JP2023096615A - Electrical connection device - Google Patents

Electrical connection device Download PDF

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JP2023096615A
JP2023096615A JP2021212495A JP2021212495A JP2023096615A JP 2023096615 A JP2023096615 A JP 2023096615A JP 2021212495 A JP2021212495 A JP 2021212495A JP 2021212495 A JP2021212495 A JP 2021212495A JP 2023096615 A JP2023096615 A JP 2023096615A
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circuit pattern
main surface
electrical connection
connection device
support substrate
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智昭 久我
Tomoaki Kuga
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Micronics Japan Co Ltd
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Micronics Japan Co Ltd
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Priority to JP2021212495A priority Critical patent/JP2023096615A/en
Priority to TW111142818A priority patent/TWI828410B/en
Priority to CN202211511041.8A priority patent/CN116359555A/en
Publication of JP2023096615A publication Critical patent/JP2023096615A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

To provide an electrical connection device that is able to prevent contact failure between an electrode terminal of an object being inspected and a circuit pattern.SOLUTION: An electrical connection device includes a rigid insulating support substrate and a rigid conductive circuit pattern. The support substrate has a first main surface and a second main surface facing each other, and a first side surface and a second side surface extending from the first main surface to the second main surface and facing each other. The circuit pattern is disposed on the first main surface. The circuit pattern extends from a first side of the support substrate, on which the first main surface and the first side surface are connected, toward a second side of the support substrate, on which the first main surface and the second side surface are connected.SELECTED DRAWING: Figure 1

Description

本発明は、被検査体の特性の検査に使用される電気的接続装置に関する。 The present invention relates to an electrical connection device used for inspecting characteristics of a device under test.

液晶パネルなどの被検査体の電気的特性の検査に、被検査体に配置された電極端子と検査装置とを電気的に接続する回路パターンを有する電気的接続装置が使用されている。被検査体の電気的特性の検査では、電気的接続装置の回路パターンを介して、被検査体とテスタなどの検査装置の間で電気信号が送信される。検査では、電気的接続装置の回路パターンの一方の端部が被検査体に配置された電極端子が接触し、回路パターンの他方の端部が検査装置と電気的に接続する。被検査体の複数の電極端子の配列に対応させて、電気的接続装置に複数の回路パターンが配置されている。 2. Description of the Related Art An electrical connection device having a circuit pattern for electrically connecting electrode terminals arranged on an object to be inspected and an inspection device is used to inspect electrical characteristics of an object to be inspected such as a liquid crystal panel. In testing the electrical characteristics of a device under test, electrical signals are transmitted between the device under test and an inspection device such as a tester via circuit patterns of an electrical connection device. In the inspection, one end of the circuit pattern of the electrical connection device is brought into contact with the electrode terminal arranged on the device under test, and the other end of the circuit pattern is electrically connected to the inspection device. A plurality of circuit patterns are arranged on the electrical connection device in correspondence with the arrangement of the plurality of electrode terminals of the device under test.

特許第２８４６８５１号公報Japanese Patent No. 2846851

樹脂フィルムに形成した導電性リードを回路パターンとする電気的接続装置が使用されている。異物の混入などにより樹脂フィルムは撓みやすいため、回路パターンと被検査体の電極端子の接触不良が生じる問題がある。 2. Description of the Related Art An electrical connection device is used in which conductive leads formed on a resin film are used as a circuit pattern. Since the resin film is likely to bend due to contamination with foreign matter, etc., there is a problem of poor contact between the circuit pattern and the electrode terminals of the device under test.

上記問題点に鑑み、本発明は、被検査体の電極端子と回路パターンの接触不良を抑制できる電気的接続装置を提供することを目的とする。 SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an electrical connection device capable of suppressing poor contact between electrode terminals of a device under test and a circuit pattern.

本発明の一態様によれば、剛体の絶縁性の支持基板と剛体の導電性の回路パターンを備える電気的接続装置が提供される。支持基板は、相互に対向する第１主面と第２主面、および第１主面から第２主面にそれぞれ向かう相互に対向する第１側面と第２側面を有する。回路パターンは、第１主面に配置されている。回路パターンは、第１主面と第１側面が接続する支持基板の第１辺から、第１主面と第２側面が接続する支持基板の第２辺に向かって延伸する。 SUMMARY OF THE INVENTION In accordance with one aspect of the present invention, an electrical connection device is provided that includes a rigid insulating support substrate and a rigid conductive circuit pattern. The supporting substrate has a first main surface and a second main surface facing each other, and first side surfaces and second side surfaces facing each other from the first main surface to the second main surface. The circuit pattern is arranged on the first main surface. The circuit pattern extends from the first side of the support substrate where the first main surface and the first side surface are connected to the second side of the support substrate where the first main surface and the second side surface are connected.

