CN1171516C - The printed circuit board structure - Google Patents

The printed circuit board structure Download PDF

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Publication number
CN1171516C
CN1171516C CNB991233867A CN99123386A CN1171516C CN 1171516 C CN1171516 C CN 1171516C CN B991233867 A CNB991233867 A CN B991233867A CN 99123386 A CN99123386 A CN 99123386A CN 1171516 C CN1171516 C CN 1171516C
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layer
surface
signal
board
printed circuit
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CNB991233867A
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CN1294484A (en
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许先越
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华硕电脑股份有限公司
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Abstract

一种印刷电路板结构,由一主板和至少一子板组成。 A printed circuit board structure, at least one of a motherboard and daughter boards. 主板为四层板,包括第一信号层、第一接地层、第一电源层、第二信号层以及多层绝缘层。 Board for the four-layer board, comprising a first signal layer, the first ground layer, a first power supply layer, a second signal layer and the multi-layer insulation. 第一信号层与第二信号层配置于主板的上下表面,第一信号层具有多个接点。 The first signal and the second signal layer arranged on the upper and lower surface of the main layer, the first layer having a plurality of signal contacts. 子板为四层板,包括第三信号层、第二接地层、第二电源层、第四信号层以及多层绝缘层,接地层或电源层配置于子板的一表面,此表面上具有多个接点,子板以此表面与主板叠合,并通过第二接点与主板的第一接点连接,其中该子板叠合于该主板的布线密度高的区域上。 For the four-layer board daughter board, comprising a layer of a third signal, the second ground layer, a second power supply layer, a fourth insulating layers and the signal layer, power supply layer or the ground layer disposed on a surface of the daughter board, on this surface having a plurality of contacts, the surface of the daughter board and the motherboard in order to overlap and are connected via a first contact and a second contact point of the main board, wherein the daughter board stacked on the board with high wiring density area.

Description

印刷电路板结构 The printed circuit board structure

技术领域 FIELD

本发明涉及一种印刷电路板(Printed Circuit Board,PCB)的结构,特别是涉及一种增加印刷电路板绕线层数的结构。 The present invention relates to a structure of a printed circuit board (Printed Circuit Board, PCB), and more particularly to a structure of a printed circuit board to increase the number of layers of windings.

背景技术 Background technique

各种半导体元件经过封装后,一般都会安装在一基板比如印刷电路板上,与其他元件连结,常见的应用比如是主机板(motherboard)。 Various semiconductor elements after the package, usually mounted on a substrate such as a printed circuit board, coupled with other elements, such as is common application motherboard (motherboard).

图1绘示现有的一种主机板的示意图。 1 a schematic view illustrating a conventional motherboard.

请参照图1,在主机板10上至少具有微处理器(microprocessor)12、芯片(chipset)14及总线(bus)插槽16等元件,主机板10通常是四层印刷电路板。 Referring to FIG 1, having at least a microprocessor (microprocessor) 12, a chip (chipset) 14, and a bus (Bus) socket on the motherboard 16 or the like element 10, motherboard 10 is typically a four-layer printed circuit board. 微处理器12用以执行程序处理数据,芯片14担任微处理器12与其他元件和总线插槽16之间的沟通桥梁,而总线插槽16供其他的附加卡如网卡、声卡等连接。 The microprocessor 12 executes a program for processing data, the chip 14 as a bridge between a microprocessor bus 12 with other elements and slots 16, 16 and bus slot for the other add-on cards such as network cards, sound cards, etc. are connected. 各元件间藉线路18(trace)连接,进行数据的传递。 Between the elements by means of line 18 (trace) is connected, for transmitting data.

由于各元件间所需传递的数据量不同,因此元件间的线路数量也会有所不同,即主机板上的布线密度分配不平均,例如微处理器12与芯片14之间处理大多数的数据传递与控制动作,因此微处理器12与芯片14间线路区域20的布线密度便非常大,以便能够处理大量的数据,而芯片14与总线插槽16间的控制动作与数据传递量较小,所以芯片14与总线插槽16间线路区域22的布线密度就比较低。 Depending on the amount of data transmission required between the elements, the number of lines between the elements will be different, i.e., the wiring density on the uneven distribution of the motherboard, for example, most of the processing of data between the microprocessor 12 and the chip 14 and transmission control operation, and therefore the microprocessor 12 and the chip 14 line wiring density region 20 will be very large to be able to handle large amounts of data, and controls the operation of the chip 14 between the socket 16 and the bus data transfer amount is small, Therefore, the chip 14 and the wiring density of 16 lines bus slot area 22 is lower.

