TW201144814A - Probing apparatus for integrated circuit testing - Google Patents
Probing apparatus for integrated circuit testingInfo
- Publication number
- TW201144814A TW201144814A TW99118869A TW99118869A TW201144814A TW 201144814 A TW201144814 A TW 201144814A TW 99118869 A TW99118869 A TW 99118869A TW 99118869 A TW99118869 A TW 99118869A TW 201144814 A TW201144814 A TW 201144814A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode terminal
- integrated circuit
- substrate
- probe body
- circuit testing
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
A probing apparatus for integrated circuit testing at least includes substrate, a probe body and a bypass capacitor. The substrate is fixed in an external conductor after an internal conductor is filled with an insulating material. One end of the substrate has a section, so that both the internal conductor and the insulating material are exposed on the section. One end of the probe body is electrically connected to the internal conductor exposed on the section. A tip end of the probe body is used for contacting a pad of an element to be tested. The bypass capacitor has a fist electrode terminal and a second electrode terminal. The first electrode terminal is electrically connected to the probe body, and the second electrode terminal is connected to the external conductor at the end of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99118869A TWI397695B (en) | 2010-06-10 | 2010-06-10 | Probing apparatus for integrated circuit testing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99118869A TWI397695B (en) | 2010-06-10 | 2010-06-10 | Probing apparatus for integrated circuit testing |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201144814A true TW201144814A (en) | 2011-12-16 |
TWI397695B TWI397695B (en) | 2013-06-01 |
Family
ID=46765725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99118869A TWI397695B (en) | 2010-06-10 | 2010-06-10 | Probing apparatus for integrated circuit testing |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI397695B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI564567B (en) * | 2014-12-23 | 2017-01-01 | Mpi Corp | Probe card and its probe module and signal probe |
TWI564571B (en) * | 2014-11-14 | 2017-01-01 | Mpi Corp | Cantilever high frequency probe card |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI647467B (en) * | 2018-06-05 | 2019-01-11 | 中華精測科技股份有限公司 | Chip test module capable of suppressing impedances of different frequency bands of a power source |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3944196B2 (en) * | 2004-06-28 | 2007-07-11 | 日本電産リード株式会社 | Probe device and substrate inspection device |
CN100535668C (en) * | 2006-07-13 | 2009-09-02 | 旺矽科技股份有限公司 | High frequency probe card |
TW200829922A (en) * | 2007-01-08 | 2008-07-16 | Microelectonics Technology Inc | High frequency probe |
TWI314651B (en) * | 2007-01-25 | 2009-09-11 | Asp Test Technology Ltd | High frequency probe assembly for ic testing |
-
2010
- 2010-06-10 TW TW99118869A patent/TWI397695B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI564571B (en) * | 2014-11-14 | 2017-01-01 | Mpi Corp | Cantilever high frequency probe card |
TWI564567B (en) * | 2014-12-23 | 2017-01-01 | Mpi Corp | Probe card and its probe module and signal probe |
Also Published As
Publication number | Publication date |
---|---|
TWI397695B (en) | 2013-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |