TWI721903B - Thin-film probe card with cantilever type - Google Patents

Abstract

The present invention provides a thin-film probe card with cantilever type. The thin-film probe card includes a carrier, a supporting layer, and a thin-film sheet. The carrier has a hole. The supporting layer includes a supporting segment disposed on the carrier and a plurality of independently elastic segments that are spacedly extending from the supporting segment and that are hanging over the hole. The thin-film sheet includes a carrying layer, a plurality of signal circuits, and a plurality of conductive protrusions. The carrying layer has an externally connecting segment, a plurality of active segments respectively formed on the independently elastic segments, and an extension segment that connects the externally connecting segment and the active segments. A portion of the extension segment is fixed on the supporting layer. The signal circuits are disposed on the carrying layer, and respectively extend from the active segments toward the externally connecting segment. The conductive protrusions are respectively formed on portions of the signal circuits that are located on the active segments.

Description

Cantilever thin film probe card

The invention relates to a probe card, in particular to a cantilever type thin film probe card.

Existing cantilever probe cards are mainly used in peripheral chip testing, but the existing cantilever probe cards have more complicated needle planting methods (such as manual soldering pins), and fan-out design (fan-out) is required. ). Accordingly, the existing cantilever probe card is not easy to maintain, which makes it difficult to reduce production and maintenance costs.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The embodiment of the present invention is to provide a cantilever type thin film probe card, which can effectively improve the defects that may occur in the existing cantilever type probe card.

The embodiment of the present invention discloses a cantilever thin film probe card, which includes: a carrier including a first surface and a second surface on opposite sides, and the carrier is recessed from the first surface to form an opening. Hole; a supporting layer, including a supporting section installed on the first surface and a plurality of independent elastic sections extending from the supporting section at intervals; wherein a plurality of the independent elastic sections are suspended from the opening One side of the hole; and a film sheet, including: a bearing layer, defining a circumscribed section, a plurality of actuating sections formed on the plurality of independent elastic sections, and connecting the circumscribed section and the plurality of An extension section of the actuation section; wherein a part of the extension section is fixed to the support layer; a plurality of signal lines are arranged on the bearing layer and extend from the plurality of actuation sections toward the outer section respectively. And a plurality of conductive bumps are respectively formed at the positions of a plurality of the signal lines in a plurality of the actuating sections; wherein, when any one of the conductive bumps is compressed, the corresponding signal The line and the corresponding actuating section can be elastically bent and deformed toward the opening through the corresponding independent elastic section.

In summary, the cantilever thin film probe card disclosed in the embodiment of the present invention is designed through the structure of the carrier, the support layer, and the thin film sheet, so that the cantilever thin film probe card has the existing The cantilever probe function further facilitates production, maintenance and replacement, and effectively reduces production and maintenance costs.

Furthermore, the cantilever thin film probe card disclosed in the embodiment of the present invention can press the corresponding signal line and the actuating section when any one of the conductive bumps is compressed. Independent elastic section, so the cantilever thin film probe card can reduce the linkage between the plurality of conductive bumps, so that the force of the plurality of conductive bumps is more uniform and can be more stable against A plurality of metal pads on the object under test (such as a peripheral chip).

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

The following is a specific embodiment to illustrate the implementation of the "cantilever thin film probe card" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[Example 1]

Please refer to FIGS. 1-10. This embodiment discloses a cantilever thin film probe card 100, which can detect an object under test, such as a peripheral chip (not shown). As shown in FIGS. 1 and 2, the cantilever thin film probe card 100 includes a carrier 1, a plurality of supporting layers 2 arranged on the carrier 1, and a plurality of supporting layers 2 mounted on the carrier 1 A plurality of film sheets 3 of, and a circuit board 4 electrically coupled to the plurality of film sheets 3. Wherein, the cantilever thin film probe card 100 is described in this embodiment by including the above-mentioned components, but the invention is not limited to this. For example, in other embodiments not shown in the present invention, when the cantilever thin film probe card 100 is used (eg, sold), the circuit board 4 may not be included; or, the cantilever type The number of the support layers 2 and the number of the film sheets 3 of the thin film probe card 100 may be single.

