CN107329297A - The binding structure and display panel of display panel - Google Patents
The binding structure and display panel of display panel Download PDFInfo
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- CN107329297A CN107329297A CN201710765502.7A CN201710765502A CN107329297A CN 107329297 A CN107329297 A CN 107329297A CN 201710765502 A CN201710765502 A CN 201710765502A CN 107329297 A CN107329297 A CN 107329297A
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- binding portion
- binding
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
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- Liquid Crystal (AREA)
Abstract
The invention discloses the binding structure and display panel of display panel, including：First binding portion and the second binding portion, the first binding portion and the second binding portion include substrate layer；Substrate layer includes：Test section and conventional finger distributed area are aligned, contraposition test section includes：Align area and test section；First binding portion and the second binding portion also include：Align the alignment mark set in area, the at least two test fingers set in test section, multiple conventional fingers are set in conventional finger distributed area, and each test finger short circuit in the first binding portion, each test finger insulation set in the second binding portion is simultaneously connected to test pin.The crimping corresponding with the second binding portion of first binding portion, forms binding structure.By the present invention, it on the one hand can realize that the finger in the binding portion of two ends can accurately correspond to crimping, on the other hand, test finger occupancy binding space is small, beneficial to display panel screen accounting is improved, reduces FPC and PCB volumes.
Description
Technical field
The present invention relates to display technology field, more particularly, to the binding structure and display panel of a kind of display panel.
Background technology
Display Technique refers to the technology that the flexible visual information of conversion is provided using electronic technology, with the height of display field
Speed development, the various electronic equipments with display screen are increasingly common in life, and conventional display applications scene has：Mobile phone
Screen, computer display, electronic bill-board etc..In order to obtain more preferable display effect, performance and quality to display screen
It is required that also more and more higher.
It is well known that the quality of a display screen first has to see its display panel, because the quality of display panel is directly
Have influence on the viewing effect of picture, display panel can largely determine the brightness of display screen, contrast, color, can
The very important parameters such as angle, so in the production process of display screen, the quality control of display panel is most important.
The display panel that LCDs is used includes：Array base palte, color membrane substrates, flexible PCB (Flexible
Printed Circuit, FPC) and printed circuit board (PCB) (PCB), wherein, the connected mode of FPC and PCB and array base palte is main
Have：Flexible PCB is located on array base palte (FPC On Glass, abbreviation FOG), and flexible PCB is located on printed circuit board (PCB)
Two kinds of (FPC On Board, abbreviation FOB), both connected modes are realized by binding (Bonding) technique, are used
Binding technique can realize low-impedance electric connection between array base palte and FPC, FPC and PCB.
Because display panel occurs in preparation process because of short circuit or breaking phenomena caused by circuit question；Or because
Chip, display panel failure, and the problems such as show error message on a display screen.If production process is without effective detection side
Method, certainly will come into the market substandard product, so as to cause bad Market reaction.
In addition, it is screen accounting in the prior art to display panel, also increasingly harsher to FPC and PCB volume requirement,
Therefore it provides one kind can increase screen accounting, further reduce the binding structure of the display panel of FPC and PCB volumes and show
Show panel, be this area urgent problem to be solved.
The content of the invention
In view of this, the invention provides the binding structure and display panel of a kind of display panel, prior art is solved
The screen accounting of middle display panel is small and the bulky technical problems of FPC and PCB.
In order to solve the above-mentioned technical problem, the present invention proposes a kind of binding structure of display panel, it is characterised in that
The binding structure includes the first binding portion and the second binding portion, the first binding portion and the second binding portion
Include substrate layer；
The substrate layer includes：The contraposition test section and conventional finger distributed area set gradually in a first direction, it is described
Contraposition test section includes：The contraposition area set gradually in a second direction and test section, wherein, the first direction and described the
Two directions are parallel with the plane where the substrate layer and intersect；
The first binding portion and the second binding portion also include：The alignment mark set in the contraposition area, it is described
At least two test fingers set in test section, in the conventional finger distributed area setting in said first direction successively
Arrangement multiple conventional fingers, the first binding portion each it is described test finger short circuit, the second binding portion each
The test finger insulation set is simultaneously connected to test pin；
Wherein, the alignment mark in the first binding portion, the test finger and the conventional finger and described
The alignment mark in two binding portions, the test finger and the conventional finger are corresponding in turn to crimping, formed described in tie up
Determine structure.
