TW202146904A - Thin-film probe card with cantilever type - Google Patents

Abstract

The present invention provides a thin-film probe card with cantilever type. The thin-film probe card includes a carrier, a supporting layer, and a thin-film sheet. The carrier has a hole. The supporting layer includes a supporting segment disposed on the carrier and a plurality of independently elastic segments that are spacedly extending from the supporting segment and that are hanging over the hole. The thin-film sheet includes a carrying layer, a plurality of signal circuits, and a plurality of conductive protrusions. The carrying layer has an externally connecting segment, a plurality of active segments respectively formed on the independently elastic segments, and an extension segment that connects the externally connecting segment and the active segments. A portion of the extension segment is fixed on the supporting layer. The signal circuits are disposed on the carrying layer, and respectively extend from the active segments toward the externally connecting segment. The conductive protrusions are respectively formed on portions of the signal circuits that are located on the active segments.

Description

Cantilever Thin Film Probe Card

The present invention relates to a probe card, in particular to a cantilever type thin film probe card.

The existing cantilever probe card is mainly used in the test of peripheral wafers, but the needle implantation method of the existing cantilever probe card is relatively complicated (such as artificial soldering needles), and the circuit fan-out design (fan-out) is required. ). Accordingly, the existing cantilever probe card is not easy to maintain, thereby making it difficult to reduce production and maintenance costs.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiment of the present invention is to provide a cantilever type thin film probe card, which can effectively improve the defects that may occur in the existing cantilever type probe card.

An embodiment of the present invention discloses a cantilever type thin film probe card, which includes: a carrier including a first surface and a second surface on opposite sides, and the carrier is recessed from the first surface to form an opening a hole; a support layer, comprising a support section mounted on the first surface and a plurality of independent elastic sections extending from the support section at intervals; wherein the plurality of independent elastic sections are suspended from the opening one side of the hole; and a film sheet, including: a bearing layer, defining a circumscribed segment, a plurality of actuation segments respectively formed on a plurality of the independent elastic segments, and connecting the circumscribed segment and a plurality of the an extension of the actuating segment; wherein a part of the extending segment is fixed to the support layer; a plurality of signal lines are arranged on the bearing layer and extend from the plurality of actuating segments toward the outer segment respectively. and a plurality of conductive bumps, respectively formed at the positions of a plurality of the signal lines located in the plurality of the actuating segments; wherein, when any one of the conductive bumps is pressed, the corresponding signal The line and the corresponding actuating segment can be elastically bent and deformed toward the opening through the corresponding independent elastic segment.

To sum up, the cantilever type thin film probe card disclosed in the embodiments of the present invention adopts the structural design of the carrier, the support layer, and the thin film sheet, so that the cantilever type thin film probe card has the existing Cantilever probe function, which facilitates production and maintenance and replacement, and effectively reduces production and maintenance costs.

Furthermore, in the cantilevered thin-film probe card disclosed in the embodiment of the present invention, when any one of the conductive bumps is pressed, only the corresponding signal line and the actuating section can be pressed against the corresponding one of the conductive bumps. The cantilevered thin-film probe card can reduce the linkage between the plurality of the conductive bumps, so that the force of the plurality of the conductive bumps is more uniform and can be pressed more stably A plurality of metal pads on the DUT (eg, peripheral chip).

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

The following are specific specific examples to illustrate the embodiments of the "cantilever type thin film probe card" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Example 1]

Referring to FIGS. 1 to 10 , the present embodiment discloses a cantilever type thin film probe card 100 , which can detect an object to be tested, such as a peripheral chip (not shown). As shown in FIG. 1 and FIG. 2 , the cantilevered thin-film probe card 100 includes a carrier 1 , a plurality of support layers 2 disposed on the carrier 1 , and a plurality of the support layers 2 mounted on the carrier 1 . A plurality of thin film sheets 3 , and a circuit board 4 electrically coupled to the plurality of thin film sheets 3 . The cantilevered thin film probe card 100 is described in this embodiment by including the above elements, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the cantilever-type thin-film probe card 100 may not include the circuit board 4 when it is used (eg, sold); The number of the supporting layers 2 and the number of the thin film sheets 3 of the thin film probe card 100 may be single.

As shown in FIG. 1 to FIG. 3 , the carrier 1 is generally plate-shaped in this embodiment, and is preferably made of a hard material (eg, metal or plastic); that is, the carrier 1 preferably does not have Elasticity, but the invention is not limited to this. The carrier 1 includes a first surface 11 and a second surface 12 on opposite sides, and an opening 13 is formed concavely from the first surface 11 of the carrier 1 . Wherein, the opening 13 is formed from the first surface 11 of the carrier 1 (along a height direction H) to the second surface 12 in the present embodiment, but this is not the case in the present invention limit. For example, in other embodiments not shown in the present invention, the openings 13 may also be blind holes.

A plurality of the support layers 2 are arranged on the first surface 11 of the carrier 1 in a surrounding manner, and the plurality of the support layers 2 are arranged separately from each other in this embodiment, but the present invention is not limited thereto . For example, as shown in FIG. 4 , a plurality of parts of the support layer 2 abutting on the first surface 11 (eg, the following support segments 21 ) may also be integrally connected annular structures, so that the The number of the supporting layers 2 shown in 4 is single. In addition, since the structures of the plurality of supporting layers 2 in this embodiment are substantially the same, for the convenience of description, only the structure of a single supporting layer 2 in this embodiment is described below.

As shown in FIGS. 3 and 5 , the support layer 2 includes a support segment 21 mounted on the first surface 11 and a plurality of independent elastic segments 22 extending from the support segment 21 at intervals. In this embodiment, the support section 21 is disposed (or fixed) on the first surface 11, and a plurality of the independent elastic sections 22 are formed by extending from the inner edge of the support section 21, so that multiple Each of the independent elastic segments 22 is suspended from one side of the opening 13 of the carrier 1 .

In more detail, as shown in FIG. 6 and FIG. 7 , the support segment 21 and the plurality of independent elastic segments 22 may be arranged in a coplanar manner, but the present invention is not limited thereto. For example, as shown in FIG. 8 , each of the independent elastic segments 22 may also be formed into a stepped structure in the direction away from the opening 13 (or the carrier 1 ), so that each of the independent elastic segments 22 and the support section 21 have a difference in the height direction H.

In addition, on the premise that the support layer 2 can provide elasticity to any of the independent elastic segments 22, the material of the support layer 2 can be adjusted according to design requirements, for example, the support layer 2 can be metal or non-metallic Metal, the present invention is not limited here.

A plurality of the film sheets 3 are respectively disposed on the plurality of the support layers 2, and the plurality of the film sheets 3 are arranged separately from each other in this embodiment, but the present invention is not limited thereto. For example, as shown in FIG. 4 , the parts of the film sheets 3 (eg, the first part 3131 of the carrier layer 31 described below) respectively abutting against the plurality of the support layers 2 may also be integrally connected. According to the annular structure, the number of the film sheets 3 shown in FIG. 4 is single. In addition, since the structures of the plurality of film sheets 3 in this embodiment are substantially the same, for the convenience of description, only the structure of a single film sheet 3 and the corresponding support layer 2 of this embodiment are described below. connection between.

As shown in FIG. 3 and FIG. 6 , the film sheet 3 includes a carrier layer 31 , a plurality of signal lines 32 disposed on the carrier layer 31 , and a plurality of conductive lines respectively connected to the plurality of signal lines 32 . Bump 33 . The bearing layer 31 defines a circumscribing section 311 and a plurality of actuating sections 312 respectively formed on the plurality of independent elastic sections 22 (that is, the plurality of actuating sections 312 are suspended from one of the openings 13 . side), and an extension section 313 partially fixed to the support layer 2 and connecting the external section 311 and a plurality of the actuating sections 312 .

Wherein, the extension section 313 includes a first portion 3131 fixed on the support layer 2 and a second portion 3132 over the carrier 1 , so that the outer portion 311 is disposed on all parts of the carrier 1 . The second surface 12 is described. Further, the extension section 313 is connected to the first section 3131 by bending the second section 3132, so that the extension section 313 can bypass the carrier 1, and the circumscribed section 311 can be connected to the first section 3131. Each of the actuating segments 312 is respectively disposed on opposite sides of the carrier 1 .

In this embodiment, the first part 3131 and the second part 3132 are connected substantially vertically, and the first part 3131 is perpendicular to the height direction H, and the second part 3132 is parallel to the In the height direction H, the first portion 3131 of the extending section 313 is staggered from the outer section 311 along the height direction H, but the invention is not limited to this.

In addition, a plurality of the actuating segments 312 are spaced apart from each other, and the contour of each of the actuating segments 312 is preferably aligned along the height direction H or retracted to the contour of the corresponding independent elastic segment 22 , so that each of the actuating segments 312 can be supported by the corresponding independent elastic segments 22 , but the present invention is not limited thereto.

A plurality of the signal lines 32 are disposed on the carrier layer 31 and are respectively formed by extending from the plurality of the actuating segments 312 toward the outer segment 311 . Wherein, the signal line 32 may extend from the corresponding actuating section 312 to the outer section 311, or extend from the corresponding actuating section 312 to the extending section 313, which is not discussed in the present invention. be restricted. It should be additionally noted that the carrier layer 31 and each of the signal lines 32 are each described as a single-layer structure in this embodiment, but in other embodiments not shown in the present invention, the carrier layer 31 and each of the signal lines 32 may also be of a multi-layer structure, so as to cooperate with each other to facilitate the formation of a signal fan-out structure.

A plurality of the conductive bumps 33 are respectively formed at the positions of the plurality of the signal lines 32 located on the plurality of the actuating segments 312; that is, the plurality of the conductive bumps 33 are suspended from the openings. one side of the hole 13. Wherein, any one of the conductive bumps 33 is integrally formed with the corresponding signal line 32 in FIG. 7 of this embodiment, and has a truncated cone-shaped structure, but the present invention is not limited thereto. For example, as shown in FIG. 9 , each of the conductive bumps 33 is a multi-layered structure (eg, a multi-layered structure composed of two truncated cone-shaped structures stacked on each other), and each of the conductive bumps 33 is a multi-layered structure. The cross-sectional area of the bump 33 gradually decreases in the direction away from the opening 13 .

In addition, as shown in FIG. 3 and FIG. 6 , the part of the film sheet 3 corresponding to the external segment 311 (eg, any part of the signal line 32 on the external segment 311 ) is installed on the the circuit board 4. Wherein, the installation method between the film sheet 3 (a part of the signal line 32 ) and the circuit board 4 may be, for example, welding or pressing connection, so that the film sheet 3 and the circuit board 4 can be connected with each other. They are electrically coupled to each other, but the invention is not limited herein.

According to the above, as shown in FIG. 10 , when (the cantilevered thin film probe card 100 is used to detect peripheral wafers, so that) any one of the conductive bumps 33 is pressed, the corresponding The signal line 32 and the corresponding actuating segment 312 can be elastically bent and deformed toward the opening 13 through the corresponding independent elastic segment 22 . Accordingly, the cantilevered thin-film probe card 100 can reduce the linkage between the plurality of the conductive bumps 33, so that the plurality of the conductive bumps 33 are subjected to a relatively uniform force and can be stably supported. A number of metal pads (not shown) against the perimeter die. Further, the cantilevered thin-film probe card 100 can also make its test area (or the distribution range of the plurality of conductive bumps 33 ) wider.

[Example 2]

Please refer to FIG. 11 , which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned embodiments, so the similarities between these embodiments will not be repeated, and the differences between this embodiment and the above-mentioned embodiments will not be repeated. The general description is as follows:

In this embodiment, the carrier layer 31 is illustrated in a multi-layer structure, which includes an insulating layer 31a and a conductive layer 31b formed on the insulating layer. The insulating layer 31a separates the conductive layer 31b from the plurality of signal lines 32, and the conductive layer 31b (which can be electrically coupled through the conductive pillars 31c embedded in the insulating layer 31a) at least one of the signal lines 32 among the plurality of the signal lines 32 .

