TWM574692U - Probe holder and test interface device - Google Patents

Abstract

A probe holder for electrically connecting a wafer to be tested, wherein the wafer to be tested has a plurality of test points. The probe holder includes a base and a probe. The pedestal is provided with a through hole in a thickness direction thereof, and a portion of the pedestal between each of the through holes has at least one metal material. The probes are respectively disposed in the through holes and correspond one-to-one to the test points of the wafer to be tested. The present disclosure also provides a test interface device including a probe holder.

Description

Probe holder and test interface device

The present disclosure relates to a test interface device, and more particularly to a probe holder for wafer testing and a test interface device including a probe holder.

In the back-end process of the semiconductor, the Final Test performs an electrical functional test on the packaged wafer to identify and eliminate the failed wafer. Usually, during the wafer test, the test machine needs to make a contact with the device under test (DUT) through a test interface device such as a probe card. That is to say, the probe card is used as a transmission interface between the test machine and the wafer to be tested, and is used for transmitting test signals and power signals, and is matched with the control and analysis program of the probe card and the test machine to measure the wafer to be tested. The purpose of the electrical characteristics.

However, since the conventional probe card is made of engineering plastic and cannot block the electric field and magnetic field generated by the signal, the adjacent probe is easy to generate a crosstalk effect due to electromagnetic field coupling. When the distance between the probes is shorter, the coupling energy of the crosstalk is larger, which causes mutual interference and distortion of the signals. In this way, it will affect the test results of the test machine, and in severe cases, the test will fail.

Therefore, it is necessary to propose a probe holder and a test interface device to overcome the problems of the prior art described above.

The present disclosure provides a probe holder and test interface device that solves the problems in the prior art.

A probe holder for electrically connecting a wafer to be tested, wherein the The test wafer has a plurality of test points. The probe holder includes: a pedestal having a plurality of through holes in a thickness direction thereof, wherein a portion of the pedestal between each of the through holes has at least one metal material; and a plurality of probes, The plurality of test points are respectively disposed in the plurality of through holes and are in electrical contact with the plurality of test points of the wafer to be tested.

In one embodiment, the base is integrally formed from a metallic material.

In one embodiment, the plurality of test points includes a plurality of signal test points and a plurality of ground test points.

In an embodiment, the plurality of probes comprise a plurality of first probes and a plurality of second probes, the plurality of first probes electrically contacting the plurality of signal test points, respectively, and the plurality of second probes The pins are electrically contacted to the plurality of ground test points, respectively.

In an embodiment, each of the first probe surfaces is coated with an insulating layer.

In one embodiment, the inner walls of the through holes in which the plurality of first probes are located each have an insulating layer.

In one embodiment, the probe holder further includes: a plurality of insulating members respectively disposed between the inner walls of each of the first probes and the through holes in which each of the first probes is located.

A test interface device includes a probe holder for electrically connecting a wafer to be tested, wherein the wafer to be tested has a plurality of test points, and the probe holder comprises: a base in a thickness direction thereof a plurality of through holes are disposed, wherein a portion of the pedestal between each of the through holes has at least one metal material; and a plurality of probes are respectively disposed in the plurality of through holes and are electrically connected to each other Sexually contacting the plurality of test points of the wafer to be tested. And a circuit board for electrically connecting to a measuring device, wherein the circuit board has a metal circuit electrically contacting the plurality of probes.

1‧‧‧Test interface device

2‧‧‧Samps to be tested

3‧‧‧Measurement device

10‧‧‧ probe holder

11‧‧‧ boards

20‧‧‧ Signal test point

21‧‧‧ Grounding test point

100‧‧‧Base

101‧‧‧through holes

102‧‧‧First probe

103‧‧‧Second probe

104‧‧‧Insulation

106‧‧‧metal layer

110‧‧‧Metal lines

1 shows a schematic diagram of a wafer test architecture of a test interface device in accordance with an embodiment of the present disclosure.

Figure 2 shows a cross-sectional view of a probe holder in accordance with another embodiment of the present disclosure.

1 shows a schematic diagram of a wafer test architecture of a test interface device in accordance with an embodiment of the present disclosure. As shown in FIG. 1, the wafer test architecture mainly includes a test interface device 1, a wafer 2 to be tested, and a measuring device 3. The wafer 2 to be tested has a plurality of test points 20,21. Test points 20, 21 include a plurality of signal test points 20 and a plurality of ground test points 21.

The test interface device 1 of the present disclosure includes a probe holder 10 and a circuit board 11. The probe base 10 is used to electrically connect the wafer to be tested 2, and includes a base 100 and a plurality of probes 102, 103. The susceptor 100 is provided with a plurality of through holes 101 in the thickness direction thereof, and a portion of the susceptor 100 interposed between each of the through holes 101 has at least one metal material. In the present embodiment, the base 100 is integrally formed of a metal material. Furthermore, the plurality of probes 102 and 103 are respectively disposed in the plurality of through holes 101 and correspond to the plurality of test points 20 and 21 electrically contacting the wafer 2 to be tested. As shown in FIG. 1 , the probes 102 and 103 include a plurality of first probes 102 and a plurality of second probes 103 , wherein the plurality of first probes 102 are electrically connected to the plurality of signal test points 20 respectively, and the plurality of signals The second probes 103 are electrically contacted with a plurality of ground test points 21, respectively. Furthermore, the circuit board 11 is used to electrically connect the measuring device 3, wherein the circuit board 11 has a metal line 110 that electrically contacts a plurality of probes 102, 103. In an embodiment, the metal line 110 can be in the form of a microstrip trace.

Continuing to refer to FIG. 1, since the susceptor 100 is made of a metal material, an insulating layer may be applied to the surface of each of the first probes 102 in order to avoid short circuit caused by contact with the first probe 102 for transmitting signals. 104, or an insulating layer 104 is disposed on the inner wall of the through hole 101 where the first probe 102 is located, and a plurality of independent insulating elements (not shown) may be disposed, and the insulating elements may be respectively disposed on each of the first The probe 102 and the inner wall of the through hole 101 where each of the first probes 102 are located.

When the wafer test is performed, the wafer 2 to be tested is tested by the signal test point 20 The signal is then passed through the first probe 102 of the probe holder 10 and the metal line 110 of the circuit board 11 and finally to the measuring device 3. The measurement device 3 performs analysis of various signals to confirm whether the function of the wafer 2 to be tested is normal.

FIG. 2 shows a cross-sectional view of a probe holder 10 in accordance with another embodiment of the present disclosure. The difference between FIG. 2 and FIG. 1 is that the susceptor 100 in FIG. 1 is entirely made of a metal material, but the susceptor 100 of FIG. 2 is mostly made of an insulating material (such as engineering plastic), and the susceptor 100 A portion between each of the through holes 101 has a metal layer 106. The arrangement of the metal layer 106 can also achieve the effect of electromagnetic shielding.

In summary, the present disclosure is characterized in that the base of the probe base is made of a metal material, the electromagnetic shielding capability of the probe is improved, and crosstalk and signal distortion between signals are reduced. The purpose of accurately transmitting test signals.

The present disclosure has been disclosed in the above preferred embodiments. However, it is not intended to limit the scope of the disclosure, and various modifications and changes can be made without departing from the spirit and scope of the disclosure. Therefore, the scope of protection of this disclosure is subject to the definition of the scope of the patent application.

Claims (8)

a probe holder for electrically connecting a wafer to be tested, wherein the wafer to be tested has a plurality of test points, the probe holder includes: a base, and a plurality of through holes are disposed in a thickness direction thereof, wherein the probe a portion of the pedestal between each of the through holes has at least one metal material; and a plurality of probes respectively disposed in the plurality of through holes and correspondingly electrically contacting the plurality of the wafers to be tested Test point. The probe holder according to claim 1, wherein the base is integrally formed of a metal material. The probe base of claim 1, wherein the plurality of test points comprise a plurality of signal test points and a plurality of ground test points. The probe base of claim 3, wherein the plurality of probes comprise a plurality of first probes and a plurality of second probes, the plurality of first probes electrically contacting the plurality of signal test points, respectively The plurality of second probes electrically contact the plurality of ground test points respectively. The probe holder of claim 4, wherein each of the first probe surfaces is coated with an insulating layer. The probe holder according to claim 4, wherein the inner walls of the through holes in which the plurality of first probes are located each have an insulating layer. The probe holder according to claim 4, further comprising: a plurality of insulating members respectively disposed between the inner walls of each of the first probes and the through holes in which each of the first probes is located. A test interface device includes: a probe holder for electrically connecting a wafer to be tested, wherein the wafer to be tested has a plurality of test points, and the probe holder comprises: a pedestal having a plurality of through holes in a thickness direction thereof, wherein a portion of the pedestal between each of the through holes has at least one metal material; and a plurality of probes are respectively disposed on the plurality of And a plurality of test points in the through hole and electrically contacting the wafer to be tested; and a circuit board for electrically connecting a measuring device, wherein the circuit board has a metal line, and the metal line is in electrical contact The plurality of probes.