In order to solve the above-mentioned technical problem, the present invention also proposes a kind of display panel, the display panel, including：First base
Plate, the second substrate being oppositely arranged with the first substrate, flexible PCB and printed circuit board (PCB)；Simultaneously including present invention offer
The display panel of any one binding structure.
Compared with prior art, the binding structure and display panel of display panel of the invention, is realized following beneficial
Effect：
The binding structure and display panel for the display panel that the present invention is provided, by introducing alignment mark in binding structure
Design, increase the aligning accuracy in two binding portions, by the way that test finger is arranged at below alignment mark, pass through the second binding
The test pin being connected in portion with test finger detects that binding structure design of the invention is applicable not only to display panel
The binding of FOG structures, is equally applicable to the binding of FOB structures, on the basis of ensureing to the normal detection of display panel, further
The width in array base palte, FPC and PCB binding area is reduced, the screen accounting of display panel is added, reduces FPC and PCB body
Product, reduces the use cost of raw material.Meanwhile, the space that binding structure design of the invention is saved can be conventional hand
The setting of finger provides more spaces, increases the reliability of binding, can also reduce binding space, reduce frame, improves screen and accounts for
Than.
By referring to the drawings to the detailed description of the exemplary embodiment of the present invention, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even
It is used for the principle for explaining the present invention together with its explanation.
Fig. 1 is the structural representation of the binding structure of display panel in correlation technique；
Fig. 2 is a kind of structural representation of optional embodiment of the binding structure of display panel provided in an embodiment of the present invention
Figure；
Fig. 3 is the partial structural diagram of the binding structure of display panel shown in Fig. 2；
Fig. 4 shows for the structure of another optional embodiment of the binding structure of display panel provided in an embodiment of the present invention
It is intended to；
Fig. 5 is the partial structural diagram of the binding structure of display panel shown in Fig. 4；
Fig. 6 is a kind of office of another optional embodiment of the binding structure of display panel provided in an embodiment of the present invention
Portion's structural representation；
Fig. 7 is a kind of schematic diagram of display panel provided in an embodiment of the present invention；
Fig. 8 is the schematic diagram of another display panel provided in an embodiment of the present invention.
Embodiment
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should be noted that：Unless had in addition
Body illustrates that the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments does not limit this
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its any limitation applied or used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
The present invention relates to a kind of binding structure of display panel, Fig. 1 is the binding structure of display panel in correlation technique
Structural representation, as shown in figure 1, when FPC is bundled on array base palte 10, passing through the rim area 11 in the one end of array base palte 10
Finger 102 is set, and FPC12 one end is also correspondingly provided with finger 103, by conductive adhesive film compression joint technique, by the finger on FPC12
103 are crimped on the finger 102 of array base palte 10, form electrical connection, realize FPC12 and array base palte 10 binding.Wherein,
After correspondence crimping is carried out, in order to detect crimping impedance, it is ensured that signal is effectively transmitted, proposed in correlation technique in every one end, will
At least two fingers are as test finger, and remaining finger is as conventional finger, by the way that at least two test fingers of one end are short
Connect, the test finger of the other end draws test pin, after by the correspondence crimping of the finger at two ends, detected and crimped by test pin
Impedance, conventional finger still completes signal transmission as signal transmission circuit.But, the appearance of test finger, which is occupied, effectively ties up
Determine space, be unfavorable for the development of FPC volume miniaturization, can also increase the rim area of display panel, influence screen accounting.Meanwhile,
Finger 103 it is corresponding with finger 102 crimping when, easily there is situation about misplacing, can also influence crimp impedance.
