CN113721093A - Display panel mother board, detection method and system of display panel mother board - Google Patents
Display panel mother board, detection method and system of display panel mother board Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G01R27/2605—Measuring capacitance
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
Abstract
The embodiment of the application provides a display panel mother board, a detection method and a detection system of the display panel mother board, wherein the display mother board comprises at least one test sub-display panel, and the test sub-display panel comprises: the at least one first electrode pad is electrically connected with the first electrode layer on the test sub-display panel and used for receiving a first voltage signal and transmitting the first voltage signal to the first electrode layer; the touch control device comprises a plurality of touch control electrodes, wherein at least one touch control electrode in the plurality of touch control electrodes is a testing touch control electrode, the testing touch control electrode is used for receiving a second voltage signal, and the first voltage signal and the second voltage signal are coupled to generate a capacitance induction signal. The embodiment of the application can realize the non-defective product detection of the self-capacitance touch display panel.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a display panel mother board, and a detection method and a detection system of the display panel mother board.
Background
With the continuous development of display technologies, the application range of display panels is more and more extensive, and touch display panels with touch functions are also widely applied. According to different touch control principles, touch control display panels can be generally divided into resistive touch control display panels, capacitive touch control display panels, infrared touch control display panels, and the like, and capacitive touch control display panels can be further divided into self-capacitive touch control display panels and mutual-capacitive touch control display panels. As the name implies, a self-capacitance touch display panel can be understood as a touch display panel in which capacitance is generated between the touch electrode itself and "ground".
Since the touch display panel is prone to poor connection or other circuit abnormalities, in order to ensure that the touch display panel can meet the design requirements, the touch display panel usually needs to be detected before the touch display panel leaves the factory. In the related art, the problem that good product detection cannot be performed on the self-capacitance touch display panel exists.
Disclosure of Invention
The embodiment of the application provides a display panel mother board, a detection method and a detection system of the display panel mother board, which can realize good product detection of a self-capacitance touch display panel.
In a first aspect, an embodiment of the present application provides a display panel motherboard, where the display panel motherboard includes at least one test sub-display panel, and the test sub-display panel includes: the at least one first electrode pad is electrically connected with the first electrode layer on the test sub-display panel and used for receiving a first voltage signal and transmitting the first voltage signal to the first electrode layer; the touch control device comprises a plurality of touch control electrodes, wherein at least one touch control electrode in the plurality of touch control electrodes is a testing touch control electrode, the testing touch control electrode is used for receiving a second voltage signal, and the first voltage signal and the second voltage signal are coupled to generate a capacitance induction signal.
In some embodiments, the test sub-display panel further includes at least one switching unit, a control terminal of the switching unit is configured to receive a first control signal, a first terminal of the switching unit is configured to receive a first voltage signal, a second terminal of the switching unit is connected to the first electrode pad, and the switching unit transmits the first voltage signal to the first electrode layer under the control of the first control signal.
In some embodiments, the test sub-display panel includes a substrate, an array layer, a second electrode layer, an organic light emitting layer, and a first electrode layer, which are stacked, the array layer sequentially includes an active layer, a gate insulating layer, and a source/drain electrode layer, the control end of the switch unit is located in the gate layer, and the first end of the switch unit and the second end of the switch unit are located in the source/drain electrode layer.
Therefore, the switch unit can be prepared by the same process as other transistors in the drive circuit of the test sub-display panel, and the process is simplified.
In some embodiments, the test sub-display panel includes an array substrate and a package cover plate that are oppositely disposed, and each of the array substrate and the package cover plate includes a display area and a non-display area surrounding the display area.
In some embodiments, the at least one first electrode pad is located on the array substrate, and the plurality of touch electrodes are located on the package cover plate.
In some embodiments, the non-display area of the package cover plate is provided with a plurality of first touch pads, and the plurality of first touch pads are electrically connected with the plurality of touch electrodes in a one-to-one correspondence manner; the array substrate is also provided with a plurality of second touch pads and a plurality of third touch pads, the plurality of second touch pads are welded with the plurality of first touch pads in a one-to-one correspondence manner, and the plurality of third touch pads are electrically connected with the plurality of second touch pads in a one-to-one correspondence manner; the test touch electrode receives a second voltage signal through the first touch pad, the second touch pad and the third touch pad which are electrically connected.
In some embodiments, the non-display region of the array substrate includes: and the first end of the switch unit is electrically connected with the first voltage signal bonding pad.
Thus, a first voltage signal is provided for the first electrode layer through the first voltage signal pad, and a second voltage signal is provided for the test touch electrode, so that the first voltage signal and the second voltage signal are coupled with each other to generate a capacitance sensing signal on the test touch electrode; the capacitance value between the testing touch electrode and the first electrode layer can be determined by detecting the capacitance induction signal, so that the quality of the testing sub-display panel is detected, and the good product detection of the self-capacitance touch display panel is realized.
In some embodiments, the non-display region of the array substrate further includes: the grounding pad is electrically connected with a grounding signal wire positioned in a non-display area of the array substrate; the first voltage signal pad is multiplexed with the ground pad.
Therefore, the first voltage signal bonding pad and the grounding bonding pad are multiplexed, so that a first voltage signal can be provided for the first electrode layer, and the number of bonding pads on the array substrate can be reduced and the manufacturing cost of the display panel can be saved because no new bonding pad needs to be additionally arranged as the first voltage signal bonding pad.
In some embodiments, the non-display area of the array substrate further includes a test bonding area, and the test bonding area includes: the at least one first voltage signal testing pad corresponds to the at least one first voltage signal testing pad one to one, and the size of the first voltage signal testing pad is larger than that of the first voltage signal testing pad; and/or a plurality of fourth touch pads, wherein the plurality of fourth touch pads are electrically connected with the plurality of third touch pads in a one-to-one correspondence manner, and the size of each fourth touch pad is larger than that of each third touch pad; the test touch electrode receives a second voltage signal through the first touch pad, the second touch pad, the third touch pad and the fourth touch pad which are electrically connected.
