1303315 九、發明說明： 【發明所屬之技術領域】 本發明係與探針卡有關，特別是指一種用以傳遞高頻 訊號的懸臂式探針卡。 【先前技術】 請參閱第一圖所示習用之懸臂式探針卡1，包括有一電 路板10、複數個同軸傳輸線n、一探針座12及複數個探 針13 ’電路板10上靠近外圍處設有多個機台銲點101用以 接收電測機台所送出的測觀號，藉由同軸傳輸線n電性 連接測試雜針13,因㈣細試峨至麟13上以對積 體電路晶圓執行晶圓級峨讀；其巾探針座12具有一接 地面121、一座體122及多數個固定件123，接地面121電 ίΆ通至雜針卡丨上的接地電位，該錄針υ設於探針 15 20 座12上，分別藉由各固定件123固定各探針13之身部， =各探針於針尖130至固定件123之間的前端i3i部位 探針Ί2下方’因此提供為各探針υ闕待測電子 =時’承文來自針尖13〇反作用力的彈性緩衝力臂，各 二斜/曰3之末端132則設於電路板10下方靠近中心處的各 板針銲點1〇2上。 v 士 面12=ίΓ傳輸線11外圈具有—導電金屬111與接地 :可維持各同軸傳輪線11高頻訊號傳輪的 尚=，但貫際上各同軸傳輸線η至積體電路晶圓之間 針13結構，且各探針13僅為—導電金屬，其外 層並無類似同軸傳輸線u之結構處理，故同軸傳輸線 4 1303315 的兩，訊麟輸錢針u時，探針D關介電環境的寄 士電容效賴會造成冑頻_雜的介電損耗，因此失去 高頻電測的可靠性。 縱便有如第 ，所不為經改良之一懸臂式探針卡2，以 具有同軸傳輸線特性之各同軸探針2〇結構取代上述探針 13之單一導電金屬結構，並將探針座12之座體122以具有 導電性的金屬材質所製成；其中，各同轴探針20以-金屬 針21為軸芯，並區分為前、後端2(U、202部位，前端2〇1 位於固定件123至針尖之間，後端2〇2位於固定件⑵至 電路板1〇之間，金屬針21之後端202周圍包覆一層介電 材料22 ’介電材料22之外層包覆-導電金屬23，導電金 屬23並與金屬材f之賴m相接並電性連駐 2 土的接地電位，使各同軸探針2〇於後端2。2部位可以維 持面頻訊賴細雜阻抗，但 15 施部位制以承受來自針尖反作用力的彈n ^ 其周圍所需之緩衝活動 ^龍ΐΐί 2增加同軸傳輸線之設置結構，於 "，匕復有與座體122相接設的外層導電全屬，故古 於各同轴探針2。之後端2。2部^ 容易使探針20周圍介電環境的寄生電容效 應足成回頻訊號傳輸的介電損耗。 =探針卡如何能以最有效的訊號傳輸結構，維持高 傳輸的特性阻抗實為現今探針卡製造者所面臨的一 5 20 1303315 【發明内容】 因此丨本，明之主要目的乃在於提供一種高頻懸臂式 探針卡，係以高品質的訊號傳輸結構傳送高頻電測訊號， 5並有效應用於晶圓級電測工程。 為達成前揭目的，本發明所提供一種高頻懸臂式探針 卡係具有一電路板、一接地座、複數個訊號探針及至少—接 地探針，該電路板設置有多數個訊號線，各該訊號線電性 連接該訊號探針，該些訊號線可用以傳輸測試機台輸出之 10電測訊號至各該訊號探針，該接地座為具導電性之金屬材 質所製成，電性連接該電路板的接地電位；各該訊號探針 及接地探針皆為具導電性的金屬材質所製成，各該^地探 針電性連接該接地座，各該訊號探針及接地探針具有一連 接邛、一針尖及一前臂，該前臂為自該連接部向該針尖延 I5伸之部位，各該訊號探針及接地探針之連接部固設於該電 路板上，各該訊號探針之前臂懸設於該接地座上並與該接 地座維持有特定之間距。 當各該訊號探針及接地探針點觸晶圓上的積體電路 時，針尖受到正向應力之作用下仍然有縱向的彈性位移空 20間，使該些訊號探針及接地探針與晶圓之間有最佳的電2 接觸效果，且各該訊號探針及接地探針可獲得最適的應力 緩衝作用；尤其各該訊號探針之前臂與該接地座之間^持 有特定之間距藉以產生所需阻抗值，因此高頻訊號在各該 成號探針傳輸過程中仍然可有效維持阻抗匹配的特性，使 1303315 該探針卡具有極佳的高頻電測可靠性。 【實施方式】 以下，茲配合圖示列舉若干較佳實施例，用以對本 發明之結構與功效作詳細說明，其中所用圖示之簡要說 明如下： ^ ，二圖係本發明所提供第一較佳實施例之結構示意圖； 第四圖係上述第一較佳實施例所提供之局部結構示意 圖，顯示該探針卡中央包括該探針座、斯也座及訊號探針之I 10構剖視圖； m，ίϋϊ上述第一較佳實施例所提供之局部結構底視 蓄〜請卡巾央包括該探針座、接地座及各該探針之結 構设置； 15體圖第六關上述第—較佳實關所提供該接地座之結構立 20 圖 圖 實轭例之间頻置测頻率特性圖； ;第九_本㈣所提供第二較佳實施例之局部結構底視 。第十_本發_提供t触實施例之局雜構底視 7 1303315 括有-電路板30、-探触4Q、—接地座5Q、錄個訊號 探針60及多數個接地探針7〇，其中： 該電路板30可定義出相對之一上表面3〇1及一下表面 川2 ’该上表面301用以電氣連接至一測試機台（圖中未 5不）’该測試機台可輸出高頻電測訊號至該探針卡3，該電 路板30佈設有電子電路，包括有多數個訊號線31及接地 線32 ’配合第二圖參照，本實施例所提供之該些訊號線31 為如習用般用以傳輸高頻訊號之同軸傳輸線，係自該上表 面301延伸設置至下表面3〇2分別與各該訊號探針6〇電性 10連接，且各该讯號線31具有一圈同軸導電金屬31〇電性連 接於該電路板30之接地線32，各該接地線32則可直接或 間接與測試機台的接地電位電性連接，使各該接地線32提 供，該電路板30的接地電位，因此維持各該訊號線31傳 遞高頻電測訊號之特性阻抗。 15 凊配合第二及第四圖參照，該探針座40設於該電路板 30下表面302上，該探針座40具有一接地面41，中央設 有一凹穴42供以設置該接地座50,本實施例所提供之該探 針座4〇為具導電性的金屬材質所製成，因此其表面即形成 為該接地面41’當然該探針座40亦可為不具導電性的材質 2〇所製成，只要同樣設有具導電性的該接地面41則可發揮等 效之功用，透過與各該訊號線31之同輛導電金屬電性 連接使該接地面41作為該電路板30中各該接地線32之接 地共平面，配合第五圖參照，該探針座4〇上供以設置該些 探針60、70，各該訊號探針60並於該探針座4〇上與各該 8 l3〇33l5 成3虎線31相接設。 請配合第五及第六圖參照，該接地座5〇為具導電性的 金屬材質所製成，設於該探針座4〇之凹穴42中直接與該 接地面41電性接觸，其上設有多數個凹槽51，中央具有一 ，5通孔52，該些凹槽51環繞該通孔52而設置，各該探針6〇、 7〇即自該探針座40上延伸設置於該些凹槽51中，僅末端 φ 針尖部位凸出於該接地座50表面並置於該通孔52中，各 该凹槽51於橫向之寬度可容置特定數量之該探針6〇、7〇， 如本實施例所提供者為以單一該訊號探針6〇設於一該凹槽 1〇 51 ’並維持各該凹槽51相互間隔有特定之間距以避免各該 ，骑60之間發生不必要的電性干擾效應以及相鄰各該 探針60、70發生短路的現象。 