As shown in FIGS. 1 to 3, the carrier 1 is generally plate-shaped in this embodiment, and is preferably a hard material (such as metal or plastic); that is, the carrier 1 preferably does not have Flexible, but the present invention is not limited to this. The carrier 1 includes a first surface 11 and a second surface 12 on opposite sides, and the carrier 1 has an opening 13 recessed from the first surface 11. Wherein, the opening 13 is formed from the first surface 11 (along a height direction H) of the carrier 1 to the second surface 12 in this embodiment, but the present invention is not based on this. limit. For example, in other embodiments not shown in the present invention, the opening 13 may also be a blind hole.

A plurality of the supporting layers 2 are circumferentially arranged on the first surface 11 of the carrier 1, and a plurality of the supporting layers 2 are arranged separately from each other in this embodiment, but the present invention is not limited to this . For example, as shown in FIG. 4, a plurality of portions of the support layer 2 (such as the following support section 21) abutting on the first surface 11 may also be an integrally connected ring structure, according to the figure The number of the supporting layer 2 shown in 4 is single. In addition, since the structures of the multiple supporting layers 2 in this embodiment are substantially the same, for ease of description, only the structure of a single supporting layer 2 of this embodiment will be described below.

As shown in FIGS. 3 and 5, the supporting layer 2 includes a supporting section 21 installed on the first surface 11 and a plurality of independent elastic sections 22 extending from the supporting section 21 at intervals. In this embodiment, the supporting section 21 is disposed (or fixed) on the first surface 11, and a plurality of the independent elastic sections 22 are formed by extending from the inner edge of the supporting section 21, so that more Each of the independent elastic sections 22 is suspended on the side of the opening 13 of the carrier 1.

In more detail, as shown in FIGS. 6 and 7, the support section 21 and the plurality of independent elastic sections 22 may be arranged in a coplanar plane, but the present invention is not limited to this. For example, as shown in FIG. 8, each of the independent elastic sections 22 may also be formed into a stepped structure in a direction away from the opening 13 (or the carrier 1), so that each of the independent elastic sections There is a difference between 22 and the supporting section 21 in the height direction H.

In addition, the material of the support layer 2 can be adjusted according to design requirements, provided that any one of the independent elastic sections 22 can provide elasticity. For example, the support layer 2 can be made of metal or non-metal. Metal, the present invention is not limited here.

The plurality of the film sheets 3 are respectively arranged on the plurality of the support layers 2, and the plurality of the film sheets 3 are separately arranged from each other in this embodiment, but the present invention is not limited to this. For example, as shown in FIG. 4, a plurality of portions of the film sheets 3 (such as the first portion 3131 of the following bearing layer 31) respectively abutting on the plurality of the supporting layers 2 may also be integrally connected According to the annular structure, the number of the film sheets 3 shown in FIG. 4 is single. In addition, since the structures of the multiple film sheets 3 in this embodiment are substantially the same, for ease of description, only the structure of the single film sheet 3 of this embodiment and the corresponding support layer 2 will be described below. The connection relationship between.

As shown in FIGS. 3 and 6, the film sheet 3 includes a carrier layer 31, a plurality of signal lines 32 disposed on the carrier layer 31, and a plurality of conductive lines respectively connected to the plurality of signal lines 32. Bump 33. Wherein, the bearing layer 31 defines a circumscribed section 311 and a plurality of actuating sections 312 respectively formed on the plurality of independent elastic sections 22 (that is, the plurality of actuating sections 312 are suspended from one of the openings 13 Side), and an extension section 313 that is partially fixed to the support layer 2 and connects the outer section 311 and a plurality of the actuation sections 312.

Wherein, the extension section 313 includes a first part 3131 fixed to the support layer 2 and a second part 3132 beyond the carrier 1, so that the outer section 311 is disposed at all of the carrier 1. Mentioned second surface 12. Furthermore, the extension section 313 is connected to the first section 3131 through the second section 3132, so that the extension section 313 can bypass the carrier 1 and make the outer section 311 and Each of the actuating sections 312 is respectively arranged on opposite sides of the carrier 1.

In this embodiment, the first part 3131 and the second part 3132 are substantially perpendicularly connected, and the first part 3131 is perpendicular to the height direction H, and the second part 3132 is parallel to the height direction H. The height direction H, and the first part 3131 of the extension section 313 is staggered from the outer section 311 along the height direction H, but the present invention is not limited to this.

In addition, a plurality of the actuating sections 312 are arranged at intervals, and the contour of each actuating section 312 is preferably aligned with or indented to the contour of the corresponding independent elastic section 22 along the height direction H According to this, each actuation section 312 can be supported by the corresponding independent elastic section 22, but the present invention is not limited to this.

A plurality of the signal lines 32 are formed on the carrier layer 31 and respectively extend from the plurality of the actuating sections 312 toward the outer section 311. Wherein, the signal line 32 may extend from the corresponding actuating section 312 to the outer section 311, or may extend from the corresponding actuating section 312 to the extension section 313. The present invention is not here. Be restricted. It should be additionally noted that the carrier layer 31 and each of the signal lines 32 are each described in a single-layer structure in this embodiment, but in other embodiments not shown in the present invention, the carrier layer 31 and each of the signal lines 32 may also have a multi-layered structure, which can be matched with each other to facilitate the formation of a signal fan-out structure.

The plurality of conductive bumps 33 are respectively formed at the positions of the plurality of signal lines 32 of the plurality of actuating segments 312; that is, the plurality of conductive bumps 33 are suspended from the openings. One side of the hole 13. Wherein, any one of the conductive bumps 33 is integrally formed with the corresponding signal line 32 in FIG. 7 of this embodiment, and has a truncated cone-shaped structure, but the present invention is not limited to this. For example, as shown in FIG. 9, each conductive bump 33 is a multi-layer structure (for example, a multi-layer structure composed of two truncated cone-shaped structures stacked on each other), and each conductive bump 33 is The cross-sectional area of the bump 33 gradually decreases in a direction away from the opening 13.

In addition, as shown in FIGS. 3 and 6, the part of the film sheet 3 corresponding to the external section 311 (for example, any position of the signal line 32 on the external section 311) is installed in the述circuit board4. Wherein, the installation method between the film sheet 3 (part of the signal line 32) and the circuit board 4 can be, for example, welding or pressing connection, so that the film sheet 3 and the circuit board 4 can be They are electrically coupled to each other, but the present invention is not limited here.

As described above, as shown in FIG. 10, when (the cantilever thin film probe card 100 is used to detect peripheral chips, so that) any one of the conductive bumps 33 is pressed, the corresponding The signal line 32 and the corresponding actuating section 312 can be elastically bent and deformed toward the opening 13 through the corresponding independent elastic section 22. Accordingly, the cantilever thin film probe card 100 can reduce the linkage between the plurality of conductive bumps 33, so that the force of the plurality of conductive bumps 33 is more uniform and can be more stable. A plurality of metal pads (not shown in the figure) against the peripheral chip. Furthermore, the cantilever thin film probe card 100 can also have a wider test area (or the distribution range of a plurality of conductive bumps 33).

[Example 2]

Please refer to FIG. 11, which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment, so the similarities of these embodiments will not be repeated here, and the difference between this embodiment and the above-mentioned embodiment The general description is as follows:

In this embodiment, the carrier layer 31 is illustrated as a multilayer structure, which includes an insulating layer 31a and a conductive layer 31b formed on the insulating layer. Wherein, the insulating layer 31a separates the conductive layer 31b from a plurality of the signal lines 32, and the conductive layer 31b (may be electrically coupled with conductive pillars 31c embedded in the insulating layer 31a) At least one of the signal lines 32 among the plurality of signal lines 32.

[Example Three]

Please refer to FIG. 12 and FIG. 13, which is the third embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment, so the similarities of these embodiments will not be repeated here. However, this embodiment is compared with the above-mentioned embodiment. The differences between the examples are roughly explained as follows:

In this embodiment, the support layer 2 has a through hole 211 formed in the support section 21, and the cantilever thin film probe card 100 further includes an electronic component 6 (such as : Impedance adjustment element), and the electronic element 6 is electrically coupled to at least one of the signal lines 32 of the plurality of signal lines 32.

Furthermore, any one of the signal lines 32 electrically coupled to the electronic component 6 may extend from the corresponding actuation section 312 to the extension section 313, and is located in the extension section 313. The signal line 32 is connected to the electronic component 6, but the present invention is not limited to this.

[Example Four]

Please refer to FIG. 14, which is the fourth embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment, so the similarities of these embodiments will not be repeated here, and the difference between this embodiment and the above-mentioned embodiment The general description is as follows:

In this embodiment, the cantilever thin film probe card 100 further includes an electrical connection structure 5 connected to the circuit board 4, and corresponding to the portion of the thin film sheet 3 of the external section 311 (such as : Any part of the signal line 32 located on the external section 311) is electrically coupled to the circuit board 4 through the electrical connection structure 5. Wherein, the electrical connection structure 5 may be, for example, a connector or a reed, so that the film sheet 3 and the circuit board 4 can be electrically coupled to each other, but the present invention is not limited herein.

In more detail, the first part 3131 and the second part 3132 are substantially perpendicularly connected, and the first part 3131 is perpendicular to the height direction H, and the second part 3132 is parallel to the height. Direction H, and the first part 3131 of the extension section 313 corresponds to the external section 311 along the height direction H, so as to reduce the overall size of the cantilever thin film probe card 100, but The present invention is not limited to this.

[Example 5]

Please refer to FIG. 15, which is the fifth embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment, so the similarities of these embodiments will not be repeated here, and the difference between this embodiment and the above-mentioned embodiment The general description is as follows:

In this embodiment, the cantilever thin film probe card 100 may use two thin film sheets 3 facing each other, and a plurality of the actuating sections 312 of the two thin film sheets 3 cross each other, so that the two The plurality of conductive bumps 33 of each of the film sheets 3 are arranged along a straight line direction perpendicular to the height direction.

[Technical Effects of Embodiments of the Invention]

In summary, the cantilever thin film probe card disclosed in the embodiment of the present invention is designed through the structure of the carrier, the support layer, and the thin film sheet, so that the cantilever thin film probe card has the existing The function of the cantilever probe facilitates production and maintenance replacement, and effectively reduces production and maintenance costs.

Furthermore, the cantilever thin film probe card disclosed in the embodiment of the present invention can press the corresponding signal line and the actuating section when any one of the conductive bumps is compressed. Independent elastic section, so the cantilever thin film probe card can reduce the linkage between the plurality of conductive bumps, so that the force of the plurality of conductive bumps is more uniform and can be more stable against A plurality of metal pads on the object under test (such as a peripheral chip).

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and schematic content of the present invention are included in the patent scope of the present invention. Inside.

100: Cantilever thin film probe card 1: carrier 11: The first surface 12: second surface 13: Hole 2: Support layer 21: Support section 211: Through hole 22: Independent elastic segment 3: Film sheet 31: Carrier layer 311: External segment 312: Acting Section 313: Extension 3131: The first part 3132: second part 31a: insulating layer 31b: Conductive layer 31c: conductive pillar 32: signal line 33: conductive bump 4: circuit board 5: Electrical connection structure 6: Electronic components H: height direction

FIG. 1 is a three-dimensional schematic diagram of a cantilever thin film probe card according to the first embodiment of the present invention.

Fig. 2 is a three-dimensional schematic diagram of Fig. 1 from another perspective (circuit board omitted).

Fig. 3 is a partial exploded schematic diagram of Fig. 1.

FIG. 4 is a schematic diagram of another aspect of FIG. 3.

Fig. 5 is a schematic top view of Fig. 1.

