CN212812140U - Induction chip, circuit board and electronic equipment - Google Patents
Induction chip, circuit board and electronic equipment Download PDFInfo
- Publication number
- CN212812140U CN212812140U CN202021689588.3U CN202021689588U CN212812140U CN 212812140 U CN212812140 U CN 212812140U CN 202021689588 U CN202021689588 U CN 202021689588U CN 212812140 U CN212812140 U CN 212812140U
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- layer
- insulating layer
- wiring board
- metal circuit
- metal
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- 230000006698 induction Effects 0.000 title description 3
- 239000002184 metal Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000001939 inductive effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 230000005611 electricity Effects 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 5
- 230000004044 response Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses an response chip, circuit board and electronic equipment. The circuit board is provided with a connecting pin, and the connecting pin comprises a base material layer, a first metal circuit layer and a first insulating layer. The substrate layer has the connection face, and first metal line layer lays in the connection face, and first insulating layer and the range upon range of setting of first metal line layer, first metal line layer clamp are located between first insulating layer and the connection face, and first insulating layer has a plurality of spaced-apart fretwork portions, and the partial surface on first metal line layer is relative with fretwork portion. According to the utility model discloses a connect the pin, through setting up fretwork portion to can expose first metal wiring layer through fretwork portion, and then be convenient for carry out the electricity to connecting the pin and connect, not only can promote the stability of connecting pin and other part electricity and being connected from this, can also avoid because of the appearance defect that substrate layer two sides design asymmetry leads to, thereby can promote the yields of connecting the pin.
Description
Technical Field
The utility model belongs to the technical field of the electron device equipment technique and specifically relates to a response chip, circuit board and electronic equipment are related to.
Background
In the related art, an insulating layer is required to cover the surface of the metal circuit of the sensing chip to protect the circuit from corrosion and pollution by the external environment. However, at the position where the sensing chip is connected with the circuit board, the circuit needs to be exposed through the window opening, so that the normal conduction between the sensing circuit and the circuit board is ensured. In the process of connecting the induction chip and the circuit board, the following technical defects are easy to occur:
firstly, in the process of turnover, the circuits in the windowing area are easily scratched/polluted;
secondly, the water vapor in the environment easily corrodes the circuit, and the service life/reliability of the product is reduced;
and thirdly, because the base material and the insulating layer are made of transparent materials, in order to ensure that exposure cannot interfere with each other, the windowing design of two surfaces (the S surface and the D surface) of the base material needs to be consistent, but the protective film of the D surface cannot be slotted at the position, and bubbles can be generated due to the height difference, so that the appearance is poor.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a circuit board, the circuit board has simple structure, advantage that the yields is high.
The utility model also provides an respond to chip and electronic equipment, respond to chip and electronic equipment and all have as above connection pin.
According to the utility model discloses circuit board, the circuit board is equipped with the connection pin, the connection pin includes: a substrate layer having a connection face; the first metal circuit layer is laid on the connecting surface; the first insulating layer and the first metal circuit layer are arranged in a stacked mode, the first metal circuit layer is clamped between the first insulating layer and the connecting surface, the first insulating layer is provided with a plurality of spaced hollow-out portions, and part of the surface of the first metal circuit layer is opposite to the hollow-out portions.
According to the utility model discloses circuit board is through setting up fretwork portion to can expose first metal wiring layer through fretwork portion, and then be convenient for carry out the electricity to connecting pin and connect, not only can promote the stability of connecting pin and other part electricity connections from this, can also avoid the appearance defect because of the asymmetric lead to of substrate layer two sides design, thereby can promote the yields of connecting the pin.
In some embodiments, the ratio of the sum of the areas of the hollowed-out portions to the area of the connecting surface is 0.25-0.40. Therefore, the stability of the connecting pin in the electrical connection of other components can be improved.