凊配合第四及第五圖參照，各該探針6〇、7〇可區分為 一針尾61、7卜一身部62、72、一連接部63、73、一前臂 I5 64、74及一針尖65、75，各該訊號探針6〇以該針尾61電 • 性，接各該訊號線31，各該接地探針70為裸針結構，以該 身邛72電性連接該接地面41，因此得以間接獲得接地電 位二當然亦可直接以該針尾71電性連接接地電位，各該訊 號探針60之身部62為同軸結構，而於裸針外依序包覆 一介電層621、-接地層622及一保護層623,該接地層似 接該接地面41 ’因此該接地面41同樣可作為該些訊 =木針6〇中各該接地層622之接地共平面，各該探針60、 之，接部63、73固設於該探針座4〇上，各該探針6〇、 之前臂64、74延伸設置於該些凹槽51中，各該探針6〇、 9 1303315 7〇之針尖65、75凸出於該接地座50。 综合上述可知，本發明所提供之該探針卡3較之習用 更多了該接地座5G的設置，由於各該凹槽51於縱向有特 定之深度，故即使各該探針60、70之前臂64、74延伸設 5置於該些凹槽51中，仍可避免該些探針6〇、70之針尖657 75點觸晶圓上的積體電路時該些前臂斜、％因縱向位移而 與該接地座50相接觸，因此維持該些探針6〇、％之針尖 65、75受到正向應力時同樣具有縱向的彈性位移空間，$ 該些探針60、70與晶圓上的積體電路之間有最佳的電性接 1〇觸效果，且各該探針60、70可獲得最適的應力緩衝作用； 尤其當該探針卡3之電子電路電氣連接至上述測試機台， 即可藉由同軸結構之各該訊號線31及訊號探針6〇傳&高 頻電測訊號，各該訊號探針60之前臂64又設置於各該凹 槽51中，兩侧與該接地座50之間維持有特定之間距，因 15此高頻訊號在各該訊號探針傳輸過程中鄰近配合有該接 地層622及接地座50的設置，可因此有效傳遞高頻訊號使 維持阻抗匹配的特性，並防止不必要的雜訊干擾或電性耦 合效應，使該探針卡3具有極佳的高頻電測可靠性，請表 閱如第七及第八圖所示，分別為習用該懸臂式探針卡2及 20本發明所提供該探針卡3之高頻量測頻率特性圖，相較兩 圖之反射耗損（return loss)曲線sil、S11，可知，本發明 所提供之該探針卡3有極低的反射耗損，顯示於高頻段有 極佳的阻抗匹配特性，另相較兩圖之插入耗損 loss)曲線S21、S21，更顯示習用該懸臂式探針卡2於_3(18 1303315 增益之通帶（passband)限制頻率僅約有3 3 GHz， t發明所提供之該探針卡3可高至近職z，顯示：針 有較制之懸臂式探針卡2為更良好的高頻訊號傳 5 值得一提的是，本發明所提供之探針卡係以如上述之該 接地座50的電位接地特性使各該訊號探針6〇冑輸 號過程更鱗雜抗匹_雜，此只要於接地座5〇^ 維持各該訊號探針60鄰近特定之間距即有接地電位，可避 免不必要的電性干擾效應影響各該訊號探針6〇傳輸高頻訊 1〇唬，故並不限定單一該訊號探針6〇僅能設於一凹槽内，而 可如第九圖所示為本發明第二較佳實施例提供之—懸臂式探 針卡4，罙針卡4可應用於一般中、低頻段的電性測試及 少部分高頻測試需求，其中較低頻的測試訊號不限定以上 述該訊號線31及訊號探針60傳輸，更可藉由一般金屬導 15線及與該接地探針70同樣為裸針結構之低頻探針％傳 輸，差異在於該些低頻探針76不與該探針座4〇電性連接， "亥振針卡4另設有一接地座80，僅具有二第一及二第二凹 槽81、82’各該第一凹槽81與上述實施例所提供者具有相 同之結構特性，供各該訊號探針6〇設置，各該第二凹槽U 2〇則於杈向具有較寬之空間可同時設置多數個探針60、70、 76，只要將各該訊號探針6〇於橫向緊鄰有該接地座8〇或 一側皆為該接地探針7〇，同樣可達到該探針卡4傳輸高頻 汛號過程維持阻抗匹配的特性，避免各該訊號探針60受到 不必要的電性干擾而具有良好的高頻訊號傳輸品質。 11 1303315 當然本發明所提供用以傳輸高頻之訊號探 ς:轴探針之結構’若應用於—般顯示器驅動^^艮 頻差動訊號之量測，則可如第十圖所示 : 5 15 7提供之-_探針卡5，其差縣於錄 差動探針9喝增獄簡3⑻ =動傳輸線33為相鄰有特如距之雙轴心導線的 同軸導電金屬33帽繞該雙軸心導線連。探 針座4〇，各該差動探針9G具有相轉 1接= 電性連接該細_ 33，__ == 立 層9G1外更依序包覆有一 雷八於該探針座4G;因此藉由該同軸導 電至屬及5亥接地層92電性接地的特性，且各該差動探針 9古0i^rrGG設於各該凹槽51中，使該探針卡5傳遞 冋頻差動喊難中可_阻抗匹配的特性。 故舉=上本=二為及本 變化，理應包含在本發明之專^範圍=圍所為之等效結構 i3〇33i5 f圖式簡單說明】 f Γ圖係f職臂式探針卡之結構示意圖； 係另—$聰臂式探針卡之局部結構示意圖； 第第:較佳實施例之結構示意圖； 圖，顯示所提供之局雜構示意 構甸视圖，· 針座、接地座及訊號探針之結 10 15 圖，較佳纽觸提供之局部結構底視 構設置 丨卡中越括該探針座、接地座及各該探針之結 圖 第六圖係上述第-難實施觸提供該接地座之結構立 第七圖係制騎式探針卡之高頻量_ =八圖係上述第-較佳實施例之高頻率:目. 圖/九_本發明所提供第二難實施例之局7=底視 圖。第十關本發_提供第三較佳實施例之局部結構底視 13 1303315 【主要元件符號說明】 3、4、5懸臂式探針卡1303315 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a probe card, and more particularly to a cantilever probe card for transmitting a high frequency signal. [Prior Art] Please refer to the conventional cantilever probe card 1 shown in the first figure, including a circuit board 10, a plurality of coaxial transmission lines n, a probe holder 12 and a plurality of probes 13' on the circuit board 10 near the periphery A plurality of machine solder joints 101 are arranged to receive the observation number sent by the electric measuring machine, and the test pin 13 is electrically connected by the coaxial transmission line n, because (4) the test is performed on the Lin 13 to the integrated circuit. The wafer performs wafer level reading; the towel probe holder 12 has a grounding surface 121, a body 122 and a plurality of fixing members 123, and the grounding surface 121 is electrically connected to a ground potential on the pin chuck, the needle The probes are disposed on the bases 12 of the probes 15, and the respective bodies of the probes 13 are fixed by the respective fixing members 123, respectively. = the probes are below the probes 2 at the front end i3i between the needle tips 130 and the fixing members 123. Provided as an elastic buffering force arm for each probe υ阙 electron to be tested = when the text is from the tip 13 〇 reaction force, the ends 132 of each slanting/曰 3 are disposed under the board 10 near the center of each board needle Solder joints 1〇2. v 士面12=ίΓ Transmission line 11 outer ring has - conductive metal 111 and ground: can maintain the high frequency signal transmission of each coaxial transmission line 11 still =, but the coaxial transmission line η to the integrated circuit wafer The structure of the intermediate pin 13 is different, and each of the probes 13 is only a conductive metal, and the outer layer has no structure similar to that of the coaxial transmission line u. Therefore, when the coaxial transmission line 4 1303315 is used, the probe D is turned off. The environment's custodian capacitance effect will cause the 介 frequency-heterogeneous dielectric loss, thus losing the reliability of high-frequency electrical measurement. For example, the cantilevered probe card 2, which is not modified, replaces the single conductive metal structure of the probe 13 with each coaxial probe 2〇 structure having coaxial transmission line characteristics, and the probe holder 12 The base 122 is made of a conductive metal material. The coaxial probe 20 has a metal pin 21 as a core and is divided into a front end and a rear end 2 (U, 202 parts, and the front end 2〇1 is located). Between the fixing member 123 and the needle tip, the rear end 2〇2 is located between the fixing member (2) and the circuit board 1〇, and the metal needle 21 is covered with a dielectric material 22 around the rear end 202. The dielectric material 22 is coated with an outer layer. The metal 23 and the conductive metal 23 are connected to the metal material f and electrically connected to the earth potential of the earth 2, so that the coaxial probes 2 are entangled at the rear end 2. The two parts can maintain the surface frequency and the fine impedance. , but the 15 part is made to withstand the reaction from the tip of the needle n ^ The buffering activity required around it ^ Long ΐΐ 2 increase the coaxial transmission line setting structure, in the "," the outer layer connected to the seat 122 Conductive is all genus, so it is ancient to each coaxial probe 2. The rear end is 2. 2 parts ^ easy to make the probe 20 weeks The parasitic capacitance effect of the surrounding dielectric environment is sufficient for the dielectric loss of the echo signal transmission. How can the probe card transmit the structure with the most efficient signal and maintain the high transmission characteristic impedance, which is the face of today's probe card manufacturers. A 5 20 1303315 [Summary] Therefore, the main purpose of the present invention is to provide a high-frequency cantilever probe card for transmitting high-frequency electrical measurement signals with a high-quality signal transmission structure, 5 and effectively applied to the wafer level. In order to achieve the foregoing, the present invention provides a high frequency cantilever probe card having a circuit board, a grounding block, a plurality of signal probes, and at least a grounding probe, the circuit board being provided with a majority The signal lines are electrically connected to the signal probes, and the signal lines can be used to transmit the 10 electrical test signals outputted by the test machine to the signal probes, the grounding seats are made of conductive metal materials. The grounding potential is electrically connected to the circuit board; each of the signal probe and the grounding probe is made of a conductive metal material, and each of the probes is electrically connected to the grounding seat, and each of the electrodes The probe and the grounding probe have a connecting port, a tip and a forearm, and the forearm is a portion extending from the connecting portion to the tip extension I5, and the connecting portion of each of the signal probe and the grounding probe is fixed to the circuit On the board, the front end of each of the signal probes is suspended on the grounding seat and maintained at a specific distance from the grounding base. When each of the signal probes and the grounding probe touches the integrated circuit on the wafer, the needle tip Under the action of the forward stress, there are still 20 longitudinal elastic displacements, so that the signal probe and the grounding probe have the best electrical contact effect with the wafer, and each of the signal probes and the grounding probe The needle can obtain an optimal stress buffering effect; in particular, each of the signal probes has a specific distance between the front arm and the grounding seat to generate a desired impedance value, so that the high frequency signal is transmitted during each of the numbered probes. The impedance matching feature can still be effectively maintained, making the 1303315 probe card with excellent high frequency electrical reliability. [Embodiment] Hereinafter, a plurality of preferred embodiments are illustrated in conjunction with the drawings to explain the structure and function of the present invention in detail. The brief description of the drawings used is as follows: ^, the second figure is the first comparison provided by the present invention. The fourth embodiment is a schematic view of a partial structure provided by the first preferred embodiment, and shows a cross-sectional view of the probe card, including the probe holder, the seat and the signal probe; m, the partial structure of the first preferred embodiment provided by the first preferred embodiment includes the probe holder, the grounding seat and the structure of each of the probes; The structure of the grounding seat provided by Jiashiguan provides a frequency characteristic map of the frequency between the yoke and the yoke. The ninth-fourth (four) provides a partial structure bottom view of the second preferred embodiment. The tenth_本发_ provides the t-touch embodiment