JPH08330469A - Wiring board for semiconductor device, and its manufacture - Google Patents

Abstract

PURPOSE: To provide a technique which can connect each electrode accurately to a corresponding conductive terminal, in case of drawing out a plurality of electrodes made at small pitches at a semiconductor chip. CONSTITUTION: A wiring board 1 is prepared in which conductive terminals 38 are made at the other main surface at pitches larger than the pitches of conductive terminals 3A made at one main surface. A semiconductor chip 12 is mounted, connecting the conductive terminals 38 at large pitches to the corresponding conductive terminals 15. Hereby, in case of drawing out a plurality of electrodes 14 made at small pitches at a semiconductor chip 12, they can be drawn out at enlarged pitches, so each electrode 14 can be connected accurately to corresponding conductive terminals 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for a semiconductor device and a method of manufacturing the same, and more particularly to a plurality of electrodes arranged at a fine pitch on one main surface of a semiconductor chip to be drawn out at an enlarged pitch. It is related to effective technology when applied.

[0002]

2. Description of the Related Art Recent semiconductor devices typified by LSIs are required to have more and more functions, and with this trend, higher integration tends to be achieved. Therefore, the number of electrodes formed on the semiconductor chip is increasing dramatically.

When a semiconductor chip having a plurality of electrodes thus formed is mounted on a mounting substrate, a large number of ball-shaped electrodes (hereinafter referred to as bumps) are formed on the entire surface of the semiconductor chip at a fine pitch, and the bumps are formed. Of the CCB (Controlled Colla)
Pse Bonding) is preferred.

That is, a plurality of bumps formed at a minute pitch on one main surface of a semiconductor chip are connected to a plurality of conductive terminals (conductive patterns) formed on a mounting substrate made of an insulating substrate corresponding to the bumps. As a result, the semiconductor chip is face down bonded to the mounting substrate by the flip chip method.

When a plurality of bumps formed at a fine pitch on such a highly integrated semiconductor chip are electrically drawn out to a mounting substrate which is an external circuit, the mounting substrate is
A multilayer mounting substrate in which wiring is formed in multiple layers in an insulating substrate is often used. Ceramics having the following features are generally used as the material of the multilayer mounting board.

Since the thermal expansion coefficients of the semiconductor chip and the mounting substrate can be made relatively close to each other, the stress applied to the bump during chip bonding can be reduced and the peeling of the bump can be reduced.

Since a mounting substrate having a smaller manufacturing tolerance than glass epoxy can be manufactured, it is easy to form a conductive pattern for bump connection.

By forming a thin film wiring on the mounting substrate, a more accurate conductive pattern for bump connection can be formed.

Since it is easy to form a multi-layer wiring, it is possible to lay out signal lines and distribute power supplies in the mounting board.

It is possible to manufacture a mounting board having excellent heat resistance, airtightness and mechanical strength.

For example, "VLSI Packaging Technology (above)" issued by Nikkei BP, May 31, 1993, P
54 to P61, a packaging technique for supporting a semiconductor chip on various mounting substrates is described in detail.

In mounting the semiconductor chip on the mounting board, it is necessary to inspect whether the semiconductor chip is a good product or a defective product in advance. Therefore, the semiconductor chip is temporarily attached to an inspection substrate such as ceramics, It is removed after the inspection. Then, only good products are bonded to the mounting substrate.

Further, the inspection may be carried out by directly contacting the inspection probe with the bump of the semiconductor chip. However, in this case, since a large number of bumps are arranged on the entire surface of the semiconductor chip with a fine pitch, it is difficult to accurately bring the inspection probe into contact with each bump.

[0014]

As described above, in order to mount a semiconductor chip on a mounting board, ceramics having excellent conditions as a mounting board are often used, but this ceramic is expensive. Therefore, there is a problem that cost increase cannot be avoided.

Further, since the semiconductor chip is mounted on the mounting substrate by connecting a plurality of bumps formed on one main surface with a fine pitch to the corresponding conductive terminals, each bump is accurately connected to the corresponding conductive terminal. Hard to do. This is also the case when the semiconductor chip is temporarily attached to the inspection substrate for inspection.