本発明によれば、被検査体の電極端子と回路パターンの接触不良を抑制できる電気的接続装置を提供できる。 According to the present invention, it is possible to provide an electrical connection device capable of suppressing poor contact between the electrode terminals of the device under test and the circuit pattern.

図１は、実施形態に係る電気的接続装置の構成を示す模式的な正面図である。FIG. 1 is a schematic front view showing the configuration of an electrical connection device according to an embodiment. 図２は、実施形態に係る電気的接続装置の構成を示す模式的な側面図である。FIG. 2 is a schematic side view showing the configuration of the electrical connection device according to the embodiment. 図３は、実施形態に係る電気的接続装置の構成を示す模式的な上面図である。FIG. 3 is a schematic top view showing the configuration of the electrical connection device according to the embodiment. 図４は、回路パターンの構成の例を示す模式的な断面図である。FIG. 4 is a schematic cross-sectional view showing an example of the configuration of a circuit pattern. 図５Ａは、実施形態に係る電気的接続装置の製造方法を説明するための模式的な正面図である（その１）。FIG. 5A is a schematic front view for explaining the method of manufacturing the electrical connection device according to the embodiment (No. 1); 図５Ｂは、実施形態に係る電気的接続装置の製造方法を説明するための模式的な側面図である（その１）。FIG. 5B is a schematic side view for explaining the method for manufacturing the electrical connection device according to the embodiment (No. 1); 図６Ａは、実施形態に係る電気的接続装置の製造方法を説明するための模式的な正面図である（その２）。FIG. 6A is a schematic front view for explaining the method of manufacturing the electrical connection device according to the embodiment (No. 2); 図６Ｂは、実施形態に係る電気的接続装置の製造方法を説明するための模式的な側面図である（その２）。FIG. 6B is a schematic side view for explaining the method of manufacturing the electrical connection device according to the embodiment (No. 2); 図７Ａは、実施形態に係る電気的接続装置の製造方法を説明するための模式的な正面図である（その３）。7A is a schematic front view for explaining the method of manufacturing the electrical connection device according to the embodiment (No. 3); FIG. 図７Ｂは、実施形態に係る電気的接続装置の製造方法を説明するための模式的な側面図である（その３）。7B is a schematic side view for explaining the method of manufacturing the electrical connection device according to the embodiment (No. 3); FIG. 図８は、実施形態に係る電気的接続装置を用いた検査の例を示す模式的な正面図である。FIG. 8 is a schematic front view showing an example of inspection using the electrical connection device according to the embodiment. 図９は、実施形態に係る電気的接続装置を用いた検査の例を示す模式的な側面図である。FIG. 9 is a schematic side view showing an example of inspection using the electrical connection device according to the embodiment. 図１０は、実施形態に係る電気的接続装置の回路パターンと配線基板との接続状態の例を示す模式図である。FIG. 10 is a schematic diagram showing an example of a connection state between the circuit pattern and the wiring board of the electrical connection device according to the embodiment. 図１１は、実施形態に係る電気的接続装置の回路パターンと配線基板との接続状態の他の例を示す模式図である。FIG. 11 is a schematic diagram showing another example of the connection state between the circuit pattern and the wiring board of the electrical connection device according to the embodiment.

次に、図面を参照して、本発明の実施形態を説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号を付している。ただし、図面は模式的なものであり、各部の長さや厚みの比率などは現実のものとは異なる。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれている。 Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and the length and thickness ratio of each part are different from the actual ones. In addition, there are portions with different dimensional relationships and ratios between the drawings.

図１に示す本発明の実施形態に係る電気的接続装置１は、被検査体の電気的な特性の検査に使用される。電気的接続装置１は、剛体の絶縁性の支持基板１０と、支持基板１０に配置された回路パターン２０を備える。ここで、「剛体」は、被検査体の電気的な特性の検査において電気的接続装置１を被検査体に接触させた場合に、撓みや歪みが略生じない程度の硬度を有する。 An electrical connection device 1 according to an embodiment of the present invention shown in FIG. 1 is used for inspecting electrical characteristics of a device under test. The electrical connection device 1 includes a rigid insulating support substrate 10 and a circuit pattern 20 arranged on the support substrate 10 . Here, the "rigid body" has a degree of hardness that does not substantially cause bending or distortion when the electrical connecting device 1 is brought into contact with the device under test for testing the electrical characteristics of the device under test.