of the hybrid structure bottom view 7 1303315 includes - circuit board 30, - probe 4Q, - grounding seat 5Q, recording signal probe 60 and a plurality of grounding probes 7〇 Wherein: the circuit board 30 can define a relative upper surface 3〇1 and a lower surface 2' of the upper surface 301 for electrically connecting to a test machine (not shown in the figure) (the test machine can be The high frequency electrical measurement signal is outputted to the probe card 3, and the circuit board 30 is provided with an electronic circuit, including a plurality of signal lines 31 and a grounding line 32', which are provided in conjunction with the second drawing. The signal lines provided in this embodiment are provided. 31 is a coaxial transmission line for transmitting high-frequency signals, which is extended from the upper surface 301 to the lower surface 3〇2, and is respectively connected to each of the signal probes 6 and electrically connected to each of the signal lines 31. The grounding wire 32 is electrically connected to the grounding wire 32 of the circuit board 30, and the grounding wire 32 can be directly or indirectly electrically connected to the grounding potential of the testing machine, so that the grounding wire 32 is provided. The ground potential of the circuit board 30 is maintained, so that each of the signal lines 31 is maintained to transmit a high frequency electrical signal. Characteristic impedance. Referring to the second and fourth figures, the probe holder 40 is disposed on the lower surface 302 of the circuit board 30. The probe holder 40 has a grounding surface 41, and a recess 42 is provided in the center for the grounding seat. 50, the probe base 4 provided in this embodiment is made of a conductive metal material, so the surface thereof is formed as the ground plane 41'. Of course, the probe base 40 can also be a non-conductive material. The grounding surface 41 is electrically connected to the same conductive metal of each of the signal lines 31, and the grounding surface 41 is used as the circuit board. The ground planes of the grounding wires 32 of the 30 are coplanar, and the probe holders 4 are provided with the probes 60 and 70, and the signal probes 60 are disposed on the probe holders. It is connected with each of the 8 l3〇33l5 into 3 tiger line 31. Referring to the fifth and sixth figures, the grounding seat 5 is made of a conductive metal material, and is disposed in the recess 42 of the probe base 4 directly in electrical contact with the grounding surface 41. A plurality of recesses 51 are defined in the center, and a through hole 52 is defined in the center. The recesses 51 are disposed around the through hole 52, and the probes 6〇, 7〇 are extended from the probe base 40. In the recesses 51, only the end φ pin point protrudes from the surface of the grounding seat 50 and is placed in the through hole 52. Each of the grooves 51 can accommodate a certain number of the probes 6〇 in the lateral width. 