JP2008304254A - Inspection socket and manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection socket capable of reducing a reactance component and a stray capacitance exerting an influence on a characteristic regardless of a terminal shape of a general package, heightening measurement accuracy, and reducing a stress generated when crimping an inspection object. <P>SOLUTION: This inspection socket is equipped with a substrate loaded with the inspection object; wiring provided on the substrate surface, and arranged to be in contact with a terminal on the inspection object side with thin thickness in order to acquire an electric characteristic of the inspection object; and a sucking device for sucking the air from one or more through holes provided in the substrate, and vacuum-adsorbing the inspection object onto the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a passive circuit element that operates in a high frequency band, an inspection socket that inspects and measures an active circuit element, and a method of manufacturing a semiconductor device using the inspection socket.

  FIG. 1 is a diagram showing an example of a semiconductor device incorporating a passive circuit element operating in a high frequency band and an active circuit element. The semiconductor device 10 has a structure in which electrode terminals 12 such as a power supply voltage and a GND terminal are exposed on one surface of a cubic sealing resin shown in FIG. 2. Description of the Related Art Conventionally, an inspection socket used for inspection in a manufacturing process of a semiconductor device 10 that is an object to be inspected is a base 1 for mounting the object 10 to be inspected, as shown in FIGS. 1 for obtaining electrical characteristics of a substrate 2 provided on the substrate 1, a coaxial connector 3 fixed to the base 1 and electrically connected to the outside, and an object to be inspected 10 provided on the substrate 2. A wiring 4 and a contact 8 for electrically connecting the terminal 12 of the object to be inspected 10 and the wiring 4 on the substrate are provided, and the inspection object 10, the contact 8 and the wiring 4 on the substrate 2 are connected at the time of inspection. Was configured to be crimped by an insulating bar 11.

  FIG. 4 is a top view of a conventional inspection socket. The contact 8 is an L-shaped good conductor, the contact 14 is an elongated cubic good conductor, and the contact holding device 9 made of resin as shown in FIG. 4 is connected to the contact 8 and the GND contact 14 with the terminal 12 on the inspection object side. 4 is held at a connecting position. The contact 8 is held by being fitted into a support 13 provided in the contact holding device 9 so that it can be easily replaced even when the electrical characteristics of the contact 8 deteriorate.

  FIG. 5 shows a conventional inspection flow using the inspection socket having such a configuration. The object to be inspected 10 is accommodated in a resin supply tray, and is adsorbed by bringing the tip of the presser bar 11 into contact with the surface of the object to be inspected 10 and sucking air from the tip of the presser bar 11. Thereafter, the presser bar moves onto the inspection substrate 2 and the inspection object 10 is pressed against the substrate 2 to start the inspection. Here, the electrical characteristics are determined, and the PASS product and FAIL product are classified and carried out to the tray. Here, if the tray containing the FAIL product and the supply tray have the same structure, re-inspection can be performed by using the tray containing the FAIL product as the supply tray.

  In the case of the conventional inspection socket configuration, when the object to be inspected 10 and the substrate 2 are pressure-bonded, the contact 8 exists in the signal path, so that a self-inductance component of the contact 8 and a parasitic capacitance between adjacent contacts 8 are added. Will be. Therefore, the inductance component and parasitic capacitance that affect the characteristics are different compared to when mounted on the product for practical use, so there is a problem that the characteristics are different from those in actual use and the measurement accuracy is deteriorated. It was.

  Further, the presser bar 11 sucks air from its tip and holds the object to be inspected 10 so that the presser bar 11 is carried out and moved from the stored tray and is mechanically pressure-bonded to the contact 8 in this state. Yes. For this reason, a positional deviation of the inspection object 10 accommodated in the tray on the tray, a horizontal deviation between the tip of the holding bar 11 and the surface of the inspection object 10 and the surface of the substrate 2 occur. As a result, the connection between the terminal 12 and the contact 8 of the object to be inspected 10 is poor, the passive circuit element or the active circuit element is damaged due to insufficient electrical withstand voltage of the object 10 to be inspected, and the appearance of the package or terminal is damaged. There was also a problem that would be missed.

  As a method for solving the above-described problem, for example, there is an ultrahigh frequency band circuit element inspection jig described in Patent Document 1. Conventional jigs are either soldered or crimped with an insulation bar. In the case of soldering, the appearance of the lead is lost when solder is placed on the lead terminals of the object to be inspected. The circuit element is destroyed by the current, and the insulator terminal bar destroys the lead terminal by a large pressure. In addition, the insulator bar has a drawback in that the measurement accuracy is lowered due to the change in the characteristic impedance of the stripline.

