JP6502095B2 - Probe unit and inspection device - Google Patents

Description

  The present invention relates to a probe unit provided with a pair of holding parts for holding a pair of probe pins, and an inspection apparatus provided with the probe unit.

  As a probe unit of this type, a probe unit disclosed by the applicant in Patent Document 1 below is known. The probe unit is configured to include a pair of contact probes and a probe holder to which each contact probe is fixed. Each contact probe is configured to include a probe pin and a holder configured by a link mechanism and holding the probe pin at its tip. In this probe unit, since each contact probe is fixed, it is possible to move a pair of probe pins together to probe each probe pin at one time with respect to one probing target. In this case, in this probe unit, when the two probe pins are viewed from the front side of the tip of each holder, each holder holds each probe pin such that each probe pin has a V shape. It is configured (see FIG. 15), and this configuration makes it possible to hold the tips of the probe pins close to each other.

JP-A-2006-330006 (page 5-6, FIG. 1)

  However, the above probe unit has the following problems to be improved. That is, in this probe unit, since each probe pin is held so as to form a V when viewed from the front, a component is disposed near the pad or land on the substrate, or a cavity is formed with a recess When pads or lands are provided in the vicinity of the wall surface of the bottom surface of the recess of the substrate, problems may occur when probing is performed on these pads or lands. Specifically, as shown in FIG. 15, in the case where the pad 103 is provided in the vicinity of the wall portion 104 in the cavity substrate 100 having the concave portion (cavity) 101, the two probes 201 are probed on the pad 103. When this happens, one of the two probes 201 (the right probe 201 in the same figure) may come in contact with the wall portion 104. At this time, probing of each probe 201 with the pad 103 is difficult. May be

  The present invention has been made in view of such problems to be improved, and has as its main object to provide a probe unit and an inspection apparatus capable of reliably probing two probe pins to be probed.

In order to achieve the above object, the probe unit according to claim 1 holds each of the probe pins at its tip end portion in a state where the contact side ends of the pair of probe pins are close to each other and the respective proximal ends A probe unit having a pair of holding parts fixed to the fixed part and configured to be capable of probing each of the probe pins as a probing target, each holding part being the base in one of the holding parts The first extending direction of the one holding portion from the end toward the tip end and the second extending direction of the other holding portion from the base end to the tip end of the other holding portion , together with the proximal end of each so as to intersect at the downstream side in the first direction is a synthetic direction of the first extending direction and the second extending direction is fixed to the fixed portion, before Wherein each probe pin aligned along the first direction, and the respective probes when the forceps each of said probe pins in a first direction toward the upstream side in the first direction from the downstream side in the first direction The respective probe pins can be held so that the pins overlap.

  The probe unit according to claim 2 is the probe unit according to claim 1, wherein each of the holders contacts or separates from the object to be probed when the respective probe pins are viewed in the first direction. The respective probe pins are configured to be able to be held so that the respective probe pins extend along the direction.

The probe unit according to claim 3, wherein, in the probe unit according to claim 1 or 2, wherein the holding portion is able to hold up the respective probe pins of the same length.

The probe unit according to claim 4 is the probe unit according to any one of claims 1 to 3 , wherein the respective holding portions are joined to each other by a joint portion in which the respective tip portions have elasticity. .

The inspection apparatus according to claim 5 comprises the probe unit according to any one of claims 1 to 4 and an inspection unit for inspecting an inspection object based on an electrical signal input / output through the probe pin of the probe unit. Is equipped.

In the probe unit according to claim 1 and the inspection apparatus according to claim 5 , the probe pins are arranged along the first direction which is the combined direction of the extending directions of the holding portions, and the downstream side in the first direction The respective holding portions are configured to be able to hold the respective probe pins such that the respective probe pins overlap when the respective probe pins are viewed in the first direction from the to the upstream side. For this reason, according to this probe unit and inspection apparatus, for example, a probing target is provided in the vicinity of a wall constituting the recess in the cavity substrate having the recess (that is, an obstacle exists in the vicinity of the probing target) Even in the case, the probe pin can be reliably probed for probing without bringing the probe pin into contact with the wall portion (obstacle).

