JP5893397B2 - Probe unit and inspection device - Google Patents

Description

  The present invention relates to a probe unit having a pair of holding members that hold a pair of probe pins at their respective distal ends and to which each proximal end is attached to a probing mechanism, and a probing object including the probe unit. The present invention relates to an inspection apparatus that performs the inspection.

  As this type of probe unit, a probe unit disclosed by the applicant in Japanese Patent Application Laid-Open No. 2006-330006 is known. The probe unit includes a probe holding portion and a pair of contact probes, and is fixed to a probe guide mechanism. Each contact probe includes a pair of holders attached to the base portion of the probe holder and a pair of probe pins fixed to each holder.

JP 2006-330006 A (page 5-6, FIG. 1)

  However, the above probe unit has the following problems to be improved. That is, in this probe unit, a contact probe including a pair of holders and a pair of probe pins is fixed to the probe guide mechanism via the probe holder. In this case, when performing an inspection using this probe unit, the probe guide mechanism moves (lowers) the probe unit toward the probing object, thereby bringing the tip portions of the pair of probe pins into contact with the probing object. Let In this case, for example, as shown in FIG. 8, when the upper part of the bump 101 of the substrate 100 as the probing object is planar, both the tip portions of the probe pins 113 are in contact with the bump 101. However, as shown in FIGS. 9 and 10, when the probe pins 113 are probed onto the bump 101 having a spherical upper portion, the probe pins 113 are kept apart from each other (each probe pin 113). As a result, one or both of the tip portions may come off the bump 101 and be in a non-contact state with the bump 101.

  The present invention has been made in view of such a problem to be improved, and it is a main object of the present invention to provide a probe unit and an inspection apparatus that can reliably bring a pair of probe pins into contact with a probing object.

In order to achieve the above object, the probe unit according to claim 1 is provided with a pair of probe pins and a probing mechanism for holding each probe pin at each tip and probing each probe pin. The probe unit includes a pair of holding members to be attached, and both the tip portions of the holding members and the probe pins are connected to each other by an elastic body.

  The probe unit according to claim 2 is the probe unit according to claim 1, wherein the elastic body is formed of a polymer material having elasticity.

  The probe unit according to claim 3 is the probe unit according to claim 2, wherein the elastic body is formed by curing a silicone adhesive as the polymer material.

  The inspection apparatus according to claim 4 is configured to be attachable to the probe unit according to any one of claims 1 to 3 and the base ends of the holding members, and is held by the holding members. A probing mechanism for probing each probe pin to the probing object, and an inspection unit for inspecting the probing object based on an electric signal input / output via each probe pin probed to the probing object; It has.

The probe unit according to claim 1, and an inspection apparatus according to claim 4 is connected to each other by an elastic body both the probe pins between which is held the respective leading ends and the respective tip portions of the two holding members ing. For this reason, according to the probe unit and the inspection apparatus, for example, even when each probe pin is probed to a bump as a probing object whose upper part is formed in a spherical shape, the elastic deformation amount of the elastic body is exceeded. As a result of being able to regulate the separation between the tips of each holding member and the separation between the probe pins, it is possible to prevent the probe pins from coming off the bumps and being in non-contact with the bumps. It is possible to maintain the tip portion in contact with the bump.

  The probe unit according to claim 2 and the inspection apparatus according to claim 4 use an elastic body made of a polymer material having elasticity. In this case, since the polymer material is generally easy to process, it is possible to easily produce an elastic body having a shape capable of connecting the tip portions of the holding members and the probe pins. Therefore, according to the probe unit and the inspection apparatus, the manufacturing cost of the probe unit and the inspection apparatus can be reduced by the amount that the elastic body can be manufactured at low cost.