図１に示すように、支持基板１０の厚さ方向をＺ方向とする。図１において、Ｚ方向は紙面の上下方向であり、Ｘ方向は紙面の左右方向、Ｙ方向は紙面の奥行方向である。図１は、Ｙ方向から見た電気的接続装置１の正面図である。図２は、Ｘ方向から見た電気的接続装置１の側面図である。図３は、電気的接続装置１をＺ方向から見た上面図である。 As shown in FIG. 1, the thickness direction of the support substrate 10 is defined as the Z direction. In FIG. 1, the Z direction is the vertical direction of the paper, the X direction is the horizontal direction of the paper, and the Y direction is the depth direction of the paper. FIG. 1 is a front view of the electrical connection device 1 viewed from the Y direction. FIG. 2 is a side view of the electrical connecting device 1 viewed from the X direction. FIG. 3 is a top view of the electrical connection device 1 as seen from the Z direction.

支持基板１０は絶縁性の基板である。支持基板１０は、相互に対向する第１主面１１と第２主面１２、および、第１主面１１から第２主面１２にそれぞれ向かう相互に対向する第１側面１３と第２側面１４を有する。支持基板１０は剛体の基板であり、例えば、支持基板１０は絶縁性セラミックスの基板である。 The support substrate 10 is an insulating substrate. The support substrate 10 has a first main surface 11 and a second main surface 12 facing each other, and a first side surface 13 and a second side surface 14 facing each other from the first main surface 11 to the second main surface 12, respectively. have The support substrate 10 is a rigid substrate, and for example, the support substrate 10 is an insulating ceramics substrate.

図２に示すように、第１側面１３と第１主面１１とのなす角が鋭角であり、第１側面１３と第２主面１２とのなす角が鈍角である。更に、第２側面１４と第１主面１１とのなす角が鋭角であり、第２側面１４と第２主面１２とのなす角が鈍角である。言い換えると、支持基板１０は、Ｘ方向から見て、第１主面１１および第２主面１２に対して第１側面１３と第２側面１４が斜めに配置されたテーパー形状である。なお、図１に示すように、第１側面１３と第２側面１４を除いた他の側面は、第１主面１１および第２主面１２とのなす角が直角であってもよい。 As shown in FIG. 2, the angle between the first side surface 13 and the first main surface 11 is an acute angle, and the angle between the first side surface 13 and the second main surface 12 is an obtuse angle. Furthermore, the angle formed by the second side surface 14 and the first main surface 11 is an acute angle, and the angle formed by the second side surface 14 and the second main surface 12 is an obtuse angle. In other words, the support substrate 10 has a tapered shape in which the first side surface 13 and the second side surface 14 are obliquely arranged with respect to the first main surface 11 and the second main surface 12 when viewed from the X direction. In addition, as shown in FIG. 1, the angles formed by the first main surface 11 and the second main surface 12 may be right angles on the other side surfaces except for the first side surface 13 and the second side surface 14 .

回路パターン２０は、支持基板１０の第１主面１１に配置されている。回路パターン２０は、支持基板１０の第１辺１５から支持基板の第２辺１６に向かって延伸する。支持基板１０の第１辺１５は、第１主面１１と第１側面１３が接続する辺である。支持基板１０の第２辺１６は、第１主面１１と第２側面１４が接続する辺である。回路パターン２０は導電性を有しかつ剛体である。回路パターン２０の材料は、支持基板１０と同程度の硬度を有する材料である。例えば、回路パターン２０は導電性セラミックスからなる。 The circuit pattern 20 is arranged on the first main surface 11 of the support substrate 10 . The circuit pattern 20 extends from the first side 15 of the support substrate 10 toward the second side 16 of the support substrate. A first side 15 of the support substrate 10 is a side where the first main surface 11 and the first side surface 13 are connected. A second side 16 of the support substrate 10 is a side where the first main surface 11 and the second side surface 14 are connected. The circuit pattern 20 is conductive and rigid. The material of the circuit pattern 20 is a material having hardness comparable to that of the support substrate 10 . For example, the circuit pattern 20 is made of conductive ceramics.

