TW201144814A - Probing apparatus for integrated circuit testing - Google Patents

Probing apparatus for integrated circuit testing

Info

Publication number
TW201144814A
TW201144814A TW99118869A TW99118869A TW201144814A TW 201144814 A TW201144814 A TW 201144814A TW 99118869 A TW99118869 A TW 99118869A TW 99118869 A TW99118869 A TW 99118869A TW 201144814 A TW201144814 A TW 201144814A
Authority
TW
Taiwan
Prior art keywords
electrode terminal
integrated circuit
substrate
probe body
circuit testing
Prior art date
Application number
TW99118869A
Other languages
Chinese (zh)
Other versions
TWI397695B (en
Inventor
Cheng-Yi Wang
Original Assignee
Allstron Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allstron Inc filed Critical Allstron Inc
Priority to TW99118869A priority Critical patent/TWI397695B/en
Publication of TW201144814A publication Critical patent/TW201144814A/en
Application granted granted Critical
Publication of TWI397695B publication Critical patent/TWI397695B/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A probing apparatus for integrated circuit testing at least includes substrate, a probe body and a bypass capacitor. The substrate is fixed in an external conductor after an internal conductor is filled with an insulating material. One end of the substrate has a section, so that both the internal conductor and the insulating material are exposed on the section. One end of the probe body is electrically connected to the internal conductor exposed on the section. A tip end of the probe body is used for contacting a pad of an element to be tested. The bypass capacitor has a fist electrode terminal and a second electrode terminal. The first electrode terminal is electrically connected to the probe body, and the second electrode terminal is connected to the external conductor at the end of the substrate.
TW99118869A 2010-06-10 2010-06-10 Probing apparatus for integrated circuit testing TWI397695B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99118869A TWI397695B (en) 2010-06-10 2010-06-10 Probing apparatus for integrated circuit testing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99118869A TWI397695B (en) 2010-06-10 2010-06-10 Probing apparatus for integrated circuit testing

Publications (2)

Publication Number Publication Date
TW201144814A true TW201144814A (en) 2011-12-16
TWI397695B TWI397695B (en) 2013-06-01

Family

ID=46765725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99118869A TWI397695B (en) 2010-06-10 2010-06-10 Probing apparatus for integrated circuit testing

Country Status (1)

Country Link
TW (1) TWI397695B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564567B (en) * 2014-12-23 2017-01-01 Mpi Corp Probe card and its probe module and signal probe
TWI564571B (en) * 2014-11-14 2017-01-01 Mpi Corp Cantilever high frequency probe card

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647467B (en) * 2018-06-05 2019-01-11 中華精測科技股份有限公司 Chip test module capable of suppressing impedances of different frequency bands of a power source

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3944196B2 (en) * 2004-06-28 2007-07-11 日本電産リード株式会社 Probe device and substrate inspection device
CN100535668C (en) * 2006-07-13 2009-09-02 旺矽科技股份有限公司 High frequency probe card
TW200829922A (en) * 2007-01-08 2008-07-16 Microelectonics Technology Inc High frequency probe
TWI314651B (en) * 2007-01-25 2009-09-11 Asp Test Technology Ltd High frequency probe assembly for ic testing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564571B (en) * 2014-11-14 2017-01-01 Mpi Corp Cantilever high frequency probe card
TWI564567B (en) * 2014-12-23 2017-01-01 Mpi Corp Probe card and its probe module and signal probe

Also Published As

Publication number Publication date
TWI397695B (en) 2013-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees