CN112285394A - Probe module suitable for multiple units to be tested with inclined conductive contacts - Google Patents

Probe module suitable for multiple units to be tested with inclined conductive contacts Download PDF

Info

Publication number
CN112285394A
CN112285394A CN202010336493.1A CN202010336493A CN112285394A CN 112285394 A CN112285394 A CN 112285394A CN 202010336493 A CN202010336493 A CN 202010336493A CN 112285394 A CN112285394 A CN 112285394A
Authority
CN
China
Prior art keywords
probe
unit
probes
tested
imaginary dividing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010336493.1A
Other languages
Chinese (zh)
Inventor
张嘉泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MJC Probe Inc
Original Assignee
MJC Probe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MJC Probe Inc filed Critical MJC Probe Inc
Publication of CN112285394A publication Critical patent/CN112285394A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06727Cantilever beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages

Abstract

The invention relates to a probe module which is used for simultaneously detecting a first unit to be detected and a second unit to be detected, wherein the side edges of the first unit to be detected and the second unit to be detected are adjacent, and the first unit to be detected and the second unit to be detected are respectively provided with a first junction contact and a second junction contact which are adjacent to a first main edge and the adjacent side edge of the first unit to be detected and the; the probe module comprises a probe seat, a first boundary probe and a second boundary probe, wherein the first boundary probe and the second boundary probe are arranged at different heights of the probe seat, when the probe module detects a first unit to be detected and a second unit to be detected, a first main edge of each unit to be detected is closer to the probe seat than a second main edge, and cantilever sections of the first boundary probe and the second boundary probe respectively pass through the upper parts of the first main edges of the first unit to be detected and the second unit to be detected and respectively extend to the upper parts of the first boundary joint and the second boundary joint so as to touch the first boundary joint and the second boundary joint by point contact sections; therefore, the first boundary probe and the second boundary probe can avoid mutual interference.

Description

Probe module suitable for multiple units to be tested with inclined conductive contacts
Technical Field
The present invention relates to a probe module of a probe card, and more particularly, to a probe module suitable for a multi-to-test unit (multi-UUT) having inclined conductive contacts.
Background
Referring to fig. 1, a unit under test 10 (UUT) having inclined conductive contacts is shown, the unit under test 10 may be an unpackaged chip (die) or a packaged chip (chip), the unit under test 10 has a plurality of first conductive contacts 11 for outputting signals arranged in one or more rows and a plurality of second conductive contacts 12 for inputting signals arranged in a row, for example, the unit under test 10 shown in fig. 1 has three rows of first conductive contacts 11 arranged from a first long side 131 of a substrate 13 toward a second long side 132, and a row of second conductive contacts 12 arranged along the second long side 132 of the substrate 13, each of the first and second conductive contacts 11, 12 are arranged in multiple rows, the arrangement direction of each row is substantially parallel to a line perpendicular to an imaginary dividing axis L of the first and second long sides 131, 132 and is close to the imaginary dividing axis L, for example, as included in a middle block 14 in fig. 1, the long sides 111, 121 of the first and second conductive contacts 11, 12 are substantially parallel to the imaginary dividing axis L, and the first and second conductive contacts 11, 12 in the row farther from the imaginary dividing axis L are inclined conductive contacts, wherein one end closer to the first long side 131 of the substrate 13 is closer to the imaginary dividing axis L, and one end farther from the first long side 131 of the substrate 13 is farther from the imaginary dividing axis L, i.e., the inclined conductive contacts are inclined from the top to the bottom and from the inside to the outside as viewed in the direction of fig. 1, and the angles of the first and second conductive contacts 11, 12 farther from the imaginary dividing axis L are larger with respect to the imaginary dividing axis L, for example, the angles θ 1, 121 of the long sides 111, 121 of the first and second conductive contacts 11, 12 included in the outer blocks 15, 16 in fig. 1 are larger with respect to the imaginary dividing axis L, θ 2 is maximum.
The unit under test 10 can be tested by using a probe card with cantilever type probes, and for simplicity, fig. 1 only schematically shows a probe 17 corresponding to the leftmost second conductive contact 12, and actually, each conductive contact 11, 12 corresponds to a probe, and the cantilever segment 171 of the probe 17 can extend from a probe base 18 located above the outer side of the second long side 132 of the unit under test 10 to above the conductive contact 12, so that a point contact segment (not shown) of the probe 17 extending downward from the end of the cantilever segment 171 can make point contact with the corresponding conductive contact 12.
However, since the unit under test 10 has the inclined conductive contacts with different inclination angles, it is difficult to arrange the probes required for the detection on the probe base, and especially for the detection of multiple units under test, i.e. simultaneously detecting at least two units under test 10, there is a concern that the probes 17 will interfere with each other, so that there is no suitable detection device at present.
Disclosure of Invention
In view of the above problems, it is a primary object of the present invention to provide a probe module, which is suitable for the detection of multiple dut with inclined conductive contacts to avoid the mutual interference of probes.
To achieve the above object, the present invention provides a probe module for multiple units under test with inclined conductive contacts, which is used to simultaneously test multiple units under test, and comprises: each unit to be tested is provided with a first main edge, a second main edge, a first side edge and a second side edge which are connected with the first main edge and the second main edge, and a plurality of conductive contacts, wherein the plurality of units to be tested comprise a first unit to be tested and a second unit to be tested, the second side edge of the first unit to be tested is adjacent to the first side edge of the second unit to be tested, the conductive contact of the first unit to be tested comprises a first junction contact which is adjacent to the first main edge and the second side edge of the first unit to be tested, and the conductive contact of the second unit to be tested comprises a second junction contact which is adjacent to the first main edge and the first side edge of the second unit to be tested; the probe module includes: at least one probe seat; the probe comprises a cantilever section and a point contact section, wherein the cantilever section is provided with a fixed part fixedly connected with the probe seat and an exposed part which is connected with the fixed part and extends out from one inner side surface of the probe seat, and the point contact section is connected with the exposed part; when the probe module detects each unit to be detected, the first main edge of each unit to be detected is closer to the first probe seat than the second main edge, and the first boundary probe and the second boundary probe respectively pass through the first main edge of the first unit to be detected and extend to the upper parts of the first boundary joint and the second boundary joint through cantilever sections of the first boundary probe and the second boundary probe so as to respectively touch the first boundary joint and the second boundary joint through point touch sections of the first boundary probe and the second boundary probe.
In the above technical solution of the present invention, the conductive contact of each unit to be tested includes a plurality of first conductive contacts arranged in a line along the first main edge of the unit to be tested, the first conductive contact of the first unit to be tested includes the first cross contact, and the first conductive contact of the second unit to be tested includes the second cross contact; the plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, each first probe forms a first probe layer on the first probe seat, each second probe forms a second probe layer with different height from the first probe layer on the first probe seat, each first probe comprises the first boundary probe, and each second probe comprises the second boundary probe; when the probe module detects each unit to be detected, each first probe respectively touches the first conductive contact of the first unit to be detected by the point contact section of the first probe, and each second probe respectively touches the first conductive contact of the second unit to be detected by the point contact section of the second probe.
The conductive contact of each unit to be tested comprises a plurality of first conductive contacts which are arranged in a line along the first main edge of the unit to be tested, the first conductive contact of the first unit to be tested comprises the first junction contact, and the first conductive contact of the second unit to be tested comprises the second junction contact; the plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, each first probe comprises a first junction probe, each second probe comprises a second junction probe, when the probe module detects each unit to be detected, each first probe respectively touches a first conductive contact of the first unit to be detected by a touch section of the first probe, and each second probe respectively touches a first conductive contact of the second unit to be detected by a touch section of the second probe; each of the first probe and the second probe forms a plurality of probe layers with different heights on the first probe seat, and the first boundary probe and the second boundary probe are positioned on different probe layers.
The probe layer of the first probe seat comprises a first probe layer and a second probe layer lower than the first probe layer, one of the first boundary probe and the second boundary probe is positioned on the first probe layer, and the rest of the first probe and the second probe are positioned on the second probe layer.
Each first probe can define a first imaginary dividing line perpendicular to the inner side surface of the first probe seat, and the extending direction of the exposed part of each first probe from the inner side surface is parallel to the first imaginary dividing line or inclines relative to the first imaginary dividing line towards the first imaginary dividing line; each of the second probes may define a second imaginary dividing line perpendicular to the inner side surface of the first probe holder, and the direction in which the exposed portion of each of the second probes extends from the inner side surface may be parallel to the second imaginary dividing line or may be inclined with respect to the second imaginary dividing line toward the second imaginary dividing line.
The conductive connection points of each unit to be tested comprise a plurality of second conductive connection points adjacent to the second main edge of the unit to be tested; the probe module further includes a second probe holder in at least one probe holder, the probe of the probe module includes a plurality of third probes disposed on the second probe holder, when the probe module detects each unit to be tested, the second main edge of each unit to be tested is closer to the second probe holder than the first main edge, and at least a part of the third probes extend to the top of each second conductive contact through the cantilever section of the third probes above the second main edge of each unit to be tested, and then contact each second conductive contact through the point contact section of the third probes.
The second conductive contacts of each unit to be tested are arranged in a plurality of rows substantially parallel to a horizontal imaginary axis, and are sequentially arranged from the second main edge towards the first main edge; each of the third probes forms a plurality of probe layers having different heights in an arrangement substantially corresponding to each of the second conductive contacts, in an order corresponding to the plurality of rows of the second conductive contacts from bottom to top.
The multiple units to be tested further comprise a third unit to be tested and a fourth unit to be tested, the first main edge of the third unit to be tested is adjacent to the second main edge of the first unit to be tested, and the first main edge of the fourth unit to be tested is adjacent to the second main edge of the second unit to be tested; when the probe module detects each unit to be tested, part of the third probes touch all the conductive contacts of the third unit to be tested and the fourth unit to be tested through the point contact sections of the third probes.
Each third probe forms a plurality of probe layers with different heights, the higher the third probe of the probe layer is used for touching the conductive contact which is farther away from the second probe seat, and the longer the cantilever section of the higher the third probe of the probe layer is.
The second probe holder can define an imaginary dividing axis perpendicular to the inner side surface thereof, a first imaginary dividing line and a second imaginary dividing line, the first imaginary dividing line and the second imaginary dividing line are respectively located on a first side and a second side of the imaginary dividing axis, a direction in which the exposed portion of the probe located on the first side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the first imaginary dividing line in parallel to the first imaginary dividing line or away from the first imaginary dividing line, and a direction in which the exposed portion of the probe located on the second side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the second imaginary dividing line in parallel to the second imaginary dividing line or away from the second imaginary dividing line.
The fixed part and the exposed part of each probe are substantially in a straight line.
The fixing part of each probe comprises an inner section and an outer section, the inner section of the fixing part of each probe is connected with the exposed part and is substantially in a straight line with the exposed part, and the outer sections of the fixing parts of each probe are substantially parallel to each other.
To achieve the above object, the present invention further provides a probe module for multiple units under test with inclined conductive contacts, comprising: at least one probe seat; the probe comprises a cantilever section and a point contact section, wherein the cantilever section is provided with a fixed part fixedly connected with the probe seat and an exposed part which is connected with the fixed part and extends out from one inner side surface of the probe seat, and the point contact section is connected with the exposed part; the probe base comprises a first probe base, the probes comprise a first boundary probe and a second boundary probe which are arranged on the first probe base and located at different heights, and the vertical distances between the tail ends of point contact sections of the first boundary probe and the second boundary probe and the inner side surface of the first probe base are substantially the same.
The exposed part of the first boundary probe and the exposed part of the second boundary probe are inclined in a manner of not being vertical to the inner side surface of the first probe seat, and the inclined directions of the exposed parts are substantially symmetrical to each other.
The plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, each first probe forms a first probe layer on the first probe seat, each second probe forms a second probe layer with different height from the first probe layer on the first probe seat, each first probe comprises a first junction probe, each second probe comprises a second junction probe, and the vertical distance between the tail end of the point contact section of each first probe and the tail end of the point contact section of each second probe are substantially the same as that of the inner side surface of the first probe seat.
The plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, the vertical distance between the tail end of a point contact section of each first probe and the tail end of a point contact section of each second probe and the inner side surface of the first probe seat is substantially the same, each first probe comprises a first junction probe, each second probe comprises a second junction probe, each first probe and each second probe form a plurality of probe layers with different heights on the first probe seat, and the first junction probe and the second junction probe are positioned on different probe layers.
The probe layer of the first probe seat comprises a first probe layer and a second probe layer lower than the first probe layer, one of the first boundary probe and the second boundary probe is positioned on the first probe layer, and the rest of the first probe and the second probe are positioned on the second probe layer.
Each first probe can define a first imaginary dividing line perpendicular to the inner side surface of the first probe seat, and the extending direction of the exposed part of each first probe from the inner side surface is parallel to the first imaginary dividing line or inclines relative to the first imaginary dividing line towards the first imaginary dividing line; each of the second probes may define a second imaginary dividing line perpendicular to the inner side surface of the first probe holder, and the direction in which the exposed portion of each of the second probes extends from the inner side surface may be parallel to the second imaginary dividing line or may be inclined with respect to the second imaginary dividing line toward the second imaginary dividing line.
The probe module comprises a first probe seat, a second probe seat and a plurality of third probes, wherein the first probe seat is provided with a plurality of cantilever sections, the cantilever sections of the first probes are arranged on the first probe seat, the cantilever sections of the first probes are arranged on the second probe seat, and the cantilever sections of the first probes are arranged on the first probe seat.
The second probe holder can define an imaginary dividing axis perpendicular to the inner side surface thereof, a first imaginary dividing line and a second imaginary dividing line, the first imaginary dividing line and the second imaginary dividing line are respectively located on a first side and a second side of the imaginary dividing axis, a direction in which the exposed portion of the probe located on the first side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the first imaginary dividing line in parallel to the first imaginary dividing line or away from the first imaginary dividing line, and a direction in which the exposed portion of the probe located on the second side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the second imaginary dividing line in parallel to the second imaginary dividing line or away from the second imaginary dividing line.
The fixed part and the exposed part of each probe are substantially in a straight line.
The fixing part of each probe comprises an inner section and an outer section, the inner section of the fixing part of each probe is connected with the exposed part and is substantially in a straight line with the exposed part, and the outer sections of the fixing parts of each probe are substantially parallel to each other.
By adopting the technical scheme, the probe module mainly aims at the conductive contact points, namely the first junction contact point and the second junction contact point, at the adjacent side edges of the adjacent units to be tested, wherein the adjacent side edges of the adjacent units to be tested are adjacent to the first main edge. The probe module is used for point-contacting the probe configuration of other conductive contacts of each unit to be tested without limitation.
Because the first and second boundary probes are located at different heights, even if the first and second boundary contacts are close to each other towards the extending direction of the first main edge, the extending direction of the exposed part of the cantilever section of the first and second boundary probes from the first probe seat can still match with the extending direction of the first and second boundary contacts to prevent the probes from accidentally sliding to the non-corresponding conductive contacts in point measurement, i.e. the exposed part of the cantilever section of the first and second boundary probes can extend obliquely from the first probe seat and gradually close to the corresponding boundary contacts, even if the required inclination angle is very large, so that the cantilever sections of the first and second boundary probes are quite close to each other or even must be partially located on the same vertical plane, and the first and second boundary probes can avoid mutual interference because of being located at different heights.
In fact, the probes extending from the first probe seat at different heights are not limited to be used for touching the first and second boundary contacts adjacent to the first main edge, but can be applied to any conductive contacts at any positions that may cause the probes at the same height to be too close to or interfere with each other, so as to achieve the effect of avoiding probe interference by disposing the probes (referred to as the first and second boundary probes in the present invention) corresponding to the conductive contacts that may cause the aforementioned problems at different heights.
Drawings
FIG. 1 is a schematic top view of a DUT having oblique conductive contacts, a probe and a probe base;
FIG. 2 is a schematic top view of a probe module, a first DUT and a second DUT according to a first preferred embodiment of the invention, but without showing a third probe of the probe module;
FIG. 3 is a right side view of FIG. 2, further showing a third probe of the probe module and a circuit board;
FIG. 4 is a view similar to FIG. 2, showing only a portion of a third probe;
FIG. 5 is a view similar to FIG. 4, but showing another part of a third probe;
FIG. 6 is a view similar to FIG. 5, but showing a third probe;
FIG. 7 is similar to FIG. 2, but the fixed portion and the exposed portion of the probe in FIG. 7 are aligned;
FIG. 8 is a schematic top view of a probe module and first to fourth DUT units according to a second preferred embodiment of the present invention, but only a part of the third probe is shown;
FIG. 9 is a right side view of FIG. 8 but showing further probes of the probe module.
Detailed Description
The structure, features, assembly or use and function of the present invention will now be described in detail with reference to the following examples taken in conjunction with the accompanying drawings. However, those skilled in the art should understand that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Applicant hereby gives notice that the same reference numerals will be used throughout the several views of the drawings to identify the same or similar elements or features thereof. It is noted that the components and structures in the drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention, and the various embodiments may be practiced with other components and features that are within the scope of the claims.
Referring to fig. 2 to 6, a probe module 20 according to a first preferred embodiment of the present invention mainly includes a first probe holder 21, a second probe holder 22, and a plurality of probes 30a to 30 e.
As shown in fig. 3, each of the probes 30a to 30e is formed by bending a linear needle made of a conductive material (e.g., metal) by machining, and each of the probes 30a to 30e includes a cantilever section 31 and a touch section 32, the cantilever section 31 has a fixing portion 311 fixedly connected to the first probe holder 21 or the second probe holder 22, and an exposed portion 312 connected to the fixing portion 311 and extending from an inner side surface 211 of the first probe holder 21 or an inner side surface 221 of the second probe holder 22. As shown in fig. 2 and 4 to 6, the cantilever segment 31 of one of the probes 30a to 30e is not bent to make the fixing portion 311 and the exposed portion 312 in a straight line, and the cantilever segment 31 of the other of the probes 30a to 30e is bent to make the fixing portion 311 and the exposed portion 312 in a non-straight line. As shown in FIG. 3, the contact segment 32 of each probe 30 a-30 e extends downwardly from the end of the exposed portion 312.
The first probe holder 21 and the second probe holder 22 are made of an insulating material (e.g., epoxy resin commonly called black glue), and the first probe holder 21 and the second probe holder 22 are disposed with inner sides 211 and 221 thereof facing each other and are usually fixed on a bottom surface 41 (as shown in fig. 3) of a circuit board 40, so that the circuit board 40, the first probe holder 21 and the second probe holder 22, and the probes 30a to 30e are combined into a probe card.
In the embodiment of the present invention, the fixing portion 311 of each of the probes 30a to 30e is located in the first or second probe seat 21, 22 by using the black glue to simultaneously arrange the probes of the same probe layer (detailed below) at the predetermined positions on the probe seat, and then baking the black glue to fix the probes on the probe seat. However, the fixing portion 311 of each of the probes 30a to 30e may be fixed to the outer surface of the first or second probe holder 21, 22 by an adhesive. Each of the probes 30 a-30 e may further have a connecting segment (not shown) extending from an outer side surface 212 of the first probe seat 21 or an outer side surface 222 of the second probe seat 22 for electrically connecting to a conductive contact (not shown) on the bottom surface 41 of the circuit board 40 through the connecting segment.
In detail, the fixing portion 311 of the inclined probe 30 a-30 e (the exposed portion 312 is inclined) in the embodiment includes an inner section 311a connected to the exposed portion 312, and an outer section 311b extending from the inner section 311a to the outer side of the probe seat and connected to the connecting section, the inner section 311a is inclined in line with the exposed portion 312, the outer section 311b is in line with the connecting section and perpendicular to the inner and outer sides of the probe seat (i.e. parallel to the probe that is not inclined), such that the probe is inclined in such a manner that the linear needle is placed on the probe seat according to the extending direction D2 (detailed below) of the corresponding conductive contact and the inner section 311a of the fixing portion 311 is fixed by the black glue to fix the exposed portion 312 of the probe at a desired angle (i.e. parallel to the extending direction D2 of the corresponding conductive contact), at this time, the probe is fixed on the probe seat, the fixing portion 311 is bent to make the outer section 311b and the connecting section perpendicular to the inner and outer side surfaces of the probe seat, and then the outer section 311b is fixed by black glue.
The probe module of the present invention is used for detecting multiple units under test, i.e. detecting multiple units under test simultaneously, for example, the probe module 20 of the present embodiment is used for detecting a first unit under test 50A and a second unit under test 50B simultaneously. The unit under test in the embodiment of the present invention is the same as the unit under test 10 (shown in fig. 1) described in the prior art, but in order to more clearly describe the features of the present invention, the unit under test is further described in the embodiment by matching different element numbers with those in fig. 1 in different description manners.
As shown in fig. 2 and 3, an upper surface 56 of each unit under test 50A, 50B has first and second major edges 51, 52 (typically long edges) facing opposite directions, first and second side edges 53, 54 (typically short edges) connecting the first and second major edges 51, 52 and facing opposite directions, and a plurality of conductive contacts 55 a-55 d, wherein the second side edge 54 of the first unit under test 50A is adjacent to the first side edge 53 of the second unit under test 50B. When the probe module 20 detects each unit to be tested 50A, 50B, the first and second probe holders 21, 22 are respectively located above the outer sides of the first main edges 51 and the outer sides of the second main edges 52 of the units to be tested 50A, 50B, in other words, the first main edges 51 of the units to be tested 50A, 50B are closer to the first probe holder 21 than the second main edges 52, the second main edges 52 of the units to be tested 50A, 50B are closer to the second probe holder 22 than the first main edges 51, the probe module 20 as a whole (together with the circuit board 40) moves downward to touch the conductive contacts 55 a-d with the probes 30A-30 e.
It should be noted that, in the present invention, the touch direction D1 (as shown in fig. 3) of the probes 30A to 30e is defined as downward, and the directions (such as terms of upper, lower, top, bottom, etc.) of other features are described based on this, for example, the upper surface 56 of each unit under test 50A, 50B having the conductive contacts 55a to 55D is a surface facing the opposite direction of the touch direction D1, and the bottom surface 41 of the circuit board 40 where the first and second probe holders 21, 22 are fixed is a surface facing the touch direction D1. However, the foregoing directionality merely describes that the features tend to be in the direction opposite to the touching direction D1 (e.g., downward) or the touching direction D1 (e.g., upward), rather than conforming to the direction opposite to the touching direction D1 or the touching direction D1 without error, for example, the touching section 32 of each of the probes 30 a-30 e extends downward from the end of the exposed portion 312, which means that the touching section 32 extends toward the touching direction D1, or the touching section 32 is inclined with respect to the touching direction D1 toward the touching direction D1 as shown in fig. 3.
In each of the units under test 50A and 50B, each of the conductive contacts 55a to 55D has a first end 551 facing the first main edge 51 and a second end 552 facing the second main edge 52, and for simplifying the drawing, only the first end 551 and the second end 552 of the three conductive contacts are labeled in fig. 4, and each of the conductive contacts 55a to 55D can define an extending direction D2 from the second end 552 to the first end 551. As shown in fig. 2, in the present embodiment, each of the cells 50A, 50B can define an imaginary dividing axis a1, the extending direction D2 of the conductive contacts 55 a-55D between the imaginary dividing axis a1 and the first side edge 53 of each of the cells 50A, 50B is parallel to the imaginary dividing axis a1 (e.g., the conductive contacts located in the middle block 57 shown in fig. 4) or inclined with respect to the imaginary dividing axis a1 toward the first side edge 53 (e.g., the conductive contacts located in the left block 58 shown in fig. 4), the extending direction D2 of the conductive contacts 55 a-55D between the imaginary dividing axis a1 and the second side edge 54 of each unit under test 50A, 50B is parallel to the imaginary dividing axis a1 (e.g., the conductive contacts located in the middle block 57 indicated in fig. 4) or is inclined with respect to the imaginary dividing axis a1 toward the second side edge 54 (e.g., the conductive contacts located in the right block 59 indicated in fig. 4). More specifically, the extending direction D2 of the conductive contacts 55a to 55D (located in the middle block 57) near the imaginary boundary axis a1 is parallel to the imaginary boundary axis a1, and the conductive contacts 55a to 55D located farther from the imaginary boundary axis a1 are inclined to the imaginary boundary axis a1 to a greater extent.
As shown in fig. 2 and 4 to 6, in each of the units to be tested 50A and 50B, each of the conductive contacts 55a to 55d is divided into a first conductive contact 55a adjacent to the first main edge 51 and second conductive contacts 55B to 55d adjacent to the second main edge 52, wherein the second conductive contact 55B is substantially parallel to a horizontal imaginary axis a2 and is arranged in a first row L1 (shown in fig. 4) along the second main edge 52, the second conductive contact 55c is substantially parallel to a horizontal imaginary axis a2 and is arranged in a second row L2 (shown in fig. 5) adjacent to the first row L1, the second conductive contact 55d is substantially parallel to a horizontal imaginary axis a2 and is arranged in a third row L3 (shown in fig. 6) adjacent to the second row L2, and the first to third rows L1 to L3 are sequentially arranged from the second main edge 52 toward the first main edge 51. As shown in fig. 2, the first conductive contact 55a of each unit under test 50A, 50B is aligned along the first major edge 51 substantially parallel to the horizontal imaginary axis a2, the first conductive contact 55a of the first unit under test 50A includes a first interface contact 61 adjacent the second side edge 54 of the first unit under test 50A, and the first conductive contact 55a of the second unit under test 50B includes a second interface contact 62 adjacent the first side edge 53 of the second unit under test 50B.
The probes 30A to 30e of the probe module 20 are divided into a first probe 30A (shown in fig. 2) disposed on the left half portion of the first probe holder 21, a second probe 30B (shown in fig. 2) disposed on the right half portion of the first probe holder 21, and third probes 30c to 30e (shown in fig. 4 to 6) disposed on the second probe holder 22, wherein each first probe 30A is respectively used for touching the first conductive contact 55a of the first unit under test 50A, each second probe 30B is respectively used for touching the first conductive contact 55a of the second unit under test 50B, and each third probe 30c to 30e is respectively used for touching each second conductive contact 55B to 55 d.
As shown in fig. 2 and 3, the first probes 30A are arranged in a row substantially corresponding to the arrangement of the first conductive contacts 55a of the first dut 50A to form a first probe layer P1 on the first probe seat 21, and the second probes 30B are arranged in a row substantially corresponding to the arrangement of the first conductive contacts 55a of the second dut 50B to form a second probe layer P2 on the first probe seat 21 with a height lower than the first probe layer P1. As shown in fig. 3 and 4, the third probes 30c are arranged in a row substantially corresponding to the arrangement of the second conductive contacts 55b to form a third probe layer P3 on the second probe socket 22. As shown in fig. 3 and 5, the third probes 30d are arranged in a row substantially corresponding to the arrangement of the second conductive contacts 55c to form a fourth probe layer P4 higher than the third probe layer P3 on the second probe stage 22. As shown in fig. 3 and 6, the third probes 30e are arranged in a row substantially corresponding to the arrangement of the second conductive contacts 55d to form a fifth probe layer P5 higher than the fourth probe layer P4 on the second probe seat 22.
In other words, the third probes 30c to 30e are arranged in three rows (the same as the number of the second conductive contacts 55b to 55 d) in the order of the first to third rows L1 to L3 corresponding to the second conductive contacts 55b to 55d from the bottom up, the higher the position of the third probe of the needle layer for touching the conductive contact farther from the second probe holder 22, and the longer the cantilever section of the third probe of the higher position of the needle layer. The first and second probes 30a, 30b are aligned in a row in the top view of fig. 2, but are actually aligned in two rows at different heights as shown in fig. 3, but the two rows of the first and second probes 30a, 30b extend to the first conductive contacts 55a aligned in the same row, so that the vertical distance d between the ends of the contact segments 32 of the first and second probes 30a, 30b and the inner side 211 of the first probe holder 21 is substantially the same.
When the probe module 20 detects each unit under test 50A, 50B, each first probe 30A extends to above the first conductive contact 55a of the first unit under test 50A (as shown in fig. 2) with the cantilever section 31 thereof passing over the first main edge 51 of the first unit under test 50A respectively and contacts the first conductive contact 55a of the first unit under test 50A with the contact section thereof, each second probe 30B extends to above the first conductive contact 55a of the second unit under test 50B (as shown in fig. 2) with the cantilever section 31 thereof passing over the first main edge 51 of the second unit under test 50B respectively and contacts the first conductive contact 55a of the first unit under test 50B with the contact section thereof, each third probe 30c extends to above the second conductive contact 55B (as shown in fig. 4) with the cantilever section 31 thereof passing over the second main edge 52 of each unit under test 50A, 50B and contacts the second conductive contact 55B with the contact section 32B thereof, each third probe 30d extends to the top of each second conductive contact 55c (as shown in fig. 5) by passing the cantilever section 31 over the second main edge 52 of each unit under test 50A, 50B and then touches each second conductive contact 55c by using the touch section 32, and each third probe 30e extends to the top of each second conductive contact 55d (as shown in fig. 6) by passing the cantilever section 31 over the second main edge 52 of each unit under test 50A, 50B and then touches each second conductive contact 55d by using the touch section 32.
In the present embodiment, the extending direction of the exposed portion 312 of each probe 30 a-30 e from the probe seat 21, 22 substantially corresponds to the extending direction D2 of the conductive contact 55 a-55D to be touched by the probe 30 a-30 e, which is called "substantially corresponding" herein, and means that the extending direction of the exposed portion 312 from the probe seat 21, 22 is not necessarily the same as or opposite to the extending direction D2 of the corresponding conductive contact 55 a-55D, but when viewed from the top (i.e. the direction of fig. 2 and 4-6), the exposed portion 312 is substantially parallel to the extending direction D2 of the corresponding conductive contact 55 a-55D, so that the problem of inaccurate touch caused by the contact segment 32 of the probe 30 a-30 e deviating to the outside of the corresponding conductive contact 55 a-55D during touch can be avoided. In other words, the exposed portions 312 of the probes 30a to 30e are arranged at an inclination angle similar to that of the conductive contacts 55a to 55 d.
