201245727 六、發明說明： 【發明所屬之技術領域】 本發月係為—麵針結構，尤其是-麵f式探針卡結 構除具有鱗疋位外’亦能具備能被縱向麗縮的彈性，維 持測試過程中與外部構件良好的接觸狀態。 、 L无珂技術】 半導體工業中之晶片尚未封裝前，為避免封裝到不良晶 2辅____咖_序，物晶以探針 項功此的電性測試作業，進而筛選出其晶片的品質良 良叩而進行修補或報廢’而良品則再進 工程，以減少封裝資源的浪費。 ^ 於是，探針卡_多數之探針作域制物(如晶片）之間 的時電性接觸，為使其穩固紮在待測物上(如晶片上之锡 =上探 = 峨她_輪)±，#探針^ 測試晶片以目距之預定距離對應接觸 、 tm以排除不必要的電性干擾。 物品料歧針財—針㈣㈣做測試 早腳式抵針用以插設組裝方式組合 、疋丄，使雜針無法制於·位置巾，因此組展完 201245727 成後藉由環氧樹脂(Epoxy)加以固定’可保持探針固定於χ 轴及Y轴方向之偏轉’但該探針之針尖部卻無法控制z軸方 向之偏轉，亦無法精準定位且接觸到待測物(如晶片）的正確位 置甚而導致晶片破裂造成損失，抑或出現精確度不夠而致 使不良率增加等問題。 【發明内容】 有鑑於上述習知技藝產生之問題，本發明人思考設計改 良之懸臂式探針卡結構以解決此問題。 本發明之一目的，是提供一種懸臂式探針卡結構，為一 U11之傳導元件以導引接觸電性機構之探針設計，該探 針能穩定軸Ic元件及電路板之間作紐連接的導電元件。 本發明之另—目的，战供—種懸臂式探針卡結構，其 懸臂式之探針具有定位件，能雜針_精準度，使探針穩 固在適當位置之中。 鐘於本發明之目的’提供—種縛式探針卡結構，其包 含至少-探針’該探針係具有-探針身部、—連接於該探針 身部-端之針尖部、-連接於該探針㈣另—端之板片，i 中，該板片至少有-個，該糾之—端_以膠體固定於絕 緣機構(如探針固定座或固定板)上，該板片之另一端係連接定 位件及訊麟料，其巾，歡娜及該峨料件可至少 201245727 一個以上，而該訊號傳導件係以表面接觸方式(如表面接著技 術或焊接)用來與外部構件作電性接觸。藉由定位件與訊號傳 導件來達成精準定位及穩定訊號傳導之效果。 本心明所&供之一種懸臂式探針卡結構，可具以下優點： ⑴本發明之探針卡，射之糾-敵_藉，及其定 位件之固定針位功能’兩者之綜效結果，使得探針更精 確的紮點於剌物上，可消除待測物(如因紮點錯 誤而造成待測物品之損害。 (2)定位件可穩固探針位置可增加測試的頻率，使探針卡可 不用經常拆解下來難針位，減少祕的次數、節省維 :的成本’進而翻增加機台連續測試的稼動率。 兹為使料麵㈣於糊賴有進—步雜，以及為 3 一技術佩之人貞驗據此書⑽財施方式據以 :故謹佐以較佳之實施方式，配合圖式、相同元件之元 減爾㈣偏料魄明如後。 L賞細方式】 明之探:=:Γ係為本發明之探針外觀示意圖。相 端(如部15顺成。該探針身部14之其中— 201245727 晶片之優劣；連接於該探針身部14之另一端（如圖中探針身 部14之上端）係具有至少一板片13。該板片13之一端（如圖 中板片13之上端）係具有定位件12以及訊號傳導件u相連 接，該訊號傳導件1丨可為半圓弧曲面體。其中，上述之該板 片I3、該定位件12與該訊號傳導件11係分別以兩個板片13、 兩個定位件12，及—訊麟導件11為舉例，僅就以下之較佳 例作示意，但不以此為限，視需求調整該板片13、該定位件 12以及該訊號傳導件u之元件個數及其形狀，任何符合專利 精神之等效增加及減少皆在範圍之内。 δ月參閱第二圖，係為本發明之第一實施例在使用時之剖 面不意圖。該探針卡2包括有電路板3、墊片4、固定單元5、 膠體6、定位件7，以及探針卜本實施例中，該電路板3之 頂面係具作線路之訊號金屬突墊31 (如)，該墊片4介於 電路板3與固定單元5之間，該㈣4(又娜片或薄板)為絕 緣材料’其用途為輕該探針卡2之水平高度，視高度調整 之需求增減片4之厚度，使探針卡2上之魏個探針！ 之=平達到平衡，以確保制物(如晶片）進人戦時，不會 因板針1的高度不平整造成損害。該©定單元5位於塾片4 之下方，並形成有複數個容置空間51，而該容置空間Μ供該 複數個探針1安裝於射，該探針1之糾13，本發明運用 在於该-板片13連接於探針身部14之懸臂，另—板片^則 連接於該訊號傳導件n及定位件 、 疋诅件12之上，上述之該板片13 201245727 之域大小並不對稱，其用途在板片13之周圍塗佈膠體6 用以固定探針1位置，該膠體6之材質係為環氧樹脂(Epoxy) 或具黏固膠性之材質’使該探針丨之該板片i3與該定位件 12係具有固定針位於絕緣機構上(如探針固定座或固定單 元)或使其針位H]定於預定位置之中，藉由朗定單元5與 該膠體6以固定該複數個探針丨在該探針卡2⑽位置，同 時，位於财削⑽R較錄12，也_著_固探 針1僅能猶直方向受縣無法做橫向或其他方向的移動。 當該探針1被固定時’該訊號傳導件u與電路板3上之訊號 金屬突墊31做電性接觸，使該複數個探針丨與電路板3的電 路兩者導iff性連接，！|由娜们之訊號料件丨丨以貫 穿、挖孔或穿透該電路板3齡，使觀麟導件u黏合於 該電路板3頂面之該金屬接觸突墊31 _觸點作電性連接， 其中，黏合可以表面接觸技術，如表面接著技術(s㈣咖201245727 VI. Description of the invention: [Technical field to which the invention pertains] The present month is a face-to-needle structure, and in particular, the face-f-type probe card structure can have elasticity that can be longitudinally retracted in addition to having a scale-like position. , maintain good contact with external components during the test. , L flawless technology] Before the wafer in the semiconductor industry has not been packaged, in order to avoid packaging into the bad crystal 2 auxiliary _ coffee _ order, the object crystal to do the electrical test work of the probe item, and then screen out the wafer The quality is good and repaired or scrapped' while the good products are re-engineered to reduce the waste of packaging resources. ^ Thus, the probe card _ the majority of the probe as a time-to-electric contact between the domain material (such as the wafer), in order to make it firmly attached to the object to be tested (such as the tin on the wafer = up = = 峨 she _ Wheel) ±, # probe ^ Test the wafer at a predetermined distance from the eye distance corresponding to the contact, tm to eliminate unnecessary electrical interference. Item material miscellaneous needles - needle (four) (four) to test the early foot type of needle to insert the assembly method combination, 疋丄, so that the needle can not be made in the position of the towel, so the group after the completion of 201245727 by epoxy resin (Epoxy Fixing 'can maintain the deflection of the probe in the y-axis and Y-axis direction' but the tip of the probe cannot control the deflection in the z-axis direction, nor can it be accurately positioned and contacted with the object to be tested (such as a wafer) The correct position can cause damage to the wafer, or problems such as insufficient accuracy and increased defect rate. SUMMARY OF THE INVENTION In view of the problems arising from the above-described prior art, the inventors have considered designing a modified cantilever probe card structure to solve this problem. An object of the present invention is to provide a cantilever type probe card structure, which is a U11 conductive element for guiding a probe of a contact electrical mechanism, and the probe can stabilize the connection between the axis Ic component and the circuit board. Conductive element. Another object of the present invention is a warp-type cantilever probe card structure in which the cantilever probe has a positioning member capable of pinching _ precision to stabilize the probe in position. For the purpose of the present invention, the present invention provides a splicing probe card structure comprising at least a probe having a probe body, a tip attached to the body of the probe, and Connected to the other end of the probe (4), i, the plate has at least one, the correcting end - is fixed by a glue on an insulating mechanism (such as a probe fixing seat or a fixing plate), the plate The other end of the piece is connected with the positioning piece and the news material, and the towel, the joy and the material can be at least 201245727, and the signal conducting part is used for external contact by surface contact (such as surface following technology or welding). The member is electrically contacted. The positioning and signal transmission are used to achieve accurate positioning and stable signal transmission. The present invention provides a cantilever type probe card structure, which has the following advantages: (1) the probe card of the present invention, the correcting of the shot, the enemy, and the fixed position function of the positioning member. The result of the comprehensive effect makes the probe more precise on the object, which can eliminate the object to be tested (such as the damage of the object to be tested due to the error of the sticking point.) (2) The positioning part can stabilize the position of the probe to increase the test. The frequency makes the probe card not need to be disassembled frequently to reduce the needle position, reduce the number of secrets, save the cost of the dimension: and then increase the rate of continuous testing of the machine. Here, in order to make the material surface (four) in the paste - According to this book (10), the method of financial management is based on the following: Therefore, it is better to use the preferred embodiment, with the pattern, the same component, and the fourth component. L 细 细 】 】 】 】 】 : : : = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = The other end of the portion 14 (the upper end of the probe body 14 in the figure) has at least one plate 13. The plate 13 One end (the upper end of the plate 13 in the figure) is connected with a positioning member 12 and a signal conducting member u, and the signal conducting member 1丨 can be a semi-circular curved surface body. The above-mentioned plate I3 and the positioning member are respectively arranged. 12 and the signal conducting member 11 are respectively exemplified by two plates 13, two positioning members 12, and -Xinlin guide 11, and only the following preferred examples are illustrated, but not limited thereto. It is required to adjust the number of components of the plate 13, the positioning member 12 and the signal conducting member u and their shapes, and any equivalent increase and decrease according to the patent spirit are within the scope. The first embodiment of the present invention is not intended to be used in a cross section. The probe card 2 includes a circuit board 3, a spacer 4, a fixing unit 5, a colloid 6, a positioning member 7, and a probe. The top surface of the circuit board 3 is provided with a signal metal pad 31 (for example), which is interposed between the circuit board 3 and the fixing unit 5, and the (4) 4 (also a sheet or a thin plate) is an insulating material. The purpose is to light the level of the probe card 2, and increase or decrease the thickness of the sheet 4 according to the height adjustment requirement. The probes on the needle card 2 are balanced to ensure that the workpiece (such as the wafer) is not damaged by the unevenness of the height of the needle 1 when the workpiece (such as a wafer) enters the cymbal. The determinate unit 5 is located on the cymbal 4 A plurality of accommodating spaces 51 are formed below, and the accommodating space Μ is used for mounting the plurality of probes 1 , and the probe 1 is calibrated 13 , and the present invention is applied to the slab 13 connected to the probe The cantilever of the body portion 14 is connected to the signal conducting member n and the positioning member and the member 12, and the above-mentioned plate 13 201245727 is asymmetrical in size and used in the plate. 13 is coated with a colloid 6 for fixing the position of the probe 1. The material of the colloid 6 is epoxy resin (Epoxy) or a material having a sticky adhesive property, so that the probe is placed on the plate i3 and the positioning The piece 12 has a fixed needle on the insulating mechanism (such as a probe holder or a fixed unit) or has its needle position H] set in a predetermined position, by fixing the unit 5 and the colloid 6 to fix the plurality of probes.丨In the position of the probe card 2 (10), at the same time, located in the financial (10) R recorded 12, also _ _ solid probe 1 can only be in the direction of the county can not be Do horizontal or other directions of movement. When the probe 1 is fixed, the signal conducting member u makes electrical contact with the signal metal pad 31 on the circuit board 3, so that the plurality of probes are connected to the circuit of the circuit board 3, ! The metal contact pad 31 is fused to the top surface of the circuit board 3 by the material of the Na's signal to penetrate, dig or penetrate the circuit board. Sexual connection, where bonding can be surface contact technology, such as surface bonding technology (s (four) coffee
Mounting Technology; SMT)或焊接技術以焊料焊至電連接點 等方式，如《更可_板3貫料穿透之孔洞中填充 具絕緣材質之膠體6，郷體6係為魏樹脂(E陶)或黏膠 材質’以阻隔其焊料（如錫）沾錫或其他導電材質流入孔洞 中，如此轉引傳導的方式使购_效果更佳。進行測試 時’探針卡2在測試機台上會進行移動，使探針丨之針尖部 15靠近待測元件(例如：晶片等測魏置）時，該探針（姐亥 訊號傳導件U之表面與該待測元件上的待測物(例如：晶片 201245727 上之錫球)做直接的電性訊號接觸以_出待測元件上 優劣。此外’該電路板3與固定單元5，除了能以螺固裝= 其他輔助ϋ定裝置減合在,，村_定位件7貫穿於 該電路板3、該墊片4，以及定單元5上使得該探針卡 2之各構件獨意移動及鋪，且穩固地結合在—起，藉此能 將本發明卿聰針卡產^上的伽。 田此 >請參閱第三圖，係為第二實施例在使用時之剖面示意圖。 雜針卡2包括有電路板3、塾片4、固定單元5、容置空間 5卜膠體6，以及複數個探針i。第—實施例與本實施例= 異在於該探針1之訊號傳導件11係為可彎曲之彈性體，且備 承受被垂魏向壓_雜，維制試難巾良好的接觸狀 態，能有效地延續探針的使用壽命。然而，其該訊號傳導件^ 之彈性體形狀圖示呈現僅為彈性體之其中—種形式，不因此為 限。本實施例中，該探針j被固定時，該訊號傳導件Η之頂 面係與電路板3上作為線路的訊號金駿塾&相接觸，使探 針1與電路板3兩者相電性連接。當欲進行測試時，將該探針 卡2進仃獅，使該探針卡2之探針丨漸漸靠近鱗測品(如 晶片或電路板）’該探針1如該針尖部15與制品之線路的 錫球直接細’進行紐_與_稀。本實_之實施方 气專同圖之本發明第—實施例在使用時之示意圖之實 施方式’為符合專利發明巾請簡潔之精神，故在此不再--贅 201245727 請同時參閱第四圖及第五圖，係為第三實施例在使用時之 剖面示意圖及第四實施例在使用時之剖面示意圖。為增強測試 過輊中捸針卡2能承受之壓縮程度，仍保持其構造之堅固性， 本實施例之實補樣舰賴料元8(如麵贼補強板)提 升探針卡2内部構造之穩固，除了固定單元5之外，更可有一 補強單兀8作為增酶針卡2的堅雖，翻強單元8之材質 可為銘合金或不鏽鋼之金屬。如第四騎示，該翻單元8可 配置在該塾片4與定單元5之間，如此可加以平衡雜片 4之穩定性’因應該墊片4厚度之需求，調整該補強單元8之 回度，又如第五騎示，該補強單元8亦可配置在删定單元 5之下方，間賴固定單元5可能因探針卡2受縱向壓縮造 成的機構無法承受之财。上狀第四圖及第五圖之實施方式 等同於第一種實施方式（即組裝方式），僅就增加補強單元8之 元件加以補充說明，故在此不再 贅述。 本lx明之k針1能獅在許多產品，目前僅就舉四種較佳 實例的範例作使職明，但並不因此限制本發_應用範圍。 需要注意的是，上述實施例僅為例示性說明本發明之原理 及其功效’而_於關本發日狀顧。任何齡此項技術領 戈之人士均可在不違背本發明之技術原理及精神下，對實施例 作修改與變化’即凡依本發明申請專利細所作的均等變化及 修飾’自為本發明之專概目所涵蓋。因此本發明之權利保護 圍應如後述之ΐ料贱圍所述。 201245727 【圖式簡單說明】 第-圖係為本㈣之探針外觀示意圖； 及 第二圖係為本發明之第一實施例在使用時之剖面示音圖； 第三圖係為本發明之第二實施例在使用時之剖面示意圖； 第四圖係為本發明之第三實施例在使用時之剖面示意圖； 第五圖係為本發明之第四實施例在使用時之剖面示意圖。 【主要元件符號說明】 1 探針 3 電路板 11 訊號傳導件 31 訊號金屬突墊 12、7 定位件 4 墊片 13 板片 5 固定單元 14 探針身部 51 容置空間 15 針尖部 6 膠體 2 探針卡 8 補強單元Mounting Technology; SMT) or soldering technology to solder to electrical connection points, such as "more can be filled with holes in the hole through the insulating material of the colloid 6, the body 6 is Wei resin (E Tao ) or the adhesive material 'to block the solder (such as tin) from tin or other conductive material into the hole, so that the way of conduction is better. When the test is performed, the probe card 2 is moved on the test machine so that the tip end portion 15 of the probe is close to the device to be tested (for example, a wafer, etc.), the probe (Shenhai Signal Conductor U) The surface is directly and electrically contacted with the object to be tested on the device to be tested (for example, the solder ball on the wafer 201245727) to get the quality of the device to be tested. In addition, the circuit board 3 and the fixed unit 5 are It can be screwed down = other auxiliary setting device is reduced, the village_positioning member 7 is penetrated through the circuit board 3, the spacer 4, and the fixed unit 5 so that the components of the probe card 2 move independently. And the slab is firmly combined, thereby enabling the gamma of the present invention to be produced. This is referred to as the third figure, which is a schematic cross-sectional view of the second embodiment in use. The needle card 2 includes a circuit board 3, a cymbal 4, a fixing unit 5, an accommodating space 5, a colloid 6, and a plurality of probes. The first embodiment and the present embodiment are different from the signal of the probe 1. The conductive member 11 is a flexible elastic body, and is prepared to be subjected to a vertical contact pressure and a good contact shape for the test towel. The life of the probe can be effectively continued. However, the shape of the elastic body of the signal conducting member is only one of the forms of the elastic body, and is not limited thereto. In this embodiment, the probe j When it is fixed, the top surface of the signal conducting member is in contact with the signal of the circuit board 3 as a line, and the probe 1 and the circuit board 3 are electrically connected. , the probe card 2 is inserted into the lion, so that the probe of the probe card 2 is gradually closer to the scale (such as a wafer or a circuit board). The probe 1 has a solder ball such as the needle tip 15 and the line of the product. Directly 'initial _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Further--赘201245727 Please refer to the fourth and fifth figures at the same time, which is a schematic cross-sectional view of the third embodiment in use and a cross-sectional view of the fourth embodiment in use. The degree of compression that can withstand, still maintains the robustness of its construction, this embodiment The solid sample ship is based on material 8 (such as the face thief reinforcement plate) to enhance the internal structure of the probe card 2, in addition to the fixed unit 5, there may be a reinforcing single 兀 8 as the reinforced needle 2, although The material of the sturdy unit 8 may be a metal of the alloy or stainless steel. As shown in the fourth riding, the turning unit 8 may be disposed between the cymbal 4 and the fixed unit 5, so that the stability of the splicing 4 can be balanced. Adjusting the resilience of the reinforcing unit 8 according to the requirement of the thickness of the spacer 4, and as shown in the fifth riding, the reinforcing unit 8 may also be disposed under the deleting unit 5, and the fixing unit 5 may be due to the probe card. 2 The mechanism caused by the longitudinal compression can not bear the financial. The fourth embodiment and the fifth figure are equivalent to the first embodiment (ie, the assembly method), and only the components of the reinforcing unit 8 are added. I will not repeat them here. This lx Ming k-pin 1 can be used in many products. At present, only four examples of better examples are used for the purpose, but this does not limit the scope of application. It should be noted that the above-described embodiments are merely illustrative of the principles and effects of the present invention. Anyone of this technology can make modifications and changes to the embodiments without departing from the technical principles and spirit of the present invention. Covered by the special outline. Therefore, the protection of the present invention should be as described in the following. 201245727 [Simple description of the drawings] The first figure is a schematic view of the appearance of the probe of (4); and the second figure is a sectional sound map of the first embodiment of the present invention in use; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a schematic cross-sectional view showing a third embodiment of the present invention in use; FIG. 5 is a cross-sectional view showing a fourth embodiment of the present invention in use. [Main component symbol description] 1 Probe 3 Circuit board 11 Signal conduction member 31 Signal metal pad 12, 7 Positioning member 4 Spacer 13 Plate 5 Fixing unit 14 Probe body 51 Housing space 15 Needle tip 6 Colloid 2 Probe card 8 reinforcement unit