TW201702610A - Probe module (I) comprising two substrates, at least two electric leads and at least two probes - Google Patents
Probe module (I) comprising two substrates, at least two electric leads and at least two probes Download PDFInfo
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- TW201702610A TW201702610A TW104121854A TW104121854A TW201702610A TW 201702610 A TW201702610 A TW 201702610A TW 104121854 A TW104121854 A TW 104121854A TW 104121854 A TW104121854 A TW 104121854A TW 201702610 A TW201702610 A TW 201702610A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- Measuring Leads Or Probes (AREA)
Abstract
Description
本發明係與電子物件的檢測有關;特別是指一種探針模組。 The invention relates to the detection of electronic objects; in particular to a probe module.
按,探針模組係設置於一檢測機與一待測電子物件之間,用以傳送檢測機的檢測訊號至待測電子物件。圖1所示者為習用的探針模組1,包含二基板10及複數個探針12,且各該基板10上佈設有二導電線102,該些導電線102之一端電性連接一檢測機(圖未示)。該些探針12以銲接的方式分別設置於該基板10且分別電性連該些導電線102之另一端。該些基板10於一待側電子物件的上方14,且該些基板10平行於該待測電子物件的一待測面14a,該些探針用以點測該待測電子物件14的待測面14a。 Pressing, the probe module is disposed between a detecting machine and an electronic object to be tested for transmitting the detecting signal of the detecting machine to the electronic object to be tested. The probe module 1 shown in FIG. 1 includes a second substrate 10 and a plurality of probes 12, and each of the substrates 10 is provided with two conductive wires 102. One end of the conductive wires 102 is electrically connected and detected. Machine (not shown). The probes 12 are respectively disposed on the substrate 10 and are electrically connected to the other ends of the conductive lines 102. The substrate 10 is on the upper side 14 of a to-be-side electronic object, and the substrates 10 are parallel to a to-be-tested surface 14a of the electronic object to be tested, and the probes are used to measure the to-be-tested electronic object 14 to be tested. Face 14a.
習用的探針模組1之基板10通常具有一定的寬度,當二個基板10相靠近時,二個基板10上的探針12受基板10寬度的限制而無法相互靠近,使得該二基板10在水平方向上,將佔去相當的空間。因此,習用的探針模組1只能用於點測尺寸較大的待測電子物件14。 The substrate 10 of the conventional probe module 1 generally has a certain width. When the two substrates 10 are close to each other, the probes 12 on the two substrates 10 are limited by the width of the substrate 10 and cannot be close to each other, so that the two substrates 10 are In the horizontal direction, it will take up quite a bit of space. Therefore, the conventional probe module 1 can only be used for measuring the electronic object 14 to be tested having a large size.
隨著科技的進步,待測電子物件的尺寸愈趨減小,而習用的探針模組1便無法滿足檢測小尺寸待測電子物件的需求。 With the advancement of technology, the size of the electronic object to be tested is becoming smaller, and the conventional probe module 1 cannot meet the demand for detecting small-sized electronic objects to be tested.
有鑑於此,本發明之目的用於提供一種探針模 組,可應用於檢測尺寸較小的待測電子物件。 In view of this, the object of the present invention is to provide a probe mode The group can be applied to detect small-sized electronic objects to be tested.