It is an object of the present invention to provide a technique capable of reducing the cost when a plurality of electrodes formed on a semiconductor chip with a fine pitch are drawn to the outside.

Another object of the present invention is to provide a technique capable of accurately connecting each electrode to a corresponding conductive terminal when a plurality of electrodes formed at a fine pitch on a semiconductor chip are drawn to the outside. is there.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0019]

Among the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

(1) The wiring board for a semiconductor device of the present invention comprises:
A wiring board for a semiconductor device for supporting a semiconductor chip in which a plurality of electrodes are arranged at a predetermined pitch on one main surface, wherein the plurality of electrodes are provided on one main surface corresponding to the one main surface of the semiconductor chip. A plurality of conductive terminals are formed at a pitch substantially equal to the arrangement pitch, and a plurality of conductive terminals are formed on the other main surface opposite to the one main surface so as to be electrically connected to the plurality of conductive terminals and at a predetermined pitch. It consists of an insulating substrate. As the insulating substrate, a material having elasticity is used, for example.

(2) In the method of manufacturing a wiring board for a semiconductor device of the present invention, a step of stacking a pair of mask plates in which a plurality of through holes are formed at equal pitches so that the positions of the through holes coincide with each other, A step of inserting a conductive wire into each corresponding through hole of the pair of mask plates; a step of separating the pair of mask plates while keeping the conductive wires taut.
A step of binding the conductive wires between the pair of mask plates, a step of embedding at least the conductive wires between the pair of mask plates in an insulator, and an insulator in which the conductive wires are embedded as a conductive wire. Cutting with a predetermined width so as to traverse.

(3) In another method of manufacturing a wiring board for a semiconductor device of the present invention, a step of arranging a pair of mask plates in which a plurality of through holes are formed in parallel at different pitches in parallel, and the pair of mask plates. A step of inserting a conductive wire into each corresponding through hole, and a step of burying at least a conductive wire between the pair of mask plates in an insulator while keeping the conductive wire tensioned in the pair of mask plates; Cutting the insulator having the conductive wire embedded therein with a predetermined width so as to traverse the conductive wire.

[0023]

According to the above-mentioned means (1), the semiconductor device wiring board of the present invention is a semiconductor device wiring for supporting a semiconductor chip in which a plurality of electrodes are arranged on one main surface at a predetermined pitch. In the substrate, a plurality of conductive terminals are formed on one main surface corresponding to one main surface of the semiconductor chip at a pitch substantially equal to the arrangement pitch of the plurality of electrodes, and another conductive terminal on the opposite side to the one main surface. Since it is composed of, for example, an elastic insulating substrate having a plurality of conductive terminals formed on the main surface and electrically connected to the plurality of conductive terminals at a predetermined pitch, a plurality of electrodes formed on the semiconductor chip with a fine pitch are drawn to the outside. In this case, the cost can be reduced and each electrode can be accurately connected to the corresponding conductive terminal.

According to the above-mentioned means (2), in the method for manufacturing a wiring board for a semiconductor device of the present invention, a pair of mask plates having a plurality of through holes formed at equal pitches are used. A step of overlapping so as to match, a step of inserting a conductive wire into each corresponding through hole of the pair of mask plates, a step of separating the pair of mask plates while keeping the conductive wires tensioned, A step of binding the conductive wires between the mask plates, a step of embedding at least the conductive wires between the pair of mask plates in an insulator, and an insulator in which the conductive wires are embedded so as to traverse the conductive wires. Since it includes a step of cutting with a predetermined width, when pulling out a plurality of electrodes formed at a fine pitch on the semiconductor chip to the outside, it is possible to reduce the cost,
Moreover, it becomes possible to connect each electrode to the corresponding conductive terminal accurately.

According to the above-described means (3), in another method of manufacturing a wiring board for a semiconductor device of the present invention, a pair of mask plates having a plurality of through holes formed at mutually different pitches are arranged in parallel. A step of inserting a conductive wire into each corresponding through hole of the pair of mask plates, and a conductive wire between at least the pair of mask plates with the conductive wire being tensioned in the pair of mask plates. Since the method includes a step of burying in the insulator and a step of cutting the insulator in which the conductive wire is embedded with a predetermined width so as to traverse the conductive wire, a plurality of electrodes formed at a fine pitch on the semiconductor chip. When it is drawn out, the cost can be reduced, and each electrode can be accurately connected to the corresponding conductive terminal.

Hereinafter, the present invention will be described in detail with reference to the drawings together with embodiments.

In all the drawings for explaining the embodiments, those having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

[0028]

【Example】

(Embodiment 1) FIG. 1 is a plan view showing a wiring board for a semiconductor device according to Embodiment 1 of the present invention, and FIG. 2 is a sectional view taken along line AA of FIG. The wiring board 1 for a semiconductor device of the present embodiment is composed of an insulating substrate 2 having elasticity such as silicone rubber, and a plurality of conductive layers 3 such as Cu and Au are provided inside the insulating substrate 2 in the thickness direction. Are formed so as to be inclined, and conductive terminals 3A and 3B of each conductive layer 3 are formed on one main surface and the other main surface of the insulating substrate 2. Alternatively, the insulating substrate 2 can be made of a relatively hard material such as various resins or glass epoxy. Insulating substrates such as these silicone rubbers, various resins, and glass epoxies are considerably cheaper than ceramics which have been widely used in the past.

The conductive terminals 3A on one main surface of the insulating substrate 2 are formed at a pitch substantially equal to the arrangement pitch of a plurality of electrodes formed on the semiconductor chip to be supported by the wiring substrate 1, as described later. There is. On the other hand, the conductive terminal 3B which is electrically connected to the conductive terminal 3A on the other main surface of the insulating substrate 2 is
It is formed to have a pitch larger than the arrangement pitch of the conductive terminals 3A. Accordingly, when a plurality of electrodes formed on the semiconductor chip at a fine pitch are electrically pulled out, it is possible to pull out the electrodes at an enlarged pitch.

The conductive terminals 3A and 3B of the conductive layers 3 formed on the one main surface and the other main surface of the insulating substrate 2 are made of Ni, A, respectively.
It is composed of a metallized layer such as u. As the metallized layer, as will be described later, a material is selected so that the bumps, which are the electrodes of the semiconductor chip, easily wet.

Next, with reference to FIGS. 3 to 7, a method of manufacturing the semiconductor device wiring board of this embodiment will be described in the order of steps.

First, as shown in FIG. 3, a pair of mask plates 5 made of a material such as metal or glass is prepared.
It is assumed that a plurality of through holes 6 are formed in each mask plate 5 in advance at the same pitch.

Next, as shown in FIG. 4, a pair of mask plates 5 are stacked so that the positions of the corresponding through holes 6 are aligned with each other, and then a plurality of holes such as Cu and Au are placed in each through hole 6. The conductive wire 7 is inserted. This conductive wire 7 will be used later as the conductive layer 3 as described above.

Subsequently, as shown in FIG. 5, the pair of mask plates 5 are separated in parallel while the conductive wires 7 inserted into the through holes 6 are kept in tension to form a space region 8 therebetween. To do. Since the through holes 6 of the mask plate 5 are formed at the same pitch, the conductive wires 7 are stretched in parallel.

Next, as shown in FIG. 6, a plurality of conductive wires 7 in the space region 8 are bound from the periphery by another wire 9 to be bound at one point. Thereby, each conductive wire 7
Is in a state of being stretched radially from one point to the surroundings. Subsequently, the mask plate 5 and the conductive wire 7 are insulated from each other by supplying an insulator 10 such as an epoxy resin in a fluid state from the periphery of the pair of mask plates 5 and the conductive wire 7 to cure the mask plate 5 and the conductive wire 7. It is buried in 10.

