200813436 九、發明說明： 【發明所屬之技術領域】 高頻 本發明係與探針卡有關，特別是指 訊號的懸臂式探針卡。 裡用以傳遞 【先前技術】 路板閱t圖所示制之㈣式探針卡丨，包括有一電 路板10、複數個同軸傳輸、線丄卜一探針座 冤 針13,電路板10上靠近外圍處設有多個機台銲點1012 接收電測機台所送出的測試訊號，藉 ，用探針13，因而傳遞測試訊號至探 ，電路晶圓執行晶圓級測缸程；其中探針座12具有= ^ 121、-座體122及多數個固定件12 性導通至該探針卡1卜沾拉仏+〜_ 文Ώ囬 座12v八接地電位，该些探針13設於探針 15 20 你^ 猎由各固定件123固定各探針13之身部， 懸於二:：::^二至^定請之間的前端⑶部位 元件時I - t ’目此提供為各探針13點觸待測電子 Λ 尖130反作用力的彈性緩衝力臂，各 木，，之末端m則設於電路板 探針銲點102上。 π M t 4的各 面12==1_線11外圈具有—導電金屬_接地 ^ 、接，可維持各同轴傳輸線11高頻傳輸的 11 Μ , 、σ 且各权針13僅為一導電金屬，直外 曰〜、、類似同軸傳輸線11之結構處理，故同轴傳輸線η 4 200813436 的高頻訊號傳輸至探針13時，探針13周門八〇 生電容效應則會造成含相 认 15圍"电裱境的寄 高頻電測的可靠性貝㈣傳輸的介電損耗，因此失去 3 導電性的金屬材質所〃〜篮i22以具有 力丄mu + 成，其中，各同軸探針2〇以一金Μ 針21為軸芯，並區分為前、後端2()1、2()2#β & 、，屬 Q ⑴傻細 2ϋ1、202 部位，前端 201 位於口疋件123至針尖之間，後端2〇2位於 Κ)電路板10之間，金屬針21 卞J至 ㈣”八μ 後^ 周圍包覆一層介電 材枓22，；,電材料22之外層包覆一導電金屬23，導電全 屬23並與金屬材質之座體122相接並電性連接至該 2上的接地電位，使各同軸探針20於後端搬部位可以Ϊ 持南頻訊號傳輸的特性阻抗，但由於各同軸探針2g之前端 15 201部位係用以承受來自針尖反作用力的彈性緩衝力臂，需 $持有金屬針21本體之特定重量及其周圍所需之緩衝活動 工間，無法如其後端202增加同軸傳輸線之設置結構，於 周圍同樣包覆有與座體122相接設的外層導電金屬，故高 頻傳輸特性僅限於各同軸探針2〇之後端2〇2部位無法及於 !〇前端201 ’同樣容易使探針2〇周圍介電環境的寄生電容效 應造成高頻訊號傳輸的介電損耗。 因此探針卡如何能以最有效的訊號傳輸結構，維持高 頻訊號傳輪的特性阻抗實為現今探針卡製造者所面臨的一 大考驗。 5 200813436 【發明内容】 因此，本發明之主要目的乃在於提供一種高頻懸臂式 探針卡，係以高品質的訊號傳輸結構傳送高頻電測訊號， 5 並有效應用於晶圓級電測工程。 為達成前揭目的，本發明所提供一種高頻懸臂式探針 卡係具有一電路板、一接地座、複數個訊號探針及至少一接 地探針，該電路板設置有多數個訊號線，各該訊號線電性 連接該訊號探針，該些訊號線可用以傳輸測試機台輸出之 1〇笔測A號至各该sil?虎棟針，該接地座為具導電性之金屬材 質所製成，電性連接該電路板的接地電位；各該訊號探針 及接地探針皆為具導電性的金屬材質所製成，各該接地探 針電性連接該接地座，各該訊號探針及接地探針具有一連 接部、一針尖及一前臂，該前臂為自該連接部向^針尖延 is伸之部位，各該訊號探針及接地探針之連接部固設於該電 路板上，各該訊號探針之前臂懸設於該接地座上並與=接 地座維持有特定之間距。 、 士當各該訊號探針及接地探針點觸晶圓上的積體電路 時，針尖受到正向應力之作用下仍然有縱向的彈性位移空 使該些δ孔號採針及接地採針與晶圓之間有最佳的電性 ^觸效果，且各該訊號探針及接地探針可獲得最適的應力 /%作用，尤其各該訊號探針之前臂與該接地座之間纟隹持 =定之間距藉以產生所需阻抗值，因此高頻訊號在各兮 雜針傳輸過程中補可有效_阻抗匹配的特性，^ 6 200813436 該探針卡具有極佳的高頻電測可靠性。 【實施方式】 以下，兹配合圖示列舉若干較佳實施例，用以對本 結構與功效作詳細說明，其中所關示之簡要說 ί三圖係本發明所提供第—較佳實施例之結構示意圖； 圖 構剖視圖 第五圖係上述第-較佳實施例所提供之局部結構底視 不該探針卡中央包括該探針座、接地座及各該探針之結 ‘號探針之結 弟四圖係上述第—較佳實施觸提供之 顯示該探針卡中央包括該探針座、接地座及訊彳 構設置 Μ體圖第六圖係上述第-較佳實施例所提供該接地座之結構立 ^七圖係制懸臂式探針卡之高頻量測頻率特性圖； :八圖係上述第-較佳實施例之高㈣測鮮特性圖； 圖；第九_本發明戦供第二較錄補之局縣構底視 如第十圖係本發明所提供第三較佳實施例之局部結構 圓0 7 200813436 括有一電路板30、一探針座 探針60及錄轉地探針7GG _接地錢、錄個訊號 ===頻電 &32 …电路，包括有多數個訊號線31及接地 ί二:：二圖參照’本實施例所提供之該些訊號線31 =/=傳輸高頻訊號之同轴傳輸線，係自該上表 、羞f*下表面3G2分別與各該訊號探針60電性 ’且各m線μ具有一圈同轴導電金屬31〇電性連 接於該電路板3G之接地線32，各該接地線32則可直接或 間接與測試機台的接地電位電性連接，使各該接地線^提 =為該電路板3G的接地電位’因此維持各該訊號線31傳 遞鬲頻電測訊號之特性阻抗。 籲 15 請配合第三及第四圖參照，該探針座40設於該電路板 3〇下表面302上，該探針座40具有一接地面4卜中央役 有一凹穴42供以設置該接地座5〇，本實施例所提供之該探 針座4〇為具導電性的金屬材質所製成，因此其表面即形成 為該接地面41，當然該探針座40亦可為不具導電性的材質 20所製成，只要同樣設有具導電性的該接地面41則可發揮等 效之功用，透過與各該訊號線31之同軸導電金屬31〇電性 連接使該接地面41作為該電路板30中各該接地線32之接 地共平面，配合第五圖參照，該探針座4〇上供以設置該此 探針60、70，各該訊號探針60並於該探針座4〇上與 200813436 訊3虎線31相接设。200813436 IX. INSTRUCTIONS: [Technical field to which the invention pertains] High frequency The present invention relates to a probe card, and more particularly to a cantilever probe card of a signal. [4] The probe card of the (fourth) type shown in the t-picture includes a circuit board 10, a plurality of coaxial transmissions, a wire probe, a probe seat pin 13, and a circuit board 10 A plurality of machine solder joints 1012 are arranged near the periphery to receive the test signals sent by the electric measuring machine, and the probes 13 are used to transmit the test signals to the probes, and the circuit wafers perform the wafer level measurement cylinders; The seat 12 has a ^ ^ 121, a body 122 and a plurality of fixing members 12 electrically connected to the probe card 1 沾 仏 仏 〜 〜 _ Ώ Ώ 12 12v eight ground potential, the probe 13 is set in the probe 15 20 You ^ Hunting the body of each probe 13 by each fixing piece 123, hanging on the front part of the front part (3) between two::::^2 to ^, and I-t' is provided for each probe The needle 13 touches the elastic buffering arm of the reaction force of the electronic Λ tip 130, and the end m of each wood is disposed on the board probe solder joint 102. Each face of π M t 4 is 12 = 1 - line 11 has an outer ring of - conductive metal _ grounding ^, connected, can maintain the high frequency transmission of each coaxial transmission line 11 11 Μ, σ and each weight pin 13 is only one The conductive metal, the direct external 曰~, is similar to the structure of the coaxial transmission line 11. Therefore, when the high-frequency signal of the coaxial transmission line η 4 200813436 is transmitted to the probe 13, the capacitance of the probe 13 is caused by the capacitance effect. Recognize the reliability of the high-frequency electrical measurement of the electric fence, and the loss of the dielectric loss of the (four) transmission, so the metal material that loses 3 conductivity is 〃~ basket i22 with force 丄mu +, wherein each coaxial The probe 2〇 has a gold pin 21 as the axis core, and is divided into front and rear ends 2 () 1, 2 () 2 # β & , , is Q (1) silly 2 ϋ 1, 202 parts, the front end 201 is located at the mouth Between the member 123 and the tip of the needle, the rear end 2〇2 is located between the circuit board 10, and the metal needle 21 卞J to (4)” is surrounded by a layer of dielectric material 22, and the electrical material 22 The outer layer is covered with a conductive metal 23, and the conductive elements are all 23 and are connected to the metal body 122 and electrically connected to the ground potential of the two, so that the coaxial probes 20 are behind. The end moving part can maintain the characteristic impedance of the south frequency signal transmission, but since the front end 15 201 of each coaxial probe 2g is used to bear the elastic buffering force arm from the needle tip reaction force, it is necessary to hold the metal needle 21 body specific The weight and the buffering work space required around it cannot be added to the rear end 202 to increase the coaxial transmission line structure, and the outer layer is also coated with the outer layer conductive metal connected to the base 122, so the high frequency transmission characteristics are limited to each The 2nd and 2nd parts of the coaxial probe 2〇 cannot be used! The front end 201' also easily causes the dielectric loss of the high-frequency signal transmission caused by the parasitic capacitance effect of the dielectric environment around the probe 2〇. Maintaining the characteristic impedance of the high-frequency signal transmission wheel with the most effective signal transmission structure is a major challenge faced by today's probe card manufacturers. 