緣以達成上述目的,本發明所提供探針模組, 係設置於一檢測機與一待測電子物件之間,該待測電子物件具有一待測面;該探針模組包含二基板、至少二導電線與至少二探針,其中各該基板係由絕緣材料所製成,各該基板具有相背對的二平面,該二平面之間的距離為該基板的厚度;各該基板的各該平面不平行於該待測電子物件的該待測面;其中一該基板的一該平面與另一該基板的一該平面相鄰,且該二基板相鄰的二個平面之間的最短距離小於該二基板另外兩個平面之間的最短距離;該二導電線分別設置於該些基板上,且各該導電線之一端供電性連接至該檢測機;該二探針分別電性連接該二導電線之另一端,各該探針供點測該待測電子物件的該待測面。 In order to achieve the above object, the probe module provided by the present invention, The method is disposed between a detecting machine and an electronic object to be tested, wherein the electronic object to be tested has a surface to be tested; the probe module comprises two substrates, at least two conductive lines and at least two probes, wherein each of the substrate systems The substrate is made of an insulating material, each of the substrates has opposite planes, and the distance between the two planes is the thickness of the substrate; each plane of each of the substrates is not parallel to the to-be-tested electronic object. a plane of one of the substrates adjacent to a plane of the other substrate, and a shortest distance between two planes adjacent to the two substrates is less than a shortest distance between the other two planes of the two substrates The two conductive lines are respectively disposed on the substrates, and one end of each of the conductive lines is electrically connected to the detecting machine; the two probes are electrically connected to the other ends of the two conductive lines, and the probes are respectively provided for the points. Measuring the surface to be tested of the electronic object to be tested.
本發明之效果在於,探針模組之基板可相對該 待測面立起,當二個基板相靠近時,在水平方向上不會受到基板寬度的限制,因此,二個基板上的探針可以更靠近,使得本發明之探針模組相較於習用之探針模組可應用於點測較小尺寸的待測電子物件。 The effect of the invention is that the substrate of the probe module can be opposite to the The surface to be tested is erected. When the two substrates are close to each other, they are not limited by the width of the substrate in the horizontal direction. Therefore, the probes on the two substrates can be closer, so that the probe module of the present invention is compared with The conventional probe module can be used to spot small electronic objects to be tested.
〔習用〕 [Use]
1‧‧‧探針模組 1‧‧‧ Probe Module
10‧‧‧基板 10‧‧‧Substrate
102‧‧‧導電線 102‧‧‧Flexible wire
12‧‧‧探針 12‧‧‧ probe
14‧‧‧待測電子物件 14‧‧‧Electronic objects to be tested
14a‧‧‧待測面 14a‧‧‧Determination
〔本發明〕 〔this invention〕
2‧‧‧探針模組 2‧‧‧ Probe Module
20‧‧‧載板 20‧‧‧ Carrier Board
202‧‧‧穿孔 202‧‧‧Perforation
204‧‧‧頂面 204‧‧‧ top surface
206‧‧‧底面 206‧‧‧ bottom
22‧‧‧基板 22‧‧‧Substrate
22a‧‧‧平面 22a‧‧‧ Plane
24‧‧‧第一板段 24‧‧‧First board
242‧‧‧第一側緣 242‧‧‧First side edge
244‧‧‧外側緣 244‧‧‧ outer edge
26‧‧‧第二板段 26‧‧‧Second board
262‧‧‧第二側緣 262‧‧‧second side edge
28‧‧‧第三板段 28‧‧‧third board
282‧‧‧第三側緣 282‧‧‧ third side
284‧‧‧延伸段 284‧‧‧Extension
284a‧‧‧底側緣 284a‧‧‧ bottom edge
30‧‧‧導電線 30‧‧‧Flexible wire
32‧‧‧接頭 32‧‧‧Connectors
322‧‧‧訊號電極 322‧‧‧ Signal electrode
324‧‧‧金屬殼體 324‧‧‧Metal housing
34‧‧‧探針 34‧‧‧Probe
342‧‧‧懸臂段 342‧‧‧Cantilever segment
344‧‧‧針尖段 344‧‧‧needle section
A‧‧‧待測電子物件 A‧‧‧Electronic objects to be tested
A01‧‧‧待測面 A01‧‧‧Detering surface
D1‧‧‧最短距離 D1‧‧‧ shortest distance
D2‧‧‧最短距離 D2‧‧‧ shortest distance
θ‧‧‧夾角 Θ‧‧‧ angle
3‧‧‧探針模組 3‧‧‧ Probe Module
36‧‧‧載板 36‧‧‧ Carrier Board
362‧‧‧穿孔 362‧‧‧Perforation
38‧‧‧基板 38‧‧‧Substrate
382‧‧‧平面 382‧‧‧ plane
382a‧‧‧凹槽 382a‧‧‧ Groove
40‧‧‧第一板段 40‧‧‧First board
402‧‧‧側緣 402‧‧‧lateral edge
402a‧‧‧開放端 402a‧‧‧Open end
42‧‧‧第三板段 42‧‧‧third board
422‧‧‧側緣 422‧‧‧ side edge
422a‧‧‧開放端 422a‧‧‧Open end
44‧‧‧導電線 44‧‧‧Flexible wire
442‧‧‧第一段 442‧‧‧ first paragraph
444‧‧‧第二段 444‧‧‧second paragraph
46‧‧‧接頭 46‧‧‧Connectors
48‧‧‧探針 48‧‧‧ probe
圖1係習用的探針模組之俯視圖。 Figure 1 is a top plan view of a conventional probe module.