In detail, the second probe holder 22 can define an imaginary dividing axis L4 perpendicular to the inner side surface 221 thereof, and a first imaginary dividing line L5 (coinciding with the imaginary dividing axis a1 of the first unit under test 50A) and a second imaginary dividing line L6 (coinciding with the imaginary dividing axis a1 of the second unit under test 50B) respectively located on a first side (left side) and a second side (right side) of the imaginary dividing axis L4, and for the probe disposed on the left half portion of the second probe holder 22, the direction in which the exposed portion 312 extends from the inner side surface 221 thereof is parallel to the first imaginary dividing line L5 (e.g., the probe corresponding to the middle block 57 indicated in fig. 4) or is inclined with respect to the first imaginary dividing line L5 away from the first imaginary dividing line L5 (e.g., the probe corresponding to the left and right side blocks 58, 59 indicated in fig. 4); the probe pins provided on the right half of the second probe holder 22 have their exposed portions 312 extending from the inner side surface 221 in a direction parallel to the second imaginary dividing line L6 (e.g., the probe pins corresponding to the middle block 57 shown in fig. 4) or inclined with respect to the second imaginary dividing line L6 away from the second imaginary dividing line L6 (e.g., the probe pins corresponding to the left and right blocks 58, 59 shown in fig. 4). For the first probe seat 21, the first probe layer P1 can define a first imaginary dividing line perpendicular to the inner side surface 211 of the first probe seat 21 (coinciding with the first imaginary dividing line L5 of the second probe seat 22), and the direction in which the exposed portion 312 of each first probe 30a extends from the inner side surface 211 is parallel to the first imaginary dividing line L5 (e.g., corresponding to the probe of the middle block 57 indicated in fig. 4) or is inclined with respect to the first imaginary dividing line L5 toward the first imaginary dividing line L5 (e.g., corresponding to the probe of the left and right side blocks 58, 59 indicated in fig. 4); the second probe layer P2 defines a second imaginary dividing line perpendicular to the inner side surface 211 of the first probe holder 21 (coinciding with the second imaginary dividing line L6 of the second probe holder 22), and the direction in which the exposed portion 312 of each second probe 30b extends from the inner side surface 211 is parallel to the second imaginary dividing line L6 (e.g., corresponding to the probe of the middle block 57 shown in fig. 4) or inclined with respect to the second imaginary dividing line L6 toward the second imaginary dividing line L6 (e.g., corresponding to the probes of the left and right side blocks 58, 59 shown in fig. 4).
By the probe arrangement of the probe module, the effect of ensuring the probe to be contacted reliably can be achieved on the premise that the various probes are arranged on the probe seat at proper intervals. In addition, in the embodiment, the outer sections 311b of the fixing portions 311 of the probes 30a to 30e are substantially parallel to each other, so that the probes are more conveniently arranged on the probe seats; however, the probe arrangement of the probe module of the present invention also facilitates the arrangement of the probe (for example, the probe 30a shown in fig. 7) with the fixing portion 311 and the exposed portion 312 substantially in a straight line on the probe base, so as to further simplify the bending process of the probe.
More importantly, as shown in fig. 2, although the extending direction D2 of the first interface contact 61 is inclined to the second side edge 54 of the first unit under test 50A and the extending direction D2 of the second interface contact 62 is also inclined to the first side edge 53 of the second unit under test 50B, the probe module 20 of the present invention contacts the first interface contact 61 through the rightmost first probe 30A of the first probe layer P1 and contacts the second interface contact 62 through the leftmost second probe 30B of the second probe layer P2, and the first probe layer P1 and the second probe layer P2 are located at different heights, so that even though the first and second probes 30A and 30B (respectively defined as the first and second interface probes 63 and 64) for contacting the first and second interface contacts 61 and 62 are matched with the extending direction of the extending portion 312 of the first and second interface contacts 61 and 61 from the first probe seat 21, The first and second boundary probes 63, 64 are positioned at different heights in the extending direction D2 of the probe head 62, so that the interference between the first and second boundary probes can be avoided.
As can be seen from fig. 2, if the first and second boundary probes 63, 64 are disposed at the same height, the fixing portion 311 or even the exposed portion 312 is too close to each other, even if the inclination angles of the first and second boundary contacts 61, 62 are larger than that provided in the present embodiment, in order to make the inclination angles of the exposed portions 312 of the first and second boundary probes 63, 64 correspond to the inclination angles of the first and second boundary contacts 61, 62, the fixing portion 311 of the first boundary probe 63 needs to be disposed on the right, and the fixing portion 311 of the second boundary probe 64 needs to be disposed on the left, so that the fixing portions 311 or even the exposed portions 312 of the first and second boundary probes 63, 64 may interfere with each other, and the first and second boundary probes 63, 64 of the present invention are disposed at different heights to avoid the above-mentioned problems. It is understood that the leftmost first probe 30A and the rightmost second probe 30B can also perform the aforementioned functions when the first side edge 53 of the first dut 50A and the second side edge 54 of the second dut 50B are adjacent to other duts (i.e. there are four duts in parallel).
In the present embodiment, since the first probe 30a and the second probe 30b are located at different heights, no matter how large the inclination angle of the first conductive contact 55a is, the inclination angles of the first and second probes 30a and 30b can correspond to the inclination angle of the first conductive contact 55a, and no interference problem occurs. However, the probe module of the present invention is not limited to the first probes 30a being located at the same height, nor the second probes 30b being located at the same height, as long as the rightmost one or more first probes 30a and the leftmost one or more second probes 30b are located at different heights, so as to avoid the problem of probe interference, that is, the first probes 30a may include one or more first interface probes 63, and the second probes 30b may include one or more second interface probes 64, as long as the first interface probes 63 and the second interface probes 64 are located at different heights (different probe layers), so as to avoid mutual interference, and the heights of the remaining first probes 30a and the remaining second probes 30b are not limited, for example, only the first interface probe 63 may be located at a higher first probe layer P1, and the remaining first probes 30a and the remaining second probes 30b may be located at a lower second probe layer P2, the number of the first and second boundary probes 63, 64 depends on the inclination angle of the first conductive contact 55a adjacent to the adjacent side edges of the first and second unit under test 50A, 50B. In detail, for the first and second units under test 50A and 50B of the present embodiment, the first conductive contact 55a closest to the adjacent side edge of each unit under test 50A and 50B would cause the corresponding probes at the same height to be too close, so that there is only one first and second interface contacts 61 and 62, and only one first and second interface probes 63 and 64, respectively, and the probe interference problem can be avoided as long as the two probes are located at different heights. In the case where the first conductive contact 55a adjacent to the adjacent side edges of the unit under test 50A, 50B is inclined at a larger angle, the number of the first and second boundary contacts 61, 62 (i.e. the conductive contacts that may cause the probes at the same height to approach too closely or interfere with each other) is set to be larger, and the number of the first and second boundary probes 63, 64 is increased.
Referring to fig. 8 and 9, a probe module 20 'according to a second preferred embodiment of the present invention is used for simultaneously detecting first to fourth units to be tested 50A to D arranged in a matrix, wherein, for the first and second units to be tested 50A and 50B at the lower left and lower right in fig. 8, the probe module 20' adopts a probe configuration similar to the probe module 20 of the first preferred embodiment, and for simplification of the drawing, the probe of this portion is not shown in fig. 8. For the third and fourth units under test 50C and 50D at the top left and the top right in fig. 8, since the first major edge 51 of the third unit under test 50C is adjacent to the second major edge 52 of the first unit under test 50A, the first major edge 51 of the fourth unit under test 50D is adjacent to the second major edge 52 of the second unit under test 50B, and the conductive contacts 55 a-55D of the third and fourth units under test 50C and 50D are all closer to the second probe holder 22 than the first conductive contact 55a of the first and second units under test 50A and 50B, the conductive contacts 55 a-55D of the third and fourth units under test 50C and 50D can all be touched by the third probes 30 f-30 i disposed on the second probe holder 22, i.e., four rows of the third probes 30 f-30 i can be additionally disposed on the second probe holder 22, as shown in fig. 9, the fourth rows of the third probes 30 f-30 i are disposed on the first probe holder for touching the first probe The third probes 30C-30 e of the two units under test 50A, 50B are disposed below and sequentially from top to bottom for touching the third to the first rows L3-L1 of the first conductive contacts 55a and the second conductive contacts 55B-55D of the third and the fourth units under test 50C, 50D, respectively. To simplify the drawing, only the third probe 30f for touching the first conductive contact 55a of the third and fourth dut 50C and 50D is shown in fig. 8.
Finally, it should be noted that the components disclosed in the foregoing embodiments are merely examples and are not intended to limit the scope of the present disclosure, and other equivalent components may be substituted or modified within the scope of the present disclosure.

