TWM536358U - Chip testing apparatus having implantable coaxial bore connector and electrical circuit architecture - Google Patents

Abstract

A chip testing apparatus having implantable coaxial bore connector and electrical circuit architecture are described. The chip testing apparatus includes connecting device for transmitting a testing signal from one side to opposite sides of an electrical board by a short transmission path such that the power consumption of the testing signal is reduced and noise is avoided. Furthermore, the procedure of manufacturing a coaxial through via of the load board of the electrical board is simplified to decrease the manufacturing cost of the chip testing apparatus.

Description

Wafer test architecture with implanted coaxial connector and its circuit architecture

This creation is about a test architecture and its circuit architecture, particularly with respect to a wafer test architecture with an implanted coaxial connector and its circuit architecture.

As electronic products are becoming more sophisticated and multi-functional, the wafer structure of integrated circuits in electronic products tends to be complex, and the operating frequency of the wafer structure is also greatly increased for use in electronic products in higher frequency bands. . The wafer test apparatus for testing the wafer must have the ability to test high frequency signals, especially when the load board of the printed circuit board of the wafer test apparatus needs to make through holes, complicated lithography and etching procedures are required, resulting in production. The cost is increased, wherein the through hole is used to connect the instrument to perform analysis and measurement of various signals to confirm whether the function of the chip is normal. Therefore, a new type of test architecture needs to be proposed to solve the above problems.

One of the aims of the present invention is to provide a wafer test architecture and circuit architecture with an implantable coaxial connector, wherein the test signal is transmitted from one surface of the circuit board to the other surface in the shortest path by the coaxial hole connector to reduce Test signal power loss and avoid miscellaneous Interference, and to simplify the complicated steps of making coaxial vias for printed boards of printed boards in the prior art, to reduce the production cost of the wafer test architecture.

In order to achieve the above object, a wafer test architecture having an implantable coaxial connector in one embodiment of the present invention includes: a wafer; a foot having a plurality of pins for electrically inserting the wafer, The pins are used to transmit test signals of the chip; a circuit board electrically connected to the pins for transmitting the test signals from the pins, wherein the circuit board is provided with at least one through hole, the through hole Corresponding to at least one foot of the foot, and the inner wall surface of the through hole is provided with a conductive layer; and a coaxial hole connector including a cable section and a joint, the cable section is inserted therein The through hole and the outer surface of the cable segment are in electrical contact with the conductive layer, so that the test signal is transmitted from the cable segment to the connector in a transfer direction, so that the test signal is received by the circuit board The first surface is transferred to the second surface, and the two ends of the through hole are respectively connected to the first surface and the second surface.

In an embodiment of the wafer test structure having an implantable coaxial connector, the conductive layer is formed on the inner wall surface of the through hole by electroplating.

In one embodiment, a wafer test architecture having an implanted coaxial connector, wherein the cable segment is a coaxial cable segment.

In one embodiment, the wafer test structure has an implantable coaxial connector, wherein the cable segment includes: a wire electrically connected to at least one pin of the foot for transmitting the test signal; and an insulation a portion for covering the wire, and an outer surface of the insulating portion is equidistant from the wire along a radial direction; and a ground shield portion is formed on the outer surface of the insulating portion to interact with the wire Insulation to control the impedance value of the test signal in the cable section.

a wafer test architecture with an implantable coaxial connector in an embodiment, The cable section is formed by combining the wire, the insulating portion and the grounding shield, and implanting the combined wire, the insulating portion and the structure of the grounding shield into the through hole of the circuit board .

In one embodiment, a wafer test architecture having an implantable coaxial connector, wherein the wire of the cable segment is a solid wire.

In an embodiment of the wafer test architecture having an implantable coaxial connector, the first surface and the second surface of the circuit board are the upper and lower surfaces of the circuit board.

In an embodiment of the wafer test structure having an implantable coaxial connector, wherein the conductive layer of the inner wall surface of the through hole extends to form a conductive portion on the first surface and the second surface of the circuit board to Control the impedance value of the cable segment.

In an embodiment of the wafer test architecture with an implantable coaxial connector, the coaxial connector is secured to the circuit board with solder or an adhesive.

In an embodiment of the present invention, a circuit structure includes: a circuit board for transmitting a test signal, wherein the circuit board is provided with at least one through hole corresponding to at least one pin of the foot, and The inner wall surface of the through hole is provided with a conductive layer; and a coaxial hole connector includes a cable section and a joint, the cable section is inserted into the through hole and the outer surface of the cable section is The conductive layer forms an electrical contact such that the test signal is transmitted from the cable segment to the connector in a direction of transmission such that the test signal is transmitted from the first surface of the circuit board to the second surface, the through hole The two ends are respectively connected to the first surface and the second surface.

The method for assembling a wafer test architecture having an implantable coaxial connector in the embodiment of the present invention comprises the steps of: electrically inserting a wafer onto a foot, wherein the foot The socket is provided with a plurality of pins, and the pins are used to transmit the test signal of the chip; the socket to which the wafer is inserted is electrically connected to a circuit board, so that the circuit board transmits the test from the pins a signal, wherein the circuit board is provided with at least one through hole corresponding to at least one position of the foot, and the inner wall surface of the through hole is provided with a conductive layer; and a coaxial hole connector is inserted The through hole to form a circuit board having an implantable coaxial connector, wherein the coaxial hole connector includes a cable segment and a connector, the cable segment is inserted into the through hole and the cable region The outer surface of the segment is in electrical contact with the conductive layer, such that the test signal is transmitted from the cable segment to the connector in a transfer direction to transmit the test signal from the first surface of the circuit board to the second a surface, the two ends of the through hole are respectively connected to the first surface and the second surface.

In an embodiment of the method of assembling a wafer test structure having an implantable coaxial connector, the conductive layer is formed on the inner wall surface of the through hole by electroplating.

In an embodiment of the method of assembling a wafer test structure having an implantable coaxial connector, the method of forming a cable segment of the coaxial connector includes the steps of: forming a wire to electrically connect the socket At least one pin for transmitting the test signal; forming an insulating portion for covering the wire, and an outer surface of the insulating portion is equidistant from the wire along a radial direction; and forming a ground shield The outer surface of the insulating portion is insulated from the wire to control the impedance value of the test signal in the cable segment.

In an embodiment of the method of assembling a wafer test structure having an implantable coaxial connector, wherein the cable segment is bonded to the wire, the insulating portion, and the ground shield, and the bonded wire, The insulating portion and the structure of the ground shield are implanted in the through hole of the circuit board.

In an embodiment of a wafer test architecture with an implantable coaxial connector An assembly method wherein the wire of the cable section is a solid wire.

In an embodiment of the method for assembling a wafer test structure having an implantable coaxial connector, wherein the first surface and the second surface of the circuit board are upper and lower opposite sides of the circuit board. surface.

In an embodiment of the method of assembling a wafer test structure having an implantable coaxial connector, wherein the conductive layer of the inner wall surface of the via extends to the first surface and the second surface of the circuit board to form a conductive To control the impedance value of the cable segment.

In an embodiment of the method of assembling a wafer test structure having an implantable coaxial connector, the coaxial connector is secured to the circuit board by solder or an adhesive.

200‧‧‧ wafer

202‧‧‧ feet

204‧‧‧Circuit board

204a‧‧‧ first surface

204b‧‧‧second surface

205‧‧‧ instruments

206‧‧‧ feet

207‧‧‧Electrical Department

208‧‧‧ coaxial hole connector

210‧‧‧through hole

212‧‧‧ inner wall

213‧‧‧ Conductive layer

214‧‧‧ Cable section

218‧‧‧ joint

220‧‧‧ wire

222‧‧‧Insulation

224‧‧‧Ground shield

226‧‧‧ outer surface

R‧‧‧ distance

S1‧‧‧ test signal

S600, S602, S604‧‧ steps

TD1‧‧‧Transfer direction

In order to more clearly illustrate the technical solutions in the present embodiment, the drawings used in the description of the embodiments will be briefly described below. FIG. 1 illustrates an embodiment of the present invention with an implantable coaxial connector. Schematic diagram of the wafer test architecture.

2 is a schematic view showing a through-hole coaxial hole connector formed by combining the through hole and the coaxial cable section in the embodiment of the present invention.

3 is a cross-sectional view showing a coaxial hole connector in the present embodiment.

4 is a schematic diagram of a through hole of a circuit board of a wafer test architecture in the present embodiment.

FIG. 5 is a schematic diagram of a coaxial cable section in the present embodiment.

6 is a flow chart showing a method of assembling a wafer test architecture with an implantable coaxial connector in the present embodiment.

Referring to the drawings, wherein like reference numerals refer to the same elements or the like elements, the principles of the present invention are illustrated by the implementation in a suitable computing environment. The following description is based on the illustrated embodiments of the present invention and should not be considered as limiting the other specific embodiments of the present invention that are not described herein.

1 to FIG. 3, FIG. 1 is a schematic diagram of a wafer test architecture with an implantable coaxial connector 208 in the present embodiment; FIG. 2 illustrates the through hole 210 and the cable segment in the present embodiment. 214 is a schematic diagram of a through hole coaxial hole connector 208 formed in combination; and FIG. 3 is a schematic cross-sectional view showing a through hole of the coaxial hole connector 208 in the present embodiment. As shown in FIG. 1, the wafer test architecture includes a wafer 200, a foot 202, a circuit board 204, and a coaxial connector 208 for performing various signal analysis and measurement by the instrument device 205 to confirm whether the function of the wafer 200 is normal. The chip 200 has, for example, a fixed-function integrated circuit having a plurality of pins (not shown) for generating a test signal S1; the pin 202 has a plurality of pins 206, and the pins 206 are electrically connected to the wafer. The pins of the 200 are electrically inserted into the chip 200, so that the pins 206 transmit the test signal S1 of the wafer 200; in an embodiment, the chip 200 transmits different test signals S1 to the foot according to the test requirements. Different feet 206 of the seat 202. The circuit board 204 is electrically connected to the foot 202 for transmitting the test signal S1 from the pins 206. The circuit board 204 is provided with at least one through hole 210 corresponding to the foot 202. At least one foot 206 is provided, and the inner wall surface 212 of the through hole 210 is provided with a conductive layer 213.

As shown in FIGS. 1 and 2, the coaxial hole connector 208 includes a cable section 214 and a joint 218 into which the cable section 214 is inserted and the outer surface of the cable section 214. 215 is in electrical contact with the conductive layer 213, so that the test signal S1 is from the cable segment 214 is transmitted to the connector 218 along a transmission direction TD1, so that the test signal S1 is transmitted from the first surface 204a of the circuit board 204 to the second surface 204b, and the two ends of the through hole 210 are respectively connected to the first surface 204a. And the second surface 204b. The joint 218 is, for example, a screw joint, but is not limited thereto. In one embodiment, the conductive layer 213 is formed on the inner wall surface 212 of the through hole 210 by electroplating. In one embodiment, the coaxial via connector 208 is soldered to the circuit board 204 with solder or an adhesive. The wafer test architecture with the implanted coaxial connector of the present invention transmits the test signal S1 from one surface of the circuit board 204 to the other surface by the coaxial via connector 208 to reduce the power consumption of the test signal and Avoid noise interference.

As shown in FIGS. 1 and 2, the cable section 214 includes a wire 220, an insulating portion 222, and a ground shield portion 224. The wire 220 is electrically connected to at least one pin 206 of the foot 220 for transmitting the test signal S1. The insulating portion 222 is used to cover the wire 220, and an outer surface 226 of the insulating portion 222 is equidistant from the wire 220 along a radial direction. The grounding shield 224 is formed on the outer surface 226 of the insulating portion 222 to be insulated from the wire 220 to control the impedance value of the test signal S at the cable segment 214. In one embodiment, the cable section 214 of the present invention is a predetermined length of coaxial cable, such as the thickness of the circuit board 204, but is not limited thereto. The wire 220 of the cable section 214 is, for example, a solid wire, but is not limited thereto, and may be a hollow cylindrical conductor.

Referring to FIG. 4 and FIG. 5, FIG. 4 is a schematic diagram of the through hole 210 of the circuit board 204 of the wafer testing architecture in the present embodiment. FIG. 5 is a schematic diagram of the cable section 214 in the present embodiment. The cable section 214 is formed by combining the wire 220, the insulating portion 222, and the ground shield portion 224, and the structure of the combined wire 220, the insulating portion 222, and the ground shield portion 224 is implanted in the circuit. The through hole 210 of the plate 204. Since the cable segment 214 is combined with the wire 220, the insulating portion 222, and the ground shield portion 224, and then embedded in the through hole 210, The step of making through holes through the circuit board 204 to simplify the load board of the printed circuit board effectively reduces the production cost of the wafer test architecture.

As shown in FIG. 1 and FIG. 2, the first surface 204a and the second surface 204b of the circuit board 204 are the upper and lower surfaces of the circuit board 204. The conductive layer 213 of the inner wall surface 212 of the through hole 210 extends to the first surface 204a and the second surface 204b of the circuit board 204 to form a conductive portion 207 for controlling the impedance value of the cable section 214.

Referring to FIG. 1, FIG. 2 and FIG. 6, FIG. 6 is a flow chart showing a method of assembling a wafer test architecture with an implantable coaxial connector 208 in the present embodiment.

In step S600, a wafer is electrically connected to a foot. The foot is provided with a plurality of pins, and the pins are used to transmit test signals of the wafer.

In step S602, the socket to which the wafer is inserted is electrically connected to a circuit board, so that the circuit board transmits the test signal from the pins. The circuit board is provided with at least one through hole corresponding to at least one position of the foot, and an inner layer of the through hole is provided with a conductive layer. In one embodiment, the conductive layer 213 is formed on the inner wall surface 212 of the through hole 210 by electroplating. In an embodiment, as shown in FIG. 1 and FIG. 2, the first surface 204a and the second surface 204b of the circuit board 204 are the upper and lower surfaces of the circuit board 204. The conductive layer 213 of the inner wall surface 212 of the through hole 210 extends to the first surface 204a and the second surface 204b of the circuit board 204 to form a conductive portion 207 for controlling the impedance value of the cable section 214.

In step S604, a coaxial connector is inserted into the through hole to form a circuit board having an implantable coaxial connector. The method for forming the cable section 214 of the coaxial connector 208 includes the steps of: forming a wire 220 to electrically connect at least one leg of the foot 220 206, for transmitting the test signal S1. An insulating portion 222 is formed to cover the wire 220, and an outer surface 226 of the insulating portion 222 is equidistant from the wire 220 along a radial direction. A grounding shield 224 is formed on the outer surface 226 of the insulating portion 22 to be insulated from the wire 220 to control the impedance value of the test signal S at the cable segment 214. When the step S604 is performed, the cable segment 214 is combined with the wire 220, the insulating portion 222, and the ground shield portion 224, and the combined wire 220, the insulating portion 222, and the ground shield portion 224 are combined. It is implanted in the through hole 210 of the circuit board 204. In one embodiment, the coaxial via connector 208 is soldered to the circuit board 204 with solder or an adhesive.

In summary, the wafer test architecture of the present invention has an implantable coaxial connector, wherein the test signal is transmitted from one surface of the circuit board to the other surface in the shortest path by the coaxial connector to reduce the test signal. Power consumption and avoidance of noise interference, and the steps of making vias to simplify the load board of the printed board to reduce the production cost of the wafer test architecture.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes without departing from the spirit and scope of the present invention. Retouching, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

204‧‧‧Circuit board

204a‧‧‧ first surface

204b‧‧‧second surface

207‧‧‧Electrical Department

208‧‧‧ coaxial hole connector

210‧‧‧through hole

212‧‧‧ inner wall

213‧‧‧ Conductive layer

214‧‧‧ Cable section

218‧‧‧ joint

220‧‧‧ wire

222‧‧‧Insulation

224‧‧‧Ground shield

226‧‧‧ outer surface

S1‧‧‧ test signal

TD1‧‧‧Transfer direction

Claims (18)

A wafer test architecture having an implantable coaxial connector includes: a chip; a foot having a plurality of pins for electrically inserting the chip, the pins for transmitting test signals of the chip a circuit board electrically connected to the foot for transmitting the test signal from the pins, wherein the circuit board is provided with at least one through hole corresponding to at least one position of the foot And the inner wall surface of the through hole is provided with a conductive layer; and a through hole connector includes a cable section and a joint, the cable section is inserted into the through hole and the outer surface of the cable section Electrically contacting the conductive layer such that the test signal is transmitted from the cable segment to the connector in a direction of transmission such that the test signal is transmitted from the first surface of the circuit board to the second surface, the pass Both ends of the hole are connected to the first surface and the second surface, respectively. The wafer test structure having an implantable coaxial connector according to claim 1, wherein the conductive layer is formed on the inner wall surface of the through hole by electroplating. A wafer test architecture having an implantable coaxial connector as described in claim 1 wherein the cable segment is a coaxial cable segment. The wafer test structure with an implantable coaxial connector according to claim 1, wherein the cable segment comprises: a wire electrically connected to at least one pin of the foot for transmitting the a test signal; an insulating portion for covering the wire, and an outer surface of the insulating portion is equidistant from the wire in a radial direction; A grounding shield is formed on the outer surface of the insulating portion to be insulated from the wire to control the impedance value of the test signal in the cable segment. A wafer test architecture having an implantable coaxial connector according to claim 4, wherein the cable segment is combined with the wire, the insulating portion, and the ground shield, and the combined The wire, the insulating portion, and the structure of the ground shield are implanted in the through hole of the circuit board. A wafer test architecture having an implantable coaxial connector as described in claim 4, wherein the wire of the cable segment is a solid wire. The wafer test architecture with an implantable coaxial connector according to claim 1, wherein the first surface and the second surface of the circuit board are two different upper and lower sides of the circuit board. The surface of the side. The wafer test structure having an implantable coaxial connector according to claim 1, wherein the conductive layer of the inner wall surface of the through hole extends to the first surface and the second surface of the circuit board. a conductive portion to control the impedance value of the cable segment. The wafer test structure with an implantable coaxial connector according to claim 1, wherein the coaxial connector is fixed to the circuit board by solder or an adhesive. A circuit structure includes: a circuit board for transmitting a test signal, wherein the circuit board is provided with at least one through hole corresponding to at least one position of a foot, and an inner wall surface of the through hole is provided a conductive layer; and a coaxial hole connector including a cable segment and a connector, the cable segment is inserted into the through hole and an outer surface of the cable segment is in electrical contact with the conductive layer To make the test The cable segment is transported to the connector in a direction of transmission such that the test signal is transmitted from the first surface of the circuit board to the second surface, the two ends of the through hole being respectively connected to the first surface and the The second surface. The circuit structure of claim 10, wherein the conductive layer is formed on the inner wall surface of the through hole by electroplating. The circuit architecture of claim 10, wherein the cable segment is a coaxial cable segment. The circuit structure of claim 10, wherein the cable segment comprises: a wire electrically connected to at least one pin of the foot for transmitting the test signal; and an insulating portion for wrapping Covering the wire, and an outer surface of the insulating portion is equidistant from the wire in a radial direction; and a grounding shield is formed on the outer surface of the insulating portion to insulate the wire from each other to control the wire Test the impedance value of the signal in the cable segment. The circuit structure of claim 13, wherein the cable section is a combination of the wire, the insulating portion, and the grounding shield, and the combined wire, the insulating portion, and the grounding shield portion The structure is implanted in the through hole of the circuit board. The circuit architecture of claim 13, wherein the wire of the cable segment is a solid wire. The circuit structure of claim 10, wherein the first surface and the second surface of the circuit board are upper and lower surfaces of the circuit board. The circuit structure of claim 10, wherein the conductive layer of the inner wall surface of the through hole extends to form a conductive portion on the first surface and the second surface of the circuit board to Control the impedance value of the cable segment. The circuit structure of claim 10, wherein the coaxial connector is fixed to the circuit board by solder or an adhesive.