圖2係本發明第一較佳實施例探針模組之立體圖。 2 is a perspective view of a probe module according to a first preferred embodiment of the present invention.
圖3係第一較佳實施例探針模組之俯視圖。 3 is a top plan view of the probe module of the first preferred embodiment.
圖4係第一較佳實施例探針模組之局部側視圖。 4 is a partial side elevational view of the probe module of the first preferred embodiment.
圖5係第一較佳實施例基板之立體圖。 Figure 5 is a perspective view of the substrate of the first preferred embodiment.
圖6係第一較佳實施例基板之另一立體圖。 Figure 6 is another perspective view of the substrate of the first preferred embodiment.
圖7係本發明第二較佳實施例探針模組之立體圖。 Figure 7 is a perspective view of a probe module in accordance with a second preferred embodiment of the present invention.
圖8係第二較佳實施例基板之立體圖。 Figure 8 is a perspective view of a substrate of a second preferred embodiment.
圖9係第二較佳實施例基板之另一立體圖。 Figure 9 is another perspective view of the substrate of the second preferred embodiment.
為能更清楚地說明本發明,茲舉較佳實施例並配合圖式詳細說明如后,請參圖2所示,為本發明第一較佳實施例之探針模組2,其係設置於一檢測機(圖未示)與一待測電子物件A之間,且該待測電子物件A具有一待測面A01。該探針模組2包含一載板20、複數個基板22、複數條導電線30、複數個接頭32與複數個探針34。 In order to explain the present invention more clearly, the preferred embodiment will be described in detail with reference to the accompanying drawings. FIG. 2 shows a probe module 2 according to a first preferred embodiment of the present invention. Between a detector (not shown) and an electronic object A to be tested, and the electronic object A to be tested has a surface to be tested A01. The probe module 2 includes a carrier 20, a plurality of substrates 22, a plurality of conductive lines 30, a plurality of connectors 32, and a plurality of probes 34.
該載板20為絕緣材料所製成,在本實施例中該載板20為印刷電路板,該載板20具有一穿孔202貫穿該載板20的頂面204與底面206。請配合圖3與圖4,該待測電子物件A位於該載板20的下方且於該穿孔202的正投影範圍內,該待測電子物件A的待測面A01係與該載板20的頂面204、底面206呈平行。 The carrier 20 is made of an insulating material. In the embodiment, the carrier 20 is a printed circuit board. The carrier 20 has a through hole 202 extending through the top surface 204 and the bottom surface 206 of the carrier 20 . Please refer to FIG. 3 and FIG. 4 , the electronic object A to be tested is located below the carrier 20 and within the orthographic projection range of the through hole 202 , the to-be-tested surface A01 of the electronic object A to be tested is associated with the carrier 20 . The top surface 204 and the bottom surface 206 are parallel.