なお、図１に示す電気的接続装置１では、支持基板１０の第１主面１１が、回路パターン２０が配置された領域（以下、「配置領域」とも称する。）が凸部の凹凸形状である。第１主面１１の配置領域に隣接し、回路パターン２０が配置されていない領域（以下、「分離領域」とも称する。）は、第２主面１２に向かって後退している凹部である。 In the electrical connecting device 1 shown in FIG. 1, the first main surface 11 of the support substrate 10 has an area in which the circuit pattern 20 is arranged (hereinafter, also referred to as "arrangement area") has a convex and concave shape. be. A region adjacent to the arrangement region of the first main surface 11 and in which the circuit pattern 20 is not arranged (hereinafter also referred to as “separation region”) is a recess recessed toward the second main surface 12 .

図４に示すように、回路パターン２０の表面に、回路パターン２０の材料よりも導電性の高い被覆材２５を形成してもよい。被覆材２５は、例えば金属材などである。回路パターン２０の表面に被覆材２５を形成することにより、回路パターン２０を伝搬する電気信号に対する電気抵抗を下げることができる。なお、被覆材２５がなくても回路パターン２０の電気抵抗が被検査体の検査が可能な値であれば、回路パターン２０の表面に被覆材２５を形成しなくてもよい。被覆材２５を形成しないことにより、電気的接続装置１の製造コストの低下や製造期間の短縮を実現できる。 As shown in FIG. 4, the surface of the circuit pattern 20 may be coated with a coating material 25 having a higher conductivity than the material of the circuit pattern 20 . The coating material 25 is, for example, a metal material. By forming the coating material 25 on the surface of the circuit pattern 20, the electrical resistance to the electrical signal propagating through the circuit pattern 20 can be lowered. If the electrical resistance of the circuit pattern 20 is a value that allows the test object to be inspected without the coating material 25, the coating material 25 may not be formed on the surface of the circuit pattern 20. FIG. By not forming the covering material 25, the manufacturing cost of the electrical connecting device 1 can be reduced and the manufacturing period can be shortened.

被検査体の検査では、支持基板１０の第１辺１５に配置された回路パターン２０の第１端部２１が、被検査体に配置された電極端子に接触する。支持基板１０の第２辺１６に配置された回路パターン２０の第２端部２２は、テスタなどの検査装置と電気的に接続する。図３に示すように、回路パターン２０は、支持基板１０の第１辺１５から第２辺１６に向かって延伸するストライプ状パターンを含む。したがって、図１に示す正面図において、回路パターン２０は櫛歯状である。 In the inspection of the device under test, the first end portion 21 of the circuit pattern 20 arranged on the first side 15 of the support substrate 10 contacts the electrode terminal arranged on the device under test. A second end 22 of the circuit pattern 20 arranged on the second side 16 of the support substrate 10 is electrically connected to an inspection device such as a tester. As shown in FIG. 3 , the circuit pattern 20 includes a striped pattern extending from the first side 15 toward the second side 16 of the support substrate 10 . Therefore, in the front view shown in FIG. 1, the circuit pattern 20 has a comb shape.

図３に示すように、支持基板１０の第１辺１５および第２辺１６において、支持基板１０の回路パターン２０と積層した配置領域の端面が、支持基板１０の回路パターン２０と積層されていない分離領域よりも外側に延在している。回路パターンが樹脂フィルムの場合では、１つの回路パターンが被測定体の電極端子の凹凸に追従することにより、その回路パターンの周りの回路パターンが、凹凸に追従した回路パターンに引っ張られて変形してしまう。その結果、回路パターンと電極端子のコンタクト不良が生じる。電気的接続装置１によれば、特定の第１端部２１と電極端子との接触状態が、その他の第１端部２１と電極端子の接触状態に影響しない為、上記の回路パターンと電極端子のコンタクト不良の発生を抑制できる。 As shown in FIG. 3 , on the first side 15 and the second side 16 of the supporting substrate 10 , the end faces of the arrangement regions laminated with the circuit pattern 20 of the supporting substrate 10 are not laminated with the circuit pattern 20 of the supporting substrate 10 . It extends outside the isolation region. In the case where the circuit pattern is a resin film, one circuit pattern follows the unevenness of the electrode terminal of the object to be measured, so that the circuit pattern around that circuit pattern is pulled and deformed by the circuit pattern following the unevenness. end up As a result, contact failure occurs between the circuit pattern and the electrode terminals. According to the electrical connection device 1, since the contact state between a specific first end portion 21 and an electrode terminal does not affect the contact state between other first end portions 21 and an electrode terminal, the circuit pattern and the electrode terminal contact failure can be suppressed.

被検査体に配列された複数の電極端子の位置に対応させて、複数の回路パターン２０の第１端部２１が第１辺１５に固定して配列されている。例えば、第１辺１５における回路パターン２０の第１端部２１の間隔は、被検査体の電極端子の間隔に対応している。被検査体の電極端子が等ピッチで配置されている場合、回路パターン２０の第１端部２１も同様に等ピッチで配置される。 The first ends 21 of the plurality of circuit patterns 20 are fixed and arranged on the first side 15 so as to correspond to the positions of the plurality of electrode terminals arranged on the device under test. For example, the interval between the first ends 21 of the circuit pattern 20 on the first side 15 corresponds to the interval between the electrode terminals of the device under test. When the electrode terminals of the device under test are arranged at equal pitches, the first end portions 21 of the circuit pattern 20 are also arranged at equal pitches.

以下に、図面を参照して図１～図３に示した電気的接続装置１の製造方法を説明する。なお、以下に述べる電気的接続装置１の製造方法は一例であり、この変形例を含めて、これ以外の種々の製造方法により電気的接続装置１が製造可能であることはもちろんである。以下の説明で、図５Ａ～図７Ａは正面図、図５Ｂ～図７Ｂは側面図である。 A method of manufacturing the electrical connection device 1 shown in FIGS. 1 to 3 will be described below with reference to the drawings. The method of manufacturing the electrical connection device 1 described below is merely an example, and it goes without saying that the electrical connection device 1 can be manufactured by various other manufacturing methods, including modifications. In the following description, FIGS. 5A-7A are front views and FIGS. 5B-7B are side views.

まず、図５Ａおよび図５Ｂに示すように、Ｘ方向から見てテーパー形状に加工された支持基板１０の第１主面１１に、導電性の剛体の回路パターン基板２００を接合する。例えば、支持基板１０は絶縁性セラミックスの基板であり、回路パターン基板２００は導電性セラミックスの基板である。例えば拡散接合により、支持基板１０と回路パターン基板２００を接合する。 First, as shown in FIGS. 5A and 5B, a conductive rigid circuit pattern board 200 is bonded to the first main surface 11 of the supporting board 10 which is tapered when viewed in the X direction. For example, the support substrate 10 is an insulating ceramics substrate, and the circuit pattern substrate 200 is a conductive ceramics substrate. For example, the support substrate 10 and the circuit pattern substrate 200 are bonded by diffusion bonding.

次いで、図６Ａおよび図６Ｂに示すように、回路パターン基板２００を加工して所定の回路パターン２０を形成する。例えば、ダイサーまたはレーザーによる切断加工により、回路パターン基板２００を複数の回路パターン２０に分割する。 Next, as shown in FIGS. 6A and 6B, the circuit pattern board 200 is processed to form a predetermined circuit pattern 20. FIG. For example, the circuit pattern board 200 is divided into a plurality of circuit patterns 20 by cutting with a dicer or laser.

回路パターン基板２００の切断加工では、隣接する回路パターン２０が電気的に接続しないように、支持基板１０の第１主面１１に達するまで回路パターン基板２００を分割して、回路パターン２０を形成する。例えば図６Ａに示すように、回路パターン２０を形成した配置領域に挟まれた第１主面１１の分離領域の上部を削除してもよい。つまり、第１主面１１は、配置領域が凸部であり分離領域が凹部である凹凸形状であってもよい。 In the cutting process of the circuit pattern board 200, the circuit pattern board 200 is divided until the first main surface 11 of the supporting board 10 is reached to form the circuit patterns 20 so that the adjacent circuit patterns 20 are not electrically connected. . For example, as shown in FIG. 6A, the upper portion of the isolation region of the first main surface 11 sandwiched between the placement regions in which the circuit pattern 20 is formed may be removed. That is, the first main surface 11 may have an uneven shape in which the arrangement region is a convex portion and the isolation region is a concave portion.

その後、図７Ａおよび図７Ｂに示すように、回路パターン２０の表面に被覆材２５を形成してもよい。被覆材２５は、例えば硬質金、パラジウム合金、ロジウムなどである。回路パターン基板２００が導電性セラミックスである場合、導電性セラミックスは金属よりも導電率が劣る。このため、被覆材２５を回路パターン２０の表面に形成することによって、回路パターン２０を伝搬する電気信号に対する電気抵抗を下げてもよい。 After that, as shown in FIGS. 7A and 7B, a covering material 25 may be formed on the surface of the circuit pattern 20 . The covering material 25 is, for example, hard gold, palladium alloy, rhodium, or the like. If the circuit pattern board 200 is made of conductive ceramics, conductive ceramics are inferior in conductivity to metals. Therefore, the electrical resistance to electrical signals propagating through the circuit pattern 20 may be reduced by forming the coating material 25 on the surface of the circuit pattern 20 .

