200829923 九、發明說明： 【發明所屬之技術領域】 本么明係與懸臂式探針有關 卡上以傳遞高頻訊號的懸臂式探針。、曰 ; 5【先前技術】 路板彡圖所7用之懸臂式探針卡丨，包括有一電 11 ^ 12 10:用ΜΑ:路板1G上靠近外圍處設有多個機台鲜點 10線111#、卜:測機台所送出的測試訊號，藉由各同轴傳輪 =圓執行晶圓級測試工程;其中探=二 =二 及多數個固定件123，接地面⑵電 座12^L1 接地電位’該些探針13設於探斜 15 借夂》彻由各11定件123111定各探針13之身部， :生士 方因此提供為各探針13點觸待測電子 =’承受來自針尖丨30反作用力的彈性緩衝力臂 則設於電路板10下方靠近中心處的各 20 由於各同軸傳輸線U外圈具有—導電金屬⑴ =21電性連接’可維持各同軸傳輸線11高頻訊號傳輪的 ^阻抗’但實際上各同軸傳輸線u至積體電路晶圓之間 ^有各板針13結構，且各探針13僅為—導電金屬，200829923 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a cantilever probe on a card for transmitting a high frequency signal. 5曰[Prior Art] The cantilever probe card used in the road board 7 includes an electric 11 ^ 12 10: for the cymbal: 1G on the road board 1G is located near the periphery Line 111#, Bu: The test signal sent by the measuring machine, the wafer level test project is performed by each coaxial transmission wheel=circle; wherein the detection = two = two and a plurality of fixing members 123, the grounding surface (2) the electric seat 12^ L1 ground potential 'The probes 13 are set on the probe 15 夂 夂 彻 由 由 由 由 由 由 由 由 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 123 'The elastic buffering force arm that receives the reaction force from the tip 丨30 is disposed at the bottom of the circuit board 10 near the center. 20 Since each outer coaxial transmission line U has a conductive metal (1) = 21 electrical connection, the coaxial transmission line 11 can be maintained. The impedance of the high-frequency signal transmission wheel is in fact that there is a structure of each pin 13 between the coaxial transmission lines u and the integrated circuit wafers, and each of the probes 13 is only a conductive metal.
層亚無類似同軸傳輸線n之結構處理，故同轴傳輸線、U 4 200829923 的南頻訊號傳輸至捸針13時，探針13周圍介電環境的寄 生電容效應則會造成高頻訊號傳輸的介電損耗，因此失去 高頻電測的可靠性。 縱使有如第一圖所示為經改良之一懸臂式探針卡2,以 “ 5具有同軸傳輸線特性之各同軸探針20結構取代上述探針 13之單一導電金屬結構’並將探針座12之座體122以具有 導電性的金屬材質所製成；其中，各同軸探針2〇以一金屬 • 針21為軸芯，並區分為前、後端201、202部位，前端201 位於固定件123至針尖之間，後端2〇2位於固定件123至 1〇電路板10之間，金屬針21之後端2〇2周圍包覆一層介電 材料22，介電材料22之外層包覆一導電金屬23，導電金 屬23並與金屬材質之座體丨22相接並電性連接至該探針卡 2上的接地電位，使各同軸探針20於後端202部位可以維 持高頻訊號傳輸的特性阻抗，但由於各同軸探針2〇之前端 I5 201部位係用以承受來自針尖反作用力的彈性緩衝力臂，需 • $持有金屬針21本體之特定重量及其周圍所f之緩衝活動 〜 空間，無法如其後端202增加同軸傳輸線之設置結構，於 周圍同樣包覆有與座體122相接設的外層導電金屬，故高 頻傳輸特性僅限於各同軸探針2〇之後端2〇2部位無法及於 2〇丽端2〇丄，同樣容易使探針20關介電環境的寄生電容效 應造成高頻訊號傳輸的介電損耗。 >因此探針卡如何能以最有效的訊號傳輸結構，維持高 頻訊號傳輸的特性阻抗實為現今探針卡製造者所面臨的= 200829923 【發明内容】 因此，本發明之主要目的乃在於提供一種 $ 係應用於測試探針卡’以維持高頻電測訊號 二發：之另一目的乃在於提供一種高頻懸 二=減:探針製作成本之方式，提升高頻 的十 傳达Π口貝，有效應用於晶圓級電測工程。 I的 為達成前揭目的’本發明所提供之一種高頻 10 二電路板一針座、多數個傳輪線及i“ r線，該些傳輸線，因此可供一電測機= 遞高頻測試訊號至該些傳輸線以至該些金屬針； 15之=„1"一料&自固定部向針尖延伸 體^=°該固定部設於該針座，各該針尖用以點觸積 +二 些金屬針更區分有相鄰之-訊號針及-接 20 :該汛旒針之固定部接設於各該傳輸線之金屬導線，該 屬:針之固定部電性連接該傳輸線之同軸金屬，因此該些金 十可傳遞上述高頻職訊號至對應賴之電子元件，且 ^接也針之$臂與相鄰之該訊號針之前臂之間維持有特定 曰距，可維持各該訊號針傳遞高頻測試訊號之特性阻抗。 【實施方式】 以下’兹配合圖示列舉若干較佳實施例，用以對本 6 200829923 發明之結構與功效作詳細說明，其中所用圖示之簡要說 明如下： 弟二圖係本發明所提供第一較佳實施例之上視圖； 第四圖係上述第一較佳實施例所提供之結構示意圖； 5 第五圖係上述第一較佳實施例所提供探針卡之探針區底 視圖， 第六圖係上述第五圖之局部結構放大圖； 第七圖係本發明所提供第二較佳實施例之結構示意圖； 第八圖係上述第二較佳實施例所提供探針卡之探針區底 10視圖； 第九圖係上述第八圖之局部結構放大圖； 第十圖係树明·料三雛實_之騎卡之探針 區底視圖， 15 第十一圖係上述第十圖之局部結構放大圖。 