Claims (22)

1. A probe module adapted for use with multiple units under test having oblique conductive contacts for simultaneously testing multiple units under test, comprising: each unit to be tested is provided with a first main edge, a second main edge, a first side edge and a second side edge which are connected with the first main edge and the second main edge, and a plurality of conductive contacts, wherein the plurality of units to be tested comprise a first unit to be tested and a second unit to be tested, the second side edge of the first unit to be tested is adjacent to the first side edge of the second unit to be tested, the conductive contact of the first unit to be tested comprises a first junction contact which is adjacent to the first main edge and the second side edge of the first unit to be tested, and the conductive contact of the second unit to be tested comprises a second junction contact which is adjacent to the first main edge and the first side edge of the second unit to be tested; the probe module includes:
at least one probe seat;
the probe comprises a cantilever section and a point contact section, wherein the cantilever section is provided with a fixed part fixedly connected with the probe seat and an exposed part which is connected with the fixed part and extends out from one inner side surface of the probe seat, and the point contact section is connected with the exposed part;
when the probe module detects each unit to be detected, the first main edge of each unit to be detected is closer to the first probe seat than the second main edge, and the first boundary probe and the second boundary probe respectively pass through the first main edge of the first unit to be detected and extend to the upper parts of the first boundary joint and the second boundary joint through cantilever sections of the first boundary probe and the second boundary probe so as to respectively touch the first boundary joint and the second boundary joint through point touch sections of the first boundary probe and the second boundary probe.
2. The probe module of claim 1 adapted for use with multiple units under test having angled conductive contacts, wherein: the conductive contact of each unit to be tested comprises a plurality of first conductive contacts which are arranged in a line along the first main edge of the unit to be tested, the first conductive contact of the first unit to be tested comprises the first junction contact, and the first conductive contact of the second unit to be tested comprises the second junction contact; the plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, each first probe forms a first probe layer on the first probe seat, each second probe forms a second probe layer with different height from the first probe layer on the first probe seat, each first probe comprises the first boundary probe, and each second probe comprises the second boundary probe; when the probe module detects each unit to be detected, each first probe respectively touches the first conductive contact of the first unit to be detected by the point contact section of the first probe, and each second probe respectively touches the first conductive contact of the second unit to be detected by the point contact section of the second probe.
3. The probe module of claim 1 adapted for use with multiple units under test having angled conductive contacts, wherein: the conductive contact of each unit to be tested comprises a plurality of first conductive contacts which are arranged in a line along the first main edge of the unit to be tested, the first conductive contact of the first unit to be tested comprises the first junction contact, and the first conductive contact of the second unit to be tested comprises the second junction contact; the plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, each first probe comprises a first junction probe, each second probe comprises a second junction probe, when the probe module detects each unit to be detected, each first probe respectively touches a first conductive contact of the first unit to be detected by a touch section of the first probe, and each second probe respectively touches a first conductive contact of the second unit to be detected by a touch section of the second probe; each of the first probe and the second probe forms a plurality of probe layers with different heights on the first probe seat, and the first boundary probe and the second boundary probe are positioned on different probe layers.
4. The probe module of claim 3 adapted for use with multiple units under test having angled conductive contacts, wherein: the probe layer of the first probe seat comprises a first probe layer and a second probe layer lower than the first probe layer, one of the first boundary probe and the second boundary probe is positioned on the first probe layer, and the rest of the first probe and the second probe are positioned on the second probe layer.
5. The probe module for multiple units under test with angled conductive contacts as recited in any of claims 2 to 4, wherein: each first probe can define a first imaginary dividing line perpendicular to the inner side surface of the first probe seat, and the extending direction of the exposed part of each first probe from the inner side surface is parallel to the first imaginary dividing line or inclines relative to the first imaginary dividing line towards the first imaginary dividing line; each of the second probes may define a second imaginary dividing line perpendicular to the inner side surface of the first probe holder, and the direction in which the exposed portion of each of the second probes extends from the inner side surface may be parallel to the second imaginary dividing line or may be inclined with respect to the second imaginary dividing line toward the second imaginary dividing line.
6. The probe module of claim 1 adapted for use with multiple units under test having angled conductive contacts, wherein: the conductive connection points of each unit to be tested comprise a plurality of second conductive connection points adjacent to the second main edge of the unit to be tested; the probe module further includes a second probe holder in at least one probe holder, the probe of the probe module includes a plurality of third probes disposed on the second probe holder, when the probe module detects each unit to be tested, the second main edge of each unit to be tested is closer to the second probe holder than the first main edge, and at least a part of the third probes extend to the top of each second conductive contact through the cantilever section of the third probes above the second main edge of each unit to be tested, and then contact each second conductive contact through the point contact section of the third probes.
7. The probe module of claim 6, adapted for use with multiple units under test having angled conductive contacts, wherein: the second conductive contacts of each unit to be tested are arranged in a plurality of rows parallel to a horizontal imaginary axis, and are sequentially arranged from the second main edge towards the first main edge; each of the third probes forms a plurality of probe layers having different heights in an arrangement corresponding to each of the second conductive contacts in an order corresponding to the plurality of rows of the second conductive contacts from bottom to top.
8. The probe module of claim 6, adapted for use with multiple units under test having angled conductive contacts, wherein: the multiple units to be tested further comprise a third unit to be tested and a fourth unit to be tested, the first main edge of the third unit to be tested is adjacent to the second main edge of the first unit to be tested, and the first main edge of the fourth unit to be tested is adjacent to the second main edge of the second unit to be tested; when the probe module detects each unit to be tested, part of the third probes touch all the conductive contacts of the third unit to be tested and the fourth unit to be tested through the point contact sections of the third probes.
9. The probe module of claim 6, adapted for use with multiple units under test having angled conductive contacts, wherein: each third probe forms a plurality of probe layers with different heights, the higher the third probe of the probe layer is used for touching the conductive contact which is farther away from the second probe seat, and the longer the cantilever section of the higher the third probe of the probe layer is.
10. The probe module of claim 6, adapted for use with multiple units under test having angled conductive contacts, wherein: the second probe holder can define an imaginary dividing axis perpendicular to the inner side surface thereof, a first imaginary dividing line and a second imaginary dividing line, the first imaginary dividing line and the second imaginary dividing line are respectively located on a first side and a second side of the imaginary dividing axis, a direction in which the exposed portion of the probe located on the first side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the first imaginary dividing line in parallel to the first imaginary dividing line or away from the first imaginary dividing line, and a direction in which the exposed portion of the probe located on the second side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the second imaginary dividing line in parallel to the second imaginary dividing line or away from the second imaginary dividing line.
11. The probe module of claim 1 adapted for use with multiple units under test having angled conductive contacts, wherein: the fixed part and the exposed part of each probe are in a straight line.
12. The probe module of claim 1 adapted for use with multiple units under test having angled conductive contacts, wherein: the fixing part of each probe comprises an inner section and an outer section, the inner section of the fixing part of each probe is connected with the exposed part and is in a straight line with the exposed part, and the outer sections of the fixing parts of each probe are parallel to each other.
13. A probe module for multiple units under test with angled conductive contacts, comprising:
at least one probe seat;
the probe comprises a cantilever section and a point contact section, wherein the cantilever section is provided with a fixed part fixedly connected with the probe seat and an exposed part which is connected with the fixed part and extends out from one inner side surface of the probe seat, and the point contact section is connected with the exposed part;
the probe seat comprises a first probe seat, the probes comprise a first boundary probe and a second boundary probe which are arranged on the first probe seat and located at different heights, and the vertical distances between the tail ends of point contact sections of the first boundary probe and the second boundary probe and the inner side surface of the first probe seat are the same.
14. The probe module for multiple units under test with angled conductive contacts as recited in claim 13, wherein: the exposed part of the first boundary probe and the exposed part of the second boundary probe are inclined in a manner of being not perpendicular to the inner side surface of the first probe seat, and the inclined directions of the exposed parts are mutually symmetrical.
15. The probe module for multiple units under test with angled conductive contacts as recited in claim 13, wherein: the plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, each first probe forms a first probe layer on the first probe seat, each second probe forms a second probe layer with different height from the first probe layer on the first probe seat, each first probe comprises a first junction probe, each second probe comprises a second junction probe, and the vertical distance between the tail end of the point contact section of each first probe and the tail end of the point contact section of each second probe is the same as that of the inner side surface of the first probe seat.
16. The probe module for multiple units under test with angled conductive contacts as recited in claim 13, wherein: the plurality of probes comprise a plurality of first probes and a plurality of second probes which are arranged on the first probe seat, the vertical distance between the tail end of a point contact section of each first probe and the tail end of a point contact section of each second probe and the inner side surface of the first probe seat is the same, each first probe comprises a first junction probe, each second probe comprises a second junction probe, each first probe and each second probe form a plurality of probe layers with different heights on the first probe seat, and the first junction probe and the second junction probe are positioned on different probe layers.
17. The probe module for multiple units under test with angled conductive contacts as recited in claim 16, wherein: the probe layer of the first probe seat comprises a first probe layer and a second probe layer lower than the first probe layer, one of the first boundary probe and the second boundary probe is positioned on the first probe layer, and the rest of the first probe and the second probe are positioned on the second probe layer.
18. The probe module for multiple units under test with angled conductive contacts as recited in any of claims 15 to 17, wherein: each first probe can define a first imaginary dividing line perpendicular to the inner side surface of the first probe seat, and the extending direction of the exposed part of each first probe from the inner side surface is parallel to the first imaginary dividing line or inclines relative to the first imaginary dividing line towards the first imaginary dividing line; each of the second probes may define a second imaginary dividing line perpendicular to the inner side surface of the first probe holder, and the direction in which the exposed portion of each of the second probes extends from the inner side surface may be parallel to the second imaginary dividing line or may be inclined with respect to the second imaginary dividing line toward the second imaginary dividing line.
19. The probe module for multiple units under test with angled conductive contacts as recited in claim 13, wherein: the probe module comprises a first probe seat, a second probe seat and a plurality of third probes, wherein the first probe seat is provided with a plurality of cantilever sections, the cantilever sections of the first probes are arranged on the first probe seat, the cantilever sections of the first probes are arranged on the second probe seat, and the cantilever sections of the first probes are arranged on the first probe seat.
20. The probe module for multiple units under test with angled conductive contacts as recited in claim 19, wherein: the second probe holder can define an imaginary dividing axis perpendicular to the inner side surface thereof, a first imaginary dividing line and a second imaginary dividing line, the first imaginary dividing line and the second imaginary dividing line are respectively located on a first side and a second side of the imaginary dividing axis, a direction in which the exposed portion of the probe located on the first side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the first imaginary dividing line in parallel to the first imaginary dividing line or away from the first imaginary dividing line, and a direction in which the exposed portion of the probe located on the second side of the imaginary dividing axis extends from the inner side surface is inclined with respect to the second imaginary dividing line in parallel to the second imaginary dividing line or away from the second imaginary dividing line.
21. The probe module for multiple units under test with angled conductive contacts as recited in claim 13, wherein: the fixed part and the exposed part of each probe are in a straight line.
22. The probe module for multiple units under test with angled conductive contacts as recited in claim 13, wherein: the fixing part of each probe comprises an inner section and an outer section, the inner section of the fixing part of each probe is connected with the exposed part and is in a straight line with the exposed part, and the outer sections of the fixing parts of each probe are parallel to each other.
CN202010336493.1A 2019-07-22 2020-04-26 Probe module suitable for multiple units to be tested with inclined conductive contacts Pending CN112285394A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW108125850A TWI704355B (en) 2019-07-22 2019-07-22 Suitable for probe modules with multiple units to be tested with inclined conductive contacts
TW108125850 2019-07-22