Fig. 6 is a schematic cross-sectional view of Fig. 1 along the line VI-VI.

FIG. 7 is an enlarged schematic diagram of part VII in FIG. 6.

FIG. 8 is a schematic diagram of another aspect of FIG. 7.

FIG. 9 is a schematic diagram of another aspect of FIG. 7.

10 is a schematic cross-sectional view of the cantilever thin film probe card of FIG. 6 in operation.

FIG. 11 is a partial schematic diagram of a cantilever thin film probe card according to the second embodiment of the present invention.

Fig. 12 is a partial schematic diagram of a cantilever thin film probe card according to the third embodiment of the present invention.

Fig. 13 is a schematic cross-sectional view of Fig. 12 along the section line XIII-XIII.

14 is a schematic cross-sectional view of a cantilever thin film probe card according to the fourth embodiment of the present invention.

Fig. 15 is a schematic top view of a cantilever thin film probe card according to the fifth embodiment of the present invention.

100: Cantilever thin film probe card

1: carrier

11: The first surface

13: Hole

2: Support layer

21: Support section

22: Independent elastic segment

3: Film sheet

31: Carrier layer

312: Acting Section

313: Extension

32: signal line

33: conductive bump

4: circuit board

H: height direction

Claims (10)

A cantilever thin film probe card, which includes: A carrier including a first surface and a second surface on opposite sides, and the carrier is recessed from the first surface to form an opening; A supporting layer includes a supporting section installed on the first surface and a plurality of independent elastic sections extending from the supporting section at intervals; wherein, a plurality of the independent elastic sections are suspended from the opening One side; and A film sheet, containing: A load-bearing layer defines a circumscribed section, a plurality of actuation sections respectively formed on the plurality of independent elastic sections, and an extension section connecting the circumscribed section and the plurality of actuation sections; wherein, the extension section Part of it is fixed to the support layer; A plurality of signal lines are arranged on the bearing layer and are formed by extending from a plurality of the actuating sections toward the external section; and A plurality of conductive bumps are respectively formed at the positions of the plurality of signal lines located in the plurality of actuating sections; wherein, when any one of the conductive bumps is compressed, the corresponding signal line and phase The corresponding actuating section can be elastically bent and deformed toward the opening through the corresponding independent elastic section. The cantilever thin film probe card according to claim 1, wherein the carrier layer includes an insulating layer and a conductive layer formed on the insulating layer, and the insulating layer separates the conductive layer from a plurality of The signal line, and the conductive layer is electrically coupled to at least one of the signal lines of the plurality of signal lines. The cantilever thin film probe card according to claim 1, wherein the supporting section and the plurality of independent elastic sections are arranged in a coplanar plane. The cantilever thin film probe card according to claim 1, wherein each of the independent elastic sections is formed into a stepped structure in a direction away from the opening, so that each of the independent elastic sections is connected to the The support section has a difference in a height direction. The cantilever thin film probe card according to claim 1, wherein each of the conductive bumps has a multi-layer structure, and the cross-sectional area of each conductive bump gradually moves away from the opening To shrink. The cantilever thin film probe card according to claim 1, wherein the support layer is formed with a through hole in the support section, and the cantilever thin film probe card further includes a through hole. An electronic element, and the electronic element is electrically coupled to at least one of the signal lines of the plurality of signal lines. The cantilever thin film probe card according to claim 1, wherein the opening of the carrier penetrates from the first surface to the second surface. The cantilever thin film probe card according to claim 1, wherein the extension section includes a first part fixed to the support layer and a second part over the carrier, so that the outer part Is arranged on the second surface of the carrier. The cantilever type thin film probe card according to claim 8, wherein the cantilever type thin film probe card further includes a circuit board, and a portion corresponding to the thin film sheet of the external section is mounted on the circuit board . The cantilever thin film probe card according to claim 8, wherein the cantilever thin film probe card further includes a circuit board and an electrical connection structure connected to the circuit board, and corresponds to the external section The part of the film sheet is electrically coupled to the circuit board through the electrical connection structure.

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