The ultra-high frequency circuit element inspection jig described in Patent Document 1 has means for crimping and connecting to a strip line having a characteristic impedance by directly applying a gas pressure to a lead terminal of an object to be inspected. The lead terminal can be connected to a strip line having a predetermined characteristic impedance without damaging the lead terminal portion or the appearance, thereby increasing the measurement accuracy.
JP-A-63-201574

  As described above, the super-high frequency band circuit element inspection jig described in Patent Document 1 is effective if the terminal of the object to be inspected has a QFP type shape, but it is effective on the back surface of the package like the QFN type or WLCSP. There is a problem in that there is a terminal, which cannot be realized in a package in which gas pressure cannot be directly applied to the terminal.

  The present invention reduces the reactance component that affects the characteristics regardless of the terminal shape of a general package, the stray capacitance, increases the measurement accuracy, and reduces the stress generated when the object to be inspected is crimped. An object of the present invention is to provide a method of manufacturing a semiconductor device using the inspection socket.

  In order to solve the above problems and achieve the object, an inspection socket provided by the present invention includes a pedestal on which an object to be inspected is mounted, a board provided thereon, and an external connection fixed to the pedestal. A coaxial connector, wiring provided on the surface of the substrate, for obtaining electrical characteristics of the object to be inspected, one or more through holes provided in the base and the substrate, and suction for sucking air from the through holes The apparatus is equipped with a device, and by sucking air from the surface of the object to be inspected through the through hole and crimping the object to be inspected and the substrate, the wiring formed on the substrate and the object to be inspected can be used without using a contact. Make sufficient contact with the terminals. For this reason, it is possible to reduce the reactance component and the stray capacitance that affect the characteristics and increase the measurement accuracy.

  In addition, according to the present invention, since the object to be inspected is pressure-bonded to the substrate by sucking air from the through hole, the pressure in the through hole does not decrease if the position of the object to be inspected is displaced. Thereby, the mechanical stress to a to-be-inspected object can be reduced. Furthermore, by detecting the pressure in the through-hole, it can be detected that the object to be inspected is not correctly connected, and the object to be inspected can be detected before applying a voltage such as an inspection voltage to the object to be inspected. It is possible to reduce electrical stress applied to the object to be inspected by performing rearrangement.

  Further, by using this inspection socket, the present invention can also provide a method for manufacturing a semiconductor device having an inspection process for inspecting the semiconductor device. The inspection process consists of a procedure for adsorbing a semiconductor device, which is an object to be inspected, to a substrate by a suction device, and at the time of the adsorption, the pressure in the through-hole is monitored by a sensor. A procedure for determining whether or not the wiring is in contact with the wiring; and a procedure for determining the electrical characteristics of the device by applying electricity to the semiconductor device when it is determined that the terminal of the semiconductor device is in contact with the wiring. Prepare.

  Since the present invention has the above-described configuration, it can be inspected in substantially the same state as actually mounted, and a high frequency band (especially 300 MHz to 3 GHz) that does not need to consider unnecessary reactance components and stray capacitance due to contacts. ) Inspection is possible.

  Furthermore, according to the present invention, unless the object to be inspected is arranged at a normal position, the air pressure in the through hole does not decrease, so that the mechanical stress on the object to be inspected is reduced, and the damage and appearance of the terminal portion are reduced. Missing is also reduced. Further, since no voltage or external signal necessary for measuring the electrical characteristics is applied to the object to be inspected, stress due to electrical or heat is eliminated, so that quality can be improved.

  Embodiments of the present invention will be described with reference to the drawings. In this embodiment, the present invention is embodied as a high-frequency band inspection jig used in an inspection process in a method for manufacturing a high-frequency semiconductor device operating at 300 MHz to 3 GHz.

  6 and 7 show a high-frequency band inspection jig according to an embodiment of the present invention in a sectional view and a plan view. The high-frequency band inspection jig includes a pedestal 1 on which an object to be inspected 10 having terminals 12 for obtaining electrical characteristics is mounted, a substrate 2 provided so as to be replaceable thereon, and the pedestal 1 A coaxial connector 3 for external connection fixed to the substrate, a wiring 4 formed on the substrate 2 for obtaining electrical characteristics of the object to be inspected 10, and an object to be inspected on the substrate 2 at a predetermined position. The housing 7 is provided with a gradient so as to be guided to the base plate 1, one or more through holes 5 provided in the base 1 and the substrate 2, and a suction device 6 for sucking air from the through holes 5. In addition, a presser bar 11 is provided above the substrate 2 as an auxiliary.

  As shown in FIGS. 6 and 7, the inspection object 10 is arranged in a rectangular area inside the housing 7. In this region, the portion of the wiring 4 that is in contact with the lead terminal on the inspection object 10 side is provided so as to face the terminal 12 of the inspection object 10 accurately. As shown in FIG. 1, the object to be inspected 10 has a structure in which a plurality of terminals 12 such as a power supply voltage and a GND terminal are exposed on one surface of a cube made mostly of resin. The GND terminal and the other six terminals are a power supply voltage terminal and an input / output terminal. The contact portion of the wiring 4 is arranged in accordance with the shape of the lead terminal of the inspection object 10 as described above. The wiring 4 is connected to the outside via the coaxial connector 3, and the electrical characteristics of the inspection object 10 are determined when the lead terminal of the inspection object 10 comes into contact with the wiring 4.

  The suction device 6 has a cylindrical structure, and sucks air toward the lower side of the drawing through the through hole 5 provided in the substrate 2 or the pedestal 1 so that the inspection object 10 can be crimped to the substrate 2 at the time of inspection. It is out. In this embodiment, the through hole 5 is located at a position corresponding to the center of the inspection object 10 when the contact portion of the wiring 4 and the lead terminal on the inspection object 10 side are correctly opposed to each other. It arrange | positions so that the GND terminal of the thing 10 may be opposed.

  With such a configuration, when the object to be inspected 10 and the substrate 2 are attracted and pressure-bonded by the suction device 6, the terminal 12 and the thin wiring 4 on the substrate 2 are in direct contact with no gap. As described above, the self-inductance component of the contact 8 conventionally used, the parasitic capacitance between the contacts 8 and the like are eliminated, and the mounting state is almost equal.

  Conventionally, when the object to be inspected 10 is crimped to the contacts 8 and 14, the presser bar 11 is lowered by a predetermined distance from above, so that the thickness of the object to be inspected 10 varies, the object to be inspected, and the like. When the positional relationship between the object and the contacts 8 and 14 is deviated, there is a possibility that the mechanical stress from above is more than necessary. Furthermore, since the inspection of the electrical characteristics is started even if there is a deviation between the object 10 to be inspected via the contacts 8 and 14 and the wiring 4 on the substrate 2, the electrical application state differs from the usage state, There was also the possibility of stress being applied to the test object.

  On the other hand, according to the configuration according to the embodiment of the present invention, when the inspection object 10 exists in the correct position, the suction device 6 sucks air from the surface of the inspection object 10 on the side of the substrate 2 and presses it. This has little to do with variations in the thickness of the inspection object 10.

  Further, when the inspection object 10 does not exist at the correct position, the through hole 5 is not completely sealed, and the air pressure does not drop even if the suction device 6 sucks air. For this reason, even if the position of the inspection object 10 on the substrate 2 is displaced, the mechanical stress on the inspection object 10 can be reduced.

  Further, in the inspection jig according to the present embodiment, when the inspection object 10 blocks the upper portion of the through hole 5 in order to detect whether the inspection object exists at the correct position, the pressure in the through hole 5 is accurate. A vacuum sensor 15 is provided as means for detecting whether the pressure is lower than a predetermined pressure at which inspection is possible. If the atmospheric pressure does not decrease, it is determined that the terminal 12 of the object to be inspected 10 is not in proper contact with the wiring 4 and no electrical application is performed, so that it is possible to avoid applying electrical stress to the object 10 to be inspected.

  In the embodiment of the present invention, the object to be inspected is a QFN type having terminals on the back surface of the package. However, a package that can maintain the hermeticity of the back surface of the substrate 2 and the object to be inspected without a terminal in the through-hole portion ( For example, any QFP type can be applied. Moreover, although the shape of the through-hole 5 is circular, any shape may be used as long as the load on the object to be inspected is optimal, such as a donut shape or a rectangle, depending on the terminal shape of the object to be inspected 10. . When two or more through holes 5 are provided, a vacuum sensor is provided for each through hole, and it is determined whether the terminal 12 of the inspection object 10 is in proper contact with the wiring 4 based on the detection result of each sensor. You can also. In this case, the predetermined pressure at which inspection can be performed may be varied depending on each through hole.