Because the size of the first voltage signal test bonding pad is larger than that of the first voltage signal bonding pad, and the size of the fourth touch bonding pad is larger than that of the third touch bonding pad, when the first voltage signal bonding pad and/or the third touch bonding pad are connected with the bonding pad on the test flexible circuit board through the bonding pad with larger size, the first voltage signal bonding pad and/or the third touch bonding pad can be connected more easily and are not easy to make mistakes, so that the occurrence of connection faults is reduced, and the accuracy of good product detection of the display panel mother board is ensured.
In some embodiments, the non-display area of the array substrate further includes a test bonding area, and the test bonding area includes: and the control end of the switch unit is electrically connected with the first control signal bonding pad.
Therefore, the first control signal is provided for the switch unit through the first control signal pad, so that the switch unit is conducted under the control of the first control signal, the first voltage signal can be output to the first electrode layer through the switch unit, a voltage difference is generated between the first voltage signal and the second voltage signal on the testing touch electrode, and a capacitor is generated between the testing touch electrode and the first electrode layer under the action of the voltage difference. The capacitance value between the testing touch electrode and the first electrode layer can be determined by detecting a capacitance induction signal generated by mutual coupling of the first voltage signal and the second voltage signal on the testing touch electrode, so that the quality of the testing sub-display panel is detected, and the good product detection of the self-capacitance touch display panel is realized.
In a second aspect, an embodiment of the present application provides a system for detecting a motherboard of a display panel, where the system includes: in one embodiment of the first aspect, a display panel motherboard includes at least one test sub-display panel; the flexible circuit board is tested, and the flexible circuit board is electrically connected with the test sub-display panel; and the capacitance detection module is electrically connected with the test flexible circuit board and is used for outputting a first voltage signal to the first electrode layer of the test sub-display panel, outputting a second voltage signal to the test touch electrode of the test sub-display panel and receiving a capacitance induction signal generated by coupling the first voltage signal and the second voltage signal.
In some embodiments, the test sub-display panel includes an array substrate and a package cover plate which are oppositely arranged, the array substrate includes at least one first voltage signal pad and a switch unit, a control terminal of the switch unit is used for receiving a first control signal, a first terminal of the switch unit is connected to the first voltage signal pad, and a second terminal of the switch unit is connected to the first electrode pad; the testing flexible circuit board comprises at least one voltage signal bonding pad, the at least one voltage signal bonding pad is correspondingly and electrically connected with the at least one first voltage signal bonding pad, and the capacitance detection module outputs a first voltage signal to the first electrode layer through the electrically connected voltage signal bonding pad, the first voltage signal bonding pad, the switch unit and the first electrode bonding pad.
In some embodiments, the non-display region of the array substrate further includes a test bonding region including at least one first voltage signal test pad, each first voltage signal pad being electrically connected to the voltage signal pad through a corresponding first voltage signal test pad.
In some embodiments, the non-display area of the array substrate further includes a test bonding area, the test bonding area includes at least one first control signal pad, and the control end of the switch unit receives the first control signal through the connected first control signal pad; the testing flexible circuit board comprises at least one control signal bonding pad, the at least one control signal bonding pad is correspondingly and electrically connected with the at least one first control signal bonding pad, and the capacitance detection module outputs a first control signal to the control end of the switch unit through the electrically connected control signal bonding pad and the first control signal bonding pad.
In a third aspect, an embodiment of the present application provides a method for detecting a display panel motherboard, where the display panel motherboard includes the display panel motherboard provided in any embodiment of the first aspect, and the method includes: outputting a first voltage signal to the first electrode layer; and outputting a second voltage signal to the test touch electrode, and receiving a capacitance induction signal generated by coupling the first voltage signal and the second voltage signal.
In some embodiments, the test sub-display panel further includes at least one switching unit, a control terminal of the switching unit is configured to receive a first control signal, a first terminal of the switching unit is configured to receive a first voltage signal, a second terminal of the switching unit is connected to the first electrode pad, and the switching unit transmits the first voltage signal to the first electrode layer under the control of the first control signal; the sub-display panel of test includes relative array substrate and the encapsulation apron that sets up, and the non-display area of array substrate includes that the test binds the district, and the test binds the district and includes: the control end of the switch unit is electrically connected with the first control signal bonding pad and used for receiving a first control signal through the first control signal bonding pad; the method further comprises the following steps: and after the testing of the testing sub-display panel is finished, removing the testing binding area on the testing sub-display panel along the thickness direction of the display mother board.
Therefore, after the good product detection is completed, the test binding region is removed, and the first control signal pad in the test binding region can be removed, so that the control end of the switch unit is always in a suspended state, namely the switch unit is always in a cut-off state in the subsequent use process of the display panel, and the first electrode layer can not be influenced by the first voltage signal and can normally work in the use process of the display panel.
The display panel mother board, the detection method and the detection system of the display panel mother board of the embodiment of the application have the advantages that the display mother board comprises at least one test sub-display panel, and the test sub-display panel comprises the following components: the at least one first electrode pad is electrically connected with the first electrode layer on the test sub-display panel and used for receiving a first voltage signal and transmitting the first voltage signal to the first electrode layer; the touch control device comprises a plurality of touch control electrodes, wherein at least one touch control electrode in the plurality of touch control electrodes is a testing touch control electrode, the testing touch control electrode is used for receiving a second voltage signal, and the first voltage signal and the second voltage signal are coupled to generate a capacitance induction signal. According to the embodiment of the application, the first voltage signal is provided for the first electrode layer, the second voltage signal is provided for the testing touch electrode, a voltage difference is generated between the testing touch electrode and the first electrode layer, the capacitance is generated between the testing touch electrode and the first electrode layer under the effect of the voltage difference, the capacitance value between the testing touch electrode and the first electrode layer can be determined by detecting the capacitance induction signal generated by mutual coupling of the first voltage signal and the second voltage signal on the testing touch electrode, the quality of the testing sub-display panel is detected, and the good product detection of the self-capacitance touch display panel is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an array substrate of an In-cell touch display panel;
FIG. 2 is a schematic structural diagram of a package cover plate of an In-cell touch display panel;
fig. 3 is a schematic structural diagram of a display panel motherboard according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of an array substrate for testing a sub-display panel according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram illustrating a structure of a package cover for testing a sub-display panel according to an embodiment of the present application;
FIG. 6 is a cross-sectional view taken along line A-A' of FIGS. 4 and 5;
FIG. 7 is a cross-sectional view of an array substrate of any one of the test sub-display panels in an embodiment of the present application;
FIG. 8 is a schematic view of an array substrate for testing a sub-display panel according to another embodiment of the present application;
FIG. 9 is a schematic view illustrating a package cover for testing a sub-display panel according to still another embodiment of the present application;
FIG. 10 is a schematic view illustrating a structure of an array substrate for testing a sub-display panel according to still another embodiment of the present application;
FIG. 11 is a cross-sectional view taken along line B-B' of FIGS. 9 and 10;
FIG. 12 is a schematic view illustrating a structure of an array substrate for testing a sub-display panel according to still another embodiment of the present application;
FIG. 13 is a schematic view illustrating a structure of an array substrate for testing a sub-display panel according to still another embodiment of the present application;
FIG. 14 is a schematic view illustrating a structure of an array substrate for testing a sub-display panel according to still another embodiment of the present application;
FIG. 15 is a schematic view illustrating a structure of an array substrate for testing a sub-display panel according to still another embodiment of the present application;
FIG. 16 is a schematic view illustrating a structure of an array substrate for testing a sub-display panel according to still another embodiment of the present application;
fig. 17 is a schematic flowchart of a system for detecting a motherboard of a display panel according to an embodiment of the present disclosure;
fig. 18 is a flowchart illustrating a method for detecting a motherboard of a display panel according to an embodiment of the present disclosure.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative only and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Before explaining the technical solutions provided by the embodiments of the present application, in order to facilitate understanding of the embodiments of the present application, the present application first specifically explains the problems existing in the prior art:
currently, touch display panels can be classified into an external touch display panel and an internal touch display panel. The In-cell touch display panel may further include an In-cell touch display panel. Compared with an externally-hung touch display panel (i.e., the touch panel and the display panel are independently arranged and the touch panel is attached to the packaging layer of the display panel), the embedded touch display panel has the advantage of being thin.
The In-cell Touch Display panel may adopt a Touch and Display Driver Integration (TDDI) manner, that is, the Touch electrodes are electrically connected to Touch pads (Touch pads) In a bonding region on the Display panel array substrate, so that the Touch electrodes are driven by the driving chip. Specifically, as shown in fig. 1 and 2, the array substrate 100 ' and the package cover 200 ' of the touch display panel both include a display area AA ' and a non-display area NA ' surrounding the display area, and the non-display area NA ' of the array substrate 100 ' includes a binding area NA1 '. The non-display area NA ' of the array substrate 100 ' is provided with a plurality of touch pads 101 '. On the package cover 200 ', a plurality of touch pads 201 ' are disposed on the non-display area NA ' of the package cover 200 ' corresponding to the plurality of touch pads 101 ', and the plurality of touch pads 201 ' are disposed opposite to the plurality of touch pads 101 ' and are welded in a one-to-one correspondence. The bonding area NA1 ' of the array substrate 100 ' is further provided with a plurality of touch connection pads 102 ', and the touch connection pads 102 ' are electrically connected with the touch pads 101 ' in a one-to-one correspondence manner. The touch electrode (not shown in fig. 2) on the package cover 200 'is electrically connected to the driving chip through the touch pad 201', the touch pad 101 ', and the touch connection pad 102' in sequence, so as to drive the touch electrode. Currently, the touch display panel (e.g., In-cell touch display panel) adopting the TDDI method is usually a self-capacitance touch display panel, and the self-capacitance touch display panel can be understood as a touch display panel generating capacitance between the touch electrode itself and "ground". "ground" is to be understood as a potential of zero.
The inventor of the present application has found that, in a self-capacitance touch display panel, generally, only when a touch object such as a finger touches the touch display panel, the capacitance of the touch object is superimposed on the capacitance of the screen body, so that the capacitance on the touch electrode can be detected. In the case where the touch object does not contact the touch display panel, the capacitance between the touch electrode and the "ground" is very small, so that it is difficult to detect the capacitance on the touch electrode. In order to eliminate the interference of the touch object on the detection result, when performing a good quality detection on the test sub-display panel in the touch display panel motherboard, it is usually necessary to avoid the touch object from contacting the test sub-display panel. Therefore, for the self-capacitance touch display panel, since the capacitance on the touch electrode cannot be detected, the related art cannot realize good product detection of the test sub-display panel in the touch display panel motherboard by a capacitance detection method.
In view of the above research findings of the inventors, embodiments of the present application provide a display panel motherboard, a method and a system for detecting the display panel motherboard, which can implement good product detection for a self-capacitance touch display panel.
The technical idea of the embodiment of the application is as follows: the testing touch control electrode is used as one polar plate of the capacitor, the first electrode layer (such as a cathode layer) is used as the other polar plate of the capacitor, a first voltage signal is provided for the first electrode layer, a second voltage signal is provided for the testing touch control electrode, so that a voltage difference is generated between the testing touch control electrode and the first electrode layer, and the capacitor is generated between the testing touch control electrode and the first electrode layer under the action of the voltage difference. The capacitance value of the capacitor can be determined by detecting a capacitance sensing signal generated by mutual coupling of the first voltage signal and the second voltage signal on the testing touch control electrode, so that the quality of the testing sub-display panel is detected in a capacitance detection mode, and the good product detection of the self-capacitance touch control display panel is realized.
First, a display panel motherboard provided in an embodiment of the present application will be described.
As shown in fig. 3, the display panel mother board 10 provided in the embodiment of the present application may include a plurality of sub display panels 11, wherein a part of the sub display panels 11 or all of the sub display panels 11 in the plurality of sub display panels 11 serve as a test sub display panel 11 a. The display panel motherboard 10 may be specifically a self-capacitance touch display panel motherboard. The sub display panel 11 may be understood as a display panel to be cut, that is, one display panel mother board 10 may cut a plurality of sub display panels 11. Wherein each of the cut sub display panels 11 may be mounted on an electronic device as a screen of the electronic device. It should be noted that the number, size, and shape of the sub display panels 100 in fig. 3 are only schematic, that is, one display panel mother board 10 may include any number of sub display panels 11, and the size and shape of the sub display panels 11 may also be flexibly adjusted according to practical situations, which is not limited in this embodiment of the present application.
Fig. 4 schematically illustrates an array substrate of any one of the test sub display panels. Fig. 5 schematically illustrates a package cover plate of any one of the test sub-display panels. Fig. 6 is a cross-sectional view taken along a-a' direction of fig. 4 and 5. As shown in fig. 4 to 6, the test sub-display panel 11a includes at least one first electrode pad 101, the at least one first electrode pad 101 is electrically connected to the first electrode layer on the test sub-display panel 11a, and the first electrode pad 101 is configured to receive the first voltage signal V1 and transmit the first voltage signal V1 to the first electrode layer. The test sub-display panel 11a further includes a plurality of touch electrodes 201, at least one touch electrode 201 of the plurality of touch electrodes 201 is a test touch electrode 201a, and the test touch electrode 201a is configured to receive the second voltage signal V2. It is easily understood that the voltage value of the first voltage signal V1 is not equal to the voltage value of the second voltage signal V2.
Therefore, by providing the first voltage signal V1 for the first electrode layer and providing the second voltage signal V2 for the testing touch electrode 201a, a voltage difference is generated between the testing touch electrode 201a and the first electrode layer, a capacitance is generated between the testing touch electrode 201a and the first electrode layer under the action of the voltage difference, and the magnitude of the capacitance value between the testing touch electrode 201a and the first electrode layer can be determined by detecting a capacitance sensing signal generated by the mutual coupling of the first voltage signal V1 and the second voltage signal V2 on the testing touch electrode 201a, so as to detect the quality of the testing sub-display panel, thereby realizing the good product detection of the self-capacitance touch display panel.
It should be noted that, in the embodiment of the present application, the number of the test touch electrodes 201a is not limited, and the test touch electrode 201a may be one touch electrode 201 or may be a plurality of touch electrodes 201. In the good product detection, a part of the touch electrodes 201 or all of the touch electrodes 201 in the test sub-display panel 11a may be used as the test touch electrodes 201 a. In the detection manner, each test touch electrode 201a may be detected one by one, multiple test touch electrodes 201a may be detected simultaneously, or even all test touch electrodes 201a may be detected simultaneously, so as to increase the detection speed and shorten the detection time.
As shown in fig. 4 to 6, according to some embodiments of the present disclosure, optionally, the test sub-display panel 11a may include an array substrate 100 and a package cover 200 disposed oppositely, and each of the array substrate 100 and the package cover 200 includes a display area AA and a non-display area NA surrounding the display area AA. The first electrode pad 101 may be located on the array substrate 100, and particularly, may be located in the non-display area NA of the array substrate 100. Accordingly, the first electrode layer may be positioned within the array substrate 100 and electrically connected to the first electrode pad 101. And a plurality of touch electrodes 201 may be located on the package cover 200. During the detection, the test sub-display panel 11a may be connected to the capacitance detection module 300, and the test touch electrode 201a receives the second voltage signal V2 output by the capacitance detection module 300 and feeds back the generated capacitance sensing signal to the capacitance detection module 300. Illustratively, the capacitance detection module 300 may include a touch and display integrated chip (TDDI chip). The TDDI chip integrates the functions of the touch driving chip and the display driving chip, and can complete the driving of touch and display. During good product detection, the TDDI chip may perform steps required to be performed by the capacitance detection module 300, and implement corresponding functions. For example, the TDDI chip may send the second voltage signal V2 to the test touch electrode 201a, and receive and analyze the capacitance sensing signal fed back by the test touch electrode 201a to obtain the result of testing the sub-display panel.
In some embodiments, for example, the TDDI chip may obtain the capacitance between the test touch electrode 201a and the first electrode layer by analyzing the received capacitance sensing signal. When the capacitance between the first electrode layer and the test touch electrodes 201a of the first number preset in the test sub-display panel 11a is greater than the preset threshold, it is determined that the test sub-display panel 11a is good. The preset first quantity and the preset threshold value can be flexibly set according to actual conditions, and the embodiment of the application is not limited to this. For example, the predetermined first number of test touch electrodes 201a in the test sub-display panel 11a may be all the test touch electrodes 201a in the test sub-display panel 11 a. The preset threshold includes, but is not limited to, 0. For example, there are 100 test touch electrodes 201a in the test sub-display panel 11a, and when the capacitance values between the 100 test touch electrodes 201a and the first electrode layer are all greater than 0, it is indicated that the 100 test touch electrodes 201a all generate capacitance, which proves that the 100 test touch electrodes 201a and the routing thereof are good, and the test sub-display panel 11a is good. It is easy to understand that when the capacitance values between the first electrode layers and the predetermined second number of test touch electrodes 201a in the test sub-display panel 11a are less than or equal to the predetermined threshold, the test sub-display panel 11a is determined to be a defective product. The preset second number can be flexibly set according to actual conditions, and the embodiment of the application is not limited to this. For example, when the capacitance between the test touch electrodes 201a and the first electrode layer in the test sub-display panel 11a is equal to 0, which indicates that the test touch electrodes 201a or the traces thereof are faulty, the test sub-display panel 11a is a defective product, and the number of the test sub-display panel is not limited to 1.
As shown in fig. 4 to 6, according to some embodiments of the present application, optionally, in order to provide the first voltage signal to the first electrode layer, the test sub-display panel 11a may further include at least one switch unit 102, a control terminal of the switch unit 102 is configured to receive the first control signal S1, a first terminal of the switch unit 102 is configured to receive the first voltage signal V1, a second terminal of the switch unit 102 is connected to the first electrode pad 101, and the switch unit 102 transmits the first voltage signal V1 to the first electrode layer under the control of the first control signal S1. Alternatively, the switching unit 102 may be located in the array substrate 100.
The first electrode layer will be briefly described below.
In the embodiment of the present application, the first electrode layer may be a metal layer (i.e., a cathode layer) where a cathode of a pixel unit in the sub-display panel 11 is located, as shown in fig. 7. As shown in fig. 7, the display area AA of the array substrate 100 includes a first substrate 701, an array layer 702, a second electrode layer 703, an organic light emitting layer 704, a first electrode layer 705, and an insulating layer 706, which are stacked. Light emitting elements of a plurality of colors, such as a red light emitting element (R sub-pixel), a green light emitting element (G sub-pixel), and a blue light emitting element (B sub-pixel), are provided in the organic light emitting layer 704. The second electrode layer 703 may be an anode layer of the light emitting element, and the first electrode layer 705 may be a cathode layer of the light emitting element, where the cathode layer may be a surface electrode. Thus, since the orthographic projection of each test touch electrode 201a on the first substrate 701 overlaps with the orthographic projection of the first electrode layer 705 on the first substrate 701, it can be ensured that each test touch electrode 201a without connection failure can generate capacitance with the first electrode layer 705, and further the accuracy of good product detection of the display panel motherboard is ensured.
As shown in fig. 8, according to some embodiments of the present application, the switching unit 102 may optionally include a transistor T1, a gate of the transistor T1 is configured to receive the first control signal S1, a first pole of the transistor T1 is configured to receive the first voltage signal V1, and a second pole of the transistor T1 is connected to the first electrode pad 101. In the detection process, the transistor T1 is turned on under the control of the first control signal S1 by outputting the first control signal S1 of the on level to the gate of the transistor T1, thereby ensuring that the first voltage signal V1 can be output to the first electrode layer through the transistor T1, a voltage difference is generated between the first voltage signal V2 and the second voltage signal V3583 on the test touch electrode, and a capacitor is generated between the test touch electrode and the first electrode layer under the effect of the voltage difference, and the capacitance value of the capacitor can be determined by detecting a capacitor sensing signal generated by the mutual coupling of the first voltage signal V1 and the second voltage signal V2 on the test touch electrode, so as to detect the quality of the test sub-display panel, thereby realizing the good product detection of the self-capacitor touch display panel.
As shown in fig. 9, according to some embodiments of the present application, optionally, the non-display area NA of the package cover 200 is provided with a plurality of first touch pads 203, and the plurality of first touch pads 203 are electrically connected to the plurality of touch electrodes 201 in a one-to-one correspondence. As shown in fig. 10, the non-display area NA of the array substrate 100 is further provided with a plurality of second touch pads 103, and the plurality of second touch pads 103 and the plurality of first touch pads 203 are oppositely disposed and welded in a one-to-one correspondence manner. A plurality of third touch pads 303 are further disposed in the non-display area NA of the array substrate 100, and the plurality of third touch pads 303 and the plurality of second touch pads 103 are electrically connected in a one-to-one correspondence. Fig. 11 is a cross-sectional view taken along the direction B-B' of fig. 9 and 10. Referring to fig. 9 to 11, the testing touch electrode 201a is electrically connected to the capacitance detection module 300 sequentially through the first touch pad 203, the second touch pad 103, the third touch pad 303 and the testing flexible circuit board 400, and is configured to receive a second voltage signal V2. Specifically, the testing touch electrode 201a is electrically connected to the capacitance detection module 300 sequentially through the first touch pad 203, the second touch pad 103, the third touch pad 303 and the touch pad 403 on the testing flexible circuit board 400. Among them, the Flexible Printed Circuit (FPC) is a Flexible Printed Circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent characteristics. In the embodiment of the present application, the flexible printed circuit board 400 is a flexible printed circuit board for testing the sub-display panel. The testing flexible circuit board 400 and the capacitance detecting module 300 may be electrically connected through a bonding process, for example, which may include a Chip On FPC (COF) process.
It should be noted that in the embodiment of the present application, the term "soldering" means electrically connecting the second touch pad 103 and the first touch pad 203, and is not limited to the soldering method, for example, the second touch pad 103 may be regarded as a first connection point, the first touch pad 203 may be regarded as a second connection point, and the first connection point and the second connection point are electrically connected by using silver paste. The embodiment of the present application is not limited thereto, as long as the second touch pad 103 and the first touch pad 203 are electrically connected.
As shown in fig. 12, according to some embodiments of the present application, optionally, the non-display area NA of the array substrate 100 may include:
the at least one first voltage signal pad 104, the at least one first voltage signal pad 104 may be electrically connected to the at least one voltage signal pad 404 on the test flexible circuit board 400 outputting the first voltage signal V1 in a one-to-one correspondence. A first terminal of the switching unit 102 (transistor T1) is electrically connected to the first voltage signal pad 104, thereby receiving the first voltage signal V1.
As shown in fig. 13, unlike fig. 12, in other specific embodiments, the first terminal of the switching unit 102 (transistor T1) may also be electrically connected to the voltage signal pad 404 in the test flexible circuit board 400.
Therefore, a first voltage signal is provided for the first electrode layer through the first voltage signal pad on the array substrate or the voltage signal pad on the testing flexible circuit board, a second voltage signal is provided for the testing touch electrode, a voltage difference is generated between the testing touch electrode and the first electrode layer, a capacitor is generated between the testing touch electrode and the first electrode layer under the action of the voltage difference, the capacitance value of the capacitor can be determined through a capacitor induction signal generated by the mutual coupling of the first voltage signal V1 and the second voltage signal V2 on the testing touch electrode, the quality of the testing sub-display panel is detected, and the good product detection of the self-capacitance touch display panel is realized.
As shown in fig. 14, according to some embodiments of the present application, optionally, the non-display area NA of the array substrate 100 may further include:
the ground pad 105, the ground pad 105 is electrically connected to a ground signal line (not shown) located in the non-display area NA of the array substrate 100. As mentioned above, the self-capacitance can be understood as the capacitance generated between the touch electrode itself and "ground". In practice, it is understood that a capacitance is generated between the touch electrode itself and the ground signal line, and the ground pad 105 refers to a pad connected to the ground signal line. In the embodiment shown in fig. 14, the first voltage signal pad 104 is multiplexed with the ground pad 105. That is, the ground pad 105 may be electrically connected to the voltage signal pad 404 on the test flexible circuit board 400 outputting the first voltage signal V1 and to the first terminal of the switching unit 102 (transistor T1), thereby outputting the first voltage signal V1 to the switching unit 102 through the ground pad 105.
Therefore, the first voltage signal bonding pad and the grounding bonding pad are multiplexed, so that a first voltage signal can be provided for the first electrode layer, and the number of bonding pads on the array substrate can be reduced and the manufacturing cost of the display panel can be saved because no new bonding pad needs to be additionally arranged as the first voltage signal bonding pad.
As shown in fig. 15, according to some embodiments of the present application, optionally, the non-display area NA of the array substrate 100 may further include a test bonding area NA2, and the test bonding area NA2 may include:
the at least one first control signal pad 106, the at least one first control signal pad 106 and the at least one control signal pad 406 on the test flexible circuit board 400 outputting the first control signal S1 are electrically connected in a one-to-one correspondence. In the embodiment shown in fig. 15, the control terminal of the switching unit 102 (transistor T1) may be electrically connected to the first control signal pad 106 in the test bonding area NA 2. In other embodiments, unlike fig. 15, the control terminal of the switch unit 102 (transistor T1) may also be electrically connected to the control signal pad 406 on the test flexible circuit board 400.
Therefore, a first control signal is provided for the switch unit through a first control signal pad of the test binding area or a control signal pad of the test flexible circuit board, the switch unit is conducted under the control of the first control signal, and therefore it is ensured that a first voltage signal can be output to the first electrode layer through the switch unit, a voltage difference is generated between the first voltage signal and a second voltage signal on the test touch electrode, a capacitor is generated between the test touch electrode and the first electrode layer under the effect of the voltage difference, the capacitance value of the capacitor can be determined through a capacitor sensing signal generated by mutual coupling of the first voltage signal V1 and the second voltage signal V2 on the test touch electrode, the quality of the test sub-display panel is detected, and the good product detection of the self-capacitance touch display panel is realized.
With continued reference to fig. 15, according to some embodiments of the present application, optionally, the testing binding region NA2 may further include:
at least one first voltage signal test pad 104 ', the at least one first voltage signal test pad 104 ' corresponding to the at least one first voltage signal pad 104 one to one, optionally, the size of the first voltage signal test pad 104 ' is larger than the size of the first voltage signal pad 104. Each first voltage signal pad 104 is electrically connected to a voltage signal pad 404 on the test flexible circuit board 400 through a corresponding first voltage signal test pad 104'.
With continued reference to fig. 15, according to some embodiments of the present application, optionally, the testing binding region NA2 may further include:
the fourth touch pads 103 'are electrically connected to the third touch pads 303 in a one-to-one correspondence manner, and optionally, the size of the fourth touch pad 103' is larger than that of the third touch pad 303. The testing touch electrode 201a is electrically connected to the capacitance detection module 300 through the first touch pad 203, the second touch pad 103, the third touch pad 303, the fourth touch pad 103' and the testing flexible circuit board 400 in sequence, so as to receive the second voltage signal V2.
Because the size of the first voltage signal test bonding pad is larger than that of the first voltage signal bonding pad, and the size of the fourth touch bonding pad is larger than that of the third touch bonding pad, when the first voltage signal bonding pad and/or the second touch bonding pad are connected with the bonding pad on the test flexible circuit board through the bonding pad with larger size, the bonding pad can be connected more easily and is not easy to make mistakes, so that the occurrence of connection faults is reduced, and the accuracy of good product detection of the display panel mother board is ensured.
In some alternative embodiments, the size of the first voltage signal test pad 104 'is the same as or similar to the size of the voltage signal pad 404 on the test flexible circuit board 400, the size of the fourth touch pad 103' is the same as or similar to the size of the touch pad 403 on the test flexible circuit board 400, and the size of the first control signal pad 106 is the same as or similar to the size of the control signal pad 406 on the test flexible circuit board 400. Like this, the pad on the test flexible circuit board 400 can be bound the pad pressfitting on the district NA2 with the test of array substrate 100 and switch on, and the connection and the dismantlement of the test flexible circuit board 400 of being convenient for just are difficult for makeing mistakes, and then reduce the emergence of connection failure, guarantee the accuracy that the display panel motherboard yields and detects.
In some embodiments, the switch unit 102 may be fabricated by the same process as that for testing other transistors in the driving circuit of the sub-display panel 11 a. Specifically, as shown in fig. 7, the display area AA of the array substrate 100 includes a first substrate 701, an array layer 702, a second electrode layer 703, an organic light emitting layer 704, a first electrode layer 705, and an insulating layer 706, which are stacked. The array layer 702 sequentially includes an active layer, a gate insulating layer, and a source/drain electrode layer, wherein the control end of the switch unit 102 is located on the gate layer, and the first end and the second end of the switch unit 102 are located on the source/drain electrode layer.
Therefore, the switch unit 102 can be manufactured by the same process as that for testing other transistors in the driving circuit of the sub-display panel 11a, which is beneficial to process simplification.
As shown in fig. 16, according to some embodiments of the present application, optionally, after the good product detection is completed, the test bonding area NA2 on the test sub-display panel 11a may be cut along the cutting line X. Therefore, the first control signal pad in the test binding region can be removed by removing the test binding region, so that the control end of the switch unit is always in a suspended state, namely the switch unit is always in a cut-off state in the subsequent use process of the display panel, and the first electrode layer can not be influenced by the first voltage signal and can normally work in the use process of the display panel.
Based on the display panel motherboard provided by the above embodiment, correspondingly, the embodiment of the application further provides a detection system for the display panel motherboard.
As shown in fig. 17, the inspection system 1700 for a display panel mother board includes:
in the display panel mother board 10 according to the embodiment of the present application, the display panel mother board 10 includes at least one test sub-display panel 11 a; a test flexible circuit board 400, the test flexible circuit board 400 being electrically connected to the test sub-display panel 11 a; the capacitance detection module 300, the capacitance detection module 300 is electrically connected to the test flexible circuit board 400, and is configured to output a first voltage signal to the first electrode layer of the test sub-display panel 11a, output a second voltage signal to the test touch electrode 201a of the test sub-display panel 11a, and receive a capacitance sensing signal generated by coupling the first voltage signal and the second voltage signal.
The detection system of the display panel motherboard, provided by the embodiment of the application, provides the first voltage signal V1 for the first electrode layer, and provides the second voltage signal V2 for the testing touch electrode 201a, so that a voltage difference is generated between the testing touch electrode 201a and the first electrode layer, and a capacitor is generated between the testing touch electrode 201a and the first electrode layer under the action of the voltage difference, and the capacitance detection module 300 can determine the size of a capacitance value between the testing touch electrode 201a and the first electrode layer by detecting a capacitance sensing signal generated by the mutual coupling of the first voltage signal V1 and the second voltage signal V2 on the testing touch electrode 201a, so as to detect the quality of the testing sub-display panel, and thus realize the good product detection of the self-capacitance touch display panel.
According to some embodiments of the present application, optionally, the test flexible circuit board 400 may include at least one voltage signal pad 404, the at least one voltage signal pad 404 is electrically connected to the at least one first voltage signal pad 104, and the capacitance detection module 300 outputs the first voltage signal to the first electrode layer through the electrically connected voltage signal pad 404, the first voltage signal pad 104, the switch unit 102, and the first electrode pad 101.
According to some embodiments of the present application, optionally, the non-display area NA of the array substrate 100 may further include a test bonding area NA2, and the test bonding area NA2 includes at least one first voltage signal test pad 104 ', and each first voltage signal pad 104 is electrically connected to the voltage signal pad 404 through a corresponding first voltage signal test pad 104'.
According to some embodiments of the present application, optionally, the non-display area NA of the array substrate 100 may further include a test bonding area NA2, the test bonding area NA2 includes at least one first control signal pad 106, and the control terminal of the switch unit 102 receives the first control signal through the connected first control signal pad 106. The test flexible circuit board 400 includes at least one control signal pad 406, the at least one control signal pad 406 is electrically connected to the at least one first control signal pad 106, and the capacitance detection module 300 outputs a first control signal to the control terminal of the switching unit 102 through the electrically connected control signal pad 406 and the first control signal pad 106.
Please refer to fig. 3 to 16 for a specific embodiment of the system 1700 for detecting a motherboard of a display panel, which is not described herein again.
Based on the display panel motherboard provided by the above embodiment, correspondingly, the application also provides a specific implementation manner of the detection method of the display panel motherboard.
The method for detecting a motherboard of a display panel according to the embodiment of the present disclosure may be applied to the capacitance detection module 300, and particularly, may be applied to a touch and display integrated chip (TDDI chip).
As shown in fig. 18, the method for detecting a motherboard of a display panel according to the embodiment of the present application includes the following steps:
s101, outputting a first voltage signal to a first electrode layer; and outputting a second voltage signal to the test touch electrode, and receiving a capacitance induction signal generated by coupling the first voltage signal and the second voltage signal.
According to the detection method of the display panel mother board, the first voltage signal is provided for the first electrode layer, the second voltage signal is provided for the testing touch electrode, voltage difference is generated between the testing touch electrode and the first electrode layer, capacitance is generated between the testing touch electrode and the first electrode layer under the effect of the voltage difference, the size of the capacitance value between the testing touch electrode and the first electrode layer can be determined by detecting the capacitance induction signal generated by mutual coupling of the first voltage signal and the second voltage signal on the testing touch electrode, the quality of the testing sub-display panel is detected, and accordingly good product detection of the self-capacitance touch display panel is achieved.
In an embodiment shown in fig. 15, the non-display area NA of the array substrate 100 may include a test bonding area NA2, and the test bonding area NA2 may include:
the at least one first control signal pad 106, the at least one first control signal pad 106 and the at least one control signal pad 406 on the test flexible circuit board 400 outputting the first control signal S1 are electrically connected in a one-to-one correspondence. The control terminal of the switching unit 102 (transistor T1) may be electrically connected to the first control signal pad 106 in the test bonding area NA 2.
Accordingly, in some specific embodiments, the method for detecting a motherboard of a display panel provided in the embodiment of the present application may further include:
and after the testing of the testing sub-display panel is finished, removing the testing binding area on the testing sub-display panel along the thickness direction of the display mother board. As shown in fig. 16 in particular, the test bonding area NA2 on the test sub-display panel 11a may be cut along the cutting line X.
Therefore, the first control signal pad in the test binding region can be removed by removing the test binding region, so that the control end of the switch unit is always in a suspended state, namely the switch unit is always in a cut-off state in the subsequent use process of the display panel, and the first electrode layer can not be influenced by the first voltage signal and can normally work in the use process of the display panel.
It will be appreciated by persons skilled in the art that the above embodiments are illustrative and not restrictive. Different features which are present in different embodiments may be combined to advantage. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art upon studying the drawings, the specification, and the claims. In the claims, the term "comprising" does not exclude other structures; the quantities relate to "a" and "an" but do not exclude a plurality; the terms "first" and "second" are used to denote a name and not to denote any particular order. Any reference signs in the claims shall not be construed as limiting the scope. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
As described above, only the specific embodiments of the present application are provided, and it can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the system, the module and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.
Claims (10)
1. A display panel mother board comprising at least one test sub-display panel, the test sub-display panel comprising:
at least one first electrode pad electrically connected to a first electrode layer on the test sub-display panel, the first electrode pad for receiving a first voltage signal and transmitting the first voltage signal to the first electrode layer;
the touch control device comprises a plurality of touch control electrodes, wherein at least one touch control electrode in the plurality of touch control electrodes is a test touch control electrode, the test touch control electrode is used for receiving a second voltage signal, and the first voltage signal and the second voltage signal are coupled to generate a capacitance induction signal.
2. The display panel mother board according to claim 1, wherein the test sub-display panel further comprises at least one switch unit, a control terminal of the switch unit is configured to receive a first control signal, a first terminal of the switch unit is configured to receive a first voltage signal, a second terminal of the switch unit is connected to the first electrode pad, and the switch unit transmits the first voltage signal to the first electrode layer under the control of the first control signal;
preferably, the test sub-display panel comprises a substrate, an array layer, a second electrode layer, an organic light emitting layer and a first electrode layer which are stacked, wherein the array layer sequentially comprises an active layer, a gate insulating layer and a source drain electrode layer, a control end of the switch unit is located in the gate layer, and a first end of the switch unit and a second end of the switch unit are located in the source drain electrode layer.
3. The display panel mother board according to claim 1, wherein the test sub-display panel comprises an array substrate and a package cover board which are oppositely arranged, and the array substrate and the package cover board each comprise a display area and a non-display area surrounding the display area;
preferably, the at least one first electrode pad is located on the array substrate, and the plurality of touch electrodes are located on the package cover plate;
preferably, a plurality of first touch pads are arranged in the non-display area of the package cover plate, and the first touch pads are electrically connected with the touch electrodes in a one-to-one correspondence manner; the array substrate is also provided with a plurality of second touch pads and a plurality of third touch pads, the second touch pads are welded with the first touch pads in a one-to-one correspondence manner, and the third touch pads are electrically connected with the second touch pads in a one-to-one correspondence manner; the test touch electrode receives the second voltage signal through the first touch pad, the second touch pad and the third touch pad which are electrically connected.
4. The display panel motherboard according to claim 3, wherein the non-display region of the array substrate comprises:
at least one first voltage signal pad, a first end of the switching unit being electrically connected to the first voltage signal pad;
preferably, the non-display area of the array substrate further includes:
the grounding pad is electrically connected with a grounding signal wire positioned in a non-display area of the array substrate; the first voltage signal pad is multiplexed with the ground pad.
5. The display panel motherboard of claim 4, wherein the non-display region of the array substrate further comprises a test bonding region, the test bonding region comprising:
the test circuit comprises at least one first voltage signal test pad, at least one second voltage signal test pad and at least one third voltage signal test pad, wherein the at least one first voltage signal test pad corresponds to the at least one first voltage signal test pad in a one-to-one mode, and the size of the first voltage signal test pad is larger than that of the first voltage signal test pad;
and/or
The fourth touch pads are electrically connected with the third touch pads in a one-to-one correspondence manner, and the size of each fourth touch pad is larger than that of each third touch pad; the test touch electrode receives the second voltage signal through the first touch pad, the second touch pad, the third touch pad and the fourth touch pad which are electrically connected.
6. The display panel motherboard of claim 3, wherein the non-display region of the array substrate further comprises a test bonding region, the test bonding region comprising:
and the control end of the switch unit is electrically connected with the first control signal bonding pad.
7. A detection system for a display panel motherboard, the detection system comprising:
the display panel motherboard of any of claims 1-6, comprising at least one test sub-display panel;
the testing flexible circuit board is electrically connected with the testing sub-display panel;
and the capacitance detection module is electrically connected with the testing flexible circuit board and is used for outputting a first voltage signal to the first electrode layer of the testing sub-display panel, outputting a second voltage signal to the testing touch electrode of the testing sub-display panel and receiving a capacitance induction signal generated by coupling the first voltage signal with the second voltage signal.
8. The system for testing the mother display panel of claim 7, wherein the sub-display panel comprises an array substrate and a package cover plate which are oppositely arranged, the array substrate comprises at least one first voltage signal pad and a switch unit, a control terminal of the switch unit is used for receiving a first control signal, a first terminal of the switch unit is connected with the first voltage signal pad, and a second terminal of the switch unit is connected with the first electrode pad;
the testing flexible circuit board comprises at least one voltage signal pad, the at least one voltage signal pad is correspondingly and electrically connected with the at least one first voltage signal pad, and the capacitance detection module outputs the first voltage signal to the first electrode layer through the electrically connected voltage signal pad, the first voltage signal pad, the switch unit and the first electrode pad;
preferably, the non-display area of the array substrate further includes a test bonding area, the test bonding area includes at least one first voltage signal test pad, and each first voltage signal pad is electrically connected to the voltage signal pad through the corresponding first voltage signal test pad;
preferably, the non-display area of the array substrate further includes a test bonding area, the test bonding area includes at least one first control signal pad, and the control end of the switch unit receives the first control signal through the connected first control signal pad; the testing flexible circuit board comprises at least one control signal pad, the at least one control signal pad is correspondingly and electrically connected with the at least one first control signal pad, and the capacitance detection module outputs a first control signal to the control end of the switch unit through the electrically connected control signal pad and the first control signal pad.
9. A method of inspecting a display panel motherboard, the display panel motherboard comprising the display panel motherboard of any of claims 1-6, the method comprising:
outputting a first voltage signal to the first electrode layer; and outputting the second voltage signal to the test touch electrode, and receiving a capacitance induction signal generated by coupling the first voltage signal and the second voltage signal.
10. The detection method according to claim 9,
the test sub-display panel further comprises at least one switch unit, wherein a control end of the switch unit is used for receiving a first control signal, a first end of the switch unit is used for receiving a first voltage signal, a second end of the switch unit is connected with the first electrode pad, and the switch unit transmits the first voltage signal to the first electrode layer under the control of the first control signal;
the test sub-display panel comprises an array substrate and a packaging cover plate which are oppositely arranged, a non-display area of the array substrate comprises a test binding area, and the test binding area comprises:
the control end of the switch unit is electrically connected with the first control signal bonding pad and used for receiving a first control signal through the first control signal bonding pad;
the method further comprises the following steps:
and after the testing of the testing sub-display panel is finished, removing the testing binding area on the testing sub-display panel along the thickness direction of the display mother board.
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| CN111308815A (en) * | 2020-02-28 | 2020-06-19 | 上海中航光电子有限公司 | Array substrate and display panel |
| CN111367437A (en) * | 2020-04-29 | 2020-07-03 | 上海天马微电子有限公司 | Display panel, detection and maintenance method thereof and display device |
| CN111681545A (en) * | 2020-05-27 | 2020-09-18 | 上海中航光电子有限公司 | Display panel and display device |
| CN111857435A (en) * | 2020-07-28 | 2020-10-30 | 京东方科技集团股份有限公司 | Touch display panel, test method thereof and display device |
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| US20220187939A1 (en) * | 2020-12-15 | 2022-06-16 | Lg Display Co., Ltd. | Display apparatus |
| US11749148B2 (en) * | 2020-12-15 | 2023-09-05 | Lg Display Co., Ltd. | Display apparatus |
| WO2023216342A1 (en) * | 2022-05-13 | 2023-11-16 | 武汉华星光电半导体显示技术有限公司 | Display panel motherboard, test method for display panel motherboard, and display panel |
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