Next, as shown by the broken line in FIG. 6, the insulator 10 between the pair of mask plates 5 is cut with a predetermined width c so as to be substantially parallel to the pair of mask plates 5 and across each conductive wire 7. By doing so, as shown in FIG. 7, the insulating substrate 2 having a predetermined thickness c is obtained. A plurality of conductive layers 3 are wired in the insulating substrate 2, and end portions are exposed on one main surface and the other main surface of the insulating substrate 2.

Subsequently, a metallized layer such as Ni or Au is formed on each end of the conductive layer 3 by plating or the like to form the conductive terminals 3A and 3B. A wiring board 1 having a structure as shown in is obtained.

In the wiring board 1 thus formed, as shown in FIGS. 5 and 7, the distance a between the pair of mask plates 5 and the distance b between the conductive wires 7 at the outermost ends are adjusted. Therefore, or by adjusting the thickness c, the ratio of the pitch of the conductive terminals 3A on one main surface to the pitch of the conductive terminals 3B on the other main surface, that is, the so-called convergence rate can be changed.

Next, another method of manufacturing the wiring board of this embodiment will be described in the order of steps with reference to FIGS.

First, as shown in FIG. 8, a pair of mask plates 5 made of a material such as metal or glass is prepared and arranged in parallel with a space region 9 interposed therebetween. Each mask board 5
In this case, a plurality of through holes 6 are formed in advance at mutually different pitches.

Next, as shown in FIG. 9, a plurality of conductive wires 7 such as Cu and Au are inserted into the corresponding through holes 6 of the pair of mask plates 5. Since the through holes 6 of each mask plate 5 are formed at different pitches, each conductive wire 7 is stretched and stretched. This conductive wire 7
Will be used later as the conductive layer 3 as described above.

Then, as shown in FIG. 10, each through hole 6
While the conductive wires 7 inserted into the elastic member 10 are kept taut, an insulating material 10 such as an epoxy resin is supplied in a fluid state from the periphery of the pair of mask plates 5 and the conductive wires 7 to cure the insulating wires 10. Mask plate 5 and conductive wire 7
Are embedded in the insulator 10.

Next, as shown by a broken line in FIG. 10, the insulator 10 between the pair of mask plates 5 is cut with a predetermined width c so as to cross the conductive wires 7 substantially in parallel with the pair of mask plates 5. By doing so, as shown in FIG. 11, an insulating substrate 2 having a predetermined thickness c is obtained. A plurality of conductive layers 3 are wired in the insulating substrate 2, and end portions are exposed on one main surface and the other main surface of the insulating substrate 2.

Then, a metallized layer such as Ni or Au is formed on each end of the conductive layer 3 by plating or the like to form the conductive terminals 3A and 3B. A wiring board 1 having a structure as shown in is obtained.

In the wiring board 1 thus formed, as shown in FIG. 8, the convergence rate can be changed by adjusting the distance a or the thickness c between the pair of mask plates 5.

FIG. 12 is a sectional view showing an example of use of the wiring board 1 according to this embodiment. The wiring board 1 is arranged between a semiconductor chip 12 made of an LSI and a mounting board 13.
On one main surface of the semiconductor chip 12, for example, solder (Pb-
A plurality of electrodes 14 made of bumps such as Sn alloy) are arranged at a fine pitch. On the other hand, a plurality of conductive terminals 15 are arranged on one main surface of the mounting substrate 13 at a pitch larger than the pitch of the electrodes 14. The conductive terminal 15 is made of Ni, like the conductive terminals 3A and 3B of the wiring board 1.
It is composed of a metallized layer such as Au.

The electrodes 14 of the corresponding semiconductor chip 12 are connected to the plurality of conductive terminals 3A having a pitch substantially equal to the arrangement pitch of the plurality of electrodes 14 of the semiconductor chip 12 on the one main surface of the wiring board 1. On the other hand, the conductive terminals 15 of the mounting board 13 are connected to the plurality of conductive terminals 3B having a pitch larger than the arrangement pitch of the electrodes 14 on the other main surface of the wiring board 1 by the solder 18.

