JP4833011B2 - Socket for electrical parts - Google Patents

Description

The present invention relates to an electrical component socket for testing / inspecting electrical components such as a semiconductor integrated circuit formed on a silicon wafer.

  A WLBI (Wafer Level Burn-In) method is known as an inspection method for removing initial defects of electrical components typified by a semiconductor integrated circuit (hereinafter referred to as “IC”) and ensuring reliability. It has been. In the WLBI method, an IC is driven by applying a load such as temperature, and a process of selecting defective products (burn-in screening) in a short time is performed simultaneously on all IC chips formed on a wafer (silicon wafer). Is the method. In the WLBI method, a large number of conductive contact pins are arranged, and the surface of the IC chip is accommodated in a disk-shaped socket in which the ends of the contact pins protrude from the surface. Conduct a current through the pin and inspect the conductive state of all pad electrodes.

FIG. 8 shows a conventional structure. As shown in the figure, conventionally, the contact pin 31 disposed on the circuit board 30 is formed by winding a conductive and elastic wire in a coil shape, and the winding density is increased at one end side in the axial direction of the winding diameter. A tightly wound portion 32 is formed, and a spring portion 33 is formed on the other end side, with the winding density being sparse. The tightly wound portion 32 of the contact pin 31 is inserted into the arrangement hole 34 of the circuit board 30 and electrically connected to a circuit conductor 35 provided from the lower surface portion of the circuit board 30 to the inner peripheral surface of the arrangement hole 34. Yes. Further, the upper end of the spring portion 33 of the contact pin 31 is formed in an abutting portion 36 that comes into contact with and electrically connects to a pad electrode 38 of an electrical component 37 such as an IC chip (for example, see Patent Document 1).
JP 2003-100375 A

  However, according to the contact pin 31 described in Patent Document 1, the contact portion 36 exists at a position separated from the shaft 39 with respect to the winding diameter of the contact pin 31, and thus is formed around the position of the shaft 39. The contact position is likely to shift with respect to the pad electrode 38. When the electrical component 37 is a minute circuit such as an IC, the pad electrodes 38 are arranged at a minute pitch of about 0.5 mm to 0.8 mm, and this pitch is the winding diameter of the contact pin 31. If smaller than that, there is a problem that a contact failure is likely to occur between the electrical component 37 and the contact portion 36 due to a contact position shift.

  Further, according to the contact pin 31 described in the above-mentioned Patent Document 1, the contact portion 36 exists almost on the diameter of the spring portion 33 having a large winding diameter, and the spring constant is small. When the electric component 37 is pressed, the end of the contact pin 31 is greatly elastically deformed to increase the contact area of the abutting portion 36, and the abutting portion 36 is easily in contact with a portion other than the pad electrode 38 on the electric component 37. . For this reason, when the pad electrode 38 is depressed more than the surrounding part on the electric component 37, the contact part 36 of the contact pin 31 contacts parts other than the pad electrode 38, and the contact part 36 is a pad. There is a problem that it is likely to be separated from the electrode 38.

Therefore, the present invention has been made in view of the above points, and avoids contact failure caused by unevenness on the surface of the electrical component or contact position deviation, and an electrical device provided with a contact pin that accurately contacts a desired position. It is an object to provide a socket for parts.

In order to solve such a problem, according to the first aspect of the present invention, an arrangement hole is formed in a socket main body portion that accommodates an electric component, and the arrangement hole is interposed between two electric components. A socket for an electrical component provided with a contact pin for electrically connecting the two electrical components, wherein the contact pin is formed by winding a conductive wire in a spiral shape to form a main body. The tip of at least one end of the main body is formed with an abutting portion that is located on the axis of the main body and abuts on the electric component, and no pressing force is applied by the electric component. In this state, a tightly wound portion is provided so as to protrude from the inside of one end portion side of the arrangement hole to the outside of the opening portion, and is closer to the distal end portion than the tightly wound portion toward the distal end portion. A reduced diameter portion having the abutting portion that is reduced in diameter is formed, The reduced diameter portion is a socket for electrical parts formed in a loose winding in which the wires do not adhere to each other .

