterns 101) via one probe 12 in the two probe units 3. Next, the measurement unit 5 inputs an electric signal (for example, voltage) generated along with the supply of the measurement signal via the other probe 12 in the two probe units 3, and the voltage value and the current value of the measurement signal are Based on the above, the resistance value between the conductor patterns 101 is measured.

  Subsequently, the control unit 8 inspects the quality of the insulation state between the conductor patterns 101. Specifically, the control unit 8 reads the reference value from the storage unit 7 and compares the reference value with the resistance value (measured value) measured by the measuring unit 5. In this case, the control unit 8 determines that the insulation state between the conductor patterns 101 is good when the measured value is greater than or equal to the reference value, and the insulation state between the conductor patterns 101 is poor when the measured value is less than the reference value. Is determined. In this case, in the inspection apparatus 1, as described above, since each probe 12 of the probe unit 3 is in reliable contact with each solder bump 102, the measurement of the resistance value by the measurement unit 5 is accurately performed. It is possible to accurately inspect the quality of the insulation state between the conductor patterns 101.

  Next, the control unit 8 controls the probing mechanism 4 to move (raise) each arm 41 in a direction (upward) away from the substrate 100. Subsequently, the control unit 8 executes each of the above-described processes to cause each solder bump 102 to probe each probe 12 and inspects the quality of the insulation state between the other conductor patterns 101.

  In this case, in the probing process, for example, as shown in FIG. 9, the vertical line L1 of the solder bump 102 and the center line L2 of the probe unit 3 are relatively far apart (in this example, with respect to the vertical line L1). When the center line L2 is located on the left side), the tip 32 of one probe 12 (in this example, the right probe 12) in the probe unit 3 contacts the solder bump 102 and the other probe 12 (this In the example, the thin probe 33 may be elastically deformed in the direction approaching the tip 32 of the left probe 12) (that is, inward) with the thin portion 33 as a fulcrum. In this case, when the amount of elastic deformation of the distal end portion 32 reaches a specified amount, the distal end portion 32 comes into contact with the first regulating member 23 of the support portion 11 as shown in FIG. For this reason, further elastic deformation is restricted, and contact between the tip portions 32 is prevented. For this reason, in this inspection apparatus 1, the state of insulation between the conductor patterns 101 is performed by the control unit 8 in a state in which the tip portions 32 are in contact with each other, and thereby it is ensured that an erroneous pass / fail judgment is made. Is prevented.

  Thus, in the probe unit 3 and the inspection apparatus 1, the thin portion 33 is formed between the proximal end portion 31 and the distal end portion 32 of the probe 12, and the distal end portion 32 extends from the distal end portion 32 of the other probe 12. The probe 12 is configured to be deformable with the thin portion 33 as a fulcrum so as to be separated (that is, outward). In this case, since the tip portion 32 is difficult to deform in the probe in which the thin portion 33 is not formed, for example, when probing the solder bump 102 as the probing target formed in a hemispherical shape, When the vertical line L1 passing through the center of the bump 102 and the center line L2 between the probes 12 in the probe unit 3 do not coincide with each other, only one end portion 32 of the pair of probes 12 in the probe unit 3 is solder bump. There is a case where the descent stops while the other probe 12 is in a non-contact state in contact with 102 and the inspection cannot be performed. On the other hand, in the probe unit 3 and the inspection apparatus 1, even when the vertical line L1 of the solder bump 102 and the center line L2 of the probe unit 3 do not coincide with each other, the probe 12 that contacts the solder bump 102 first. The probe unit 3 is lowered until the tip 32 of the other probe 12 comes into contact with the solder bump 102 while the tip 32 of the probe 12 is elastically deformed using the thin portion 33 as a fulcrum. Both can be brought into contact with the solder bumps 102. Therefore, according to the probe unit 3 and the inspection apparatus 1, the pair of probes 12 in the probe unit 3 can be reliably brought into contact with the solder bumps 102 to be probed.

  Further, according to the probe unit 3 and the inspection apparatus 1, the first restricting member 23 that restricts the deformation of the probe 12 beyond a predetermined deformation amount in the direction in which the distal end portions 32 approach each other is provided. Contact between the tip portions 32 can be reliably prevented. For this reason, according to this probe unit 3 and the inspection apparatus 1, the control part 8 inspects the insulation state between the conductor patterns 101 in a state in which the tip portions 32 are in contact with each other, thereby making an incorrect quality determination. Can be reliably prevented.

  Further, according to the probe unit 3 and the inspection apparatus 1, the second restricting member 24 that restricts the deformation of the probe 12 beyond a predetermined deformation amount in the direction in which the tip portions 32 are separated from each other is provided. The separation beyond the predetermined distance between the front end portions 32 can be surely limited. For this reason, according to the probe unit 3 and the inspection apparatus 1, the pressing force from the distal end portion 32 against the solder bump 102 decreases as the distal end portions 32 of the probes 12 are separated from each other by a predetermined distance or more. As a result, it is possible to reliably avoid a situation in which the electrical connection between the tip 32 and the solder bump 102 is insufficient.

  The probe unit and the inspection apparatus are not limited to the above configuration. For example, although an example in which the probe 12 formed in the shape of a quadrangular prism as a whole has been described above, the shape of the probe 12 is not limited to this, and as a whole, the cross section is a polygonal shape other than a square, It can also be formed into an elliptical columnar shape. Moreover, the probe formed in plate shape as a whole is also employable. Also, a probe unit that does not include either the first restriction member 23 or the second restriction member 24 or the first restriction member 23 and the second restriction member 24 may be employed.

  In addition, the example using the support portion 11 formed of an insulating material has been described above. For example, when the base end portion 31 of the probe 12 is covered with an insulating material (for example, resin), a metal or the like is used. A support portion formed using a conductive material can also be used.

DESCRIPTION OF SYMBOLS 1 Inspection apparatus 3 Probe unit 5 Measuring part 8 Control part 11 Support part 12 Probe 22 Fixing part 23 1st control member 24 2nd control member 31 Base end part 32 Tip part 33 Thin part 100 Board | substrate 101 Conductive pattern 102 Solder bump

Claims (4)

A probe unit configured such that the base ends of a pair of probes arranged in parallel are connected in an insulated state so that the tip of each probe can be simultaneously contacted with one probing target,
The probe is formed such that a thin portion thinner than the other portion of the probe is formed between the base end portion and the tip end portion, and the tip end portion is separated from the tip end portion of the other probe. A probe unit configured to be deformable with the thin portion as a fulcrum.   The probe unit according to claim 1, further comprising a first restricting member that restricts deformation of the probe by a predetermined amount or more in a direction in which the tip portions approach each other.   3. The probe unit according to claim 1, further comprising a second restricting member that restricts deformation of the probe by a predetermined amount or more in a direction in which the tip portions are separated from each other.   The substrate is inspected based on the probe unit according to any one of claims 1 to 3 and an electric signal input through each probe of the probe unit brought into contact with a conductor portion of the substrate as the probing target. An inspection device comprising an inspection unit.

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