The binding structure and display panel for the display panel that the present invention is provided, by introducing alignment mark in binding structure
Design, increase the aligning accuracy in two binding portions, by the way that test finger is arranged at below alignment mark, ensureing contraposition essence
On the basis of spending and crimping impedance normally being detected, the width that glass substrate, FPC and PCB bind area is not increased, equivalent to section
The space of binding region has been saved, because binding region space is limited, the space that binding structure design of the invention is saved, energy
Enough settings for conventional finger provide space, increase the reliability of binding, are also beneficial to reduce binding space, reduce frame, carry
Height screen accounting, binding structure design of the invention is applicable not only to the binding of FOG structures, is equally applicable to the binding of FOB structures.
The embodiment of the present invention provides a kind of binding structure of display panel, and Fig. 2 is display surface provided in an embodiment of the present invention
A kind of structural representation of optional embodiment of the binding structure of plate, Fig. 3 is the office of the binding structure of display panel shown in Fig. 2
Portion's structural representation；As shown in Fig. 2 the binding structure includes：First binding portion 20 and the second binding portion 21, wherein, first
Binding portion 20 can be a FPC part, correspondingly, and the second binding portion 21 can be a PCB part, or can also
For other structures, the application is not defined to this, no matter which kind of structure, binding portion includes substrate layer and in substrate layer
The finger of upper setting, realizes the structure of correspondence crimping between finger.
Wherein, when binding portion is FPC, the substrate layer in binding portion can be Kapton, polyester film or fluorination second
Polypropylene film；When binding portion is PCB, the substrate layer in binding portion can be phenolic paper laminate, epoxy paper-based laminate, polyester
Glass felt layers pressing plate or epoxy glass cloth laminated board, when binding portion is FPC or PCB, the finger in binding portion is usually golden hand
Refer to, i.e., gold-plated on finger surface or chemical turmeric.
No matter which kind of substrate layer, substrate layer is subjected to subregion, referring to Fig. 2, set gradually in a first direction on X to bit test
Area 201 and conventional finger distributed area 202, with further reference to Fig. 3, the contraposition test section 201 includes：On second direction Y according to
The contraposition area 211 and test section 212 of secondary setting, wherein, the first direction X and the second direction Y with the substrate layer
The plane at place is parallel and intersects.
Referring to Fig. 2 and Fig. 3, in the first binding portion 20 and the second binding portion 21, on substrate layer in regional
The finger of setting is as follows：It is provided with the contraposition area 211 in alignment mark 213, the test section 212 and is provided with least two
Test in finger 214, the conventional finger distributed area 202 and be provided with the multiple routines being arranged in order on the first direction X
Finger 221, each test short circuit of finger 214 in the first binding portion 20, described in each of the second binding portion 21
The test insulation set of finger 214 is simultaneously connected to test pin 215.
When the first binding portion 20 and the second binding portion 21 are bound, conductive adhesive film first can be attached to the second binding
In portion 21, aligned by aligning the alignment mark 213 set in area 211, test finger 214 corresponded into crimping respectively,
Conventional finger 221 is corresponded into crimping respectively, it is ensured that aligning accuracy, two ends are accurately crimped.Complete after crimping, tester can be by
Universal meter is electrically connected in the test pin 215, and crimping effect is analyzed by detecting the crimping impedance between two binding portions
Really, it is ensured that signal normal transmission.
In the present embodiment, alignment mark 213 is set respectively in the first binding portion 20 and the second binding portion 21, two are improved
Aligning accuracy when finger is crimped between individual binding portion.And the lower section of alignment mark 213 is arranged at by finger 214 is tested, the
On one direction X, it is to avoid test finger 214 is to be arranged at intervals in the space in increase binding area, the second binding portion 21, i.e., both are phases
Mutual independent no electric signal, by by the short circuit of test finger 214 in the first binding portion 20, when the test hand in the second binding portion 21
When referring to 214 crimping corresponding with the test finger 214 in the first binding portion 20, the electricity that finger 214 is tested in the second binding portion 21 is realized
Gas is connected, and is the crimping impedance in detectable first binding portion 20 and the second binding portion 21 by test pin 215.Relative to figure
For correlation technique shown in 1, increase the setting of alignment mark, and by adjusting the position of test finger, it is to avoid increase pair
Increase the area of binding region after the mark of position, reduce preparation cost, while also reducing FPC or PCB volume, be conducive to showing
Show the development of the volume miniaturization of panel, be conducive to improving screen accounting.
Substrate layer described in the present embodiment can set one, two or more test contraposition areas, and the application does not enter to this
Row is limited.When binding region is limited, a contraposition test section can be set in substrate layer；When binding space abundance, further
Ground, as shown in Fig. 2 the substrate layer includes：Two contraposition test sections 201, along the first direction X, the conventional hand
Refer to distributed area 202 to be located between two contraposition test sections 201.
Binding portion on two substrate layers with respect to position, is further ensured two by the contraposition area 211 of reference substrate floor both sides
The crimping aligning accuracy in individual binding portion.Two test sections 212 crimp impedance between testing two binding portions, further ensure survey
The accuracy and reliability of test result.
In the present embodiment, by setting at least two to test finger in test section, to realize the impedance detection to binding area,
Further to reduce the length of test section in the first direction, further, as shown in Fig. 2 being provided with the test section 212
Two test fingers 214.Electric signal is passed to the second binding portion 21 by the first 20 two, binding portion short circuit test finger 214
In in two relatively independent test fingers 214, can be met to the first binding portion 20 by corresponding two test pins 215
And second detection for crimping impedance between binding portion 21.
Specifically, the application adds the setting of alignment mark, and has reset the position of test finger, relatively straight
Connect for setting alignment mark, the single binding area of the present embodiment can save the width of 4 test fingers 214, bind and tie for FOB
Structure, is calculated by current finger 0.3mm, and each binding sector width can at least reduce 1.2mm.
As shown in Figures 2 and 3, the alignment mark 213 in the first binding portion 20 being projected as on the substrate layer is more
Side ring；The alignment mark 213 in the second binding portion 21 is projected as polygon on the substrate layer；It is described polygonal outer
Profile matches with the Internal periphery of many side rings.
When first binding portion 20 is crimped with the second binding portion 21, hollow many side ring alignment marks 213 are designed, and are easy to pass through
Hollow clear area intuitively monitors the alignment situation in two binding portions.One layer of conducting resinl is first coated with the second binding portion 21
Film, is directed at the polygonal outline in the second binding portion 21, by the first binding portion by the Internal periphery of first binding portion side ring more than 20
20 are crimped in the second binding portion 21, and preferably polygonal outline matches with the Internal periphery of many side rings, further increase
Aligning accuracy between strong two binding portions.
Further, many side rings are straight-flanked ring, and the polygon is rectangle.Rectangular configuration design is sharp to greatest extent
With contraposition area 211 X and second direction Y in the first direction space, play a part of saving the contraposition area useful space.
Be located remotely from each other on the first direction X two of two of the first binding portion 20 test fingers 214
The distance between edge is for first apart from a, and two test fingers 214 in the second binding portion 21 are in the first direction
The distance between two edges being located remotely from each other on X are second distance b, and described first is equal to the second distance b apart from a, and
Described first is equal to length c of the polygon on the first direction X apart from a.Further ensure the first binding portion 20
The spacing and effective area of corresponding two tests finger 214, improve two binding portions as far as possible with the second binding portion 21
The effective area that middle correspondence test finger 214 is mutually crimped, it is ensured that the stability of electric signal transmission.
The structural representation of another optional real-time mode of the binding structure for the display panel that Fig. 4 provides for inventive embodiments
Figure, Fig. 5 is the partial structural diagram of the binding structure of display panel shown in Fig. 4；
As shown in Figure 4 and Figure 5, in another alternatively embodiment, wherein, the first binding portion 20 can be array
A part for substrate, correspondingly, the second binding portion 21 are a FPC part, when binding portion is array base palte, binding portion
Substrate layer can be glass substrate.When the first binding portion 20 is bound with the second binding portion 21, conductive adhesive film is attached to
On glass substrate.When the base material in binding portion is glass substrate, finger can be made up of tin indium oxide.The first binding portion 20
Projection of the alignment mark 213 on the substrate layer includes the first polygon 231, the second polygon 232 and the 3rd polygon
233, wherein, first polygon 231 and second polygon 232 extend along the second direction Y, and described second
It is intervally arranged on the Y of direction and positioned at same straight line, the 3rd polygon 233 extends along the first direction X, and described the
It is located at side of first polygon 231 away from the conventional finger distributed area 202 on one direction X, in the second direction Y
It is upper to be located between first polygon 231 and second polygon 232.
The alignment mark 213 in the second binding portion 21 is projected as T fonts on the substrate layer, the T fonts
First extension 2131 extends on the first direction X, and the second extension 2132 of the T fonts is in the second direction Y
Upper extension.
Wherein, first polygon 231 pressure corresponding with second polygon 232 and second extension 2132
Connect, the 3rd polygon 233 crimping corresponding with first extension 2131.
The alignment mark 213 in the first binding portion 20 is designed to the T-type structure disconnected, the alignment mark in the second binding portion 21
213 are designed to continuous T-type structure, and the arragement direction of two T-type structures is consistent.Two binding portions of the present embodiment are mutually crimped
When, the disconnection plot structure design of alignment mark 213, is easy to intuitively supervise by the clear area of open position in the first binding portion 20
Survey the alignment situation of two alignment marks 213.One layer of conductive adhesive film is first coated with the first binding portion 20, the second binding portion 21
Continuous T type structure is directed at the disconnection T-type structure in the first binding portion 20, and the second binding portion 21 is crimped in the first binding portion 20.
Further, first polygon 231, second polygon 232 and the 3rd polygon 233 are square
Shape.
Be located remotely from each other on the first direction X two of two of the first binding portion 20 test fingers 214
The distance between edge is for first apart from a, and two test fingers 214 in the second binding portion 21 are in the first direction
The distance between two edges being located remotely from each other on X are second distance b.
Described first is equal to the second distance b apart from a, and described first exists apart from a equal to the 3rd polygon 233
Length c on the first direction X.
On the basis of contraposition area 211 effectively contraposition area is ensured, the occupancy of test finger 214 is ensure that to greatest extent
The test finger 214 in space and the first binding portion 20 and effective area crimped of the test finger 214 in the second binding portion 21, are protected
The stability of electric signal transmission is demonstrate,proved.
The T-shaped alignment mark 213 of the present invention is not limited to the arrangement described in Fig. 4, can also be as shown in Figure 6：It is described
First polygon 231 and second polygon 232 extend and the row of interval on the first direction X along the first direction X
Cloth and positioned at same straight line, the 3rd polygon 233 extend along the second direction Y and on the first direction X with institute
State conventional finger distributed area 202 parallel, first polygon 231 is located on the first direction X and described second polygon
Between shape 232.
The alignment mark 213 in the second binding portion 21 is projected as T fonts on the substrate layer, the T fonts
First extension 2131 extends on the first direction X, and the second extension 2132 of the T fonts is in the second direction Y
Upper extension.
Wherein, first polygon 231 pressure corresponding with second polygon 232 and first extension 2131
Connect, the 3rd polygon 233 crimping corresponding with second extension 2132.
The binding structure provided using the embodiment, adds the setting of alignment mark, and reset test hand
For the position of finger, relatively direct setting alignment mark, the single binding area of the present embodiment can save the width of 4 test fingers 214
Degree, structure is bound for FOG, is calculated by current finger 0.12mm, and each FOG bindings sector width can at least reduce 0.48mm.
To reduce the space of substrate layer shared by binding portion to greatest extent, with continued reference to Fig. 2 and Fig. 4, further, if
Put the first direction X vertical with the second direction Y.
Further, with continued reference to Fig. 2 and Fig. 4, on the second direction Y, the length e of the contraposition test section 201
Less than or equal to the length f in the conventional finger distributed area 202, it is to avoid the distribution of the conventional finger of setting influence of contraposition test section.
Further, with continued reference to Fig. 2 and Fig. 4, on the second direction Y, the length k of the test finger 214 is small
In the length j of the conventional finger 221, saved in the second direction Y length for testing the relatively conventional reduction of finger 221 of finger 214
The space of province, for setting alignment mark 213, space-consuming of the reduction binding portion in substrate layer Y in a second direction, it is to avoid increase
Alignment mark and on second direction Y increase binding region area.
In some optional embodiments, with reference to Fig. 3 and Fig. 5, on the first direction X, the length in the contraposition area 211
Spend the length h that g is more than or equal to the test section 212.Two binding portions are when aligning crimping, by referring to alignment mark 213,
To ensure its aligning accuracy, the present embodiment is less than or equal to the contraposition length of area 211 by limiting the length of test section 212, makes test
Area 212 does not take effective binding space additionally, and binding space is saved and arrives least limit.
To avoid, because binding portion aligning accuracy difference causes the effective area that the golden palmistry of test is mutually crimped in two test sections low, causing
Make electric signal transmission uneven, and influence signal effectively to transmit, the present embodiment is by adjusting alignment mark and test in binding portion
The structure design of finger, so as to lift the aligning accuracy in binding portion and the accuracy of test.Not concrete restriction register guide of the invention
The shape and arrangement of note and test finger.
The embodiment of the structure of binding as described above of the invention can be applied to the display panel of following structure, the display surface
Plate, including：First substrate, the second substrate being oppositely arranged with the first substrate, flexible PCB and printed circuit board (PCB).Its
In, when the first substrate is array base palte, the second substrate is color membrane substrates；Flexible PCB and printed circuit board (PCB) with
The connected mode of array base palte mainly has：Flexible PCB is located at (FPC On Glass, abbreviation FOG), flexible circuit on substrate
Plate is located on printed circuit board (PCB) two kinds of (FPC On Board, abbreviation FOB), both connected modes be all by the present invention as above
What shown binding (Bonding) technique was realized, and low-impedance electric connection between display screen and FPC, PCB can be realized.
A kind of structural representation for display panel that Fig. 7 provides for the present invention, including as above tying up described in any embodiment
Determine structure.In the display panel, it is related to binding and detection between array base palte 22 and flexible PCB 23.Tie up when described first
When determining portion and being arranged on the array base palte 22, namely the part that the first binding portion is the array base palte 22, it is described
Second binding portion is arranged on the flexible PCB 23, namely one that the second binding portion is the flexible PCB 23
Point；By binding flexible PCB 23 in the stepped region of array base palte 22.Because array base palte is transparent configuration, and positioned at array base
Alignment mark on plate is provided with clear area, and the dorsal part from array base palte binding portion can be real-time by the clear area of alignment mark
The crimping situation of alignment mark in two binding portions is monitored, corresponding adjustment can be made when aligning bad, to ensure contraposition
Accuracy.
The structural representation for another display panel that Fig. 8 provides for the present invention, including as above described in any embodiment
Bind structure.In the display panel, one end of flexible PCB 23 is bound on array base palte 22, flexible PCB 23 it is another
End is bound on printed circuit board (PCB) 24.When the first binding portion is arranged on the array base palte 22, namely described first
Binding portion is a part for the array base palte 22, and the second binding portion is arranged on the flexible PCB 23, Ye Jisuo
State the part that the second binding portion is the flexible PCB 23；When the first binding portion is arranged at the printed circuit board (PCB) 24
When upper, namely the part that the first binding portion is the printed circuit board (PCB) 24, the second binding portion is arranged at described soft
Property circuit board 23 on, namely the second binding portion be the flexible PCB 23 a part.By by printed circuit board (PCB) 24
Bound with flexible PCB 23, while array base palte 22 is bound with flexible PCB 23, realize printed circuit board (PCB) 24 and array
The signal transmission of substrate 22.The display panel of the present invention has the identical technique effect of above-mentioned binding structure, no longer goes to live in the household of one's in-laws on getting married herein
State.
By above-described embodiment, binding structure of the invention and display panel have reached following beneficial effect：
The binding structure and display panel for the display panel that the present invention is provided, by introducing alignment mark in binding structure
Design, increase the aligning accuracy in two binding portions, by the way that test finger is arranged at below alignment mark, pass through the second binding
The test pin being connected in portion with test finger detects that binding structure design of the invention is applicable not only to display panel
The binding of FOG structures, is equally applicable to the binding of FOB structures, on the basis of ensureing to the normal detection of display panel, further
The width in glass substrate, FPC and PCB binding area is reduced, the use cost of raw material is reduced.Simultaneously as binding area
Domain space is limited, the space that binding structure design of the invention is saved, and can provide more skies for the setting of conventional finger
Between, increase the reliability of binding, can also reduce binding space, reduce frame, improve screen accounting.
Although some specific embodiments of the present invention are described in detail by example, the skill of this area
Art personnel are it should be understood that example above is merely to illustrate, the scope being not intended to be limiting of the invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (13)
1. a kind of binding structure of display panel, it is characterised in that
The binding structure includes the first binding portion and the second binding portion, and the first binding portion and the second binding portion are wrapped
Include substrate layer；
The substrate layer includes：The contraposition test section and conventional finger distributed area set gradually in a first direction, the contraposition
Test section includes：The contraposition area set gradually in a second direction and test section, wherein, the first direction and the second party
Plane where substrate layer described in Xiang Junyu is parallel and intersects；
The first binding portion and the second binding portion also include：The alignment mark set in the contraposition area, the test
What is set at least two test fingers set in area, the conventional finger distributed area is arranged in order in said first direction
Multiple conventional fingers, each test finger short circuit in the first binding portion, described in each of the second binding portion
Test finger insulation set is simultaneously connected to test pin；
Wherein, the alignment mark in the first binding portion, the test finger and the conventional finger and described second are tied up
The alignment mark, the test finger and the conventional finger for determining portion are corresponding in turn to crimping, form the binding knot
Structure.
2. the binding structure of display panel according to claim 1, it is characterised in that
Two test fingers are provided with the test section.
3. the binding structure of display panel according to claim 1, it is characterised in that
The first direction is vertical with the second direction；
In this second direction, the length of the test finger is less than the length of the conventional finger.
4. the binding structure of display panel according to any one of claim 1 to 3, it is characterised in that
In said first direction, the length in the contraposition area is more than or equal to the length of the test section.
5. the binding structure of display panel according to claim 4, it is characterised in that
The alignment mark in the first binding portion is projected as many side rings on the substrate layer；
The alignment mark in the second binding portion is projected as polygon on the substrate layer；
The polygonal outline matches with the Internal periphery of many side rings.
6. the binding structure of display panel according to claim 5, it is characterised in that
Many side rings are straight-flanked ring, and the polygon is rectangle；
Between two edges that two test fingers in the first binding portion are located remotely from each other in said first direction
Two be located remotely from each other in said first direction apart from two test fingers for the first distance, the second binding portion
The distance between edge is second distance, and first distance is equal to the second distance, and first distance is equal to described
The length of polygon in said first direction.
7. the binding structure of display panel according to claim 4, it is characterised in that
Projection of the alignment mark in the first binding portion on the substrate layer includes the first polygon, the second polygon and the
Three polygons, wherein, first polygon and second polygon are intervally arranged and positioned at same in this second direction
One straight line, the 3rd polygon is located at first polygon away from the conventional finger distributed area in said first direction
Side, in this second direction between first polygon and second polygon；
The alignment mark in the second binding portion is projected as T fonts, the first extension of the T fonts on the substrate layer
Extend in said first direction, the second extension of the T fonts extends in this second direction,
Wherein, first polygon with second polygon is corresponding with second extension crimps, the described 3rd is polygon
Shape crimping corresponding with first extension.
8. the binding structure of display panel according to claim 7, it is characterised in that
First polygon, second polygon and the 3rd polygon are rectangle；
Between two edges that two test fingers in the first binding portion are located remotely from each other in said first direction
Two be located remotely from each other in said first direction apart from two test fingers for the first distance, the second binding portion
The distance between edge is second distance；
First distance is equal to the second distance, and first distance is equal to the 3rd polygon in the first party
Upward length.