Further, in the probe unit according to claim 2 and the inspection apparatus according to claim 5 , each probe pin extends along a direction in which the probe pin is moved toward and away from the object when the probe pin is viewed in the first direction. Each holding portion is configured to be able to hold each probe pin so as to extend. For this reason, according to this probe unit and inspection apparatus, even if an obstacle exists in the vicinity of either the right side or the left side of the object to be probed from the downstream side to the upstream side in the first direction, the obstacle is Probe pins can be reliably probed for probing without contacting the probe pins with objects.

The probe unit according to claim 3, wherein, and the inspection device according to claim 5, each holding portion is capable of holding the probe pins of the same length is formed. For this reason, according to this probe unit and inspection apparatus, the mechanical characteristics of each probe pin can be made equal, unlike the configuration using two probe pins having different lengths, and thus each probe pin at the time of probing As a result of being able to equalize (or nearly equalize) the amount of elastic deformation or the state of vibration of the probe pin, it is possible to probe each probe pin stably.

Further, in the probe unit according to claim 4 and the inspection apparatus according to claim 5 , the tip end portions of the respective holding portions are joined to each other by a joint portion having elasticity. For this reason, according to this probe unit and inspection apparatus, the movement amount and the vibration state of each tip of each holder can be made equal (or almost equal), as a result, each probe pin can be probed more stably. be able to. Further, according to the probe unit and the inspection apparatus, since the bonding portion has elasticity, some separation of the respective tip portions of the respective holding portions is permitted, and the respective probes are respectively held by the respective tip portions. As a result of the pins being able to be somewhat separated from each other, for example, both probe pins can be reliably probed against a probing target whose surface is curved (the surface is not flat).

FIG. 1 is a block diagram showing the configuration of a substrate inspection apparatus 1; FIG. 3 is a perspective view of a probe unit 3; FIG. 2 is a perspective view of a fixing unit 10; It is the perspective view which looked at the front of the probe unit 3 somewhat from upper direction. FIG. 5 is a side view of the probe unit 3; FIG. 5 is a plan view of the probe unit 3; It is a side view of attaching part 12a. It is a side view of attaching part 12b. FIG. 6 is a first explanatory view illustrating how to use the probe unit 3; FIG. 8 is a second explanatory view for explaining a method of using the probe unit 3; It is a perspective view explaining the composition of probe unit 3A. It is an explanatory view explaining operation of probe unit 3A at the time of use. FIG. 6 is a side view illustrating the configuration of a probe unit 203. FIG. 6 is a side view illustrating the configuration of a probe unit 303. It is explanatory drawing explaining the structure of the conventional probe unit.

  Hereinafter, embodiments of the probe unit and the inspection apparatus will be described with reference to the attached drawings.

  First, the configuration of the substrate inspection apparatus 1 as an example of the inspection apparatus will be described. The substrate inspection apparatus 1 shown in FIG. 1 is an inspection apparatus for inspecting an inspection object (for example, the cavity substrate 100 shown in FIG. 9 and FIG. 9), and the substrate fixing base 2, the pair of probe units 3, and the pair of probing mechanisms 4, a measurement unit 5, an operation unit 6, a storage unit 7, and a control unit 8 are provided.

  The substrate fixing base 2 is configured to be capable of mounting the cavity substrate 100 to be inspected, and is configured to be capable of fixing the cavity substrate 100 by a clamp not shown.

  As shown in FIG. 2, each probe unit 3 includes a fixing portion 10, a substrate 11, a pair of holding portions 12a and 12b (hereinafter, also referred to as "holding portion 12" when not distinguished), and a pair of probe pins 13a and 13b. Each of the probe pins 13 can be probed together (at one time) on a probing target (eg, the pad 103 of the cavity substrate 100 shown in FIG. 9). Is configured.

  As shown in FIG. 4, the fixing portion 10 is configured to be able to fix the base end portions 22a and 22b of the holding portions 12a and 12b (hereinafter, also referred to as "base end portion 22" when not distinguished). Further, as shown in FIG. 3, the fixing portion 10 is formed so that the width becomes narrower as it goes from the one end side (the back side in the drawing) to the other end side (the front side in the drawing). As shown in FIG. 4, the holding portions 12 a and 12 b in which the base end portions 22 a and 22 b are fixed to the fixing portion 10 have respective tip portions 21 a and 21 b (hereinafter, also referred to as “tip portion 21” when not distinguished) It keeps in the posture which approaches each other as it goes to.