7〇, as provided in this embodiment, a single signal probe 6 is disposed in a recess 1 〇 51 ′ and the respective grooves 51 are spaced apart from each other by a specific distance to avoid each. An unnecessary electrical interference effect occurs and a short circuit occurs between adjacent probes 60 and 70. Referring to the fourth and fifth figures, each of the probes 6〇, 7〇 can be divided into a needle tail 61, a body portion 62, 72, a connecting portion 63, 73, a forearm I5 64, 74 and a needle tip. 65, 75, each of the signal probes 6 is electrically connected to the signal lines 31, and each of the grounding probes 70 is a bare needle structure, and the body 72 is electrically connected to the grounding surface 41. Therefore, the ground potential can be obtained indirectly. The ground potential can be directly connected to the tail 71. The body 62 of each of the signal probes 60 has a coaxial structure, and a dielectric layer 621 is sequentially coated on the outside of the bare needle. a grounding layer 622 and a protective layer 623, the grounding layer is similar to the grounding surface 41'. Therefore, the grounding surface 41 can also serve as a grounding coplanar plane of each of the grounding layers 622 of the plurality of wooden pins 6? The needle 60, the connecting portions 63, 73 are fixed on the probe base 4, and the probes 6 and 64 are extended in the grooves 51, and the probes are respectively 9 1303315 The tip of the needle 65, 75 protrudes from the grounding seat 50. In summary, the probe card 3 provided by the present invention has more arrangement of the grounding seat 5G than the conventional one. Since each of the grooves 51 has a specific depth in the longitudinal direction, even before the respective probes 60 and 70 The arms 64 and 74 are disposed in the recesses 51, and the tips of the probes 6 and 70 can be prevented from touching the integrated circuit on the wafer. The forearms are inclined and the longitudinal displacement is due to the longitudinal displacement. And the grounding seat 50 is in contact with each other, so that when the probes 6〇, % of the needle tips 65, 75 are subjected to the forward stress, they also have a longitudinal elastic displacement space, and the probes 60, 70 and the wafers are Between the integrated circuits, there is an optimum electrical contact effect, and each of the probes 60, 70 can obtain an optimum stress buffering effect; especially when the electronic circuit of the probe card 3 is electrically connected to the above test machine The signal beam 60 and the signal probe 6 can transmit the high frequency electrical signal by the coaxial structure, and the front arm 64 of each of the signal probes 60 is disposed in each of the grooves 51 on both sides. The grounding seat 50 maintains a specific distance between the ground, because the high frequency signal is adjacent to each of the signal probes. The arrangement of the grounding layer 622 and the grounding base 50 is closely matched, so that the high frequency signal can be effectively transmitted to maintain the impedance matching characteristic, and unnecessary noise interference or electrical coupling effect is prevented, so that the probe card 3 has a pole. For the