随着微处理器功能的增加、芯片功能的多样化以及主机板元件的增加,使得微处理器与芯片或其他元件之间的线路数量增加,以便处理更多的数据,造成布线密度提高。 With the increase in function of the microprocessor, and increased diversification function motherboard chip element, so that the number of lines between the microprocessor and the chip or other element increases, more data to process, resulting in improving the wiring density. 但是因为主机板上的线路区域面积大小固定,因此当线路密度超过一定限度时,将无法在常用的四层板上完成线路布局,而必需使用更多层数的印刷电路板来完成线路布局。 However, because the line size of the area secured on the motherboard, so that when the line density exceeds a certain limit, will not complete the circuit layout in a conventional four-layer board and necessary to use more layers of the printed circuit board to complete the circuit layout. 然而,并非整个主机板上的布线密度都很高,一般只有部分区域的布线密度较高,需较多的绕线层数完成线路布局,若是整体改用较多层数的印刷电路板,比如六层板或八层板,则将增加制造成本。 However, not on the entire motherboard wiring density is high, generally only part of the higher wiring density region, to be more winding layers of the circuit layout is completed, if the overall use more layers of a printed circuit board, such as six or eight panel board, the manufacturing cost will be increased.

发明内容 SUMMARY

因此本发明的目的之一就是提供一种印刷电路板的结构,其在一主板布线密度高的区域上,叠合一子板,区域性地提高该区域的绕线层数,以完成高密度的线路布局。 It is therefore an object of the present invention is to provide a structure of a printed circuit board, a motherboard in a high wiring density area, a daughter board laminated regional increase the winding number of layers in the region of high density in order to complete the circuit layout.

本发明的另一目的在于提供一种印刷电路板结构,可在主板的部分区域叠合一子板,以做为线路的跨接,改变整体电路布局,以满足各种不同产品的需要,使生产更具弹性化(flexible)或模组化。 Another object of the present invention is to provide a printed circuit board configuration, a daughter board can be laminated in a partial area of ​​the motherboard, as in the line jumper, change the overall layout of the circuit, in order to meet the various needs of different products, so that production of more resilient (flexible) or modular.

根据上述及其他目的,本发明提出一种印刷电路板结构,由一主板和至少一子板所组成。 The above and other objects, the present invention provides a structure of a printed circuit board, a motherboard and a daughter board consisting of at least one. 其中主板为四层板结构,包括第一信号层、第一接地层、第一电源层、第二信号层以及用以隔离各层的多层绝缘层叠合而成。 Wherein motherboard four-layer board structure, comprising a first signal layer, the first ground layer, a first power supply layer, and a second signal layer for isolating multilayer insulated from the laminated layers together. 第一信号层与第二信号层配置于主板的上下表面,第一信号层具有多个第一接点。 The first signal and the second signal layer arranged on the upper and lower surface of the main layer, the first layer having a plurality of first signal contacts. 子板亦为四层板结构,包括第三信号层、第二接地层、第二电源层、第四信号层以及用以隔离各层的多层绝缘层叠合而成,其中接地层或电源层配置于子板的一表面,而此表面上具有多个第二接点分别与该第三信号层及该第四信号层电连接,子板以此表面与主板的该第一信号层的部分表面叠合,并通过第二接点与主板的第一接点连接,其中,该子板叠合于该主板的布线密度高的区域上。 Daughter board also four-layer board structure, comprising a layer of a third signal, the second ground layer, a second power supply layer, and a fourth signal layer of the multilayer insulated to isolate the laminated layers laminated together, wherein the power supply layer or the ground layer disposed on a surface of the daughter board, and this surface having a plurality of second contacts are electrically connected to the signal layer of the third and the fourth signal layer, the surface of the daughter board and the motherboard in order to signal the first portion of the upper surface layer stacked, and the second contact through the first contact is connected with the motherboard, wherein the daughter board stacked on the board with high wiring density area.

根据上述及其它目的,本发明提出另一种印刷电路板结构,包括:一主板,由多层第一信号层、至少一第一接地层、至少一第一电源层以及用以隔离各层的多层绝缘层叠合而成,其中该第一信号层之一配置于该主板的一第一表面,且该第一表面具有多个第一接点;以及一子板,由多层第二信号层、至少一第二接地层、至少一第二电源层以及用以隔离各层的多层绝缘层叠合而成,其中该第二接地层及该第二电源层其中之一配置于该子板的一第二表面,且该第二表面具有多个第二接点,该第二接点分别与该第二信号层电连接,而该子板以该第二表面叠合于该主板的部分该第一表面上,并通过该第二接点分别与该主板的部分该第一接点电连接,其中,该子板叠合于该主板的布线密度高的区域上。 The above and other objects, the present invention provides another printed circuit board structure, comprising: a motherboard, a plurality of layers of the first signal layer, at least a first ground layer, at least a first layer and a power source for isolating the layers multi-layer insulation layer laminated together, wherein one of the first signal layer is disposed on a first surface of the main board and the first surface having a first plurality of contacts; and a daughter board, a second signal layer of a multilayer at least one second ground layer, and at least a second power supply layer for isolating the layers from the multilayer insulating layer are laminated, wherein the second ground layer, and wherein the one of the second power supply layer disposed on the daughter board a second surface, and the second surface having a second plurality of contacts, the second contacts are electrically connected to the second signal layer, and the sub-plate is superimposed on the second surface of the first portion of the board the upper surface, respectively by the second contact portion of the first contact electrically connected to the board, wherein the daughter board stacked on the board with high wiring density area.

根据上述及其他目的,本发明提出另一种印刷电路板结构,其第二接点配置于子板的侧边。 The above and other objects, the present invention provides another printed circuit board structure, which is disposed on the second contact side of the daughter board. 子板的侧边配置多个凹槽,而凹槽的内表面及子板位于凹槽附近的表面具有一导电镀层,以作为第二接点。 A plurality of daughter board side grooves and the inner surface of the groove and the sub-plate is positioned near the surface of the recess having a conductive coating, as a second contact point. 而由后续的表面焊接工艺,焊锡会附着于第一接点表面、第二接点的凹槽内表面及附近的表面。 And by subsequent surface welding process, the solder will adhere to the first contact surface, the inner surface of the recess and a second contact surface in the vicinity.

在本发明中提供一子板叠合主板的结构,通过此子板可以提供主板上布线密度较高的区域有较多的绕线层数,以降低制造成本。 In the present invention, to provide a daughter board laminated board structure through which the daughter board has more winding layers may be provided on the motherboard high wiring density area to reduce the manufacturing cost. 同时利用此子板叠合主板的结构,也可以让主板上部分线路形成跨接,改变线路布局,以满足各种产品的需求。 While using the structure of this laminated board daughter board, but also allows the main plate portion is formed across the lines, changing the line layout to meet the needs of a variety of products.

附图说明 BRIEF DESCRIPTION

为使本发明的上述和其他目的、特征、和优点能更明显易懂,下文特举优选实施例,并配合附图作详细说明。 To make the above and other objects, features, and advantages will become apparent from, the following preferred non-limiting embodiment, and detailed description with accompanying drawings. 附图中:图1绘示习知一种主机板的透视图;图2A绘示根据本发明一优选实施例之印刷电路板子板的背面示意图;图2B绘示根据本发明一优选实施例之印刷电路板子板与印刷电路板主板叠合的剖面示意图;图3绘示根据图2B的剖面放大图;图4A绘示根据本发明另一优选实施例的印刷电路板子板的背面示意图;以及图4B绘示根据本发明另一优选实施例的印刷电路板子板与印刷电路板主板叠合的剖面示意图。 In the drawings: FIG 1 shows a perspective view of a conventional motherboard; FIG. 2A shows a schematic view of the back surface of the printed circuit board embodiment of the board according to a preferred embodiment of the present invention; FIG. 2B shows a preferred embodiment of the present invention the printed circuit board schematic cross-sectional view of the printed circuit board and the laminated board motherboard; FIG. 3 illustrates an enlarged cross-sectional view of FIG. 2B; FIG. 4A illustrates a schematic view of the back surface of the printed circuit board board according to another preferred embodiment of the present invention; and FIG. a printed circuit board with a schematic sectional view of a printed circuit laminated board board board 4B illustrates another preferred embodiment of the present invention.

具体实施方式 Detailed ways

本发明提供一子板叠合主板的印刷电路板结构,通过此子板的使用,可以提供主板上布线密度较高的区域有较多的绕线层数。 The present invention provides a laminated board daughter board printed circuit board structure, by using this sub-plate, has more winding layers may be provided on the motherboard high wiring density area. 利用此子板叠合主板的结构,主板可使用较少层数的印刷电路板,即可获得较多的绕线层数,降低生产成本。 With this daughter board laminated board structure, fewer layers may be used motherboard printed circuit board, can be obtained more winding layers, reduce production costs.

图2A绘示根据本发明一优选实施例的印刷电路板子板的背面示意图,图2B绘示根据本发明一优选实施例的印刷电路板子板与印刷电路板主板叠合的剖面示意图。 FIG 2A shows a schematic view of the back surface of the printed circuit board board according to a preferred embodiment of the present invention, FIG 2B shows a schematic cross-sectional view of the printed circuit board panel and a laminated printed circuit board Board according to a preferred embodiment of the present invention.

请同时参照图2A与图2B,子板30包括是四层板、六层板、八层板或是十层板。 Referring to FIGS. 2A and 2B, the sub-plate 30 comprises a four-layer board, six boards, eight or ten board laminates. 其中包括信号层(signal),接地层(ground)及电源层(power),而信号层上形成有线路(未绘示)。 Wherein the layer includes a signal (signal), a ground layer (Ground) and the power supply layer (power), is formed with a line (not shown) on the signal layer. 信号层,接地层及电源层间配置有绝缘层,且绝缘层中有贯孔(via),作为层与层之间的电连接。 A signal layer, the ground layer and power supply layer is arranged an insulating layer and the insulating layer with a through hole (Via), as an electrical connection between the layers. 本实施例中将接地层或电源层配置于子板30的表面39,而在其表面39形成有多个接点32,且在接点32上镀有导电材料33,导电材料包括锡铅合金,且接点32的排列通常为两排。 39 cases in the surface of the ground or power plane disposed on the daughter board 30 according to the present embodiment, a plurality of contacts 32 and 39 formed on its surface and on contact 32 plated with a conductive material 33, conductive material includes tin-lead alloy, and contact 32 is generally arranged in two rows. 同样地,在主板34上,比如在布线密度较高的线路区域上形成多个接点36,对应子板30的接点32,以便与子板30电连接,接点36排列方式与印刷电路板子板30上的接点32相同。 Similarly, on the motherboard 34, such as a plurality of contacts 36 are formed on the high-density circuit wiring area, the corresponding sub-plate 30 of the contact 32, electrically connected to the daughter board 30, the contacts 36 of the printed circuit board and the arrangement board 30 contacts 32 on the same. 其中接点36上也镀有导电材料37,比如锡铅合金,而印刷电路板主板34包括四层板。 Wherein the joint 36 is also plated with a conductive material 37, such as tin-lead alloy, and the printed circuit board 34 comprises a four-layer board Board.

在叠合子板30与主板34时,将印刷电路板子板30的接点32与印刷电路板主板34的接点36印上焊膏38(焊锡),将子板30与主板34对准叠合后,加热此子板30与主板34即可,加热的方式比如是利用红外线回流焊机。 After the superimposition daughter board 30 and the motherboard 34, the printed circuit board on the contact plate 30 contacts the printed circuit board 32 and the motherboard 34 of the printing paste 36 38 (solder), the daughter board 30 and the motherboard 34 are aligned stacked, heating the daughter board 30 and the motherboard 34 can be heated in a manner such as using an infrared reflow machine.

本发明中,在印刷电路板主板布线密度较高的区域上,通过一子板的使用,可以区域性地提高主板的绕线层数,以完成高密度的线路布局。 In the present invention, in the high density PCB board layout area, by using a sub-board, the main board can be improved regional winding layers, to complete a high-density circuit layout. 而子板的配置亦可以使主板上部分区域的线路形成跨接或跳接,而使得整体电路布局做一些调整,以满足各种产品应用的需求,使制造上更具弹性,而无须重新布局。 And the sub-plate can also be arranged so that the line portion forming region on the motherboard jumper or jumper, such that the overall circuit layout to make some adjustments to meet the needs of a variety of product applications, so that more flexible manufacturing, without having to re-layout .

图3绘示根据图2B的剖面放大图。 FIG 3 illustrates an enlarged cross-sectional view of FIG. 2B.

请参照图3,在一般的多层印刷电路板设计上,都会有信号层、接地层及电源层的设计,以四层板为例,通常的配置为具有两层信号层、一层接地层及一层电源层,且将两层信号层配置于多层结构的上下表面,由接地层与电源层隔开,以避免信号层相距太近发生干扰。 Referring to FIG 3, in the general multilayer printed circuit board design, there will be a signal layer, a ground layer and power supply layer design, four layers board, for example, is generally configured to have two signal layers, one ground layer and a power supply layer, and the two signal layers disposed above and below the surface of the multilayer structure is separated by a ground layer and power layer, a signal layer is too close to avoid interference. 因此在本发明中,需修改作为子板的印刷电路板设计,以避免主板与子板叠合后,主板叠合表面的电路与子板叠合表面的电路发生干扰。 In the present invention, therefore, the need to modify the design of printed circuit boards as daughter boards, the main board and the sub board to avoid overlap, the overlapping surface of the circuit of the circuit board sub-surface of the laminated board interfere.

以主板34与子板30都为四层板为例子,主板34采用现有设计,将信号层50,56配置于上下表面,其上配置有多条线路(未绘示)。 In the main board 34 and the sub plate 30 are four-layer board as an example, the motherboard 34 using conventional designs, the signal layer arranged on the upper and lower surfaces 50, 56, disposed on a plurality of lines (not shown). 而电源层52与接地层54则配置于信号层50,56之间,各层间并以绝缘层40隔开,至于各层间的连接则是通过贯孔41来达成。 52 and the power supply layer and the ground layer 54 is disposed between the signal layers 50, 56, separated by insulating layer 40 between the layers, as for the connection between the layers is achieved through the through hole 41. 而子板30则是将电源层或接地层配置于欲与主板34叠合的表面39。 And the sub-plate 30 sucked power or ground layer is disposed to be overlapped with the surface 39 of the main board 34. 本实施例中,将接地层48配置于表面39,然后信号层46、电源层44及信号层42依序配置于接地层48上,各层间同样以绝缘层40隔开。 In this embodiment, the ground layer 48 disposed on the surface 39, and then signal layer 46, the power supply layer 44 and signal layer 42 are sequentially disposed on the ground layer 48, similarly to the insulating layer 40 between the layers are separated. 利用这样的设计,可以避免主板34与子板30叠合时,信号层46与信号层50相距太近发生干扰。 When using such a design, to avoid overlapping the main board 30 and the sub-plate 34, the interference signal layer 46 and signal layer 50 occur too close.

图4A绘示根据本发明另一优选实施例的子板的背面示意图,图4B绘示根据本发明另一优选实施例的子板与主板叠合的剖面示意图。 FIG 4A illustrates a schematic view of the back surface of the daughter board according to another preferred embodiment of the present invention, FIG. 4B shows a schematic cross-sectional view of the embodiment of the daughter board and the motherboard according to another preferred embodiment superimposing the present invention.

请同时参照图4A与图4B,子板60包括是四层板、六层板、八层板或是十层板。 Referring to FIGS. 4A and 4B, the daughter board 60 comprises a four-layer board, six boards, eight or ten board laminates. 其中包括信号层,接地层及电源层,而信号层上形成有线路(未绘示)。 Including signal layer, power supply layer and ground layer, is formed with a line (not shown) on the signal layer. 信号层,接地层及电源层间配置有绝缘层,且绝缘层中有贯孔(via),作为层与层之间的电连接。 A signal layer, the ground layer and power supply layer is arranged an insulating layer and the insulating layer with a through hole (Via), as an electrical connection between the layers. 本实施例中是将接地层或电源层配置于子板60的表面61,子板60在其侧边上形成有多个凹槽62,且凹槽62的周围镀上导电镀层64,比如是铜镀层与其表面的锡铅合金镀层。 Embodiment is a power supply layer or the ground layer disposed on the surface 61 of daughter board 60 of this embodiment, the daughter board 60 with a plurality of grooves 62 formed on its side, and the groove 62 around the plated conductive coating 64, such as a tin-lead alloy plating copper plating its surface. 导电镀层64所覆盖的区域包括凹槽62的内表面64a及表面61邻近凹槽62的附近区域64b,形成接点,作为电连接之用,导电镀层64并加强后续表面焊接时与焊锡的接合性。 Area covered by conductive plating 64 includes an inner surface 64a and surface 62 of the groove adjacent to the recess region near 64b 61 62, forming contacts, as electrically connected with the conductive coating 64 and to enhance adhesion to the surface of the solder in the subsequent solder . 同样地,在主板66上,欲叠合印刷电路板子板60的线路区域上形成多个接点68,其排列方式与子板60上的凹槽62对应,接点68上并镀有导电材料,比如是锡铅合金镀层72。 A plurality of contacts on the circuit region is formed in the same manner, on the main board 66, the printed circuit board to be laminated board 68 of 60, corresponding to the groove 62 on which the daughter board 60 arrangement, the contacts 68 and plated with a conductive material, such as 72 is a tin-lead alloy plating layer. 而主板66包括是四层板,而其结构与上述实施例中类似,在此不再赘述。 And the main board 66 includes a four-layer board with its configuration similar to the above-described embodiments, not described herein again.

叠合子板60与主板66时,是采面对面叠合,主板66的接点68印上锡膏70(焊锡),然后把子板60与主板66对准后,利用表面粘着技术(surfacemounting technology,SMT)的方式,电连接子板60与主板66,而此时焊锡70会附着于凹槽62的导电镀层64表面及接点68的导电材料72表面。 Laminating the sub-board 60 and motherboard 66, is superimposed mining face, the contacts 68 on the motherboard 66 of the printed solder paste 70 (solder), and after the daughterboard 60 and motherboard 66 are aligned, using a surface mount technology (surfacemounting technology, SMT ) manner, the daughter board 60 is electrically connected with the motherboard 66, but this time the solder 70 adheres to the conductive coating 72 and the surface of the conductive material 64 contacts the surface 68 of the recess 62.

上述实施例的印刷电路板配置结构是用以说明本发明,而本发明并不限于此种形式的印刷电路板配置结构。 The printed circuit board arrangement structure of the above-described embodiment is illustrative of the present invention, but the present invention is not limited to this form of the printed circuit board arrangement. 当子板具有更多层数比如是六层板时,仍是应用上述的设计方式,将子板欲与主板叠合的表面配置接地层或是电源层,以避免主板与子板之间发生干扰。 When the daughter board with more layers such as a six boards, still applying the above design approach, the surface of the sub plate is disposed to be overlapped with the motherboard power supply layer or a ground layer, and between the main plate in order to prevent the daughter board interference. 同样地,也可将主板与子板叠合的表面皆配置接地层或是电源层,或者主板叠合表面为接地层或电源层,而子板接合表面为信号层,以避免主板与子板之间发生干扰。 Likewise, the surface may also be laminated motherboard and daughter board are a ground layer or a power layer arranged or superposed surface motherboard power supply layer or a ground layer, and the sub-plate engaging surface of the signal layer, the main board and the sub board to avoid interference between. 换句话说,主板叠合表面及子板叠合表面的其中不同时配置信号层,以避免干扰现象发生。 In other words, where the main board and the laminated surface of the laminated board sub-surface layer is not the same configuration signals to avoid interference phenomenon. 至于其他各层的配置方式则更是可以有多种排列选择,以符合电连接要求。 As for other configurations even more layers can be arranged in a variety of options to comply with the electrical connection requirements.

在本发明中,利用一子板叠合在主板布线密度较高的区域上,通过此子板的使用,可以区域性地提高主板的绕线层数,以在主板上完成高密度的线路布局。 In the present invention, the use of a daughter board laminated wiring board in a higher density region, by using this sub-board, the main board can be improved regional winding layers, to complete a high-density circuit layout on the motherboard . 而利用此子板叠合主板的结构,主板可使用较少层数的印刷电路板,即可获得较多的绕线层数,并节省生产成本。 With this sub-board and laminated board structure, fewer layers may be used motherboard printed circuit board, can be obtained more winding layers, and save production costs.

此外,应用本发明的结构,更可以对印刷电路板产品进行模组化的设计。 Further, the structure of the present invention is applied, it may be more modular design of the printed circuit board products. 将基本电路设计在印刷电路板主板上,而把不同功能的电路设计在印刷电路板子板上,例如将印刷电路板设计为影像模组或声卡模组,藉由替换不同的印刷电路板子板,即可改变产品的功能。 The basic principal circuit design on a printed circuit board, and the different functions of the circuit design on a printed circuit board board, for example, a printed circuit board module is designed to image or sound modules, by substituting different printed circuit board board, you can change the function of the product.

虽然本发明已结合优选实施例揭露如上,但是其并非用以限定本发明,本领域的技术人员在不脱离本发明的精神和范围内,可作各种更动与润饰。 While the invention has been described by reference to preferred embodiments, but not intended to limit the present invention, those skilled in the art without departing from the spirit and scope of the present invention, various changes or modifications may be made.

Claims (18)