In some embodiments, the hollowed-out portion is a circular hole having a diameter of 1-100 micrometers, and further, the circular hole has a diameter of 10-50 micrometers. Further, the hollow-out part is a polygonal hole or an elliptical hole. By setting the shape of the hollow part, on one hand, the hollow part is convenient to process on the first insulating layer; on the other hand, the precision of processing can also be promoted to can promote the yields of connecting pin processing.
In some embodiments, the clear distance between any two adjacent hollows is 8-15 microns. The "clear distance" herein may be understood as a minimum distance between edges of two neighboring cutouts. On one hand, the distribution state of the plurality of hollows on the substrate layer is convenient to control; on the other hand, the area ratio of the total area of the hollowed-out parts to the connecting surface can be controlled through the net distance.
In some embodiments, the substrate layer has first and second opposing surfaces, at least one of which is the joint face. Thus, the structure of the connection pin can be simplified.
In some embodiments, the first metal circuit layer is disposed on the first surface; the connection pin further includes: the second metal circuit layer is arranged on the second surface; the second insulating layer and the second metal circuit layer are arranged in a stacked mode, the second metal circuit layer is clamped between the second insulating layer and the second surface, the second insulating layer is provided with a plurality of spaced hollow parts, and partial surface of the second metal circuit layer is opposite to the corresponding hollow parts. From this, all can expose when the first surface and the second surface of substrate layer to can all form fretwork portion in substrate layer both sides, can simplify the course of working of connecting the pin from this, promote the yields of connecting the pin.
In some embodiments, the connection pin further includes a conductive gel section filled in the hollow-out section. The conductive gel section has a conductive property, and on one hand, the first metal line layer can be included by the conductive gel, and on the other hand, the first metal line layer is convenient to be electrically connected.
According to the utility model discloses response chip, electronic equipment, including as above the circuit board.
According to the utility model discloses response chip, electronic equipment are through setting up fretwork portion to can expose first metal wiring layer through fretwork portion, and then be convenient for carry out the electricity to connecting the pin and connect, not only can promote the stability of connecting pin and other part electricity connections from this, can also avoid the appearance defect because of the asymmetric lead to of substrate layer two sides design, thereby can promote the yields of connecting the pin.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a connection pin of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a connection pin of a circuit board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
FIG. 4 is an enlarged partial schematic view at A of FIG. 3;
FIG. 5 is a schematic diagram of the connection pin of FIG. 3;
fig. 6 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
FIG. 7 is an enlarged partial schematic view at B of FIG. 6;
fig. 8 is a schematic structural view of a wiring board in the related art;
FIG. 9 is a schematic view of a portion of the structure of FIG. 8;
fig. 10 is a schematic structural view of the connection pin in fig. 8;
fig. 11 is a schematic structural view of a wiring board in the related art.
Reference numerals:
the connection of the pins 100 is made by,
a substrate layer 110, a connection surface 111, a first surface 112, a second surface 113,
the first metal wiring layer 120 is formed on the first metal wiring layer,
the first insulating layer 130, the hollow portion 131,
the conductive gel section 140 is formed on the substrate,
a second metal wiring layer 150, a second insulating layer 160, a protective film 170,
the wiring board 200 is provided with a plurality of wiring patterns,
a wiring board 200', connection pins 100',
a base material layer 110', a first metal wiring layer 120 ', a first insulating layer 130 ',
a second metal line layer 150 ', a second insulating layer 160 ', and a protective film 170 '.
Detailed Description
Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary.
A wiring board 200 according to an embodiment of the present invention is described below with reference to fig. 1 to 7. The wiring board 200 has the connection pins 100. For example, when the wiring board 200 needs to be electrically connected to other components, the wiring board 200 may be provided with a plurality of connection pins 100, and the connection pins 100 and other components are electrically connected by wires, so that electrical connection can be achieved.