As an example, one main surface of the semiconductor chip 12 having an area of about 10 mm × 10 mm has a diameter of about 0.15.
A plurality of 0.2 mm electrodes 14 are formed at a pitch of about 0.3 mm, and a plurality of conductive layers 3 having a diameter of about 0.05 to 0.15 mm are provided inside the wiring board 1 having a thickness of about 1 to 2 mm. Are formed. The plurality of conductive terminals 3A on one main surface of the wiring board 1 are formed with a pitch of about 0.3 mm, and the plurality of conductive terminals 3B on the other main surface are formed with a value larger than 0.3 mm, which is a convergence rate. Determined by

FIG. 13 is a sectional view showing another example of use of the wiring board 1 according to this embodiment. The wiring board 1 is arranged between the semiconductor chip 12 made of LSI and the inspection board 16. A plurality of electrodes 14 made of bumps such as solder (Pb—Sn alloy) are arranged at a fine pitch on one main surface of the semiconductor chip 12, and a plurality of electrodes 14 are provided on one main surface of the inspection substrate 16. The conductive terminal 17 of the electrode 1
They are arranged at a pitch larger than the arrangement pitch of No. 4.
Like the conductive terminals 3A and 3B of the wiring board 1, the conductive terminal 17 is composed of a metallized layer such as Ni or Au.

The electrodes 14 of the corresponding semiconductor chip 12 are temporarily attached to the plurality of conductive terminals 3A having a pitch substantially equal to the arrangement pitch of the plurality of electrodes 14 of the semiconductor chip 12 on one main surface of the wiring board 1. On the other hand, the conductive terminals 17 of the corresponding mounting board 16 are temporarily attached to the plurality of conductive terminals 3B having a pitch larger than the arrangement pitch of the electrodes 14 on the other main surface of the wiring board 1 by the solder 18.

An inspection device is connected to a measurement terminal (not shown) that is electrically connected to the conductive terminal 17 of the inspection board 16 to inspect the semiconductor chip 12 for a good product and a defective product. After the inspection is completed, the wiring board 1 is removed from the temporary attachment portion with the semiconductor chip 12 and the inspection board 16. Then, only the good semiconductor chips 12 are mounted on the mounting substrate 13 as shown in FIG.

According to this embodiment, the following effects can be obtained.

(1) Since the wiring board 1 can be formed of an inexpensive material without using expensive ceramics, the cost can be reduced when the plurality of electrodes 14 formed on the semiconductor chip 12 at a fine pitch are drawn to the outside. It becomes possible.

(2) A wiring board 1 having conductive terminals 3B formed on the other main surface at a pitch larger than the pitch of the conductive terminals 3A formed on one main surface is prepared, and the conductive terminals 3B having this large pitch are mounted on the mounting board. The semiconductor chip 12 is mounted by connecting to the corresponding conductive terminals 15 of the semiconductor chip 12.
When a plurality of electrodes 14 formed with a fine pitch are drawn to the outside, each electrode 14 can be drawn at an enlarged pitch.
Can be accurately connected to the corresponding conductive terminal 15.

(3) Since the wiring board 1 can be made of a material having elasticity, stress applied to the electrodes 14 such as bumps in chip bonding can be reduced.

(4) A wiring board 1 having conductive terminals 3B formed on the other main surface at a pitch larger than the pitch of the conductive terminals 3A formed on one main surface is prepared, and the conductive terminals 3B having this large pitch are used for inspection. Since the semiconductor chip 12 is inspected by temporarily attaching it to the corresponding conductive terminals 17 of the substrate 16, the plurality of electrodes 1
Since 4 can be pulled out to the outside at a pitch enlarged, accurate inspection can be easily performed.

(5) It is possible to manufacture the wiring board 1 in which the electrodes 14 having a fine pitch can be expanded to the outside and taken out by a simple process without any special process.

(Embodiment 2) FIG. 14 is a cross-sectional view showing a semiconductor device wiring board according to a second embodiment of the present invention. In the wiring board 1 of the first embodiment, in particular, the conductive terminals 3B on the other main surface are connected to the short lead 19. It shows an example formed in the shape of.