1.一种印刷电路板结构,包括:一主板,其由一第一信号层、一第一接地层、一第一电源层、一第二信号层以及用以隔离各层的多层绝缘层叠合而成,其中该第一信号层与该第二信号层分别位于该主板的上下表面,该第一信号层上至少具有多个第一接点;以及一子板,其由一第三信号层、一第二接地层、一第二电源层、一第四信号层以及用以隔离各层的多层绝缘层叠合而成,其中该接地层及该电源层其中之一位于该子板的一表面,且该表面配置有多个第二接点分别与该第三信号层及该第四信号层电连接,而该子板以该表面叠合于该主板的该第一信号层的部分表面上,并通过该第二接点分别与该主板的部分该第一接点电连接,其中,该子板叠合于该主板的布线密度高的区域上。 1. A printed circuit board structure, comprising: a main board, which is composed of a first layer signal, a first ground layer, a first power supply layer, and a second signal layer for isolating the layers laminated multilayer insulated bonded together, wherein the first signal and the second signal layer are respectively positioned above and below the surface layer of the board, having at least a first plurality of signal contacts on the first layer; and a daughter board consisting of a third signal layer a second ground layer, a second power supply layer, and a fourth signal layer laminated insulating layers for isolation multilayer laminated together, wherein one of the ground layer and the power supply layer of the daughter board which is located in a surface, and the surface of the plurality of second contacts are arranged are connected to a fourth electrical signal and said third signal layer of the layer, and the sub-plate is stacked on the upper surface of the main board of the first signal layer to the surface portion , respectively, and the second contact through the first contact portion electrically connected to the board, wherein the daughter board stacked on the board with high wiring density area.
2.如权利要求1所述的印刷电路板结构,其中该第一接点与该第二接点分别藉由一导电接合材料连接。 2. The printed circuit board structure according to claim 1, wherein the first contact by a conductive bonding material respectively connected to the second contact.
3.如权利要求2所述的印刷电路板结构,其中该导电接合材料包括焊锡。 The printed circuit board structure according to claim 2, wherein the electrically conductive joining material comprises a solder.
4.如权利要求1所述的印刷电路板结构,其中该第一接点与该第二接点的表面分别还包括一锡铅合金镀层。 4. The printed circuit board structure according to claim 1, wherein the first contact and the second contact surface, respectively, further comprising a tin-lead alloy plating layer.
5.一种印刷电路板结构,包括:一主板,由一第一信号层、一第一接地层、一第一电源层、一第二信号层以及用以隔离各层的多层绝缘层叠合而成,其中该第一信号层与该第二信号层分别位于该主板的上下表面,该第一信号层上至少具有多个第一接点;以及一子板,由一第三信号层、一第二接地层、一第二电源层、一第四信号层以及用以隔离各层的多层绝缘层叠合而成,其中该接地层及该电源层其中之一配置于该子板的一表面,该子板的侧边上具有多个凹槽,该凹槽的内表面与该表面位于该凹槽附近的区域分别具有一导电镀层,以形成多个第二接点,该第二接点分别与该第三信号层及该第四信号层电连接,而该子板以该表面叠合于该主板的该第一信号层的部分表面上,并通过该第二接点分别与该主板的部分该第一接点电连接,其中,该子板叠合于 A printed circuit board structure, comprising: a motherboard, a layer of a first signal, a first ground layer, a first power supply layer, a signal layer and a second spacer layers for multi-layer insulation layer are laminated together, wherein the first signal and the second signal layer are respectively positioned above and below the surface layer of the board, having at least a first plurality of signal contacts on the first layer; and a daughter board, a layer of a third signal, a a second ground layer, a second power supply layer, a signal layer and a fourth surface for the stacked multilayer insulated isolation layers laminated together, wherein one of the ground layer and the power supply layer which is disposed on the daughter board , having a plurality of sub-grooves on the side of the plate, the inner surface of the groove is located near to the surface region of the recess each have a conductive plating to form a plurality of second contacts, the second contacts, respectively the third and the fourth signal layer electrically connected to the signal layer, and the sub-plate is stacked on the upper surface of the main board of the first signal to a portion of the surface layer, and the portion of the board with the second contact, respectively, by the first contact is electrically connected, wherein the daughter board is stacked on 主板的布线密度高的区域上。 High density region of the wiring board.
6.如权利要求5所述的印刷电路板结构,其中该第一接点与该第二接点分别藉由一导电接合材料连接。 The printed circuit board structure as claimed in claim 5, wherein the first contact by a conductive bonding material respectively connected to the second contact.
7.如权利要求6所述的印刷电路板结构,其中该导电接合材料分别附着于该第一接点及该第二接点的该导电镀层的表面。 The printed circuit board structure according to claim 6, wherein the conductive bonding material are adhered to the surface of the conductive plating of the first contact and the second contact.
8.如权利要求6所述的印刷电路板结构,其中该导电接合材料包括焊锡。 The printed circuit board structure as claimed in claim 6, wherein the electrically conductive joining material comprises a solder.
9.如权利要求5所述的印刷电路板结构,其中该导电镀层还包括一铜层以及一锡铅合金镀层。 9. The printed circuit board structure according to claim 5, wherein the coating further comprises a conductive copper layer and a tin-lead alloy plating layer.