  FIG. 8 shows an inspection flow using the high-frequency band inspection jig configured as described above. First, the object to be inspected 10 is stored in a resin supply tray, and the tip of the presser bar 11 is brought into contact with the surface of the object to be inspected 10 and sucked by sucking air from the tip of the presser bar 11. Thereafter, the presser bar moves onto the inspection substrate 2 and lowers the inspection object 10 to the housing 7. As shown in FIGS. 6 and 7, the housing 7 is provided with a taper so as to be inclined downward in the direction of the portion where the terminal 12 of the wiring 10 to be inspected 10 contacts. Even if lowered, the inspection object 10 is guided to a position where the terminal 12 and the wiring 4 are in contact with each other due to the taper. This taper avoids a large misalignment.

  Here, the suction device is operated and pressed onto the substrate 2. At this time, the pressure in the through hole is monitored by a vacuum sensor, and it is determined whether or not the terminal of the inspection object 10 is in proper contact with the wiring 4. If the atmospheric pressure is sufficiently lowered, it is determined that the terminal of the inspection object 10 and the wiring 4 are in contact, and the inspection is started. When the atmospheric pressure is not lowered, it is determined that the terminal 10 of the inspection object 10 and the wiring 4 are not in proper contact, the suction to the substrate is released, and the inspection object 10 is again adsorbed with the holding bar. , Put it back. In this way, if the contact determination is PASS, the inspection starts and the electrical characteristics are determined. When the electrical characteristics are determined, the suction to the substrate is released, and the object to be inspected is classified into a PASS product and a FAIL product according to the determination result of the electrical characteristics, and is carried out to the tray.

  As described above, according to the high-frequency band inspection jig of the present embodiment, the self-inductance component of the contact 8 and the parasitic capacitance between the contact 8 and the contact 8 that have been conventionally used are eliminated and are almost equal to the mounted state. Therefore, the high frequency semiconductor device can be accurately inspected in the same state as the actual use state. In addition, the high-frequency band inspection jig in the present embodiment is provided with a tapered housing and a vacuum sensor, so that the object to be inspected can be positioned accurately, and the terminal portion is damaged or damaged. Is also reduced.

  The present invention is useful in inspection and measurement of passive circuit elements and active circuit elements operating in a high frequency band.

A figure showing an example of the external shape of the inspection object Cross-sectional view of a conventional inspection jig Plan view of conventional inspection jig Outline drawing of conventional inspection jig contact Inspection flow using conventional jigs Sectional drawing of the inspection jig for high frequency bands of an embodiment concerning the present invention The top view of the inspection jig for high frequency bands of an embodiment concerning the present invention Inspection flow using the high-frequency band inspection jig of the embodiment according to the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pedestal 2 Board | substrate 3 Coaxial connector 4 Wiring 5 Through-hole 6 Suction device 7 Housing 8 Contact 9 Contact holding device 10 Inspected object 11 Bar 12 Terminal 13 Post 14 GND contact 15 Vacuum sensor

Claims (5)

A substrate on which the object to be inspected is mounted;
Wiring provided on the surface of the substrate and arranged to come into contact with a terminal on the inspection object side with a small thickness in order to obtain electrical characteristics of the inspection object;
An inspection socket comprising: a suction device for sucking air from one or more through holes provided in the substrate and vacuum-adsorbing the object to be inspected to the substrate.   The inspection socket according to claim 1, wherein the board is mounted on a pedestal, and a coaxial connector for external connection connected to the wiring is fixed to the pedestal.   A taper surface provided on the substrate, surrounding a contact portion with the terminal on the inspection object side of the wiring, and having a tapered surface inclined downward in the contact portion direction, is installed in the inspection socket. The inspection socket according to claim 1, further comprising a housing that guides the terminal and the wiring to a predetermined position so that the terminal contacts the wiring.   The inspection socket according to claim 1, wherein the suction device includes a sensor that detects a pressure in a through hole sealed by the inspection object. A method of manufacturing a semiconductor device comprising an inspection step of inspecting a semiconductor device using the inspection socket according to claim 4,
The inspection step is
A procedure for adsorbing the semiconductor device as the inspection object to the substrate by the suction device;
A procedure for monitoring the pressure in the through hole by the sensor at the time of the adsorption, and determining whether the terminal of the semiconductor device is in contact with the wiring from the detection result of the sensor;
And a step of determining the electrical characteristics of the device by applying electricity to the semiconductor device when it is determined that the terminal of the semiconductor device is in contact with the wiring. Method.

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