Publications (1)

Publication Number Publication Date
CN112285394A true CN112285394A (en) 2021-01-29

Family

ID=73644172

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010336493.1A Pending CN112285394A (en) 2019-07-22 2020-04-26 Probe module suitable for multiple units to be tested with inclined conductive contacts

Country Status (3)

Country Link
KR (1) KR102292880B1 (en)
CN (1) CN112285394A (en)
TW (1) TWI704355B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1398448A (en) * 2000-12-09 2003-02-19 株式会社鼎新 Contact structure and prodn. method thereof and probe contact assembly using same
TW200606436A (en) * 2004-07-07 2006-02-16 Cascade Microtech Inc Probe head having a membrane suspended probe
CN1818571A (en) * 2005-02-07 2006-08-16 波恩斯公司 Potentiometer
CN101308163A (en) * 2007-05-15 2008-11-19 旺矽科技股份有限公司 Probe card with electrical shield structure
CN101881787A (en) * 2009-05-07 2010-11-10 旺矽科技股份有限公司 Multi-chip test probe device
TWM457875U (en) * 2013-01-21 2013-07-21 Mpi Corp Cantilever probe card
CN106018891A (en) * 2015-03-26 2016-10-12 旺矽科技股份有限公司 Cantilever probe card using coaxial needle
CN108802443A (en) * 2017-05-03 2018-11-13 创意电子股份有限公司 Probe card system, probe carrier device and method for manufacturing probe carrier device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1318733B1 (en) * 2000-08-04 2003-09-10 Technoprobe S R L CABLE PROBE MEASUREMENT HEAD.
KR100823879B1 (en) * 2001-12-05 2008-04-21 주식회사 파이컴 Method of making probe card
JP2008082912A (en) * 2006-09-28 2008-04-10 Micronics Japan Co Ltd Electrical connection device
JP2008216206A (en) 2007-03-07 2008-09-18 Tokyo Cathode Laboratory Co Ltd Contactor, probe card, and method of manufacturing probe card
JP5788767B2 (en) * 2011-11-07 2015-10-07 株式会社日本マイクロニクス Probe block, probe card including the same, and probe device
JP2013130400A (en) * 2011-12-20 2013-07-04 Micronics Japan Co Ltd Probe assembly, probe card including the same and manufacturing method thereof
CN103185819B (en) * 2011-12-27 2016-08-17 联咏科技股份有限公司 Probe card and manufacturing method thereof
ITMI20122023A1 (en) * 2012-11-28 2014-05-29 Technoprobe Spa SHIELD CONTACT PROBE [CANTILEVER] FOR A MEASURING HEAD
TWI458987B (en) * 2013-04-26 2014-11-01 Mpi Corp Probe needle module
KR101544845B1 (en) * 2013-06-07 2015-08-18 주식회사 에이엠에스티 Method for making of probe and one body type probe
JP6357002B2 (en) 2014-04-16 2018-07-11 株式会社日本マイクロニクス Probes and probe cards
TWI612312B (en) * 2017-05-03 2018-01-21 創意電子股份有限公司 Probe card system, probe loader device and manufacturing method of the probe loader device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1398448A (en) * 2000-12-09 2003-02-19 株式会社鼎新 Contact structure and prodn. method thereof and probe contact assembly using same
TW200606436A (en) * 2004-07-07 2006-02-16 Cascade Microtech Inc Probe head having a membrane suspended probe
CN1818571A (en) * 2005-02-07 2006-08-16 波恩斯公司 Potentiometer
CN101308163A (en) * 2007-05-15 2008-11-19 旺矽科技股份有限公司 Probe card with electrical shield structure
CN101881787A (en) * 2009-05-07 2010-11-10 旺矽科技股份有限公司 Multi-chip test probe device
TWM457875U (en) * 2013-01-21 2013-07-21 Mpi Corp Cantilever probe card
CN106018891A (en) * 2015-03-26 2016-10-12 旺矽科技股份有限公司 Cantilever probe card using coaxial needle
CN108802443A (en) * 2017-05-03 2018-11-13 创意电子股份有限公司 Probe card system, probe carrier device and method for manufacturing probe carrier device

Also Published As

Publication number Publication date
KR20210011871A (en) 2021-02-02
TWI704355B (en) 2020-09-11
KR102292880B1 (en) 2021-08-24
TW202104904A (en) 2021-02-01

Similar Documents

Publication Publication Date Title
US9329205B2 (en) High-precision semiconductor device probing apparatus and system thereof
KR101422566B1 (en) Probe and Probe Card
KR102088204B1 (en) Pin board
KR100867330B1 (en) Probe assembly for probe card
JP2519737B2 (en) Probe card
CN102667505A (en) Capacitive opens testing in low signal environments
KR100934914B1 (en) Electrical Connecting Apparatus
CN108732393B (en) Probe module and probe card
US9354253B2 (en) Probe module
KR20130047933A (en) Probe, probe assembly and probe card comprising it
KR101120405B1 (en) Probe block assembly
KR102257278B1 (en) Electrical connection device
CN112285394A (en) Probe module suitable for multiple units to be tested with inclined conductive contacts
CN111141938B (en) Probe module suitable for multiple units to be tested with inclined conductive contacts
KR101227547B1 (en) Probe card
TWI704357B (en) Suitable for probe modules with multiple units to be tested with inclined conductive contacts
CN112505374A (en) Probe module suitable for multiple units to be tested with inclined conductive contacts
KR102357377B1 (en) Probe pin and probe unit with them
KR20130051843A (en) Probe, probe assembly and probe card comprising it
JP2023093708A (en) Method for inspecting wiring circuit board
CN103837715A (en) Jig
US20080012595A1 (en) Wafer test card using electric conductive spring as wafer test interface
WO2011090146A1 (en) Probe card, semiconductor wafer, inspection device and inspection method
JPH067138B2 (en) Probe device
JP2013079892A (en) Probe card

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination