TW293938B - Probe card assembly and kit, and methods of using same - Google Patents
Probe card assembly and kit, and methods of using same Download PDFInfo
- Publication number
- TW293938B TW293938B TW85105626A TW85105626A TW293938B TW 293938 B TW293938 B TW 293938B TW 85105626 A TW85105626 A TW 85105626A TW 85105626 A TW85105626 A TW 85105626A TW 293938 B TW293938 B TW 293938B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe card
- space transformer
- orientation
- interposer
- probe
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
293938293938
子在其頂部表面上; 一中間插入物之有一頂部表面 1衣囱一底部表面, 一第一多個彈性接觸結構自其底邱矣 丹坻邛表面伸展;以及 一第二多個接觸結構自其頂部表面伸展;以及 一間隔變換器之有一頂部表面,一底部表面, 多個接觸墊放置於其底部表面上,以 „ 夂 弟二多個 彈丨生接觸結構自其頂部表面伸展; 其中: 此第一多個彈性接觸結構與探針卡之接觸端子 產生一壓力連接;以及 器之接觸 此第二多個彈性接觸結構與間隔變換 塾產生—壓力連接; 用以調整間隔變換器之平面而勿須改變探針卡 之方位之裝置。 9.依據申請專利範圍第8項之探針卡總成,其中用以 調整間隔變換器之平面之裝置包含: 多個差動螺旋,各包括一外差動螺旋元件和内 差動螺旋元件,作用於間隔變換器之底部表面上。 1 〇·依據申請專利範圍第9項之探針卡總成,另包含: 多個樞軸球體放置於内差動螺旋元件之終端 上。 1 1 ·依據申請專利範圍第9項之探針卡總成,另包含: 一致動器安裝板放置於探針卡之底下; 其中: -3- 293938 六、申請專利範圍 此差動螺旋係循螺紋穿入此致動器安裝板内。 1 2 ·依據申請專利範圍第8項之探針卡總成,其中用以 調整間隔變換器之平面之裝置包含: 多個致動器’回應於一電腦而作用於此間隔變 換器之底部 表面。On the top surface; an intermediate insert has a top surface, a chimney, and a bottom surface, a first plurality of elastic contact structures extend from the bottom surface Qiu Yidan Qiong Qiong surface; and a second plurality of contact structures from Its top surface extends; and one of the space transformers has a top surface, a bottom surface, and a plurality of contact pads are placed on its bottom surface to extend from its top surface with two or more elastic contact structures; wherein: The first plurality of elastic contact structures and the contact terminals of the probe card generate a pressure connection; and the device contacts the second plurality of elastic contact structures and the interval conversion unit to generate pressure connection; A device that does not need to change the orientation of the probe card 9. The probe card assembly according to item 8 of the patent application scope, where the device for adjusting the plane of the interval converter includes: multiple differential spirals, each including an outer The differential spiral element and the internal differential spiral element act on the bottom surface of the space transformer. 1 〇 · Probe card assembly according to item 9 of the patent application scope, separately included : Multiple pivot spheres are placed on the terminal of the internal differential spiral element. 1 1 · According to the probe card assembly of item 9 of the patent application scope, it also includes: The actuator mounting plate is placed under the probe card; Among them: -3- 293938 VI. Patent scope The differential screw is threaded into the actuator mounting plate. 1 2 · The probe card assembly according to item 8 of the patent scope is used to adjust the interval conversion The device of the plane of the device includes: a plurality of actuators acting on the bottom surface of the interval converter in response to a computer.
3 · —種製造用於接觸結構之終端之尖端結構之方法, 包含: 澱積至少一層之至少一種導 一表面上; 電物質於矽晶圓 之 澱積一層遮蔽材料在至少一導電層之頂上· 在遮蔽材料上形成有開口之圖形; 開 殺積至少一層之至少-種導電物質進入此等 〇 ;3. A method of manufacturing a tip structure for a terminal of a contact structure, comprising: depositing at least one layer of at least one conductive surface; depositing a layer of shielding material on top of at least one conductive layer of electrical material on a silicon wafer · A pattern of openings is formed on the shielding material; at least one layer of at least one kind of conductive substance enters this layer;
移除此遮蔽材料’以形成尖端結構;. 澱積一接合材料在先前搬積於開口内之至 層之至少一種導電物質上;以及 v 接合該尖端結構至接觸結構之終端。 其中 其中 14·依據申請專利範圍第13項之方法 此接觸結構係彈性接觸結構。 15.依據申請專利範圍第13項之方法 此接觸結構係複合互連元件。 293938 六、申請專利範圍 16.依據申請專利範圍第13項之方法,其中·· 此接觸結構係彈性接觸結構放置於探針卡總成 之間隔變換器之頂上。 -5-Remove this masking material 'to form a tip structure ;. deposit a bonding material on at least one conductive substance previously deposited in the opening to the layer; and v bond the tip structure to the terminal of the contact structure. Among them, 14 · According to the method of claim 13 of the patent application scope, the contact structure is an elastic contact structure. 15. The method according to item 13 of the patent application scope This contact structure is a composite interconnection element. 293938 6. Scope of patent application 16. According to the method of item 13 of the patent application scope, where the contact structure is an elastic contact structure placed on top of the space transformer of the probe card assembly. -5-
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/554,902 US5974662A (en) | 1993-11-16 | 1995-11-09 | Method of planarizing tips of probe elements of a probe card assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
TW293938B true TW293938B (en) | 1996-12-21 |
Family
ID=51398445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW85105626A TW293938B (en) | 1995-11-09 | 1996-05-13 | Probe card assembly and kit, and methods of using same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW293938B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI387030B (en) * | 2004-12-20 | 2013-02-21 | Panasonic Corp | Probe card, manufacturing method thereof, and alignment method |
TWI458984B (en) * | 2006-11-01 | 2014-11-01 | Formfactor Inc | Probe card assembly |
TWI467181B (en) * | 2006-09-29 | 2015-01-01 | Formfactor Inc | Apparatus for indirectly planarizing a probe card assembly and probe card assembly for testing a semiconductor |
US9470750B2 (en) | 2013-04-16 | 2016-10-18 | Mpi Corporation | Alignment adjusting mechanism for probe card, position adjusting module using the same and modularized probing device |
US10078101B2 (en) | 2009-04-21 | 2018-09-18 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
TWI648542B (en) * | 2012-06-20 | 2019-01-21 | Johnstech International Corporation | Test contact needle assembly |
US10330702B2 (en) | 2014-03-10 | 2019-06-25 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
-
1996
- 1996-05-13 TW TW85105626A patent/TW293938B/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI387030B (en) * | 2004-12-20 | 2013-02-21 | Panasonic Corp | Probe card, manufacturing method thereof, and alignment method |
TWI467181B (en) * | 2006-09-29 | 2015-01-01 | Formfactor Inc | Apparatus for indirectly planarizing a probe card assembly and probe card assembly for testing a semiconductor |
TWI458984B (en) * | 2006-11-01 | 2014-11-01 | Formfactor Inc | Probe card assembly |
US10078101B2 (en) | 2009-04-21 | 2018-09-18 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
TWI648542B (en) * | 2012-06-20 | 2019-01-21 | Johnstech International Corporation | Test contact needle assembly |
US9470750B2 (en) | 2013-04-16 | 2016-10-18 | Mpi Corporation | Alignment adjusting mechanism for probe card, position adjusting module using the same and modularized probing device |
US10330702B2 (en) | 2014-03-10 | 2019-06-25 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW589462B (en) | Probe card for probing wafers with raised contact elements | |
CN1900725B (en) | Lithographic contact elements | |
EP0839323B1 (en) | Microelectronic spring contact elements | |
CN100559660C (en) | Be used for printed circuit board (PCB) interconnection device, make the method for this device and have the interconnecting assembly of this device | |
US6184053B1 (en) | Method of making microelectronic spring contact elements | |
JP3386077B2 (en) | Probe card assemblies and kits and methods of using them | |
TW584950B (en) | Chip packaging structure and process thereof | |
US6933524B2 (en) | Semiconductor component having test contacts | |
EP1610375A3 (en) | Contact carriers for populating substrates with spring contacts | |
TWI226931B (en) | Needle assembly of probe card | |
US7217139B2 (en) | Interconnect assembly for a probe card | |
TW200409582A (en) | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs | |
MY112466A (en) | Bumped semiconductor device and method for probing the same | |
TW293938B (en) | Probe card assembly and kit, and methods of using same | |
TW315518B (en) | High density electrical connectors | |
JPS6180067A (en) | Test-probe device | |
CN1299344C (en) | Method for manufacturng semiconductor device | |
US20040012405A1 (en) | Probe card with full wafer contact configuration | |
JP2000516044A (en) | Microwave hybrid integrated circuit | |
KR200312739Y1 (en) | Integrated silicone contactor with an electric conductor | |
US6667627B2 (en) | Probe for inspecting semiconductor device and method of manufacturing the same | |
US20040198081A1 (en) | Microelectronic spring contact elements | |
US20020053917A1 (en) | Probe structure and method for manufacturing the same | |
US7474113B2 (en) | Flexible head probe for sort interface units | |
JP2003533863A (en) | Elastomer electrical connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |