TWI580970B - Probe module (1) - Google Patents

Description

Probe module (1)

The invention relates to the detection of electronic objects; in particular to a probe module.

Pressing, the probe module is disposed between a detecting machine and an electronic object to be tested for transmitting the detecting signal of the detecting machine to the electronic object to be tested. The probe module 1 shown in FIG. 1 includes a second substrate 10 and a plurality of probes 12, and each of the substrates 10 is provided with two conductive wires 102. One end of the conductive wires 102 is electrically connected and detected. Machine (not shown). The probes 12 are respectively disposed on the substrate 10 and are electrically connected to the other ends of the conductive lines 102. The substrate 10 is on the upper side 14 of a to-be-side electronic object, and the substrates 10 are parallel to a to-be-tested surface 14a of the electronic object to be tested, and the probes are used to measure the to-be-tested electronic object 14 to be tested. Face 14a.

The substrate 10 of the conventional probe module 1 generally has a certain width. When the two substrates 10 are close to each other, the probes 12 on the two substrates 10 are limited by the width of the substrate 10 and cannot be close to each other, so that the two substrates 10 are In the horizontal direction, it will take up quite a bit of space. Therefore, the conventional probe module 1 can only be used for measuring the electronic object 14 to be tested having a large size.

With the advancement of technology, the size of the electronic object to be tested is becoming smaller, and the conventional probe module 1 cannot meet the demand for detecting small-sized electronic objects to be tested.

In view of this, the object of the present invention is to provide a probe mode The group can be applied to detect small-sized electronic objects to be tested.

In order to achieve the above object, the probe module provided by the present invention, The method is disposed between a detecting machine and an electronic object to be tested, wherein the electronic object to be tested has a surface to be tested; the probe module comprises two substrates, at least two conductive lines and at least two probes, wherein each of the substrate systems The substrate is made of an insulating material, each of the substrates has opposite planes, and the distance between the two planes is the thickness of the substrate; each plane of each of the substrates is not parallel to the to-be-tested electronic object. a plane of one of the substrates adjacent to a plane of the other substrate, and a shortest distance between two planes adjacent to the two substrates is less than a shortest distance between the other two planes of the two substrates The two conductive lines are respectively disposed on the substrates, and one end of each of the conductive lines is electrically connected to the detecting machine; the two probes are electrically connected to the other ends of the two conductive lines, and the probes are respectively provided for the points. Measuring the surface to be tested of the electronic object to be tested.

The effect of the invention is that the substrate of the probe module can be opposite to the The surface to be tested is erected. When the two substrates are close to each other, they are not limited by the width of the substrate in the horizontal direction. Therefore, the probes on the two substrates can be closer, so that the probe module of the present invention is compared with The conventional probe module can be used to spot small electronic objects to be tested.

[Use]

1‧‧‧ Probe Module

10‧‧‧Substrate

102‧‧‧Flexible wire

12‧‧‧ probe

14‧‧‧Electronic objects to be tested

14a‧‧‧Determination

〔this invention〕

2‧‧‧ Probe Module

20‧‧‧ Carrier Board

202‧‧‧Perforation

204‧‧‧ top surface

206‧‧‧ bottom

22‧‧‧Substrate

22a‧‧‧ Plane

24‧‧‧First board

242‧‧‧First side edge

244‧‧‧ outer edge

26‧‧‧Second board

262‧‧‧second side edge

28‧‧‧third board

282‧‧‧ third side

284‧‧‧Extension

284a‧‧‧ bottom edge

30‧‧‧Flexible wire

32‧‧‧Connectors

322‧‧‧ Signal electrode

324‧‧‧Metal housing

34‧‧‧Probe

342‧‧‧Cantilever segment

344‧‧‧needle section

A‧‧‧Electronic objects to be tested

A01‧‧‧Detering surface

D1‧‧‧ shortest distance

D2‧‧‧ shortest distance

Θ‧‧‧ angle

3‧‧‧ Probe Module

36‧‧‧ Carrier Board

362‧‧‧Perforation

38‧‧‧Substrate

382‧‧‧ plane

382a‧‧‧ Groove

40‧‧‧First board

402‧‧‧lateral edge

402a‧‧‧Open end

42‧‧‧third board

422‧‧‧ side edge

422a‧‧‧Open end

44‧‧‧Flexible wire

442‧‧‧ first paragraph

444‧‧‧second paragraph

46‧‧‧Connectors

48‧‧‧ probe

Figure 1 is a top plan view of a conventional probe module.