5 200813436 [Invention] Therefore, the main object of the present invention is to provide a high The frequency cantilever probe card transmits high-frequency electrical measurement signals with high-quality signal transmission structure, and is effectively applied to wafer-level electrical measurement engineering. The high-frequency cantilever probe card has a circuit board, a grounding block, a plurality of signal probes and at least one grounding probe. The circuit board is provided with a plurality of signal lines, and the signal lines are electrically connected. The signal probes are connected, and the signal lines can be used to transmit the test instrument output of the test machine to the sil? tiger pin, which is made of a conductive metal material and is electrically connected. The grounding potential of the circuit board; each of the signal probe and the grounding probe is made of a conductive metal material, and each of the grounding probes is electrically connected to the grounding base, and each of the signal probe and the grounding probe has a connecting portion, a tip and a forearm, wherein the forearm is a portion extending from the connecting portion to the tip of the needle, and the connecting portion of each of the signal probe and the grounding probe is fixed on the circuit board, and each of the signal probes The front arm is suspended on the grounding seat and maintains a specific distance from the grounding seat. When each of the signal probes and the grounding probe touches the integrated circuit on the wafer, the needle tip is subjected to the longitudinal stress and the longitudinal elastic displacement is still applied to make the δ hole number and the grounding needle. The best electrical contact effect between the wafer and the wafer, and each of the signal probe and the grounding probe can obtain an optimum stress/% effect, especially between the front arm of the signal probe and the grounding seat. The distance between the fixed and fixed distances is used to generate the required impedance value, so the high-frequency signal can be effectively supplemented during the transmission process of each doped pin. _ impedance matching characteristics, ^ 6 200813436 The probe card has excellent high-frequency electrical reliability. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, a number of preferred embodiments are described in conjunction with the drawings to illustrate the structure and function of the present invention, and the structure of the preferred embodiment of the present invention is provided. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a partial view of the above-described first preferred embodiment. The bottom of the probe card includes the probe holder, the grounding seat, and the junction of the probes of the probes. The fourth embodiment of the present invention is shown in the above-mentioned first preferred embodiment. The probe card includes the probe holder, the grounding base, and the mechanism. FIG. 6 is a diagram of the ground provided by the above-described first preferred embodiment. The structure of the seat is a high-frequency measurement frequency characteristic diagram of the cantilever type probe card; the eight-picture is the high (four) fresh-keeping characteristic diagram of the above-mentioned first preferred embodiment; FIG. The second embodiment of the present invention provides a partial structure circle of the third preferred embodiment. The system includes a circuit board 30, a probe holder probe 60, and a record transfer. Ground probe 7GG _ grounding money, recording a signal ===frequency & 32 ... circuit, package There are a plurality of signal lines 31 and grounding ί2:: two figures refer to the coaxial signal transmission lines for transmitting the high-frequency signals provided by the signal lines 31=/= provided in this embodiment, from the above table, shame f* The surface 3G2 is electrically connected to each of the signal probes 60, and each of the m lines μ has a ring of coaxial conductive metal 31〇 electrically connected to the grounding line 32 of the circuit board 3G, and the grounding lines 32 can be directly or indirectly The ground potential of the test machine is electrically connected to each other, so that the ground line is set to the ground potential of the circuit board 3G. Therefore, the characteristic impedance of the frequency signal signal transmitted by each of the signal lines 31 is maintained. Referring to the third and fourth figures, the probe base 40 is disposed on the lower surface 302 of the circuit board 3. The probe base 40 has a grounding surface 4 and a central cavity has a recess 42 for setting the The grounding base 5〇, the probe base 4〇 provided in this embodiment is made of a conductive metal material, so the surface thereof is formed as the grounding surface 41. Of course, the probe base 40 can also be non-conductive. The material 20 is made of the same material. As long as the grounding surface 41 having the conductivity is also provided, the equivalent function is exerted, and the grounding surface 41 is electrically connected through the coaxial conductive metal 31 of each of the signal lines 31. The grounding planes of the grounding wires 32 of the circuit board 30 are coplanar, and the probe holders 4 are provided with the probes 60 and 70, and the signal probes 60 are disposed on the probes. Block 4 is connected with 200813436 News 3 Tiger Line 31.
請配合第五及第六圖參照，該接地座5〇為具導電性的 金屬材質所製成’設於該探針座40之凹穴42中直接與今 接地面41電性接觸，其上設有多數個凹槽51，中央具有一 5通孔52，該些凹槽51環繞該通孔52而設置，各該探針6〇、 70即自該探針座40上延伸設置於該些凹槽51中，僅末端 針尖部位凸出於該接地座50表面並置於該通孔52中，各 該凹槽51於橫向之寬度可容置特定數量之該探針6〇、7〇， 如本實施例所提供者為以單一該訊號探針6〇設於一該凹槽 1〇 51，並維持各該凹槽51相互間隔有特定之間距以避免各該 訊號探針60之間發生不必要的電性干擾效應以及相鄰各該 探針60、70發生短路的現象。 15 20 請配合第四及第五圖參照，各該探針6〇、7〇可區分為 一針尾61、71、一身部62、72、一連接部幻、73、一前^ 64、74及一針尖65、75，各該訊號探針6〇以該針尾6丨電 性連接各魏!緣31，各該接地騎7〇為裸針結構，以該 身部72電性連接該接地面41，因此得以隨獲得接地電 位’當然亦可麵崎針尾7丨電性連難地餘，各該訊 號探針6G之身部62為同減構，而於裸針外依序包 一介，層621、-接地層622及一賴層必，該接地層必 面41 ’因此該接地面41同樣可作為該些訊 ，鱼1 接地層622之接地共平面，各該探針6〇、 it:3、73固設於該探針座4〇上，各該探針60、 4延伸設置於該些凹槽51中，各該探針6〇、 9 200813436 70之針乂 65、75凸出於該接地座％。 15 更夕ί Γ ’本發_提供之該探針卡3較之習用 一夕二座50的設置’由於各該凹槽51於縱向有特 疋之珠度，故即使各該探針60、7〇之前f 64、74延伸設 7置5=^槽51中’仍可避免該些探針60、70之針尖65、 75爲曰圓上的積體電路時該些前臂64、74因縱向位移而 ”該接地座5G相接觸，因此轉該些探針6G、7G之針尖 ^5、75 X到正向應力時同樣具有縱向的彈性位移空間，使 ，些探針6G、7G與晶圓上的積體電路之間有最佳的電性接 觸效果，且各雌針6〇、7G可獲得最_應力緩衝作用； 尤其f該探針卡3之電子電路電氣連接至上述測試機台， 即可藉由同條構之各該訊驗M及訊絲針⑹傳遞高 頻電測訊號，各該職探針6G之㈣64又設置於各該凹 槽中’兩側與該接地座5〇之_持有特定之間距，因 此高頻訊號在各該訊號探針6〇傳輸過程中鄰近配合有該接 地層622及接地座5〇的設置，可因此有效傳遞高頻訊號使 維持阻抗匹_躲，並防止不必要的雜訊干擾或電性柄 合政應，使該探針卡3具有極佳的高頻電測可靠性，請參 閱如第七及第八圖所示，分別為習用該懸臂式探針卡2及 本Ίχ月所k供5亥板針卡3之尚頻量測頻率特性圖，相較兩 圖之反射耗損（return loss)曲線Sll、S11，可知，本發明 所提供之該探針卡3有極低的反射耗損，顯示於高頻段有 極佳的阻抗匹配特性，另相較兩圖之插入耗損（insertion loss)曲線S21、S21，更顯示習用該懸臂式探針卡2於_3(13 20 200813436 增益之通帶（passband)限制頻率僅約有3 3 GHz，遠小於 本發明所提供之該探針卡3可高至近1〇GHz，顯示該探針 卡3具有較習用之懸臂式探針卡2為更良好的高頻訊號傳 輸品質。 5 歸一提的是，本發明所提供之探針卡係以如上述之該 接地座5〇的電位接地特性使各該訊號探針6〇傳輸高頻訊 號過程更能轉阻抗匹g⑽特性，·只要於接地座中 維持各該訊號探針60鄰近特定之間距即有接地電位，可避 免不必要的％ 1±干擾效應影響各該訊號探針⑼傳輸高頻訊 10號，故並不限定單一該訊號探針6(H堇能設於一凹槽内，而 可如第九圖所示為本發明第二較佳實施例提供之—懸臂式探 、’十卡4 口亥探針卡4可應用於一般中、低頻段的電性測試及 少部分高頻測試需求，其中較低頻的測試訊號不限定以上 述該訊號線31及訊麟針6〇傳輸，更可藉自—般金屬導 15線及與該接地探針7〇同樣為裸針結構之低頻探針76傳 輸L差異在於該些低頻探針76不與該探針座40電性連接， 该楝針卡4另設有—接地座8G，僅具有二第—及二第二凹 槽81、82 ’各該第一凹槽81與上述實施例所提供者具有相 同之、、、σ構特性，供各該訊號探針設置，各該第二凹槽u 2〇則於橫向具有較寬之空間可同時設置多數個探針60、70、 %，只要將各該訊號探針6〇於橫向緊鄰有該接地座肋或 ，側皆為該接地探針70,同樣可達到該探針卡4傳輪高頻 沘旒過程維持阻抗匹配的特性，避免各該訊號探針60受到 不必要的電性干擾而具有良好的高頻訊號傳輸品質。 11 200813436 、當然本發明所提供用以傳輸高頻之訊號探針種類亦不限 疋為同軸探針之結構’若顧於—般顯示器驅動晶片做高 頻差動訊號之量測，則可如第十圖所示本發明第三較佳實施 例提供之-懸臂式探針卡5 ’其差異在於以差動傳輪線幻^ 是動探針9〇取代上述實施例之訊號線3i及訊號探針邰，各 該差動傳輸線33為相鄰有特定間距之雙軸心導線的結構，並 具有-同軸導電金屬33〇圍繞該雙軸心導線且電性連接 針座4〇，各該差動探針9〇具有相鄰特定間距之二裸針_， 電性連接該聽傳輸線33，各該差動探針9㈣前臂 二ί針9〇0設於同一該凹槽51中’各該裸針9〇〇外 ϋΪ 層刪，該二介電層剛外更依序包覆有一 〇m—保護層93 ’該接地層92電性連接該探針座 電全設於該探針座4〇;因此藉由該同軸導 15 9〇之92電性接地的特性，且各該差動探針 如之该一稞針900設於各該凹槽51巾，使 馬頻差動訊號過程巾可維持阻抗匹配的特性。& 唯’以上所述者，僅為本發明之較佳可 故舉凡應用本發明說明書及申請 ^ 料盖 變化，理應包含在本發明之專利範圍内圍斤為之纽、、、。構 12 200813436 【圖式簡單說明】 第一圖係習用懸臂式探針卡之結構示意圖； 第-圖係另-習闕臂式探針卡之局部結構示意圖； ，二圖係本發明所提供第一較佳實施例之結構示意圖； 第四圖係上述第-較佳實施例所提供之局部結構示意 圖，顯示該探針卡中央包括該探針座、接地座及訊號探針之結 構剖視圖；Please refer to the fifth and sixth figures. The grounding seat 5〇 is made of a conductive metal material. The recess 42 disposed in the probe base 40 is directly in electrical contact with the grounding surface 41. A plurality of recesses 51 are defined in the center, and a central through hole 52 is disposed. The recesses 51 are disposed around the through hole 52. The probes 6 and 70 extend from the probe base 40. In the groove 51, only the tip end portion protrudes from the surface of the grounding seat 50 and is placed in the through hole 52. Each of the grooves 51 can accommodate a certain number of the probes 6〇, 7〇 in the width of the lateral direction, such as In this embodiment, a single signal probe 6 is disposed in a recess 1 〇 51, and each of the recesses 51 is spaced apart from each other by a specific distance to avoid occurrence of a difference between the signal probes 60. Necessary electrical interference effects and short-circuiting of adjacent probes 60, 70. 