請參閱如第三至第五圖所示本發明所提供之第一較佳 實施例m制频電路晶®之-懸臂式探針卡3，包 括有-電路板3G、-針座4G、錄個傳輸線5G及多數個 金屬針60，其中：The sub-layer has no structure processing similar to the coaxial transmission line n. Therefore, when the coaxial transmission line and the south frequency signal of U 4 200829923 are transmitted to the 捸 pin 13, the parasitic capacitance effect of the dielectric environment around the probe 13 causes the transmission of the high-frequency signal. Electrical losses, thus losing the reliability of high frequency electrical measurements. Even if one of the modified cantilever probe cards 2 is shown as shown in the first figure, the "single conductive metal structure of the probe 13 having the coaxial transmission line characteristics having 5 coaxial transmission line characteristics" is replaced with the probe holder 12 The base body 122 is made of a conductive metal material; wherein each of the coaxial probes 2 has a metal needle 21 as a core and is divided into front and rear ends 201 and 202, and the front end 201 is located at the fixing member. Between 123 and the tip of the needle, the rear end 2〇2 is located between the fixing members 123 to 1〇 of the circuit board 10. The rear end 2〇2 of the metal needle 21 is covered with a dielectric material 22, and the outer layer of the dielectric material 22 is coated with a layer. The conductive metal 23 and the conductive metal 23 are connected to the metal body 22 and electrically connected to the ground potential of the probe card 2, so that the coaxial probes 20 can maintain high frequency signal transmission at the rear end 202. The characteristic impedance, but because the front end I5 201 of each coaxial probe 2 is used to withstand the elastic buffering force arm from the needle tip reaction force, it is necessary to hold the specific weight of the metal needle 21 body and the buffer around it. Activity ~ space, can not be increased as its back end 202 The structure of the transmission line is also covered with an outer layer of conductive metal connected to the base 122. Therefore, the high-frequency transmission characteristic is limited to the position of the second coaxial end of each coaxial probe 2〇2 and the 2nd end 2 〇丄, it is also easy to make the dielectric loss of the high-frequency signal transmission caused by the parasitic capacitance effect of the probe 20 in the dielectric environment. > Therefore, how can the probe card maintain the structure of the high-efficiency signal transmission with the most efficient signal transmission structure? The impedance is actually faced by today's probe card manufacturers = 200829923 [Invention] Therefore, the main object of the present invention is to provide a system for applying a probe card to maintain the high frequency electrical signal two: another One purpose is to provide a high-frequency suspension two = reduction: the way the probe is manufactured, and the high-frequency ten-conveyance is effectively applied to the wafer-level electrical measurement engineering. The invention provides a high-frequency 10 two-circuit board, a pin holder, a plurality of transmission lines and i "r lines", and the transmission lines are therefore available for an electric measuring machine to send high frequency test signals to the transmission lines to the Metal needle; 15 =„1"一料& Self-fixing part to the tip extension body ^=° The fixing part is arranged on the needle seat, and each of the needle tips is used for the touch-contact + two metal needles to distinguish the adjacent-signal pin and - 20: the fixing portion of the pin is connected to the metal wire of each of the transmission lines, and the fixed portion of the pin is electrically connected to the coaxial metal of the transmission line, so that the golden ten can transmit the high frequency service signal to Corresponding to the electronic component of the electronic component, and maintaining a specific interpupcular distance between the arm of the pin and the adjacent arm of the adjacent signal pin, the characteristic impedance of the high frequency test signal transmitted by each of the signal pins can be maintained. The following is a detailed description of several preferred embodiments for illustrating the structure and function of the invention of the present invention. The brief description of the drawings is as follows: The second preferred embodiment of the present invention provides the first preferred embodiment. The top view is a schematic view of the structure of the probe card provided by the first preferred embodiment. The fifth figure is the bottom view of the probe area of the probe card provided by the first preferred embodiment. An enlarged view of a partial structure of the fifth figure; 7 is a schematic structural view of a second preferred embodiment of the present invention; FIG. 8 is a view of the probe base 10 of the probe card provided by the second preferred embodiment; The enlarged structure of the partial structure; the tenth figure is the bottom view of the probe area of the card, and the eleventh figure is an enlarged view of the partial structure of the above tenth figure. Please refer to the first preferred embodiment of the present invention, as shown in the third to fifth figures, of the m-frequency circuit crystal®-cantilever type probe card 3, including a circuit board 3G, a needle holder 4G, and a recording A transmission line 5G and a plurality of metal pins 60, wherein:
-月配合第二及第四圖參照，該電路板3〇可定義出相 之一上表面則及—下表面302，以及内、外圍之一探 303及-測試區綱，該上表面則之測試區綱可H 7 20 200829923 測機台（圖中未示）電性接觸，該電測機台可輸出電測訊 號至該探針卡3，以傳遞高頻測試訊號至内圍之探針區 303，該電路板30佈設有電子電路，包括有多數個訊號線 31及接地線32，係自該上表面3〇1延伸設置至下表面3〇2 .5以電性連接該些傳輸線5〇,各該訊號線31用以傳遞上述高 頻測试§fl號，且相鄰特定間距上設有該接地線32，各該^ 地線32可直接或間接與電測機台的接地電位電性連接，因 ⑩ 此維持各該訊號線31傳遞高頻測試訊號之特性阻抗。 請配合第四及第五圖參照，該針座40係環設於該電路 板30下表面302之採針區303上，為如環氧樹脂等具良好 絕緣特性的材質所製成，用以固定各該金屬針6〇並使相互 不電性導通。 睛配合第四至苐六圖參照’各該傳輸線5〇設於該針座 40之外圍，其一端接設於該電路板3〇上，另一端則接設於 15该金屬針60，各該傳輸線50為同軸結構，係於一金屬導線 _· 51外依序包覆有一介電層52、一同軸金屬53及一保護層 、 54，該金屬導線51電性連接該訊號線31以傳遞上述高頻& 試訊號，該同軸金屬53電性連接該接地線32，因此維持各 該金屬導線51傳遞高頻測試訊號之特性阻抗。 20 请配合第四及弟六圖參照’各該金屬針6〇且有一固定 部601、一針尖602及自固定部601向針尖6〇2延伸之一前 臂603，各該固定部601設於該針座40，各該針尖6〇2用 以點觸上述積體電路晶圓上之一測試銲墊71，該些金屬針 6〇更區分有相鄰之一訊號針61及一接地針62，該訊號針 8 200829923 61之固定部601接設於該金屬導線51，因此可傳遞上述高 頻測試訊號至對應之測試銲墊71所連接之電子元件，該2 地針62之固定部601接設於該同軸金屬53，因此可以^尖 602點觸該電子元件之接地電位所對應之一接地銲墊， 5該接地針62之前臂603並與相鄰之該訊號針61之前臂6〇3 之間維持有特定間距，S此可維持該訊號針61傳遞高頻測 試訊號之特性阻抗。 