以上により、図１～図３に示した電気的接続装置１が完成する。 Thus, the electrical connection device 1 shown in FIGS. 1 to 3 is completed.

図８および図９に、電極端子１０１が主面に配置された被検査体１００の検査に電気的接続装置１を使用した例を示す。電気的接続装置１は、支持基板１０を被検査体１００に対して一定の角度で保持するプローブブロック３０を有する。プローブブロック３０は、第１主面１１が被検査体１００の主面に対して一定の角度をなして斜めに配置されるように、支持基板１０を保持する。被検査体１００の主面に対して支持基板１０の第１主面１１が斜めに配置されることにより、複数の回路パターン２０の第１端部２１が被検査体１００の複数の電極端子１０１のそれぞれと接続する。 FIGS. 8 and 9 show an example of using the electrical connection device 1 for inspection of a device under test 100 having electrode terminals 101 arranged on its main surface. The electrical connection device 1 has a probe block 30 that holds the support substrate 10 at a certain angle with respect to the device under test 100 . The probe block 30 holds the support substrate 10 so that the first main surface 11 is obliquely arranged at a certain angle with respect to the main surface of the device under test 100 . By arranging the first main surface 11 of the support substrate 10 obliquely with respect to the main surface of the device under test 100 , the first ends 21 of the plurality of circuit patterns 20 are aligned with the plurality of electrode terminals 101 of the device under test 100 . connect to each of the

支持基板１０がテーパー形状であるため、Ｚ方向から回路パターン２０の第１端部２１が被検査体１００の電極端子１０１と接続する状態を容易に観察できる。したがって、電気的接続装置１によれば、回路パターン２０と被検査体１００を確実に位置合わせすることができる。 Since the support substrate 10 has a tapered shape, it is possible to easily observe the state in which the first end portion 21 of the circuit pattern 20 is connected to the electrode terminal 101 of the device under test 100 from the Z direction. Therefore, according to the electrical connection device 1, the circuit pattern 20 and the device under test 100 can be reliably aligned.

図９に示すように、回路パターン２０の第２端部２２は、プローブブロック３０に配置された配線基板４０の接続端子４１に接続する。図９は、検査装置５０がプローブブロック３０に配置された例を示す。検査装置５０は、配線基板４０に配置されている。検査装置５０は、配線基板４０の回路配線（図示略）を介して接続端子４１と電気的に接続する。検査装置５０は、配線基板４０および回路パターン２０を介して、被検査体１００の電極端子１０１との間で電気信号を送受信する。 As shown in FIG. 9 , the second end 22 of the circuit pattern 20 is connected to the connection terminal 41 of the wiring board 40 arranged on the probe block 30 . FIG. 9 shows an example in which the inspection device 50 is arranged in the probe block 30. As shown in FIG. The inspection device 50 is arranged on the wiring board 40 . The inspection device 50 is electrically connected to the connection terminals 41 via circuit wiring (not shown) of the wiring board 40 . The inspection apparatus 50 transmits and receives electrical signals to and from the electrode terminals 101 of the device under test 100 via the wiring board 40 and the circuit pattern 20 .

上記では、検査装置５０がプローブブロック３０に配置された例を示した。しかし、電気的接続装置１の外部に配置した検査装置と回路パターン２０とを配線などによって接続してもよい。 An example in which the inspection device 50 is arranged in the probe block 30 has been described above. However, the inspection device arranged outside the electrical connection device 1 and the circuit pattern 20 may be connected by wiring or the like.

なお、図９に示すように、支持基板１０の第２側面１４と配線基板４０の接続端子４１を配置した主面とが略平行になるように、支持基板１０のテーパー形状を設定してもよい。第２側面１４と接続端子４１を配置した主面とを略平行にすることにより、プローブブロック３０の配線基板４０を配置した面と第２辺１６との間隔を狭くできる。その結果、配線基板４０の厚みを薄くするなどして、電気的接続装置１を小型化できる。 As shown in FIG. 9, the tapered shape of the support substrate 10 may be set such that the second side surface 14 of the support substrate 10 and the main surface of the wiring substrate 40 on which the connection terminals 41 are arranged are substantially parallel to each other. good. By making the second side surface 14 and the main surface on which the connection terminals 41 are arranged substantially parallel, the distance between the surface of the probe block 30 on which the wiring board 40 is arranged and the second side 16 can be narrowed. As a result, the electrical connecting device 1 can be miniaturized by reducing the thickness of the wiring board 40, for example.

