CN113838378B - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN113838378B CN113838378B CN202111080439.6A CN202111080439A CN113838378B CN 113838378 B CN113838378 B CN 113838378B CN 202111080439 A CN202111080439 A CN 202111080439A CN 113838378 B CN113838378 B CN 113838378B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to a display module and a display device, wherein the display module comprises: the display panel comprises a display area and a binding area, wherein a binding part is arranged in the binding area; the binding part is provided with a first surface and a second surface which are oppositely arranged in the thickness direction of the display panel, and golden fingers are respectively arranged on the first surface and the second surface; the circuit board comprises at least two layers of wiring layers which are laminated in the thickness direction of the display panel and are arranged in an insulating mode through insulating layers, wherein the same ends of the at least two layers of wiring layers are partially exposed out of the insulating layers between the at least two layers of wiring layers to form pins respectively, the pins on one of the at least two layers of wiring layers are connected with the golden fingers on the first surface, and the pins on the other layer of wiring layers are connected with the golden fingers on the second surface. The embodiment of the invention can meet the requirements of high-refresh and high-resolution display products and can meet the experience of users.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display module and a display device.
Background
Along with the improvement of the performance requirements of users on display products, the display products are continuously developed to the directions of high refreshing and high resolution, so that more and more lines are routed, more binding golden fingers are required to be left when the display panel is designed, the size of the display panel is increased due to the arrangement of more golden fingers, and the user experience is influenced.
Disclosure of Invention
The embodiment of the invention provides a display module and a display device, wherein the display module can meet the requirements of high-refresh and high-resolution display products and can meet the user experience.
In one aspect, an embodiment of the present invention provides a display panel, including a display area and a binding area located at least one side of the display area, where a binding portion is disposed in the binding area; the binding part is provided with a first surface and a second surface which are oppositely arranged in the thickness direction of the display panel, and golden fingers are respectively arranged on the first surface and the second surface; the circuit board comprises at least two layers of wiring layers which are laminated in the thickness direction of the display panel and are arranged in an insulating mode through insulating layers, wherein the same ends of the at least two layers of wiring layers are partially exposed out of the insulating layers between the at least two layers of wiring layers to form pins respectively, one of the at least two layers of wiring layers is connected with the golden finger on the first surface, and the other layer of wiring layers is connected with the golden finger on the second surface.
According to one aspect of the embodiment of the present invention, two layers of the wiring layers having the pins are disposed adjacently along the thickness direction of the display panel, and the binding portion is interposed between the two layers of the wiring layers having the pins.
According to an aspect of the embodiment of the present invention, the number of the gold fingers on the same surface is plural, and the pins formed on one of the wiring layers on the circuit board are electrically connected to the gold fingers on the same surface in a one-to-one correspondence manner.
According to an aspect of the embodiment of the present invention, the outermost sides of the circuit board are insulating layers along the thickness direction of the display panel.
According to an aspect of an embodiment of the present invention, the wiring layers and the insulating layers are alternately arranged in a thickness direction of the display panel.
According to an aspect of the embodiment of the present invention, the total number of layers of the wiring layer and the insulating layer is greater than or equal to 5.
According to one aspect of the embodiment of the present invention, the pins are connected to the golden finger through an electrical connection portion.
According to an aspect of the embodiment of the present invention, the electrical connection portion includes a plurality of conductive blocks, and each conductive block has a shape matching the shape of the gold finger and is connected between the lead and the gold finger.
According to an aspect of the embodiment of the present invention, the display module further includes a driving chip, where the driving chip is disposed on the first surface or the second surface, and the driving chip is electrically connected to the gold finger.
According to an aspect of the embodiment of the present invention, the binding portion further has a via hole, the via hole is disposed through the first surface and the second surface, and the driving chip is electrically connected to the gold finger on the other of the first surface and the second surface through the via hole.
According to an aspect of the embodiment of the present invention, the via hole is located between the display area and the golden finger.
On the other hand, according to an embodiment of the present invention, a display device is provided, including the display module.
According to the display module and the display device provided by the embodiment of the invention, the display module comprises the display panel and the circuit board, the binding area of the display panel is provided with the binding part, the binding part is provided with the first surface and the second surface in the thickness direction, and as the golden fingers are arranged on the first surface and the second surface, when the driving chip is bound on the display panel, the driving chip can be bound and connected with the pins of the circuit board through the golden fingers on the first surface and the second surface, so that the functional requirement of the display module is realized, and the golden fingers are arranged on the first surface and the second surface, so that the display module can meet the requirement of high-refresh and high-resolution display products, the external dimension of the display panel is reduced, and the user experience sense is met.
Drawings
Features, advantages, and technical effects of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a schematic view showing a partial structure of a display panel according to an embodiment of the present invention;
FIG. 2 is a partial side view of a display panel according to one embodiment of the invention;
FIG. 3 is a schematic view showing a partial structure of a display panel and a circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic view showing a partial structure of a display panel and a circuit board according to another embodiment of the present invention;
FIG. 5 is a schematic diagram of a display panel for connecting a driving chip and a golden finger according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of the size of the golden finger arrangement in the conventional display module;
fig. 7 is a schematic diagram of dimensions corresponding to arrangement of gold fingers in a display module according to an embodiment of the invention.
Wherein:
10-a display panel; 10 a-a display area; 10 b-binding area; 101-binding portion
111-a first surface; 112-a second surface; 113-vias;
11-golden finger;
20-a circuit board; 21-a wiring layer; 22-an insulating layer; 221-pin;
30-an electrical connection;
40-driving a chip;
51-normal line; 52-a via line;
x-thickness direction; y-a first direction; z-second direction.
In the drawings, like parts are designated with like reference numerals. The figures are not drawn to scale.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the invention and are not configured to limit the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.
With the improvement of the performance requirements of users on display products, the display products are continuously developed to the directions of high refreshing and high resolution, so that more and more lines are routed, and more binding golden fingers are required to be reserved when the display products are designed.
The traditional display product adopts a plurality of golden fingers arranged on the same surface of the binding area so as to meet the requirements of high-refresh and high-resolution display products. The binding mode of adopting a plurality of golden fingers requires more arrangement space, so that the display module is oversized, especially the binding area is wider in lower frame, and the user experience is not met.
In order to solve the above-mentioned problems, embodiments of the present invention provide a display module and a display device, and embodiments of the display module and the display device are described below with reference to fig. 1 to 7.
As shown in fig. 1 to 3, fig. 1 is a schematic view showing a partial structure of a display panel according to an embodiment of the present invention, fig. 2 is a partial side view of the display panel according to an embodiment of the present invention, and fig. 3 is a schematic view showing a partial structure of the display panel according to an embodiment of the present invention mated with a circuit board.
The display module provided by the embodiment of the invention comprises a display panel 10 and a circuit board 20, wherein the display panel 10 comprises a display area 10a and a binding area 10b positioned on at least one side of the display area 10a, a binding part 101 is arranged in the binding area 10b, the binding part 101 is provided with a first surface 111 and a second surface 112 which are oppositely arranged in the thickness direction X of the display panel 10, and golden fingers 11 are respectively arranged on the first surface 111 and the second surface 112. The circuit board 20 includes at least two wiring layers 21 stacked in the thickness direction X of the display panel 10 and insulated by an insulating layer 22, and the same ends of the at least two wiring layers 21 are partially exposed to the insulating layer 22 between the at least two wiring layers 21 to form the pins 221, respectively. Wherein, the pins 221 formed on one of the at least two wiring layers 21 are bonded to the gold fingers 11 on the first surface 111, and the pins 221 formed on the other wiring layer 21 are bonded to the gold fingers 11 on the second surface 112.
In the display module provided by the embodiment of the invention, the golden fingers 11 are arranged on the first surface 111 and the second surface 112, so that when the driving chip is bound on the display panel 10, the driving chip can be connected with the pins 221 of the circuit board 20 through the binding of the golden fingers 11 on the first surface 111 and the second surface 112, thereby realizing the functional requirements of the display module. And, all be provided with golden finger 11 on with first surface 111 and second surface 112 for the display module assembly can satisfy the demand of high refresh, high resolution display product, can also reduce golden finger 11 at the area occupied of display panel 10's frame, reduces display panel 10's overall dimension, satisfies user experience and feels.
Optionally, the display module provided in the embodiment of the present invention, the display panel 10 includes an array substrate and a light-emitting layer, which are stacked, where the array substrate includes a substrate and a device layer, which are stacked, and the light-emitting layer is located on a side of the device layer facing away from the substrate.
Optionally, the substrate may be a flexible substrate, and optionally, a material of the substrate may be a Polyimide (PI) material or a material containing PI, so that the substrate is a flexible substrate, and the array substrate may be bendable.
Optionally, the device layer includes a plurality of array-distributed driving circuits, and optionally, the light-emitting layer includes a plurality of array-distributed sub-pixels, and the driving circuits are connected to the sub-pixels and are used for driving the sub-pixels. The display requirements of the display panel 10 are fulfilled.
As an alternative embodiment, the binding part 101 is formed on the array substrate, and alternatively, the binding part 101 protrudes from the light emitting layer.
In some alternative embodiments, the number of the golden fingers 11 on the same surface is plural, and the pins 221 formed on one of the wiring layers 21 on the circuit board 20 are electrically connected to the golden fingers on the same surface in a one-to-one correspondence. Through the arrangement, the number of the golden fingers 11 can be increased, the display module is developed towards the high refresh and high resolution direction, the occupied area of the golden fingers 11 in the binding area 10b can be reduced, the outline size of the display panel 10 is reduced, and the user experience is optimized
Illustratively, the number of the gold fingers 11 on the first surface 111 may be plural, and the leads 221 formed on one of the wiring layers 21 on the circuit board 20 are electrically connected to the gold fingers 11 on the first surface 111 in a one-to-one correspondence. By making the number of the golden fingers 11 on the first surface 111 plural, the number of the golden fingers 11 disposed on the first surface 111 can be increased, so that the display module is developed in the high refresh and high resolution direction.
Optionally, at least a part of the plurality of gold fingers 11 on the first surface 111 are arranged side by side along the same direction. Through the arrangement, the occupation area of the golden fingers 11 at the binding part 101 can be reduced as much as possible on the basis of increasing the number of the golden fingers 11, the outline size of the display panel 10 is reduced, and the user experience is optimized.
In some alternative embodiments, all the golden fingers 11 located on the first surface 111 may be arranged side by side in the same direction as the first direction Y in fig. 1, and by this arrangement, the external dimension of the display panel 10 can be further reduced.
For example, the number of the gold fingers 11 on the second surface 112 may be plural, and the leads 221 formed on one of the wiring layers 21 on the circuit board 20 are electrically connected to the gold fingers 11 on the second surface 112 in a one-to-one correspondence. By making the number of the golden fingers 11 on the second surface 112 be plural, the number of the golden fingers 11 disposed on the second surface 112 can be increased, so that the display module is developed in the high refresh and high resolution direction.
Optionally, at least a part of the plurality of gold fingers 11 on the second surface 112 are arranged side by side along the same direction. Through the arrangement, the occupation area of the golden fingers 11 at the binding part 101 can be reduced as much as possible on the basis of increasing the number of the golden fingers 11, the outline size of the display panel 10 is reduced, and the user experience is optimized.
In some alternative embodiments, all the golden fingers 11 on the second surface 112 may be arranged side by side in the same direction as the first direction Y in fig. 1, and by this arrangement, the external dimension of the display panel 10 can be further reduced.
In some alternative embodiments, the first direction Y may be made perpendicular to the thickness direction X.
As an alternative embodiment, when the first surface 111 and the second surface 112 each include a row of gold fingers 11, the row of gold fingers 11 on the first surface 111 may be the same distance from the edge of the binding region 10b in the second direction Z as the row of gold fingers 11 on the second surface 112. By the above arrangement, the rows of the golden fingers 11 on the first surface 111 and the rows of the golden fingers 11 on the second surface 112 are approximately corresponding, so as to reduce the external dimension of the display panel 10. Alternatively, the second direction Z is perpendicular to the thickness direction X and the first direction Y.
In some alternative embodiments, the number of the golden fingers 11 included on the first surface 111 and the number of the golden fingers 11 included on the second surface 112 may be the same, however, in some embodiments, they may be different, and may be specifically set according to the binding requirement with the circuit board 20.
As shown in fig. 3, as an alternative embodiment, the circuit board 20 includes a plurality of wiring layers 21 and insulating layers 22, and the number of layers of the wiring layers 21 and the insulating layers 22 of the circuit board 20 is not particularly limited, and may be adjusted according to the number of lines and the arrangement space.
Alternatively, there are a plurality of materials for the wiring layer 21 and the insulating layer 22, which is not particularly limited in this application. Alternatively, the material of the wiring layer 21 may be copper foil or aluminum foil, which is good in conductivity and bending property. The material of the insulating layer 22 may be Polyimide (PI) or PI-containing material, so that the circuit board 20 may be bent.
Alternatively, when the circuit board 20 is manufactured, the copper foil may be directly evaporated on one of the insulating layers 22 to form the wiring layer 21, or a plurality of single-layer circuit boards or multi-layer circuit boards may be stacked and bonded by an adhesive layer, and then the insulating layer 22 is disposed on the outermost wiring layer 21, so long as the performance requirement of the display module can be met.
In some alternative embodiments, two wiring layers 21 having the pins 221 are disposed adjacently above in the thickness direction X of the display panel 10, and the binding portion 101 is interposed between the two wiring layers 21 having the pins 221. Through the arrangement, the binding requirement between the circuit board 20 and the golden fingers 11 on two sides of the binding area 10b of the display panel 10 can be met.
As an alternative embodiment, in the display module provided by the embodiment of the present invention, along the thickness direction X of the display panel 10, the outermost sides of the circuit board 20 are respectively insulation layers 22. Through the arrangement, insulation between the wiring layers 21 and protection of the outer wiring layers 21 can be achieved through the insulation layers 22, and safety performance of the display module is guaranteed.
The wiring layers 21 and the insulating layers 22 are alternately arranged in the thickness direction X of the display panel 10, facilitating the formation of the leads 221.
In some alternative embodiments, the total number m of layers of wiring layer 21 and insulating layer 22 is greater than or equal to 5 layers. By the above arrangement, the circuit board 20 includes at least two wiring layers 21, ensuring the connection requirements with the pins 221 on the first surface 111 and the pins 221 on the second surface 112.
As shown in fig. 3, the display module provided by the embodiment of the invention is exemplary. In some alternative embodiments, the value of m may be 5, and may include two layers of wiring layers 21 and three layers of insulating layers 22, where one layer of wiring layer 21 is disposed between two adjacent layers of insulating layers 22, and the first layer of wiring layer 21 and the second layer of wiring layer 21 are symmetrical with respect to the second layer of insulating layer 22 and protrude from the second layer of insulating layer 22 along the same direction respectively, so as to form the pin 221. The leads 221 formed on the first wiring layer 21 may be bonded to the gold fingers 11 on one of the first surface 111 and the second surface 112, and the leads 221 on the second wiring layer 21 may be bonded to the gold fingers 11 on the other of the first surface 111 and the second surface 112. Alternatively, in this example, the circuit board 20 may be of axisymmetric structure.
Fig. 4 is a schematic view showing a partial structure of a display panel and a circuit board according to another embodiment of the invention. It will be appreciated that the value of m is 5 is just an alternative embodiment. In some embodiments, the value of m may be set to 7, the wiring layer 21 may include three layers, and the insulating layer 22 includes four layers, where any two adjacent wiring layers 21 may be set to form the pin 221 along the same direction by the insulating layer 22 protruding between the two layers in the three-layer wiring layer 21, so as to ensure the binding requirement with the display panel 10.
For example, when m has a value of 7, the first layer wiring layer 21 and the second layer wiring layer 21 may be disposed with the insulating layer 22 protruding therebetween from one side to the other side, such as from the left side to the right side, in the thickness direction X, so as to form the pins 221 required for binding with the gold fingers 11 on the display panel 10. Of course, in some other examples, the second layer of wiring layer 21 and the third layer of wiring layer 21 may be protruded from the insulating layer 22 therebetween, so that the pins 221 can be formed as well, thereby meeting the binding requirement with the golden finger 11 on the display panel 10.
It will be appreciated that the above values of m for 5, 7, etc. are just alternative examples. In some embodiments, the value of m may be greater than 7, for example, the values of m are 9 and 11, so long as the binding requirement with the display panel 10 can be satisfied, and the requirement of high-refresh and high-resolution display products can be satisfied.
As shown in fig. 3 and fig. 4, in some alternative embodiments, in the display module provided by the embodiment of the present invention, the circuit board 20 further includes an electrical connection portion 30, and the pins 221 are connected to the gold finger 11 through the electrical connection portion 30 in a binding manner. Through setting up electric connection portion 30, can do benefit to the binding connection demand between pin 221 and the golden finger 11, simultaneously, need not to set up golden finger 11 or pin 221 in thickness direction X's size too big, set up electric connection portion 30 according to the interval between golden finger 11 and the pin 221, guarantee the connection demand between golden finger 11 and the pin 221 can.
In some alternative embodiments, the electrical connection 30 may include a plurality of conductive bumps, each conductive bump having a shape that matches the shape of the gold finger 11 and is connected between the lead 221 and the gold finger 11. By making the electrical connection portion 30 include a plurality of conductive blocks and making the shapes of the conductive blocks match the shapes of the gold fingers 11, each of the pins 221 is bonded to the gold fingers 11 through the conductive block, ensuring connection requirements, and no influence on electrical signals due to mismatch of the sizes of the conductive blocks and the shapes of the gold fingers 11 and the like.
As an alternative implementation mode, the materials of the conductive block are various, and optionally, the material of the conductive block can be anisotropic conductive adhesive, so that on one hand, the fixed connection between the first pin 221 and the first welding spot can be realized while the conduction is realized, and on the other hand, the anisotropic conductive adhesive has a lower curing temperature, is better in flexibility, can improve the environmental adaptability of the connecting point, and reduces failure.
In some alternative embodiments, the display module further includes a driving chip 40, where the driving chip 40 is disposed on the first surface 111 or the second surface 112, and the driving chip 40 is electrically connected to the gold finger 11. By providing the driving chip 40, it is advantageous to satisfy the control requirement of the display panel 10.
As an alternative embodiment, the binding portion 101 further has a via 113, and the via 113 is disposed through the first surface 111 and the second surface 112, and the driving chip 40 is electrically connected to the gold finger 11 located on the other of the first surface 111 and the second surface 112 through the via 113.
As shown in fig. 2 and 5, in some alternative embodiments, a plurality of bonding wires for connecting the driving chip 40 and the gold finger 11 may be disposed on the bonding portion 101, where the plurality of bonding wires may include a normal wire 51 and a via wire 52, and one end of the normal wire 51 is electrically connected to the driving chip 40, and the other end is electrically connected to the gold finger 11 on the same surface as the driving chip 40. One end of the via line 52 is electrically connected to the driving chip 40, and the other end extends to the via 113, and passes through the via 113 to the surface of the driving chip 40 and extends into the other surface, for example, the driving chip 40 is located on the first surface 111, and then the other end of the via line 52 passes through the via 113 to the first surface 111 and extends to the second surface 112, so as to electrically connect the driving chip 40 with the golden finger 11 on the second surface 122.
Because the substrate of the array substrate can adopt a flexible substrate, the above-mentioned arrangement of the driving chip 40 can make the binding portion 101 at least partially bend to the display area 10a and be located at one side of the substrate away from the device layer, and then make the driving chip 40 and the circuit board 20 both be located at one side of the display area 10a away from the device layer or the light emitting surface thereof, that is, the lower frame of the display device adopts a COP (chip on plastic) laminating scheme, so that the lower frame of the display device can be reduced.
As an alternative implementation manner, in the display module provided by the embodiment of the present invention, the via hole 113 may be located between the display area 10a and the gold finger 11, and by adopting the above arrangement, it is beneficial to enable the gold finger 11 that is not on the same surface with the driving chip 40 to be connected with the driving chip 40 through the via hole 113. On the basis of reducing the overall dimension of the display module, the binding requirement can be effectively ensured.
Fig. 6 and fig. 7 show a schematic size diagram corresponding to the arrangement of the golden fingers in the conventional display module, and fig. 7 shows a schematic size diagram corresponding to the arrangement of the golden fingers in the display module according to an embodiment of the invention. As can be seen from comparison between fig. 6 and fig. 7, the display module provided in the embodiment of the present invention takes the display panel 10 including two rows of golden fingers 11 as an example, and adopts a conventional display module, wherein the two rows of golden fingers 11 are located on the same side of the display panel 10, and as the number of golden fingers 11 increases, the occupied area of the golden fingers 11 on the lower frame of the display panel 10 increases. If the two rows of golden fingers 11 are all arranged on the same surface, the occupied area is increased, so that the width of the lower frame of the display module is larger. In the display module provided by the embodiment of the invention, the golden finger 11 is also taken as an example to include two rows, wherein one row is arranged on the first surface 111, and the other row is arranged on the second surface 112, so that the number of the golden fingers 11 on the same surface can be reduced.
For example, as shown in fig. 6, taking two rows of gold fingers 11 as an example, when the two rows of gold fingers 11 are all located on the same surface, there are values of h=h1+h3+h4, H and H2 and the frame size of the display panel 10 included in the conventional display module can be fed back. As shown in fig. 7, with the display module provided by the embodiment of the present invention, when the height dimension of the binding area 10b of the display panel 10 occupied by the golden finger 11 is H5 or H6, the numerical value of H5 and H7 and/or the numerical value of H6 and H7 and the frame dimension of the display panel 10 included in the display module provided by the embodiment of the present invention can be fed back, and as h5=h6=h4 and h2=h7 can be made, the dimension of the binding area 10b of the display panel 10 occupied by the golden finger 11 can be greatly reduced compared with the numerical value of H, so that the lower frame dimension of the display panel 10 is smaller, the display module can meet the requirements of high-refresh and high-resolution display products, and the overall dimension of the display panel 10 can be reduced, thereby meeting the user experience.
On the other hand, the embodiment of the invention also provides a display device, which comprises the display module of each embodiment. The display device can be any product or component with display function such as a mobile phone, a tablet computer, a notebook computer, a digital photo frame, a navigator and the like, and can be integrated with photosensitive components such as a camera and the like. The display device provided by the embodiment of the invention comprises the display module in any embodiment, has high refreshing and high resolution display capabilities, and can meet the user experience.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (9)
1. A display module, comprising:
the display panel comprises a display area and a binding area positioned on at least one side of the display area, wherein a binding part is arranged in the binding area;
the binding part is provided with a first surface and a second surface which are oppositely arranged in the thickness direction of the display panel, and golden fingers are respectively arranged on the first surface and the second surface;
a circuit board including at least two wiring layers laminated in a thickness direction of the display panel and arranged in an insulating manner through an insulating layer, the same ends of the at least two wiring layers being partially exposed from the insulating layer between the at least two wiring layers to form pins, respectively, wherein the pins on one of the at least two wiring layers are connected with the gold fingers on the first surface, and the pins on the other wiring layer are connected with the gold fingers on the second surface;
the pins are connected with the golden finger through the electric connection parts.
2. The display module of claim 1, wherein two layers of the wiring layers having the pins are disposed adjacent to each other in a thickness direction of the display panel, and the binding portion is interposed between the two layers of the wiring layers having the pins.
3. The display module of claim 1, wherein the number of the gold fingers on the same surface is plural, and the pins formed on one of the wiring layers on the circuit board are electrically connected to the gold fingers on the same surface in a one-to-one correspondence.
4. A display module according to any one of claims 1 to 3, wherein the outermost sides of the circuit boards are insulating layers in the thickness direction of the display panel;
preferably, the wiring layers and the insulating layers are alternately arranged in a thickness direction of the display panel;
preferably, the total number of layers of the wiring layer and the insulating layer is 5 or more.
5. The display module of claim 1, wherein the electrical connection portion includes a plurality of conductive blocks, each of which has a shape matching the shape of the gold finger and is connected between the pin and the gold finger.
6. A display module according to any one of claims 1 to 3, further comprising a driver chip disposed on the first surface or the second surface, the driver chip being electrically connected to the gold finger.
7. The display module of claim 6, wherein the binding portion further has a via hole penetrating the first surface and the second surface, and the driving chip is electrically connected to the gold finger on the other of the first surface and the second surface through the via hole.
8. The display module of claim 7, wherein the via is located between the display area and the gold finger.
9. A display device comprising a display module according to any one of claims 1-8.
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| CN202111080439.6A CN113838378B (en) | 2021-09-15 | 2021-09-15 | Display module and display device |
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| CN202111080439.6A CN113838378B (en) | 2021-09-15 | 2021-09-15 | Display module and display device |
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| CN113838378A CN113838378A (en) | 2021-12-24 |
| CN113838378B true CN113838378B (en) | 2023-07-25 |
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Citations (4)
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| CN107329297A (en) * | 2017-08-30 | 2017-11-07 | 上海中航光电子有限公司 | The binding structure and display panel of display panel |
| CN110111682A (en) * | 2019-04-10 | 2019-08-09 | 深圳市华星光电技术有限公司 | Flip chip and display device |
| CN210519001U (en) * | 2019-08-13 | 2020-05-12 | 新余市木林森线路板有限公司 | Ultra-long flexible circuit board for LED lamp strip |
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| CN108241240B (en) * | 2018-02-08 | 2021-05-14 | 上海天马微电子有限公司 | Display panel and display device |
| CN209570765U (en) * | 2018-10-31 | 2019-11-01 | 惠科股份有限公司 | Display panel and display device |
| CN110600487A (en) * | 2019-09-16 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN112002246B (en) * | 2020-09-28 | 2022-04-29 | 武汉天马微电子有限公司 | Display panel and display device |
| CN112669707B (en) * | 2020-12-22 | 2023-05-12 | 武汉天马微电子有限公司 | Display panel, flexible circuit board and display device |
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| CN107329297A (en) * | 2017-08-30 | 2017-11-07 | 上海中航光电子有限公司 | The binding structure and display panel of display panel |
| CN110111682A (en) * | 2019-04-10 | 2019-08-09 | 深圳市华星光电技术有限公司 | Flip chip and display device |
| CN210519001U (en) * | 2019-08-13 | 2020-05-12 | 新余市木林森线路板有限公司 | Ultra-long flexible circuit board for LED lamp strip |
| CN212812140U (en) * | 2020-08-13 | 2021-03-26 | 南昌欧菲显示科技有限公司 | Induction chip, circuit board and electronic equipment |
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