續參圖3,各該基板22係由絕緣材料所製成,在本實施例中各該基板22為印刷電路板,各該基板22具有相背對的二平面22a,該二平面22a之間的距離即為該基板22的厚度。相鄰二個基板22之中,其中一該基板22的一該平面22a與另一該基板22的一該平面22a相鄰,且二相鄰基板22的二個平面22a之間的最短距離D1小於該二基板22另外兩個平面22a之間的最短距離D2。本實施例中,相鄰二個基板22二相鄰的平面22a為相互垂直,但不以此為限,亦可為二相鄰的平面22a相平行,或夾角小於180度。 Referring to FIG. 3, each of the substrates 22 is made of an insulating material. In this embodiment, each of the substrates 22 is a printed circuit board, and each of the substrates 22 has opposite planes 22a, between the two planes 22a. The distance is the thickness of the substrate 22. Among the two adjacent substrates 22, one of the planes 22a of the substrate 22 is adjacent to a plane 22a of the other substrate 22, and the shortest distance D1 between the two planes 22a of the two adjacent substrates 22 It is smaller than the shortest distance D2 between the other two planes 22a of the two substrates 22. In this embodiment, the two adjacent planes 22a of the two adjacent substrates 22 are perpendicular to each other, but not limited thereto, or two adjacent planes 22a may be parallel or have an included angle of less than 180 degrees.
請配合圖4至圖6,各該基板22具有依序連接的一第一板段24、一第二板段26與一第三板段28,其中 該第一板段24位於該第二板段26與該檢測機之間,該第二板段26位於該第一板段24與該第三板段28之間。該第一板段24具有二個相平行的第一側緣242及連接於該二第一側緣242之間的一外側緣244。該第二板段26具有二個相平行的第二側緣262,該第二板段26位於下方的第二側緣262結合於該載板20的頂面204,藉此,使各該基板22直立地設置於該載板20的頂面204,且各該基板22的各該平面22a在本實施例中係實質上垂直於該待測電子物件A的該待測面A01。該第二板段26位於上方的該第二側緣262與該第一板段24位於上方的該第一側緣242之間夾一夾角θ,該夾角θ大於90度,使該第一板段24相對該載板20穿孔202的中心往外傾斜且該外側緣244由上而下傾斜。 With reference to FIG. 4 to FIG. 6 , each of the substrates 22 has a first plate segment 24 , a second plate segment 26 and a third plate segment 28 connected in sequence. The first plate segment 24 is located between the second plate segment 26 and the detector, and the second plate segment 26 is located between the first plate segment 24 and the third plate segment 28. The first plate segment 24 has two parallel first side edges 242 and an outer edge 244 connected between the two first side edges 242. The second plate section 26 has two parallel second side edges 262, and the second side edge 262 of the second plate section 26 is coupled to the top surface 204 of the carrier 20, thereby making each substrate 22 is erected on the top surface 204 of the carrier 20, and each of the planes 22a of the substrate 22 is substantially perpendicular to the to-be-measured surface A01 of the electronic object A to be tested in this embodiment. An angle θ is formed between the second side edge 262 of the second plate segment 26 and the first side edge 242 of the first plate segment 24, and the angle θ is greater than 90 degrees, so that the first plate The segment 24 is inclined outwardly relative to the center of the perforation 202 of the carrier 20 and the outer edge 244 is inclined from top to bottom.
該第三板段28位於該載板20的穿孔202之正 投影範圍內且具有一第三側緣282鄰近該穿孔202的中心,該第三側緣282實質上垂直於該載板20的頂面204、底面206及該待測電子物件之待測面A01。此外,該第三板段28更向下延伸穿過該載板20的穿孔202而形成一延伸段284,該延伸段284具有位於最底端的一底側緣284a,該底側緣284a連接於該基板22的該二平面22a之間。 The third plate segment 28 is located on the perforation 202 of the carrier 20 A third side edge 282 is adjacent to the center of the through hole 202, and the third side edge 282 is substantially perpendicular to the top surface 204 of the carrier 20, the bottom surface 206, and the to-be-tested surface A01 of the electronic object to be tested. . In addition, the third plate section 28 extends further through the perforations 202 of the carrier 20 to form an extension 284 having a bottom side edge 284a at the bottom end, the bottom side edge 284a being coupled to Between the two planes 22a of the substrate 22.
該些導電線30在本實施中係以線路佈局的方 式分別佈設於各該基板22的二個該平面22a上,且各該導電線30係於各該基板22的各該平面22a由第一板段24延伸至第三板段28而止於平面22a與底側緣284a連接處。 The conductive lines 30 are in the form of a line layout in this embodiment. The two types of the plane 22a of the substrate 22 are respectively disposed on the two planes 22a of the substrate 22, and each of the conductive lines 30 extends from the first plate segment 24 to the third plate segment 28 to the plane. 22a is joined to the bottom side edge 284a.
請配合圖5與圖6,各該接頭32設置於各該 基板22的第一板段24的外側緣244上,各該接頭32具有相隔離的一訊號電極322與一金屬殼體324,該訊號電極322及該金屬殼體324以銲接的方式分別電性連接該基板22二個平面22a上的二導電線30之一端,使每一該基板22上二 個導電線30透過一該接頭32電性連接至該檢測機。 Please cooperate with FIG. 5 and FIG. 6, each of the joints 32 is disposed in each of the joints. On the outer edge 244 of the first plate segment 24 of the substrate 22, each of the terminals 32 has a signal electrode 322 and a metal casing 324, and the signal electrode 322 and the metal casing 324 are respectively electrically connected by soldering. Connecting one end of the two conductive lines 30 on the two planes 22a of the substrate 22, so that each of the substrates 22 is A conductive line 30 is electrically connected to the detector through a connector 32.
各該探針34在本實施例中為懸臂式探針,具 有一懸臂段342與一針尖段344,該些探針34每兩個一組設置於各該基板22上的第三板段28的延伸段284,詳而言之,每一組的二該探針34的懸臂段342以銲接的方式分別電性連接於每一該基板22上的該二導電線30的另一端,且連接於基板22的底側緣284a與二個平面22a的連接處,使該些探針34位於該穿孔202的正投影範圍內,而各該基板22的第三板段28位於各該探針34與各該基板22的第二板段26之間。該些探針34的針尖段344供點測該待測電子物件A的該待測面A01。 Each of the probes 34 is a cantilever probe in this embodiment, There is a cantilever segment 342 and a tip segment 344. Each of the probes 34 is disposed on each of the extensions 284 of the third plate segment 28 on each of the substrates 22, in detail, each of the two sets of probes The cantilever segments 342 of the pins 34 are electrically connected to the other ends of the two conductive wires 30 on each of the substrates 22, and are connected to the junctions of the bottom side edges 284a of the substrate 22 and the two planes 22a. The probes 34 are positioned within the orthographic projection of the perforations 202, and the third plate segments 28 of each of the substrates 22 are located between each of the probes 34 and the second plate segment 26 of each of the substrates 22. The tip portion 344 of the probes 34 is used to spot the surface A01 of the electronic object A to be tested.
藉由將該些基板22以直立的方式設置,可以 讓該些基板22在排列時可以更緊密,在水平方向上不會受到基板22寬度所影響,使得該探針模組2相較於習用技術可應用於測試尺寸更小的待測電子物件A。實務上,只要基板平行於該待測面A01,且相鄰該二基板22的二個平面22a之間的最短距離小於該二基板22另外兩個平面22a之間的最短距離,即可達到使兩個基板22上的探針34比習用的探針模組之探針更接近的效果。 By setting the substrates 22 in an upright manner, The substrate 22 can be more closely arranged in the horizontal direction, and is not affected by the width of the substrate 22 in the horizontal direction, so that the probe module 2 can be applied to test the electronic object A to be tested smaller than the conventional technology. . In practice, as long as the substrate is parallel to the surface A01 to be tested, and the shortest distance between the two planes 22a adjacent to the two substrates 22 is smaller than the shortest distance between the other two planes 22a of the two substrates 22, The probes 34 on the two substrates 22 are closer to the probes of the conventional probe modules.
此外,由於該些基板的第一板段24係相對穿 孔202往外傾斜,因此,得以增加各該接頭32彼此相隔的距離,讓使用者在將外部的訊號線連接至該些接頭32時,有更多的操作空間。又,各該基板22的第三側緣282垂直於待測電子物件A,因此,在垂直方向上,第三側緣282不會遮擋到探針34的針尖段344,在以探針34點測待測電子物件A時,使用者可清楚地看到探針34之針尖。 In addition, since the first plate segments 24 of the substrates are relatively worn The holes 202 are inclined outwardly, thereby increasing the distance between the joints 32, allowing the user to have more room to operate when connecting external signal lines to the joints 32. Moreover, the third side edge 282 of each of the substrates 22 is perpendicular to the electronic object A to be tested. Therefore, in the vertical direction, the third side edge 282 does not block the tip portion 344 of the probe 34, and the probe 34 points. When the electronic object A to be tested is measured, the user can clearly see the tip of the probe 34.
圖7為本發明第二較佳實施例之探針模組3, 其具有大致相同於第一實施例之結構,同樣包含一載板 36、複數個基板38、複數條導電線44、複數個接頭46與複數個探針48。請參圖8與圖9,本實施例與第一實施例不同之處在於,各該基板38的其中一平面382具有一凹槽382a,該凹槽382a係由第一板段40延伸至第三板段42,且該凹槽382a於該第一板段40的一側緣402(本實施例為外側緣)與該第三板段42的一側緣422(本實施例為第三側緣)分別形成二開放端402a,422a,且該些基板38的凹槽382a於二個開放端402a,422a之間的長度相同。 FIG. 7 is a probe module 3 according to a second preferred embodiment of the present invention; It has a structure substantially the same as that of the first embodiment, and also includes a carrier 36. A plurality of substrates 38, a plurality of conductive lines 44, a plurality of contacts 46, and a plurality of probes 48. Referring to FIG. 8 and FIG. 9, the embodiment is different from the first embodiment in that one of the planes 382 of each of the substrates 38 has a recess 382a extending from the first plate segment 40 to the first portion. a third plate segment 42 , and the groove 382 a is at a side edge 402 of the first plate segment 40 (the outer edge of the embodiment) and a side edge 422 of the third plate segment 42 (the third side of the embodiment) The edges are respectively formed into two open ends 402a, 422a, and the grooves 382a of the substrates 38 are the same length between the two open ends 402a, 422a.
此外,本實施例的導電線44為同軸電纜線, 各該導電線44具有相連接的一第一段442與一第二段444,該第一段442的長度大於該第二段444的長度,各該導電線44的該第一段442嵌入各該基板38的凹槽382a中。各該導電線44之第一段442的一端伸出第一板段40上的該開放端402a而與一該接頭46電性連接;各該導電線44之第二段444伸出第三板段42上的開放端422a,且穿過該載板36的穿孔362而位於該穿孔362的正投影範圍內。各該探針48連接於各該導電線44第二段444之一端,而位於該穿孔362的正投影範圍內。 In addition, the conductive wire 44 of the embodiment is a coaxial cable. Each of the conductive wires 44 has a first segment 442 and a second segment 444. The length of the first segment 442 is greater than the length of the second segment 444. The first segment 442 of each of the conductive wires 44 is embedded in the first segment 442. The substrate 38 is in the recess 382a. One end of the first segment 442 of the conductive wire 44 extends from the open end 402a of the first plate segment 40 to be electrically connected to a connector 46. The second segment 444 of each of the conductive wires 44 extends out of the third plate. The open end 422a on the segment 42 and through the perforations 362 of the carrier plate 36 are located within the orthographic projection of the perforations 362. Each of the probes 48 is coupled to one end of the second segment 444 of each of the electrically conductive wires 44 and is located within the orthographic projection of the perforations 362.
藉由基板38上的凹槽382a可固定導電線44, 避免探針48點測待測電子物件A時,導電線44受到反作用力而往上移動距離過大。再者,因為第一段442長度佔整條導電線44長度較大的比例,藉由該些凹槽382a的長度相同之設計,可以讓該些導電線44之第一段442長度相等,以減少該些導電線44長度的誤差,減少該些導電線44之間阻抗不匹配的情形。 The conductive line 44 can be fixed by the recess 382a on the substrate 38, When the probe 48 is not inspected for the electronic object A to be tested, the conductive wire 44 is subjected to a reaction force and the upward moving distance is excessive. Moreover, because the length of the first segment 442 is greater than the length of the entire conductive wire 44, the first segments 442 of the conductive wires 44 can be made equal in length by the same length of the grooves 382a. The error of the length of the conductive wires 44 is reduced, and the impedance mismatch between the conductive wires 44 is reduced.
綜上所述,本發明透過基板不平行於待測電子 物件的待測面之設計,有效增加待測電子物件上方的可用空間。當二個基板相靠近時,在水平方向上不會受到基板寬度 的限制,因此,二個基板上的探針可以更靠近,讓探針模組可以應用於更小的待測電子物件。本發明亦增加更多的可用空間,而可以設置更多的基板、導電線及探點,以供點測接點更多的待測電子物件。 In summary, the present invention is not parallel to the electron to be tested through the substrate. The design of the object to be tested is effective to increase the available space above the electronic object to be tested. When the two substrates are close to each other, they are not subjected to the substrate width in the horizontal direction. The limitation is that the probes on the two substrates can be closer together, allowing the probe module to be applied to smaller electronic objects to be tested. The invention also adds more space available, and more substrates, conductive lines and probe points can be provided for the point measurement contacts to have more electronic objects to be tested.
以上所述僅為本發明較佳可行實施例而已,舉凡應用本發明說明書及申請專利範圍所為之等效變化,理應包含在本發明之專利範圍內。 The above is only a preferred embodiment of the present invention, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.
2‧‧‧探針模組 2‧‧‧ Probe Module
20‧‧‧載板 20‧‧‧ Carrier Board
202‧‧‧穿孔 202‧‧‧Perforation
204‧‧‧頂面 204‧‧‧ top surface
206‧‧‧底面 206‧‧‧ bottom
22‧‧‧基板 22‧‧‧Substrate
30‧‧‧導電線 30‧‧‧Flexible wire
32‧‧‧接頭 32‧‧‧Connectors
34‧‧‧探針 34‧‧‧Probe
A‧‧‧待測電子物件 A‧‧‧Electronic objects to be tested
A01‧‧‧待測面 A01‧‧‧Detering surface
Claims (13)
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TW104121854A TWI580970B (en) | 2015-07-06 | 2015-07-06 | Probe module (1) |
CN201610526949.4A CN106338626A (en) | 2015-07-06 | 2016-07-06 | Probe module |
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TW104121854A TWI580970B (en) | 2015-07-06 | 2015-07-06 | Probe module (1) |
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TW201702610A true TW201702610A (en) | 2017-01-16 |
TWI580970B TWI580970B (en) | 2017-05-01 |
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TW (1) | TWI580970B (en) |
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US6143668A (en) * | 1997-09-30 | 2000-11-07 | Intel Corporation | KLXX technology with integrated passivation process, probe geometry and probing process |
JP2004309441A (en) * | 2003-02-18 | 2004-11-04 | Yamaha Corp | Probe head, its assembling method, and probe card |
US6956388B2 (en) * | 2003-06-24 | 2005-10-18 | Agilent Technologies, Inc. | Multiple two axis floating probe assembly using split probe block |
TWI435083B (en) * | 2010-07-27 | 2014-04-21 | Mpi Corp | Combination probe head for vertical probe card and its assembly alignment method |
ITMI20120996A1 (en) * | 2012-06-08 | 2013-12-09 | Technoprobe Spa | MEASUREMENT CARD FOR A TEST DEVICE OF ELECTRONIC DEVICES |
CN103808992B (en) * | 2012-11-12 | 2017-09-12 | 旺矽科技股份有限公司 | Probe card structure with low power consumption |
TWI512300B (en) * | 2013-07-15 | 2015-12-11 | Mpi Corp | Cantilever high frequency probe card |
TWI572868B (en) * | 2015-07-03 | 2017-03-01 | Mpi Corp | Detection device and its probe module |
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2015
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