15 20 Please refer to the fourth and fifth figures. Each of the probes 6〇, 7〇 can be divided into a needle tail 61, 71, a body part 62, 72, a connecting part illusion, 73, a front ^ 64, 74 and A pinion 65, 75, each of the signal probes 6 is electrically connected to each of the pins 316, and each of the grounding pins 7 is a bare pin structure, and the body portion 72 is electrically connected to the ground plane 41. Therefore, it is possible to obtain the grounding potential with the ground potential. Of course, the surface of the signal probe 6G is the same as the subtraction, and the body of the signal probe 6G is the same as the subtraction, and the layer is 621. - the ground layer 622 and a layer must be, the ground layer must face 41 'so the ground plane 41 can also serve as the signal, the ground plane 622 of the fish 1 is coplanar, each of the probes 6 it, it: 3 The probes 60 and 4 are disposed on the probe holders 4, and the probes 60 and 4 are disposed in the recesses 51. The probes 65 and 75 of the probes 6〇, 9 200813436 70 protrude from the probes. Grounding seat%. 15 更 ί Γ 'This hair _ provides the probe card 3 compared to the conventional one set of two sets of 50' because each of the grooves 51 has a characteristic bead in the longitudinal direction, even if each of the probes 60, 7〇 before f 64, 74 extension 7 set 5 = ^ slot 51 'can still avoid the probes 60, 70 needle tips 65, 75 are integrated circuits on the circle, the forearms 64, 74 due to the longitudinal Displacement and "the grounding seat 5G is in contact with each other, so the tip of the probes 6G, 7G ^5, 75 X to the forward stress also has a longitudinal elastic displacement space, so that the probes 6G, 7G and the wafer The optimal electrical contact effect between the integrated circuits on the upper side, and the female stitches 6〇, 7G can obtain the most stress buffering effect; in particular, the electronic circuit of the probe card 3 is electrically connected to the above test machine. The high frequency electrical measurement signals can be transmitted by the respective M and the signal pins (6) of the same structure, and the (4) 64 of each of the service probes 6G is disposed in each of the grooves and the grounding seat 5' _ holding a specific distance, so the high frequency signal is adjacent to the ground layer 622 and the grounding seat 5 配合 in the transmission process of each of the signal probes 6 ,, Passing the high-frequency signal to maintain the impedance and avoid unnecessary noise interference or electrical shank, so that the probe card 3 has excellent high-frequency electrical reliability, please refer to the seventh and As shown in the eighth figure, the frequency characteristics of the frequency measurement of the cantilever type probe card 2 and the 5th board needle card 3 of the present month are respectively compared with the reflection loss curves of the two figures. S11 and S11, it can be seen that the probe card 3 provided by the invention has extremely low reflection loss, and has excellent impedance matching characteristics in a high frequency band, and an insertion loss curve S21 in comparison with the two figures. S21, further showing that the cantilever probe card 2 is used in the _3 (13 20 200813436 gain passband limit frequency is only about 3 3 GHz, which is much smaller than the probe card 3 provided by the present invention can be high to near 1 GHz, the probe card 3 has a better high-frequency signal transmission quality than the conventional cantilever probe card 2. 5 It is to be noted that the probe card provided by the present invention is as described above. The potential grounding characteristic of the grounding seat 5〇 enables the signal probes 6〇 to transmit high-frequency signals more efficiently. The characteristics of the transimpedance g(10), as long as the signal potential of the signal probe 60 is maintained in the grounding seat, that is, the ground potential is avoided, thereby avoiding unnecessary %1±interference effects affecting each of the signal probes (9) transmitting high frequency signals 10 No, it is not limited to a single signal probe 6 (H堇 can be disposed in a recess, but can be provided as a second preferred embodiment of the present invention as shown in the ninth embodiment - cantilever probe, 'ten card The 4-port probe card 4 can be applied to the electrical test of a medium- and low-frequency band and a small number of high-frequency test requirements. The test signal of the lower frequency is not limited to the above-mentioned signal line 31 and the signal transmission. The difference between the low-frequency probe 76 and the low-frequency probe 76 of the bare-pin structure is that the low-frequency probe 76 is not electrically connected to the probe holder 40. The 楝 pin card 4 is additionally provided with a grounding seat 8G, and has only two first and second second grooves 81, 82'. Each of the first grooves 81 has the same sigma structure as the one provided in the above embodiment. For each of the signal probes, each of the second grooves u 2 具有 has a wider space in the lateral direction A plurality of probes 60, 70, and % are disposed, and each of the signal probes 6 is disposed adjacent to the grounding ribs in the lateral direction, and the grounding probes 70 are all on the side. The frequency 沘旒 process maintains the characteristics of impedance matching, and the signal probe 60 is prevented from being subjected to unnecessary electrical interference and has good high-frequency signal transmission quality. 11 200813436 , of course, the type of signal probe provided by the present invention for transmitting high frequency is not limited to the structure of the coaxial probe. If the display driver chip is used to measure the high frequency differential signal, it can be as The tenth figure shows a cantilever type probe card 5' provided by the third preferred embodiment of the present invention, which differs in that the signal line 3i and the signal of the above embodiment are replaced by a differential transmission line. The probe 邰, each of the differential transmission lines 33 is a structure of a biaxial core wire adjacent to a specific pitch, and has a coaxial coaxial metal 33 around the biaxial core wire and electrically connected to the needle holder 4 〇, each of the difference The movable probe 9 has two bare pins _ adjacent to a specific pitch, and is electrically connected to the audible transmission line 33, and each of the differential probes 9 (four) forearm yokes 9 〇 0 is disposed in the same groove 51 The second dielectric layer is sequentially coated with a 〇m-protective layer 93. The grounding layer 92 is electrically connected to the probe holder. The probe is fully disposed on the probe holder 4. 〇; therefore, by the characteristics of the coaxial conductor 92 electrically grounded, and each of the differential probes is provided The napkin groove 51, so that the frequency characteristic of the differential signal process horse towel impedance matching can be maintained. It is to be understood that the above description of the present invention and the application of the cover change are only included in the scope of the patent of the present invention. Structure 12 200813436 [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the conventional cantilever probe card; the first diagram is a schematic diagram of the partial structure of the other-armed probe card; A schematic structural view of a preferred embodiment of the present invention; the fourth embodiment is a partial structural view of the first preferred embodiment, showing a structural view of the probe card including the probe holder, the grounding seat and the signal probe;
第五圖係上述第一較佳實施例所提供之局部結構底視 圖’顯不該探針卡中央包括該探針座、接地座及各該探針之結 構設置； 第六圖係上述第—較佳實補所提供該接地座之结槿立 體圖； " ，七圖係制懸臂式探針卡之高頻量測頻率特性圖； ，八圖係上述第—較佳實施例之高頻量麵率特性圖； •第九圖係本發明所提供第二較佳實關之局部結構底視 圖； 一 第十嶋本發贿提供第三較佳實關之局部結構底視 13 200813436 【主要元件符號說明】The fifth figure is a bottom view of the partial structure provided by the first preferred embodiment. The central portion of the probe card includes the probe holder, the grounding seat and the structure of each of the probes. The sixth figure is the above-mentioned The preferred embodiment provides a perspective view of the junction of the grounding seat; ", a high-frequency measurement frequency characteristic diagram of the cantilevered probe card of the seven-picture system; and eight figures are the high-frequency quantities of the above-described first preferred embodiment The ninth figure is a bottom view of the partial structure of the second preferred embodiment provided by the present invention; a tenth 发本本发发 provides a third preferred embodiment of the partial structure bottom view 13 200813436 [main component symbol Description]
10 1510 15
3、4、5懸臂式探針卡 30電路板 301上表面 302下表面 31訊號線 310、330同軸導電金屬 32接地線 33差動傳輸線 40探針座 41接地面 42凹穴 50、80接地座 51凹槽 52通孔 60訊號探針 61、71針尾 62、72身部 621、901介電層 622、92接地層 633、93保護層 63、73連接部 64、74、91 前臂 65、75針尖 70接地探針 76低頻探針 81第一凹槽 82第二凹槽 90差動探針 900裸針 S11、S11’反射耗損曲線 S21、S21’插入耗損曲線 143, 4, 5 cantilever probe card 30 circuit board 301 upper surface 302 lower surface 31 signal line 310, 330 coaxial conductive metal 32 ground line 33 differential transmission line 40 probe holder 41 ground plane 42 recess 50, 80 grounding seat 51 groove 52 through hole 60 signal probe 61, 71 pin tail 62, 72 body 621, 901 dielectric layer 622, 92 ground layer 633, 93 protective layer 63, 73 connection portion 64, 74, 91 forearm 65, 75 tip 70 grounding probe 76 low frequency probe 81 first groove 82 second groove 90 differential probe 900 bare needle S11, S11' reflection loss curve S21, S21' insertion loss curve 14