high-frequency electrical measurement reliability, please refer to the seventh and eighth figures, respectively. The high-frequency measurement frequency characteristics of the probe card 3 provided by the present invention are the cantilever probe cards 2 and 20 respectively. As shown in the figure, the reflection loss curves sil, S11 of the two figures show that the probe card 3 provided by the present invention has extremely low reflection loss, and has excellent impedance matching characteristics in the high frequency band. Compared with the insertion loss curve S21 and S21 of the two figures, it is shown that the cantilever probe card 2 is used in the _3 (the distance of the passband of the 18 1303315 gain is only about 3 3 GHz, and the invention provides The probe card 3 can be as high as the near position z, showing that the cantilevered probe card 2 has a better high frequency signal transmission. 5 It is worth mentioning that the probe card provided by the present invention is The potential grounding characteristic of the grounding seat 50 as described above causes each of the signal probes 6 to transmit signals. The process is more sturdy and anti-pizzy, so as long as the grounding potential is maintained at the grounding block 5〇^, the signal probes 60 are maintained at a certain distance from each other, thereby avoiding unnecessary electrical interference effects affecting each of the signal probes 6〇. The transmission of the high frequency signal is not limited to that the single signal probe 6 can be disposed only in a recess, and can be provided as the second preferred embodiment of the present invention as shown in FIG. The probe card 4 and the 罙 pin card 4 can be applied to the electrical test in the middle and low frequency bands and the low frequency test. The lower frequency test signal is not limited to the signal line 31 and the signal probe 60. It can also be transmitted by the general metal conductor 15 line and the low frequency probe % of the bare needle structure similarly to the grounding probe 70. The difference is that the low frequency probes 76 are not electrically connected to the probe holder 4, " The flash pin card 4 is further provided with a grounding seat 80, and has only two first and second second grooves 81, 82'. Each of the first grooves 81 has the same structural characteristics as those provided by the above embodiments, and is provided for each The signal probe 6 is disposed, and each of the second grooves U 2 具有 has a wider space in the slanting direction. At the same time, a plurality of probes 60, 70, and 76 are disposed, and the probe card 4 can also be obtained by arranging each of the signal probes 6 in the lateral direction adjacent to the grounding block 8 or on one side of the grounding probe 7〇. The process of transmitting the high frequency nickname maintains the impedance matching characteristic, and the signal probe 60 is prevented from being subjected to unnecessary electrical interference and has good high frequency signal transmission quality. 