2 is a perspective view of a probe module according to a first preferred embodiment of the present invention.

3 is a top plan view of the probe module of the first preferred embodiment.

4 is a partial side elevational view of the probe module of the first preferred embodiment.

Figure 5 is a perspective view of the substrate of the first preferred embodiment.

Figure 6 is another perspective view of the substrate of the first preferred embodiment.

Figure 7 is a perspective view of a probe module in accordance with a second preferred embodiment of the present invention.

Figure 8 is a perspective view of a substrate of a second preferred embodiment.

Figure 9 is another perspective view of the substrate of the second preferred embodiment.

In order to explain the present invention more clearly, the preferred embodiment will be described in detail with reference to the accompanying drawings. FIG. 2 shows a probe module 2 according to a first preferred embodiment of the present invention. Between a detector (not shown) and an electronic object A to be tested, and the electronic object A to be tested has a surface to be tested A01. The probe module 2 includes a carrier 20, a plurality of substrates 22, a plurality of conductive lines 30, a plurality of connectors 32, and a plurality of probes 34.

The carrier 20 is made of an insulating material. In the embodiment, the carrier 20 is a printed circuit board. The carrier 20 has a through hole 202 extending through the top surface 204 and the bottom surface 206 of the carrier 20 . Please refer to FIG. 3 and FIG. 4 , the electronic object A to be tested is located below the carrier 20 and within the orthographic projection range of the through hole 202 , the to-be-tested surface A01 of the electronic object A to be tested is associated with the carrier 20 . The top surface 204 and the bottom surface 206 are parallel.

Referring to FIG. 3, each of the substrates 22 is made of an insulating material. In this embodiment, each of the substrates 22 is a printed circuit board, and each of the substrates 22 has opposite planes 22a, between the two planes 22a. The distance is the thickness of the substrate 22. Among the two adjacent substrates 22, one of the planes 22a of the substrate 22 is adjacent to a plane 22a of the other substrate 22, and the shortest distance D1 between the two planes 22a of the two adjacent substrates 22 It is smaller than the shortest distance D2 between the other two planes 22a of the two substrates 22. In this embodiment, the two adjacent planes 22a of the two adjacent substrates 22 are perpendicular to each other, but not limited thereto, or two adjacent planes 22a may be parallel or have an included angle of less than 180 degrees.

With reference to FIG. 4 to FIG. 6 , each of the substrates 22 has a first plate segment 24 , a second plate segment 26 and a third plate segment 28 connected in sequence. The first plate segment 24 is located between the second plate segment 26 and the detector, and the second plate segment 26 is located between the first plate segment 24 and the third plate segment 28. The first plate segment 24 has two parallel first side edges 242 and an outer edge 244 connected between the two first side edges 242. The second plate section 26 has two parallel second side edges 262, and the second side edge 262 of the second plate section 26 is coupled to the top surface 204 of the carrier 20, thereby making each substrate 22 is erected on the top surface 204 of the carrier 20, and each of the planes 22a of the substrate 22 is substantially perpendicular to the to-be-measured surface A01 of the electronic object A to be tested in this embodiment. An angle θ is formed between the second side edge 262 of the second plate segment 26 and the first side edge 242 of the first plate segment 24, and the angle θ is greater than 90 degrees, so that the first plate The segment 24 is inclined outwardly relative to the center of the perforation 202 of the carrier 20 and the outer edge 244 is inclined from top to bottom.

The third plate segment 28 is located on the perforation 202 of the carrier 20 A third side edge 282 is adjacent to the center of the through hole 202, and the third side edge 282 is substantially perpendicular to the top surface 204 of the carrier 20, the bottom surface 206, and the to-be-tested surface A01 of the electronic object to be tested. . In addition, the third plate section 28 extends further through the perforations 202 of the carrier 20 to form an extension 284 having a bottom side edge 284a at the bottom end, the bottom side edge 284a being coupled to Between the two planes 22a of the substrate 22.

The conductive lines 30 are in the form of a line layout in this embodiment. The two types of the plane 22a of the substrate 22 are respectively disposed on the two planes 22a of the substrate 22, and each of the conductive lines 30 extends from the first plate segment 24 to the third plate segment 28 to the plane. 22a is joined to the bottom side edge 284a.

Please cooperate with FIG. 5 and FIG. 6, each of the joints 32 is disposed in each of the joints. On the outer edge 244 of the first plate segment 24 of the substrate 22, each of the terminals 32 has a signal electrode 322 and a metal casing 324, and the signal electrode 322 and the metal casing 324 are respectively electrically connected by soldering. Connecting one end of the two conductive lines 30 on the two planes 22a of the substrate 22, so that each of the substrates 22 is A conductive line 30 is electrically connected to the detector through a connector 32.

Each of the probes 34 is a cantilever probe in this embodiment, There is a cantilever segment 342 and a tip segment 344. Each of the probes 34 is disposed on each of the extensions 284 of the third plate segment 28 on each of the substrates 22, in detail, each of the two sets of probes The cantilever segments 342 of the pins 34 are electrically connected to the other ends of the two conductive wires 30 on each of the substrates 22, and are connected to the junctions of the bottom side edges 284a of the substrate 22 and the two planes 22a. The probes 34 are positioned within the orthographic projection of the perforations 202, and the third plate segments 28 of each of the substrates 22 are located between each of the probes 34 and the second plate segment 26 of each of the substrates 22. The tip portion 344 of the probes 34 is used to spot the surface A01 of the electronic object A to be tested.

By setting the substrates 22 in an upright manner, The substrate 22 can be more closely arranged in the horizontal direction, and is not affected by the width of the substrate 22 in the horizontal direction, so that the probe module 2 can be applied to test the electronic object A to be tested smaller than the conventional technology. . In practice, as long as the substrate is parallel to the surface A01 to be tested, and the shortest distance between the two planes 22a adjacent to the two substrates 22 is smaller than the shortest distance between the other two planes 22a of the two substrates 22, The probes 34 on the two substrates 22 are closer to the probes of the conventional probe modules.

In addition, since the first plate segments 24 of the substrates are relatively worn The holes 202 are inclined outwardly, thereby increasing the distance between the joints 32, allowing the user to have more room to operate when connecting external signal lines to the joints 32. Moreover, the third side edge 282 of each of the substrates 22 is perpendicular to the electronic object A to be tested. Therefore, in the vertical direction, the third side edge 282 does not block the tip portion 344 of the probe 34, and the probe 34 points. When the electronic object A to be tested is measured, the user can clearly see the tip of the probe 34.

FIG. 7 is a probe module 3 according to a second preferred embodiment of the present invention; It has a structure substantially the same as that of the first embodiment, and also includes a carrier 36. A plurality of substrates 38, a plurality of conductive lines 44, a plurality of contacts 46, and a plurality of probes 48. Referring to FIG. 8 and FIG. 9, the embodiment is different from the first embodiment in that one of the planes 382 of each of the substrates 38 has a recess 382a extending from the first plate segment 40 to the first portion. a third plate segment 42 , and the groove 382 a is at a side edge 402 of the first plate segment 40 (the outer edge of the embodiment) and a side edge 422 of the third plate segment 42 (the third side of the embodiment) The edges are respectively formed into two open ends 402a, 422a, and the grooves 382a of the substrates 38 are the same length between the two open ends 402a, 422a.

In addition, the conductive wire 44 of the embodiment is a coaxial cable. Each of the conductive wires 44 has a first segment 442 and a second segment 444. The length of the first segment 442 is greater than the length of the second segment 444. The first segment 442 of each of the conductive wires 44 is embedded in the first segment 442. The substrate 38 is in the recess 382a. One end of the first segment 442 of the conductive wire 44 extends from the open end 402a of the first plate segment 40 to be electrically connected to a connector 46. The second segment 444 of each of the conductive wires 44 extends out of the third plate. The open end 422a on the segment 42 and through the perforations 362 of the carrier plate 36 are located within the orthographic projection of the perforations 362. Each of the probes 48 is coupled to one end of the second segment 444 of each of the electrically conductive wires 44 and is located within the orthographic projection of the perforations 362.

The conductive line 44 can be fixed by the recess 382a on the substrate 38, When the probe 48 is not inspected for the electronic object A to be tested, the conductive wire 44 is subjected to a reaction force and the upward moving distance is excessive. Moreover, because the length of the first segment 442 is greater than the length of the entire conductive wire 44, the first segments 442 of the conductive wires 44 can be made equal in length by the same length of the grooves 382a. The error of the length of the conductive wires 44 is reduced, and the impedance mismatch between the conductive wires 44 is reduced.

In summary, the present invention is not parallel to the electron to be tested through the substrate. The design of the object to be tested is effective to increase the available space above the electronic object to be tested. When the two substrates are close to each other, they are not subjected to the substrate width in the horizontal direction. The limitation is that the probes on the two substrates can be closer together, allowing the probe module to be applied to smaller electronic objects to be tested. The invention also adds more space available, and more substrates, conductive lines and probe points can be provided for the point measurement contacts to have more electronic objects to be tested.

The above is only a preferred embodiment of the present invention, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.

2‧‧‧ Probe Module

20‧‧‧ Carrier Board

202‧‧‧Perforation

204‧‧‧ top surface

206‧‧‧ bottom

22‧‧‧Substrate

30‧‧‧Flexible wire

32‧‧‧Connectors

34‧‧‧Probe

A‧‧‧Electronic objects to be tested

A01‧‧‧Detering surface

Claims (13)

A probe module is disposed between a detecting machine and an electronic object to be tested, wherein the electronic object to be tested has a surface to be tested; the probe module comprises: two substrates, which are made of an insulating material, Each of the substrates has opposite planes, the distance between the two planes is the thickness of the substrate; each plane of each of the substrates is not parallel to the surface to be tested of the electronic object to be tested; One of the planes is adjacent to a plane of the other substrate, and a shortest distance between two adjacent planes of the two substrates is less than a shortest distance between the other two planes of the two substrates; at least two conductive lines, respectively And being disposed on the substrate, and one end of each of the conductive lines is electrically connected to the detecting machine; and at least two probes are electrically connected to the other ends of the two conductive lines, and each of the probes is for measuring the measured The surface to be tested of the electronic object. The probe module of claim 1, wherein each of the substrates is substantially perpendicular to the surface to be tested of the electronic object to be tested. The probe module of claim 1, comprising a carrier plate having a through hole; the two substrates are disposed on the carrier, and the probes are located within an orthographic projection range of the through hole. The probe module of claim 3, wherein each of the substrates has an extension, the extension passes through the through hole of the carrier; each of the conductive wires is disposed on one of the substrates in a line layout manner. The plane extends to the extension; each of the probes is soldered to the other end of each of the conductive lines and is located at an extension of each of the substrates. The probe module of claim 4, wherein the extension of each of the substrates has a bottom side edge connected between the two planes of each of the substrates, each probe being located at the bottom of each of the substrates The side edge is connected to a plane on which the conductive line is laid. The probe module of claim 5, wherein each of the probes is a cantilever probe and includes a connected cantilever segment and a tip segment, each of the cantilever segments of the probe being located on the bottom side of each of the substrates The edge is connected to the plane where the conductive line is provided. The probe module of claim 1, wherein one of the planes of each of the substrates has a recess, and the recesses respectively form two open ends on the two side edges of the substrate; each of the conductive lines is a coaxial cable, and each of the conductive lines is a coaxial cable The conductive wires are embedded in the grooves of each of the substrates, and the two ends of the conductive wires protrude from the two open ends of the respective grooves. The probe module of claim 7, wherein the groove of each of the substrates has the same length between the two open ends. The probe module of claim 7, comprising a carrier plate having a through hole, the two substrates being disposed on the carrier, and the probes are located within an orthographic projection range of the through hole. The probe module of claim 9, wherein each of the conductive wires has a first segment and a second segment connected, and the first segment of each of the conductive wires is embedded in a recess of each of the substrates, each The second segment of the conductive line extends from a open end of each of the substrates and through the perforations of the carrier; each of the probes is coupled to a second segment of each of the conductive lines. The probe module of claim 10, wherein the length of the first segment of each of the conductive lines is greater than the length of the second segment. The probe module of claim 1, comprising two connectors, each of the connectors being electrically connected to one of the conductive wires, each connector being electrically connected to the detecting device; wherein each of the substrates has a first a plate segment and a second plate segment, the first plate segment being located between the second plate segment and the detector, the second plate segment being located between the probe and the first plate segment; the first The plate segment has a first side edge, the second plate segment has a second side edge, the first side edge and the second side edge are at an angle, the angle is greater than 90 degrees; each of the joints is located at each of the The first plate segment of the substrate. The probe module of claim 12, wherein each of the substrates has a third plate segment, the third plate segment being located between the second plate segment and a probe; the third plate segment having a first The three side edges are substantially perpendicular to the surface to be tested of the electronic object to be tested.