9. the binding structure of display panel according to claim 1, it is characterised in that
In this second direction, the length of the contraposition test section is less than or equal to the length in the conventional finger distributed area.
10. the binding structure of display panel according to claim 9, it is characterised in that
The substrate layer includes：Two contraposition test sections, along the first direction, the conventional finger distributed area is located at two
Between the individual contraposition test section.
11. a kind of display panel, including：First substrate, the second substrate being oppositely arranged with the first substrate, flexible PCB
And printed circuit board (PCB)；It is characterised in that it includes the binding structure any one of claim 1 to 10.
12. display panel according to claim 11, it is characterised in that
When the first binding portion is arranged on the first substrate, the second binding portion is arranged at the flexible PCB
On.
13. display panel according to claim 11, it is characterised in that
When the first binding portion is arranged on the flexible PCB, the second binding portion is arranged at the printed circuit
On plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710765502.7A CN107329297A (en) | 2017-08-30 | 2017-08-30 | The binding structure and display panel of display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710765502.7A CN107329297A (en) | 2017-08-30 | 2017-08-30 | The binding structure and display panel of display panel |
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| CN107329297A true CN107329297A (en) | 2017-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710765502.7A Pending CN107329297A (en) | 2017-08-30 | 2017-08-30 | The binding structure and display panel of display panel |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001156417A (en) * | 1999-11-30 | 2001-06-08 | Optrex Corp | Pattern for inspecting connection between circuit boards |
| CN203616553U (en) * | 2013-12-19 | 2014-05-28 | Tcl显示科技（惠州）有限公司 | Flexible printed circuit board, touchpad, liquid crystal panel and liquid crystal display screen |
| CN105607316A (en) * | 2016-03-22 | 2016-05-25 | 京东方科技集团股份有限公司 | Array substrate mother board and display panel mother board |
| CN205643942U (en) * | 2016-05-24 | 2016-10-12 | 合肥京东方光电科技有限公司 | Circuit plate structure and display device |
| CN106973485A (en) * | 2017-03-14 | 2017-07-21 | 惠科股份有限公司 | Display device and flexible circuit board thereof |
-
2017
- 2017-08-30 CN CN201710765502.7A patent/CN107329297A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001156417A (en) * | 1999-11-30 | 2001-06-08 | Optrex Corp | Pattern for inspecting connection between circuit boards |
| CN203616553U (en) * | 2013-12-19 | 2014-05-28 | Tcl显示科技（惠州）有限公司 | Flexible printed circuit board, touchpad, liquid crystal panel and liquid crystal display screen |
| CN105607316A (en) * | 2016-03-22 | 2016-05-25 | 京东方科技集团股份有限公司 | Array substrate mother board and display panel mother board |
| CN205643942U (en) * | 2016-05-24 | 2016-10-12 | 合肥京东方光电科技有限公司 | Circuit plate structure and display device |
| CN106973485A (en) * | 2017-03-14 | 2017-07-21 | 惠科股份有限公司 | Display device and flexible circuit board thereof |
Cited By (31)
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|---|---|---|---|---|
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| CN108205215B (en) * | 2017-12-26 | 2021-06-22 | 张家港康得新光电材料有限公司 | Method for connecting display panel and circuit board |
| CN108447413A (en) * | 2018-02-12 | 2018-08-24 | 武汉天马微电子有限公司 | Display device |
| CN108493194B (en) * | 2018-03-28 | 2020-07-24 | 京东方科技集团股份有限公司 | Array substrate and display panel |
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| CN110174968A (en) * | 2019-05-24 | 2019-08-27 | 武汉天马微电子有限公司 | Display device |
| CN110174968B (en) * | 2019-05-24 | 2023-01-10 | 武汉天马微电子有限公司 | Display device |
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| CN110967880A (en) * | 2019-11-27 | 2020-04-07 | Tcl华星光电技术有限公司 | Display panel and display device |
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Application publication date: 20171107 |