As shown in fig. 1, fig. 3 and fig. 6, according to the circuit board 200 of the embodiment of the present invention, the circuit board 200 has the connection pin 100, and the connection pin 100 includes: a base material layer 110, a first metal wiring layer 120, a first insulating layer 130, and a conductive gel section 140. The substrate layer 110 has a connection surface 111, the first metal circuit layer 120 is laid on the connection surface 111, the first insulating layer 130 and the first metal circuit layer 120 are stacked, the first metal circuit layer 120 is sandwiched between the first insulating layer 130 and the connection surface 111, the first insulating layer 130 has a plurality of spaced hollow portions 131, and a part of the surface of the first metal circuit layer 120 is opposite to the hollow portions 131. The first metal circuit layer 120 is exposed through the hollow portion 131, so as to facilitate electrical connection to the connection pin 100. As shown in fig. 5, a protection film 170 is disposed on a side of the first insulating layer 130 away from the base material layer 110. Thereby protecting the first insulating layer 130 from a user.
In addition, a plurality of conductive traces may be included in the first metal trace layer 120, and each conductive trace corresponds to at least one hollow portion 131, so that the conductive trace is electrically connected to other components through the hollow portion 131. The hollow portion 131 may be filled with a conductive gel section 140, and the conductive gel section 140 has a conductive property, thereby facilitating electrical connection to the first metal line layer 120. In addition, the conductive gel section 140 also has a protective effect on the first metal circuit layer 120, so as to prevent the first metal circuit layer 120 from being scratched, corroded, and the like.
The area ratio of the total area of the hollow parts 131 to the connecting surface 111 is 0.25-0.40. Thereby improving the stability of the connection pin 100 when other components are electrically connected. The shape of the hollow portion 131 is not particularly limited, and for example, the hollow portion 131 may be a circular hole, a polygonal hole, or an elliptical hole. When the hollow portion 131 is a circular hole, the diameter of the circular hole is 1 to 100 micrometers. Further, the diameter of the circular hole is 10-50 micrometers. When the hollow portion 131 needs to be processed on the first insulating layer 130, an etching process may be used. Therefore, by setting the shape of the hollow-out portion 131, on one hand, the hollow-out portion 131 is convenient to process on the first insulating layer 130; on the other hand, the processing precision can be improved, so that the yield of the processing of the connecting pins 100 can be improved.
As shown in fig. 1, 4 and 7, the clear distance between any two adjacent hollow-out portions 131 is 8-15 micrometers. The "clear distance" herein may be understood as a minimum distance between edges of two adjacent hollows 131. On one hand, the distribution state of the plurality of hollows on the substrate layer 110 is convenient to control; on the other hand, the ratio of the total area of the hollowed portions 131 to the area of the connection surface 111 may be controlled by the clear distance.
As shown in fig. 2, the substrate layer 110 has a first surface 112 and a second surface 113 opposite to each other, and at least one of the first surface 112 and the second surface 113 is a connection surface 111. It is understood that any one of the first surface 112 and the second surface 113 may serve as the connection surface 111. It is understood that the first surface 112 may be provided with a first metal wiring layer 120, a first insulating layer 130; of course, the same structure may be provided on the second surface 113. It should be noted that, the structure of the hollow portion 131 may involve an exposure process in the processing process, and in the exposure process, both the first surface 112 and the second surface 113 of the substrate layer 110 are exposed, so that the hollow portion 131 may be formed on both sides of the substrate layer 110.
Further, as shown in fig. 2, a first metal circuit layer 120 is disposed on the first surface 112. The connection pin 100 may further include a second metal line layer 150 and a second insulating layer 160. The second metal circuit layer 150 is disposed on the second surface 113, the second insulating layer 160 and the second metal circuit layer 150 are stacked, the second metal circuit layer 150 is sandwiched between the second insulating layer 160 and the second surface 113, the second insulating layer 160 has a plurality of spaced-apart hollow portions 131, and a part of the surface of the second metal circuit layer 150 is opposite to the corresponding hollow portions 131. Therefore, when both the first surface 112 and the second surface 113 of the substrate layer 110 are exposed, the hollow portions 131 can be formed on both sides of the substrate layer 110, so that the process of connecting the pins 100 can be simplified. As shown in fig. 5, the second insulating layer 160 is provided with a protective film 170 on a side away from the base material layer 110. The second insulating layer 160 can thereby be user-protected.
In the related art, as shown in fig. 8 to 11, a wiring board 200' has a connection pin 100 ', and the connection pin 100 ' includes a base material layer 110', a first metal wiring layer 120 ', a first insulating layer 130 ', a second metal wiring layer 150 ', a second insulating layer 160 ', and a protective film 170 '. As shown in fig. 10, the first metal wiring layer 120 ', the first insulating layer 130', and the protective film 170 'are sequentially stacked on one side of the base material layer 110', and the second metal wiring layer 150 ', the second insulating layer 160', and the protective film 170 'are sequentially stacked on the other side of the base material layer 110'.
According to the utility model discloses circuit board 200 is through setting up fretwork portion 131 to can expose first metal wiring layer 120 through fretwork portion 131, and then be convenient for connect pin 100 and carry out the electricity and connect, not only can promote the stability of connecting pin 100 and other part electricity connections from this, can also avoid the appearance defect because of substrate layer 110 two-sided design asymmetry leads to, thereby can promote the yields of connecting pin 100.
According to the utility model discloses response chip, electronic equipment all include as above circuit board 200.
In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features. In the description of the present invention, "a plurality" means two or more.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. The utility model provides a circuit board, its characterized in that, the circuit board is equipped with connection pin, connection pin includes:
a substrate layer having a connection face;
the first metal circuit layer is laid on the connecting surface;
the first insulating layer and the first metal circuit layer are arranged in a stacked mode, the first metal circuit layer is clamped between the first insulating layer and the connecting surface, the first insulating layer is provided with a plurality of spaced hollow-out portions, and part of the surface of the first metal circuit layer is opposite to the hollow-out portions.
2. The wiring board according to claim 1, wherein the ratio of the sum of the areas of the hollowed-out portions to the area of the connection surface is 0.25 to 0.40.
3. The wiring board of claim 1, wherein the hollowed-out portion is a circular hole having a diameter of 1-100 μm.
4. The wiring board of claim 3, wherein the circular holes have a diameter of 10-50 microns.
5. The wiring board of claim 1, wherein the hollowed-out portion is a polygonal hole or an elliptical hole.
6. The wiring board of claim 1, wherein the clear distance between any two adjacent hollows is 8-15 μm.
7. The wiring board of claim 1, wherein the substrate layer has first and second opposing surfaces, at least one of the first and second surfaces being the connection face.
8. The wiring board of claim 7, wherein the first metal circuit layer is disposed on the first surface;
the connection pin further includes:
the second metal circuit layer is arranged on the second surface;
the second insulating layer and the second metal circuit layer are arranged in a stacked mode, the second metal circuit layer is clamped between the second insulating layer and the second surface, the second insulating layer is provided with a plurality of spaced hollow parts, and partial surface of the second metal circuit layer is opposite to the corresponding hollow parts.
9. The wiring board of claim 1, wherein the connection pin further comprises a conductive gel section, and the conductive gel section is filled in the hollow section.
10. An inductive chip, characterized in that it comprises a wiring board according to any one of claims 1 to 9.
11. An electronic device characterized by comprising a wiring board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021689588.3U CN212812140U (en) | 2020-08-13 | 2020-08-13 | Induction chip, circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021689588.3U CN212812140U (en) | 2020-08-13 | 2020-08-13 | Induction chip, circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212812140U true CN212812140U (en) | 2021-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021689588.3U Expired - Fee Related CN212812140U (en) | 2020-08-13 | 2020-08-13 | Induction chip, circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212812140U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838378A (en) * | 2021-09-15 | 2021-12-24 | 昆山国显光电有限公司 | Display module and display device |
-
2020
- 2020-08-13 CN CN202021689588.3U patent/CN212812140U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838378A (en) * | 2021-09-15 | 2021-12-24 | 昆山国显光电有限公司 | Display module and display device |
| CN113838378B (en) * | 2021-09-15 | 2023-07-25 | 昆山国显光电有限公司 | Display module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210326 |