[Example 3]

Please refer to FIG. 12 and FIG. 13 , which are Embodiment 3 of the present invention. This embodiment is similar to the above-mentioned embodiments, so the same parts of these embodiments will not be repeated, and this embodiment is compared with the above-mentioned embodiments. The differences are roughly explained as follows:

In this embodiment, the support layer 2 is formed with a through hole 211 in the support section 21 , and the cantilevered thin film probe card 100 further includes an electronic component 6 (eg, an electronic device 6 ) disposed in the through hole 211 . : impedance adjustment element), and the electronic element 6 is electrically coupled to at least one of the signal lines 32 of the plurality of signal lines 32 .

Further, any one of the signal lines 32 electrically coupled to the electronic component 6 may extend from the corresponding actuating section 312 to the extending section 313 and be located in the extending section 313 The portion of the signal line 32 is connected to the electronic component 6, but the present invention is not limited to this.

[Example 4]

Please refer to FIG. 14 , which is the fourth embodiment of the present invention. This embodiment is similar to the above-mentioned embodiments, so the similarities between these embodiments will not be repeated, and the differences between this embodiment and the above-mentioned embodiments will not be repeated. The general description is as follows:

In this embodiment, the cantilevered thin-film probe card 100 further includes an electrical connection structure 5 connected to the circuit board 4 and corresponding to the portion of the thin-film sheet 3 of the external segment 311 (eg, : any one of the signal lines 32 located on the external segment 311 ) is electrically coupled to the circuit board 4 through the electrical connection structure 5 . Wherein, the electrical connection structure 5 can be, for example, a connector or a spring, so that the film sheet 3 and the circuit board 4 can be electrically coupled to each other, but the invention is not limited herein.

In more detail, the first portion 3131 and the second portion 3132 are connected substantially perpendicularly, and the first portion 3131 is perpendicular to the height direction H, and the second portion 3132 is parallel to the height direction H, and the first part 3131 of the extension section 313 corresponds to the outer section 311 along the height direction H, thereby reducing the overall size of the cantilever type thin film probe card 100, but The present invention is not limited to this.

[Example 5]

Please refer to FIG. 15 , which is Embodiment 5 of the present invention. This embodiment is similar to the above-mentioned embodiments, so the similarities between these embodiments will not be repeated, and the differences between this embodiment and the above-mentioned embodiments will not be repeated. The general description is as follows:

In this embodiment, the cantilever type thin film probe card 100 can use two thin film sheets 3 facing each other, and the plurality of the actuating segments 312 of the two thin film sheets 3 cross each other, so that the two A plurality of the conductive bumps 33 of each of the thin film sheets 3 are arranged along a straight line direction perpendicular to the height direction.

[Technical effects of the embodiments of the present invention]

To sum up, the cantilever type thin film probe card disclosed in the embodiments of the present invention adopts the structural design of the carrier, the support layer, and the thin film sheet, so that the cantilever type thin film probe card has the existing The function of the cantilever probe is convenient for production and maintenance and replacement, and effectively reduces production and maintenance costs.

Furthermore, in the cantilevered thin-film probe card disclosed in the embodiment of the present invention, when any one of the conductive bumps is pressed, only the corresponding signal line and the actuating section can be pressed against the corresponding one of the conductive bumps. The cantilevered thin-film probe card can reduce the linkage between the plurality of the conductive bumps, so that the force of the plurality of the conductive bumps is more uniform and can be pressed more stably A plurality of metal pads on the DUT (eg, peripheral chip).

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Cantilever Thin Film Probe Card 1: carrier 11: The first surface 12: Second surface 13: Opening 2: support layer 21: Support segment 211: Through hole 22: Independent elastic segment 3: film sheet 31: Bearing layer 311: External segment 312: Action Section 313: Extension 3131: The first part 3132: Part II 31a: insulating layer 31b: Conductive layer 31c: Conductive pillar 32: Signal line 33: Conductive bumps 4: circuit board 5: Electrical connection structure 6: Electronic components H: height direction

FIG. 1 is a three-dimensional schematic diagram of a cantilevered thin-film probe card according to Embodiment 1 of the present invention.

FIG. 2 is a schematic perspective view of FIG. 1 from another perspective (the circuit board is omitted).

FIG. 3 is a partial exploded schematic view of FIG. 1 .

FIG. 4 is a schematic diagram of another aspect of FIG. 3 .

FIG. 5 is a schematic top view of FIG. 1 .

FIG. 6 is a schematic cross-sectional view taken along section line VI-VI of FIG. 1 .

FIG. 7 is an enlarged schematic view of part VII of FIG. 6 .

FIG. 8 is a schematic diagram of another aspect of FIG. 7 .

FIG. 9 is a schematic diagram of another aspect of FIG. 7 .

FIG. 10 is a schematic cross-sectional view of the cantilevered thin-film probe card of FIG. 6 during operation.

FIG. 11 is a partial schematic diagram of the cantilevered thin-film probe card according to the second embodiment of the present invention.

FIG. 12 is a partial schematic diagram of a cantilevered thin-film probe card according to Embodiment 3 of the present invention.

FIG. 13 is a schematic cross-sectional view taken along line XIII-XIII of FIG. 12 .

FIG. 14 is a schematic cross-sectional view of the cantilevered thin-film probe card according to the fourth embodiment of the present invention.

FIG. 15 is a schematic top view of the cantilever type thin film probe card according to the fifth embodiment of the present invention.

100: Cantilever Thin Film Probe Card

1: carrier

11: The first surface

13: Opening

2: support layer

21: Support segment

22: Independent elastic segment

3: film sheet

31: Bearing layer

312: Action Section

313: Extension

32: Signal line

33: Conductive bumps

4: circuit board

H: height direction

Claims (10)

A cantilever type thin film probe card, comprising: a carrier, comprising a first surface and a second surface on opposite sides, and the carrier is recessed from the first surface to form an opening; a support layer, comprising a support section installed on the first surface and a plurality of independent elastic sections extending from the support section at intervals; wherein the plurality of independent elastic sections are suspended from the openings of the holes one side; and A film sheet, containing: a bearing layer defining a circumscribed segment, a plurality of actuation segments formed on the plurality of independent elastic segments, and an extension segment connecting the circumscribed segment and the actuation segments; wherein, the extension segment part is fixed on the support layer; a plurality of signal lines disposed on the bearing layer and formed by extending from the plurality of the actuating sections toward the outer section respectively; and A plurality of conductive bumps are respectively formed at positions of a plurality of the signal lines located in the plurality of actuation segments; wherein, when any one of the conductive bumps is pressed, the corresponding signal line and the phase The corresponding actuating segments can be elastically bent and deformed toward the openings through the corresponding independent elastic segments. The cantilevered thin-film probe card according to claim 1, wherein the carrier layer comprises an insulating layer and a conductive layer formed on the insulating layer, and the insulating layer separates the conductive layer from the plurality of all strips. the signal line, and the conductive layer is electrically coupled to at least one of the signal lines of the plurality of the signal lines. The cantilevered thin-film probe card according to claim 1, wherein the support segment and the plurality of independent elastic segments are arranged coplanarly. The cantilevered thin-film probe card according to claim 1, wherein each of the independent elastic segments is formed into a stepped structure in a direction away from the opening, so that each of the independent elastic segments and the The support section has a difference in a height direction. The cantilever type thin film probe card according to claim 1, wherein each of the conductive bumps is a multi-layered structure, and the cross-sectional area of each of the conductive bumps gradually moves away from the opening. shrink down. The cantilevered thin-film probe card according to claim 1, wherein the support layer is formed with a through hole in the support section, and the cantilevered thin-film probe card further comprises a cantilevered thin-film probe card disposed in the through hole. an electronic component, and the electronic component is electrically coupled to at least one of the signal lines of the plurality of signal lines. The cantilever type thin film probe card according to claim 1, wherein the opening of the carrier penetrates from the first surface to the second surface. The cantilevered thin-film probe card according to claim 1, wherein the extension section includes a first part fixed on the support layer and a second part over the carrier, so that the external section disposed on the second surface of the carrier. The cantilevered thin-film probe card according to claim 8, wherein the cantilevered thin-film probe card further comprises a circuit board, and the portion of the thin-film sheet corresponding to the external segment is mounted on the circuit board . The cantilever type thin film probe card according to claim 8, wherein the cantilever type thin film probe card further comprises a circuit board and an electrical connection structure connected to the circuit board, and corresponding to the external section of the The portion of the film sheet is electrically coupled to the circuit board through the electrical connection structure.

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