少綜合上述之結構可知，本發明所提供之該懸臂式探針卡3 係為以各該金屬針60與各該傳輸線5〇之組合結構取代習 10用捸針結構，使高頻測試訊號傳遞之路徑上皆設有鄰近之 接地電位，因此達到最佳阻抗匹配的效果以維持高頻測試 訊號之傳輸品質，有效彌補制探針卡之探針結構的缺 點；再者’由於該探針卡3所提供之各該金屬針6〇在結構 上之長度僅有相當於該探針卡3中心至該針座4〇之距離， 15因此有效節省較習用之探針結構近一半之製作成本。 β另請參閱如第七及第八圖所示本發㈣二較佳實施例 $提供之—歸式探針卡4，與上述第—較佳實施例所提供 ，差異在於，該針座4G上更設有—接地面41，係為具導電 2〇 2的金屬材質所製成，各該傳輸線50之同軸金屬53以及各 =接地針62之固定部601皆為電性連接該接地面41，配合 =九圖參照’因麟接地面q *但可提供為該探針卡4中 =子電路之接地等電㈣’使電路中維持穩定的共同接地 =立’且相鄰二該訊號針61之間僅需設置—該接地針&， P可、准持各该訊號針61傳遞高頻測試訊號之特性阻抗，可 9 200829923 減少該些接地針62之設置數量，用以量測對應設置較少接 地銲墊的晶圓電子電路結構。Referring to the second and fourth figures, the circuit board 3 〇 can define one of the upper surface and the lower surface 302, and one of the inner and outer surfaces 303 and the test area, and the upper surface is The test area can be H 7 20 200829923. The measuring machine (not shown) is electrically contacted, and the measuring machine can output an electrical measuring signal to the probe card 3 to transmit the high frequency test signal to the probe of the inner circumference. In the area 303, the circuit board 30 is provided with an electronic circuit, and includes a plurality of signal lines 31 and a grounding line 32 extending from the upper surface 3〇1 to the lower surface 3〇2.5 for electrically connecting the transmission lines 5. 〇, each of the signal lines 31 is used to transmit the high frequency test §fl number, and the ground line 32 is disposed adjacent to a specific interval, and each of the ground lines 32 can directly or indirectly be connected to the ground potential of the electric measuring machine. The electrical connection is maintained by 10 to maintain the characteristic impedance of the high frequency test signal transmitted by each of the signal lines 31. Referring to the fourth and fifth figures, the needle holder 40 is disposed on the ejector region 303 of the lower surface 302 of the circuit board 30, and is made of a material having good insulating properties such as epoxy resin. Each of the metal pins 6 is fixed and electrically disconnected from each other. The eye is connected to the periphery of the hub 40 with reference to the fourth to sixth figures. One end of the transmission line 5 is connected to the circuit board 3, and the other end is connected to the metal pin 60. The transmission line 50 is a coaxial structure. The metal wire _· 51 is sequentially coated with a dielectric layer 52, a coaxial metal 53 and a protective layer. The metal wire 51 is electrically connected to the signal line 31 to transmit the above. The high frequency & test signal, the coaxial metal 53 is electrically connected to the ground line 32, thereby maintaining the characteristic impedance of each of the metal wires 51 to transmit the high frequency test signal. 20, in conjunction with the fourth and sixth figures, refer to the 'each of the metal pins 6', and have a fixing portion 601, a needle tip 602, and a self-fixing portion 601 extending toward the needle tip 6〇2, one of the front arms 603, and each of the fixing portions 601 is disposed therein. The needle holder 40, each of the needle tips 6〇2 is used to touch one of the test pads 71 on the integrated circuit wafer, and the metal pins 6〇 further distinguish one adjacent signal pin 61 and one ground pin 62. The fixing portion 601 