  Further, according to the probe unit according to claim 3 and the inspection apparatus according to claim 4, each tip of each holding member is formed by using an elastic body formed by curing a silicone adhesive as a polymer material. In addition, an elastic body can be formed by a very simple process of applying a silicone adhesive and curing the silicone adhesive so as to cover the holding portion of each probe pin held by each tip. In addition, the tip portions of the holding members and the probe pins can be connected by an elastic body.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. FIG. 3 is a perspective view showing configurations of probe units 3a and 3b and a probing mechanism 4. FIG. 5 is a perspective view showing a connection state of each holding member 11 and each probe pin 13 by an elastic body 12. 3 is a front view of the holding member 11 and the probe pin 13 as viewed from the front end portion 11b side of the holding member 11. FIG. FIG. 5 is a first explanatory view explaining the operation of the probe unit 3. FIG. 6 is a second explanatory diagram explaining the operation of the probe unit 3. FIG. 6 is a third explanatory diagram for explaining the operation of the probe unit 3. It is the 1st explanatory view explaining operation of the conventional probe unit. It is the 2nd explanatory view explaining operation of the conventional probe unit. It is the 3rd explanatory view explaining operation of the conventional probe unit.

  Hereinafter, embodiments of a probe unit and an inspection apparatus will be described with reference to the accompanying drawings.

  First, the configuration of the substrate inspection apparatus 1 as an example of the inspection apparatus will be described. As an example, the substrate inspection apparatus 1 shown in FIG. 1 measures the resistance between the bumps 101 provided on the substrate 100 as the probing object by a four-terminal method, and based on the measured value, the substrate 100 (each bump 101) can be inspected. Specifically, as shown in the figure, the substrate inspection apparatus 1 includes a substrate support base 2, probe units 3a and 3b (see also FIG. 2; hereinafter, also referred to as “probe unit 3” when not distinguished), a probing mechanism 4, the measurement part 5, the operation part 6, the memory | storage part 7, and the control part 8 are comprised.

  The substrate support 2 includes a clamp (not shown) and is configured to be able to support the substrate 100 to be inspected.

  As shown in FIG. 2, the probe unit 3 includes two holding members 11, an elastic body 12, and two probe pins 13.

  As shown in FIGS. 2 and 3, the holding member 11 is cantilevered (cantilevered) in a state in which the base end portion 11a is fixed to the attachment portion main body 71 of the attachment portions 62a and 62b in the probing mechanism 4 described later. It is comprised so that. The holding member 11 is formed of an insulating material (non-conductive resin as an example), and is configured to hold the probe pin 13 at the distal end portion 11b. Specifically, as shown in FIG. 4, a groove 41 is formed in the distal end portion 11 b of the holding member 11, and the probe pin 13 is inserted into the groove 41 by inserting the proximal end portion 13 a side of the probe pin 13 into the groove 41. It is held at the tip 11b.

  In this case, as shown in FIG. 3, each groove 41 formed in the tip portion 11b of each holding member 11 has each holding member toward the lower side (side closer to the substrate 100 when probing by the probing mechanism 4). 11 is inclined so as to be separated from the attachment main body 71 along the extending direction, and as shown in FIG. Therefore, as shown in FIG. 3, each probe pin 13 fitted in each groove 41 is separated from the attachment portion main body 71 along the extending direction of each holding member 11 toward the distal end portion 13 b side. As shown in FIG. 4, the tip portions 13b are closer to each other. Further, the probe pin 13 held in this manner on the tip 11b of the holding member 11 is fixed to the tip 11b with an adhesive as will be described later.

  In addition, the holding member 11 includes, for example, a four-node rotation link mechanism, and absorbs an impact when the probe pin 13 comes into contact with the bump 101 serving as a probing target body during the probing performed by the probing mechanism 4. It has a function.

  As shown in FIGS. 3 and 4, the elastic body 12 connects the tip portions 11b of the pair of holding members 11 and the probe pins 13 held by the tip portions 11b. In this case, as an example, the elastic body 12 is formed of an insulating and elastic silicone rubber (an example of a polymer material having elasticity) and is configured to be elastically deformable. This elastic body 12 allows separation between the tip portions 11b and separation between the probe pins 13 within the range of the amount of elastic deformation, and separation between the tip portions 11b exceeding the elastic deformation amount and each probe pin 13. It has a function of regulating the separation between them.

  The probe pin 13 is held at the distal end portion 11b of the holding member 11 as described above. The probe pin 13 is made of a conductive material.

  As shown in FIG. 1, the probing mechanism 4 includes two arms 61a and 61b (hereinafter also referred to as “arm 61” when not distinguished from each other) and two attachment portions 62a and 62b (which are fixed to the arms 61a and 61b). 2. Refer to FIG. 2 (hereinafter also referred to as “mounting portion 62” when not distinguished), and according to the control of the control unit 8, the direction along the surface of the substrate 100 supported by the substrate support 2 (XY direction), and Each arm 61 is moved downwardly and upwardly (Z direction) that contacts and separates from the substrate 100 to probe the probe pins 13 on the bumps 101 of the substrate 100. In this case, the mounting portion 62 is configured to include a mounting portion main body 71 and a fixing plate 72 as shown in FIG. In the following description, the fixing plate 72 of the mounting portion 62a is also referred to as a fixing plate 72a, and the fixing plate 72 of the mounting portion 62b is also referred to as a fixing plate 72b.

  As shown in FIG. 2, the attachment portion main body 71 is configured to be able to attach the base end portion 11 a of each holding member 11, and is configured to be able to fix the distal end portion (lower end portion in the figure) of the fixing plate 72. ing. Further, as shown in FIG. 3, the attachment portion main body 71 is arranged so that the distal end portions 11 b of the holding members 11 are close to each other in a state where the base end portions 11 a of the holding members 11 are attached (see also FIG. 4). The shape is defined.

  The fixing plate 72 is a member for fixing the mounting portion 62 to the arm 61, and is fixed to the distal end portion of the arm 61 by a fixing screw 70 as shown in FIG. As shown in the figure, the fixing plate 72a of the mounting portion 62a is provided with a cable support portion 81 that supports the signal cable 80 connected to each probe pin 13.

  The measurement unit 5 performs a measurement process in which the resistance between the bumps 101 is measured by a four-terminal method based on an electric signal input / output via each probe pin 13 probed on each bump 101 of the substrate 100. The operation unit 6 includes various switches and keys, and outputs an operation signal when these are operated.

  The storage unit 7 stores position data indicating the position of each bump 101 where the probe pin 13 is to be probed. Further, the storage unit 7 stores a reference value of the resistance value used for the inspection of the substrate 100 (bump 101).

  The control unit 8 controls the probing mechanism 4 and the measurement unit 5. The control unit 8 functions as an inspection unit together with the measurement unit 5, and the quality of the substrate 100 based on the resistance value measured by the measurement unit 5, specifically, as an example, the insulation state between the bumps 101. Inspect the quality.

  Next, an example of a method of holding the probe pin 13 on the holding member 11 and an example of a method of connecting the tip portions 11b of the holding members 11 and the probe pins 13 with the elastic body 12 will be described.

  First, the probe pin 13 is held at each tip portion 11 b of each holding member 11. Specifically, the proximal end portion 13 a of the probe pin 13 is fitted into the groove 41 formed in the distal end portion 11 b of one holding member 11. Next, an adhesive is applied to the fitting portion to fix the distal end portion 11 b of the holding member 11 and the proximal end portion 13 a of the probe pin 13. Subsequently, the probe pin 13 is held on the tip 11b of the other holding member 11 in the same procedure.

  Next, the distal end portions 11 b of the holding members 11 and the probe pins 13 are connected by the elastic body 12. Specifically, as shown in FIG. 4, the distal end portions 11b of the holding members 11 that are close to each other, and the proximal end portion 13a side (groove 41) of each probe pin 13 that is held by each distal end portion 11b. A moisture-curing silicone adhesive (hereinafter, also simply referred to as “silicone adhesive”) is applied so as to cover the portion that is fitted into the film.

  In this case, the moisture-curing type silicone adhesive changes (cures) into a rubber-like rubber having a curing reaction with moisture in the air, and also applies an object to be coated (in this example, the tip of the holding member 11). 11b and the hydroxyl group (OH) contained or adhering to the probe pin 13) and adheres to the substrate. For this reason, the silicone adhesive applied as described above becomes the elastic body 12 having elasticity, and connects the tip portions 11b and the probe pins 13 to each other. Note that an addition curing type (heat curing type) silicone adhesive or an ultraviolet curing type silicone adhesive may be used instead of the moisture curing type silicone adhesive.

  Next, a method for inspecting the substrate 100 (bump 101) using the substrate inspection apparatus 1 and the operation of each part at that time will be described with reference to the drawings.

  First, the substrate 100 is mounted on the mounting surface of the substrate support 2, and then the substrate 100 is fixed by a clamp (not shown). Thereby, the substrate 100 is supported by the substrate support 2. Next, the operation unit 6 is operated to instruct the start of inspection. At this time, the operation unit 6 outputs an operation signal, and in response thereto, the control unit 8 starts an inspection process.

  In this inspection process, the control unit 8 reads the position data from the storage unit 7 and specifies the position of the bump 101 where the probe pin 13 is to be probed. Subsequently, the control unit 8 controls the probing mechanism 4 to move one arm 61 (for example, the left arm 61 in FIG. 2) along the surface of the substrate 100 (the mounting surface of the substrate support 2). Then, each tip portion 13b of each probe pin 13 held by each holding member 11 in the probe unit 3a attached to the arm 61 via the attachment portion 62 is positioned above one bump 101. Further, the control unit 8 controls the probing mechanism 4 to move the other arm 61 (the right arm 61 in the figure) along the surface of the substrate 100, and the probe unit 3b attached to the arm 61. Each tip portion 13b of each probe pin 13 held by each holding member 11 is positioned above another bump 101.

  Next, the controller 8 controls the probing mechanism 4 to move (lower) each arm 61 in a direction close to the surface of the substrate 100 (downward). Subsequently, as shown in FIG. 5, the tips 13 b of the probe pins 13 held by the holding members 11 of the probe units 3 come into contact with the bumps 101 as the arms 61 descend. Next, when each arm 61 is further lowered, the tip portion 13 b of the probe pin 13 presses the bump 101.

  Here, as shown in FIG. 5, when the upper portion of the bump 101 is planar, both the tip portions 13 b of the two probe pins 13 held by the two holding members 11 in one probe unit 3 are The upper surface of the bump 101 is brought into contact with the upper surface of the bump 101 and then the upper surface of the bump 101 is pressed evenly by the lowering of the arm 61. In this state, movement of the probe pin 13 (movement in the XY direction) is prevented, and each tip portion 13b of each probe pin 13 is maintained in a state of reliably contacting the bump 101.

  Further, as shown in FIG. 6, when the upper part of the bump 101 is spherical, when the tip parts 13b of the two probe pins 13 are in contact with each other at symmetrical positions with the center of the spherical upper part in between, As the arm 61 is subsequently lowered, each tip portion 13b of each probe pin 13 presses the upper surface of the bump 101 downward, and a reaction force of the downward pressing force is applied upward. At this time, each tip portion 13b of each probe pin 13 comes into contact with the spherical portion of the bump 101, and a tangent line passing through a contact point between the tip portion 13b and the bump 101 is inclined with respect to the vertical direction (Z direction). Therefore, the component force of the upward reaction force is applied in a direction that separates the tip portions 13b from each other. In this case, in the configuration in which the tip portions 11b of the holding members 11 and the probe pins 13 are not connected, the tip portions 13b of the probe pins 13 move along the spherical surface while sliding on the spherical surface of the bump 101. The tip portions 11b and the probe pins 13 are separated from each other. On the other hand, in the probe unit 3, the distal end portions 11 b of the holding members 11 and the probe pins 13 are connected by an elastic body 12. For this reason, in this probe unit 3, the separation of the tip portions 11 b exceeding the elastic deformation amount of the elastic body 12 and the separation of the probe pins 13 are restricted. In other words, a state of non-contact is prevented, and each tip portion 13 b of each probe pin 13 is maintained in a state of reliably contacting the bump 101.

  Further, as shown in FIG. 7, the tip portion 13b of the probe pin 13 on one side (right side in the figure) contacts the center of the spherical upper portion of the bump 101, and the probe pin 13 on the other side (left side in the figure) When the tip portion 13b is in contact with a position deviated from the center of the spherical upper portion (the position on the left side in the figure), each tip portion 13b of each probe pin 13 is moved to the upper surface of the bump 101 by the subsequent lowering of the arm 61. Is pressed downward, and the reaction force of the downward pressing force is applied upward. At this time, since the tip portion 13b of the right probe pin 13 is in contact with the center of the upper portion, a reaction force is applied to the tip portion 13b of the right probe pin 13 as it is. On the other hand, the tip portion 13b of the left probe pin 13 is in contact with a position eccentric from the center of the upper portion, and the tangent line passing through the contact point between the tip portion 13b and the bump 101 is inclined with respect to the vertical direction. A component of an upward reaction force is applied to the tip portion 13 b of the left probe pin 13 in a direction to separate from the tip portion 13 b of the right probe pin 13. Also in this case, since the tip portions 11b of the holding members 11 and the probe pins 13 are connected by the elastic body 12, each tip portion exceeding the elastic deformation amount of the elastic body 12 as shown in FIG. As a result of the separation of the separation between the probe pins 13 and the separation of the probe pins 13 from each other, the tips 13 b of the probe pins 13 are kept in contact with the bumps 101 reliably.

  Subsequently, the control unit 8 controls the measurement unit 5 to execute measurement processing. In this measurement process, the measurement unit 5 measures the resistance value between the bumps 101 by a four-terminal method. Specifically, the measurement unit 5 outputs a measurement signal (for example, a constant current). At this time, two bumps 101 are used for measurement via the probe pin 13 held by one holding member 11 in the probe unit 3a and the probe pin 13 held by one holding member 11 in the probe unit 3b. A signal is supplied. Next, the measurement unit 5 includes an electrical signal (a voltage generated between the bumps 101) generated with the supply of the measurement signal, a probe pin 13 held by the other holding member 11 in the probe unit 3a, and the probe unit. The resistance value between the bumps 101 is measured based on the voltage value and the current value of the measurement signal, which is input via the probe pin 13 held by the other holding member 11 in 3b.

  Subsequently, the control unit 8 inspects the quality of the insulation state between the bumps 101. Specifically, the control unit 8 reads the reference value from the storage unit 7 and compares the reference value with the resistance value (measured value) measured by the measuring unit 5. In this case, the control unit 8 determines that the insulation state between the bumps 101 is good when the measurement value is equal to or greater than the reference value, and determines that the insulation state between the bumps 101 is defective when the measurement value is less than the reference value. To do. In this case, in this board inspection apparatus 1, as described above, each probe pin 13 of the probe unit 3 is reliably in contact with each bump 101, so that the resistance value is accurately measured by the measurement unit 5. Thus, it is possible to accurately inspect the quality of the insulation state between the bumps 101.

  Next, the control unit 8 controls the probing mechanism 4 to move (raise) each arm 61 in a direction (upward) away from the substrate 100. Subsequently, the control unit 8 executes the above-described processes to cause the other bumps 101 to probe the probe pins 13 and inspects the quality of the insulation between the other bumps 101.

  As described above, in the probe unit 3 and the substrate inspection apparatus 1, the tip portions 11 b of the two holding members 11 and the probe pins 13 held by the tip portions 11 b are connected to each other by the elastic body 12. ing. For this reason, according to the probe unit 3 and the substrate inspection apparatus 1, for example, even when each probe pin 13 is probed to the bump 101 as a probing target body whose upper part is formed in a spherical shape, the elastic body 12 As a result of being able to regulate the separation between the tip portions 11b exceeding the elastic deformation amount and the separation between the probe pins 13, it is possible to prevent the probe pin 13 from coming off the bump 101 and being in a non-contact state with the bump 101. As a result, the tip portions 13b of the probe pins 13 can be maintained in a state of reliably contacting the bumps 101.

  Further, the probe unit 3 and the substrate inspection apparatus 1 use the elastic body 12 formed of a polymer material having elasticity. In this case, since the polymer material is generally easy to process, it is possible to easily produce the elastic body 12 having a shape capable of connecting the tip portions 11b of the holding member 11 and the probe pins 13 to each other. . For this reason, according to this probe unit 3 and the board | substrate inspection apparatus 1, since the elastic body 12 can be produced at low cost, the manufacturing cost of the probe unit 3 and the board | substrate inspection apparatus 1 can be reduced.

  Moreover, according to this probe unit 3 and the board | substrate test | inspection apparatus 1, by using the elastic body 12 formed by hardening the silicone adhesive as a polymer material, each front-end | tip part 11b of each holding member 11, and each front-end | tip The elastic body 12 can be formed by an extremely simple process of applying a silicone adhesive and curing the silicone adhesive so as to cover the holding portion of each probe pin 13 held by the portion 11b. At the same time, the distal end portions 11 b of the holding member 11 and the probe pins 13 can be connected by the elastic body 12.

  The probe unit and the circuit board inspection apparatus are not limited to the above configuration. For example, although it described above about the example which connected both the front-end | tip parts 11b of two holding members 11 and two probe pins 13 with the elastic body 12, the structure which connects each front-end | tip part 11b only with the elastic body 12, A configuration in which only the probe pins 13 are connected by the elastic body 12 can be employed.

  Moreover, although it described above about the example which comprises the elastic body 12 by apply | coating a silicone adhesive and making it harden | cure, the elastic body 12 in the state hardened | cured previously is each tip part 11b of each holding member 11, and each probe A method of adhering using an adhesive (silicone adhesive or other adhesive) so as to connect at least one of the base end portions 13a of the pin 13 can also be adopted. Moreover, the structure using the elastic body formed with materials other than silicone rubber is also employable. Specifically, an elastic body formed of various rubbers such as chloroprene rubber, nitrile rubber, ethylene propylene rubber, butyl rubber, urethane rubber, and fluorine rubber, and elastomer (another example of an elastic polymer material) is used. it can.

  Moreover, the structure using the spring as an elastic body is also employable. In this configuration, both ends of the spring are fixed and connected to at least one of the two tip portions 11b and the two probe pins 13. In this case, a resin spring can be employed, and a metal spring can be employed as long as the short circuit between the probe pins 13 can be prevented.

  In addition, although an example using an elastic body having an insulating property (silicone rubber in the above example) has been described above, when only the tip portions 11b of the holding members 11 are connected, an elastic body that does not have an insulating property is used. Can be used. Moreover, although the example using the holding member 11 formed of an insulating material has been described above, a configuration using a holding member formed of a conductive material (for example, metal) may be employed. When this configuration is adopted, in a configuration in which the holding member and the probe pin 13 are not insulated, a short circuit between the holding members and a short circuit between the probe pins 13 can be achieved by using an insulating elastic body. Can be prevented.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 3a, 3b Probe unit 4 Probing mechanism 5 Measuring part 8 Control part 11 Holding member 11a Base end part 11b Tip part 12 Elastic body 13 Probe pin 62a, 62b Mounting part 100 Board | substrate 101 Bump

Claims (4)

A probe unit comprising a pair of probe pins and a pair of holding members each holding the probe pins at their respective distal ends and having their base ends attached to a probing mechanism for probing the probe pins. ,
Wherein both of the distal ends and the respective probe pins of the respective holding members, the probe unit are connected to each other by an elastic body.   The probe unit according to claim 1, wherein the elastic body is formed of a polymer material having elasticity.   The probe unit according to claim 2, wherein the elastic body is formed by curing a silicone adhesive as the polymer material.   The probe unit according to any one of claims 1 to 3 and each probe pin configured to be attachable to each base end of each holding member and held by each holding member are probed to a probing target body An inspection apparatus comprising: a probing mechanism to be performed; and an inspection unit that inspects the probing object based on an electrical signal input / output via each probe pin that is probed to the probing object.

Images