According to the second embodiment as well, since the conductive terminals 3B are formed on the other main surface at a pitch larger than the pitch of the conductive terminals 3A formed on the one main surface, the same effect as that of the first embodiment is obtained. Obtainable. In addition to this, by forming the conductive terminal 3B on the other main surface in the form of the short lead 19, when connecting to the corresponding conductive terminal of the mounting substrate 13 or the inspection substrate 16, the spread of solder is suppressed. Therefore, it is possible to obtain an effect that accurate connection can be made even to a conductive terminal having a relatively complicated pattern.

(Embodiment 3) FIG. 15 is a sectional view showing a wiring board for a semiconductor device according to Embodiment 3 of the present invention. The pitch of the conductive terminals 3A on one main surface and the pitch of the conductive terminals 3B on the other main surface are almost the same. The wiring board 1 is formed in the same manner and is formed by expanding only the conductive terminals 3B on the other main surface in the circumferential direction.

Also in the third embodiment, since the conductive terminals 3B on the other main surface of the wiring board 1 are formed so as to be widened in the peripheral direction, they are connected to the corresponding conductive terminals of the mounting board 13 or the inspection board 16. If you do, it will be easier to connect,
The effect according to Example 1 can be obtained.

(Embodiment 4) FIG. 16 is a sectional view showing a wiring board for a semiconductor device according to Embodiment 4 of the present invention, in which conductive terminals 3A, 3B on one main surface or the other main surface are adjacent to each other as required. 1 shows a wiring board 1 formed so as to short-circuit each other.

Also according to the fourth embodiment as described above, the conductive terminals 3 on one main surface or the other main surface of the wiring board 1 are used as required.
Since adjacent ones of A and 3B are short-circuited, when connecting to the corresponding conductive terminals of the mounting board 13 or the inspection board 16, the conductive terminals of a relatively complicated pattern can be bypassed. Since the connection is easy, the effect according to the first embodiment can be obtained.

As described above, the invention made by the present inventor is
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, in the above-mentioned embodiment, the material of the wiring board has been described as an example, but it is not limited to this as long as it has an equivalent function, and other materials may be used. good.

The semiconductor chip to be connected to the wiring board has been described with an example having bump electrodes. However, the present invention is not limited to this, and any semiconductor chip in which electrodes are formed at a fine pitch can be similarly applied. You can

Furthermore, the number of conductive layers formed on the wiring board in the examples is an example, and similarly, the dimensions of the constituent portions shown in the examples are examples. These can be arbitrarily selected according to the purpose, use, etc.

The semiconductor device wiring board according to the first embodiment shown in FIG. 2 has the conductive terminals 3 as shown in FIG.
A and 3B may be omitted.

In the above description, the case where the invention made by the present inventor is mainly applied to the technology of the semiconductor integrated circuit device which is the background field of application has been described, but the invention is not limited thereto. The present invention can be applied to at least a plurality of electrodes arranged at a minute pitch on one main surface of a semiconductor chip to the outside at an enlarged pitch.

[0070]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) Since the wiring board can be made of an inexpensive material without using expensive ceramics, it is possible to reduce the cost when a plurality of electrodes formed on the semiconductor chip with a fine pitch are drawn out. Becomes

(2) A wiring board having conductive terminals formed on the other main surface at a pitch larger than the pitch of the conductive terminals formed on one main surface is prepared, and the conductive terminals having the large pitch are used as the corresponding conductive materials on the mounting board. Since the semiconductor chip is mounted by connecting to the terminals, when drawing out multiple electrodes formed on the semiconductor chip with a fine pitch to the outside, it is possible to draw out at an enlarged pitch, so each electrode can be connected to the corresponding conductive terminal accurately. It will be possible.

[Brief description of drawings]

FIG. 1 is a plan view showing a wiring board for a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a perspective view showing a step of the method of manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another step of the method for manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing another step of the method for manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 6 is a cross-sectional view showing another step of the method for manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 7 is a cross-sectional view showing another step of the method for manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a step of another method of manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 9 is a cross-sectional view showing another step of the other method for manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 10 is a cross-sectional view showing another step of the other method for manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 11 is a cross-sectional view showing another step of the other method for manufacturing the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 12 is a cross-sectional view showing an example of use of the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 13 is a cross-sectional view showing another usage example of the semiconductor device wiring board according to the first embodiment of the present invention.

FIG. 14 is a sectional view showing a wiring board for a semiconductor device according to a second embodiment of the present invention.

FIG. 15 is a sectional view showing a wiring board for a semiconductor device according to a third embodiment of the present invention.

FIG. 16 is a sectional view showing a semiconductor device wiring board according to a fourth embodiment of the present invention.

FIG. 17 is a cross-sectional view showing a modified example of the semiconductor device wiring board according to the first embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wiring board for semiconductor devices, 2 ... Insulating board, 3 ... Conductive layer, 3A ... Conductive terminal on one main surface, 3B ... Conductive terminal on other main surface, 5 ... Mask plate, 6 ... Through hole, 7 ... Conductivity Wire, 8
... space area, 9 ... another wire, 10 ... insulator, 12 ... semiconductor chip, 13 ... mounting board, 14 ... semiconductor chip electrode, 15 ... mounting board conductive terminal, 16 ... inspection board, 1
7 ... Terminal of inspection board, 18 ... Solder, 19 ... Short lead.

Claims (8)

[Claims] 1. A wiring board for a semiconductor device for supporting a semiconductor chip in which a plurality of electrodes are arranged at a predetermined pitch on one main surface, the one main surface corresponding to the one main surface of the semiconductor chip. A plurality of conductive terminals are formed at a pitch substantially equal to the arrangement pitch of the plurality of electrodes, and a plurality of conductive terminals are formed on the other main surface on the opposite side of the one main surface to the plurality of conductive terminals and at a predetermined pitch. A wiring board for a semiconductor device, comprising an insulating substrate on which terminals are formed. 2. The wiring board for a semiconductor device according to claim 1, wherein the insulating substrate is made of a material having elasticity. 3. The wiring board for a semiconductor device according to claim 1, wherein the predetermined pitch is larger than an arrangement pitch of the plurality of electrodes. 4. The conductive terminal formed on the one main surface and the conductive terminal formed on the other main surface are electrically connected to each other through a conductive layer formed inside an insulating substrate. 4. The wiring board for a semiconductor device according to any one of 1 to 3. 5. A plurality of conductive terminals on the one main surface are connected to corresponding electrodes on a semiconductor chip, and a plurality of conductive terminals on the other main surface are connected to corresponding conductive terminals on a mounting board. The wiring board for a semiconductor device according to claim 1, wherein the wiring board is for a semiconductor device. 6. A plurality of conductive terminals on the one main surface are temporarily attached to a plurality of corresponding electrodes of a semiconductor chip, and a plurality of conductive terminals on the other main surface are temporarily attached to a corresponding conductive terminal of an inspection board. The wiring board for a semiconductor device according to claim 1, which is attached. 7. A step of stacking a pair of mask plates in which a plurality of through holes are formed at equal pitches so that the positions of the through holes are aligned with each other, and the corresponding through holes of the pair of mask plates are electrically conductive. A step of inserting a wire; a step of separating the pair of mask plates while keeping the conductive wires taut; a step of binding the conductive wires between the pair of mask plates; and a conduction between at least the pair of mask plates. Of a conductive wire embedded in an insulator, and a step of cutting the insulator in which the conductive wire is embedded with a predetermined width so as to cross the conductive wire. Method. 8. A step of arranging a pair of mask plates in which a plurality of through holes are formed at mutually different pitches in parallel, and a step of inserting a conductive wire into each corresponding through hole of the pair of mask plates, A step of embedding at least the conductive wire between the pair of mask plates in an insulator while the conductive wire is tensioned in the pair of mask plates; and crossing the conductive wire through the insulator in which the conductive wire is embedded. And a step of cutting the wiring board to a predetermined width.