11 1303315 Of course, the signal probe for transmitting high frequency is provided by the present invention: the structure of the axis probe can be measured as shown in the tenth figure if it is applied to the measurement of the display of the frequency differential signal. 5 15 7 provides - _ probe card 5, its poor county record differential probe 9 drink jail 3 (8) = moving transmission line 33 is adjacent to the coaxial magnetic metal 33 with a special distance of the coaxial cable The biaxial core wire is connected. The probe base 4 〇, each of the differential probes 9G has a phase 1 connection = electrically connected to the thin _ 33, __ == the vertical layer 9G1 is more sequentially coated with a ridge 8 of the probe holder 4G; The coaxially conductive to the genus and the 5 hp ground layer 92 are electrically grounded, and each of the differential probes 9 is disposed in each of the grooves 51, so that the probe card 5 transmits the 冋 frequency difference. It is difficult to yaw the characteristics of impedance matching. Therefore, the above = the second and the change, should be included in the scope of the invention = the equivalent structure i3〇33i5 f simple description] f Γ diagram f structure of the arm probe card Schematic diagram of the partial structure of the other-$c-arm probe card; the first: the schematic structure of the preferred embodiment; the figure shows the schematic diagram of the provided heterogeneous structure, the needle seat, the grounding seat and Signal probe junction 10 15 Figure, the preferred structure provided by the local contact structure, the bottom view configuration, the cross-section of the probe holder, the grounding seat, and the junction diagram of each of the probes. The sixth diagram is the above-mentioned first-difficulty touch The structure of the grounding seat is provided. The seventh figure is the high frequency of the riding probe card. _=8 is the high frequency of the above-mentioned preferred embodiment: Fig. 9/The second difficulty provided by the present invention The bureau 7 of the embodiment = bottom view. The tenth aspect of the present invention provides a partial structure bottom view of the third preferred embodiment 13 1303315 [Description of main component symbols] 3, 4, 5 cantilever probe card
10 1510 15
30電路板 301上表面 302下表面 31訊號線 310、330同軸導電金屬 32接地線 33差動傳輸線 40探針座 41接地面 42凹穴 50、80接地座 51凹槽 52通孔 60訊號探針 61、71針尾 62、72身部 621、901介電層 622、92接地層 633、93保護層 63、73連接部 64、74、91 前臂 65、75針尖 70接地探針 76低頻探針 81第一凹槽 82第二凹槽 90差動探針 900裸針 S11、S11’反射耗損曲線 S21、S21’插入耗損曲線 1430 circuit board 301 upper surface 302 lower surface 31 signal line 310, 330 coaxial conductive metal 32 ground line 33 differential transmission line 40 probe holder 41 ground plane 42 recess 50, 80 grounding seat 51 recess 52 through hole 60 signal probe 61, 71 pin tail 62, 72 body 621, 901 dielectric layer 622, 92 ground layer 633, 93 protective layer 63, 73 connecting portion 64, 74, 91 forearm 65, 75 tip 70 grounding probe 76 low frequency probe 81 a groove 82, the second groove 90, the differential probe 900, the bare needles S11, S11', the reflection loss curves S21, S21', the insertion loss curve 14