  As shown in FIG. 2, the substrate 11 is formed in a plate shape, and one end portion (lower end portion in the same figure) is fixed to the fixing portion 10. In addition, the other end (upper end in the same drawing) of the substrate 11 is fixed to a mounting portion (not shown) in the probing mechanism 4. Further, the substrate 11 is configured to be electrically connectable to the probe pin 13 via a lead (not shown). In FIGS. 4 to 14, the substrate 11 is not shown.

  The holding portion 12a is configured to be capable of holding the probe pin 13a at the distal end portion 21a as shown in FIGS. 4 to 6, and is configured to be able to fix the proximal end portion 22a to the fixing portion 10 (FIG. 5). The illustration of the fixing portion 10 is omitted). Specifically, as shown in FIG. 7, the holding portion 12a includes a base portion 121a fixed to the fixing portion 10, and a pair of arm portions 122a and 123a each having a base end portion connected to the base portion 121a. A connecting portion 124a is provided which connects the tip end portions of the arm portions 122a and 123a and holds the probe pin 13a. In this case, the base end portions of the arm portions 122a and 123a (each connection portion with the base portion 121a) and the tip end portions of the arm portions 122a and 123a (each connection portion with the connection portion 124a) It is also thin and easy to be elastically deformed. Therefore, in the holder 12a, a four-bar link mechanism in which the arms 122a and 123a correspond to links (nodes), and the base ends and the tips of the arms 122a and 123a correspond to joints (joints or fulcrum) Act as.

  The holding portion 12b is configured to be capable of holding the probe pin 13b at the distal end portion 21b and configured to be capable of fixing the proximal end portion 22b to the fixing portion 10 as shown in FIGS. Specifically, as shown in FIG. 8, the holding portion 12 b includes a base portion 121 b fixed to the fixing portion 10 and a pair of arm portions 122 b and 123 b each having a base end portion connected to the base portion 121 b. A connecting portion 124b is provided, which connects the tip end portions of the arm portions 122b and 123b and holds the probe pin 13b. In this case, the base end portions of the arm portions 122b and 123b (each connection portion with the base portion 121b) and the tip end portions of the arm portions 122b and 123b (each connection portion with the connection portion 124b) It is also thin and easy to be elastically deformed. For this reason, the holding unit 12b functions as a four-bar link mechanism as the holding unit 12a.

  As shown in FIGS. 4, 5, 7 and 8, the probe pins 13a and 13b have cylindrical shapes in which tip portions 31a and 31b (hereinafter also referred to as "tip portion 31" when not distinguished) have a conical shape (tapered shape). The base end portions 32a and 32b are respectively held by the connecting portions 124a and 124b of the holding portions 12a and 12b. In this case, in this probe unit 3, probe pins 13a and 13b of the same length are used.

Here, in the probe unit 3, as shown in FIG. 5, the holding portions 12 are configured to hold the probe pins 13 in a state where the tip portions 31 of the probe pins 13 are close to each other. There is. Further, in the probe unit 3, as shown in FIG. 6, the extending direction A1 of the holding portion 12a (arm portions 122a and 123a) from the base end portion 22a toward the distal end portion 21a (“first extension of one holding portion Of the existing direction ) and the extending direction A2 of the holding portion 12b (arm portions 122b and 123b) from the proximal end 22b toward the distal end 21b ( an example of the “second extending direction of the other holding portion”) Each probe pin 13 is arranged along a first direction B which is a synthesis direction , and each probe in a first direction from the downstream B1 side (see FIG. 5) to the upstream B2 side (see FIG. 5) in the first direction B When the pins 13 are viewed, as shown in FIG. 4, the holding portions 12 are configured to be able to hold the probe pins 13 so that the probe pins 13 overlap.

  Further, in this probe unit 3, as shown in FIG. 4, when each probe pin 13 is viewed in the above-described first direction, the direction in which each probe pin 13 is brought into contact with or separated from the probing target at the time of probing ( Z direction: A state in which each probe pin 13 extends along a direction perpendicular to the surface of the cavity substrate 100 fixed to the substrate fixing base 2 (that is, each probe pin 13 with respect to the surface of the cavity substrate 100 The respective holding portions 12 are configured to be able to hold the respective probe pins 13 in a state of being vertical.

  Further, in the probe unit 3, when each probe pin 13 is viewed along the second direction C (see FIG. 6) orthogonal to the above-mentioned first direction B, as shown in FIG. 5, each probe pin Each holding portion 12 is configured to be able to hold each probe pin 13 such that 13 inclines at an acute angle (an angle smaller than a right angle) with respect to the first direction B. More specifically, each holding portion 12 is positioned on the downstream side B 1 in the first direction B of the probe pins 13 when each probe pin 13 is viewed along the above-described second direction C. The inclination angle θ2 (see FIG. 5) of one probe pin 13 (in this example, the probe pin 13b) with respect to the first direction B is the inclination of the other probe pin 13 (the probe pin 13a in this example) with the first direction B Each probe pin 13 is configured to be able to be held in a state larger than the angle θ1 (see the same figure).

  Further, in the probe unit 3, as described above, the probe pins 13a and 13b having the same length are used, and the probe pins 13a and 13b having the same length are as described above (each probe pin in the first direction When viewing 13, the holding portions 12 a and 12 b are configured to be holdable so that the probe pins 13 overlap.

  Each probing mechanism 4 executes probing processing according to the control of the control unit 8. In this case, in this probing process, the probing mechanism 4 is in the direction (XY direction) along the surface of the cavity substrate 100 fixed to the substrate fixing base 2 and in the direction (Z direction) approaching and separating from the cavity substrate 100. The probe unit 3 is moved to probe the tip portions 31 of the probe pins 13 in the probe unit 3 with the pads 103 (see FIG. 9) of the cavity substrate 100 as a probing target.

  The measurement unit 5 is connected to the pad 103 based on an electrical signal input / output via each probe pin 13 of the probe unit 3 probed to the pad 103 of the cavity substrate 100 under the control of the control unit 8. A measurement process is performed to measure the resistance value (measured amount) of the conductor pattern (not shown).

  The operation unit 6 includes various switches and keys, and outputs an operation signal when these are operated. The storage unit 7 stores position data indicating the position of the pad 103 to be probed (to probe the probe pin 13 of the probe unit 3). In addition, the storage unit 7 stores a reference value of a resistance value used for an inspection of the cavity substrate 100 (a conductor pattern (not shown) formed on the cavity substrate 100).

  The control unit 8 controls the probing mechanism 4 and the measurement unit 5. Further, the control unit 8 functions as an inspection unit together with the measurement unit 5, and inspects the cavity substrate 100 based on the resistance value measured by the measurement unit 5.

  Next, a method of inspecting the cavity substrate 100 as an inspection target using the substrate inspection apparatus 1 and the operation of each part of the substrate inspection apparatus 1 at that time will be described with reference to the drawings. Incidentally, as shown in FIG. 9, the cavity substrate 100 is formed with a recess 101 (cavity) for housing (mounting) an electric component, and on the bottom surface 102 of the recess 101 is connected to a conductor pattern It is assumed that a target pad 103 is provided.

  First, as shown in FIG. 1, the cavity substrate 100 is mounted on the substrate fixing base 2, and then the cavity substrate 100 is fixed by a clamp not shown. Subsequently, the operation unit 6 is operated to instruct the start of the examination. At this time, the operation unit 6 outputs an operation signal, and the control unit 8 executes inspection processing according to the operation signal. In this inspection process, the control unit 8 reads out position data from the storage unit 7, and the storage unit 7 specifies the position of the pad 103 to be probed based on the position data.

  Next, the control unit 8 controls each probing mechanism 4 to execute probing processing. In this probing process, the probing mechanism 4 moves the probe unit 3 in the direction along the surface of the cavity substrate 100 fixed to the substrate fixing base 2 to move the probe unit 3 above the pads 103 to be probed. Each tip 31 is positioned. Subsequently, as shown in FIG. 9, the probing mechanism 4 moves the probe unit 3 in the Z direction close to the cavity substrate 100 to probe each probe pin 13 on the pad 103 of the cavity substrate 100 as a probing target. .

  Here, in the probe unit 3, as described above, the probe pins 13 are arranged along the first direction B, and the probe pins 13 overlap when the probe pins 13 are viewed in the first direction. Thus, each probe pin 13 is held. For this reason, as shown in FIG. 9, even in the case where the pad 103 is provided in the vicinity of the wall 104 constituting the recess 101 of the cavity substrate 100, the probe pin 13 does not contact the wall 104 (wall The probe pin 13 can be probed on the pad 103 by bringing the probe pin 13 sufficiently close to the portion 104).

  Further, in the probe unit 3, as described above, the probe pins 13 are held to extend along the Z direction (direction perpendicular to the surface of the cavity substrate 100). Therefore, there is a wall 104 as an obstacle in the vicinity of either the right side or the left side of the pad 103 from the downstream B1 side (see FIG. 5) to the upstream B2 side (see FIG. 5) in the first direction B Even if this is done (see FIG. 9), it is possible to probe each probe pin 13 to the pad 103 without bringing each probe pin 13 into contact with each wall portion 104.

  Further, in the probe unit 3, as described above, each probe pin 13 is held so as to be inclined at an acute angle with respect to the first direction B. For this reason, as shown in FIG. 10, as each probe pin 13 of one probe unit 3 and each probe pin 13 of another one probe unit 3 can be brought close without contacting each other, the adjacent two It is possible to probe each probe pin 13 on one pad 103.

  Further, in the probe unit 3, as described above, two probe pins 13 of the same length are used. In this case, for example, in the configuration in which the lengths of the two probe pins 13 are different, the mechanical characteristics of the probe pins 13 are different, so that the amounts of elastic deformation of the probe pins 13 during probing differ from each other. The vibration states (frequency characteristics) of the probe pins 13 may be different from each other, which may make stable probing difficult. On the other hand, in this configuration in which the lengths of the probe pins 13 are equal, the mechanical characteristics of the probe pins 13 can be equalized, which enables stable probing of the probe pins 13. There is.

  On the other hand, in a state where each probe pin 13 is probed on the pad 103 of the cavity substrate 100, the control unit 8 controls a signal supply unit (not shown) to output an electric signal for inspection. Next, the control unit 8 controls the measuring unit 5 to execute the measurement process. In this measurement process, the measurement unit 5 measures the resistance value of a conductor pattern (not shown) connected to the pad 103 based on the electric signal input / output via each probe pin 13.

  Subsequently, the control unit 8 reads the reference value of the resistance value from the storage unit 7, compares the resistance value measured by the measurement unit 5 with the reference value, and inspects the quality (breakage or short circuit) of the conductor pattern. . Next, the control unit 8 causes the display unit (not shown) to display the inspection result and causes the storage unit 7 to store the inspection result.

  In this case, in the substrate inspection apparatus 1, as described above, it is possible to reliably probe each probe pin 13 on the pad 103 to be probed. Therefore, in the substrate inspection apparatus 1, it is possible to inspect the cavity substrate 100 accurately.

As described above, in the probe unit 3 and the substrate inspection apparatus 1, the probe pins 13 are arranged along the first direction B, which is the combined direction of the extending directions of the holding portions 12, and the downstream in the first direction B When the probe pins 13 are viewed in a first direction from the B1 side toward the upstream B2 side, the holding portions 12 are configured to be able to hold the probe pins 13 so that the probe pins 13 overlap. For this reason, according to the probe unit 3 and the substrate inspection apparatus 1, for example, the pad 103 is provided in the vicinity of the wall portion 104 constituting the recess 101 of the cavity substrate 100 (that is, an obstacle in the vicinity of the probing target) Even in the case where the probe pin 13 is present, the probe pin 13 can be reliably probed on the pad 103 without bringing the probe pin 13 into contact with the wall portion 104 (obstacle).

  Further, in the probe unit 3 and the substrate inspection apparatus 1, each probe pin 13 extends along the Z direction which contacts and separates from the pad 103 when each probe pin 13 is viewed in the first direction. The holding portion 12 is configured to be able to hold each of the probe pins 13. Therefore, according to the probe unit 3 and the substrate inspection apparatus 1, the wall portion which becomes an obstacle in the vicinity of either the right side or the left side of the pad 103 from the downstream B1 side to the upstream B2 side in the first direction B Even if 104 is present, the probe pins 13 can be reliably probed to the pads 103 without contacting the probe pins 13 with the respective walls 104.

  Further, in the probe unit 3 and the substrate inspection apparatus 1, each probe pin 13 has an acute angle with respect to the first direction B when each probe pin 13 is viewed along the second direction C orthogonal to the first direction B. Each holding part 12 is comprised so that holding of each probe pin 13 is possible so that it may incline. Therefore, according to the probe unit 3 and the substrate inspection apparatus 1, each tip 31 of each probe pin 13 in one probe unit 3 and each tip 31 of each probe pin 13 in another one probe unit 3 As a result of making each probe pin 13 avoid contact with each other, as a result, each tip portion 31 of each probe pin 13 in two probe units 3 can be reliably attached to two adjacent pads 103 without contact with each other. It can be probed.

  Further, in the probe unit 3 and the substrate inspection apparatus 1, the holding portions 12 are configured to be able to hold the probe pins 13 of the same length. For this reason, according to this probe unit 3 and the substrate inspection apparatus 1, the mechanical characteristics of each probe pin 13 can be made equal, unlike the configuration using two probe pins 13 having different lengths. As a result of being able to equalize (or approximately equal) the amount of elastic deformation and the state of vibration of each probe pin 13 in the process, it is possible to stably probe each probe pin 13.

  The probe unit and the circuit board inspection apparatus are not limited to the above configuration. For example, a probe unit 3A shown in FIG. 11 and a substrate inspection apparatus provided with this probe unit 3A can also be adopted. In the following description, the same components as those of the above-described probe unit 3 are denoted by the same reference numerals, and redundant description will be omitted.

  In this probe unit 3A, as shown in FIG. 11, the tip end 21a of the holding portion 12a and the tip end 21b of the holding portion 12b are joined to each other by the joint portion 14 having elasticity. The bonding portion 14 is, for example, coated with a moisture-curable silicone adhesive, an addition-curable (heat-curable) silicone adhesive, an ultraviolet-curable silicone adhesive, or the like on each of the tip portions 21a and 21b. (Rubbed) is formed. In addition, the joining part 14 of the shape which can be inserted in each tip part 21a, 21b is formed with elastic materials, such as rubber, this joining part 14 is inserted in each tip part 21a, 21b, and tip parts 21a and 21b are mutually It can also be joined.

  According to this probe unit 3A, the distal end portions 21a and 21b of the holding portions 12a and 12b are joined to each other by the joining portion 14 so that the movement amount and the vibration state of the distal end portions 21a and 21b become equal (or As a result, the probe pins 13 can be probed more stably.

  In this case, in the configuration in which the tip portions 21a and 21b are joined to each other by the joining portion 14 which is not easily elastically deformed, the tip portions 21a and 21b are difficult to separate from each other. 13 are also in a state where it is difficult to separate. Therefore, in such a configuration, for example, as shown in FIG. 12, when probing each probe pin 13 on a probing target 105 having a curved surface (the surface is not flat), only one probe pin 13b is a probing target. In some cases, probing of the other probe pin 13a (indicated by a broken line in the figure) becomes difficult. On the other hand, according to this probe unit 3A, since the bonding portion 14 has elasticity, some separation of the tip portions 21a and 21b is permitted, and the tip portions 21a and 21b are respectively held. As a result of the probe pins 13 being able to be slightly separated from each other, both of the probe pins 13 can be reliably probed with respect to a probing target 105 having a curved surface, as shown by solid lines in the same figure.

  Further, a probe unit 203 shown in FIG. 13 and a substrate inspection apparatus provided with this probe unit 203 can also be adopted. The probe unit 203 includes holders 212a and 212b (hereinafter, also referred to as "holders 212" if not distinguished from each other) shown in the figure, instead of the holders 12a and 12b of the probe unit 3 described above. Instead of the fixing portion 10 of the probe unit 3, a fixing portion (not shown) capable of fixing the base end portions 222a and 222b of the holding portions 212a and 212b is provided. Further, the probe unit 203 is configured to include probe pins 213a and 213b having different lengths (hereinafter, also referred to as "probe pin 213" when not distinguished).

In the probe unit 203, as shown in FIG. 13, the holding portion 212b is disposed above the holding portion 212a. In the probe unit 203, the holder 212a holds the short probe pin 213a, and the holder 212b holds the long probe pin 213b. Also in this probe unit 203, the probe pins 213 are arranged along the first direction B (see the same figure), which is the combined direction of the extending directions of the holding portions 212, and the downstream B1 in the first direction B. When each probe pin 213 is viewed in a first direction from the side (right side in the figure) to the upstream B2 side (left side in the figure), the probe pins 213 can be held so that the probe pins 213 overlap The respective holding units 212 are respectively configured. For this reason, also in this probe unit 203, as in the case of the probe unit 3, even when an obstacle is present in the vicinity of the object to be probed, each probe pin 213 can be connected without contacting each probe pin 213 with the obstacle. Probing can be performed reliably.

Further, in the probe unit 3 described above, the holding portion 12 holds the probe pins 13a and 13b such that the inclination angles θ1 and θ2 of the probe pins 13a and 13b with respect to the first direction B are different from each other. As described above, a probe unit 303 provided with holding portions 312a and 312b (hereinafter, also referred to as "holding portion 312" when not distinguished) for holding the probe pins 13a and 13b so that the inclination angles θ1 and θ2 become equal You can also. Also in this configuration, the probe pins 13 are arranged along the first direction B (see the same drawing), which is the combined direction of the extending directions of the holding portions 312, and the downstream side B1 in the first direction B (the same drawing) When each probe pin 13 is viewed in a first direction from the right side to the upstream B2 side (left side in the same drawing) from the right side, each holding portion is capable of holding each probe pin 13 such that the probe pins 13 overlap. By configuring 312, as in the case of the probe unit 3, even when an obstacle is present in the vicinity of the object to be probed, the probe pins 13 can be subjected to the object of probing without bringing the probe pins 13 into contact with the obstacle. Can be probed reliably.

  Further, although the example in which the cavity substrate 100 having the concave portion 101 (cavity) is the inspection target has been described above, a substrate having no concave portion 101 may be the inspection target. Moreover, although the above-mentioned example demonstrated the example which measures the resistance value as a to-be-measured amount from the electric signal input-output via the probe pin 13 (probe pin 213), other to-be-measured amount It can also be measured.

DESCRIPTION OF SYMBOLS 1 board inspection apparatus 3, 203, 303 probe unit 8 control part 5 measurement part 13a, 13b, 213a, 213b probe pin 31a, 31b tip part 21a, 21b tip part 22a, 22b base end part 10 fixing part 12a, 12b holding part 212a, 212b holding portion 312a, 312b holding portion 100 cavity substrate 103 pad A1, A2 extending direction B first direction C second direction θ1, θ2 tilt angle

Claims (5)

And a pair of holding portions for holding the probe pins at their tip end portions while the respective contact side ends of the pair of probe pins are close to each other, and for fixing the respective base end portions to the fixing portion, A probe unit configured to be capable of probing each of the probe pins together for probing.
Each of the holding portions is connected from the proximal end portion of the one holding portion to the distal end portion in the first extending direction of the one holding portion from the proximal end portion to the distal end portion of the other holding portion. The respective base ends such that the second extending direction of the other holding portion toward the second direction intersects the downstream side in the first direction which is the combined direction of the first extending direction and the second extending direction with part is fixed to the fixed portion, wherein each probe pin aligned along the first direction, and wherein in the first direction from the downstream side in the first direction on the upstream side in the first direction A probe unit configured to be capable of holding the respective probe pins such that the respective probe pins overlap when viewing each probe pin.   The respective holding portions are configured such that the respective probe pins extend along a direction in which the respective probe pins are brought into contact with and separated from the probing target when the respective probe pins are viewed in the first direction. The probe unit according to claim 1, wherein the probe unit is configured to be able to be held. Wherein the holding unit, the probe unit according to claim 1 or 2, wherein held configured to enable the respective probe pins of the same length. The probe unit according to any one of claims 1 to 3 , wherein the respective holding parts are joined to each other by a joint part in which the respective tip parts are elastic. The inspection apparatus provided with the probe unit in any one of Claims 1-4 , and the test | inspection part which test | inspects a test object based on the electric signal input-output via the said probe pin of the said probe unit.

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