The invention according to claim 2, in addition to the configuration of claim 1, wherein the contact portion is characterized in that inclined obliquely in the axial direction of the main body portion.

According to a third aspect of the present invention, in addition to the configuration according to the first or second aspect , both ends of the main body are reduced in diameter toward the tip, respectively, and the contact is applied to both the tips. A contact portion is formed.

According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, the contact portion is formed on a peripheral portion of an unpolished end surface obtained by cutting the wire. Features.

According to a fifth aspect of the present invention, in addition to the configuration of the first aspect, the tip of the at least one end is bent at the end of the final winding to form the bent at the tip of the bent. A contact portion is formed.

The invention according to claim 6, in addition to the configuration according to any one of claims 1 to 5, a plurality of the distribution設孔to the socket body for accommodating the electrical components is formed,該配set The contact pins are disposed in the holes, respectively .

According to a seventh aspect of the invention, in addition to the configuration of the sixth aspect , the contact pin includes a small diameter portion and a large diameter portion that is larger in diameter than the small diameter portion. A step portion is formed at a boundary with the diameter portion, and the disposition hole has a large diameter hole portion into which the large diameter portion is inserted and a small diameter hole portion into which the small diameter portion is inserted, A retaining step portion with which the step portion of the contact pin abuts is formed at a boundary between the diameter hole portion and the small diameter hole portion.

  According to the first aspect of the present invention, the contact portion formed at the tip end portion of the contact pin contacts the electrical component at the axial position of the main body portion, so that the axial position of the main body portion serves as a reference for positioning. Positioning of the contact position between the pin and the electric component is facilitated, contact failure can be avoided, and contact with the desired position can be accurately performed.

According to the first aspect of the present invention, since the end portion of the main body wound in a spiral shape is formed with a reduced diameter portion toward the tip portion, the spring of the reduced diameter portion is formed. Since the constant increases, the elastic deformation of the main body in the vicinity of the contact portion is reduced, the contact area between the contact portion and the electrical component is reduced, and the contact position can be positioned with high accuracy.
Further, according to the first aspect of the present invention, the reduced diameter portion is formed in a loose winding in which the wires are not in close contact with each other, so that a high spring constant and elasticity are provided in the vicinity of the tip portion of the contact pin. A high urging force can be applied to the nearby electrical component, and the contact state with the electrical component can be stabilized.
In addition, according to the first aspect of the present invention, in a state in which no pressing force is applied by the electric component, it protrudes from the inside on the one end side of the arrangement hole to the outside of the opening. By providing the tightly wound portion, unevenness on the outer peripheral surface of the tightly wound portion is reduced. As a result, when the contact pin is disposed in the disposition hole formed in the socket for electrical parts or the like, the contact pin is disposed in a state in which a portion having a high winding density is in contact with the opening of the disposition hole. Since it is possible to prevent the expansion and contraction from being hindered by being caught in the opening of the arrangement hole, the contact pin can be smoothly expanded and contracted by the pressing force. In addition, since the density of the wire forming the contact pin increases, the rigidity increases, and when the contact pin is inserted into the mounting hole, the contact pin is prevented from being elastically deformed unnecessarily due to frictional resistance inside the mounting hole. It is possible to easily perform the process of inserting the contact pin into the arrangement hole.

According to the second aspect of the present invention, the contact area between the contact portion and the electrical component can be reduced by inclining the contact portion obliquely from the axial direction of the body portion. Thereby, even when the terminals of the electrical component are small and a plurality of terminals are densely packed, the contact portion can be brought into contact with only the desired terminal accurately, and problems such as poor contact can be avoided more reliably. .

According to the third aspect of the present invention, the two contact portions connected to both ends of the contact pin are formed by the contact portions formed at both tip portions of the contact pin contacting the electrical component at the axial position of the main body portion. It is possible to avoid problems of contact failure and contact position deviation in contact with a component.

According to the fourth aspect of the present invention, the contact portion of the contact pin is formed by the peripheral portion of the unpolished end face obtained by cutting the wire, so that the wire is cut when the contact pin main body is formed. The surface can be used as a contact portion as it is. For this reason, the special process of the wire end part for forming a contact part becomes unnecessary, and the manufacturing process of a contact pin can be simplified.

According to the fifth aspect of the present invention, since the final winding portion is bent to form the bent portion at the tip portion of at least one end portion, and the contact portion is formed at the tip of the bent portion, the final portion is simply the final portion. Since it is only necessary to bend the winding part, it is easy to mold and the positional accuracy of the contact part can be improved.

According to the invention described in claim 6, by respectively disposing a plurality of contact pins to the electrical components for multiple distribution設孔formed in the socket, in each of the contact pins, the electrical components are contacted It is possible to avoid the problem of contact failure and contact position shift and to easily perform the manufacturing.

According to the seventh aspect of the present invention, if at least a part of the outer periphery of the contact pin is in close contact with at least a part of the disposition hole, the disposition hole is provided if the contact pin is disposed in the disposition hole. Friction resistance acts on the contact part between the contact pin and the contact pin. For this reason, the contact pin does not rattle or fall off, and the contact pin mounting accuracy can be increased. Further, a retaining step portion is provided that forms a locking portion by providing an enlarged portion in the vicinity of one tip portion of the contact pin, and locks the enlarged portion to the inner peripheral portion of the arrangement hole. By being provided, the contact pin is locked to the arrangement hole only by inserting the contact pin to a predetermined portion of the arrangement hole, and the axial position within the arrangement hole is determined. For this reason, when the contact pin is pressed by the electrical component, it is prevented from being displaced in the axial direction inside the arrangement hole. Therefore, after the contact pin is arranged in the arrangement hole, adhesion or soldering is performed. This eliminates the necessity and simplifies the manufacturing process.

Embodiment 1 of the Invention

  Embodiment 1 of the present invention will be described below with reference to FIGS.

  FIG. 1 is an enlarged front sectional view of a part of the IC socket according to the first embodiment.

  First, the configuration will be described. Reference numeral 20 shown in FIG. 1 is an IC socket as an “electrical component socket”. This IC socket 20 is used for performing a performance test of the IC chip group 21 as an “electrical component”. This IC chip group 21 and the electrode 22a provided on the surface of the wiring board 22 of the measuring instrument (tester) are electrically connected.

  The IC chip group 21 is an aggregate of ICs formed on a disk-shaped silicon wafer by printing or the like. The substrate is partitioned into a grid pattern, and the same circuit is formed for each rectangular unit partitioned. A pattern is formed. On the surface of each circuit pattern on the IC chip group 21, a pad electrode 21a, which is a minute electrode for conducting current inside the circuit, is provided.

  The IC socket 20 is composed of a socket body 20a and contact pins 1, and one contact pin 1 is disposed in each of a plurality of placement holes 27 carved in the socket body 20a.

  Specifically, the substantially cylindrical arrangement holes 27 carved in the socket main body portion 20a of the IC socket 20 each have an approximately diameter on the upper side (the upper side shown in FIG. 1; the same applies in this specification). It has a small-diameter hole portion 27a of about 0.41 millimeters and a large-diameter hole portion 27b of about 0.53 millimeters in diameter on the lower side (the lower side shown in FIG. 1; the same applies in this specification). A retaining step portion 28 is formed at the boundary between the small diameter hole portion 27a and the large diameter hole portion 27b.

  The upper surface of the socket main body 20a is formed in a disc-shaped accommodation portion 23 having an outer diameter substantially the same as or larger than the outer diameter of the IC chip group 21. The accommodation portion 23 has a plurality of accommodation portion side openings 24 formed through the upper end of the arrangement hole 27. The accommodating portion side opening 24 has a circular shape of about 0.41 mm and the same diameter as the small diameter hole portion 27a. On the other hand, the lower surface of the socket main body portion 20 a is formed on the back surface portion 25 having an outer diameter substantially the same as the surface of the wiring board 22. In the back surface portion 25, the lower end of the arrangement hole 27 penetrates and a plurality of back surface side opening portions 26 are formed. The back side opening 26 is a 0.53 mm circle having the same diameter as the large diameter hole 27b.

  FIG. 2 is a front view of the contact pin 1 of this embodiment. The contact pin 1 is formed of a wire material having a thickness of about 0.1 mm made of a material having conductivity and high rigidity such as aluminum. The main body 2 of the contact pin 1 is formed by spirally winding a wire cut to a predetermined length, and the total length is about 4 millimeters. In addition, the end surface 3 and the end surface 4 which are left unpolished at the both ends of the main body 2 are formed at one end side and the other end of the wire forming the main body 2.

  The main body 2 has a small-diameter portion 8a and a large-diameter portion 8b having a larger diameter than the small-diameter portion 8a formed adjacent to the small-diameter portion 8a.

  More specifically, the small diameter portion 8a is formed from one end (upper end in FIG. 2) side of the main body 2 to the vicinity of the other end (lower end in FIG. 2) side. The outer diameter of the small diameter portion 8a is about 0.41 millimeters which is substantially equal to the diameter of the small diameter hole portion 27a of the arrangement hole 27. The large diameter portion 8 b is formed on the other end side of the main body portion 2. The outer diameter of the large diameter portion 8b is about 0.53 millimeters which is substantially equal to the diameter of the large diameter hole portion 27b of the disposition hole 27. The large diameter portion 8b is provided as a portion having a high winding density that is wound in a state where adjacent wire rods are in contact with each other. The boundary between the small diameter portion 8 a and the large diameter portion 8 b is formed in the step portion 9 that is locked to the retaining step portion 28 inside the arrangement hole 27.

  In the small-diameter portion 8a, the central portion 5a from the vicinity of one end portion to the boundary with the large-diameter portion 8b is wound with a winding density such that the interval between adjacent windings is approximately the same as the thickness of the wire.

  In the small-diameter portion 8b, on the one end portion side, about 4 windings of the closely wound portion 5b wound with a higher winding density than the central portion 5a are provided. In this close winding part 5b, it winds in the state which adjacent wire rods contacted.

  About two turns on the one end side further than the tightly wound portion 5b are formed in the reduced diameter portion 6 that decreases in diameter toward the tip end portion. The reduced diameter portion 6 has a spring constant higher than that of the central portion 5a of the main body portion 2 due to the reduced diameter.

  FIG. 3 is a left side view of the contact pin 1 of this embodiment. As shown in the figure, at one end of the main body 2, the end surface 3 of the wire is directed obliquely with respect to the direction of the axis 12 of the main body 2. The tip end portion located on the one end side is formed in the contact portion 7 that contacts the pad electrode 21a (FIG. 1) of the IC chip group 21. The abutting portion 7 is provided on the shaft 12 of the main body portion 2. The contact portion 7 is a part of the peripheral edge portion of the unpolished end surface 3 obtained by cutting the wire. That is, the cut surface of the wire rod when forming the main body portion 2 of the contact pin 1 is used as the contact portion 7 as it is. Therefore, special processing of the end portion of the wire for forming the contact portion 7 is unnecessary.

  Returning to FIG. 2, approximately three turns on the other end side of the large diameter portion 8 b of the main body portion 2 are formed in the reduced diameter portion 10 that is reduced in diameter toward the distal end portion. The reduced diameter portion 10 has a spring constant higher than that of the central portion 5a of the main body portion 2 due to the reduced diameter.

  FIG. 4 is a right side view of the contact pin 1 of this embodiment. As shown in the figure, at the other end of the main body 2, the end face 4 of the wire is oriented obliquely with respect to the direction of the axis 12 of the main body 2. The tip portion on the other end side located outside is formed in the contact portion 11 that contacts the electrode 22a (FIG. 1) of the wiring board 22. The abutting portion 11 is provided on the shaft 12 of the main body portion 2. The contact portion 11 is a part of the peripheral portion of the unpolished end surface 4 obtained by cutting the wire, and the cut surface of the wire when forming the main body portion 2 of the contact pin 1 is used as the contact portion 11 as it is. Therefore, special processing of the end portion of the wire for forming the contact portion 11 is not necessary.