第２端部２２と接続端子４１の接点部形状は、プローブブロック３０に対する支持基板１０の取り付け角度などに応じて、第２端部２２と接続端子４１が接触しやすいように適宜設定することができる。 The shape of the contact portion between the second end portion 22 and the connection terminal 41 can be appropriately set according to the mounting angle of the support substrate 10 with respect to the probe block 30 so that the second end portion 22 and the connection terminal 41 are easily brought into contact with each other. can.

例えば、図１０に示すように、支持基板１０と同様に回路パターン２０をテーパー形状に加工して、支持基板１０よりも外側に張り出した回路パターン２０の端部を配線基板４０の回路配線と接触させてもよい。図１０に示した回路パターン２０の端部のテーパー角と支持基板１０のテーパー角は略同じである。或いは、図１１に示すように、回路パターン２０の端部が露出するように支持基板１０の端部を後退させ、支持基板１０の端部と回路パターン２０の端部を階段状に形成してもよい。 For example, as shown in FIG. 10, the circuit pattern 20 is tapered in the same manner as the support substrate 10, and the end portion of the circuit pattern 20 protruding outside the support substrate 10 is brought into contact with the circuit wiring of the wiring substrate 40. You may let The taper angle of the end portion of the circuit pattern 20 shown in FIG. 10 and the taper angle of the support substrate 10 are substantially the same. Alternatively, as shown in FIG. 11, the end of the support substrate 10 is retracted so that the end of the circuit pattern 20 is exposed, and the end of the support substrate 10 and the end of the circuit pattern 20 are formed stepwise. good too.

以上に説明したように、電気的接続装置１は、剛体の支持基板１０の第１主面１１に剛体の回路パターン２０を配置した構成を有する。支持基板１０および回路パターン２０が剛体である電気的接続装置１では、回路パターン２０の撓みが抑制される。したがって、電気的接続装置１によれば、被検査体１００の電極端子１０１と回路パターン２０の接触不良を抑制できる。例えば、支持基板１０が撓むことにより回路パターン２０の一部が電極端子１０１と接触不良になることを防止できる。 As described above, the electrical connection device 1 has a configuration in which the rigid circuit pattern 20 is arranged on the first main surface 11 of the rigid support substrate 10 . In the electrical connection device 1 in which the support substrate 10 and the circuit pattern 20 are rigid bodies, the bending of the circuit pattern 20 is suppressed. Therefore, according to the electrical connection device 1, it is possible to suppress poor contact between the electrode terminal 101 of the device under test 100 and the circuit pattern 20. FIG. For example, it is possible to prevent a portion of the circuit pattern 20 from becoming in poor contact with the electrode terminal 101 due to the bending of the support substrate 10 .

（その他の実施形態）
上記のように本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。 (Other embodiments)
Although the present invention has been described by way of embodiments as described above, the discussion and drawings forming part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, implementations and operational techniques will become apparent to those skilled in the art from this disclosure.

例えば、上記では複数の回路パターン２０が第１辺１５から第２辺１６まで平行に延伸するストライプ状パターンである例を示した。しかし、回路パターン２０のストライプ状パターンの相互の間隔が、第１辺１５から第２辺１６に向かうにしたがって次第に広がるようにしてもよい。或いは、回路パターン２０がストライプ状以外の形状であってもよい。 For example, in the above example, the plurality of circuit patterns 20 are striped patterns extending in parallel from the first side 15 to the second side 16 . However, the distance between the striped patterns of the circuit pattern 20 may gradually widen from the first side 15 toward the second side 16 . Alternatively, the circuit pattern 20 may have a shape other than the stripe shape.

このように、本発明はここでは記載していない様々な実施形態などを含むことはもちろんである。したがって、本発明の技術的範囲は上記の説明から妥当な特許請求の範囲に係る発明特定事項によってのみ定められるものである。 Thus, the present invention naturally includes various embodiments and the like not described here. Therefore, the technical scope of the present invention is defined only by the matters specifying the invention according to the valid scope of claims based on the above description.

１…電気的接続装置
１０…支持基板
１１…第１主面
１２…第２主面
１３…第１側面
１４…第２側面
１５…第１辺
１６…第２辺
２０…回路パターン
２１…第１端部
２２…第２端部
２５…被覆材
３０…プローブブロック
４０…配線基板
５０…検査装置
２００…回路パターン基板 DESCRIPTION OF SYMBOLS 1... Electrical connection apparatus 10... Support substrate 11... First main surface 12... Second main surface 13... First side surface 14... Second side surface 15... First side 16... Second side 20... Circuit pattern 21... First side End 22 Second end 25 Coating material 30 Probe block 40 Wiring board 50 Inspection device 200 Circuit pattern board

Claims (10)

被検査体の検査に使用される電気的接続装置であって、
相互に対向する第１主面と第２主面、および前記第１主面から前記第２主面にそれぞれ向かう相互に対向する第１側面と第２側面を有する剛体の絶縁性の支持基板と、
前記第１主面に配置され、前記第１主面と前記第１側面が接続する前記支持基板の第１辺から前記第１主面と前記第２側面が接続する前記支持基板の第２辺に向かって延伸する剛体の導電性の回路パターンと
を備える電気的接続装置。 An electrical connection device used for inspection of an object to be inspected,
a rigid insulating support substrate having first and second major surfaces facing each other, and first and second side surfaces facing each other from said first main surface to said second main surface, respectively; ,
The first side of the supporting substrate, which is arranged on the first main surface and connects the first main surface and the first side surface, to the second side of the supporting substrate, which connects the first main surface and the second side surface. An electrical connection device comprising: a rigid electrically conductive circuit pattern extending toward a; 前記被検査体に配列された複数の電極端子の位置に対応させて、複数の前記回路パターンの第１端部が前記第１辺に配列されている、請求項１に記載の電気的接続装置。 2. The electrical connecting device according to claim 1, wherein the first ends of the plurality of circuit patterns are arranged on the first side in correspondence with the positions of the plurality of electrode terminals arranged on the device under test. . 前記複数の第１端部が前記複数の電極端子のそれぞれと接続するように、前記支持基板を前記被検査体に対して所定の角度で保持するプローブブロックを更に備える、請求項２に記載の電気的接続装置。 3. The probe block according to claim 2, further comprising a probe block holding said support substrate at a predetermined angle with respect to said device under test so that said plurality of first ends are connected to each of said plurality of electrode terminals. Electrical connection device. 前記プローブブロックに配置され、前記第２辺において前記回路パターンの第２端部と電気的に接続する接続端子を有する配線基板を更に備える、請求項３に記載の電気的接続装置。 4. The electrical connection device according to claim 3, further comprising a wiring board arranged on said probe block and having a connection terminal electrically connected to said second end of said circuit pattern on said second side. 前記支持基板の前記第１主面が、前記回路パターンが配置された配置領域が凸部、前記配置領域に隣接する分離領域が凹部の凹凸形状である、請求項１乃至４のいずれか１項に記載の電気的接続装置。 5. The first main surface of the support substrate has an uneven shape in which an arrangement region in which the circuit pattern is arranged is a convex portion and an isolation region adjacent to the arrangement region is a concave portion. The electrical connection device according to . 前記回路パターンが、前記第１辺から前記第２辺に向かって延伸するストライプ状パターンを含む、請求項１乃至５のいずれか１項に記載の電気的接続装置。 6. The electrical connecting device according to claim 1, wherein said circuit pattern includes a striped pattern extending from said first side toward said second side. 前記回路パターンの表面に、前記回路パターンよりも導電性の高い被覆材が形成されている、請求項１乃至６のいずれか１項に記載の電気的接続装置。 7. The electrical connecting device according to any one of claims 1 to 6, wherein a coating material having higher conductivity than said circuit pattern is formed on the surface of said circuit pattern. 前記支持基板が絶縁性セラミックスの基板である請求項１乃至７のいずれか１項に記載の電気的接続装置。 8. The electrical connecting device according to any one of claims 1 to 7, wherein said supporting substrate is a substrate of insulating ceramics. 前記回路パターンが導電性セラミックスからなる請求項１乃至８のいずれか１項に記載の電気的接続装置。 9. The electrical connecting device according to any one of claims 1 to 8, wherein said circuit pattern is made of conductive ceramics. 前記第１側面と前記第１主面とのなす角が鋭角であり、前記第１側面と前記第２主面とのなす角が鈍角である、請求項１乃至９のいずれか１項に記載の電気的接続装置。 10. The angle formed by the first side surface and the first principal surface is an acute angle, and the angle formed by the first side surface and the second principal surface is an obtuse angle according to any one of claims 1 to 9. electrical connection device.
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