10.一种印刷电路板结构,包括:一主板,由多层第一信号层、至少一第一接地层、至少一第一电源层以及用以隔离各层的多层绝缘层叠合而成,其中该第一信号层之一配置于该主板的一第一表面,且该第一表面具有多个第一接点;以及一子板,由多层第二信号层、至少一第二接地层、至少一第二电源层以及用以隔离各层的多层绝缘层叠合而成,其中该第二接地层及该第二电源层其中之一配置于该子板的一第二表面,且该第二表面具有多个第二接点,该第二接点分别与该第二信号层电连接,而该子板以该第二表面叠合于该主板的部分该第一表面上,并通过该第二接点分别与该主板的部分该第一接点电连接,其中,该子板叠合于该主板的布线密度高的区域上。 A printed circuit board structure, comprising: a motherboard, a plurality of layers of the first signal layer, at least a first ground layer, at least a first layer and a power source for isolating the layers from the multilayer insulating layer are laminated, wherein one of said first signal layer disposed on a first surface of the main board and the first surface having a first plurality of contacts; and a daughter board, a multilayer second signal layer, at least a second ground layer, at least a first and a second power supply layer for isolating multilayer insulated from the laminated layers together, wherein the second ground layer, and wherein the one of the second power supply layer disposed on a second surface of the sub-plate, and a second surface having a second plurality of contacts, the second contacts are electrically connected to the second signal layer, and the sub-plate stacked on the second surface of the first surface portion of the board, and through the second respectively, with the contacts of the first contact portion of the board is electrically connected, wherein the daughter board stacked on the board with high wiring density area.
11.如权利要求10所述的印刷电路板结构,其中该第一接点与该第二接点分别藉由一导电接合材料连接。 11. The printed circuit board structure according to claim 10, wherein the first contact by a conductive bonding material respectively connected to the second contact.
12.如权利要求11所述的印刷电路板结构,其中该导电接合材料包括焊锡。 12. The printed circuit board structure according to claim 11, wherein the electrically conductive joining material comprises a solder.
13.如权利要求10所述的印刷电路板结构,其中该第一接点与该第二接点的表面分别还包括一锡铅合金镀层。 13. The printed circuit board structure according to claim 10, wherein the first contact and the second contact surface, respectively, further comprising a tin-lead alloy plating layer.
14.一种印刷电路板结构,包括:一主板,由多层第一信号层、至少一第一接地层、至少一第一电源层以及用以隔离各层的多层绝缘层叠合而成,其中该第一信号层之一配置于该主板的一第一表面,且该第一表面具有多个第一接点;以及一子板,由多层第二信号层、至少一第二接地层、至少一第二电源层以及用以隔离各层的多层绝缘层叠合而成,其中该第二接地层及该第二电源层其中之一配置于该子板的一第二表面,该子板的侧边上具有多个凹槽,该凹槽的内表面与该第二表面位于该凹槽附近的区域分别具有一导电镀层,以形成多个第二接点,该第二接点分别与该第二信号层电连接,而该子板以该第二表面叠合于该主板的部分该第一表面上,并通过该第二接点分别与该主板的部分该第一接点电连接,其中,该子板叠合于该主板的布线密度高的区域上 14. A printed circuit board structure, comprising: a motherboard, a plurality of layers of the first signal layer, at least a first ground layer, at least a first layer and a power source for isolating the layers from the multilayer insulating layer are laminated, wherein one of said first signal layer disposed on a first surface of the main board and the first surface having a first plurality of contacts; and a daughter board, a multilayer second signal layer, at least a second ground layer, at least a second layer and a power source for isolating multilayer insulated from the laminated layers together, wherein the second ground layer, and wherein the one of the second power supply layer disposed on a second surface of the daughter board, the daughter board region having a plurality of grooves on the side of the inner surface of the recess located in the vicinity of the groove and the second surface each have a conductive plating to form a plurality of second contacts, the second contacts, respectively, the second electrically connecting the second signal layer, and the sub-plate stacked on the first surface of the main board to the second surface portion, and the first contact portion is electrically connected to the board by the second contact, respectively, wherein the daughter board stacked on the wiring board of the high density region
15.如权利要求14所述的印刷电路板结构,其中该第一接点与该第二接点分别藉由一导电接合材料连接。 15. The printed circuit board structure according to claim 14, wherein the first contact by a conductive bonding material respectively connected to the second contact.
16.如权利要求15所述的印刷电路板结构,其中该导电接合材料分别附着于该第一接点及该第二接点的该导电镀层的表面。 16. The printed circuit board structure according to claim 15, wherein the conductive bonding material are attached to the surface of the first contact and the second contact of the conductive plating.
17.如权利要求15所述的印刷电路板结构,其中该导电接合材料包括焊锡。 17. The printed circuit board structure according to claim 15, wherein the electrically conductive joining material comprises a solder.
18.如权利要求14所述的印刷电路板结构,其中该导电镀层还包括一铜层以及一锡铅合金镀层。 18. The printed circuit board structure according to claim 14, wherein the coating further comprises a conductive copper layer and a tin-lead alloy plating layer.
CNB991233867A 1999-10-27 1999-10-27 The printed circuit board structure CN1171516C (en)

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KR100995447B1 (en) * 2002-04-08 2010-11-18 소니 주식회사 Tuner and reception device
TWI258325B (en) 2005-03-22 2006-07-11 Quanta Comp Inc A motherboard with a RF module and the fabricating method thereof
CN100574560C (en) 2006-06-30 2009-12-23 鸿富锦精密工业(深圳)有限公司;鸿海精密工业股份有限公司 Printed circuit boards
CN102401846B (en) * 2010-09-19 2013-11-20 旺矽科技股份有限公司 Multi-power-supply circuit board and probe clamp applied to same
CN105611729A (en) * 2016-03-10 2016-05-25 安捷利电子科技(苏州)有限公司 Printed circuit board
CN108668425A (en) * 2017-03-31 2018-10-16 鹏鼎控股(深圳)股份有限公司 Signal transmssion line ontology and preparation method thereof, USBTypeC connectors
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