  Next, the operation of this embodiment will be described.

  The IC socket 20 is inserted into the arrangement hole 27 from the back surface portion 25 side with one end of the contact pin 1 as the head. The step 9 of the contact pin 1 is brought into contact with and locked to the retaining step 28 of the arrangement hole 27. In this state, one end of the contact pin 1 protrudes from the accommodating portion side opening 24 to the tightly wound portion 5b, and the other end of the contact pin 1 protrudes from the back surface side opening 26 to the vicinity of the contact portion 11.

  The small diameter portion 8a of the contact pin 1 and the small diameter hole portion 27a of the arrangement hole 27 have substantially the same diameter, and the large diameter portion 8b of the contact pin 1 and the large diameter hole portion 27b of the arrangement hole 27 have substantially the same diameter. Because of the diameter, the parts having the same diameter are in close contact with each other, and frictional resistance acts on the intimate part, so that the contact pin 1 does not rattle or fall off. Further, when the step 9 of the contact pin 1 is locked to the retaining step 28 of the arrangement hole 27, the position in the axis 12 direction within the arrangement hole 27 of the contact pin 1 is determined.

  In a state where the contact pin 1 is disposed in the disposition hole 27, the wiring board 22 of the measuring instrument is disposed on the back surface portion 25 of the IC socket 20, and the electrode 22 a of the wiring substrate 22 projects from the back surface side opening portion 26. The contact portion 11 of the contact pin 1 is contacted. On the other hand, the IC chip group 21 is accommodated in the accommodating portion 23 of the IC socket 20, and the pad electrode 21 a of the IC chip group 21 is brought into contact with the abutting portion 7 of the contact pin 1 protruding from the accommodating portion side opening 24. When a pressing force is applied from the IC chip group 21 and the wiring board 22 to the IC socket 20 side, the pressing force is transmitted to the contact portion 7 and the contact portion 11 of the contact pin 1.

  FIG. 5 shows a partially enlarged front sectional view of the IC socket 20 of this embodiment in a state where a pressing force is applied by the IC chip group 21 and the wiring board 22. As shown in the figure, the contact pin 1 contracts toward the center in the direction of the axis 12.

  Here, the contact pin 1 is provided with a reduced diameter portion 6 and a reduced diameter portion 10 at both ends, and the reduced diameter portion 6 and the reduced diameter portion 10 are formed in a loose winding in which the wires are not in close contact with each other. Since the portion 6 and the reduced diameter portion 10 have a high spring constant and elasticity, the urging force of the contact pin 1 against the IC chip group 21 and the wiring board 22 is increased. Therefore, the contact failure between the contact pin 1 and the IC chip group 21 and the contact failure between the contact pin 1 and the wiring board 22 due to insufficient urging force can be avoided.

  Moreover, since the spring constants of the reduced diameter portion 6 and the reduced diameter portion 10 are high, elastic deformation at both ends of the contact pin 1 is reduced. Accordingly, the contact area between the contact portion 1 of the contact pin 1 and the IC chip group 21 and the contact area between the contact portion 11 of the contact pin 1 and the wiring substrate 22 are reduced, and the IC chip group 21 and the wiring substrate are reduced. Contact failure due to the irregularities on the surface of the contact 22 can be avoided, and the contact portion 7 and the contact portion 11 of the contact pin 1 can be brought into contact with the desired pad electrode 21a or electrode 22a.

  Further, the end face 3 and the end face 4 of the wire are oriented obliquely with respect to the direction of the axis 12 of the main body 2, and the abutment located on the outermost part in the axis 12 direction of the peripheral edge of the end face 3 and end face 4. The part 7 and the contact part 11 are in contact with the pad electrode 21a and the electrode 22a (FIGS. 1 and 5), respectively. That is, the contact area between the contact part 7 and the contact part 11 and the pad electrode 21a and the electrode 22a can be further reduced by inclining the contact part obliquely with respect to the direction of the axis 12 of the main body part 2. Thus, even when the pad electrode 21a and the electrode 22a are small and densely packed, the contact portion 7 and the contact portion 11 can be accurately brought into contact only with the desired pad electrode 21a and electrode 22a. it can.

  Further, the contact portion 7 at the tip end portion on one end side of the contact pin 1 and the contact portion 11 at the tip end portion on the other end side are located on the shaft 12 of the main body portion 2 of the contact pin 1. Positioning of the contact position between the contact pin 1 and the pad electrode 21a and positioning of the contact position between the contact pin 1 and the electrode 22a by contacting the pad electrode 21a of the chip group 21 and the electrode 22a of the wiring board 22 It becomes easy to do. As a result, the contact position can be positioned with high accuracy, and contact failure due to the position shift of the contact position between the contact pin 1 and the pad electrode 21a and the contact position between the contact pin 1 and the electrode 22a is prevented. The problem can be avoided.

  Further, in a state where the IC chip group 21 does not apply a pressing force, the tightly wound portion 5b of the contact pin 1 is in contact with the accommodating portion side opening 24 of the socket main body portion 20a. Since there are less irregularities on the outer peripheral surface than the portion 5a, when the contact pin 1 expands and contracts in the direction of the axis 12, the outer periphery of the contact pin 1 is prevented from being caught by the accommodating portion side opening 24 and hindering expansion and contraction. it can. Further, since the tightly wound portion 5b and the large diameter portion 8b have high rigidity because the density of the wire forming the main body portion 2 is increased, the contact pin 1 is inserted when the contact pin 1 is inserted into the arrangement hole 27. It is possible to prevent the main body 2 from being elastically deformed unnecessarily due to frictional resistance or the like inside the arrangement hole 27 and making it difficult to insert, and the process of inserting the contact pin 1 into the arrangement hole 27 can be easily performed. it can.

When the measuring instrument is energized in such a state, a current is conducted from the electrode 22a of the wiring board 22 to the pad electrode 21a of the IC chip group 21 via the contact pin 1, and the conductivity test of the IC chip group 21 can be performed. .
[Embodiment 2 of the Invention]

  6 and 7 show a second embodiment of the present invention.

  The contact pin 51 according to the second embodiment is different from the first embodiment in that the reduced diameter portions 6 and 10 as in the first embodiment are not formed.

  Specifically, in the contact pin 51, the main body portion 52 has a normal winding portion 53 and a tightly wound portion 54, and the end portion of the end portion of the main body portion 52 is bent by the final winding portion 55. And a contact portion 57 is formed at the tip of the bent portion 56.

  The bent portion 56 is bent so as to be lifted obliquely upward by 45 ° at the last approximately 0.5 to 0.75 turns of the final winding portion 55. Thus, the contact portion 57 is positioned on the shaft 58 of the main body portion 52.

  In such a case, since the final winding portion 55 is bent to form the bending portion 56 and the contact portion 57 is formed at the tip of the bending portion 56, it is only necessary to bend the final winding portion 55. Therefore, it is easy to mold and the positional accuracy of the contact portion 57 can be improved.

  In addition, although this bending part 56 is formed in the last about 0.5-0.75 winding part of the last winding part 55, it is not limited to this and a bending angle is also limited to 45 degrees. However, by adjusting them, the abutment portion 57 can be easily positioned on the shaft 58 of the main body portion 52, and the length and the bending angle of the bent portion 56 are adjusted. The displacement amount and elastic force of the contact portion 57 can be adjusted.

  Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.

  In the above embodiment, the contact pins 1 and 51 and the IC socket 20 are used for conducting a conductivity test on the IC chip group 21. However, the present invention is not limited to this. It is also possible to apply to a conductive test of the IC chip (for example, an IC chip formed on a rectangular wafer cut from a disk-shaped silicon wafer).

  It goes without saying that the embodiment described above exemplifies one embodiment of the present invention and does not indicate that the present invention is limited to the above embodiment.

It is front sectional drawing which expanded a part of IC socket of Embodiment 1 of this invention. It is a front view of the contact pin of the first embodiment. It is a left view of the contact pin of the first embodiment. It is a right view of the contact pin of the first embodiment. It is front sectional drawing which expanded a part in the state in which the pressing force was applied by the electrical component of the IC socket of the first embodiment. It is a figure which shows the contact pin of Embodiment 2 of this invention, (a) is a top view, (b) is a front view, (c) is a left view. It is a perspective view which shows the contact pin of the same Embodiment 2. It is front sectional drawing to which some conventional contact pins and the socket for electrical components which arrange | positioned this contact pin were expanded.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,51 ... Contact pin 2,52 ... Main-body part 3 ... End surface 4 ... End surface 5b ... Close-contact winding part 6 ... Reduced diameter part 7 ... Contact part 8a ...・ Small diameter part 8b ... large diameter part 9 ... step part 10 ... reduced diameter part 11 ... contact part 12 ... shaft 20 ... IC socket (socket for electrical parts)
20a: Socket body 21: IC chip group (electrical parts)
22 ... Wiring board (electrical parts)
DESCRIPTION OF SYMBOLS 23 ... Accommodating part 27 ... Arrangement hole 27a ... Small diameter hole part 27b ... Large diameter hole part 28 ... Stopping step part 30 ... Circuit board (electrical component)
31 ... Contact pin 32 ... Close winding part 34 ... Disposition hole 36 ... Contact part 37 ... Electrical component 39 ... Shaft 55 ... Final winding part 56 ... Bending Part 57 ... contact part 58 ... axis

Claims (7)

An arrangement hole is formed in the socket main body portion that accommodates the electric component, and a contact pin that is interposed between the two electric components to electrically connect the two electric components is arranged in the arrangement hole. A socket for electrical parts ,
The contact pin is
A conductive wire is spirally wound to form a main body, and the tip of at least one end of the main body is positioned on the axis of the main body and contacts the electrical component. A contact portion is formed ,
In a state where no pressing force is applied by the electrical component, a tightly wound portion is provided so as to protrude from the inside of one end side of the arrangement hole to the outside of the opening,
A reduced-diameter portion having the abutting portion that is reduced in diameter toward the distal end portion is formed closer to the distal end portion than the tightly wound portion,
The reduced diameter portion is formed in a loose winding in which the wires do not adhere to each other,
A socket for electrical parts characterized by the above. The electrical component socket according to claim 1, wherein the contact portion is inclined obliquely from an axial direction of the main body portion. 3. The electrical component according to claim 1, wherein both end portions of the main body portion are reduced in diameter toward the distal end portion, and the abutting portions are formed at both the distal end portions, respectively. Socket. 4. The electrical component socket according to claim 1, wherein the contact portion is formed on a peripheral portion of an unpolished end surface obtained by cutting the wire. 5. 2. The electricity according to claim 1, wherein a tip end portion of the at least one end portion is bent to form a bent portion, and the contact portion is formed at a tip end of the bent portion. Socket for parts. 6. The socket main body portion that accommodates the electrical component is formed with a plurality of arrangement holes, and the contact pins are arranged in the arrangement holes, respectively. Socket for electrical parts as described in 1. The contact pin has a small-diameter portion and a large-diameter portion that is larger in diameter than the small-diameter portion, and a step portion is formed at a boundary between the small-diameter portion and the large-diameter portion, and the arrangement hole is The step portion of the contact pin has a large-diameter hole portion into which the large-diameter portion is inserted and a small-diameter hole portion into which the small-diameter portion is inserted, and at the boundary between the large-diameter hole portion and the small-diameter hole portion The electrical component socket according to claim 6, wherein a retaining step portion on which the abutment contacts is formed.

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