of the signal pin 8 200829923 61 is connected to the metal wire 51, so that the high frequency test signal can be transmitted to the electronic component connected to the corresponding test pad 71, and the fixing portion 601 of the ground pin 62 is connected. The coaxial metal 53 can be used to touch the grounding pad corresponding to the ground potential of the electronic component, and the grounding pin 62 is adjacent to the front arm 603 and the adjacent front end of the signal pin 61. A specific spacing is maintained therebetween, which maintains the characteristic impedance of the signal pin 61 to transmit the high frequency test signal. The structure of the cantilever probe card 3 provided by the present invention is such that the combination of the metal pin 60 and each of the transmission lines 5 is used to replace the 10 pin structure of the 10th, so that the high frequency test signal is transmitted. The path is adjacent to the ground potential, so the best impedance matching effect is achieved to maintain the transmission quality of the high frequency test signal, effectively offset the shortcomings of the probe card probe structure; Each of the metal pins 6 provided in the structure has a length corresponding to only the distance from the center of the probe card 3 to the socket 4, thereby effectively saving the manufacturing cost of the conventional probe structure by half.另Please also refer to the present invention as shown in the seventh and eighth embodiments. The preferred probe embodiment provides a collation probe card 4, which is provided in the above-described preferred embodiment, except that the hub 4G is provided. The grounding surface 41 is made of a metal material having a conductive shape 2〇2, and the coaxial metal 53 of each of the transmission lines 50 and the fixing portion 601 of each of the grounding pins 62 are electrically connected to the grounding surface 41. , cooperate = nine diagrams refer to 'incoming ground plane q * but can be provided as the probe card 4 = sub-circuit grounding isoelectric (four) 'to maintain a stable common ground in the circuit = vertical 'and adjacent two of the signal pin Only need to be set between 61—the grounding pin&, P can hold the characteristic impedance of each of the signal pins 61 to transmit the high frequency test signal, and 9 200829923 reduce the number of the grounding pins 62 to measure the corresponding A wafer electronic circuit structure with fewer ground pads.
當然本發明所提供之高頻測試訊號傳輸結構亦不限定為 上述同軸傳輪線50配合金屬針60之設置結構，若應用於 一般顯示為驅動晶片做高頻差動訊號之量測，則可如第十 及第十一圖所示本發明第三較佳實施例提供之一懸臂式探針 卡5 ’其差異在於具有多數個差動傳輸線80取代上述實施例 之傳輸線50以傳遞高頻差動訊號，各該差動傳輸線80為相 鄰有特定間距之雙軸々導線的結構，具有二金屬導線81、二 10 15Of course, the high-frequency test signal transmission structure provided by the present invention is not limited to the arrangement structure of the coaxial transmission line 50 and the metal needle 60. If it is applied to the measurement of the high-frequency differential signal generally displayed as the drive wafer, As shown in the tenth and eleventh drawings, a third preferred embodiment of the present invention provides a cantilever type probe card 5' which differs in that a plurality of differential transmission lines 80 are provided in place of the transmission line 50 of the above embodiment to transmit a high frequency difference. The signal, each of the differential transmission lines 80 is a structure of a biaxial 々 wire adjacent to a specific spacing, having two metal wires 81, two 10 15
介電層82、一同軸金屬83及一保護層84,各該差動傳輸線 8〇之各金屬導線81對應接設有該訊號針61，各該同軸金屬 83則電性連接至少一該接地針62,因此藉由該同軸金屬83 及所對應接☆之該接地針Μ，使該探針卡5傳遞高頻差動 訊號過程中可維持阻抗匹配的特性。故兴1述者’僅為本發日狀紐可行實施例而已， 明書及申請專利範圍所為之等娜 又化理應包含在本發明之糊範圍内。 200829923 【圖式簡单說明】 第一圖係習用懸臂式探針卡之結構示意圖； 第二圖係另一習用懸臂式探針卡之局部結構示意圖； 第三圖係本發明所提供第一較佳實施例之上視圖； 第四圖係上述第一較佳實施例所提供之結構示意圖； 第五圖係上述第一較佳實施例所提供探針卡之探針區底 視圖， 第六圖係上述第五圖之局部結構放大圖； 第七圖係本發明所提供第二較佳實施例之結構示意圖； 第八圖係上述第二較佳實施例所提供探針卡之探針區底 視圖， 第九圖係上述第八圖之局部結構放大圖； 第十圖係本發明所提供帛三紐實施彳狀麟卡之探針 區底視圖， 第十一圖係上述第+ 弟十圖之局部結構放大圖。 11 200829923 【主要元件符號說明】 3、4、5懸臂式探針卡 30電路板 302下表面 5 304測試區 32接地線 41接地面 51、81金屬導線 53、83同軸金屬 ίο 60金屬針 602針尖 61訊號針 71測試銲墊 301上表面 303探針區 31訊號線 40針座 50、80傳輸線 52、82介電層 54、84保護層 601固定部 603前臂 62接地針 72接地銲墊 12The dielectric layer 82, a coaxial metal 83 and a protective layer 84, each of the metal wires 81 of the differential transmission line 8 is connected to the signal pin 61, and each of the coaxial wires 83 is electrically connected to at least one of the ground pins. 62. Therefore, the coaxial metal 83 and the corresponding grounding pin of the corresponding connector ☆ enable the probe card 5 to maintain impedance matching characteristics during the transmission of the high frequency differential signal. It is only a possible example of the present invention, and the scope of the patent and the scope of the patent application should be included in the scope of the present invention. 200829923 [Simple description of the diagram] The first diagram is a schematic diagram of the structure of a conventional cantilever probe card; the second diagram is a partial structure diagram of another conventional cantilever probe card; the third diagram is the first comparison provided by the present invention The top view is a schematic view of the first preferred embodiment; the fifth figure is the bottom view of the probe area of the probe card provided by the first preferred embodiment, and the sixth figure FIG. 7 is a schematic view showing the structure of a second preferred embodiment of the present invention; FIG. 8 is a schematic view showing the structure of the probe card provided by the second preferred embodiment; The ninth figure is an enlarged view of the partial structure of the above eighth figure; the tenth figure is the bottom view of the probe area of the 帛三纽 implementation of the 帛三纽, and the eleventh figure is the above-mentioned A magnified view of the partial structure. 11 200829923 [Description of main component symbols] 3, 4, 5 cantilever probe card 30 circuit board 302 lower surface 5 304 test area 32 ground wire 41 ground plane 51, 81 metal wire 53, 83 coaxial metal ίο 60 metal needle 602 tip 61 signal pin 71 test pad 301 upper surface 303 probe area 31 signal line 40 pin holder 50, 80 transmission line 52, 82 dielectric layer 54, 84 protective layer 601 fixing portion 603 front arm 62 grounding pin 72 grounding pad 12